阅读说明：本技术 包括嵌入控制电子器件的固态开关器件 (Solid state switching device including embedded control electronics ) 是由 乔瓦尼·萨尔瓦托雷 斯拉沃·基辛 于 2021-06-18 设计创作，主要内容包括：本公开的各实施例涉及包括嵌入控制电子器件的固态开关器件。一种固态开关器件,诸如固态断路器,包括至少一个散热器,控制电子器件印刷电路板(PCB),以及功率电子器件。所述功率电子器件用于调节从固态开关器件的一个端子到另一个端子的电流的流动。功率电子器件可以包括一个或多个固态器件,诸如：FET、晶闸管、并联的晶闸管+SiC JFET、IGBT以及IGCT。控制PCB可以包括各种电路元件,用于执行用于激活功率电子器件的固态器件的栅极驱动器的功能。散热器包括一个或多个信号通孔,信号通孔穿过该散热器被形成,以便允许将控制PCB嵌入在散热器内。(Embodiments of the present disclosure relate to solid state switching devices including embedded control electronics. A solid state switching device, such as a solid state circuit breaker, includes at least one heat sink, control electronics Printed Circuit Board (PCB), and power electronics. The power electronics are used to regulate the flow of current from one terminal of the solid state switching device to the other terminal. The power electronics may include one or more solid state devices, such as: FET, thyristor, parallel thyristor + SiC JFET, IGBT and IGCT. The control PCB may include various circuit elements for performing the functions of a gate driver for activating the solid state devices of the power electronics device. The heat sink includes one or more signal vias formed therethrough to allow the control PCB to be embedded within the heat sink.)

1. An apparatus, comprising:

a solid state current interrupt device having a first power terminal and a second power terminal, the solid state current interrupt device comprising:

a power electronics module having at least one solid state component for regulating a flow of current between the first power terminal and the second power terminal;

a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink, the heat sink having a signal via formed therein and extending from a first side of the heat sink to a second side of the heat sink; and

a control electronics printed circuit board configured to provide control signals to the at least one solid state component of the power electronics module;

wherein the power electronics are placed on the first side of the heat sink, wherein the control electronics printed circuit board is placed on the second side of the heat sink, and wherein signal-carrying conductive leads are positioned in the signal vias and electrically connected on one end to the control electronics printed circuit board and on an opposite end of the signal-carrying leads to the power electronics.

2. The apparatus of claim 1, wherein the at least one solid state component is a gate drive component for stopping current flow.

3. The apparatus of claim 2, wherein the at least one solid state component is in the form of one of: FET, thyristor, IGBT, and RB-IGCT, and wherein the solid state current interruption device is a solid state circuit breaker.

4. The apparatus of claim 1, wherein the heat sink comprises a plurality of heat sink fins extending from a base of the heat sink, wherein the heat sink comprises a heat sink fin on a first lateral side of the heat sink and the heat sink comprises a second heat sink fin on an opposite second lateral side of the heat sink, and wherein the control electronics printed circuit board is positioned between the first and second heat sink fins.

5. The apparatus of claim 4, wherein each of the plurality of control electronics printed circuit boards is each disposed between adjacent ones of the plurality of heat sink fins.

6. The apparatus of claim 1, wherein the control electronics printed circuit board includes a top surface and a bottom surface, the bottom surface of the control electronics printed circuit board being offset from the heat sink such that transfer of thermal energy from the heat sink to the control electronics printed circuit board is inhibited.

7. The apparatus of claim 1, wherein a thermal insulator is disposed between the control electronics printed circuit board and the heat sink.

8. The apparatus of claim 1, wherein the signal-carrying conductive lead positioned in the signal via is in the form of one of a pin and a terminal.

9. The apparatus of claim 8, wherein the signal-carrying conductive lead is isolated from the heat sink by an electrical insulator.

10. The apparatus of claim 8, wherein the signal-carrying conductive lead is configured to structurally support the control electronics printed circuit board such that an offset formed from the heat sink is maintained through the signal-carrying conductive lead.

11. An apparatus, comprising:

a solid state circuit breaker configured to monitor current flow in a circuit connection between a power input and a power output, the solid state circuit breaker comprising a heat sink and an electronics package, the heat sink and electronics package comprising: a power electronics module including at least one switchable solid state component, a heat sink having a plurality of laterally spaced heat sink fins extending from a base of the heat sink, and a control electronics printed circuit board configured to monitor current flow between the power input and the power output and issue a control signal to the at least one switchable solid state component to disconnect the circuit connection, wherein at least a majority of a volume of the control electronics printed circuit board is positioned between two of the laterally spaced heat sink fins, and at least a majority of the volume of the control electronics printed circuit board is vertically positioned between at least one end of the laterally spaced heat sink fins and the base.

12. The apparatus of claim 11, wherein the heat sink includes a signal via formed through a thickness of the heat sink, and wherein a signal-carrying conductive lead is positioned in the signal via and electrically connected to the control electronics printed circuit board and the power electronics module.

13. The apparatus of claim 12, wherein the control electronics printed circuit board comprises an elongated extension axis oriented parallel to the base of the heat sink.

14. The apparatus of claim 12, wherein the base of the heat sink extends along a base axis that is perpendicular to an extension axis of the control electronics printed circuit board, wherein the control electronics printed circuit board includes an elongated extension axis that is angled relative to a base of the plurality of laterally spaced heat sink fins.

15. The apparatus of claim 11, wherein the heat sink and electronics package are defined by a height, a width, and a depth, wherein the control electronics printed circuit board is positioned so as to be entirely within the height, width, and depth of the heat sink and electronics package.

16. The apparatus of claim 11, wherein the heat spreader comprises a plurality of signal vias formed through the thickness of the heat spreader, and wherein the solid state current interrupt device comprises a plurality of control electronics printed circuit boards each coupled with the power electronics module.

17. The apparatus of claim 11, wherein the heat spreader and electronics package comprises a plurality of control electronics printed circuit boards.

18. The apparatus of claim 17, wherein each of the plurality of control electronics printed circuit boards is located between respective adjacent ones of the plurality of laterally spaced heat sink fins.

19. The apparatus of claim 18, further comprising a plurality of signal vias formed through a thickness of the heat sink.

20. The apparatus of claim 11, wherein the heat sink and electronics package comprises another heat sink positioned adjacent to the power electronics module opposite the heat sink having the plurality of laterally spaced heat sink fins.

21. A method, comprising:

attaching a first heat sink to a power electronics module, the first heat sink including a signal via formed through the first heat sink;

nesting a control electronics printed circuit board between laterally spaced fins of the heat sink, the laterally spaced fins extending from a base of the heat sink;

positioning a signal-carrying conductive lead in the signal via of the first heat sink; and

electrically connecting the control electronics printed circuit board to the power electronics module with the signal-carrying conductive leads.

22. The method of claim 21, further comprising: attaching a second heat sink to the power electronics module opposite the first heat sink, the second heat sink comprising a plurality of second heat sink fins.

23. The method of claim 21, further comprising: insulating the signal-carrying conductive leads from the base of the heat sink.

Technical Field

The present disclosure relates generally to solid state switching devices, and more particularly, but not exclusively, to solid state circuit breakers having one or more heat sinks.

Background

The present invention generally relates to power switches such as solid state circuit breakers. Power systems need to protect against fault currents: power electronics converters, energy storage systems, capacitor banks, and other devices. Solid state circuit breakers can provide ultra-fast fault protection, load connection, and disconnection for a variety of power critical applications. Existing solid state circuit breakers suffer from a number of disadvantages and shortcomings. During fault-free operation, there remains an unmet need, including reduced equipment costs and reduced power losses. For example, conventional solid state circuit breakers are more costly and have greater conduction losses than conventional electromechanical circuit breakers. In view of these and other drawbacks in the art, there is a significant need for unique apparatuses, methods, systems, and techniques disclosed herein. Some existing systems have various drawbacks with respect to certain applications. Therefore, there is still a need for further contributions in this area of technology.

Disclosure of Invention

One embodiment of the present disclosure is a unique solid state circuit breaker. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations thereof to position control electronics relative to a heat sink of a solid state circuit breaker. Additional embodiments, forms, features, aspects, benefits, and advantages of the present application shall come from the description and figures provided herein.

Drawings

FIG. 1 illustrates one embodiment of a solid state switching device.

FIG. 2 illustrates one embodiment of a heat sink.

Fig. 3A and 3B illustrate embodiments of a solid state circuit breaker.

Fig. 4 illustrates an embodiment of a solid state switching device.

Fig. 5 illustrates another embodiment of a solid state switching device.

Fig. 6 illustrates an embodiment of a signal via formed through a heat sink.

Detailed Description

For the purposes of promoting an understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended. Any alterations and further modifications in the described embodiments, and any further applications of the principles of the invention as described herein are contemplated as would normally occur to one skilled in the art to which the invention relates.

Referring to fig. 1, a power switch 50 for regulating (e.g., interrupting) current flow between terminals 52 and 54 is shown. In some forms, the power switch 50 may take the form of a Solid State Circuit Breaker (SSCB). For ease of the following description, reference will be made to a Solid State Circuit Breaker (SSCB)50, but it should be understood that there are never the following limitations: the following description applicable to other types of power switches is limited to SSBC. For example, in certain embodiments, the SSCB50 may instead be another type of power switch, to name just a few examples, including: a solid state contactor, a state transfer switch, a multifunction isolation switch, a seasonal interconnect switch, a bypass switch, another type of power switch configured to prevent a fault, or another type of power switch that connects a power source to a load. It should also be understood that the SSCB50 may be implemented in a variety of applications, including low voltage DC power distribution systems, medium voltage DC power distribution systems, AC power distribution systems, data centers, and marine power systems, to name a few examples. In certain embodiments, the low voltage may comprise any voltage less than 1500V, and the medium voltage may comprise a voltage range between 1500V and 73 kV.

The SSCB50 includes terminals 52 and 54, and a heat sink and electronics package 56, the heat sink and electronics package 56 including: power electronics 58, control electronics Printed Circuit Board (PCB)60, and heat sinks 62 and 64 for removing heat from power electronics 58. Although two heat sinks 62 and 64 are illustrated, in some forms the SSCB50 may include only one heat sink. Additionally, in some forms, one or both of the heat sinks 62 and 64 positioned on opposite sides of the power electronics 58 may include multiple heat sinks that together form a cooperating heat sink for a particular side of the power electronics 58. In these embodiments, the heat sinks that together form the cooperating heat sinks of a particular side of the power electronics 58 may be, but need not be, identical. The components depicted in fig. 1 may be arranged and stacked in the vertical manner illustrated, but other embodiments may include other orderings and/or locations of components. For example, although the control electronics PCB 60 is shown arranged on top of the component stack, in some forms the control PCB 60 may be located on at least a lateral side of the power electronics circuit 58.

The power electronics 58 include a semiconductor switching arrangement 66, which may include one or more semiconductor switching elements (two shown in the schematic for illustrative purposes). The semiconductor switching element may take various forms, to illustrate only a few non-limiting examples, including: FETs, thyristors, parallel thyristors + SiC JFETs, IGBTs, IGCTs or any other combination of these forms. Switching element 66 may be used to regulate current flow between terminals 52 and 54, such as, but not limited to, interrupting current flow between terminals 52 and 54. In some non-limiting embodiments, the SSCB50 is bi-directional, so that current can flow from terminal 52 to 54, or from terminal 54 to 52. When turned on, current may flow through switching element 66 in a forward direction rather than a backward direction, and in some forms current may flow in a reverse direction, and in still other forms current may flow in both a forward and backward direction. The orientation of the plurality of individual switching elements 66 may ensure that current flows from terminal 52 to 54 through at least one other element 66 and current flows from terminal 52 to 54 through at least one other element 66. As understood by those skilled in the art, such devices may have individual elements 66 in an anti-parallel configuration. An example of such a circuit breaker may be found in U.S. patent application No. 16/707,426 filed on 9.12.2019, which is incorporated herein by reference in its entirety.

The control PCB 60 is provided to monitor the current between the terminals 52 and 54 and to control the solid state device 66 of the power electronics 58 to regulate and/or interrupt the current. Such monitoring and/or control may occur via communication link 67, and communication link 67 may take any form, including, but not limited to: pins, leads, or other types of electrically conductive devices that electrically connect control PCB 60 to power electronics 58 and/or other locations of SSCB 52. Those skilled in the art will also appreciate that other forms and functions of the communication link 67 are further described below. The control PCB 60 may be comprised of digital circuit devices, analog circuit devices, or a hybrid combination of the two types, which may include any kind of conventional circuit elements, solid state devices, and the like. In one form, the control PCB 60 includes one or more gate drivers to activate the solid state elements 66 of the power electronics 58.

The control PCB 60 includes a Printed Circuit Board (PCB)68, which Printed Circuit Board (PCB)68 may be used to mechanically support and interconnect various circuit elements 70 (only one circuit element 70 is shown for simplicity, but it is understood that the PCB 68 may include other elements 70). The PCB 68 may take a variety of arrangements to illustrate just a few non-limiting examples, including a single side (one copper layer), double sides (two copper layers on both sides of a substrate layer), or multiple layers. The PCB 68 may be made of a variety of materials, typically dielectric in nature, which may include cloth and paper impregnated with a thermosetting resin. Common substrate materials include: phenolic paper, woven glass fibers, polyimide foils, and polyimide-fluoropolymer composite foils.

In some forms, the printed circuit board 68 is relatively flat, has a relatively thin thickness, and extends in a planar manner, but not all printed circuit boards need be arranged in this manner. It should be understood that the printed circuit board may have various cross-sectional shapes in its thickness direction, including: square, rectangular or another polygonal shape. For example, in the schematic diagram shown in fig. 1, the PCB 68 is rectangular in shape, having a length along its larger dimension and a width along its shorter dimension. The thickness (not shown) will be understood to extend into the plan view of fig. 1. In some forms, the printed circuit board may be considered to extend along an elongated axis (e.g., along its length and/or width), where the elongated axis lies within the plane of the planar shaped printed circuit board 68. Although the printed circuit board may extend along each of three separate axes, as shown in the side view of the figure, the elongate axis may be considered to be an extension axis that includes a greater dimension than the other extension axes.

Heat sinks 62 and 64 may be attached within package 56 by soldering, sintering, gluing, or screwing in place. Further, the heat sinks 62 and 64 may cover the entire area of the power electronics 58, or only a portion thereof. For example, the heat sinks 62 and/or 64 may extend the entire distance across one dimension of the power electronics 58 (e.g., its width), but may not extend the entire distance across another dimension of the power electronics 58 (e.g., its length).

Heat sinks 62 and 64 may be made from a variety of materials using a variety of different manufacturing processes. For example, heat sinks 62 and/or 64 may be made of a thermally conductive material such as a metal or polymer. In one form, described further below, the heat sinks 62 and 64 may include a base from which a plurality of individual heat sink fins 74 extend. The heat sinks 62 and 64 may be fabricated by bonding heat sink fins to a substrate, the fins may be folded into shape and bonded/brazed/welded to the substrate, the fins may be stamped and encapsulated with a die cast substrate, the fins may be forged, the fins may be scraped onto the substrate, the fins may be machined from stock into an integral substrate and fins, the fins may be digitally controlled, the fins may be extruded, etc. As shown in fig. 1, when mounted, the base 72 of the heat spreader 64 may extend parallel to the power electronics package 58. In one form shown in fig. 1, the substrate 72 extends parallel to the power electronics component 58, the substrate 72 having a uniform thickness along the length and/or width of the heat sink, but not all forms of heat sinks need include a substrate 72 of constant thickness. Thus, the base 72 of the heat sink may include an elongated axis as shown in fig. 1, which may be its length or width. Although the printed circuit board may extend along each of three separate axes, as shown in the side view of the figures, the elongate axis may be considered to be an extension axis that includes a greater dimension than the other extension axis.

The fins may take various forms such as pins, foils and posts. In this regard, the fins 74 may have a common cross-sectional shape along their respective lengths, but not all embodiments of the heat sink need have a common shape in their respective fins 74. Two or more different shapes are also contemplated for the fins 74 in any given heat sink.

In some forms, the fins 74 may be equally spaced along the dimension of the base (e.g., along its length and/or width), but not all forms need include equally spaced fins. In yet another embodiment, the fins may be equally spaced in one portion of the heat sink, while providing open space in another portion of the heat sink not occupied by fins. Furthermore, heat sinks 62 and 64 need not be made of the same material and/or need not be manufactured using the same process. In short, the heat sinks 62 and 64 may be different from each other.

The fins 74 may extend to a vertical height above the base 72 of the heat sink. In some forms, all of the fins 74 may extend to a common height above the base, but in other forms the fins may extend to two or more different heights above the base 72. One non-limiting embodiment of a heat sink is illustrated in FIG. 2, which illustrates a plurality of fins 74 extending from a base 72.

Generally, heat sink and electronics package 56 is defined by a package envelope 76, package envelope 76 representing the volume of space occupied by the package components. The dashed lines identified by reference numeral 76 in fig. 1 are conceptual only and are used for illustration purposes only in fig. 1. The dashed line 76 does not reflect the actual volumetric envelope of the package 56 in fig. 1, as will be appreciated, but nonetheless the concept is applicable to envelopes that may identify the components comprising the package 56, some forms of the package 56 may be minimized by appropriate relative positions and orientations of the constituent components (e.g., the power electronics 58 control PCB 60, the heat sink 72 and/or 74), which reduces at least one of the width, height or depth of the package. In various forms, the control electronics PCB 60 may be mounted in close proximity to one or both heat sinks, minimizing the space occupied by the heat sinks and the electronics package 56.

Fig. 3A and 3B illustrate two non-limiting embodiments of the SSCB50 discussed herein. Dimensions are provided for the embodiment in fig. 3A, but it should be understood that other embodiments may have different dimensions. It should be understood that embodiments include a housing, and wherein the heat sink and electronics package 56 are at least partially disposed within the housing (and in some embodiments may be entirely disposed within the housing).

In applications with specific requirements on space and size, the development of solid state circuit breakers involves challenges to design devices with miniaturized physical formats and capable of operating at high currents. The control PCB 60 may be arranged in various different orientations with respect to the power electronics 58, with respect to the heat sinks 62 and/or 64, and/or with respect to the overall volumetric size of the heat sink and electronics package 56. The size of the heat sink and electronics package 56 should minimize the package envelope 76 to reduce one or more dimensions of the package and/or to reduce the volume requirements needed to incorporate the electronic switching device 50. Package dimensions may include height, width, and depth defined by portions of the package. For example, a heat sink fan extending from the top heat sink base may define one edge and a heat sink fan extending from the bottom heat sink base may define another edge, wherein the distance between the two edges defines the height of the package. Various properties of the package may be derived from these constraints. For example, the heat sink and electronics package may be sized such that the upper portion of the control electronics does not extend beyond the upper portion of the top heat sink.

Turning now to fig. 4, one embodiment of a heat sink and electronics package 56 is shown that includes a control PCB 60 positioned between laterally spaced heat sinks 74. The control PCB 60 is shown nested between two laterally spaced heat sinks 74 on either side of the control PCB 60, but it will be appreciated that if the heat sinks 74 are in the form of separate heat sinks depicted in a matrix arrangement as shown in fig. 2, the control PCB 60 may also be defined by additional heat sinks 74 distributed in and out of the page. It should also be understood that in some embodiments, one or more heat sinks may be distributed across the front of the image shown in fig. 4 and on the other side of the control PCB 60, in which embodiments the control PCB 60 is positioned inside a set of heat sinks 74 distributed around the control PCB 60. In short, there are several different arrangements in which two or more heat sinks may surround the PCB 60.

The control PCB 60 as illustrated is mounted horizontally relative to the heat sink 62, as used herein, the terms "vertical" and "horizontal" are used for brevity of description and are not intended to convey precise limitations on the configuration of the SSCB50 as mounted. In the embodiment shown in fig. 4, the PCB 68 is aligned parallel to the base 72 of the heat sink 62, but in other forms, the PCB 68 may be angularly disposed, including at a 90 degree angle (see, e.g., fig. 5).

The control PCB 60 may be connected to the power electronics 58 by one or more pins, leads, and other similar devices depicted at 78 that serve as the communication link 67 described above. The following discussion references the reference numeral 78 to a pin, but it will be understood that any conductive device that connects the control PCB 60 to the power electronics 58 is contemplated herein. The pins 78 may have various thicknesses and configurations and are shown extending through the heat sink 62 through signal vias 80 formed in the heat sink. The pins 78 are shown in conductive communication with one or more of the electronic paths shown in the figures, both in the control PCB 60 and the power electronics 58.

The control PCB 60 may be offset from the heat sink 62 to provide some measure of insulation from the heat sink 62, fins 74, and/or substrate 72. In some forms, the pins 78 are used to structurally support the control PCB 60 and provide an air gap offset from the base 72. In some forms, a physical insulator may be disposed between the control PCB 60 and the power electronics 58 in place of and/or in addition to the air gap.

The embodiment in fig. 4 also includes a thermal grease disposed between the power electronics 58 and each of the heat sinks 62 and 64 to act as a thermally conductive but electrically insulating material. The thermal grease may be used to bond the heat sink to the power electronics device. The thermal grease serves to eliminate air gaps or spaces from the interface area between the power electronics 58 and the water sinks 62 and 64. Some forms of the SSCB50 need not include such materials. For example, in some forms, screws may be used to attach the heat sink to the power electronics device.

Fig. 5 depicts another embodiment in which a plurality of separate control PCBs 60 are used for communication and/or control of the power electronics 58. The control PCBs 60 may be configured to individually control the gate-driven solid-state devices of the power electronics 58. The PCBs 60 are each nested between adjacent fins 74. The control PCB 60 is shown mounted relative to a heat sink 62. In the embodiment shown in fig. 5, the PCB 68 is vertically aligned with the base 72 of the heat sink 62, but in other forms, the PCB 68 may be arranged at other angles, including parallel to the base 72.

In some forms, the individual PCBs 60 may be positioned adjacent to one another with the fins 74 positioned on the outside (e.g., the embodiment shown in fig. 5 with the inner fins 74 removed between the PCBs 60). The fins 74 may be positioned around the various PCBs 60 (e.g., extending around the periphery of one or both of the PCBs 60) in a manner similar to the embodiments described above. In some versions, the PCBs 60 may be identical, but not all versions need include identical PCBs 60. It should be understood that in fig. 5, the envelope 76 extends to the top of the PCB 60, and in some forms one or both of the PCBs 60 in fig. 5 is located completely below the top of the fins 74. It should also be appreciated that the thin dimension (i.e., thickness) of the PCB 68 is as shown in fig. 4 and 5, with the length and depth of the PCB 68 extending into and/or out of the page. As shown in fig. 4, a thermal paste is disposed in fig. 5, but in some forms the thermal paste need not be present. It will also be appreciated that the pins 78 are in conductive communication with one or more circuit paths shown in the figures in the control PCB 60 and the power electronics device 58.

Fig. 6 depicts an embodiment in which the pins 78 pass through signal vias 80 formed in the heat sink 62. The signal vias 80 may take any of a variety of shapes having any of a variety of cross-sectional dimensions. In some forms, an insulator 82 is disposed between the pin 78 and the wall of the signal via 80. The insulator 82 may be an electrical insulator, and in some forms may also be a thermal insulator. As discussed above in the discussion of the air gap acting as an insulator, the insulator 82 may be air, polymer/gel, or the like. The insulator 82 may be installed after insertion of the pins 78, but in some embodiments, the pins 78 may be pre-insulated and then inserted into the signal vias 80.

One way to construct the package 56 of any of the embodiments disclosed herein includes attaching one or more heat sinks to the power electronics 58, inserting the pins 78 through the signal vias 80, and connecting the control PCB 60 to the power electronics 58. The pins 78 may be pre-connected to either the power electronics 58 or the control PCB 60 before being inserted into the vias 80.

One aspect of the present application includes, an apparatus comprising: a solid state current interrupt device having a first power terminal and a second power terminal, the solid state current interrupt device comprising: a power electronics module having at least one solid state component for regulating a flow of current between a first power terminal and a second power terminal; a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink, the heat sink having a signal via formed therein, the signal via extending from a first side of the heat sink to a second side of the heat sink; and a control electronics printed circuit board configured to provide control signals to at least one solid state component of the power electronics module; wherein the power electronics parallel is disposed on a first side of the heat sink, wherein the control electronics printed circuit board is disposed on a second side of the heat sink, and wherein the signal-carrying conductive leads are positioned in the signal vias, the signal-carrying conductive leads being electrically connected to the control electronics printed circuit board on one end and to the power electronics on an opposite end of the signal-carrying conductive leads.

Features of the present application include wherein the at least one solid state component is a gate drive component for stopping current flow.

Another feature of the present application includes wherein the at least one solid state component is in the form of one of: FETs, thyristors, IGBTs, and RB-IGCTs, and wherein the solid state current interruption devices are solid state circuit breakers.

One feature of the present application includes wherein the thermal heat sink includes a plurality of heat sink fins extending from a base of the heat sink, wherein the heat sink includes a heat sink fin on a first lateral side of the heat sink and the heat sink includes a second heat sink fin on an opposite second lateral side of the heat sink, and wherein the control electronics printed circuit board is positioned between the first heat sink fin and the second heat sink fin.

Yet additional features of the present application include wherein each of the plurality of control electronics printed circuit boards is each disposed between adjacent ones of the plurality of heat sink fins.

Yet additional features of the present application include wherein the control electronics printed circuit board includes a top surface and a bottom surface, the bottom surface of the control electronics printed circuit board being offset from the heat sink such that transfer of thermal energy from the heat sink to the control electronics printed circuit board is inhibited.

Yet another feature of the present application includes wherein the thermal insulator is disposed between the control electronics printed circuit board and the heat sink.

Additional features of the present application include wherein the signal-carrying conductive lead positioned in the signal via is in the form of one of a pin and a terminal.

Yet additional features of the present application include wherein the signal-carrying conductive lead is isolated from the heat sink by an electrical insulator.

Yet additional features of the present application include wherein the signal-carrying conductive lead is configured to structurally support the control electronics printed circuit board such that an offset formed from the heat sink is maintained through the signal-carrying conductive lead.

Another aspect of the present application includes an apparatus comprising a solid state circuit breaker configured to monitor current flow in a circuit connection between a power input and a power output, the solid state circuit breaker comprising a heat sink and an electronics package, the heat sink and electronics package comprising: a power electronics module including at least one switchable solid state device, a heat sink having a plurality of laterally spaced heat sink fins extending from a base of the heat sink, and a control electronics printed circuit board configured to monitor current flow between a power input and a power output and issue a control signal to the at least one switchable solid state component to disconnect a circuit connection, wherein at least a majority of a volume of the control electronics printed circuit board is positioned between two of the laterally spaced heat sink fins, and at least a majority of a volume of the control electronics printed circuit board is vertically positioned between at least one end of the laterally spaced heat sink fins and the base.

Features of the present application include wherein the heat sink includes a signal via formed through a thickness of the heat sink, and wherein a signal-carrying conductive lead is positioned in the signal via and electrically connected to the control electronics printed circuit board and the power electronics module.

Another feature of the present application includes wherein the control electronics printed circuit board includes an elongated extension axis oriented parallel to the base of the heat sink.

Another feature of the present application includes wherein the base of the heat sink extends along a base axis perpendicular to an extension axis of the control electronics printed circuit board, wherein the control electronics printed circuit board includes an elongated extension axis that is angled relative to the base of the plurality of laterally spaced heat sink fins.

Yet another feature of the present application includes wherein the heat spreader and the electronics package are defined by a height, a width, and a depth, wherein the control electronics printed circuit board is positioned so as to be entirely within the height, width, and depth of the heat spreader and the electronics package.

Yet another feature of the present application includes wherein the heat spreader includes a plurality of signal vias formed through a thickness of the heat spreader, and wherein the solid state current interrupt device includes a plurality of control electronics printed circuit boards each coupled with the power electronics module.

Still additional features of the present application include wherein the heat spreader and electronics package comprise a plurality of control electronics printed circuit boards.

Yet additional features of the present application include wherein each of the plurality of control electronics printed circuit boards is located between respective adjacent ones of the plurality of laterally spaced heat sink fins.

Still additional features of the present application further include a plurality of signal vias formed through a thickness of the heat spreader.

Additional features of the present application also include wherein the heat spreader and the electronics package include another heat spreader positioned adjacent to the power electronics module having a plurality of laterally spaced heat spreader fins.

Yet another aspect of the present application includes a method comprising: attaching a first heat sink to the power electronics module, the first heat sink including a signal via formed therethrough; embedding the control electronics printed circuit board between laterally spaced fins of the heat sink, the laterally spaced fins extending from the base of the heat sink; positioning a signal-carrying conductive lead in a signal via of a first heat sink; and electrically connecting the control electronics printed circuit board to the power electronics module by signal carrying conductive leads.

The present application is also characterized by: attaching a second heat sink to the power electronics module opposite the first heat sink, the second heat sink module including a plurality of second heat sink fins.

Another feature of the present application further includes insulating the signal-carrying conductive leads from the base of the heat sink.

While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected. It is to be understood that while the use of words such as preferred, preferably, preferred or more preferred in the description above indicate that the feature so described may be more desirable, it nonetheless may not be necessary and embodiments lacking the same may be contemplated as within the scope of the invention, that scope being defined by the claims that follow. In reading the claims, it is intended that when words such as "a," "an," "at least one," or "at least a portion" are used, the claims are not intended to be limited to only one item unless specifically stated to the contrary in the claims. If the language "at least a portion" and/or "a portion" is used, the item can include a portion and/or the entire item unless specifically stated otherwise. Unless specified or limited otherwise, the terms "mounted," "connected," "supported," and "coupled" and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Further, "connected" and "coupled" are not restricted to physical or mechanical connections or couplings.