阅读说明：本技术 高频信号传输结构及其制作方法 (High-frequency signal transmission structure and manufacturing method thereof ) 是由 徐筱婷 何明展 胡先钦 沈芾云 于 2020-06-19 设计创作，主要内容包括：本发明提供一种高频信号传输结构,包括第一线路板和第二线路板。所述第一线路板包括第一导电线路层、第二导电线路层和夹设于所述第一导电线路层和所述第二导电线路层之间的第一介质层。所述第二线路板包括第二介质层及形成在所述第二介质层一表面的第三导电线路层。所述第二介质层覆盖所述第一导电线路层背离所述第一介质层的表面,所述第三导电线路层位于所述第二介质层背离所述第一导电线路层的一侧。所述第一介质层和所述第二介质层均包括气凝胶层,所述气凝胶层中的空气占比为80～99％。本发明还提供上述高频信号传输结构的制作方法。(The invention provides a high-frequency signal transmission structure which comprises a first circuit board and a second circuit board. The first circuit board comprises a first conductive circuit layer, a second conductive circuit layer and a first dielectric layer clamped between the first conductive circuit layer and the second conductive circuit layer. The second circuit board comprises a second dielectric layer and a third conductive circuit layer formed on one surface of the second dielectric layer. The second dielectric layer covers the surface, away from the first dielectric layer, of the first conductive circuit layer, and the third conductive circuit layer is located on one side, away from the first conductive circuit layer, of the second dielectric layer. The first medium layer and the second medium layer both comprise aerogel layers, and the air proportion in the aerogel layers is 80-99%. The invention also provides a manufacturing method of the high-frequency signal transmission structure.)

1. A high-frequency signal transmission structure, comprising:

the first circuit board comprises a first conductive circuit layer, a second conductive circuit layer and a first dielectric layer clamped between the first conductive circuit layer and the second conductive circuit layer; and

the second circuit board comprises a second dielectric layer and a third conducting circuit layer, the second dielectric layer covers one side, away from the first dielectric layer, of the first conducting circuit layer, and the third conducting circuit layer is located on one side, away from the first conducting circuit layer, of the second dielectric layer;

the first medium layer and the second medium layer both comprise aerogel layers, and the air proportion in the aerogel layers is 80-99%.

2. The high-frequency signal transmission structure according to claim 1, wherein the first conductive trace layer includes a signal line and two ground lines disposed at both sides of the signal line with a gap therebetween, the first dielectric layer and the second dielectric layer further include a first water-blocking layer disposed on a surface of the aerogel layer, the first water-blocking layer covering one side of the first conductive trace layer and filling the gap.

3. The high-frequency signal transmission structure according to claim 2, wherein the first dielectric layer further includes a second water-blocking layer interposed between the second conductive trace layer and the aerogel layer of the first dielectric layer.

4. The high-frequency signal transmission structure according to claim 2, wherein the second dielectric layer includes two layers of the aerogel layer, the first water-blocking layer and the second water-blocking layer, wherein an aerogel layer is sandwiched between the first water-blocking layer and the second water-blocking layer, and wherein another aerogel layer is sandwiched between the second water-blocking layer and the third conductive trace layer.

5. The high-frequency signal transmission structure according to claim 2, further comprising two sets of conductive holes electrically connected to the two ground lines, respectively, the second conductive line layer including a first ground layer, the third conductive line layer including a second ground layer, each set of conductive holes including a first conductive hole and a second conductive hole, the first conductive hole electrically connecting one ground line and the first ground layer, the second conductive hole electrically connecting the ground line and the second ground layer.

6. The high-frequency signal transmission structure according to claim 1, wherein the aerogel layer comprises polyimide, polyacrylic acid, and silicon dioxide.

7. A manufacturing method of a high-frequency signal transmission structure comprises the following steps:

providing a first circuit board, wherein the first circuit board comprises a first conductive circuit layer, a second conductive circuit layer and a first dielectric layer clamped between the first conductive circuit layer and the second conductive circuit layer;

providing a second circuit board, wherein the second circuit board comprises a second dielectric layer and a third conductive circuit layer formed on one surface of the second dielectric layer;

and pressing the second circuit board on the first circuit board, wherein the second dielectric layer covers the surface of the first conductive circuit layer, which is far away from the first dielectric layer, the third conductive circuit layer is positioned on one side, which is far away from the first conductive circuit layer, of the second dielectric layer, the first dielectric layer and the second dielectric layer both comprise aerogel layers, and the air proportion in the aerogel layers is 80-99%.

8. The method for manufacturing a high-frequency signal transmission structure according to claim 7, wherein the first conductive trace layer includes a signal line and two ground lines disposed at both sides of the signal line at intervals, a gap is formed between the signal line and each ground line, the first dielectric layer and the second dielectric layer further include a first water-blocking layer disposed on a surface of the aerogel layer, and the first water-blocking layer covers one side of the first conductive trace layer and fills the gap.

9. The method for manufacturing a high-frequency signal transmission structure according to claim 8, wherein the first dielectric layer further includes a second water-blocking layer interposed between the second conductive trace layer and the aerogel layer of the first dielectric layer.

10. The method for manufacturing a high-frequency signal transmission structure according to claim 8, wherein the second dielectric layer includes two layers of the aerogel layer, the first water-blocking layer and the second water-blocking layer, wherein an aerogel layer is sandwiched between the first water-blocking layer and the second water-blocking layer, and wherein another aerogel layer is sandwiched between the second water-blocking layer and the third conductive trace layer.

Technical Field

The invention relates to a high-frequency signal transmission structure and a manufacturing method thereof.

Background

In electronic signal transmission, attenuation of signal lines for high-frequency transmission mainly comes from attenuation caused by dielectric loss. Wherein the dielectric loss is positively correlated with the dielectric loss tangent and the dielectric constant. In order to reduce transmission loss, it is common practice in the industry to use a liquid crystal polymer having a low dielectric constant as a dielectric layer for covering a signal line. However, the dielectric loss of the material is still relatively large, so that the signal line using the material as the dielectric layer has relatively large signal attenuation.

Disclosure of Invention

In view of the above, it is desirable to provide a high frequency signal transmission structure and a method for manufacturing the same.

The invention provides a high-frequency signal transmission structure which comprises a first circuit board and a second circuit board. The first circuit board comprises a first conductive circuit layer, a second conductive circuit layer and a first dielectric layer clamped between the first conductive circuit layer and the second conductive circuit layer. The second circuit board comprises a second dielectric layer and a third conductive circuit layer formed on one surface of the second dielectric layer. The second dielectric layer covers the surface, away from the first dielectric layer, of the first conductive circuit layer, and the third conductive circuit layer is located on one side, away from the first conductive circuit layer, of the second dielectric layer. The first medium layer and the second medium layer both comprise aerogel layers, and the air proportion in the aerogel layers is 80-99%.

Further, the first conductive circuit layer comprises a signal line and two grounding lines arranged on two sides of the signal line at intervals, a gap is formed between the signal line and each grounding line, the first dielectric layer and the second dielectric layer further comprise a first water-blocking layer arranged on one surface of the aerogel layer, and the first water-blocking layer covers one side of the first conductive circuit layer and is filled in the gap.

Further, the first dielectric layer further comprises a second water-resistant layer, and the second water-resistant layer is clamped between the second conductive circuit layer and the aerogel layer of the first dielectric layer.

Further, the second dielectric layer includes two aerogel layers, a first water-blocking layer and a second water-blocking layer, wherein one aerogel layer is sandwiched between the first water-blocking layer and the second water-blocking layer, and the other aerogel layer is sandwiched between the second water-blocking layer and the third conductive circuit layer.

Further, the high-frequency signal transmission structure further includes two sets of conductive holes electrically connected to the two ground lines, respectively, the second conductive trace layer includes a first ground layer, the third conductive trace layer includes a second ground layer, each set of conductive holes includes a first conductive hole and a second conductive hole, the first conductive hole is electrically connected to one ground line and the first ground layer, and the second conductive hole is electrically connected to the ground line and the second ground layer.

Further, the aerogel layer comprises polyimide, polyacrylic acid, and silica.

The invention also provides a manufacturing method of the high-frequency signal transmission structure, which comprises the following steps: providing a first circuit board, wherein the first circuit board comprises a first conductive circuit layer, a second conductive circuit layer and a first dielectric layer clamped between the first conductive circuit layer and the second conductive circuit layer; providing a second circuit board, wherein the second circuit board comprises a second dielectric layer and a third conductive circuit layer formed on one surface of the second dielectric layer; and pressing the second circuit board on the first circuit board, wherein the second dielectric layer covers the surface of the first conductive circuit layer, which is far away from the first dielectric layer, the third conductive circuit layer is positioned on one side, which is far away from the first conductive circuit layer, of the second dielectric layer, the first dielectric layer and the second dielectric layer both comprise aerogel layers, and the air proportion in the aerogel layers is 80-99%.

In the high-frequency signal transmission structure and the manufacturing method thereof provided by the invention, the dielectric layer arranged around the signal line comprises the aerogel layer with low dielectric constant, so that the attenuation of the signal line in transmission can be reduced.

Drawings

Fig. 1 is a sectional view of a high-frequency signal transmission structure according to an embodiment of the present invention.

Fig. 2 is a sectional view of a first wiring board according to an embodiment of the present invention.

Fig. 3 is a sectional view of a second wiring board according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view of the second wiring board shown in fig. 3 after being press-fitted onto the first wiring board.

Fig. 5 is a cross-sectional view after forming blind and through holes in the structure shown in fig. 4.

Description of the main elements

High frequency signal transmission structure 100

First circuit board 10

Second wiring board 30

First dielectric layer 13

First conductive line layer 15

Second conductive trace layer 16

Signal line 151

Grounding wire 153

Gap 154

First ground layer 161

Aerogel layers 131, 311

First water resistant layer 132, 312

Second water-resistant layer 133, 313

Second dielectric layer 31

Third conductive line layer 33

Second ground layer 331

First conductive via 61

Second conductive via 63

Blind hole 84

Through hole 86

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

Referring to fig. 1, a high frequency signal transmission structure 100 according to an embodiment of the present invention is applied to a circuit board. The high-frequency signal transmission structure 100 includes a first wiring board 10 and a second wiring board 30 disposed on one surface of the first wiring board 10.

The first circuit board 10 is a double-sided circuit board, and includes a first dielectric layer 13, and a first conductive trace layer 15 and a second conductive trace layer 16 disposed on two opposite surfaces of the first dielectric layer 13.

The first conductive trace layer 15 is made of metal (e.g., copper), and includes the signal line 151 and two ground lines 153 disposed at two sides of the signal line 151 at intervals. A gap 154 is formed between the signal line 151 and the ground line 153.

The second electrically conductive line layer 16 is made of metal, such as copper. The second conductive trace layer includes a trace pattern layer (not shown) and a first ground layer 161, and the first ground layer 161 corresponds to the signal line 151. In this embodiment, the first ground layer 161 is a copper plating layer or a copper foil.

The first medium layer 13 includes an aerogel layer 131 and first and second water-resistant layers 132 and 133 disposed on opposite surfaces of the aerogel layer 131. The aerogel layer 131 includes a polymer having a low dielectric constant, such as Polyimide (PI), polyethylene terephthalate (PET), Liquid Crystal Polymer (LCP), polyethylene naphthalate (PEN), polytetrafluoroethylene (Teflon). The air proportion in the aerogel layer 131 is 80-99%, so that the aerogel layer 131 has a low dielectric constant. In this embodiment, the dielectric constant of the first dielectric layer 13 is 1.14 to 2.4.

Optionally, the glass transition temperature Tg of the aerogel layer 131 is greater than 340 ℃. In this embodiment, the aerogel layer 131 includes polyimide, polyacrylic acid, and silica. In other embodiments, the aerogel layer 131 may further include other high molecular materials and silicon dioxide, or the aerogel layer 131 may be formed by removing a polymer having a low glass transition temperature from polyimide and a polymer having a low glass transition temperature through thermal cracking.

In this embodiment, the thickness of the aerogel layer 131 is 25 to 150 μm, so that the first dielectric layer 13 has better weight resistance, and thus, collapse is not caused in the pressing process.

The first and second moisture-resistant layers 132 and 133 serve to block moisture in the air from entering the aerogel layer 131. In this embodiment, the first water-resistant layer 132 covers the surface of the first conductive trace layer 15 facing the first dielectric layer 13, and the second water-resistant layer 133 covers the surface of the second conductive trace layer 16 facing the first dielectric layer 13. In this embodiment, the first and second moisture-proof layers 132 and 133 have a thickness of 2 to 20 μm, respectively, so as to prevent the aerogel layer 131 from absorbing moisture.

The first and second water-resistant layers 132 and 133 may each include a hydrophobic material such as a fluorocarbon material (e.g., polytetrafluoroethylene, perfluoroalkoxyalkane), or a hydrocarbon. The material of the second water-resistant layer 133 may be the same as or different from the material of the first water-resistant layer 132. The dielectric constants of the first water-resistant layer 132 and the second water-resistant layer 133 are both 2.0-2.4.

The second circuit board 30 is a single-sided circuit board, and includes a second dielectric layer 31 and a third conductive trace layer 33 disposed on a surface of the second dielectric layer 31. The second dielectric layer 31 covers a side of the first conductive trace layer 15 departing from the first dielectric layer 13, and the third conductive trace layer 33 is located on a side of the second circuit board 30 departing from the first conductive trace layer 15.

The third conductive line layer 33 is made of metal (e.g., copper). The third conductive trace layer includes a trace pattern (not shown) and a second ground layer 331 disposed at intervals, and the second ground layer 331 corresponds to the signal line 151. In this embodiment, the second ground layer 331 is a copper plating layer or a copper foil.

The second dielectric layer 31 includes two layers of aerogel 311 and a first water resistant layer 312 and a second water resistant layer 313. The first water-resistant layer 312 covers the surface of the first conductive trace layer 15 away from the first dielectric layer 13. One of the aerogel layers 311 is sandwiched between the first water-resistant layer 312 and the second water-resistant layer 313, and the other aerogel layer 311 is sandwiched between the second water-resistant layer 313 and the third conductive trace layer 33. It is understood that in other embodiments, the second dielectric layer 31 may include only one aerogel layer 311.

In this embodiment, the first water-blocking layer 132 of the first dielectric layer 13 and the first water-blocking layer 312 of the second dielectric layer 31 are also commonly filled in the gap 154 to cover the signal line 151, so as to protect the signal line 151 from being oxidized.

The aerogel layer 311 includes a polymer having a low dielectric constant, such as Polyimide (PI), polyethylene terephthalate (PET), Liquid Crystal Polymer (LCP), polyethylene naphthalate (PEN), polytetrafluoroethylene (Teflon). The air proportion in the aerogel layer 311 is 80-99%, so that the aerogel layer 311 has a low dielectric constant. In this embodiment, the dielectric constant of the second dielectric layer 31 is 1.14 to 2.4.

Optionally, the glass transition temperature Tg of the aerogel layer 311 is greater than 340 ℃. In this embodiment, the aerogel layer 311 includes polyimide, polyacrylic acid, and silica. In other embodiments, the aerogel layer 311 may further include other polymer materials and silicon dioxide, or the aerogel layer 311 may be formed of polyimide and a polymer having a low glass transition temperature after removing the polymer having a low glass transition temperature through thermal cracking.

In this embodiment, the thickness of the aerogel layer 311 is 25 to 150 μm, so that the second dielectric layer 31 has better weight resistance, and thus, collapse is not caused in the pressing process.

It is understood that the number of the first wiring board 10 and the second wiring board 30 may be set as needed to obtain the high-frequency signal transmission structure 100 having more conductive line layers.

The high-frequency signal transmission structure 100 further includes two sets of conductive holes located at both sides of the signal line 151. The two sets of conductive holes are electrically connected to the two ground lines 153, respectively. Each set of conductive vias includes a first conductive via 61 and a second conductive via 63 on opposite surfaces of a ground line 153, the first conductive via 61 electrically connects the ground line 153 and the first ground layer 161, and the second conductive via 63 electrically connects the ground line 153 and the second ground layer 331. The two sets of conductive holes, the two ground lines 153, the first ground layer 161 and the second ground layer 331 are commonly surrounded around the signal line 151 to form an external surrounding electromagnetic shielding structure.

In the high-frequency signal transmission structure 100 according to the embodiment of the present invention, the dielectric layer disposed around the signal line 151 includes an aerogel layer having a low dielectric constant, so that attenuation of the signal line 151 during transmission can be reduced. The signal line 151 is covered with a water-blocking layer, so that the signal line 151 is prevented from being oxidized.

An embodiment of the present invention further provides a method for manufacturing a high-frequency signal transmission structure, including the following steps:

the method includes the steps that S1, a first circuit board is provided, and the first circuit board comprises a first medium layer, a first conductive circuit layer and a second conductive circuit layer, wherein the first conductive circuit layer and the second conductive circuit layer are formed on two opposite surfaces of the first medium layer;

s2, providing a second circuit board, wherein the second circuit board comprises a second dielectric layer and a third conductive circuit layer formed on one surface of the second dielectric layer;

and S3, pressing the second circuit board on the first circuit board, wherein the second dielectric layer covers the surface of the first conductive circuit layer, which is far away from the first dielectric layer.

Referring to fig. 2, in step S1, a first circuit board 10 is provided, where the first circuit board 10 includes a first dielectric layer 13, and a first conductive trace layer 15 and a second conductive trace layer 16 disposed on two back surfaces of the first dielectric layer 13.

The first conductive trace layer 15 is made of metal (e.g., copper), and includes a signal line 151 and two ground lines 153 disposed at two sides of the signal line 151 at intervals. A gap 154 is formed between the signal line 151 and the ground line 153.

The second electrically conductive line layer 16 is made of metal, such as copper. The second conductive trace layer includes a trace pattern layer (not shown) and a first ground layer 161, and the first ground layer 161 corresponds to the signal line 151. In this embodiment, the first ground layer 161 is a copper plating layer or a copper foil. The first conductive circuit layer 15 and the second conductive circuit layer 16 may be formed by performing exposure development and etching on a copper layer (not shown).

The first medium layer 13 includes an aerogel layer 131 and first and second water-resistant layers 132 and 133 disposed on opposite surfaces of the aerogel layer 131. The aerogel layer 131 can be formed by coating a hydrogel layer on a support (e.g., the first water-resistant layer 132 or the second water-resistant layer 133) and then baking the hydrogel layer.

The aerogel layer 131 includes a polymer having a low dielectric constant, such as Polyimide (PI), polyethylene terephthalate (PET), Liquid Crystal Polymer (LCP), polyethylene naphthalate (PEN), polytetrafluoroethylene (Teflon). The air proportion in the aerogel layer 131 is 80-99%, so that the aerogel layer 131 has a low dielectric constant. In this embodiment, the dielectric constant of the first dielectric layer 13 is 1.14 to 2.4.

Optionally, the glass transition temperature Tg of the aerogel layer 131 is greater than 340 ℃. In this embodiment, the aerogel layer 131 includes polyimide, polyacrylic acid, and silica. In other embodiments, the aerogel layer 131 may further include other high molecular materials and silicon dioxide, or the aerogel layer 131 may be formed by removing a polymer having a low glass transition temperature from polyimide and a polymer having a low glass transition temperature through thermal cracking.

In this embodiment, the thickness of the aerogel layer 131 is 25 to 150 μm, so that the first dielectric layer 13 has better weight resistance, and thus, collapse is not caused in the pressing process.

The first and second moisture-resistant layers 132 and 133 serve to block moisture in the air from entering the aerogel layer 131. In this embodiment, the first water-resistant layer 132 covers the surface of the first conductive trace layer 15 facing the first dielectric layer 13, and the second water-resistant layer 133 covers the surface of the second conductive trace layer 16 facing the first dielectric layer 13. In this embodiment, the first and second moisture-proof layers 132 and 133 have a thickness of 2 to 20 μm, respectively, so as to prevent the aerogel layer 131 from absorbing moisture.

The first and second water-resistant layers 132 and 133 may each include a hydrophobic material such as a fluorocarbon material (e.g., polytetrafluoroethylene, perfluoroalkoxyalkane), or a hydrocarbon. The material of the second water-resistant layer 133 may be the same as or different from the material of the first water-resistant layer 132. The dielectric constants of the first water-resistant layer 132 and the second water-resistant layer 133 are both 2.0-2.4.

Referring to fig. 3, in step S2, a second circuit board 30 is provided, where the second circuit board 30 includes a second dielectric layer 31 and a third conductive trace layer 33 disposed on a surface of the second dielectric layer 31.

The third conductive line layer 33 is made of metal (e.g., copper). The third conductive trace layer includes a trace pattern (not shown) and a second ground layer 331 disposed at intervals, and the second ground layer 331 corresponds to the signal line 151. In this embodiment, the second ground layer 331 is a copper plating layer or a copper foil.

The second dielectric layer 31 includes two layers of aerogel 311 and a first water resistant layer 312 and a second water resistant layer 313. The first water-resistant layer 312 covers the surface of the first conductive trace layer 15 away from the first dielectric layer 13. One of the aerogel layers 311 is sandwiched between the first water-resistant layer 312 and the second water-resistant layer 313, and the other aerogel layer 311 is sandwiched between the second water-resistant layer 313 and the third conductive trace layer 33. It is understood that in other embodiments, the second dielectric layer 31 may include only one aerogel layer 311.

The aerogel layer 311 includes a polymer having a low dielectric constant, such as Polyimide (PI), polyethylene terephthalate (PET), Liquid Crystal Polymer (LCP), polyethylene naphthalate (PEN), polytetrafluoroethylene (Teflon). The air proportion in the aerogel layer 311 is 80-99%, so that the aerogel layer 311 has a low dielectric constant. In this embodiment, the dielectric constant of the second dielectric layer 31 is 1.14 to 2.4.

Optionally, the glass transition temperature Tg of the aerogel layer 311 is greater than 340 ℃. In this embodiment, the aerogel layer 311 includes polyimide, polyacrylic acid, and silica. In other embodiments, the aerogel layer 311 may further include other polymer materials and silicon dioxide, or the aerogel layer 311 may be formed of polyimide and a polymer having a low glass transition temperature after removing the polymer having a low glass transition temperature through thermal cracking.

In this embodiment, the thickness of the aerogel layer 311 is 25 to 150 μm, so that the second dielectric layer 31 has better weight resistance, and thus, collapse is not caused in the pressing process.

Referring to fig. 4, in step S3, the second circuit board 30 is laminated on the first circuit board 10, wherein the second dielectric layer 31 covers a side of the first conductive trace layer 15 away from the first dielectric layer 13.

After the lamination, the first water-blocking layer 132 of the first dielectric layer 13 and the first water-blocking layer 312 of the second dielectric layer 31 are also filled in the gap 154 together to cover the signal line 151, so as to protect the signal line 151 from being oxidized.

Referring to fig. 5 and fig. 1, it can be understood that after step S3, the method further includes the steps of: one of the two sets of conductive holes formed on both sides of the signal line 151 electrically connects one ground line 153 and the first ground layer 161, and the other electrically connects the other ground line 153 and the second ground layer 331.

Each set of conductive vias includes a first conductive via 61 and a second conductive via 63 on opposite surfaces of a ground line 153, the first conductive via 61 electrically connects the ground line 153 and the first ground layer 161, and the second conductive via 63 electrically connects the ground line 153 and the second ground layer 331. The two sets of conductive holes, the two ground lines 153, the first ground layer 161 and the second ground layer 331 are commonly surrounded around the signal line 151 to form an external surrounding electromagnetic shielding structure. The first conductive hole 61 may be formed in the following manner: a blind hole 84 exposing the ground line 153 is formed in the first circuit board 10, and the first conductive hole 61 is formed by filling or plating a conductive material in the blind hole 84. The second conductive hole 63 may be formed in the following manner: a through hole 86 exposing the ground line 153 is formed in the second wiring board 30, and the second conductive hole 63 is formed by filling or plating a conductive material in the through hole 86.

In the manufacturing method of the high-frequency signal transmission structure provided by the embodiment of the invention, the aerogel layer has better weight resistance, so that collapse cannot be caused when the second circuit board 30 is pressed on the first circuit board 10.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.