阅读说明：本技术 一种用于光伏电源的集成电路芯片管理装置 (Integrated circuit chip management device for photovoltaic power supply ) 是由 刘一锋 于 2021-09-07 设计创作，主要内容包括：本发明公开了一种用于光伏电源的集成电路芯片管理装置,包括电路板、安装孔和单片机,电路板一端的中心位置处安装有单片机,电路板一端的拐角位置处均设置有安装孔,电路板的一端设置有防尘结构,电路板的外侧设置有防护结构,电路板的另一端设置有散热机构。本发明通过设置有防尘结构,在一般情况下防尘板位于电路板的表面,可对其表面的电子元件保护,防止灰尘或者杂物落于电路板的表面,进而影响电路板表面电子元件的使用,后期,若需对电路板表面的电子元件进行检查或者维护时,操作人员只需滑动防尘板,将其滑向溢边,将电路板表面的电子元件露出即可,实现了该集成电路芯片管理装置其表面的防尘性。(The invention discloses an integrated circuit chip management device for a photovoltaic power supply, which comprises a circuit board, mounting holes and a single chip microcomputer, wherein the single chip microcomputer is mounted at the center of one end of the circuit board, the mounting holes are formed in the corners of one end of the circuit board, a dustproof structure is arranged at one end of the circuit board, a protective structure is arranged on the outer side of the circuit board, and a heat dissipation mechanism is arranged at the other end of the circuit board. The dustproof structure is arranged, the dustproof plate is positioned on the surface of the circuit board under the general condition, the electronic elements on the surface of the dustproof plate can be protected, dust or sundries are prevented from falling on the surface of the circuit board, the use of the electronic elements on the surface of the circuit board is further influenced, and in the later period, if the electronic elements on the surface of the circuit board need to be checked or maintained, an operator only needs to slide the dustproof plate to the overflow edge to expose the electronic elements on the surface of the circuit board, so that the dustproof performance of the surface of the integrated circuit chip management device is realized.)

1. The utility model provides an integrated circuit chip management device for photovoltaic power supply, includes circuit board (1), mounting hole (4) and singlechip (5), its characterized in that: a single chip microcomputer (5) is installed at the center of one end of the circuit board (1), and mounting holes (4) are formed in the corner positions of one end of the circuit board (1);

one end of the circuit board (1) is provided with a dustproof structure (2), the dustproof structure (2) comprises a guide rail (201), a sliding groove (202), a sliding block (203) and a dustproof plate (204), the guide rail (201) is fixed at one end of the circuit board (1), and the outer side of the circuit board (1) is provided with a protective structure (3);

and the other end of the circuit board (1) is provided with a heat dissipation mechanism (6).

2. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 1, wherein: one side of the guide rail (201) is provided with a sliding groove (202), a sliding block (203) is arranged inside the sliding groove (202), and a dust guard (204) is fixed on one side of the sliding block (203).

3. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 1, wherein: two groups of guide rails (201) are fixed at one end of the circuit board (1), and the two groups of guide rails (201) are symmetrically distributed.

4. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 1, wherein: the cross section of the sliding groove (202) is larger than that of the sliding block (203), and the sliding groove (202) and the sliding block (203) form a slidable structure.

5. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 1, wherein: protective structure (3) include protective strip (301), mounting groove (302) and mounting groove (302), protective strip (301) set up in the outside of circuit board (1), the one end of protective strip (301) is provided with mounting groove (302), the inside of mounting groove (302) is provided with gim peg (303).

6. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 5, wherein: the cross section of the protection strip (301) is larger than that of the circuit board (1), and the protection strip (301) and the circuit board (1) form a clamping structure.

7. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 5, wherein: the inside of mounting groove (302) is provided with the internal thread, the surface of gim peg (303) is provided with the external screw thread, mounting groove (302) are connected through the screw thread with gim peg (303).

8. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 1, wherein: heat dissipation mechanism (6) are including heat dissipation case (601), radiating groove (602), cooling fan (603) and protection network (604), the other end in circuit board (1) is installed in heat dissipation case (601), the inside of heat dissipation case (601) is provided with radiating groove (602), the internally mounted of radiating groove (602) has cooling fan (603), protection network (604) are installed to the inside one end of radiating groove (602).

9. An integrated circuit chip management device for a photovoltaic power supply as recited in claim 8, wherein: the heat dissipation tank (601) is internally provided with six groups of heat dissipation grooves (602), and the six groups of heat dissipation grooves (602) are distributed at equal intervals.

Technical Field

The invention relates to the technical field of integrated circuit chip management devices, in particular to an integrated circuit chip management device for a photovoltaic power supply.

Background

The integrated circuit is a circuit with specific functions, which integrates a certain number of common electronic elements such as resistors, capacitors, transistors and the like and connecting lines among the elements through a semiconductor process, and the integrated circuit chip management device is a device for managing and controlling the integrated circuit chip management device;

chinese patent No. CN212812410U, publication No. 2021, 03, 26 discloses a power management device for a navigation version radio frequency chip, which comprises a circuit board, right-angled plates fixedly mounted on both sides of the bottom of the circuit board, and a mounting frame arranged on the outer sides of the right-angled plates; a buffer part is laid in the mounting frame, and the top of the buffer part is contacted with the bottom of the right-angle plate; a positioning piece is arranged on the mounting frame, and the bottom end of the positioning piece penetrates through the buffer piece. The invention provides a power supply management device of a navigation version radio frequency chip, which buffers a circuit board by arranging a buffer part and a positioning part and is used for buffering and damping; meanwhile, under the action of the positioning piece, the disassembly is facilitated;

the prior art scheme has the following defects that the traditional integrated circuit chip management device has a relatively common surface dustproof effect, and dust and sundries are easy to adhere to electronic elements on the surface of the integrated circuit chip management device, so that the integrated circuit chip management device needs to be improved and is more convenient to use.

Disclosure of Invention

Technical problem to be solved

The invention aims to provide an integrated circuit chip management device for a photovoltaic power supply, which is used for solving the defect of common dustproof effect of the conventional integrated circuit chip management device.

Disclosure of the invention

In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides an integrated circuit chip management device for photovoltaic power supply, includes circuit board, mounting hole and singlechip, the central point of circuit board one end puts the department and installs the singlechip, the turning position department of circuit board one end all is provided with the mounting hole, the one end of circuit board is provided with dustproof construction, dustproof construction includes guide rail, spout, slider and dust guard, the guide rail is fixed in the one end of circuit board, the outside of circuit board is provided with protective structure, the other end of circuit board is provided with heat dissipation mechanism.

Preferably, one side of the guide rail is provided with a sliding groove, a sliding block is arranged inside the sliding groove, and a dust guard is fixed on one side of the sliding block.

Preferably, two groups of guide rails are fixed at one end of the circuit board, and the two groups of guide rails are symmetrically distributed.

Preferably, the cross section of the sliding groove is larger than that of the sliding block, and the sliding groove and the sliding block form a slidable structure.

Preferably, protective structure includes protecting strip, mounting groove and mounting groove, the protecting strip sets up in the outside of circuit board, the one end of protecting strip is provided with the mounting groove, the inside of mounting groove is provided with the gim peg.

Preferably, the cross section of the protection strip is larger than that of the circuit board, and the protection strip and the circuit board form a clamping structure.

Preferably, the inside of mounting groove is provided with the internal thread, the surface of gim peg is provided with the external screw thread, the mounting groove is connected through the screw thread with the gim peg.

Preferably, the heat dissipation mechanism includes heat dissipation case, radiating groove, cooling fan and protection network, the heat dissipation case is installed in the other end of circuit board, the inside of heat dissipation case is provided with the radiating groove, the internally mounted of radiating groove has cooling fan, the protection network is installed to the inside one end of radiating groove.

Preferably, the heat dissipation grooves are arranged in six groups in the heat dissipation box, and the six groups of heat dissipation grooves are distributed at equal intervals.

(III) advantageous effects

The integrated circuit chip management device for the photovoltaic power supply has the advantages that: by arranging the dustproof structure, the dustproof plate is positioned on the surface of the circuit board under the general condition, so that electronic elements on the surface of the dustproof plate can be protected, dust or sundries are prevented from falling on the surface of the circuit board, the use of the electronic elements on the surface of the circuit board is further influenced, and in the later period, if the electronic elements on the surface of the circuit board need to be inspected or maintained, an operator only needs to slide the dustproof plate to the overflow edge to expose the electronic elements on the surface of the circuit board, so that the dustproof performance of the surface of the integrated circuit chip management device is realized;

by arranging the protection structure, the protection strip is clamped at the edge of the outer side of the circuit board, and after the protection strip is clamped, an operator can twist the fixing bolt on the protection strip to enable the bottom end of the fixing bolt to be abutted against the top of the circuit board to fix the protection strip and prevent the protection strip from falling off, so that the fixing bolt is positioned at the edge of the circuit board, the edge of the circuit board can be protected, the fragile edge of the circuit board is prevented from being damaged due to collision, and the protection performance of the integrated circuit chip management device is realized;

through being provided with heat dissipation mechanism, along with these cooling fan's in back rotation, can drive the air current and dispel the heat to the circuit board to this prevents the surperficial high temperature of circuit board, and then influences the use of electronic component on the circuit board, has strengthened the thermal diffusivity when this integrated circuit chip management device uses.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a rear view of the present invention;

FIG. 3 is a schematic bottom sectional view of the dustproof structure of the present invention;

FIG. 4 is a schematic three-dimensional structure of the dustproof structure of the present invention;

FIG. 5 is a schematic bottom sectional view of the protective structure of the present invention;

fig. 6 is a schematic bottom sectional view of the heat dissipation mechanism of the present invention.

In the figure: 1. a circuit board; 2. a dust-proof structure; 201. a guide rail; 202. a chute; 203. a slider; 204. a dust-proof plate; 3. a protective structure; 301. a protective strip; 302. mounting grooves; 303. a fixing bolt; 4. mounting holes; 5. a single chip microcomputer; 6. a heat dissipation mechanism; 601. a heat dissipation box; 602. a heat sink; 603. a heat radiation fan; 604. and (4) a protective net.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-6, an embodiment of the present invention is shown: an integrated circuit chip management device for a photovoltaic power supply comprises a circuit board 1, mounting holes 4 and a single chip microcomputer 5, wherein the single chip microcomputer 5 is mounted at the center of one end of the circuit board 1, the mounting holes 4 are formed in the corner positions of one end of the circuit board 1, a dustproof structure 2 is arranged at one end of the circuit board 1, the dustproof structure 2 comprises guide rails 201, sliding grooves 202, sliding blocks 203 and dustproof plates 204, the guide rails 201 are fixed at one end of the circuit board 1, the sliding grooves 202 are formed in one sides of the guide rails 201, the sliding blocks 203 are arranged inside the sliding grooves 202, the dustproof plates 204 are fixed on one sides of the sliding blocks 203, two groups of guide rails 201 are fixed at one end of the circuit board 1, the two groups of guide rails 201 are symmetrically distributed, the cross sections of the sliding grooves 202 are larger than the cross sections of the sliding blocks 203, and the sliding grooves 202 and the sliding blocks 203 form a slidable structure;

specifically, as shown in fig. 1, 3 and 4, when the structure is used, two sets of symmetrical guide rails 201 are installed on the surface of the circuit board 1, sliding grooves 202 are processed on the inner sides of the guide rails 201, and the sliding blocks 203 on both sides of the dust-proof plate 204 can be clamped in the sliding grooves 202, so that the dust-proof plate 204 forms a slidable structure through the cooperation between the sliding blocks 203 and the sliding blocks 203, and the dust-proof plate 204 is generally located on the surface of the circuit board 1, so as to protect the electronic components on the surface thereof, and prevent dust or impurities from falling on the surface of the circuit board 1, thereby affecting the use of the electronic components on the surface of the circuit board 1, and at a later stage, if the electronic components on the surface of the circuit board 1 need to be inspected or maintained, an operator only needs to slide the dust-proof plate 204 to the overflow edge, and expose the electronic components on the surface of the circuit board 1;

the protection structure 3 is arranged on the outer side of the circuit board 1, the protection structure 3 comprises a protection strip 301, a mounting groove 302 and a mounting groove 302, the protection strip 301 is arranged on the outer side of the circuit board 1, the mounting groove 302 is arranged at one end of the protection strip 301, a fixing bolt 303 is arranged inside the mounting groove 302, the cross section of the protection strip 301 is larger than that of the circuit board 1, the protection strip 301 and the circuit board 1 form a clamping structure, an internal thread is arranged inside the mounting groove 302, an external thread is arranged on the surface of the fixing bolt 303, and the mounting groove 302 is connected with the fixing bolt 303 through the threads;

specifically, as shown in fig. 1 and 5, when the structure is used, the protective strip 301 is clamped at the edge of the outer side of the circuit board 1, and after the protective strip 301 is clamped, an operator can screw the fixing bolt 303 on the protective strip 301 to enable the bottom end of the fixing bolt to abut against the top of the circuit board 1 to fix the protective strip 301, so that the protective strip 301 is prevented from falling off, and is located at the edge of the circuit board 1, so that the edge of the circuit board 1 can be protected, the fragile edge of the circuit board 1 is prevented from being damaged due to collision, and if the protective strip 301 is damaged in the later period, the operator can loosen the fixing bolt 303 to detach and replace the protective strip 301;

the other end of the circuit board 1 is provided with a heat dissipation mechanism 6, the heat dissipation mechanism 6 comprises a heat dissipation box 601, a heat dissipation groove 602, a heat dissipation fan 603 and a protective net 604, the heat dissipation box 601 is mounted at the other end of the circuit board 1, the heat dissipation groove 602 is arranged in the heat dissipation box 601, the heat dissipation fan 603 is mounted in the heat dissipation groove 602, the type of the heat dissipation fan 603 can be FD3010, the protective net 604 is mounted at one end in the heat dissipation groove 602, six groups of heat dissipation grooves 602 are arranged in the heat dissipation box 601, and the six groups of heat dissipation grooves 602 are distributed at equal intervals;

specifically, as shown in fig. 2 and fig. 6, when the mechanism is used, a plurality of sets of cooling fans 603 are installed on the back surface of the circuit board 1, and when the mechanism is used, the cooling fans 603 on the back rotate to drive airflow to cool the circuit board 1, so as to prevent the over-high temperature on the surface of the circuit board 1 from affecting the use of electronic components on the circuit board 1.

The working principle is as follows: when the protective strip 301 is used, firstly, the protective strip 301 is clamped at the edge position of the circuit board 1, and the fixing bolt 303 is used for reinforcing to prevent the protective strip 301 from falling off, so that the edge of the circuit board 1 can be protected by the protective strip 301, and the edge of the circuit board 1 is prevented from colliding with foreign objects to damage the circuit board 1;

secondly, a dust guard 204 is movably mounted above the surface of the circuit board 1, the dust guard 204 can protect the surface of the circuit board 1, dust can be prevented from attaching to electronic elements on the surface of the circuit board 1, the use of the electronic elements is further influenced, and if wiring or maintenance needs to be performed on the surface of the circuit board 1, an operator only needs to slide the dust guard 204 to one side;

finally, when the circuit board 1 is used, the movement of the airflow at the back end of the circuit board 1 can be accelerated along with the starting of the heat dissipation fan 603 at the back end of the circuit board 1, so that the temperature on the surface of the circuit board 1 can be taken away more quickly, the effect of cooling and heat dissipation is achieved, and the whole using process of the integrated circuit chip management device is finally completed.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.