阅读说明：本技术 电路板结构和显示装置 (Circuit board structure and display device ) 是由 秦福宏 康报虹 于 2021-09-30 设计创作，主要内容包括：本申请公开了一种电路板结构和显示装置,电路板结构包括柔性电路板、印制电路板和第一绑定结构,柔性电路板通过第一绑定结构绑定在印制电路板上,第一绑定结构包括第一金手指、第二金手指和第一异方性导电胶,第一金手指设置在印制电路板上,第二金手指设置在柔性电路板上,第一金手指与第二金手指对应设置；印制电路板上设置有凹槽,第一金手指对应设置在凹槽内,且第一金手指不突出于印制电路板；第二金手指突出于柔性电路板；第一异方性导电胶设置在印制电路板的第一金手指和对应柔性电路板的第二金手指之间。本申请通过上述方案,以提高绑定处绑定结构的导电效果。(The application discloses a circuit board structure and a display device, wherein the circuit board structure comprises a flexible circuit board, a printed circuit board and a first binding structure, the flexible circuit board is bound on the printed circuit board through the first binding structure, the first binding structure comprises a first golden finger, a second golden finger and a first anisotropic conductive adhesive, the first golden finger is arranged on the printed circuit board, the second golden finger is arranged on the flexible circuit board, and the first golden finger and the second golden finger are arranged correspondingly; a groove is formed in the printed circuit board, the first golden finger is correspondingly arranged in the groove, and the first golden finger does not protrude out of the printed circuit board; the second golden finger protrudes out of the flexible circuit board; the first anisotropic conductive adhesive is arranged between the first golden finger of the printed circuit board and the second golden finger of the corresponding flexible circuit board. This application is through above-mentioned scheme to improve and bind the electrically conductive effect of department's binding structure.)

1. A circuit board structure, the circuit board comprising a flexible circuit board, a printed circuit board and a first binding structure, the flexible circuit board being bound to the printed circuit board by the first binding structure,

the first binding structure comprises a first golden finger, a second golden finger and a first anisotropic conductive adhesive, the first golden finger is arranged on the printed circuit board, the second golden finger is arranged on the flexible circuit board, and the first golden finger and the second golden finger are arranged correspondingly;

a groove is formed in the printed circuit board, the first golden finger is correspondingly arranged in the groove, and the first golden finger does not protrude out of the printed circuit board; the second golden finger protrudes out of the flexible circuit board; the first anisotropic conductive adhesive is arranged between the first golden finger of the printed circuit board and the second golden finger corresponding to the flexible circuit board.

2. The circuit board structure of claim 1, wherein the sum of the thicknesses of the first gold finger and the second gold finger is greater than the depth of the groove.

3. The circuit board structure of claim 1, wherein the width of the first gold finger is greater than the width of the second gold finger, and the projection of the second gold finger on the printed circuit board is located in the projection area of the first gold finger on the printed circuit board.

4. The circuit board structure of claim 1, wherein the first bonding structure further comprises a conductive wire, the conductive wire is connected to the first gold finger correspondingly, and is disposed in the groove, the conductive wire is disposed on a side of the first gold finger away from the second gold finger, and a sum of thicknesses of the conductive wire and the first gold finger is smaller than a depth of the groove.

5. The circuit board structure according to claim 1, wherein the printed circuit board includes a resin substrate on which the groove is formed; the grooving width of the groove is gradually increased along the grooving direction, and the grooving width of the groove is the length of the groove along the width direction of the first golden finger.

6. The circuit board structure of claim 5, wherein the groove width of the groove increases linearly from the position of the first gold finger along the groove direction to form a slope on the sidewall of the groove.

7. The circuit board structure according to claim 1, wherein a gap exists between the flexible circuit board and the printed circuit board except for the region of the groove.

8. The circuit board structure of claim 6, wherein the second gold finger has a thickness greater than a thickness of the first gold finger.

9. A display device comprising a display panel and a circuit board structure according to any one of claims 1 to 8 for driving the display panel.

10. The display device according to claim 9, wherein one side of the flexible circuit board is bound to the printed circuit board by the first binding structure, and the other side of the flexible circuit board is bound to the display panel by a second binding structure,

the second binding structure comprises a third golden finger, a fourth golden finger and a second anisotropic conductive adhesive, the third golden finger is arranged on the display panel, the fourth golden finger is arranged on the flexible circuit board, and the third golden finger and the fourth golden finger are arranged correspondingly;

a second groove is formed in the display panel, the third golden finger is correspondingly arranged in the second groove, and the third golden finger does not protrude out of the display panel; the fourth golden finger protrudes out of the flexible circuit board; the second anisotropic conductive adhesive is arranged between the third golden finger of the display panel and the fourth golden finger corresponding to the flexible circuit board.

Technical Field

The application relates to the technical field of display, in particular to a circuit board structure and a display device.

Background

The circuit board structure is composed of a flexible circuit board and a printed circuit board, and particularly, for the circuit board structure applied to the display panel, the printed circuit board is generally not directly bound on the display panel and is bound through the flexible circuit board, and the flexible circuit board is generally also bound on the printed circuit board in a mode of realizing the conduction between the display panel and the printed circuit board. The flexible circuit board is usually bound by ACF (anisotropic Conductive film) anisotropic Conductive adhesive, the Conductive property of the ACF adhesive mainly depends on the effective number of Conductive particles, the effective number refers to the number of Conductive particles between the flexible circuit board and the printed circuit board, the flexible circuit board and the printed circuit board are conducted through the ACF adhesive only when the number of Conductive particles reaches a certain value, and the Conductive effect is directly influenced when the number of effective Conductive particles is too small.

At present, with the continuous improvement of the demand, because the number of the golden fingers at the bonding end of the flexible circuit board and the binding end of the printed circuit board in higher requirements is improved, and the size of the flexible circuit board and the printed circuit board needs to be reduced, and the like, the distance between the golden fingers is also smaller and smaller, so that the number of effective conductive particles between the golden fingers is smaller and smaller; causing poor conduction.

Disclosure of Invention

The application aims at providing a circuit board structure and a display device so as to improve the conductive effect of a binding structure at a binding part.

The application discloses a circuit board structure, the circuit board structure comprises a flexible circuit board, a printed circuit board and a first binding structure, the flexible circuit board is bound on the printed circuit board through the first binding structure, the first binding structure comprises a first golden finger, a second golden finger and a first anisotropic conductive adhesive, the first golden finger is arranged on the printed circuit board, the second golden finger is arranged on the flexible circuit board, and the first golden finger and the second golden finger are arranged correspondingly; a groove is formed in the printed circuit board, the first golden finger is correspondingly arranged in the groove, and the first golden finger does not protrude out of the printed circuit board; the second golden finger protrudes out of the flexible circuit board; the first anisotropic conductive adhesive is arranged between the first golden finger of the printed circuit board and the second golden finger corresponding to the flexible circuit board.

Optionally, the sum of the thicknesses of the first gold finger and the second gold finger is greater than the depth of the groove.

Optionally, the width of the first gold finger is greater than the width of the second gold finger, and the projection of the second gold finger on the printed circuit board is located in the projection area of the first gold finger on the printed circuit board.

Optionally, the first binding structure further includes a conductive line, the conductive line is correspondingly connected to the first gold finger, the conductive line is disposed in the groove, the first gold finger is disposed on the conductive line, and a sum of thicknesses of the conductive line and the first gold finger is smaller than a depth of the groove.

Optionally, the printed circuit board includes a resin substrate on which the groove is formed; the grooving width of the groove is gradually increased along the grooving direction, and the grooving width of the groove is the length of the groove along the width direction of the first golden finger.

Optionally, the groove width of the groove increases linearly from the position of the first gold finger along the groove direction to form a slope on the sidewall of the groove.

Optionally, a gap exists between the flexible circuit board and the printed circuit board except for the region of the groove.

Optionally, the thickness of the second gold finger is greater than the thickness of the first gold finger.

The application also discloses a display device, which comprises a display panel and the circuit board structure, wherein the circuit board structure is used for driving the display panel.

Optionally, one side of the flexible circuit board is bound to the printed circuit board through the first binding structure, the other side of the flexible circuit board is bound to the display panel through a second binding structure, the second binding structure includes a third gold finger, a fourth gold finger and a second anisotropic conductive adhesive, the third gold finger is disposed on the display panel, the fourth gold finger is disposed on the flexible circuit board, and the third gold finger and the fourth gold finger are disposed correspondingly; a second groove is formed in the display panel, the third golden finger is correspondingly arranged in the second groove, and the third golden finger does not protrude out of the display panel; the fourth golden finger protrudes out of the flexible circuit board; the second anisotropic conductive adhesive is arranged between the third golden finger of the display panel and the fourth golden finger corresponding to the flexible circuit board.

In this application, the region that binds with the flexible circuit board on the printed circuit board is called and binds the district, the district that binds of printed circuit board sets up the recess in the below of the first golden finger that corresponds, make after coating ACF glues on printed circuit board, bind the second golden finger of flexible circuit board with first golden finger one-to-one respectively, in extrusion process, because ACF glue in the recess receives pressure and can not expand outward, and the regional ACF glue of non-recess is because the squeezing action, conductive particle in the ACF glue receives the extrusion, can move to the recess region, make the conductive particle who moves the recess region increase. The strength of the conductive capacity between the first golden finger and the second golden finger mainly depends on the quantity of conductive particles in the area, if the quantity of the conductive particles is small, the conductive capacity at the area is weak, and the conductive particles can be burnt when large current passes through the area, so that the quantity of the conductive particles between the first golden finger and the second golden finger is increased, and the problem of the reduction of the conductive capacity between the first golden finger and the second golden finger can be solved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

fig. 1 is a schematic top view of a circuit board structure according to a first embodiment of the present application;

FIG. 2 is a schematic side view of a circuit board structure of a first embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of FIG. 2 along the AA cutting line;

fig. 4 is a schematic cross-sectional view of a first bonding structure of a circuit board structure according to a first embodiment of the present application;

FIG. 5 is a schematic view of a second type of printed circuit board of the first embodiment of the present application;

FIG. 6 is a schematic view of a third printed circuit board of the first embodiment of the present application;

fig. 7 is a schematic top view of a display device according to a second embodiment of the present application;

FIG. 8 is a schematic side view of a display device of a second embodiment of the present application;

FIG. 9 is a schematic cross-sectional view of FIG. 8 along line BB cut;

fig. 10 is a schematic view of a second display panel of the second embodiment of the present application;

fig. 11 is a schematic view of a third display panel of the second embodiment of the present application.

Wherein, 1, a circuit board structure; 10. a printed circuit board; 20. a flexible circuit board; 30. a first binding structure; 31. a first golden finger; 32. a second golden finger; 33. a first anisotropic conductive adhesive; 34. a conductive wire; 35. conductive particles; 100. a resin substrate; 101. a groove; 102. a bevel; 103. an inclined surface; 200. a display device; 210. a display panel; 211. a second groove; 212. a third groove; 213. a glass substrate; 214. an insulating layer; 220. a second binding structure; 221. a third golden finger; 222. a fourth golden finger; 223. a second anisotropic conductive adhesive.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The present application is described in detail below with reference to the figures and alternative embodiments.

The first embodiment is as follows:

as shown in fig. 1, as a first embodiment of the present application, a schematic top view of a circuit board structure is disclosed, the circuit board structure 1 includes a printed circuit board 10 and a flexible circuit board 20, the flexible circuit board 20 is bound on the printed circuit board 10, and as shown in fig. 2, a side view of a display device is disclosed, and the printed circuit board 10 and the flexible circuit board 20 are bound and connected by a first binding structure 30.

Fig. 3 is a schematic cross-sectional view of fig. 2 along an AA cutting line, disclosing a specific first binding structure 30, where the first binding structure 30 includes a plurality of first gold fingers 31, a plurality of second gold fingers 32 and a first anisotropic conductive adhesive 33, the first gold fingers 31 are disposed on the printed circuit board 10, the second gold fingers 32 are disposed on the flexible circuit board 20, and the plurality of first gold fingers 31 and the plurality of second gold fingers 32 are disposed in a one-to-one correspondence; a plurality of grooves 101 are formed in the printed circuit board 10, a plurality of first gold fingers 31 are arranged in the grooves 101, and the first gold fingers 31 do not protrude out of the printed circuit board 10; the second gold finger 32 protrudes out of the flexible circuit board 20; the first anisotropic conductive paste 33 is disposed between the first gold finger 31 of the printed circuit board 10 and the second gold finger 32 corresponding to the flexible circuit board 20.

In this application, the area of the printed circuit board 10 bonded to the flexible circuit board 20 is referred to as a bonding area, the bonding area of the printed circuit board 10 is provided with a groove 101 below the corresponding first gold finger 31, after the ACF glue is coated on the printed circuit board 10, the second golden fingers 32 of the flexible circuit board 20 are respectively bound with the first golden fingers 31 in a one-to-one correspondence manner, in the pressing process, the ACF glue in the groove 101 is pressed by the pressure and cannot be spread, but the ACF glue in the area other than the groove 101 is pressed by the pressing action, so that the conductive particles 35 in the ACF glue move to the area of the groove 101, the conductive particles 35 moving to the area of the groove 101 are increased, the strength of the conductive capability between the first gold finger 31 and the second gold finger 32 mainly depends on the number of the conductive particles 35 in the area, and if the number of the conductive particles 35 is small, the conductive capability is weak; and when a large current passes through the first gold finger 31 and the second gold finger 32, the first gold finger may be burnt, so that the number of the conductive particles 35 between the first gold finger 31 and the second gold finger 32 is increased, and the problems of reduced conductivity and insufficient overload capacity between the first gold finger 31 and the second gold finger 32 can be solved.

Specifically, the first bonding structure 30 further includes a plurality of conductive lines 34, the plurality of conductive lines 34 are connected with the plurality of first gold fingers 31 in a one-to-one correspondence manner, the conductive lines 34 are disposed in the grooves 101, the first gold fingers 31 are disposed on the corresponding conductive lines 34, and the sum of the thicknesses of the conductive lines 34 and the first gold fingers 31 is smaller than the depth of the grooves 101.

It should be noted that the conductive line 34 may be formed of a metal, such as a Cu material. The conductive traces 34 extend into the printed circuit board 10 and are connected to internal circuitry. Generally, the printed circuit board 10 adopts a single-layer, double-layer or multi-layer design, the different layer designs may result in different depths of the grooves, and the conductive line 34 is in direct contact with the first gold finger 31, and the conductive line 34 is disposed in the groove 101. In order to ensure that the first gold finger 31 does not protrude from the surface of the printed circuit board 10, the depth of the groove 101 is dug so that the sum of the thicknesses of the conductive line 34 and the first gold finger 31 is less than the depth of the groove 101.

For example, fig. 4 is a schematic diagram showing the first gold finger 31 and the second gold finger 32 communicating after the flexible circuit board is bonded to the printed circuit board; as shown in connection with fig. 3, the printed circuit board includes a resin substrate on which the groove is directly formed; the grooves 101 may be cut by physical laser cutting or by chemical etching, which may be a solution of an etchable resin to form the corresponding grooves 101. The specific depth and width of the groove 101 can be set to different specifications by setting parameters to adapt to different printed circuit boards 10 and flexible circuit boards 20. It should be noted that the Flexible Circuit board 20 may be an FPC (Flexible Printed Circuit) or a COF (Chip On Film), and correspondingly, the Flexible Circuit board 20 is provided with a plurality of second gold fingers 32, and the second gold fingers are formed by an alloy of a Ni layer and an Au layer. The printed Circuit Board may be a pcb (printed Circuit Board) Board or a pcba (printed Circuit Board assembly) Board, and the first gold finger is formed of one or more of a Cu layer, a Ni layer and an Au layer, and typically an alloy layer of Ni and Au is used. The groove is dug in the base material below the first golden finger of the binding area at the PCB end, the base material is generally a resin substrate, the first golden finger at the PCB end corresponds to the second golden finger at the FPC end one by one, the groove below the first golden finger is matched with the protruding part above the second golden finger one by one, and due to the effect of the groove, the stress in the groove cannot expand outwards during binding, the ACF adhesive in the groove is acted to the maximum extent, so that the stitching condition of conductive particles in the ACF adhesive is optimal; in addition, due to the limiting effect of the groove, the conductive particles inside the groove cannot slide to other areas when being pressed by force.

Specifically, the width of the first gold finger 31 is smaller than the width of the groove 101, and the width d1 of the first gold finger 31 is larger than the width d2 of the second gold finger 32 on the projection of the first gold finger. Since the first gold finger 31 and the second gold finger 32 may be shifted due to the shifting of the binding machine, the thermal expansion and other factors in the binding process, that is, the first gold finger 31 and the second gold finger 32 are not completely overlapped and correspond to each other, the second gold finger 32 on one side of the flexible circuit board 20 is designed to be narrower. Generally, the width d2 of the second gold finger 32 is narrower than the width d1 of the first gold finger 31 by about 10%. Moreover, under the normal binding condition, the projection of the second golden finger 32 on the printed circuit board is positioned in the projection area of the first golden finger 31 on the printed circuit board. I.e. the second gold finger 32 does not extend beyond the area of the first gold finger 31.

Further, the sum of the thicknesses of the first gold finger 31 and the second gold finger 32 is greater than the depth of the groove 101. Generally, if the depth of the groove 101 is too deep, after the printed circuit board 10 and the flexible circuit board 20 in the corresponding non-groove 101 region are attached, the first gold finger 31 and the second gold finger 32 cannot be connected, and therefore, the sum of the thicknesses of the first gold finger 31 and the second gold finger 32 is required to be larger than the depth of the groove 101. More precisely, the sum of the thicknesses of the first gold finger 31, the anisotropic conductive adhesive and the second gold finger 32 is greater than the depth of the groove 101. While the thickness of the printed circuit board is generally quite limited, and is often on the order of millimeters, in this embodiment, the depth of the groove can be made proportional to the thickness of the printed circuit board, in the range of 1: and the thickness of the corresponding first golden finger and the thickness of the corresponding second golden finger can be correspondingly set between 2-2: 3. Within this range, the conductive ability of the first binding structure can be improved to the maximum extent possible.

On another aspect, when the first gold finger 31 and the second gold finger 32 are electrically connected through the first anisotropic conductive adhesive 33, a gap exists between the flexible circuit board 20 and the printed circuit board 10 except for the region of the groove 101. The gap can be adjusted by selecting the appropriate thickness of the first gold finger 31, the second gold finger 32 and the depth of the groove 101 according to actual conditions. Under the condition that the depth of the groove and the thickness of the printed circuit board are 2:3 and the thicknesses of the first golden finger and the second golden finger are in limit conditions, the ACF glue only exists in the groove, the non-groove area can be pasted by using insulating glue, and the design can meet the maximum conductive design in the groove.

In order to further increase or enable the flexible circuit board 20 and the printed circuit board 10 to form a gap after being bound, the thickness of the second gold finger 32 may be set to be greater than the thickness of the first gold finger 31. The second gold finger 32 has a thicker thickness, which is more favorable for designing the gap distance. In a relatively speaking manner, the thickness of the second gold finger 32 can be kept constant, while the thickness of the first gold finger 31 is made thicker, and it should be noted that the design is a parameter which can be adjusted in order to form the gap under the condition that the depth of the groove 101 is constant.

As shown in fig. 5, as a variation of the first embodiment, the groove width of the groove 101 gradually increases along the groove direction, and the groove width of the groove 101 is the length of the groove 101 along the width direction of the first gold finger 31. It should be noted that the slotting direction is a direction from the first gold finger to the second gold finger.

Specifically, after the first gold finger 31 is disposed in the groove 101, the surface of the first gold finger 31 is the bottom of the groove 101, and the width of the groove 101 gradually increases from the surface of the first gold finger 31 to the surface of the non-groove 101 region, that is, the sidewall of the groove 101 forms an inclined surface 102 or an arc surface (not shown), which is an inclined surface in the case of linear increase, and is an arc surface in the case of two or three times. The inclined surface or the arc surface is to make the conductive particles 35 enter the groove 101 more easily when being pressed, thereby increasing the number of the conductive particles 35 between the first gold finger 31 and the second gold finger 32. The groove 101 is gradually enlarged in the grooving direction, and can be realized on the resin base 100, and the inclined slope of the corresponding non-groove 101 region can be formed on the substrate 100 by laser etching, so that the applicability is high. The inclination angle and the inclination width of the inclined surface of the side wall of the groove 101 should not be too large, and the specific values can be adjusted according to design parameters.

As another modification of the first embodiment, as shown in fig. 6, it may be arranged that the non-groove 101 region is formed such that the resin base forms a surface inclined to the groove 101, that is, an inclined surface 103 in a direction toward the groove 101 region, and the inclined surface 103 gradually faces the groove, and also that the conductive particles 35 can more easily enter into the groove 101 when being pressed. The conductive particles may be further forced into the grooves in conjunction with the bevel 102 in fig. 5. The inclined surface 103 has a small inclination angle and can be formed by polishing or the like during the manufacturing process.

Example two:

as shown in fig. 7, as a second embodiment of the present application, a top view of a display device is disclosed, the display device 200 includes a display panel 210 and a circuit board structure 1, the circuit board structure 1 includes a printed circuit board 10 and a flexible circuit board 20, one side of the flexible circuit board 20 is bound on the printed circuit board 10, and the other side of the flexible circuit board 20 is bound on the display panel 210, as shown in fig. 8, a side view of the display device is disclosed, and the display panel 210 and the flexible circuit board 20 are also bound and connected by a second binding structure 220.

As shown in fig. 9, which is a schematic cross-sectional view along a cutting line BB of fig. 8, the second bonding structure 220 includes a third gold finger 221, a fourth gold finger 222 and a second anisotropic conductive adhesive 223, the third gold finger 221 is disposed on the display panel 210, the fourth gold finger 222 is disposed on the flexible circuit board 20, and the third gold finger 221 and the fourth gold finger 222 are disposed correspondingly; a second groove 211 is formed in the display panel 210, the third golden finger 221 is correspondingly disposed in the second groove 211, and the third golden finger 221 does not protrude from the display panel 210; the fourth gold finger 222 protrudes from the flexible circuit board 20; the second anisotropic conductive paste 223 is disposed between the third gold finger 221 of the display panel 210 and the fourth gold finger 222 corresponding to the flexible circuit board 20.

The design of the second binding structure 220 may be substantially the same as the first and second embodiments, that is, a plurality of second grooves 211 are disposed in the binding region of the display panel 210, and the third gold fingers 221 are disposed in a one-to-one correspondence. The difference is that the second groove 211 can be formed on the glass substrate 213 of the display panel or on the film layer of the display panel, and the substrate itself has a certain thickness, so that it is easier to form the second groove 211 with a corresponding depth; the film layer needs to have a certain thickness, and similar to the transparent conductive layer, the second groove 211 with a certain depth cannot be formed on the thickness of the transparent conductive layer.

The substrate is a substrate, the second recess 211 can be formed by physical laser cutting or chemical etching cutting, and the chemical etching can be performed by etching the substrate with a hydrogen fluoride solution to form a corresponding second recess 211. The specific depth and width of the second groove 211 can be set to different specifications by setting parameters to adapt to different display panels and flexible circuit boards. The substrate may be a substrate for forming an array substrate, or may be a substrate for forming a color filter substrate, and generally, the substrate bound to the flexible circuit board is an array substrate.

As shown in fig. 10, as a second bonding structure of the second embodiment of the present application, a second groove 211 is disposed on a film layer of a glass substrate 213, the display panel 210 includes the glass substrate 213 and an insulating layer 214 disposed on the glass substrate, the second groove 211 is disposed on the insulating layer 214, and the third gold finger 221 is disposed in the second groove 211. Under the condition that the thickness of the insulating layer 214 is enough, the insulating layer 214 is directly exposed, developed and etched to form a plurality of second grooves 211, the manufacturing method is simpler, the glass substrate 213 does not need to be processed, only one exposure process needs to be added, the exposure process is relatively more mature in technology, and the yield is high.

Of course, in order to ensure the depth of the second groove 211, the second groove 211 may be disposed on the glass substrate and the third groove 212 may be formed on the insulating layer in fig. 9, for example, as shown in fig. 11, that is, the second groove 211 of the glass substrate is formed to overlap with the third groove 212 of the insulating layer, so that the second groove 211 has a depth that can be implemented.

In this embodiment, the width and thickness of the third gold finger 221 and the fourth gold finger 222, the depth of the second groove 211, and the like may be designed the same as those in the first embodiment, and are not described herein again. Different from the first embodiment, when the third groove 212 is formed by etching the insulating layer, the width of the groove of the third groove 212 can be gradually increased only by changing the concentration, direction, and the like of the etching, so that the side wall of the third groove 212 forms an inclined surface or an arc surface, and the inclined surface or the arc surface is used for enabling conductive particles to enter the third groove 212 more easily when being extruded, thereby increasing the number of the conductive particles between the first gold finger and the second gold finger.

It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced.

The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display Panel, IPS (In-plane Switching) display Panel, VA (Vertical Alignment) display Panel, MVA (Multi-Domain Vertical Alignment) display Panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display Panel, and the above solution can be applied thereto.

The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.