阅读说明：本技术 一种盘类平面构件柔性点阵粘接装置及适应性装夹方法 (Flexible dot matrix bonding device for disc-type planar member and adaptive clamping method ) 是由 孙玉文 闫舒洋 齐书韬 徐金亭 于 2021-10-13 设计创作，主要内容包括：本发明公开了一种盘类平面构件柔性点阵粘接装置及适应性装夹方法,该装置主要包括基板、连接杆和辅助支架三部分。基板上均布周向阵列的螺纹孔,连接杆通过螺纹连接方式固定在基板不同周向位置处,起粘接和辅助支撑盘类平面构件的作用。辅助支架与基板配合,可将车削加工完成后的工件无碰伤取出。结合盘类构件加工面形检测结果,针对性地调整连接杆在基板上的安装位置,进而改变盘类构件的粘接位置,以降低后续加工过程中装夹边界对构件应力释放的约束效果,最终形成旨在减小盘类平面构件加工变形的适应性装夹方法。本发明提供的点阵粘接装置结构柔性可调,结合所提适应性装夹方法,可以满足不同应力状态盘类平面构件的最优装夹需求。(The invention discloses a flexible dot matrix bonding device for a disc-type planar member and an adaptive clamping method. The threaded holes in the circumferential array are uniformly distributed in the substrate, and the connecting rods are fixed at different circumferential positions of the substrate in a threaded connection mode to play a role in bonding and assisting in supporting the disc-like plane member. The auxiliary support is matched with the base plate, so that the workpiece after turning can be taken out without damage. And the mounting position of the connecting rod on the substrate is adjusted in a targeted manner by combining the detection result of the processing surface shape of the disc type component, so that the bonding position of the disc type component is changed, the constraint effect of a clamping boundary on the stress release of the component in the subsequent processing process is reduced, and finally, the adaptive clamping method aiming at reducing the processing deformation of the disc type planar component is formed. The lattice bonding device provided by the invention has flexible and adjustable structure, and can meet the optimal clamping requirements of disc-type plane members in different stress states by combining the provided adaptive clamping method.)

1. A flexible dot matrix bonding device for a disc-like planar member is characterized by comprising a substrate (1), a connecting rod (2) and an auxiliary support (3);

the base plate (1) is uniformly distributed with balancing screw holes (11) in the circumferential direction, mounting holes (13) are uniformly distributed in the circumferential direction at the outer edge of the upper surface, and a groove is formed in the middle; a plurality of arc grooves (12) and threaded through holes (15) are arranged in the grooves, and seam allowance structures (14) are arranged at the outer edges of the grooves;

the bottom surface of the connecting rod (2) is provided with an inner hexagonal counter bore (21), and the bottom of the connecting rod is provided with an external thread (22);

the auxiliary support (3) comprises a plurality of bosses (31), wherein arc-shaped silicon rubber plates (32) with the same cross section outline as the bosses (31) are adhered to the upper surfaces of the bosses (31);

when the disc-like plane member (6) is processed, firstly, the connecting rod (2) is fixed on the substrate (1) by utilizing the thread matching relationship; the connecting rods (2) on the base plate (1) are divided into two types which respectively play roles of bonding and assisting in supporting the workpiece; coating an adhesive on the upper surface of the connecting rod (2) which plays a role in bonding, and sticking a circular silicon rubber plate (5) on the upper surface of the connecting rod (2) which plays a role in auxiliary supporting to form a dot matrix clamping device; placing a disc-type plane component (6) to be processed on the combined dot matrix clamping device, and after the adhesive is cured, adjusting the height of the connecting rod (2) playing a role of auxiliary support until the circular silicon rubber plate (5) on the connecting rod is contacted with the clamping surface of the disc-type plane component (6);

when the disc-type plane member (6) is disassembled, firstly, the bonding device and the disc-type plane member (6) which are fixedly connected together are placed on a heating platform, and bonding agents between the connecting rod (2) and the disc-type plane member (6) are melted; and then the combined structure is placed on an auxiliary support (3), a boss (31) on the support penetrates through an arc groove (12) on the base plate (1), an arc silicon rubber plate (32) on the boss is contacted with a clamping surface of the disc type plane component (6), and the processed disc type plane component (6) is jacked up immediately, so that the workpiece is taken out without collision damage.

2. The flexible dot matrix bonding device for disc-like planar members according to claim 1, wherein the base plate (1), the connecting rods (2) and the auxiliary support (3) are made of aluminum alloy.

3. The flexible dot matrix bonding device for the disc-like plane members as claimed in claim 1 or 2, wherein the width of the circular arc groove (12) on the base plate (1) is larger than that of the boss (31) on the auxiliary bracket (3), and the boss (31) can move up and down in the circular arc groove (12).

4. The flexible dot matrix bonding device for disc-like planar members according to claim 1 or 2, wherein the bonding agent is a low melting point bonding wax, and the melting point is in the range of 60 ℃ to 70 ℃.

5. A flexible dot matrix bonding device for a disc-like planar member according to claim 3, wherein said adhesive is a low melting point adhesive wax having a melting point in the range of 60 ℃ to 70 ℃.

6. A flexible dot matrix bonding device for disc-like planar members according to claim 1, 2 or 5, wherein the circular silicone rubber sheet (5) is a self-adhesive rubber sheet, one side of which is provided with a 3M back adhesive.

7. A flexible dot matrix bonding device for disc-like planar members according to claim 3, wherein said circular silicone rubber sheet (5) is a self-adhesive rubber sheet, one side of which is provided with a 3M back adhesive.

8. The flexible dot matrix bonding device for disc-like planar members according to claim 4, wherein the circular silicone rubber sheet (5) is a self-adhesive rubber sheet, one side of which is provided with a 3M back adhesive.

9. An adaptive clamping method realized based on a flexible dot matrix bonding device of a disc-like planar member is characterized by comprising the following steps:

firstly, primarily selecting the number and the positions of bonding points of the disc-like plane component (6) according to the stress and moment balance conditions in the cutting process of the disc-like plane component (6); mounting a connecting rod (2) on the substrate (1), and adjusting the axial height of the connecting rod (2) to a proper position; according to the initial selection bonding scheme, a circular silicon rubber plate (5) is bonded on the upper surface of the selected part of the connecting rod (2);

secondly, the flexible dot matrix bonding device is integrally arranged on a heating platform for preheating; after preheating is finished, uniformly coating a layer of hot-melt adhesive on the upper surface of the selected connecting rod (2) with the bonding function, and placing the disc-like planar member (6) on the combined dot matrix clamping device; then the heating platform is closed, and the bonding agent between the disc-like plane component (6) and the connecting rod (2) is cooled and solidified, so that the workpiece is fixed on the bonding device; fixing a flexible dot matrix device adhered with a disc-like planar member (6) on an ultra-precision machine tool by adopting bolts matched with the mounting holes (13), mounting a balancing bolt (4) in a balancing screw hole (11) on the substrate (1), and adjusting the balancing bolt (4) until the dynamic balance detection result of the machine tool meets the requirement;

thirdly, ejecting the disc-like plane component (6) by using the auxiliary bracket (3) after turning; measuring the processing surface shape of the disc-like plane member (6) by adopting a non-contact measuring device to obtain the deformation distribution of the disc-like plane member;

step four, adjusting the clamping scheme of the workpiece according to the deformation detection result; specifically, the boundary constraint action of the large deformation area is weakened by reducing the number of bonding points in the area, so that unbalanced stress induced by material removal is fully released in the machining process, and the machining deformation of the disc-like plane component (6) after constraint unloading is further reduced;

fifthly, fixing the disc-like plane component (6) on the bonding device again according to the revised clamping scheme, then installing the bonding device on the ultra-precision machine tool, readjusting the dynamic balance of the machine tool, and finishing the subsequent processing of the disc-like plane component (6) according to the given turning parameters;

step six, detecting the processing surface shape of the disc-like planar member (6), evaluating the effect of the new clamping scheme, determining the current deformation distribution of the disc-like planar member (6), and providing data support for the adjustment of the subsequent clamping scheme; and repeating the fourth step, the fifth step and the sixth step until the geometric dimension and the surface shape precision of the disc-like plane member (6) converge to the expected target.

Technical Field

The invention belongs to the technical field of turning and clamping of disc-type plane components, and particularly relates to a flexible dot matrix bonding device and an adaptive clamping method.

Background

The surface shape precision of some thin-wall disc type plane components applied to the fields of information electronics, energy power and the like is often extremely high, but the thin-wall disc type plane components are easy to deform under the action of stress due to large diameter-thickness ratio and poor rigidity, so that the difficulty of ensuring the precision in turning is extremely high. The clamping form not only directly influences the clamping deformation of the component, but also changes the stress release mode in the component processing process, and further influences the surface shape precision of the thin-wall disc type plane component after the thin-wall disc type plane component is processed.

At present, the commonly adopted vacuum adsorption clamping method firmly presses the plane component on the surface of the clamp through the pressure difference between the vacuum cavity inside the clamp body and the atmosphere, and has the advantages of simple operation and reliable clamping. However, the major problems of the large clamping deformation caused by the adsorption force and the strong constraint effect on the stress release in the machining process are the main problems that the machining precision of the thin-wall plane component under the vacuum adsorption clamping condition is restricted. Different from the method, the bonding method adopts the low-stress adhesive to fix the workpiece on the clamp, so that the constraint effect of the clamping boundary is weakened, and the clamping deformation of the thin-wall disc type component can be effectively reduced. The method is applied to the polishing process of the optical element, and generally the positioning surface is integrally bonded. The patent CN103847032A adopts a smooth glue plate liquid wax bonding method to bond the whole surface of the positioning surface of the disc-type component, and on the basis, a polishing process meeting the requirement of batch processing of ultrathin quartz wafers is formed. Due to the volume shrinkage of the adhesive during curing and the randomness of the curing sequence of the adhesive, the whole surface bonding further increases the bonding deformation amount and the deformation complexity of the thin-wall plane component. Patent CN111482337B discloses a local bonding fixture for polishing and grinding ultrathin disc parts, which is used for bonding asphalt powder on an array boss structure of the fixture, and fixing the disc members on the fixture by the bonding force generated when the molten asphalt powder is cooled. The clamping method reduces the adhesive deformation of the ultrathin disc parts, but fails to effectively control the stress deformation of the disc parts.

According to the existing bonding technical scheme, although the bonding area of the disc type member can be reduced by reducing the number of bosses in the local bonding fixture so as to achieve the constraint effect of weakening the bonding boundary on stress release in the machining process, the unsupported area of the workpiece is increased, and the elastic cutter relieving deformation of the thin-wall member under the cutting force action is aggravated. In addition, most of the existing local bonding devices are special fixtures for a certain procedure of a certain part, but the stress states of the interior of different disc type components are different even at different processing stages of the same disc type component, the corresponding optimal bonding schemes are different inevitably, and the special fixtures adopting the fixed structures are difficult to meet the optimal clamping requirement in the turning process of the disc type plane components.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a flexible dot matrix bonding device and an adaptive clamping method for the turning process of a disc type plane member, and aims to solve the problem that the prior bonding device and method are difficult to meet the optimal clamping requirement in the turning process of the disc type plane member.

The technical scheme of the invention is as follows:

a flexible dot matrix bonding device for a disc-like planar member with adjustable bonding positions comprises a substrate, a connecting rod and an auxiliary support.

The base plate circumference equipartition balancing screw of bonding device, upper surface outer edge circumference equipartition mounting hole, the middle part is the recess. A plurality of threaded through holes and arc grooves are arranged in the grooves, and seam allowance structures are arranged at the outer edges of the grooves.

The bottom surface of the connecting rod of the bonding device is provided with an inner hexagonal counter bore, and the bottom of the connecting rod is provided with an external thread.

The auxiliary support of the bonding device comprises a plurality of boss structures, wherein arc-shaped silicon rubber plates with the same cross section outline as the bosses are bonded on the upper surfaces of the boss structures.

The flexible dot matrix bonding device is assembled according to the structural characteristics of the components so as to adapt to various actual working conditions of the disc-like plane member, and specifically:

when processing the disc-like plane member, the connecting rod is first fixed to the base plate by means of screw connection. The connecting rods on the base plate are divided into two types according to the selected bonding and clamping scheme, and the two types of connecting rods respectively play roles in bonding and assisting in supporting the disc-like planar components. And coating an adhesive (hot melt adhesive or wax) on the upper surface of the connecting rod with the bonding function, and adhering a circular silicon rubber plate on the upper surface of the connecting rod with the auxiliary supporting function to form the dot matrix clamping device. And (3) placing the disc-type planar member to be processed on the combined dot matrix clamping device, and after the adhesive is cured, adjusting the height of the connecting rod playing a role in auxiliary support by adopting an inner hexagonal wrench until the circular silicone rubber plate on the connecting rod is contacted with the clamping surface of the disc-type planar member.

When the disc-type plane member is disassembled, firstly, the bonding device and the disc-type plane member which are fixedly connected together are placed on the heating platform, the hot melt adhesive between the connecting rod and the disc-type plane member is melted, and at the moment, the disc-type plane member can freely rotate in the spigot structure of the bonding device but is difficult to take out. Therefore, the combined structure is arranged on the auxiliary support, the boss on the support penetrates through the arc groove on the base plate, the arc silicon rubber plate on the boss is contacted with the clamping surface of the disc type plane component, and then the processed disc type plane component is jacked up, so that the workpiece is taken out without damage.

The flexible adjustable characteristic of the designed bonding device structure is fully exerted, and by adopting the device, an adaptive clamping method for reducing the processing deformation of the disc-type planar member is provided, and the specific steps are as follows:

firstly, selecting the number and the positions of bonding points of the disc-type planar member primarily according to the stress and moment balance conditions in the cutting process of the disc-type planar member. And mounting a connecting rod on the base plate, and adjusting the axial height of the connecting rod to a proper position. According to the initially selected bonding scheme, a circular silicon rubber plate is bonded on the upper surface of part of the connecting rod;

and secondly, placing the whole bonding device on a heating platform for preheating. After preheating is finished, a layer of hot melt adhesive is uniformly coated on the upper surface of the connecting rod which is not adhered with the silicon rubber plate, and the disc-like plane component is placed on the combined dot matrix clamping device. And then closing the heating platform, and cooling and solidifying the adhesive between the disc-like planar member and the connecting rod so as to fix the workpiece on the bonding device. And fixing the bonding device on the ultra-precision machine tool by adopting bolts matched with the base plate mounting holes, mounting the balancing bolts in the balancing screw holes on the base plate, and adjusting the balancing bolts until the dynamic balance detection result of the machine tool meets the requirement.

And step three, ejecting the disc-like plane component by using the auxiliary support after the processing is finished. And measuring the processing surface shape of the disc-like plane member by using a non-contact measuring device so as to obtain the deformation distribution of the disc-like plane member.

And step four, adjusting the clamping scheme of the disc-like plane member according to the deformation detection result. The method reduces the number of bonding points in a large deformation area, weakens the boundary constraint effect of the area, fully releases unbalanced stress induced by material removal in the machining process, and further reduces the machining deformation of the disc-like plane component after constraint unloading.

And fifthly, re-fixing the disc-like planar member on the bonding device according to the revised clamping scheme, then installing the bonding device on the ultra-precision machine tool, re-adjusting the dynamic balance of the machine tool, and finishing the subsequent processing of the disc-like planar member according to the given turning parameters.

And step six, detecting the processing surface shape of the disc type plane component, evaluating the effect of the new clamping scheme, determining the current deformation distribution of the disc type plane component, and providing data support for the adjustment of the subsequent clamping scheme. And repeating the processes of the fourth step, the fifth step and the sixth step until the geometric dimension and the surface shape precision of the disc-like plane component converge to the expected target.

Compared with the prior art, the invention has the beneficial effects that:

(1) the invention designs a flexible dot matrix bonding device facing the turning process of the disc-type plane component, and a user can more freely adjust the bonding position of the disc-type component according to the actual situation so as to meet the optimal clamping requirements of the disc-type plane component in different stress states.

(2) The invention designs a clamping scheme of the disc-type planar member of 'bonding and auxiliary supporting', reduces the number of connecting rods with bonding effect, not only reduces the constraint effect of a clamping boundary on stress release in the processing process of the disc-type planar member, but also solves the problem of serious elastic cutter relieving deformation caused by too few bonding points and too large unsupported area of the disc-type planar member, and effectively improves the processing surface shape precision of the disc-type planar member.

(3) The auxiliary support structure matched with the base plate is designed, the disc-like plane member can be conveniently jacked up from the seam allowance structure by utilizing the auxiliary support structure, and the workpiece can be taken out without damage after turning.

Drawings

FIG. 1 is a schematic diagram of a substrate structure of a flexible dot matrix bonding apparatus.

FIG. 2 is a schematic view of a connection rod structure of the flexible dot matrix bonding device.

FIG. 3 is a schematic view of the structure of the auxiliary support of the flexible dot matrix bonding device.

Fig. 4 is a layered view of the disc-like planar member in a clamped state.

Figure 5 is a layered view of the device when the disc-like planar member is disassembled.

Fig. 6 is a flow of adjustment of the bonding scheme aimed at reducing the processing distortion of the disc-like planar member.

In the figure: 1. a substrate; 11. a trim screw hole; 12. an arc groove; 13. mounting holes; 14. a spigot structure; 15. a threaded through hole; 2. a connecting rod; 21. an inner hexagonal counter bore; 22. an external thread; 3. an auxiliary support; 31. a boss; 32. an arc silicone rubber plate; 4. a trim bolt; 5. a circular silicone rubber plate; 6. a disc-like planar member.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the present invention is further described below with reference to the accompanying drawings in combination with the embodiments so that those skilled in the art can implement the present invention by referring to the description, and the scope of the present invention is not limited to the embodiments. It is to be understood that the embodiments described below are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A flexible dot matrix bonding device for a disc-type planar member mainly comprises a substrate 1, a connecting rod 2 and an auxiliary support 3.

As shown in figure 1, the base plate 1 of the bonding device is uniformly provided with balancing screw holes 11 in the circumferential direction, mounting holes 13 are uniformly provided in the circumferential direction at the outer edge of the upper surface, and a groove is formed in the middle. A plurality of arc grooves 12 and threaded through holes 15 are arranged in the grooves, and seam allowance structures 14 are arranged at the outer edges of the grooves.

As shown in FIG. 2, the connecting rod 2 of the bonding device is provided with a hexagon socket head 21 on the bottom surface and an external thread 22 on the bottom.

As shown in fig. 3, the auxiliary holder 3 of the bonding apparatus includes a plurality of bosses 31, wherein an arc-shaped silicone rubber sheet 32 having the same cross-sectional profile as that of the bosses 31 is bonded to the upper surface of the bosses 31.

The flexible dot matrix bonding device is assembled according to the structural characteristics of the components so as to adapt to various actual working conditions of the disc-like plane member, and specifically:

as shown in fig. 4, when the disc-like planar member 6 is processed, the tie bar 2 is first fixed to the base plate 1 by the fitting relationship between the male screw 22 at the bottom of the tie bar 2 and the female screw of the threaded through hole 15 in the base plate 1. The connecting rods 2 on the base plate 1 are divided into two types according to the selected bonding clamping scheme, and the two types respectively play roles of connecting and assisting the supporting disc type plane component 6. The upper surface of the connecting rod 2 which plays a role in connection is coated with adhesive (hot melt adhesive or wax), and the upper surface of the connecting rod 2 which plays a role in auxiliary support is adhered with a circular silicon rubber plate 5. And (3) placing the disc-type planar member 6 to be processed on the combined dot matrix clamping device, after the adhesive is cured, selecting an inner hexagonal wrench matched with the inner hexagonal counter bore 21 to adjust the axial height of the connecting rod 2 playing a role in auxiliary supporting until the circular silicon rubber plate 5 on the connecting rod is contacted with the clamping surface of the disc-type planar member 6.

As shown in fig. 5, when the disc-like planar member 6 is removed, the bonding apparatus and the disc-like planar member 6 which are fixedly connected together are firstly placed on a heating platform, and the hot melt adhesive between the tie bar 2 and the disc-like planar member 6 is melted, and the disc-like planar member 6 can freely rotate in the seam allowance structure 14 of the bonding apparatus, but is difficult to remove. Therefore, the combined structure is placed on the auxiliary support 3, the boss 31 on the support penetrates through the arc groove 12 on the base plate 1, the arc silicon rubber plate 32 on the boss is in surface contact with the clamping surface of the disc-like planar member 6, and then the processed disc-like planar member 6 is jacked up, so that the workpiece is taken out without damage.

As shown in fig. 6, the flexible and adjustable characteristic of the designed bonding device structure is fully exerted, and by adopting the device, an adaptive clamping method for reducing the processing deformation of a disc-like planar member is provided, which comprises the following specific steps:

firstly, selecting the number and the positions of the bonding points of the disc-like planar member 6 primarily according to the stress and moment balance conditions in the cutting process of the disc-like planar member 6. A connecting rod 2 is arranged on a base plate 1, and the axial height of the connecting rod 2 is adjusted to a proper position. According to the initially selected bonding scheme, a circular silicon rubber plate 5 is bonded on the upper surface of the selected part of the connecting rod 2;

and secondly, placing the whole bonding device on a heating platform for preheating. After preheating is finished, a layer of hot melt adhesive is uniformly coated on the upper surface of the selected connecting rod 2 with the bonding function, and the disc-like plane component 6 is placed on the combined dot matrix clamping device. And then, closing the heating platform, and fixing the workpiece on the bonding device after the bonding agent between the disc-like planar member 6 and the connecting rod 2 is cooled and solidified. Fixing the bonding device on the ultra-precision machine tool by adopting bolts matched with the mounting holes 13, mounting the balancing bolts 4 in the balancing screw holes 11 on the substrate 1, and adjusting the balancing bolts 4 until the dynamic balance detection result of the machine tool meets the requirement;

and step three, ejecting the disc-like plane component 6 by using the auxiliary bracket 3 after the processing is finished. Measuring the processing surface shape of the disc-like plane member 6 by using a non-contact measuring device, and further obtaining the deformation distribution of the disc-like plane member;

and step four, adjusting the clamping scheme of the workpiece according to the deformation detection result. The number of bonding points in a large deformation area is reduced, the boundary constraint effect of the area is weakened, unbalanced stress induced by material removal is fully released in the machining process, and machining deformation of the disc-like plane component 6 after constraint unloading is reduced;

fifthly, fixing the disc-like planar member 6 on the bonding device again according to the revised clamping scheme, then installing the bonding device on the ultra-precision machine tool, readjusting the dynamic balance of the machine tool, and finishing the subsequent processing of the disc-like planar member 6 according to the given turning parameters;

and step six, detecting the processing surface shape of the disc type plane component 6, evaluating the effect of the new clamping scheme, determining the current deformation distribution of the disc type plane component 6, and providing data support for the adjustment of the subsequent clamping scheme. And repeating the processes of the fourth step, the fifth step and the sixth step until the geometric dimension and the surface shape precision of the disc-like plane member 6 converge to the expected target.