阅读说明：本技术 用于制造分别具有至少一个集成电路的钞票的方法 (Method for producing bank notes each having at least one integrated circuit ) 是由 罗伯特·斯蒂尔曼 奥雷利·贝尔通 安格雷·莫尼 于 2020-10-20 设计创作，主要内容包括：本发明涉及一种用于制造分别具有至少一个集成电路(04)的钞票(02)的方法,其中,钞票(02)由印刷单张纸(01)或者由材料幅材在制造印张中制成,至少在多个钞票(02)中或者在每个钞票(02)中分别形成穿过其基材(18)的穿孔(03),分别将集成电路(04)布置在相应的穿孔(03)中,待布置在穿孔(03)之一内的集成电路(04)中的每个电路在第一方法步骤中关于在具有穿孔(03)的每个钞票(02)中的预定位置以位置正确的方式布置在带状薄膜(06)上,并且在第二方法步骤中从该带状薄膜(06)传递到相应的钞票(01)上,通过在第二方法步骤中实施的所述传递,将集成电路(04)分别布置在构造于钞票(03)中的穿孔(03)中。(The invention relates to a method for producing banknotes (02) each having at least one integrated circuit (04), wherein the banknotes (02) are produced from a printed sheet of paper (01) or from a material web in the production of the printed sheets, wherein perforations (03) through the base material (18) thereof are formed at least in a plurality of banknotes (02) or in each banknote (02), wherein the integrated circuits (04) are each arranged in a respective perforation (03), wherein each of the integrated circuits (04) to be arranged in one of the perforations (03) is arranged in a positionally correct manner on a strip-shaped film (06) in a first method step with respect to a predetermined position in each banknote (02) having the perforations (03), and wherein the integrated circuits are transferred from the strip-shaped film (06) to the respective banknote (01) in a second method step, wherein, by means of the transfer carried out in the second method step, the integrated circuits (04) are each arranged in a perforation (03) formed in the banknote (03).)

1. A method for producing banknotes (02) each having at least one integrated circuit (04), wherein the banknotes (02) are produced from a printed sheet of paper (01) or from a web of material in the production of the printed sheet, wherein perforations (03) through the base material (18) thereof are formed at least in a plurality of banknotes (02) or in each banknote (02) in each case, wherein the integrated circuits (04) are arranged in each case in a corresponding perforation (03), wherein each of the integrated circuits (04) to be arranged in one of the perforations (03) is arranged in a positionally correct manner on a strip-shaped film (06) in a first method step with respect to a predetermined position in each of the banknotes (02) having the perforations (03), and wherein in a second method step the integrated circuits are transferred from the strip-shaped film (06) to the respective banknote (01), wherein by means of the transfer carried out in the second method step, the integrated circuits (04) are each arranged in a perforation (03) formed in the banknote (02).

2. Method according to claim 1, characterized in that the respective perforation (03) in each of the banknotes (02) is formed by blanking or by laser cutting, respectively.

3. Method according to claim 1 or 2, characterized in that each of the integrated circuits (04) to be arranged in one of the perforations (03) constructed in the respective banknote (02) is respectively designed as a microchip encapsulated in its own housing.

4. A method as claimed in claim 1 or 2 or 3, characterized in that an RFID tag is used as the integrated circuit (04), respectively.

5. The method of claim 4, wherein capacitively coupled RFID tags are used.

6. Method according to claim 1 or 2 or 3 or 4 or 5, characterized in that each of the integrated circuits (04) to be arranged in one of the perforations (03) formed in the respective banknote (02) has a surface with an edge length (104) of at most 1mm x 1 mm.

7. Method according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that the perforations (03) in the respective banknote (02) are each designed in their respective extent to be 10% to 100% greater than the respective edge length (104) of the respective integrated circuit (04).

8. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7, characterized in that the integrated circuit (04) is arranged on the band-shaped film (06) with the aid of blown air in a first method step.

9. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8, characterized in that the integrated circuit (04) is fixed in its respective position in the first method step on the strip-shaped film (06) electrostatically and/or by means of an adhesive technique.

10. The method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9, characterized in that the strip-shaped film (06) is connected to the base material (18) of the respective printed sheet (01) or of the respective banknote (02) of the material web by or directly after the implementation of the second method step.

11. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10, characterized in that a double-layer film is used as the band-shaped film (06), the first layer (16) of the band-shaped film (06) being connected to the base material (18) of the respective printed sheet of paper (01) or of the respective material web bank note (02) by or directly after the implementation of the second method step, wherein the integrated circuit (04) adheres to the first layer (16).

12. Method according to claim 11, characterized in that the second layer (17) of the two-layer structured band-shaped film (06) is constructed from paper or synthetic material.

13. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12, characterized in that a film with a hologram and/or a kinegram is used as the band-shaped film (06).

14. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13, characterized in that a metal film or a metallized film is used as the band-shaped film (06).

15. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14, characterized in that a security film to be arranged on the substrate (18) of the banknote (02) is used as the band film (06).

16. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15, characterized in that in a third method step the integrated circuits (04) arranged in the respective perforations (03) are fixed there, wherein the fixing takes place using a printing method.

17. Method according to claim 16, characterized in that a non-conductive printing fluid (21) is applied by the printing method.

18. The method according to claim 16 or 17, characterized in that an inkjet printing method or a screen printing method is used as the printing method.

19. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 17 or 18, characterized in that in the third method step the integrated circuits (04) arranged in the respective perforations (03) are fixed there, wherein the fixing is effected by rolling or hot-pressing a cover film (23) onto the substrate (18) of the respective banknote (02).

20. Method according to claim 19, characterized in that a non-conductive film is used as the cover film (23).

21. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 17 or 18 or 19 or 20, characterized in that an integrated circuit (04) with a structure height of at most 90 μm is used.

22. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 17 or 18 or 19 or 20, characterized in that an integrated circuit (04) is used having a structure height in the range between 25 μm and 50 μm.

23. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 17 or 18 or 19 or 20 or 21 or 22, characterized in that information about the currency and/or value of the respective banknote (02) and/or information about the issuing bank of the respective banknote (02) is stored in the integrated circuit (04).

24. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 17 or 18 or 19 or 20 or 21 or 22 or 23, characterized in that information about whether the banknotes (02) have been circulated or when they have started to circulate is stored in the integrated circuit (04).

25. Method according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 or 10 or 11 or 12 or 13 or 14 or 15 or 16 or 18 or 19 or 20 or 21 or 22 or 23 or 24, characterized in that at least two method steps to be carried out in the production of bank notes (02) each having at least one integrated circuit (04) are carried out in-line in the same production machine, respectively, namely: a first method step, in which the integrated circuit (04) is arranged in a positionally correct manner on the web-shaped film (06), and/or a second method step, in which the integrated circuit (04) is arranged in a perforation (03) of the banknote (02), and/or a third method step, in which the integrated circuit (04) arranged in the perforation (03) is fixed, and/or in which a printed sheet of paper (01) with the banknote (02) or a web of material with the banknote (02) is printed and/or a copy produced in the production of the banknote (02) is separated.

Technical Field

The invention relates to a method for producing bank notes, each having at least one integrated circuit, according to claim 1.

Background

DE69722403T2 discloses a standard banknote comprising: a paper-based substrate comprising at least one integrated circuit which is attached to or embedded in the paper-based substrate as an active identification element and/or authentication element of a banknote, wherein the integrated circuit provides storage and exchange of information about the banknote in a secure manner, the integrated circuit being inserted into an opening of the paper-based substrate, the thickness of the integrated circuit corresponding to the thickness of the paper-based substrate and being smaller than 100 μm.

DE102011103000a1 discloses a method for hot-pressing at least one portion of at least one strip-shaped embossing film onto a strip-shaped substrate, wherein the substrate to be embossed is brought together with the embossing film of the at least one embossing film, the substrate and the embossing film located thereon are guided along the periphery of a first heated embossing roller, in which first embossing section the substrate and the embossing film located thereon are pressed against one another and against a heated surface of the first embossing roller by means of at least one first pressure roller arranged at the periphery of the first embossing roller, and a first embossing layer is embossed onto the substrate, the single-embossed substrate is guided away from the first embossing roller and, with respect to the running direction of the substrate, after the first embossing roller, again meets the same or another embossing film of the at least one embossing film, the single-embossed substrate and the embossing film located thereon are guided along the periphery of a second heated embossing roller, in the second embossing, the substrate and the embossed film on the substrate are pressed against each other and against the heated surface of the second embossing roller by at least one second pressing roller arranged at the periphery of the second embossing roller, and the second embossed layer is embossed onto the substrate, the secondarily embossed substrate being guided away from the second embossing roller.

DE102004018081a1 discloses a method for producing security papers, comprising the following steps: a) forming a paper web on a paper web, and b) embedding a synthetic material film with an antenna structure into the paper web during the paper forming, wherein the synthetic material film is a web-structured synthetic material film web.

From US2005/0150740a 1a sheet material with an electrical circuit is known, as well as a device and a method for processing the sheet material, which reduce the processing expenditure of the sheet material and/or simplify and/or improve the processing and/or make the processing more reliable. To this end, the sheet has at least one electrical circuit, wherein energy and/or data is transferred from the device to the electrical circuit and/or from the electrical circuit to the device, and at least a part of the transferred data is used for processing the sheet.

Disclosure of Invention

The object of the invention is to provide a method for producing bank notes, each having at least one integrated circuit, which can be implemented economically in an industrial process.

According to the invention, this object is achieved by the measure of claim 1. The dependent claims relate to advantageous developments and/or configurations of the found solution.

The advantages which can be achieved by the invention are, in particular, that bank notes each having at least one integrated circuit can be produced economically in an industrial process. Another advantage of the solution found is that banknotes with integrated circuits inserted respectively in the perforations are more durable and durable in use than banknotes with integrated circuits applied on the surface, in particular when the structural height of the integrated circuits is less than the thickness or material thickness of the substrate of the respective banknote. It is also advantageous that the integrated circuit configured as a capacitively coupled RFID (radio frequency identification) tag does not require a separate antenna. Other advantages will become apparent from the following description.

Drawings

Embodiments of the invention are illustrated in the drawings and described in detail below.

Wherein:

figure 1 shows a printed single sheet with a plurality of banknotes;

figure 2 shows a banknote with an integrated circuit arranged in a perforation;

FIG. 3 shows a structure for positionally correctly applying an integrated circuit to a strip-shaped film;

figure 4 shows a device for arranging integrated circuits in respective perforations of a banknote;

FIG. 5 illustrates an apparatus for securing an integrated circuit in one of the perforations using an inkjet printing method;

FIG. 6 shows an apparatus for securing an integrated circuit in one of the perforations using a screen printing method;

fig. 7 shows an arrangement for fixing an integrated circuit in one of the perforations by rolling a cover film.

Detailed Description

Fig. 1 shows by way of example that a large number of required security documents, in particular banknotes 02, are usually produced in an industrial process for producing printed sheets. The use of this application technique means that a plurality of banknotes 02 are arranged in a composite of rows R and columns S on a printed sheet of paper 01 or on a material web during the production process, and that these banknotes 02 are removed from the composite at the end of the production process and are separated therefrom. At the end of the production process, each bank note 02 produced in the production of printed sheets forms a separate product after separation, but a plurality of such largely identical products are produced jointly on the printed sheets 01 or on the material web in order to make optimum use of the surface area of the printed sheets 01 or material web and thus to enable cost-effective mass production.

The bank note 02 generally has a substrate 18 (fig. 4) made of, for example, paper or synthetic material, in particular a polymer material, wherein the substrate 18 is preferably printed in one or more printing presses in a plurality of different printing processes. As printing methods, for example, offset printing methods and/or gravure printing methods, in particular inline printing methods, and/or screen printing methods and/or inkjet printing methods are used. The bank notes 02 arranged in the columns S on the printed sheets 01 or on the material web, respectively, are arranged generally longitudinally to the conveying direction of the respective printed sheet 01 or material web guided through the respective printing press, whereas the bank notes 02 in the arrangement rows R are arranged generally transversely to the conveying direction.

In order to produce the banknotes 02 each having at least one integrated circuit 04, a perforation 03 is first produced in each case at least in a plurality of, or preferably in each banknote 02, each perforation penetrating the respective printed sheet 01 or the base material 18 of the respective web of material, wherein such a perforation 03 is often also referred to as a window or opening. The formation of the perforations 03 is effected, for example, by blanking or cutting, in particular by laser cutting, and the contour of the respective perforation 03 can be designed arbitrarily, but is usually designed in a circular or rectangular manner. Fig. 2 shows an exemplary individual copy of such a banknote 02.

Each integrated circuit 04 to be inserted into one of the banknotes 02 is respectively encapsulated in its own housing and is therefore respectively designed as a separate component. Each integrated circuit 04 to be embedded in one of the banknotes 02 is therefore designed as a microchip. In the exemplary embodiment which is preferred here, the integrated circuits 04 to be embedded in the respective banknotes 02 are designed as RFID tags (radio-frequency identification tags) (english: radio-frequency identification and english: tag;. german: funketett), in particular as capacitively coupled RFID tags, and the data exchange between the respective integrated circuits 04 and an external transmitting device and receiving device, not shown, takes place in a contactless manner. Each of these integrated circuits 04 has a generally rectangular shape, in particular a square face with a rim length l04 of at most 1mm × 1mm, preferably 0.5mm × 0.5mm, wherein the overall height or thickness of such an integrated circuit 04 to be embedded is at most 90 μm, and preferably lies in the range between 25 μm and 50 μm, and is therefore smaller than the material thickness of the base material 18 of the respective banknote 02. The perforation 03 to be formed in the respective banknote 02 is adapted to the shape of the respective integrated circuit 04 to be inserted and, in its respective extent, is formed, for example, to be between 10% and 100% greater than the respective edge length l04 of the integrated circuit to be inserted. In each integrated circuit 04, for example, information about the currency and/or the value of the respective banknote 02 and/or information about the issuing bank of the respective banknote 02, which can be read contactlessly by means of an external transmitting and/or receiving device, not shown, is stored, for example by means of a corresponding programming. It is also possible to store information in the integrated circuit 04 as to whether the banknote 02 has already been circulated or when it has started to be circulated.

In the following, for the sake of simplicity only and without limiting the invention, it is assumed that banknotes 02 of the same type are produced in the production of printed sheets, so that the respective perforation 03 in each of these banknotes 02 is configured in the same position in relation to the respective banknote 02. The center of the respective perforation 03 and thus its position in the respective banknote 02, for example, passes through the respective coordinate x, for example, relative to at least one boundary line (for example, an edge or side edge of the respective printed sheet of paper 01 or web of material), for example; y. These coordinates x; y are stored, for example, in a control computer, wherein the control computer provides, at least for each banknote 02 produced in production use, the respective coordinates x; y, for example, are supplied, on the one hand, to a cutting device 09 or to a blanking device 28 (fig. 4) which respectively forms the individual perforations 03, and, on the other hand, to a device which supplies the individual integrated circuits 04.

In order to arrange the integrated circuits 04 in the respective perforations 03 of the banknotes 02 to be produced together in an industrial process, in a first method step, a required number of integrated circuits 04 are arranged in register on the web-shaped film 06 by providing a device for each integrated circuit 04. The registered arrangement means that in each case a respective one of the integrated circuits 04 is arranged precisely at those positions on the web-shaped film 06 which correspond to the passage of a respective coordinate x on the respective printed sheet 01 or web of material; y determined locations for placement of the respective integrated circuits 04. The structures on the web-shaped film 06 thus correspond precisely in lateral register and in circumferential register to the desired arrangement on the respective printed sheet 01 or web of material.

As is shown in fig. 3 by way of example and only schematically, the web-shaped film 06 is preferably provided in the form of a material roll 07 and unwound from the material roll 07, and the supplied integrated circuits 04 are then arranged in position and therefore in positional register on the unwound part of the material roll 07, i.e., on the web-shaped film 06. The supply of the integrated circuits 04 to the web-shaped film 06 can take place, for example, with the aid of blowing air. The integrated circuit 04 is fixed to the strip-shaped film 06, for example, electrostatically and/or by means of adhesive technology. After the adhesive arrangement of the integrated circuits 04 on the tape-like film 06 has been completed, the film can be wound up again, for example on a reel 08.

In a second method step, the web-shaped film 06 wound on the reel 08 according to the example described is unwound again from the reel 08, wherein the integrated circuits 04 arranged in register on the web-shaped film 06 are transferred from the web-shaped film 06 to the bank notes 02 formed on the respective printed sheet of paper 01 or the respective web of material, respectively, and by this transfer carried out in the second method step, one of the integrated circuits 04 is arranged in each case in a perforation 03 formed in the bank notes 02.

Fig. 4 shows the use of an integrated circuit 04 in a banknote 02, wherein fig. 4 shows an example of the use of individual perforations 03 of printed sheets 01 transported in the transport direction T, in particular the structure of the integrated circuit 04, each of the printed sheets 01 having a length l01 in the transport direction T. In the example shown, a plurality of printed sheets 01 are fed from the first stack 24 at a distance a in succession in the feed direction T to the device 12 for applying the integrated circuits 04 and are then deposited again in the second stack 26 after the application has been completed. In order to be able to produce economically, at least some of the processing steps are combined locally, that is to say, carried out in the same machine arrangement, in order to avoid intermediate storage of the printed sheets 01. The printed sheets 01 or the material web are therefore preferably fed continuously from the first stack 24 first to the cutting device 09 or the punching device 28, wherein the perforations 03 are formed in the respective printed sheet 01 or material web by the cutting device 09 or the punching device 28. The printed sheets of paper 01 or the material web provided with the perforations 03 are then preferably fed in the same machine arrangement to a device 12 for applying the integrated circuits 04, for example with a roller pair, which transfers the integrated circuits 04 arranged on the strip-shaped film 06 from the strip-shaped film 06 to the respective bank note 02 in the roller gap of the cooperating rollers 13, wherein one of the integrated circuits 04 is arranged in each case in a perforation 03 formed on the bank note 02 by this transfer. Preferably, the application is performed simultaneously for all integrated circuits 04 arranged in the same row R. Since the bank note 02 is produced in the production of printed sheets by means of a plurality of columns S arranged next to one another and therefore a plurality of bank notes 02 are arranged in each case in rows R which each extend over a plurality of columns S, a very high throughput can be achieved here in comparison with the serial processing of individual bank notes 02. At least at the transfer point 11 located in the roller nip, the transport speed of the band-shaped film 06 to be unwound from the reel 08, for example, is synchronized with the transport speed of the printed sheets 01 or web of material.

By carrying out the second method step or immediately after the second method step, the band-shaped film 06 is connected to the respective base material 18 of the printed sheet of paper 01 or of the respective web of material of the banknote 02. In a preferred embodiment for producing the bank notes 02, the web-shaped film 06, on which the integrated circuits 04 are arranged in register in a first method step, is configured as a double-layer film, wherein the first layer 16 of the web-shaped film 06 is connected to the base material 18 of the bank notes 02 of the respective printed sheet of paper 01 or of the respective material web by or directly after the second method step. The strip-shaped film 06 or its first layer 16 is connected to the base material 18 of the respective printed sheet of paper 01 or of the respective banknote 02 of the material web, for example, in a material-locking manner, in particular by gluing. The first layer 16 of the band-shaped film 06 or of the two-layer band-shaped film 06 is preferably designed as a film with a hologram and/or a kinegram (kinegram), respectively, wherein the second layer 17 of the two-layer band-shaped film 06 is made of paper or synthetic material, for example. The motion picture is a security element with a tilting effect, which means that a fixedly defined movie-like process is produced depending on the viewing angle of the motion picture. Unlike holograms with three-dimensional elements, most silver-colored bright kinegrams are two-dimensional motion processes. In particular, a metal film or a metallized film or a security film to be arranged on the substrate 18 of the banknote 02 is used as the first layer 16 of the band film 06 or of the band film 06 of the two-layer construction, respectively. The second layer 17 forms a carrier for the first layer 16, for example for tear strength and/or stability and/or processability reasons. If the strip-shaped film 06 or its first layer 16 is designed as a metal film or as a metallized film, the film is made, for example, of aluminum or of another metal material, or the film has a carrier made, for example, of a synthetic material, the surface of which is metallized, for example, by evaporation of a metal. In each of these embodiments, the integrated circuit 04 to be applied is adhered to the first layer 16 of the strip film 06 or of the strip film 06 in a two-layer construction. However, there is no electrically conductive connection between the individual integrated circuits 04 and the metal film 06 or the metallized surface of this film 06. The connection of the band-shaped film 06 or its first layer 16 to the base material 18 of the respective printed sheet of paper 01 or of the respective bank note 02 of the material web is produced, for example, by rolling or by hot pressing. During the hot pressing, the band-shaped film 06 or the first layer 16 thereof is applied under pressure and heat to the substrate 18 of the respective printing sheet 01 or of the respective material web. Two layers 16 of a two-layer structured band-shaped film 06; 17 are preferably separated from one another at the transfer station 11 or immediately after the transfer station, wherein the second layer 17 is wound onto a further reel 14, for example, again.

In a third method step, the integrated circuits 04 applied or arranged in the respective openings 03 are fixed there. This fixing takes place, for example, using a printing method, in particular using an inkjet printing method or a screen printing method, and/or by rolling or hot-pressing a cover film onto the respective substrate 18 of the bank note 02. Fig. 5 shows that a non-conductive printing fluid 21, for example ink or lacquer, is applied to the integrated circuits 04 arranged in one of the perforations 03 by means of the inkjet printing device 19, wherein the integrated circuits 04 are fixed in the respective perforation 03 by drying and/or hardening of the printing fluid 21. Fig. 6 shows an example in which a non-conductive printing fluid 21 is applied by means of a screen printing device 22 to the integrated circuits 04 arranged in one of the perforations 03 and is applied into said perforations 03, wherein the integrated circuits 04 are also fixed in the respective perforations 03 by drying and/or hardening of the printing fluid 21. As an alternative or in addition to the application of the printing fluid 21, the fixing of the integrated circuit 04 arranged in the perforation 03 can be achieved by applying an electrically non-conductive cover film 23 to the respective banknote 02, in particular by the stitching device 27, optionally additionally stitching under the effect of heat, as is schematically and very simply shown in fig. 7.

After the integrated circuits 04 have been applied or arranged and fixed in the corresponding perforations 03 of the banknotes 02, a plurality of printed sheets 01 or material webs, each having a copy of the banknote 02 to be produced in the production of the printed sheets, are typically printed in at least one printing press or using at least one printing method, and are subsequently separated from their composite and thereby separated by a punching device or by a cutting device, for example a flat cutter.

In the production of the bank note 02, at least two, preferably all, of the above-described method steps can be carried out online, that is to say preferably in the same production machine, in particular in a rotary printing press for valuable printing: a first method step of arranging the integrated circuit 04 on the web-shaped film 06 in a positionally correct or registered manner, and/or a second method step of applying or arranging the integrated circuit 04 in the perforation 03 of the banknote 02, and/or a third method step of fixing the integrated circuit 04 arranged in the perforation 03, and/or printing a printed sheet of paper 01 comprising the banknote 02 or printing a material web comprising the banknote 02 and/or separating a copy of the banknote 02 produced in the production of the printed sheet.

List of reference numerals

01 printing single paper

02 banknote

03 perforation

04 Integrated Circuit

05 -

06 film

07 material roller

08 reel

09 cutting device

10 -

11 transfer site

12 integrated circuit coating device

13 roller

14 reel

15 -

16 layers (first)

17 layer (second)

18 base material

19 ink jet printer

20 -

21 printing fluid

22 Screen printing apparatus

23 cover film

24 Stack (first)

25 -

26 Stacking (second)

27 rolling device

28 blanking equipment

a distance

l01 Length

l04 edge length

R line

S column

T direction of conveyance

x; y coordinate