阅读说明：本技术 高频探测组件 (High frequency detection assembly ) 是由 夏晨 马向阳 陈欢 于 2021-08-16 设计创作，主要内容包括：本发明公开了一种高频探测组件,其包括低频探针和高频探针,电路板电性连接低频探针和线缆连接件；探针部件还包括金属套筒、第一绝缘子和第二绝缘子,第一绝缘子和第二绝缘子均设置于金属套筒内部,第一绝缘子相对第二绝缘子更靠近顶壁部,高频探针自与线缆连接件连接的部分依次穿过第二绝缘子、第一绝缘子和顶壁部。本申请通过套筒设计将高频探针包围,能够将特定的高频探针的信号屏蔽,能够保证高频检测性能的同时,由于低频探针并未这样设置,从而兼具高频测试性能和成本更低的优点。(The invention discloses a high-frequency detection assembly, which comprises a low-frequency probe and a high-frequency probe, wherein a circuit board is electrically connected with the low-frequency probe and a cable connecting piece; the probe component further comprises a metal sleeve, a first insulator and a second insulator, the first insulator and the second insulator are both arranged inside the metal sleeve, the first insulator is closer to the top wall portion relative to the second insulator, and the high-frequency probe sequentially penetrates through the second insulator, the first insulator and the top wall portion from the portion connected with the cable connecting piece. This application surrounds the high frequency probe through the sleeve design, can shield the signal of specific high frequency probe, when can guaranteeing high frequency detection performance, because the low frequency probe does not set up like this to have high frequency test performance and advantage that the cost is lower concurrently.)

1. A high frequency probe assembly for testing terminals of a board-to-board connector, comprising: the high-frequency detection assembly comprises a plug, a flange, a coil spring, a cable connecting piece and a bolt, the plug is positioned in front of the flange, the cable connecting piece is physically connected with the plug and electrically connected with the plug, the bolt is connected with the flange and the plug, and the coil spring is arranged between the flange and the plug;

the plug comprises a first shell, a second shell, a carrier, a circuit board and a probe component, wherein the first shell and the second shell are matched with each other to form an accommodating cavity, the carrier and the circuit board are positioned in the accommodating cavity, the probe component comprises a low-frequency probe and a high-frequency probe, the circuit board is electrically connected with the low-frequency probe and a cable connecting piece, the first shell comprises a top wall part, the first shell is provided with a low-frequency pinhole and a high-frequency pinhole, the low-frequency pinhole and the high-frequency pinhole penetrate through the top wall part, the low-frequency probe part is positioned in the low-frequency pinhole, and the high-frequency pinhole part is positioned in the high-frequency pinhole;

the probe component further comprises a metal sleeve, a first insulator and a second insulator, the metal sleeve is located in the high-frequency pin hole, the first insulator and the second insulator are both arranged inside the metal sleeve, the first insulator is closer to the top wall portion relative to the second insulator, and the high-frequency probe sequentially penetrates through the second insulator, the first insulator and the top wall portion from the portion connected with the cable connecting piece;

and no other objects are arranged between the low-frequency probe and the first shell.

2. The high frequency detection assembly of claim 1, wherein: the first shell comprises a first base and a first boss, the first boss extends forwards from the first base, the width of the first boss is smaller than that of the first base, and the thickness of the first boss is the same as that of the first base;

the first base has a first cavity, the first boss has a second cavity, and the width of the first cavity is greater than the width of the second cavity.

3. The high frequency detection assembly of claim 2, wherein: the first casing is equipped with the screw hole in the horizontal both sides of first cavity, the high frequency detection subassembly includes the screw, the screw passes the screw hole and is used for fixing the circuit board to first casing.

4. The high frequency detection assembly of claim 3, wherein: one side of the first boss, which is far away from the first base part, is provided with a sunken sinking platform groove, the circuit board is arranged in the sinking platform groove, and the top surface of the circuit board is flush with the top surface of the first boss;

the first boss is also provided with four first fixing holes which are formed by sinking downwards from the bottom wall of the sinking platform groove, and the four fixing holes are positioned at four opposite corners of the sinking platform groove;

four corners of the circuit board are respectively provided with a second fixing hole, and four corners of the second shell are respectively provided with a third fixing hole;

the high-frequency detection assembly further comprises a fixing piece, wherein the fixing piece sequentially penetrates through the third fixing hole, the second fixing hole and the first fixing hole, fixes the circuit board in the sink table groove and is fixed between the first boss and the second shell.

5. The high frequency detection assembly of claim 4, wherein: the second housing includes a second base and a second boss extending forwardly from the second base, the second boss having a width less than a width of the second base;

the thickness of the second boss is smaller than that of the second base, the height of the second boss is larger than that of the second base, and the second boss is located in the center of the second base;

the second boss comprises the top wall part, the second shell is provided with a third cavity, the third cavity penetrates through the second base part and the part of the second boss, the third cavity does not penetrate through the top wall part, and the low-frequency pin hole and the high-frequency pin hole of the top wall part are communicated with the third cavity;

the carrier is housed within the third cavity.

6. The high frequency detection assembly of claim 5, wherein: the low-frequency pinhole comprises a first hole and a second hole, the first hole penetrates through the top wall part, the second hole is communicated with the first hole and the third cavity, and the diameter of the second hole is larger than that of the first hole;

the carrier having a third aperture and a fourth aperture, the third aperture having a diameter greater than a diameter of the fourth aperture, the third aperture being located between the fourth aperture and the second aperture;

the low-frequency probe comprises a first needle head part, a second needle head part and a first needle body part, wherein the first needle head part is positioned in the first hole, and the first needle head part is positioned outside the first shell; said first needle body portion being located in said second aperture, said first needle body portion being located in said third aperture, said second needle head portion being located in said fourth aperture;

the diameter of the first needle head part is equal to the aperture of the first hole, and the aperture of the second needle head part is equal to the aperture of the fourth hole.

7. The high frequency detection assembly of claim 6, wherein: the high-frequency pinhole comprises a fifth hole and a sixth hole, the fifth hole penetrates through the top wall part, the sixth hole is communicated with the fifth hole and the third cavity, and the diameter of the sixth hole is smaller than that of the fifth hole;

the carrier has a seventh hole having a diameter greater than a diameter of the third hole.

8. The high frequency probe assembly of claim 7, wherein: the metal sleeve comprises a first sleeve part and a second sleeve part, the diameter of the first sleeve part is larger than that of the second sleeve part, the first sleeve part is located in the fifth hole, the first sleeve part is provided with a first sleeve hole, the first insulator is located in the first sleeve hole, and the outer diameter of the first insulator is equal to the inner diameter of the fifth hole.

9. The high frequency detection assembly of claim 8, wherein: the high-frequency probe comprises a third needle head part, a fourth needle head part and a second needle body part, wherein the first insulator is provided with a first insulation hole, the third needle head part is partially positioned in the first insulation hole and the second sleeve part, and part of the third needle head part is positioned outside the first shell.

10. The high frequency detection assembly of claim 9, wherein: the second insulator is provided with a second insulating hole, the fourth needle head part is positioned in the second insulating hole, the diameter of the third needle head part is equal to that of the first insulating hole, and the diameter of the fourth needle head part is equal to that of the second insulating hole.

Technical Field

The invention relates to the field of electronic element testing, in particular to a high-frequency detection assembly.

Background

The probe of the prior art probing assembly is not shielded from electrons outside, and thus cannot meet the testing requirements of the high frequency signal terminal, and therefore, there is a need for improvement over the prior art.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the high-frequency detection assembly meets high-frequency testing and is low in cost.

In order to solve the technical problems, the technical scheme of the invention is as follows:

a high-frequency detection assembly is used for testing terminals of a board-to-board connector and comprises a plug, a flange, a coil spring, a cable connecting piece and a bolt, wherein the plug is positioned in front of the flange;

the plug comprises a first shell, a second shell, a carrier, a circuit board and a probe component, wherein the first shell and the second shell are matched with each other to form an accommodating cavity, the carrier and the circuit board are positioned in the accommodating cavity, the probe component comprises a low-frequency probe and a high-frequency probe, the circuit board is electrically connected with the low-frequency probe and a cable connecting piece, the first shell comprises a top wall part, the first shell is provided with a low-frequency pinhole and a high-frequency pinhole, the low-frequency pinhole and the high-frequency pinhole penetrate through the top wall part, the low-frequency probe part is positioned in the low-frequency pinhole, and the high-frequency pinhole part is positioned in the high-frequency pinhole;

the high-frequency probe further comprises a metal sleeve, a first insulator and a second insulator, wherein the first insulator and the second insulator are arranged inside the metal sleeve, the first insulator is closer to the top wall part relative to the second insulator, and the high-frequency probe sequentially penetrates through the second insulator, the first insulator and the top wall part from the part connected with the cable connecting piece;

and no other objects are arranged between the low-frequency probe and the first shell.

Compared with the prior art, this application realizes the electric connection between cable connecting piece and the low frequency probe through the circuit board, and relative sleeve design structure is simpler, and the equipment flow is still less, and manufacturing cost is lower relatively. This application surrounds the high frequency probe through the sleeve design, can shield the signal of specific high frequency probe, when can guaranteeing high frequency detection performance, because the low frequency probe does not set up like this to have high frequency test performance and advantage that the cost is lower concurrently.

Further, the first shell comprises a first base and a first boss, the first boss extends forwards from the first base, the width of the first boss is smaller than that of the first base, and the thickness of the first boss is the same as that of the first base;

the first base has a first cavity, the first boss has a second cavity, and the width of the first cavity is greater than the width of the second cavity.

Further, the first housing is provided with screw holes at both lateral sides of the first cavity, and the high frequency detection assembly includes screws passing through the screw holes for fixing the circuit board to the first housing.

Furthermore, a sunken sinking platform groove is formed in one side, away from the first base, of the first boss, the circuit board is installed in the sinking platform groove, and the top surface of the circuit board is flush with the top surface of the first boss;

the first boss is also provided with four first fixing holes which are formed by sinking downwards from the bottom wall of the sinking platform groove, and the four fixing holes are positioned at four opposite corners of the sinking platform groove;

four corners of the circuit board are respectively provided with a second fixing hole, and four corners of the second shell are respectively provided with a third fixing hole;

the high-frequency detection assembly further comprises a fixing piece, wherein the fixing piece sequentially penetrates through the third fixing hole, the second fixing hole and the first fixing hole, fixes the circuit board in the sink table groove and is fixed between the first boss and the second shell.

Further, the second housing includes a second base and a second boss extending forwardly from the second base, the second boss having a width less than a width of the second base;

the thickness of the second boss is smaller than that of the second base, the height of the second boss is larger than that of the second base, and the second boss is located in the center of the second base;

the second boss comprises the top wall part, the top wall part is provided with a needle hole, the second shell is provided with a third cavity, the third cavity penetrates through the second base part and the part of the second boss, the third cavity does not penetrate through the top wall part, and the needle hole of the top wall part is communicated with the third cavity;

the carrier is housed within the third cavity.

Further, the low-frequency pinhole comprises a first hole and a second hole, the first hole penetrates through the top wall part, the second hole is communicated with the first hole and the third cavity, and the diameter of the second hole is larger than that of the first hole;

the carrier having a third aperture and a fourth aperture, the third aperture having a diameter greater than a diameter of the fourth aperture, the third aperture being located between the fourth aperture and the second aperture;

the low-frequency probe comprises a first needle head part, a second needle head part and a first needle body part, wherein the first needle head part is positioned in the first hole, and the first needle head part is positioned outside the first shell; said first needle body portion being located in said second aperture, said first needle body portion being located in said third aperture, said second needle head portion being located in said fourth aperture;

the diameter of the first needle head part is equal to the aperture of the first hole, and the aperture of the second needle head part is equal to the aperture of the fourth hole.

Further, the high-frequency pinhole comprises a fifth hole and a sixth hole, the fifth hole penetrates through the top wall part, the sixth hole is communicated with the fifth hole and the third cavity, and the diameter of the sixth hole is smaller than that of the fifth hole;

the carrier has a seventh hole having a diameter greater than a diameter of the third hole.

Further, the metal sleeve includes a first sleeve portion and a second sleeve portion, the diameter of the first sleeve portion is larger than that of the second sleeve portion, the first sleeve portion is located in the fifth hole, the first sleeve portion has a first sleeve hole, the first insulator is located in the first sleeve hole, and the outer diameter of the first insulator is equal to the inner diameter of the fifth hole.

Further, the high-frequency probe comprises a third needle head part, a fourth needle head part and a second needle body part, the first insulator is provided with a first insulation hole, the third needle head part is partially positioned in the first insulation hole and the second sleeve part, and part of the third needle head part is positioned outside the first shell.

Furthermore, the second insulator is provided with a second insulating hole, the fourth needle head part is positioned in the second insulating hole, the diameter of the third needle head part is equal to that of the first insulating hole, and the diameter of the fourth needle head part is equal to that of the second insulating hole.

Drawings

FIG. 1 is a perspective view of a high frequency detection assembly according to an embodiment of the present invention.

FIG. 2 is a perspective view of another high frequency detection assembly according to an embodiment of the present invention.

Figure 3 is an exploded view of a portion of a high frequency detection assembly in accordance with one embodiment of the present invention.

FIG. 4 is a partial exploded view of another perspective view of a high frequency detection assembly in accordance with an embodiment of the present invention.

Figure 5 is a further exploded view of a high frequency detection assembly in accordance with one embodiment of the present invention.

FIG. 6 is a further exploded view from another perspective of a high frequency detection assembly in accordance with an embodiment of the present invention.

FIG. 7 is a perspective view of a carrier and probe in accordance with one embodiment of the present invention.

FIG. 8 is a partial cross-sectional view of a high frequency detection assembly in accordance with an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the terms "first," "second," and the like as used in the description and in the claims do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Similarly, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one; "plurality" means two or more than two. Unless otherwise indicated, "front", "rear", "lower" and/or "upper" and the like are for convenience of description and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items.

Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments can be supplemented or combined with each other without conflict.

Referring to fig. 1-8, an embodiment of a high frequency detection assembly 100 consistent with the present application is shown. The high frequency probe assembly 100 is used to test the high frequency performance of the terminals of a board-to-board connector (BTB).

The high frequency probe assembly 100 includes a plug 10, a flange 21, a coil spring 31, a cable connection 41, and a bolt 51. The plug 10 is located in front of the flange 21, the cable connector 41 is physically and electrically connected with the plug 10, the bolt 51 connects the flange 21 and the plug 10, the coil spring 31 is disposed between the flange 10 and the plug 10, and the coil spring 31 is used so that the plug 10 can be matched with the board-to-board connector in a floating manner. The coil spring 31 is sleeved outside the bolt 51, that is, the coil spring 31 is wound around the bolt 51. The flange 21 has a flange hole 211, and the flange hole 211 is used for the cable connection 41 to pass through.

In the illustrated embodiment, the design of four bolts 51 in cooperation with four coil springs 31 can enhance the floating of the high frequency probe assembly 100 and the board-to-board connector during testing, which is more controllable and thus more stable.

As shown in fig. 3 to 8, the plug 10 includes a first housing 11, a second housing 12, a carrier 13, a circuit board 14, and a probe member 15. The first housing 11 includes a first base 111 and a first boss 112, the first boss 112 extends forward from the first base 111, and a width of the first boss 112 is smaller than a width of the first base 111, and a thickness of the first boss 112 is the same as a thickness of the first base 111.

The first base 111 has a first cavity 113, the first boss 112 has a second cavity 114, and the width of the first cavity 113 is greater than the width of the second cavity 114. The first cavity 113 is substantially cross-shaped to facilitate insertion and installation of the cable connector 41 and the screw 61. The first housing 11 is provided with screw holes 119 at both lateral sides of the first cavity 113, and the high frequency detecting assembly 100 includes screws 61, wherein the screws 61 pass through the screw holes 119 for fixing the circuit board 14 to the first housing 11.

The first base portion 111 is substantially rectangular parallelepiped, four corners 115 of the first base portion 111 are chamfered, and the first base portion 111 is provided with a first screw hole 116 near each of the four corners 115. The side of the first boss 112 away from the first base 111 is provided with a sunken platform groove 117 recessed downwards, the circuit board 14 is mounted in the sunken platform groove 117, and the top surface of the circuit board 14 is arranged approximately flush with the top surface of the first boss 112. The first boss 112 further has four first fixing holes 118 formed by being depressed downward from the bottom wall of the platform settling groove 117, and the four fixing holes 118 are located at four opposite corners of the platform settling groove 117. The circuit board 14 is provided with a second fixing hole 141 at each of four corners thereof, and the second housing 12 is provided with a third fixing hole 121 at each of four corners thereof. The circuit board can be fixed in the counter sink groove 117 and between the first boss 112 and the second housing 12 by a fixing member such as a bolt or a screw (not shown) passing through the third fixing hole 121, the second fixing hole 141, and the first fixing hole 118 in this order.

The second housing 12 includes a second base 122 and a second boss 123, the second boss 123 extending forward from the second base 122, and a width of the second boss 123 being smaller than a width of the second base 122. The thickness of the second bosses 123 is smaller than that of the second base 122, and the height of the second bosses 123 is greater than that of the second base 122. The second boss 123 is located approximately at the center of the second base 122. The second boss 123 includes a top wall portion 124, the top wall portion 124 has a pin hole 125, the second housing 12 has a third cavity 126, the third cavity 126 penetrates through the second base portion 122 and a portion of the second boss 123, the third cavity 126 does not penetrate through the top wall portion 124, and the pin hole 125 of the top wall portion 124 penetrates through the third cavity 126. The third cavity 126 is cross-shaped to facilitate insertion of the probe member 15.

The first boss 112 has a second cavity 114, and the width of the first cavity 113 is greater than the width of the second cavity 114. The first cavity 113 is generally cross-shaped to facilitate insertion and installation of the cable connector 41. The carrier 13 is housed in the third cavity 126, and the probe elements 15 are arranged in at least two rows, at least one of which comprises a low frequency probe 151 and a high frequency probe 152.

The first housing 11 is made of plastic, the pin hole 125 includes a low frequency pin hole 127 and a high frequency pin hole 128, the low frequency pin hole 127 includes a first hole 1271 and a second hole 1272, the first hole 1271 penetrates the top wall portion 124, the second hole 1272 communicates the first hole 1271 and the third cavity 126, and the diameter of the second hole 1272 is larger than that of the first hole 1271. The carrier 13 has a third aperture 131 and a fourth aperture 132, the third aperture 131 having a larger diameter than the fourth aperture 132, the third aperture 131 being located between the fourth aperture 132 and the second aperture 1272.

Low frequency probe 151 includes a first needle portion 1511, a second needle tip portion 1512, and a first needle portion 1513. The first needle portion 1511 is located partially within the first aperture 1271 and partially outside the first housing 11. The first needle portion 1513 is partially disposed within the second aperture 1272, the first needle portion 1513 is partially disposed within the third aperture 131, and the second needle portion 1512 is disposed within the fourth aperture 132.

The diameter of the first needle head portion 1511 is equal to the aperture of the first hole 1271, the diameter of the second needle head portion 1512 is equal to the aperture of the fourth hole 132, and the diameter of the first needle body portion 1513 is equal to the diameters of the second hole 1272 and the third hole 131, so that the stability of the low-frequency probe 15 is improved, additional fixing parts are not needed, and the structure is simple.

The high-frequency pinhole 128 includes a fifth hole 1281 and a sixth hole 1282, the fifth hole 1281 penetrates the top wall portion 124, the sixth hole 1282 communicates the fifth hole 1281 with the third cavity 126, and the diameter of the sixth hole 1282 is smaller than the diameter of the fifth hole 1281. The carrier 13 has a seventh hole 133, the diameter of the seventh hole 133 being larger than the diameter of the third hole 131. The probe part 15 further includes a metal sleeve 153 covering the high-frequency probe 151, and the metal sleeve 153 plays a role of shielding.

The metal sleeve 153 includes a first sleeve portion 1531 and a second sleeve portion 1532, the first sleeve portion 1531 having a diameter greater than a diameter of the second sleeve portion 1532 to facilitate positioning into the first housing 11. The first sleeve portion 1531 is located in the fifth hole 1281, the probe member 15 further includes a first insulator 154 and a second insulator 155, the first sleeve portion 1531 has a first sleeve hole 1533, the first insulator 154 is located in the first sleeve hole 1533, and an outer diameter of the first insulator 154 is equal to an inner diameter of the fifth hole 1281, so that a fixing device is omitted, the structure is simple, and high-frequency signal transmission is facilitated. The second insulator 155 is located within the second sleeve 1532.

High frequency probe 152 includes a third needle portion 1521, a fourth needle portion 1522, and a second needle portion 1523. The first insulator 154 has a first insulation hole 1541, the third needle portion 1521 is partially located in the first insulation hole 1541 and the second sleeve portion 153, and a portion of the third needle portion 1521 is located outside the first housing 11. The second insulator 155 has a second insulating hole 1551 and the fourth tip segment 1522 is located in the second insulating hole 1551. The diameter of the third needle head portion 1521 is equal to the aperture of the first insulation hole 1541, and the diameter of the fourth needle head portion 1522 is equal to the aperture of the second insulation hole 1551, so that the stability of the probe is improved, additional fixing parts are not needed, and the structure is simple.

The metal sleeve 15 plays an electromagnetic shielding role for the high-frequency signal transmitted in the high-frequency probe 152, so that the external influence on the signal transmission of the high-frequency probe 152 is reduced, and the high-frequency probe can be adapted to a higher-frequency signal test, such as a 60Ghz high-frequency signal test. The diameter of the first bore 1533 is larger than the diameter of the third pin portion 1521 of the high frequency probe 152, avoiding contact of the high frequency probe 152 with the metal sleeve 153. Second sleeve portion 1532 has a second bore 1534, second pin portion 1523 is positioned within second bore 1534, and second bore 1534 has a diameter greater than second pin portion 1523 of high frequency probe 152, thereby preventing contact between high frequency probe 152 and metal sleeve 153.

The first insulator 154 and the second insulator 155 are arranged to insulate and isolate the contact between the high-frequency probe 152 and the metal sleeve 153, so that the high-frequency probe 152 is limited by the first insulator 154 and the second insulator 155 and insulates and isolates the metal sleeve 153, and the metal sleeve 153 can play a role of shielding the high-frequency probe 152.

The low frequency probe 152 is inserted into the conductive through hole 143 of the circuit board 14, the low frequency probe 152 is physically and electrically connected with the conductive through hole of the circuit board 14, and the metal sleeve 153 penetrates through the circuit board 14. The cable connector 41 has a plug 42 and a cable 43, wherein the plug 42 is used for plugging to an external testing device, and the cable 43 has a conductive core 431 inside, and the conductive core 431 is electrically and physically connected with the high-frequency probe 152 respectively. The low frequency probe 152 is electrically and physically connected to the circuit board 14, and the conductive core 431 is electrically and physically connected to the circuit board 14, so that the conductive low frequency probe 151 is electrically connected to the conductive core 431 of the corresponding cable 43 through the circuit board 14.

Compared with the prior art, the electric connection between the cable 43 and the low-frequency probe 51 is realized through the circuit board 14, the design structure of the sleeve is simpler, the assembly process is less, and the manufacturing cost is relatively lower. This application surrounds high frequency probe 152 through the sleeve design, can shield specific high frequency probe 152's signal, when can guaranteeing high frequency detection performance, because low frequency probe 151 sets up like this to have high frequency test performance concurrently and advantage that the cost is lower.

The present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.