阅读说明：本技术 微针电极及其制备方法 (Microneedle electrode and method for producing same ) 是由 李志宏 史晓艺 李君实 黄东 于 2021-09-10 设计创作，主要内容包括：本发明涉及微电子机械系统和微弱信号测量技术领域,尤其涉及一种微针电极及其制备方法。其中,微针电极包括：微针、夹持柄和输出端口；微针的数量为多个；各微针内沿夹持柄的一侧边均匀分布；各微针的朝向一致；输出端口设置在夹持柄的另一侧边；微针上设置有至少两个电极区；其中同一微针上的各个电极区距微针的针尖的距离不同；电极区为记录电极点或刺激电极点；输出端口设置有与电极区一一对应的输出接点；电极区通过金属引线连接对应的输出接点；微针、持柄和输出端口共用同一块基板；基板为表面涂覆有绝缘层的金属衬底。如此微针电极可以同时采集记录脑中不同深度的信号数据。同时,采用金属衬底,使得基板不易断裂。(The invention relates to the technical field of micro-electromechanical systems and weak signal measurement, in particular to a microneedle electrode and a preparation method thereof. Wherein the microneedle electrode comprises: a microneedle, a grip handle, and an output port; the number of microneedles is plural; the inner edges of the microneedles are uniformly distributed along one side edge of the clamping handle; the microneedles are oriented uniformly; the output port is arranged at the other side edge of the clamping handle; at least two electrode areas are arranged on the microneedle; wherein, the distances from the electrode areas on the same microneedle to the needlepoint of the microneedle are different; the electrode area is a recording electrode point or a stimulating electrode point; the output port is provided with output contacts which correspond to the electrode regions one by one; the electrode area is connected with a corresponding output contact through a metal lead; the micro-needle, the handle and the output port share the same substrate; the base plate is a metal substrate coated with an insulating layer on the surface. Therefore, the micro-needle electrodes can simultaneously acquire and record signal data at different depths in the brain. Meanwhile, the metal substrate is adopted, so that the base plate is not easy to break.)

1. A microneedle electrode, comprising: a microneedle, a grip handle, and an output port;

the number of the microneedles is plural; the microneedle is uniformly distributed along one side edge of the clamping handle; the microneedles are uniformly oriented;

the output port is arranged on the other side of the clamping handle;

at least two electrode areas are arranged on the micro-needle; wherein the distances from the electrode areas on the same microneedle to the needle tip of the microneedle are different; the electrode area is a recording electrode point or a stimulating electrode point;

the output port is provided with output contacts which correspond to the electrode regions one to one; the electrode area is connected with a corresponding output contact through a metal lead;

the microneedle, the handle and the output port share the same substrate; the substrate is a metal substrate with an insulating layer coated on the surface; wherein the metal substrate is in a shape of a microneedle electrode obtained through graphical processing; the insulating layer of the metal substrate and the top insulating layer covering the metal lead are manufactured by deposition, glue spraying process or pulling method; the electrode area and the output contact are exposed by destroying the preset position of the top insulating layer by photoetching or photoetching and reactive ion etching methods.

2. A microneedle electrode according to claim 1, wherein the electrode zone is a recording electrode point or a stimulating electrode point; the length of the stimulating electrode point is 150-300 micrometers, and the width of the stimulating electrode point is 10-25 micrometers; the recording electrode point is 10-25 microns long and 10-25 microns wide.

3. The microneedle electrode according to claim 1, wherein the microneedle has a length of 2 to 5 mm and a width of 100 to 200 μm.

4. A microneedle electrode according to any one of claims 1 to 3, further comprising: an external lead;

the external lead is used for connecting the output port and an external circuit.

5. A microneedle electrode preparation method for preparing the microneedle electrode according to any one of claims 1 to 4, comprising the steps of:

obtaining a substrate in the shape of a microneedle electrode by graphically processing a preset material; wherein the shape of the microneedle electrode is the shape of a microneedle electrode comprising a microneedle, a clamping handle and an output port; the substrate is a metal substrate with the surface coated with an insulating layer;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through the photoresist spraying process or a pulling method;

and exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

6. A method for preparing a microneedle electrode according to claim 5, wherein the step of obtaining a substrate in the shape of the microneedle electrode by patterning a predetermined material comprises:

s101, processing the shape of the microneedle electrode on the metal substrate by using deep etching, corrosion or laser cutting processes;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through a photoresist spraying process or a pulling method, wherein the photoresist spraying process comprises the following steps:

s102, manufacturing a first insulating layer on the first side surface of the metal substrate and manufacturing a back insulating layer on the second side surface of the metal substrate through a deposition, glue spraying process or pulling method;

s103, depositing photoresist on the first side face of the metal substrate through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

and S104, manufacturing a top insulating layer on the first side surface of the metal substrate by a glue spraying process or a pulling method.

7. A method for preparing a microneedle electrode according to claim 5, wherein the step of obtaining a substrate in the shape of the microneedle electrode by patterning a predetermined material comprises:

s201, processing the shape of the microneedle electrode on the metal substrate by using a deep etching corrosion or laser cutting process;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through a photoresist spraying process or a pulling method, wherein the photoresist spraying process comprises the following steps:

s202, manufacturing a first insulating layer on the first side face of the metal substrate through a deposition or glue spraying process;

s203, depositing photoresist on the first insulating layer through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

s204, manufacturing a top insulating layer on the first insulating layer with the metal leads through a deposition process or a glue spraying process;

exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with a microneedle, a clamping handle and an output port, comprising:

s205, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

s206, removing the second side face of the metal substrate, and manufacturing a back insulating layer through a deposition process or a glue spraying process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

8. A method for preparing a microneedle electrode according to claim 5, wherein the step of obtaining a substrate in the shape of the microneedle electrode by patterning a predetermined material comprises:

s301, processing the shape of the microneedle electrode on the metal substrate by deep etching, corrosion or laser cutting processes and the like;

deposit the photoresist through spouting gluey technology, carry out photoetching, deposit preparation metal lead wire, and through spouting gluey technology or czochralski method preparation cover the top insulating layer of metal lead wire includes:

s302, manufacturing a first insulating layer on the first side surface of the metal substrate through a deposition or glue spraying process;

s303, depositing photoresist on the first insulating layer through a photoresist spraying process, and photoetching and depositing to manufacture a metal lead;

s304, manufacturing a top insulating layer on the first side surface of the metal substrate and manufacturing a back insulating layer on the second side surface of the metal substrate through a deposition process, a glue spraying process or a pulling method.

9. A microneedle electrode preparation method for preparing the microneedle electrode according to any one of claims 1 to 4, comprising the steps of:

attaching and fixing a first side surface of a preset substrate material on a silicon wafer; the preset substrate material is a preset metal plate;

based on the shape of the micro-needle electrode, manufacturing a metal lead and a top end insulating layer covering the metal lead on the second side face of a preset substrate material, and exposing an output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

the preset substrate material is patterned by laser processing, photoetching, deep etching or wet etching, and finally the shape of the microneedle electrode is manufactured, so that the microneedle electrode with the microneedle, the clamping handle and the output port is obtained.

10. A method for preparing a microneedle electrode according to claim 9, wherein the attaching and fixing of the first side of the predetermined substrate material to the silicon wafer comprises:

s401, attaching and fixing the first side face of the substrate on a silicon wafer;

based on the shape of the micro-needle electrode, manufacturing a metal lead and a top end insulating layer covering the metal lead on a second side surface of a preset substrate material, and exposing an output contact and at least two electrode areas by a direct photoetching or photoetching and reactive ion etching method, wherein the method comprises the following steps:

s402, manufacturing a first insulating layer on the second side face of the metal sheet through direct spin coating, deposition, glue spraying process or pulling method;

s403, manufacturing the first insulating layer into a microneedle electrode shape by direct photoetching or photoetching and reactive ion etching methods;

s404, manufacturing a metal lead on the first insulating layer through photoetching and deposition;

s405, manufacturing a top insulating layer on the second side face of the metal sheet through direct spin coating, a deposition process, a glue spraying process or a pulling method;

s406, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods, and manufacturing a microneedle electrode shape on the top insulating layer; wherein the microneedle electrode-shaped top insulating layer covers the microneedle electrode-shaped first insulating layer;

the method for patterning the preset substrate material by the laser processing, photoetching, deep etching or wet etching method to finally manufacture the shape of the microneedle electrode to obtain the microneedle electrode with the microneedle, the clamping handle and the output port comprises the following steps:

s407, patterning the metal sheet by using a laser processing, photoetching, deep etching or wet etching method to finally manufacture the shape of the microneedle electrode to obtain a metal substrate; wherein the first insulating layer in the shape of the microneedle electrode covers the metal sheet in the shape of the microneedle electrode;

s408, taking down the metal substrate from the silicon wafer, and manufacturing a back insulating layer on the first side face of the metal substrate through a glue spraying process or a deposition process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Technical Field

The invention relates to the technical field of micro-electromechanical systems and weak signal measurement, in particular to a microneedle electrode and a preparation method thereof.

Background

The research of the implanted nerve micro-needle electrode has important significance for the development of a plurality of technologies such as brain-computer interface technology, nerve rehabilitation, disease diagnosis and treatment and the like. Since much attention is paid to the development of the research direction in many countries in the world, in recent years, many top scientific researches and application results have been obtained.

Existing neural electrodes can be divided into microwire electrodes, utah electrodes, and michigan electrodes. Among them, the microwire electrode needs rigid probe to assist the implantation, also is difficult to record the neural signal of different degree of depth. The utah electrodes are array electrodes and can record nerve signals of the same horizontal plane, but can not record nerve signals of different depths. The michigan type electrode has small sectional area, is more suitable for deep brain implantation, and can record nerve signals of different depths, but the silicon-based michigan nerve electrode is easy to break in the operation process, which can cause serious brain injury. The existing microneedle electrode has the problems of less recorded signal data, single recorded signal data depth and easy breakage.

Disclosure of Invention

The embodiment of the invention provides a microneedle electrode and a preparation method thereof, which are used for solving the problems of less recorded data, single recorded signal data depth and easiness in fracture of the existing microneedle electrode.

In a first aspect, embodiments of the present invention provide a microneedle electrode, including: a microneedle, a grip handle, and an output port;

the number of the microneedles is plural; the microneedle is uniformly distributed along one side edge of the clamping handle; the microneedles are uniformly oriented;

the output port is arranged on the other side of the clamping handle;

at least two electrode areas are arranged on the micro-needle; wherein the distances from the electrode areas on the same microneedle to the needle tip of the microneedle are different; the electrode area is a recording electrode point or a stimulating electrode point;

the output port is provided with output contacts which correspond to the electrode regions one to one; the electrode area is connected with a corresponding output contact through a metal lead;

the microneedle, the handle and the output port share the same substrate; the substrate is a metal substrate with an insulating layer coated on the surface; wherein the metal substrate is in a shape of a microneedle electrode obtained through graphical processing; the insulating layer of the metal substrate and the top insulating layer covering the metal lead are manufactured by deposition, glue spraying process or pulling method; the electrode area and the output contact are exposed by destroying the preset position of the top insulating layer by photoetching or photoetching and reactive ion etching methods.

Preferably, the electrode region is a recording electrode point or a stimulating electrode point.

Preferably, the length of the stimulating electrode point is 150-300 micrometers, and the width of the stimulating electrode point is 10-25 micrometers; the recording electrode point is 10-25 microns long and 10-25 microns wide.

Preferably, the length of the microneedle is 2-5 mm, and the width of the microneedle is 100-200 microns.

Preferably, the method further comprises the following steps: an external lead;

the external lead is used for connecting the output port and an external circuit.

In a second aspect, embodiments of the present invention provide a microneedle electrode preparation method for preparing a microneedle electrode according to the first aspect of the present application, the method including:

obtaining a substrate in the shape of a microneedle electrode by graphically processing a preset material; wherein the shape of the microneedle electrode is the shape of a microneedle electrode comprising a microneedle, a clamping handle and an output port; the substrate is a metal substrate with the surface coated with an insulating layer;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through the photoresist spraying process or a pulling method;

and exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Preferably, when the substrate is a metal substrate, the obtaining of the substrate in the shape of the microneedle electrode by patterning a predetermined material includes:

s101, processing the shape of the microneedle electrode on the metal substrate by using deep etching, corrosion or laser cutting processes;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through a photoresist spraying process or a pulling method, wherein the photoresist spraying process comprises the following steps:

s102, manufacturing a first insulating layer on the first side surface of the metal substrate and manufacturing a back insulating layer on the second side surface of the metal substrate through a deposition, glue spraying process or pulling method;

s103, depositing photoresist on the first side face of the metal substrate through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

and S104, manufacturing a top insulating layer on the first side surface of the metal substrate by a glue spraying process or a pulling method.

Preferably, when the substrate is a metal substrate, the obtaining of the substrate in the shape of the microneedle electrode by patterning a predetermined material includes:

s201, processing the shape of the microneedle electrode on the metal substrate by using a deep etching corrosion or laser cutting process;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through a photoresist spraying process or a pulling method, wherein the photoresist spraying process comprises the following steps:

s202, manufacturing a first insulating layer on the first side face of the metal substrate through a deposition or glue spraying process;

s203, depositing photoresist on the first insulating layer through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

s204, manufacturing a top insulating layer on the first insulating layer with the metal leads through a deposition process or a glue spraying process;

exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with a microneedle, a clamping handle and an output port, comprising:

s205, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

s206, removing the second side face of the metal substrate, and manufacturing a back insulating layer through a deposition process or a glue spraying process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Preferably, when the substrate is a metal substrate, the obtaining of the substrate in the shape of the microneedle electrode by patterning a predetermined material includes:

s301, processing the shape of the microneedle electrode on the metal substrate by deep etching, corrosion or laser cutting processes and the like;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through the photoresist spraying process or a pulling method; the method comprises the following steps:

s302, manufacturing a first insulating layer on the first side surface of the metal substrate through a deposition or glue spraying process;

s303, depositing photoresist on the first insulating layer through a photoresist spraying process, and photoetching and depositing to manufacture a metal lead;

s304, manufacturing a top insulating layer on the first side surface of the metal substrate and manufacturing a back insulating layer on the second side surface of the metal substrate through a deposition process, a glue spraying process or a pulling method.

In a third aspect, embodiments of the present invention provide a microneedle electrode preparation method for preparing a microneedle electrode according to the first aspect of the present application, the method including the following steps:

attaching and fixing a first side surface of a preset substrate material on a silicon wafer; the preset substrate material is a preset metal plate;

based on the shape of the micro-needle electrode, manufacturing a metal lead and a top end insulating layer covering the metal lead on the second side face of a preset substrate material, and exposing an output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

the preset substrate material is patterned by laser processing, photoetching, deep etching or wet etching, and finally the shape of the microneedle electrode is manufactured, so that the microneedle electrode with the microneedle, the clamping handle and the output port is obtained.

Preferably, when the substrate is a metal substrate, the attaching and fixing of the first side surface of the preset substrate material on the silicon wafer includes:

s401, attaching and fixing the first side face of the substrate on a silicon wafer;

based on the shape of the micro-needle electrode, manufacturing a metal lead and a top end insulating layer covering the metal lead on a second side surface of a preset substrate material, and exposing an output contact and at least two electrode areas by a direct photoetching or photoetching and reactive ion etching method, wherein the method comprises the following steps:

s402, manufacturing a first insulating layer on the second side face of the metal sheet through direct spin coating, deposition, glue spraying process or pulling method;

s403, manufacturing the first insulating layer into a microneedle electrode shape by direct photoetching or photoetching and reactive ion etching methods;

s404, manufacturing a metal lead on the first insulating layer through photoetching and deposition;

s405, manufacturing a top insulating layer on the second side face of the metal sheet through direct spin coating, a deposition process, a glue spraying process or a pulling method;

s406, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods, and manufacturing a microneedle electrode shape on the top insulating layer; wherein the microneedle electrode-shaped top insulating layer covers the microneedle electrode-shaped first insulating layer;

the method for patterning the preset substrate material by the laser processing, photoetching, deep etching or wet etching method to finally manufacture the shape of the microneedle electrode to obtain the microneedle electrode with the microneedle, the clamping handle and the output port comprises the following steps:

s407, patterning the metal sheet by using a laser processing, photoetching, deep etching or wet etching method to finally manufacture the shape of the microneedle electrode to obtain a metal substrate; wherein the first insulating layer in the shape of the microneedle electrode covers the metal sheet in the shape of the microneedle electrode;

s408, taking down the metal substrate from the silicon wafer, and manufacturing a back insulating layer on the first side face of the metal substrate through a glue spraying process or a deposition process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

According to the microneedle electrode provided by the embodiment of the invention, a plurality of electrode areas are arranged on a microneedle; the distances from the electrode areas on the same microneedle to the needle point of the microneedle are different, and after the microneedle electrode is inserted into the brain, the different electrode areas on the microneedle are located at different depths, so that the microneedle electrode can collect and record signal data of different depths in the brain. Meanwhile, as the micro-needles are provided with the plurality of electrode regions, compared with the prior scheme that one micro-needle is provided with one electrode region, the number of the electrode regions is increased, and the signal data volume acquired when the same number of micro-needles are used for acquisition is increased. In summary, the microneedle electrode provided by the embodiment of the invention can collect and record signal data at different depths, and the data volume of the collected and recorded signal data is larger, thereby solving the problems of less recorded data and single recorded signal depth in the prior art to a certain extent.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a microneedle electrode according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a microneedle electrode provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a microneedle electrode according to another embodiment of the present invention;

fig. 4 is a schematic partial structure view of a microneedle electrode according to another embodiment of the present invention;

fig. 5 is a schematic flow chart of a process for preparing a microneedle electrode according to an embodiment of the present invention;

fig. 6 is a schematic view of a process for preparing a microneedle electrode according to an embodiment of the present invention;

fig. 7 is a schematic flow chart illustrating a process for preparing a microneedle electrode according to another embodiment of the present invention;

fig. 8 is a schematic view illustrating a process of preparing a microneedle electrode according to another embodiment of the present invention;

fig. 9 is a schematic view illustrating a process for preparing a microneedle electrode according to yet another embodiment of the present invention;

fig. 10 is a schematic view illustrating a process of preparing a microneedle electrode according to yet another embodiment of the present invention;

fig. 11 is a schematic view illustrating a process of preparing a microneedle electrode according to yet another embodiment of the present invention;

fig. 12 is a schematic view of a process for preparing a microneedle electrode according to yet another embodiment of the present invention.

Reference numerals:

11: microneedles; 111: recording the electrode points; 112: stimulating electrode points;

12: a clamping handle; 13: an output port; 131: an output contact;

14: a metal lead; 15: a metal substrate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The research of the implanted nerve micro-needle electrode has important significance for the development of a plurality of technologies such as brain-computer interface technology, nerve rehabilitation, disease diagnosis and treatment and the like. Since much attention is paid to the development of the research direction in many countries in the world, in recent years, many top scientific researches and application results have been obtained. Existing neural electrodes can be divided into microwire electrodes, utah electrodes, and michigan electrodes. Among them, the microwire electrode needs rigid probe to assist the implantation, also is difficult to record the neural signal of different degree of depth. The utah electrodes are array electrodes and can record nerve signals of the same horizontal plane, but can not record nerve signals of different depths. The michigan type electrode has small sectional area, is more suitable for deep brain implantation, and can record nerve signals of different depths, but the silicon-based michigan nerve electrode is easy to break in the operation process, which can cause serious brain injury. The existing microneedle electrode has the problems of less recorded signal data, single recorded signal data depth and easy breakage.

In order to solve the above problems, the present application provides a microneedle electrode. Fig. 1 is a schematic structural diagram of a microneedle electrode according to an embodiment of the present invention; as shown in fig. 1, a microneedle electrode according to an embodiment of the present invention includes:

a microneedle 11, a grip handle 12, and an output port 13; the number of the microneedles 11 is plural; the microneedles 11 are uniformly distributed along one side edge of the clamping handle 13; the microneedles 11 are oriented uniformly; the output port 13 is arranged on the other side of the clamping handle 12; at least two electrode areas are arranged on the micro-needle 11; wherein the distances of the respective electrode areas on the same microneedle 11 from the needle tip of the microneedle are different; the electrode area is a recording electrode point 111 or a stimulating electrode point 112; the output port 13 is provided with output contacts 131 corresponding to the electrode regions one by one; the electrode regions are connected with corresponding output contacts through metal leads 14; the microneedle 11, the handle 12 and the output port 13 share the same substrate; the substrate is a metal substrate with an insulating layer coated on the surface. Wherein the metal substrate is in a shape of a microneedle electrode obtained through graphical processing; the insulating layer of the metal substrate and the top insulating layer covering the metal lead are manufactured by deposition, glue spraying process or pulling method; the electrode area and the output contact are exposed by destroying the preset position of the top insulating layer by photoetching or photoetching and reactive ion etching methods.

When the microneedle electrode provided by the embodiment of the invention is arranged to penetrate into the brain, different electrode areas on the microneedle 11 are located at different depths, so that the microneedle electrode can acquire and record signal data of different depths in the brain. Meanwhile, because the micro-needles 11 are provided with a plurality of electrode regions, compared with the prior art in which one micro-needle 11 is provided with one electrode region, the number of the electrode regions is increased, and the signal data volume obtained when the same number of micro-needles 11 are used for acquisition is increased. In summary, the microneedle electrode provided by the embodiment of the invention can collect and record signal data at different depths, and the data volume of the collected and recorded signal data is larger, thereby solving the problems of less recorded data and single recorded signal depth in the prior art to a certain extent. Furthermore, the arrangement of the metal substrate can avoid the breakage of the micro-needle electrode in the operation process to a certain extent, so that the micro-needle electrode is safer. Meanwhile, the microneedle 11, the handle 12 and the output port 13 share the same substrate; and the arrangement position of the micro-needle in the embodiment of the invention ensures that the base plate can be directly cut by a metal plate, thereby being more convenient.

Specifically, the metal substrate 15 material includes, but is not limited to, stainless steel, titanium. The thickness of the insulating layer is 3-10 μm, and the material of the insulating layer may include, but is not limited to, polyimide, parylene, silicon dioxide, epoxy, and ceramic.

It should be noted that, in practical applications, the electrode area may be a recording electrode point 111 or a stimulating electrode point 112. In one microneedle electrode, a plurality of microneedles 11 may be included, and each microneedle 11 may be provided with a plurality of electrode regions, which may be individually set as a recording electrode point 111 or a stimulating electrode point 112 based on actual needs, specifically, in fig. 1, the stimulating electrode point 112 is disposed on two outer microneedles 11. In fig. 2, the stimulating electrode points 112 are provided on the two microneedles 11 on the inner side; further, the layout of the electrode points and their metal leads 14 can be seen in FIG. 4

The length of the stimulating electrode point 112 is 150-300 micrometers, and the width is 10-25 micrometers; the recording electrode point 111 has a length of 10 to 25 micrometers and a width of 10 to 25 micrometers. The length of the microneedle 11 is 2-5 mm, and the width of the microneedle is 100-200 microns. Furthermore, the width of the metal lead 14 is 10-25 μm, and the material includes, but is not limited to, gold and platinum.

In practical application, the microneedle electrode needs to transmit the acquired signal data to an external device for further processing, i.e. the external device needs to be connected with an external circuit through the output port 13.

In order to facilitate electrical connection of the output port 13 to an external circuit, the output port 13 may be configured to match the ZIF interface, so that the external circuit may be electrically connected to the output port 13 through the ZIF interface.

Further, the use of output ports 13 that match the ZIF interface limits the size and shape of the output ports 13, which in turn limits the performance of the microneedle electrodes. In order to avoid pre-setting the limits of the communication interface to the output port 13.

In an embodiment of the present application, the following scheme is proposed: a microneedle electrode, further comprising: an external lead; the external lead is used to connect the output port 13 and an external circuit. With this arrangement, referring to fig. 3, each output contact 131 in the output port 13 can be made more compact, and the volume of the output port 13 can be made smaller.

The application provides a microneedle electrode preparation method for preparing a microneedle electrode according to any embodiment of the application, comprising the following steps:

obtaining a substrate in the shape of a microneedle electrode by graphically processing a preset material;

depositing photoresist through a photoresist spraying process, photoetching and depositing to manufacture a metal lead, and manufacturing a top insulating layer covering the metal lead through the photoresist spraying process or a pulling method;

and exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

In the scheme provided by the embodiment of the invention, the substrate forms the main body of the microneedle electrode. A metal lead, a top insulating layer, an output contact and at least two electrode areas are arranged on a substrate, so that a microneedle electrode consisting of a microneedle, a clamping handle and an output port is obtained. The base plate is provided with an electrode area, the part of the base plate, which is suitable for being inserted into the brain, is a microneedle of a microneedle electrode, and the part of the base plate, which is provided with an output contact and can be connected with an external circuit, is an output port; the part of the substrate, which is connected with the micro-needle and the output node, is a clamping handle. The clamping handle is convenient for clamping and is not provided with a complex function, so that the structure of the clamping handle is simple.

In practice, the base plate may be formed of a metal substrate coated with an insulating layer. Fig. 5 is a schematic view of a process for preparing a microneedle electrode according to an embodiment of the present invention; referring to fig. 5, a method for preparing a microneedle electrode having a substrate formed of a metal substrate coated with an insulating layer according to an embodiment of the present invention includes:

s101, processing the shape of the microneedle electrode on the metal substrate by using deep etching, corrosion or laser cutting processes;

specifically, the shape of the microneedle electrode is first processed on the metal substrate 1 (fig. 6 (a)) by using a deep etching (DRIE), etching or laser cutting process, the etching can be single-sided etching or double-sided etching as required, and the final shape can be, but is not limited to, the shape shown in fig. 6 (b).

S102, manufacturing a first insulating layer on the first side surface of the metal substrate and manufacturing a back insulating layer on the second side surface of the metal substrate through a deposition, glue spraying process or pulling method;

specifically, the insulating layers are formed on both sides of the metal substrate by deposition, glue spraying process or pulling method, as shown in fig. 6 (c), the material may be, but is not limited to, PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like.

S103, depositing photoresist on the first side face of the metal substrate through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

specifically, SUN-lift photoresist is deposited through a photoresist spraying process, photoetching is carried out, and a metal lead is manufactured through PVD sputtering of Ti/Pt or Ti/Au metal and acetone ultrasonic stripping, as shown in (d) of FIG. 6.

S104, manufacturing a top insulating layer on the first side surface of the metal substrate through a glue spraying process or a pulling method;

specifically, the top insulating layer is manufactured by a glue spraying process or a pulling method (as shown in fig. 6 (e)), and the material is not limited to the photoresist such as PI, SU-8, and the like.

And S105, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Specifically, direct lithography or photolithography, Reactive Ion Etching (RIE) method is selected to expose the lead contacts, stimulating electrode points and recording electrode points according to the photosensitive characteristics of the insulating layer (as shown in (f) of fig. 6).

In the embodiment of the present invention, after the subsequent steps such as coating the insulating layer on the metal substrate in the shape of the microneedle electrode, the microneedle electrode including the microneedle, the holder, and the output port is formed. The solid structure of the clamping handle is a part of metal substrate wrapped with an insulating layer, so that the clamping handle does not need to be assembled intentionally. Similarly, the substrate of the micro-needle and the output port is also directly formed by the part of the metal substrate wrapped with the insulating layer. The electrode area of the micro-needle can be made by exposing part of the metal lead at the part of the metal substrate corresponding to the micro-needle. The output node of the output port can also be directly made by exposing part of the metal lead. In conclusion, by the scheme, the microneedle electrode comprising the microneedle, the clamping handle and the output port can be manufactured.

In the scheme provided by the embodiment of the present invention, for convenience of description, each insulating layer is named, for example, a first insulating layer, a back insulating layer, and a top insulating layer. However, in actual processes, these insulating layers are not substantially different, and the nomenclature thereof is merely based on consideration of convenience of description.

Fig. 7 is a schematic flow chart illustrating a process for preparing a microneedle electrode according to another embodiment of the present invention; fig. 8 is a schematic view illustrating a process of preparing a microneedle electrode according to another embodiment of the present invention; referring to fig. 7 and 8, a method for preparing a microneedle electrode having a substrate formed of a metal substrate coated with an insulating layer according to an embodiment of the present invention includes:

s201, processing the shape of the microneedle electrode on the metal substrate by using a deep etching corrosion or laser cutting process;

specifically, the shape of the microneedle electrode is processed on a metal substrate (e.g., fig. 8 (a)) by a deep etching (DRIE), etching, or laser cutting process (e.g., fig. 8 (b)).

S202, manufacturing a first insulating layer on the first side face of the metal substrate through a deposition or glue spraying process;

specifically, the insulating layer is formed on one side of the metal substrate by deposition or glue spraying, and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like (as shown in fig. 8 (c)).

S203, depositing photoresist on the first insulating layer through a photoresist spraying process, and manufacturing a metal lead through photoetching and deposition;

specifically, a SUN-lift photoresist is deposited by a photoresist spraying process, and metal leads are fabricated by performing photolithography, sputtering Ti/Pt or Ti/Au metal by PVD, and ultrasonic stripping with acetone (shown in fig. 8 (d)).

S204, manufacturing a top insulating layer on the first insulating layer with the metal leads through a deposition process or a glue spraying process;

specifically, the top insulating layer is formed by a deposition process or a glue-spraying process, and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like (shown in fig. 8 (e)).

S205, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

specifically, direct lithography or photolithography, Reactive Ion Etching (RIE) method is selected to expose the lead contacts, stimulating electrode points, and recording electrode point patterns 8 according to the photosensitive characteristics of the insulating layer (f).

S206, removing the second side face of the metal substrate, and manufacturing a back insulating layer through a deposition process or a glue spraying process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Specifically, the back surface insulating layer is formed by a deposition process or a glue spraying process, and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, or the like (shown in fig. 8 (g)).

In the embodiment of the present invention, after the subsequent steps such as coating the insulating layer are performed on the metal substrate in the shape of the microneedle electrode, the metal substrate becomes the microneedle electrode including the microneedle, the holder, and the output port. The solid structure of the clamping handle is a part of metal substrate wrapped with an insulating layer, so that the clamping handle does not need to be assembled intentionally. Similarly, the substrate of the micro-needle and the output port is also directly formed by the part of the metal substrate wrapped with the insulating layer. The electrode area of the micro-needle can be made by exposing part of the metal lead at the part of the metal substrate corresponding to the micro-needle. The output node of the output port can also be directly made by exposing part of the metal lead. In conclusion, by the scheme, the microneedle electrode comprising the microneedle, the clamping handle and the output port can be manufactured.

Fig. 9 is a schematic view illustrating a process for preparing a microneedle electrode according to yet another embodiment of the present invention; fig. 10 is a schematic view illustrating a process of preparing a microneedle electrode according to yet another embodiment of the present invention; referring to fig. 9 and 10, a method for preparing a microneedle electrode having a substrate formed of a metal substrate coated with an insulating layer according to an embodiment of the present invention includes:

s301, processing the shape of the microneedle electrode on the metal substrate by deep etching, corrosion or laser cutting processes and the like;

specifically, a microneedle electrode is formed on a metal substrate (as shown in fig. 10 (a)) by a cutting process such as deep etching (DRIE), etching, or laser (as shown in fig. 10 (b)).

S302, manufacturing a first insulating layer on the first side surface of the metal substrate through a deposition or glue spraying process;

specifically, the insulating layer is formed on the front surface of the metal substrate by a deposition or glue spraying process (as shown in fig. 10 (c)), and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like.

S303, depositing photoresist on the first insulating layer through a photoresist spraying process, and photoetching and depositing to manufacture a metal lead;

specifically, a photoresist is deposited by a photoresist spraying process, and metal leads are fabricated by photolithography and deposition (as shown in fig. 10 (d)).

S304, manufacturing a top insulating layer on the first side surface of the metal substrate and a back insulating layer on the second side surface of the metal substrate through a deposition process, a glue spraying process or a pulling method;

specifically, the top and back insulating layers are formed by a deposition process, a glue spraying process, or a pulling method (as shown in fig. 10 (e)), and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, or the like.

S305, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Specifically, direct lithography or photolithography, Reactive Ion Etching (RIE) method is selected to expose the lead contacts, stimulating electrode points and recording electrode points according to the photosensitive characteristics of the insulating layer (as shown in (f) of fig. 10).

In the embodiment of the present invention, after the subsequent steps such as coating the insulating layer are performed on the metal substrate in the shape of the microneedle electrode, the metal substrate becomes the microneedle electrode including the microneedle, the holder, and the output port. The solid structure of the clamping handle is a part of metal substrate wrapped with an insulating layer, so that the clamping handle does not need to be assembled intentionally. Similarly, the substrate of the micro-needle and the output port is also directly formed by the part of the metal substrate wrapped with the insulating layer. The electrode area of the micro-needle can be made by exposing part of the metal lead at the part of the metal substrate corresponding to the micro-needle. The output node of the output port can also be directly made by exposing part of the metal lead. In conclusion, by the scheme, the microneedle electrode comprising the microneedle, the clamping handle and the output port can be manufactured.

The present application also provides a method for preparing a microneedle electrode, which is used for preparing the microneedle electrode according to any embodiment of the present application, and the method comprises the following steps:

attaching and fixing a first side surface of a preset substrate material on a silicon wafer;

based on the shape of the micro-needle electrode, manufacturing a metal lead and a top end insulating layer covering the metal lead on the second side face of a preset substrate material, and exposing an output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods;

the preset substrate material is patterned by laser processing, photoetching, deep etching or wet etching, and finally the shape of the microneedle electrode is manufactured, so that the microneedle electrode with the microneedle, the clamping handle and the output port is obtained.

Specifically, fig. 11 is a schematic view of a process for preparing a microneedle electrode according to another embodiment of the present invention; fig. 12 is a schematic view of a process for preparing a microneedle electrode according to yet another embodiment of the present invention. Referring to fig. 11 and 12, a method for preparing a microneedle electrode having a substrate formed of a metal substrate coated with an insulating layer according to an embodiment of the present invention includes:

s401, attaching and fixing a first side face of a metal sheet on a silicon wafer;

specifically, a metal sheet is bonded to a silicon wafer (as shown in fig. 12 (a)).

S402, manufacturing a first insulating layer on the second side face of the metal sheet through direct spin coating, deposition, glue spraying process or pulling method;

specifically, the first insulating layer is formed by direct spin coating, deposition, glue spraying process or pulling method (as shown in fig. 12 (b)), and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, or the like.

S403, manufacturing the first insulating layer into a microneedle electrode shape by direct photoetching or photoetching and reactive ion etching methods;

specifically, the shape of the microneedle electrode is made by selecting a direct lithography method or a lithography method or an RIE method according to the photosensitive characteristic of the insulating layer material (as shown in fig. 12 (c)).

S404, manufacturing a metal lead on the first insulating layer through photoetching and deposition;

specifically, the metal wiring is formed by photolithography and deposition (as shown in fig. 12 (d)).

S405, manufacturing a top insulating layer on the second side face of the metal sheet through direct spin coating, a deposition process, a glue spraying process or a pulling method;

specifically, the top insulating layer is fabricated by a direct spin coating, deposition process, glue spraying process or pulling method (as shown in fig. 12 (e)), and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like.

S406, exposing the output contact and at least two electrode areas by direct photoetching or photoetching and reactive ion etching methods, and manufacturing a microneedle electrode shape on the top insulating layer; wherein the microneedle electrode-shaped top insulating layer covers the microneedle electrode-shaped first insulating layer;

specifically, direct lithography or photolithography, RIE method is selected to expose the lead contacts, stimulating electrode points, and recording electrode points according to the photosensitive characteristics of the insulating layer, and the microneedle electrode shape is fabricated (as shown in fig. 12 (f)).

S407, patterning the metal sheet by using a laser processing, photoetching, deep etching or wet etching method to finally manufacture the shape of the microneedle electrode to obtain a metal substrate; wherein the microneedle electrode shaped first insulating layer overlies a microneedle electrode shaped metal sheet;

specifically, the shape of the microneedle electrode is finally manufactured by patterning the metal sheet by laser processing, photolithography, deep etching (DRIE) or wet etching (as shown in fig. 12 (g)).

S408, taking down the metal substrate from the silicon wafer, and manufacturing a back insulating layer on the first side face of the metal substrate through a glue spraying process or a deposition process to obtain the microneedle electrode with the microneedle, the clamping handle and the output port.

Specifically, the metal sheet is removed from the silicon wafer, and a back surface insulating layer is formed on the back surface through a glue spraying process or a deposition process (as shown in fig. 12 (h)), and the material is not limited to PI, SU-8, parylene, silicon dioxide, silicon nitride, and the like.

In the embodiment of the present invention, after a metal sheet (metal substrate) having a shape of a microneedle electrode is subjected to a subsequent process such as smearing and etching of an insulating layer, the metal substrate becomes a microneedle electrode including a microneedle, a holder, and an output port. The solid structure of the clamping handle is a part of metal substrate wrapped with an insulating layer, so that the clamping handle does not need to be assembled intentionally. Similarly, the substrate of the micro-needle and the output port is also directly formed by the part of the metal substrate wrapped with the insulating layer. The electrode area of the micro-needle can be made by exposing part of the metal lead at the part of the metal substrate corresponding to the micro-needle. The output node of the output port can also be directly made by exposing part of the metal lead. In conclusion, by the scheme, the microneedle electrode comprising the microneedle, the clamping handle and the output port can be manufactured.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes commands for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method according to the embodiments or some parts of the embodiments.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.