阅读说明：本技术 光电接口转换装置 (Photoelectric interface conversion device ) 是由 胡跃申 于 2021-10-25 设计创作，主要内容包括：本申请涉及一种光电接口转换装置。该装置包括：光电转换模块,与交换机芯片连接,能够将光学数据和交换机数据相互转换、以太网接口模块,与交换机芯片连接,能够将以太网数据和交换机数据相互转换、USB接口模块,与交换机芯片连接,能够将USB数据和交换机数据相互转换、Type-C接口模块,与交换机芯片连接,能够将Type-C数据和交换机数据相互转换、交换机芯片,能够将交换机芯片连接的任意一个交换机接口传输至交换机芯片的交换机数据,转发至交换机芯片连接的其它交换机接口。从而能够实现多种电接口和光接口之间的相互转换,使得工作人员在检测光纤网络时,无论使用的是何种接口的测试工具,都能顺利的进行检测。(The present application relates to an optical-electrical interface conversion device. The device includes: photoelectric conversion module, be connected with the switch chip, can be with optics data and switch data interconversion, ethernet interface module, be connected with the switch chip, can be with ethernet data and switch data interconversion, USB interface module, be connected with the switch chip, can be with USB data and switch data interconversion, Type-C interface module, be connected with the switch chip, can be with Type-C data and switch data interconversion, the switch chip, can transmit the switch data of arbitrary switch interface transmission to the switch chip that the switch chip is connected, other switch interfaces of switch chip connection are forwarded to. Therefore, the interconversion between various electrical interfaces and optical interfaces can be realized, and the detection can be smoothly carried out no matter what interface test tool is used when the worker detects the optical fiber network.)

1. An optical-to-electrical interface conversion apparatus, the apparatus comprising: the device comprises a photoelectric conversion module (10), an Ethernet interface module (20), a USB interface module (30), a Type-C interface module (40) and a switch chip (50); wherein the content of the first and second substances,

the photoelectric conversion module (10) comprises an optical interface and a switch interface, and the switch interface of the photoelectric conversion module (10) is connected with the switch chip (50) and is used for converting optical data input from the optical interface into switch data and transmitting the switch data to the switch chip (50) or converting the switch data transmitted by the switch chip (50) into optical data and outputting the optical data from the optical interface;

the Ethernet interface module (20) comprises an Ethernet interface and a switch interface, and the switch interface of the Ethernet interface module (20) is connected with the switch chip (50) and is used for converting Ethernet data input from the Ethernet interface into switch data and transmitting the switch data to the switch chip (50) or converting the switch data transmitted by the switch chip (50) into Ethernet data and outputting the Ethernet data from the Ethernet interface;

the USB interface module (30) comprises a USB interface and a switch interface, and the switch interface of the USB interface module (30) is connected with the switch chip (50) and is used for converting USB data input from the USB interface into switch data and transmitting the switch data to the switch chip (50) or converting the switch data transmitted by the switch chip (50) into USB data and outputting the USB data from the USB interface;

the Type-C interface module (40) comprises a Type-C interface and a switch interface, wherein the switch interface of the Type-C interface module (40) is connected with the switch chip (50) and is used for converting Type-C data input from the Type-C interface into switch data and transmitting the switch data to the switch chip (50) or converting the switch data transmitted by the switch chip (50) into Type-C data and outputting the Type-C data from the Type-C interface;

the switch chip (50) is used for transmitting the switch data of any switch interface connected with the switch chip (50) to the switch chip (50) and forwarding the switch data to other switch interfaces connected with the switch chip (50).

2. The apparatus of claim 1, further comprising:

a first received optical power indicator (71), a second received optical power indicator (72), a third received optical power indicator (73), a fourth received optical power indicator (74);

a controller (60) respectively connected to the first received optical power indicator (71), the second received optical power indicator (72), the third received optical power indicator (73), the fourth received optical power indicator (74) and the switch chip (50), and configured to control the first received optical power indicator (71) to be turned on when the switch chip (50) receives the switch data transmitted by the photoelectric conversion module (10); and then acquiring a numerical value of the optical power corresponding to the received switch data transmitted by the photoelectric conversion module (10), and respectively controlling the bright and dark states of the second received optical power indicator lamp (72), the third received optical power indicator lamp (73) and the fourth received optical power indicator lamp (74) according to the numerical value of the optical power.

3. The apparatus of claim 1, further comprising:

a first transmitting light power indicator lamp (75), a second transmitting light power indicator lamp (76), a third transmitting light power indicator lamp (77), a fourth transmitting light power indicator lamp (78);

a controller (60) connected to the first transmitting optical power indicator (75), the second transmitting optical power indicator (76), the third transmitting optical power indicator (77), the fourth transmitting optical power indicator (78), and the switch chip (50), respectively, for controlling the first transmitting optical power indicator (75) to be turned on when the switch chip (50) transmits switch data to the photoelectric conversion module (10); and then acquiring the numerical value of the optical power corresponding to the switch data of the photoelectric conversion module (10), and respectively controlling the bright and dark states of the second sending optical power indicator lamp (76), the third sending optical power indicator lamp (77) and the fourth sending optical power indicator lamp (78) according to the numerical value of the optical power.

4. The apparatus of claim 2 or 3, further comprising:

a power module (80) respectively connected to the controller (60), the photoelectric conversion module (10), the ethernet interface module (20), the USB interface module (30), the Type-C interface module (40), and the switch chip (50), and configured to supply power to the controller (60), the photoelectric conversion module (10), the ethernet interface module (20), the USB interface module (30), the Type-C interface module (40), and the switch chip (50);

the Type-C interface module (40) is used for receiving the electric quantity input of an external power supply through the Type-C interface, transmitting the electric quantity to the power supply module (80) and charging the power supply module (80);

the USB interface module (30) can transmit the electric quantity transmitted from the power supply module (80) to the USB interface module (30) through the USB interface.

5. The apparatus of claim 4, further comprising:

a first power indicator (91), a second power indicator (92), and a third power indicator (93);

the power management module (90) is respectively connected with the first power indicator (91), the second power indicator (92), the third power indicator (93) and the power module (80) and is used for acquiring the current electric quantity of the power module (80) and whether the power module (80) is charging, and controlling the first power indicator (91) to be on, the second power indicator (92) to be off and the third power indicator (93) to be off when the power module (80) is charging; when the electric quantity of the power supply module (80) is higher than an upper limit threshold value, controlling the first power supply indicator lamp (91) not to be turned on, the second power supply indicator lamp (92) to be turned on and the third power supply indicator lamp (93) not to be turned on; and when the electric quantity of the power supply module (80) is lower than a lower limit threshold value, controlling the first power supply indicator lamp (91) not to be turned on, the second power supply indicator lamp (92) not to be turned on and the third power supply indicator lamp (93) to be turned on.

6. The device according to any one of claims 1 to 3,

the photoelectric conversion module (10) comprises an optical connector chip connected with the switch chip (50);

the Ethernet interface module (20) comprises an Ethernet connector chip and a network transformer chip which are connected with each other, and the network transformer chip is connected with the switch chip (50);

the USB interface module (30) comprises a USB connector chip, a first capacitance protection device and a first Ethernet chip, wherein the USB connector chip is connected with the first capacitance protection device, the first capacitance protection device is connected with the first Ethernet chip, and the first Ethernet chip is connected with the switch chip (50);

the Type-C interface module (40) comprises a Type-C connector chip, a second capacitance protection device and a second Ethernet chip, wherein the Type-C connector chip is connected with the second capacitance protection device, the second capacitance protection device is connected with the second Ethernet chip, and the second Ethernet chip is connected with the switch chip (50).

7. The apparatus of claim 6, further comprising:

the first Ethernet indicator lamp (41) is connected with the first Ethernet chip and used for lighting when the first Ethernet chip works;

and the second Ethernet indicator lamp (42) is connected with the second Ethernet chip and used for lighting when the second Ethernet chip works.

8. The apparatus of any one of claims 1 to 3, wherein the Ethernet interface is a 10M \100M \1000M adaptive data interface.

9. The apparatus of any one of claims 1 to 3, wherein the USB interface and the Type-C interface are 10M \100M adaptive data interfaces.

10. The apparatus of any of claims 1 to 3, wherein the optical interface is a single-fiber single-mode optical interface.

Technical Field

The present application relates to the field of photoelectric conversion technologies, and in particular, to a photoelectric interface conversion device.

Background

With the development of science and technology, optical signals have the advantages of being free of electromagnetic interference, low in transmission loss, suitable for long-distance transmission, large in transmission quantity and the like, so that a traditional telecommunication network using electrical signal transmission is gradually replaced by an optical fiber network using optical signal transmission, and the use of optical fibers is more and more popular. When testing an optical fiber network, a worker needs to convert an optical signal into an electrical signal suitable for testing equipment so as to facilitate detection, and because electrical signal interfaces used by different testing tools are different, how to convert the optical signal into the electrical signal of a required interface is a problem to be solved at present.

In the conventional technology, an optical-electrical protocol converter is used to convert an optical signal into an RJ-45 electrical signal, which is transmitted to a notebook for detection.

However, with the progress of science and technology, the currently used testing tools are more and more diversified, and if the used testing tool is a tablet computer or an ultra-thin notebook, the testing tool does not have an RJ-45 electrical interface, but only has a USB interface or a Type-C interface, so that the conventional photoelectric protocol converter cannot be used for conversion.

Disclosure of Invention

In view of the above, it is necessary to provide an optical-electrical interface conversion device capable of converting an optical signal into an electrical signal suitable for a different electrical interface.

An optical-to-electrical interface conversion apparatus, the apparatus comprising: the device comprises a photoelectric conversion module, an Ethernet interface module, a USB interface module, a Type-C interface module and a switch chip; wherein the content of the first and second substances,

the photoelectric conversion module comprises an optical interface and a switch interface, wherein the switch interface of the photoelectric conversion module is connected with the switch chip and is used for converting optical data input from the optical interface into switch data and transmitting the switch data to the switch chip or converting the switch data transmitted by the switch chip into optical data and outputting the optical data from the optical interface;

the Ethernet interface module comprises an Ethernet interface and a switch interface, wherein the switch interface of the Ethernet interface module is connected with the switch chip and is used for converting Ethernet data input from the Ethernet interface into switch data and transmitting the switch data to the switch chip, or converting the switch data transmitted by the switch chip into Ethernet data and outputting the Ethernet data from the Ethernet interface;

the USB interface module comprises a USB interface and a switch interface, wherein the switch interface of the USB interface module is connected with the switch chip and is used for converting USB data input from the USB interface into switch data and transmitting the switch data to the switch chip or converting the switch data transmitted by the switch chip into USB data and outputting the USB data from the USB interface;

the Type-C interface module comprises a Type-C interface and an exchanger interface, wherein the exchanger interface of the Type-C interface module is connected with the exchanger chip and is used for converting Type-C data input from the Type-C interface into exchanger data and transmitting the exchanger data to the exchanger chip, or converting the exchanger data transmitted by the exchanger chip into Type-C data and outputting the Type-C data from the Type-C interface;

the switch chip is used for transmitting any switch interface connected with the switch chip to the switch data of the switch chip and transmitting the switch data to other switch interfaces connected with the switch chip.

In one embodiment, the apparatus further comprises: the first receiving optical power indicator lamp, the second receiving optical power indicator lamp, the third receiving optical power indicator lamp and the fourth receiving optical power indicator lamp; the controller is respectively connected with the first receiving optical power indicator lamp, the second receiving optical power indicator lamp, the third receiving optical power indicator lamp, the fourth receiving optical power indicator lamp and the switch chip, and is used for controlling the first receiving optical power indicator lamp to be on when the switch chip receives the switch data transmitted by the photoelectric conversion module; and then acquiring a value of the received optical power corresponding to the switch data transmitted by the photoelectric conversion module, and respectively controlling the bright and dark states of the second received optical power indicator lamp, the third received optical power indicator lamp and the fourth received optical power indicator lamp according to the value of the optical power.

In one embodiment, the apparatus further comprises: a first sending light power indicator light, a second sending light power indicator light, a third sending light power indicator light and a fourth sending light power indicator light; the controller is respectively connected with the first sending light power indicator lamp, the second sending light power indicator lamp, the third sending light power indicator lamp, the fourth sending light power indicator lamp and the switch chip and is used for controlling the first sending light power indicator lamp to be on when the switch chip transmits switch data to the photoelectric conversion module; and then acquiring the light power value corresponding to the switch data of the photoelectric conversion module, and respectively controlling the bright and dark states of the second sending light power indicator lamp, the third sending light power indicator lamp and the fourth sending light power indicator lamp according to the light power value.

In one embodiment, the apparatus further comprises: a power module, connected to the controller, the photoelectric conversion module, the ethernet interface module, the USB interface module, the Type-C interface module, and the switch chip, respectively, for supplying power to the controller, the photoelectric conversion module, the ethernet interface module, the USB interface module, the Type-C interface module, and the switch chip; the Type-C interface module is used for receiving the electric quantity input of an external power supply through the Type-C interface, transmitting the electric quantity to the power supply module and charging the power supply module; the USB interface module can output the electric quantity transmitted from the power supply module to the USB interface module through the USB interface.

In one embodiment, the apparatus further comprises: the power supply comprises a first power supply indicator light, a second power supply indicator light and a third power supply indicator light; the power management module is respectively connected with the first power indicator light, the second power indicator light, the third power indicator light and the power module, and is used for acquiring the current electric quantity of the power module and whether the power module is charging or not, and controlling the first power indicator light to be turned on, the second power indicator light to be turned off and the third power indicator light to be turned off when the power module is charging; when the electric quantity of the power supply module is higher than an upper limit threshold value, controlling the first power supply indicator lamp to be not on, the second power supply indicator lamp to be on and the third power supply indicator lamp to be not on; and when the electric quantity of the power supply module is lower than a lower limit threshold value, controlling the first power supply indicator lamp not to be turned on, the second power supply indicator lamp not to be turned on and the third power supply indicator lamp to be turned on.

In one embodiment, the photoelectric conversion module comprises an optical connector chip connected with the switch chip; the Ethernet interface module comprises an Ethernet connector chip and a network transformer chip which are connected with each other, and the network transformer chip is connected with the switch chip; the USB interface module comprises a USB connector chip, a first capacitor protection device and a first Ethernet chip, wherein the USB connector chip is connected with the first capacitor protection device, the first capacitor protection device is connected with the first Ethernet chip, and the first Ethernet chip is connected with the switch chip; the Type-C interface module comprises a Type-C connector chip, a second capacitance protection device and a second Ethernet chip, the Type-C connector chip is connected with the second capacitance protection device, the second capacitance protection device is connected with the second Ethernet chip, and the second Ethernet chip is connected with the switch chip.

In one embodiment, the apparatus further comprises: the first Ethernet indicator light is connected with the first Ethernet chip and used for lighting when the first Ethernet chip works; and the second Ethernet indicator light is connected with the second Ethernet chip and used for lighting when the second Ethernet chip works.

In one embodiment, the ethernet interface is a 10M \100M \1000M adaptive data interface.

In one embodiment, the USB interface and the Type-C interface are 10M \100M adaptive data interfaces.

In one embodiment, the optical signal interface is a single-fiber single-mode optical interface.

The photoelectric interface conversion device can convert externally input optical data into exchanger data and send the exchanger data to the exchanger by arranging the photoelectric conversion module, and can also convert the received exchanger data into optical data and output the optical data. Through setting up ethernet interface module, can convert ethernet data into switch data and send for the switch, also can convert received switch data into ethernet data output. Through setting up USB interface module, can convert USB data into switch data and send for the switch, also can convert received switch data into USB data output. Through setting up Type-C interface module, can convert Type-C data into switch data transmission and give the switch, also can convert received switch data into Type-C data output. By setting the switch chip, the switch data transmitted by any one interface can be forwarded to other switch interfaces. Therefore, optical data, Ethernet data, USB data and Type-C data can be converted into switch data and can be mutually forwarded. The optical interface, the Ethernet interface, the USB interface and the Type-C interface can be converted arbitrarily. When the optical fiber network is detected by workers, the detection can be smoothly carried out no matter what interface test tool is used.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an optical-electrical interface conversion device in one embodiment;

FIG. 2 is a schematic diagram of a power indicator module according to an embodiment;

FIG. 3 is a schematic diagram of the received optical power range in one embodiment;

FIG. 4 is a diagram illustrating a range of transmitted optical powers in one embodiment;

FIG. 5 is a schematic structural diagram of an optical-to-electrical interface conversion apparatus according to another embodiment;

FIG. 6 is a circuit diagram of a switch chip in one embodiment;

FIG. 7 is a circuit diagram of a photoelectric conversion module in one embodiment;

FIG. 8 is a circuit diagram of an Ethernet interface module in one embodiment;

FIG. 9 is a circuit diagram of a USB interface module in one embodiment;

FIG. 10 is a circuit diagram of a Type-C interface module in one embodiment;

FIG. 11 is a circuit diagram of a power management module in one embodiment;

FIG. 12 is a circuit diagram of a controller according to one embodiment;

FIG. 13 is a circuit diagram of an indicator light in one embodiment;

description of reference numerals: 10-photoelectric conversion module, 20-Ethernet interface module, 30-USB interface module, 40-Type-C interface module, 50-switch chip, 60-controller, 71-first received optical power indicator lamp, 72-second received optical power indicator lamp, 73-third received optical power indicator lamp, 74-fourth received optical power indicator lamp, 75-first transmitted optical power indicator lamp, 76-second transmitted optical power indicator lamp, 77-third transmitted optical power indicator lamp, 78-fourth transmitted optical power indicator lamp, 80-power module, 90-power management module, 91-first power indicator lamp, 92-second power indicator lamp, 93-third power indicator lamp, 41-first Ethernet indicator lamp, 42-second Ethernet indicator lamp.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

As mentioned in the background, the prior art optoelectronic converter cannot adapt to the electrical interface of different testing tools when the worker uses different testing tools. The inventor researches and discovers that the problem occurs because the prior art photoelectric converter only comprises one electrical interface, which is generally an RJ-45 electrical interface, and the currently used testing tools are more and more diversified, and if the used testing tool is a tablet computer or an ultra-thin notebook, the testing tool does not have the RJ-45 electrical interface, but only has a USB interface or a Type-C interface, so that the conversion cannot be performed by using the conventional photoelectric protocol converter.

For the above reasons, the present invention provides an optical-electrical interface conversion device capable of converting an optical signal into an electrical signal suitable for different electrical interfaces.

In one embodiment, as shown in fig. 1, there is provided an optical-to-electrical interface conversion apparatus, the apparatus comprising: photoelectric conversion module 10, ethernet interface module 20, USB interface module 30, Type-C interface module 40, switch chip 50.

The optical-to-electrical conversion module 10 includes an optical interface and a switch interface, and the switch interface of the optical-to-electrical conversion module 10 is connected to the switch chip 50, and is configured to convert optical data input from the optical interface into switch data and transmit the switch data to the switch chip 50, or convert switch data transmitted by the switch chip 50 into optical data and output the optical data from the optical interface.

The ethernet interface module 20 includes an ethernet interface and a switch interface, and the switch interface of the ethernet interface module 20 is connected to the switch chip 50, and is configured to convert ethernet data input from the ethernet interface into switch data and transmit the switch data to the switch chip 50, or convert switch data transmitted by the switch chip 50 into ethernet data and output the ethernet data from the ethernet interface.

The USB interface module 30 includes a USB interface and a switch interface, and the switch interface of the USB interface module 30 is connected to the switch chip 50, and is configured to convert USB data input from the USB interface into switch data and transmit the switch data to the switch chip 50, or convert switch data transmitted by the switch chip 50 into USB data and output the USB data from the USB interface.

Type-C interface module 40, including Type-C interface and switch interface, Type-C interface module 40's switch interface is connected with switch chip 50 for to convert the Type-C data that will follow Type-C interface input into switch data and transmit to switch chip 50, or convert the switch data that switch chip 50 transmitted into Type-C data and follow Type-C interface output.

The switch chip 50 is configured to transmit the switch data, which is transmitted to the switch chip 50 from any one switch interface connected to the switch chip 50, to the other switch interfaces connected to the switch chip 50.

In this embodiment, by providing the photoelectric conversion module, the optical data input from the outside can be converted into the switch data and transmitted to the switch, and the received switch data can also be converted into the optical data and output. Through setting up ethernet interface module, can convert ethernet data into switch data and send for the switch, also can convert received switch data into ethernet data output. Through setting up USB interface module, can convert USB data into switch data and send for the switch, also can convert received switch data into USB data output. Through setting up Type-C interface module, can convert Type-C data into switch data transmission and give the switch, also can convert received switch data into Type-C data output. By setting the switch chip, the switch data transmitted by any one interface can be forwarded to other switch interfaces. Therefore, optical data, Ethernet data, USB data and Type-C data can be converted into switch data and can be mutually forwarded. The optical interface, the Ethernet interface, the USB interface and the Type-C interface can be converted arbitrarily. When the optical fiber network is detected by workers, the detection can be smoothly carried out no matter what interface test tool is used.

Illustratively, the photoelectric conversion module 10 includes an optical connector chip connected with the switch chip 50.

Illustratively, the ethernet interface module 20 includes an ethernet connector chip and a network transformer chip connected to each other, the network transformer chip being connected to the switch chip 50.

Illustratively, the USB interface module 30 includes a USB connector chip, a first capacitance protection device, and a first ethernet chip, wherein the USB connector chip is connected to the first capacitance protection device, the first capacitance protection device is connected to the first ethernet chip, and the first ethernet chip is connected to the switch chip 50.

Illustratively, the Type-C interface module 40 includes a Type-C connector chip, a second capacitance protection device, and a second ethernet chip, where the Type-C connector chip is connected to the second capacitance protection device, the second capacitance protection device is connected to the second ethernet chip, and the second ethernet chip is connected to the switch chip 50.

Illustratively, as shown in fig. 3, the optical-electrical interface conversion device further includes a first ethernet indicator lamp 41 and a second ethernet indicator lamp 42.

And a first ethernet indicator 41 connected to the first ethernet chip and configured to light up when the first ethernet chip is in operation.

And a second ethernet indicator lamp 42 connected to the second ethernet chip for lighting up when the second ethernet chip is in operation.

Illustratively, the ethernet interface is a 10M \100M \1000M adaptive data interface.

Illustratively, the USB interface and the Type-C interface are 10M \100M adaptive data interfaces.

Illustratively, the optical interface is a single-fiber single-mode optical interface.

In one embodiment, as shown in fig. 2, the optical-electrical interface conversion apparatus further includes: a first received optical power indicator 71, a second received optical power indicator 72, a third received optical power indicator 73, a fourth received optical power indicator 74, and a controller 60.

The controller 60 is respectively connected to the first received optical power indicator 71, the second received optical power indicator 72, the third received optical power indicator 73, the fourth received optical power indicator 74 and the switch chip 50, and is configured to control the first received optical power indicator 71 to be turned on when the switch chip 50 receives the switch data transmitted by the photoelectric conversion module 10; then, the received optical power value corresponding to the switch data transmitted by the photoelectric conversion module 10 is obtained, and the light and dark states of the second received optical power indicator 72, the third received optical power indicator 73, and the fourth received optical power indicator 74 are respectively controlled according to the optical power value.

Specifically, as shown in fig. 3, the first preset range of received power is expressed as: the second received optical power indicator is not on, the third received optical power indicator is not on, and the fourth received optical power indicator is not on.

The second reception power preset range is expressed as: the second received optical power indicator is not on, the third received optical power indicator is not on, and the fourth received optical power indicator is on.

The third predetermined range of received power is expressed as: the second received optical power indicator is not on, the third received optical power indicator is on, and the fourth received optical power indicator is not on.

The fourth receive power preset range is expressed as: the second received optical power indicator is not on, the third received optical power indicator is on, and the fourth received optical power indicator is on.

The fifth reception power preset range is expressed as: the second received optical power indicator is on, the third received optical power indicator is not on, and the fourth received optical power indicator is not on.

The sixth reception power preset range is expressed as: the second received optical power indicator is on, the third received optical power indicator is not on, and the fourth received optical power indicator is on.

The seventh reception power preset range is expressed as: the second received optical power indicator is on, the third received optical power indicator is on, and the fourth received optical power indicator is not on.

The eighth reception power preset range is expressed as: the second received optical power indicator is on, the third received optical power indicator is on, and the fourth received optical power indicator is on. And when the light power value falls into the corresponding range, controlling the second receiving light power indicator lamp, the third receiving light power indicator lamp and the fourth receiving light power indicator lamp to be in corresponding bright and dark states.

In this embodiment, whether the processor chip is receiving the optical power is displayed by setting the first received optical power indicator, and the range of the value of the optical power is represented by setting the second received optical power indicator, the third received optical power indicator and the fourth received optical power indicator, so that the magnitude of the received optical power can be detected.

In one embodiment, as shown in fig. 2, the optical-electrical interface conversion apparatus further includes: a first transmitting light power indicator lamp 75, a second transmitting light power indicator lamp 76, a third transmitting light power indicator lamp 77, a fourth transmitting light power indicator lamp 78, and a controller 60.

A controller 60, connected to the first transmitting optical power indicator lamp 75, the second transmitting optical power indicator lamp 76, the third transmitting optical power indicator lamp 77, the fourth transmitting optical power indicator lamp 78 and the switch chip 50, respectively, for controlling the first transmitting optical power indicator lamp 75 to be on when the switch chip 50 transmits switch data to the photoelectric conversion module 10; then, the value of the optical power corresponding to the switch data of the photoelectric conversion module 10 is obtained, and the light and dark states of the second transmitting optical power indicator lamp 76, the third transmitting optical power indicator lamp 77, and the fourth transmitting optical power indicator lamp 78 are controlled according to the value of the optical power.

Specifically, as shown in fig. 4, the first preset transmission power range is expressed as: the second sending light power indicator light is not on, the third sending light power indicator light is not on, and the fourth sending light power indicator light is not on.

The second preset range of transmission power is expressed as: the second sending light power indicator light is not on, the third sending light power indicator light is not on, and the fourth sending light power indicator light is on.

The third preset range of transmission power is expressed as: the second sending light power indicator light is not on, the third sending light power indicator light is on, and the fourth sending light power indicator light is not on.

The fourth preset range of transmission power is expressed as: the second sending light power indicator light is not on, the third sending light power indicator light is on, and the fourth sending light power indicator light is on.

The fifth preset range of transmission power is expressed as: the second sending light power indicator lamp is on, the third sending light power indicator lamp is not on, and the fourth sending light power indicator lamp is not on.

The sixth preset range of transmission power is expressed as: the second sending light power indicator lamp is on, the third sending light power indicator lamp is not on, and the fourth sending light power indicator lamp is on.

The seventh transmission power preset range is expressed as: the second sending light power indicator lamp is on, the third sending light power indicator lamp is on, and the fourth sending light power indicator lamp is not on.

The eighth preset range of transmission power is expressed as: the second sending light power indicator lamp is on, the third sending light power indicator lamp is on, and the fourth sending light power indicator lamp is on. And when the light power value falls into the corresponding range, controlling the second sending light power indicator lamp, the third sending light power indicator lamp and the fourth sending light power indicator lamp to be in corresponding bright and dark states.

In this embodiment, whether the processor chip is transmitting the optical power is displayed by setting the first transmitting optical power indicator lamp, and the range in which the value of the optical power is located is indicated by setting the second transmitting optical power indicator lamp, the third transmitting optical power indicator lamp, and the fourth transmitting optical power indicator lamp, so that the magnitude of the transmitted optical power can be detected.

In one embodiment, as shown in fig. 5, the optical-electrical interface conversion apparatus further includes: a power module 80.

The power module 80 is connected to the controller 60, the photoelectric conversion module 10, the ethernet interface module 20, the USB interface module 30, the Type-C interface module 40, and the switch chip 50, respectively, and is configured to supply power to the controller 60, the photoelectric conversion module 10, the ethernet interface module 20, the USB interface module 30, the Type-C interface module 40, and the switch chip 50.

Specifically, the Type-C interface module 40 is used for receiving the electric quantity input of the external power supply through the Type-C interface, and transmits the electric quantity to the power module 80 to charge the power module 80. The USB interface module 30 may transmit the power output from the power module 80 to the USB interface module 30 through the USB interface.

In this embodiment, the power module is used for supplying power to the photoelectric interface conversion device, so that when the photoelectric interface conversion device is used, a power supply does not need to be carried, and the photoelectric interface conversion device is lighter. And can charge for the power through Type-C interface to and use the power to charge for other equipment through the USB interface. The function of the photoelectric interface conversion device is further increased, and the photoelectric interface conversion device can also be used as a power supply, so that the function of the photoelectric interface conversion device is more diversified.

In one embodiment, as shown in fig. 5, the optical-electrical interface conversion apparatus further includes: the power supply comprises a first power supply indicator lamp 91, a second power supply indicator lamp 92, a third power supply indicator lamp 93 and a power supply management module 90.

The power management module 90 is respectively connected with the first power indicator 91, the second power indicator 92, the third power indicator 93 and the power module 80, and is used for acquiring the current electric quantity of the power module 80 and whether the power module 80 is charging, and controlling the first power indicator 91 to be turned on, the second power indicator 92 to be turned off and the third power indicator 93 to be turned off when the power module 80 is charging; when the electric quantity of the power module 80 is higher than the upper limit threshold value, controlling the first power indicator lamp 91 not to be turned on, the second power indicator lamp 92 to be turned on and the third power indicator lamp 93 not to be turned on; when the electric quantity of the power module 80 is lower than the lower threshold, the first power indicator lamp 91 is not turned on, the second power indicator lamp 92 is not turned on, and the third power indicator lamp 93 is controlled to be turned on.

In this embodiment, through setting up power management module to and power indicator, can show power module's the electric quantity condition, and power module's operating condition for the user can audio-visually see power module's condition.

Illustratively, as shown in fig. 6 to 13, there is provided a circuit diagram of an optical-to-electrical interface conversion apparatus, including an optical-to-electrical conversion circuit, an ethernet interface circuit, a USB interface circuit, a Type-C interface circuit, a switch chip circuit, a power management circuit, and a processor circuit.

As shown in fig. 6, the switch chip circuit includes a switch chip RTL8367S-CG, a capacitor C23, a crystal oscillator X1, a capacitor C17, a capacitor C18, a resistor R19, a resistor R59, a resistor R60, a capacitor C13, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C31, a capacitor C32, a resistor R10, an inductor L7, a storage chip AT24C64M/TR, a resistor R31, a capacitor C28, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a capacitor C59, a capacitor C57, a capacitor C58, a capacitor C62, a capacitor C60, and a capacitor C61. Pins 128, 116, 102, 90, 82, 67, 59, 42, 41, 33, 21, 17, 11 of the switch chip are connected to a power supply, pins 122, 108, 95, 69, 58, 37, 27, 20, 14, 6 are connected to a VDDL terminal, pins 125, 119, 115, 111, 105, 99, 96, 89, 85, 68, 62, 61, 57, 44, 43, 40, 34, 32, 24, 18, 12, 1 are connected to ground, a first terminal of a capacitor C23 is connected to ground, a second terminal of a capacitor C23 is connected to pin 114 of the switch chip, a first terminal of a resistor R25 is connected to VDDL, a second terminal of a resistor R25 is connected to pin 114 of the switch chip, a first terminal of a resistor R19 is connected to ground, a second terminal of a resistor R19 is connected to pin 13 of the switch chip, a first terminal of a resistor R10 is connected to a power supply, a second terminal of a resistor R10 is connected to pin 60 of the switch chip, a first terminal of a capacitor C31, a first terminal of a capacitor C31, a terminal of a capacitor C31, a second terminal of a capacitor C31 and a second terminal of a capacitor C7, the VDDL interface is respectively connected with the first ends of a capacitor C59, a capacitor C57, a capacitor C58, a capacitor C62, a capacitor C60 and a capacitor C61, the second ends of a capacitor C59, a capacitor C57, a capacitor C58, a capacitor C62, a capacitor C60 and a capacitor C61 are grounded, the second end of the inductor L7 is connected with pins 63 and 64 of the switch chip, the first ends of a capacitor C29 and a capacitor C30 are grounded, the second ends of a capacitor C29 and a capacitor C30 are connected with the first end of a resistor R32 and pins 65 and 66 of the switch chip, the second end of a resistor R32 is connected with a power supply, the 2 and 4 ends of a crystal oscillator X1 are grounded, the 1 st end and the 3 rd end of a crystal oscillator X1 are respectively connected with the first ends of a capacitor C18 and a capacitor C17, the second ends of a capacitor C18 and a capacitor C17 are grounded, the 1 st end and the 3 rd end of the crystal oscillator X1 are respectively connected with the pins 83, the pins 88 of the switch chip, the switch chip 88 and the pins 88 of the switch chip, and the switch chip are respectively connected with the pins 88 of the switch chip 88 and the pin 88 of the switch chip, 87, the first ends of the resistor R11, the resistor R12, the resistor R13 and the resistor R14 are grounded, the second ends of the resistor R11, the resistor R12, the resistor R13 and the resistor R14 are respectively connected with pins 79, 76, 75 and 74 of the switch chip, the pin 8 of the memory chip is connected with the power supply, the pin 8 is connected with the first end of the resistor R31, the second end of the resistor R31 is connected with the first end of the capacitor C28, the second end of the resistor R31 is connected with the pin 86 of the switch chip, the second end of the capacitor C28 is grounded, and the pins 1, 2, 3 and 4 of the memory chip are grounded.

As shown in fig. 7, the photoelectric conversion circuit includes an optical connector chip 744410001, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, and a resistor R9. The first ends of the resistor R4, the resistor R5, the resistor R6, the resistor R7 and the resistor R8 are connected with a VCCT (transmitting power supply) interface, the first end of the resistor R9 is grounded, the second ends of the resistor R4, the resistor R5, the resistor R6, the resistor R7 and the resistor R8 are respectively connected with pins 2, 4, 5, 6 and 8 of the connector chip, the second end of the resistor R9 is connected with pin 3 of the connector chip, pins 1, 17, 20, 9, 10, 14 and 11 of the connector chip are grounded, and pins 19, 18, 13 and 12 of the connector chip are respectively connected with pins 36, 35, 38 and 39 of the RTL8367S-CG of the switch chip. Pin 15 of the connector chip is connected to a VCCT (transmit power) interface, and pin 16 of the connector chip is connected to a VCCR (receive power) interface.

As shown in fig. 8 and 13, the ethernet interface circuit includes an ethernet connector chip R-RJ45R08P-C000, a network transformer chip G2406S, a resistor R15, a resistor R16, a resistor R1, a capacitor C1, a capacitor C4, and a bulb M3. The pin 9 of the Ethernet connector chip is connected with a power supply, the pin 12 is grounded, the first end of the resistor R15 is used for connecting an LED lamp, the second end of the resistor R15 is connected with the pin 11 of the Ethernet connector chip, the first end of the resistor R16 is connected with the pin 10 of the Ethernet connector chip, the second end of the resistor R16 is connected with the pin 72 of the switch chip, the pins 1, 2, 3, 4, 5, 6, 7 and 8 of the Ethernet connector chip are respectively connected with the pins 13, 14, 16, 19, 20, 17, 22 and 23 of the network transformer chip, the first end of the capacitor C4 is connected with the M3, the second end of the capacitor C4 is connected with the first end of the resistor R1, the second end of the resistor R1 is connected with the pins 15, 18, 21 and 24 of the network transformer chip, the first end of the capacitor C1 is grounded, the second ends of the pins 10, 7, 4 and 1 of the network transformer chip, and the pin 12 of the network transformer chip, 11. 9, 8, 6, 5, 3, 2 are connected to pins 2, 3, 4, 5, 7, 8, 9, 10, respectively, of the switch chip RTL 8367S-CG.

As shown in fig. 9 and 13, the USB interface circuit includes a USB connector chip USB2USB-302S, a capacitance protection device USBLC6-2SC6, an ethernet chip RTL8152B-VB-CG, a flash memory chip MX25L1606EM1I-12G, a resistor R35, a resistor R34, a resistor R52, a resistor R42, a resistor R41, a resistor R2, a resistor R36, a crystal oscillator X2, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C35, a capacitor C36, a capacitor C38, an omnidirectional antenna F3, an indication lamp LED2, a resistor R17, a resistor R18, a capacitor C73, a capacitor C74, a capacitor C75, a capacitor C76, a capacitor C66, a capacitor C67, a capacitor C68, a capacitor C65, a capacitor C64, and a capacitor C63. Pins 5, 6 and 4 of the USB connector chip are grounded and connected with a first end of a resistor R34 and a first end of a resistor R35, second ends of a resistor R34 and a resistor R35 are grounded, a pin 1 of the USB connector chip is connected with a first end of an omnidirectional antenna F3, a second end of an omnidirectional antenna F3 is connected with a power supply, a second end of an omnidirectional antenna F3 is connected with a pin 5 of a capacitance protection device D4, a pin 2 of the USB connector chip is connected with pins 6 and 1 of a capacitance protection device D4, a pin 3 of the USB connector chip is connected with pins 4 and 3 of a capacitance protection device D4, a pin 2 of the capacitance protection device D4 is grounded, pins 1 and 3 of a capacitance protection device D4 are respectively connected with pins 7 and 8 of an Ethernet chip U7, a first end of a resistor R52 is connected with the power supply, a second end of a resistor R52 is connected with a pin 11 of the Ethernet chip, and pins 9, 12, 16 and 23 of the Ethernet chip are connected with V10-U, V10-U is connected to the first terminals of the capacitor C73, the capacitor C74, the capacitor C75, and the capacitor C75, the second terminals of the capacitor C75, and the capacitor C75 are grounded, the pins 10, 13, 1 of the ethernet chip are connected to the interfaces of the resistor R75, the first terminal of the resistor R75, and the VCC 75, the VCC 75 interface is connected to the first terminals of the capacitor C75, the second terminal of the resistor R75 is grounded, the second terminal of the resistor R75 is connected to the pin 18 of the ethernet chip, the second terminal of the resistor R75 is connected to the pin 19 of the ethernet chip, the pin 2 of the crystal oscillator X75, the first terminal of the crystal oscillator X364, and the first terminal of the capacitor C3621 are connected to the pin 19 of the ethernet chip 75, the second terminal of the ethernet chip 75 is connected to the pin 75, the capacitor X75 is connected to the pin 3621, the 3 rd terminal of the oscillator X2 is connected to the first terminal of the capacitor C35 and the pin 22 of the ethernet chip, the second terminal of the capacitor C36 is grounded, the second terminal of the capacitor C35 is grounded and connected to the pin 25 of the ethernet chip and the first terminal of the resistor R36, the second terminal of the resistor R36 is connected to the pin 24 of the ethernet chip, the pin 18 of the ethernet chip is connected to the pin 5 of the flash chip, the pin 17 of the ethernet chip is connected to the first terminal of the resistor R18, the second terminal of the resistor R18 is connected to the pin 4 of the indicator light chip LED2, the pin 6 of the ethernet chip is grounded, the pins 2, 3, 4, and 5 of the ethernet chip are connected to the pins 103, 104, 106, and 107 of the switch chip RTL8367S-CG, the pin 3, 7, and 8 of the flash chip U9 are powered, the pin 4 of the flash chip U9 is grounded, the pin 8 of the flash chip U9 is connected to the first terminal of the capacitor C38, and the second terminal of the capacitor C38 is grounded, pins 5 and 6 of the flash memory chip U9 are connected to pins 17 and 18 of the Ethernet chip, respectively, and pin 1 of the flash memory chip U9 is connected to pin 15 of the Ethernet chip.

As shown in fig. 10 and 13, the Type-C interface circuit includes a Type-C connector chip USB2USB-302S, a capacitance protection device USBLC6-2SC6, an ethernet chip RTL8152B-VB-CG, a flash memory chip MX25L1606EM1I-12G, an omnidirectional antenna F2, a diode D6, a resistor R47, a resistor R43, a resistor R44, a resistor R45, a resistor R46, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, a capacitor C46, a capacitor C47, a capacitor C37, a capacitor C71, a capacitor C70, a capacitor C69, a capacitor C72, a capacitor C66, a capacitor C67, a capacitor C68, a capacitor C65, a capacitor C64, and a capacitor C63. Pins 13, 14, 15 and 16 of the Type-C connector chip are grounded, pins B4A9 and A4B9 of the Type-C connector chip are connected with the first end of an omnidirectional wire F2, the second end of the omnidirectional wire F2 is connected with the cathode of a diode D6, the anode of a diode D6 is connected with a power supply, pins B7 and A7 of the Type-C connector chip are respectively connected with pin 4 of a capacitance protection device, pins B6 and A6 of the Type-C connector chip are respectively connected with pin 6 of the capacitance protection device, pin 4 of the capacitance protection device is connected with pin 3, pin 6 of the capacitance protection device is connected with pin 1, pin 2 of the capacitance protection device is grounded, pin 5 of the capacitance protection device is connected with the power supply, pins 1 and 3 of the capacitance protection device are respectively connected with pins 8 and 7 of the Ethernet chip, the first end of a resistor R47 is connected with the power supply, and the second end is connected with pin 11 of the Ethernet chip, pins 9, 12, 16, 23 of the ethernet chip are connected to V10-T, V10-T is connected to first ends of capacitors C10, and C10, respectively, second ends of capacitors C10, and C10 are grounded, pins 10, 13, and 1 of the ethernet chip are connected to resistor R10, a first end of resistor R10, and VCC 10, a second end of resistor R10 is connected to pin 14 of the ethernet chip, a second end of resistor R10 is connected to pin 18 of the ethernet chip, a second end of resistor R10 is connected to pin 19 of the ethernet chip, a VCC 10 interface is connected to capacitors C10, a first end of a capacitor X3621 of the capacitor X10, a second end of the capacitor X10 is connected to ground, and a capacitor X364, the 3 rd terminal of the crystal oscillator X3 is connected to the first terminal of the capacitor C47 and the pin 22 of the ethernet chip, the second terminal of the capacitor C46 is grounded, the second terminal of the capacitor C47 is grounded and connected to the pin 25 of the ethernet chip and the first terminal of the resistor R46, the second terminal of the resistor R46 is connected to the pin 24 of the ethernet chip, the pin 18 of the ethernet chip is connected to the pin 5 of the flash chip, the pin 17 of the ethernet chip is connected to the first terminal of the resistor R17, the second terminal of the resistor R17 is connected to the pin 2 of the indicator chip LED2, the pin 6 of the ethernet chip is grounded, the pins 2, 3, 4, and 5 of the ethernet chip are connected to the pins 117, 118, 120, and 121 of the switch chip RTL83 8367S-CG, the pin 3, 7, and 8 of the flash chip U8 are powered, the pin 4 of the flash chip U8 is grounded, the pin 8 of the flash chip U8 is connected to the first terminal of the capacitor C38, and the second terminal of the capacitor C38 is connected to the ground, pins 5 and 6 of the flash memory chip U8 are connected to pins 17 and 18 of the Ethernet chip, respectively, and pin 1 of the flash memory chip U8 is connected to pin 15 of the Ethernet chip.

As shown in fig. 11 and 13, the power management circuit includes a power management chip TP5000-QFN16, a power indication lamp LED4, a resistor R20, a resistor R21, a resistor R22, a resistor R23, a resistor R24, a capacitor C22, a capacitor C33, a capacitor C20, a capacitor C19, a diode D1, an inductor L5, a switch SW1, a resistor R33, a diode D3, a switch Q1, a switch SW2, a capacitor C24, a capacitor C25, a DC-DC chip U4, an inductor L6, a diode D2, a resistor R29, a resistor R30, a capacitor C26, and a capacitor C27. The first ends of a capacitor C22 and a capacitor C33 are grounded, the second ends of a capacitor C22 and a capacitor C33 are connected with pins 16, 1 and 2 of a power management chip and a power supply, pins 17, 11, 6 and 7 of the power management chip are grounded, a pin 13 of the power management chip is connected with the first end of a switch SW1, the second end of the switch SW1 is connected with the power supply, a pin 12 of the power management chip is grounded through a resistor 20, a pin 10 of the power management chip is grounded through a capacitor C20, a pin 9 of the power management chip is grounded through a capacitor C21, a pin 8 and a pin 9 of the power management chip are respectively connected with two ends of a resistor R22 and a resistor R24, a pin 8 of the power management chip is connected with the first end of the capacitor C19, the second end of the capacitor C19 is grounded, pins 3 and 4 of the power management chip are connected with the cathode of a diode D1, the anode of a diode D1 is grounded, a pin 3 and a pin of the power management chip are connected with the other terminals of the power management chip respectively, 4. 5 is connected to a first end of an inductor L5, a second end of the inductor L5 is connected to a pin 8 of a power management chip, a pin 16 of the power management chip is connected to a first end of a resistor R23, a second end of the resistor R23 is connected to pins 3 and 5 of a power indicator chip, pins 15 and 14 of the power management chip are connected to pins 4 and 6 of the power indicator chip, a pin 2 of the power indicator chip is connected to a first end of a resistor R21, a second end of the resistor R21 is grounded, a pin 1 of the power indicator chip is connected to a power supply, a first end of a resistor R33 is grounded, a second end of a resistor R33 is connected to the power supply, a second end of a resistor R33 is connected to an anode of a diode D3, a second end of a resistor R45 is connected to a base of a switch Q1, a drain of a switch Q1 is connected to a cathode of a diode D3, an emitter of the switch Q1 is connected to a pin 9 of the power management chip, a cathode of a diode D3 is connected to a pin 2 of a switch SW2, pin 3 of switch SW2 is connected to first terminals of capacitor C24 and capacitor C25, first terminals VIN of capacitor C24 and capacitor C25, second terminals of capacitor C24 and capacitor C25 are grounded, capacitor C24, a first end of a capacitor C25 is connected to a first end of an inductor L6, a first end of a capacitor C25 is connected to pins 4 and 5 of a DC-DC chip U4, a second end of the inductor L6 is connected to pin 1 of the DC-DC chip U4, pin 2 of a DC-DC chip U4 is grounded, a second end of the inductor L6 is connected to the anode of a diode D2, the cathode of a diode D2 is connected to a first end of a resistor R29, a second end of a resistor R29 is connected to pin 3 of the DC-DC chip U4, pin 3 of the DC-DC chip U4 is connected to the first end of a resistor R30, a second end of the resistor R30 is grounded, a first end of the capacitor C26 and the capacitor C27 is connected to a power supply, and second ends of the capacitors C26 and C27 are grounded.

As shown in fig. 12 and 13, the controller circuit includes a processor chip STM8S003F3U6TR, an indication lamp LED6, an indication lamp LED3, an indication lamp LED4, a resistor R28, a resistor R27, a resistor R48, a resistor R49, a resistor R50, a resistor R51, a resistor R53, a resistor R54, a resistor R55, a resistor R56, a resistor R57, a resistor R58, a capacitor C7, a capacitor C6, and pin header chips GP26-2520 WV-4P. A first end of the resistor R27 is connected to a pin 8 of the connector chip 744410001, a second end of the resistor R27 is connected to a pin 10 of the processor chip, pins 8 and 9 of the processor chip are connected to pins 4 and 5 of the connector chip 744410001, respectively, a pin 7 of the processor chip is connected to a pin 4 of the indicator chip LED6, a pin 6 of the processor chip is connected to the power supply and a first end of the resistor R3, a second end of the resistor R3 is connected to a pin 1 of the processor chip, a second end of the resistor R3 is further connected to a first end of the capacitor C7, a second end of the capacitor C7 is grounded and connected to a pin 4 of the processor chip and a first end of the capacitor C6, a second end of the capacitor C6 is connected to a pin 5 of the processor chip, pins 14, 16 and 17 of the processor chip are connected to a pin R58, a pin R57 and a first end of the resistor R38, respectively, and second ends of the resistors R58, R57 and R56 are connected to a pin 3 of the indicator chip LED3, 4. 6, pins 18, 19 and 20 of the processor chip are respectively connected with first ends of a resistor R55, a resistor R54 and a resistor R53, second ends of the resistor R55, the resistor R54 and the resistor R53 are respectively connected with pins 2, 4 and 6 of an indicating lamp chip LED4, pins 1, 3 and 5 of an indicating lamp chip LED3 are connected with a power supply, pins 1, 3 and 5 of an indicating lamp chip LED4 are connected with a power supply, a pin 13 of the processor chip is connected with a pin 86 of the switch chip, a pin 12 of the processor chip is connected with a first end of a resistor R48, a second end of the resistor R48 is connected with a first end of a resistor R50, a second end of the resistor R50 is connected with a power supply, a pin 11 of the processor chip is connected with a first end of a resistor R49, a second end of the resistor R49 is connected with a first end of a resistor R51, a second end of the resistor R51 is connected with a power supply, a pin 15 of the processor chip is connected with a pin 1 of the pin bank chip, and a pin 2 of the pin bank chip is connected with a pin bank, pin 3 of the pin header chip is grounded.

In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.