阅读说明：本技术 一种自适应储热高导热模块锁紧装置 (Self-adaptive heat storage high-heat-conduction module locking device ) 是由 董进喜 赵亮 杨明明 吴波 周尧 赵航 于 2021-09-08 设计创作，主要内容包括：本发明提供了一种自适应储热高导热模块锁紧装置,包括锁紧条和压力杆,所述锁紧条包括依次连接的楔形块A、楔形块B、楔形块C,所述楔形块A、楔形块B、楔形块C的相对两侧壁上均开设两端贯通的用于安装所述压力杆的凹槽；所述楔形块A、楔形块B、楔形块C的内部均开设温控形变腔,所述温控形变腔内填充相变材料。本发明在满足锁紧模块安装功能的基础上,还能够自适应地处理电子设备内短时高热量冲击和高导热性能的应用需求。(The invention provides a locking device of a self-adaptive heat storage high-heat-conductivity module, which comprises a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B and a wedge block C which are sequentially connected, and grooves which are communicated with two ends and used for installing the pressure rod are respectively formed in two opposite side walls of the wedge block A, the wedge block B and the wedge block C; temperature control deformation cavities are formed in the wedge blocks A, the wedge blocks B and the wedge blocks C, and phase change materials are filled in the temperature control deformation cavities. The invention can also adaptively process the application requirements of short-time high heat impact and high heat conductivity in the electronic equipment on the basis of meeting the installation function of the locking module.)

1. A locking device of a self-adaptive heat storage high-heat-conductivity module comprises a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B and a wedge block C which are sequentially connected, and is characterized in that grooves which are communicated with each other at two ends and used for mounting the pressure rod are formed in two opposite side walls of the wedge block A, the wedge block B and the wedge block C; temperature control deformation cavities are formed in the wedge blocks A, the wedge blocks B and the wedge blocks C, and phase change materials are filled in the temperature control deformation cavities.

2. The locking device of the adaptive heat-storage high-heat-conductivity module as claimed in claim 1, wherein the width of the groove is 0.25-0.5mm larger than the diameter of the pressure rod.

3. The locking device of the self-adaptive heat-storage high-heat-conductivity module as claimed in claim 1, wherein the phase-change temperature of the phase-change material is in the range of 45-60 ℃, and the volume expansion coefficient of the phase change material is not lower than 3%.

4. The locking device of the self-adaptive heat-storage high-heat-conduction module as claimed in claim 1, wherein the central offsets of the groove opening positions on the wedge block a and the wedge block C and the groove opening position on the wedge block B are respectively 0.25-0.5 mm.

5. The locking device of the self-adaptive heat-storage high-heat-conductivity module as claimed in claim 1, wherein the openings of the temperature-controlled deformation cavity are respectively formed on the upper bottom surfaces of the trapezoidal structures of the wedge block A, the wedge block B and the wedge block C.

6. The locking device of the adaptive heat-storage high-heat-conductivity module as claimed in claim 5, wherein a memory alloy layer covers the opening of the temperature-controlled deformation chamber.

7. The locking device of the adaptive heat-storage high-thermal-conductivity module according to claim 6, wherein the memory alloy layer is waved at normal temperature.

8. The locking device of the self-adaptive heat-storage high-heat-conduction module as claimed in claim 1, further comprising an upper limiting plate and a lower limiting plate, wherein the upper limiting plate and the lower limiting plate are respectively installed at two ends of the locking bar and used for limiting the pressure rod.

9. The locking device of the self-adaptive heat-storage high-heat-conduction module as claimed in claim 8, wherein an elastic spring is further arranged between the lower limiting plate and the bottom of the wedge block C.

10. The locking device of the adaptive heat-storage high-heat-conductivity module as claimed in claim 8, further comprising a locking screw, wherein the upper limiting plate is fixed on the top end of the wedge block A by the locking screw and provides a locking force.

Technical Field

The disclosure relates to a heat dissipation structure technology of electronic equipment, in particular to a locking device of a self-adaptive heat storage high-heat-conductivity module.

Background

With the development of electronic equipment towards high performance and high integration, the heat transfer efficiency of the structure directly affects the temperature rise of devices in the electronic equipment, and further determines the service life and reliability of the electronic equipment.

Currently, most of the modules in electronic equipment are installed in a field replaceable module (LRM), and the typical heat transfer path is components > printed board/module cold board > guide rail > cabinet > ambient air. The link of the printed board/module cold board > guide rail is the bottleneck of heat transfer in the electronic equipment. In the link of printed board/module cold board > guide rail, a locking bar device is usually adopted for locking and installation. The traditional locking strip structure only plays a role of locking the module, has limited heat conduction capability and greatly limits the transmission and the dissipation of heat in the electronic equipment. The electronic equipment with complex working conditions and large heat quantity has urgent requirements on short-time heat storage and high heat conduction. The existing locking strip structure is difficult to meet the application requirement.

Disclosure of Invention

In view of this, the embodiments of the present disclosure provide a locking device for an adaptive heat-storage high-thermal-conductivity module, which can satisfy the application requirements of adaptively handling short-time high thermal shock and high thermal conductivity in an electronic device, in addition to the function of installing the locking module.

In order to achieve the above purpose, the invention provides the following technical scheme:

a locking device of a self-adaptive heat storage high-heat-conductivity module comprises a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B and a wedge block C which are sequentially connected, and two opposite side walls of the wedge block A, the wedge block B and the wedge block C are respectively provided with a groove with two through ends for mounting the pressure rod; temperature control deformation cavities are formed in the wedge blocks A, the wedge blocks B and the wedge blocks C, and phase change materials are filled in the temperature control deformation cavities.

Further, the width of the groove is 0.25-0.5mm larger than the diameter size of the pressure rod.

Furthermore, the phase change temperature of the phase change material is in the range of 45-60 ℃, and the volume expansion coefficient of phase change is not lower than 3%.

Further, the central offset between the groove opening positions on the wedge block A and the wedge block C and the groove opening position on the wedge block B is 0.25-0.5mm respectively.

Furthermore, the orifices of the temperature-controlled deformation cavity are respectively arranged on the upper bottom surfaces of the trapezoidal structures of the wedge block A, the wedge block B and the wedge block C.

Furthermore, a memory alloy layer covers the opening of the temperature-controlled deformation cavity.

Further, the memory alloy layer is in a wave shape at normal temperature.

Further, still include spacing board and lower limiting plate on, it installs respectively to go up spacing board and lower limiting plate the both ends of locking strip are used for right the pressure lever carries on spacingly.

Furthermore, an elastic reed is arranged between the lower limiting plate and the bottom of the wedge block C.

Further, the wedge-shaped block A further comprises a locking screw, the upper limiting plate is fixed to the top end of the wedge-shaped block A through the locking screw, and locking force is provided.

The self-adaptive heat storage high-heat-conductivity module locking device provided by the invention not only ensures the locking function in the module installation process, but also can meet the application requirements of self-adaptively processing short-time high-heat impact and high-heat-conductivity in electronic equipment, and has the advantages of reasonable structural design, comprehensive functions and excellent performance.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a view of an apparatus assembly according to an embodiment of the present invention;

FIG. 2 is a side view of an apparatus mounting structure in accordance with an embodiment of the present invention;

FIG. 3 is another side view of a device mounting structure in accordance with an embodiment of the present invention;

FIG. 4 is a cross-sectional view of a wedge A detail in one embodiment of the invention;

FIG. 5 is a view of a portion 1-1 of wedge block A of FIG. 4;

FIG. 6 is a cross-sectional view of a wedge block B component in one embodiment of the invention;

FIG. 7 is a cross-sectional view of a wedge block C component in one embodiment of the invention;

FIG. 8 is a top plan view of the end face of a device mounting structure in accordance with one embodiment of the present invention.

Detailed Description

The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

The embodiments of the present disclosure are described below with specific examples, and other advantages and effects of the present disclosure will be readily apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. The disclosure may be embodied or carried out in various other specific embodiments, and various modifications and changes may be made in the details within the description without departing from the spirit of the disclosure. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present disclosure, and the drawings only show the components related to the present disclosure rather than the number, shape and size of the components in actual implementation, and the type, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.

The present invention is described in further detail with reference to fig. 1-8.

As shown in fig. 1, the embodiment of the present disclosure provides a locking device for a self-adaptive heat storage high thermal conductivity module, which includes a locking bar and a pressure rod 4, wherein the locking bar includes a wedge block a1, a wedge block B2, and a wedge block C3, which are connected in sequence, and further includes an upper limiting plate 5, an elastic spring 6, a lower limiting plate 7, and a locking screw 8.

As shown in fig. 2 and 3, the wedge block a1, the wedge block B2 and the wedge block C3 are respectively wedge-shaped structures with trapezoidal side surfaces, and two opposite side walls thereof are respectively provided with a groove 10 with two through ends for mounting the pressure rod 4; temperature control deformation cavities 9 are formed in the wedge blocks A1, B2 and C3, and phase-change materials 11 are filled in the temperature control deformation cavities 9. In this embodiment, for the setting that sets up the cavity of installing the pressure lever in traditional structure in the locking strip surface center department, this embodiment has seted up the recess on two relative lateral walls of locking strip for install the pressure lever, has seted up control by temperature change shape chamber 9 in wedge A1, wedge B2, wedge C3 inside simultaneously, makes wedge A1, wedge B2, wedge C3 produce the position skew through pressure lever 4 and realize the basic locking function of locking strip, through the phase change material 11 heat absorption phase transition in control by temperature change shape chamber 9 realizes the self-adaptation heat-retaining function when high heat strikes in short-term. And the phase change material 11 absorbs heat to generate phase change, and the phase change material 11 absorbs heat to generate volume expansion through the temperature control deformation cavity 9, so that the locking gap is filled to realize high heat conduction performance of heat transfer of the locking strip.

In practice, in order to facilitate the adjustment operation of the pressure bar in the groove, in a preferred embodiment of the present embodiment, the width of the groove 10 is 0.25-0.5mm larger than the diameter of the pressure bar 4, so that the wedge block a1, the wedge block B2 and the wedge block C3 ensure that the pressure bar 4 can have enough adjustment space within the limit of the groove 10 during the locking process.

The phase change temperature of the phase change material 11 is in the range of 45-60 ℃, and the volume expansion coefficient of phase change is not lower than 3%. The phase change material 11 absorbs and stores heat in this temperature range. The locking gap is filled by volume expansion after phase change, and high heat conduction and heat transfer performance is realized.

In the mounting structure of locking strip, wedge A with wedge C's trapezoidal mounting structure with wedge B's trapezoidal mounting structure opposite direction, consequently, wedge A with the position is seted up to recess on the wedge C with the central offset that the position was seted up to recess on the wedge B is 0.25-0.5mm respectively, realizes that the locking strip does in the locking process wedge A1, wedge B2, wedge C3 can provide enough locking skew demands.

As shown in fig. 4-7, the openings of the temperature-controlled deformation cavity 9 are respectively formed in the upper bottom surfaces of the trapezoidal structures of the wedge block a1, the wedge block B2 and the wedge block C3. Because the upper bottom surface is one side of the locking strip where the wedge block A1, the wedge block B2 and the wedge block C3 are locked to generate the heat transfer gap, the cavities of the temperature control deformation cavity 9 are respectively arranged on the respective upper bottom surfaces, so that when the phase change material 11 generates volume expansion due to phase change, the heat transfer gap is filled through the cavities of the upper bottom surfaces, and the high heat conduction performance of the phase change material is ensured.

In a preferred embodiment of this embodiment, the opening of the temperature-controlled deformation chamber 9 is covered with a memory alloy layer 12 for sealing the phase-change material 11 in the temperature-controlled deformation chamber 9. Further preferably, as shown in fig. 5, the memory alloy layer 12 has a wave shape at normal temperature, and the volume of the phase change material 11 relatively decreases and increases during the phase change transformation of solidification and liquefaction, and the memory alloy layer 12 is required to have a decrease and increase change of the surface area during the sealing. Therefore, the surface area of the memory alloy layer 12 can be adjusted by adopting a wave-shaped design.

In the locking device of this embodiment, still include spacing board 5 and spacing board 7 down, it installs respectively to go up spacing board 5 and spacing board 7 down the both ends of locking strip are used for right pressure pole 4 carries on spacingly. And an elastic spring 6 is arranged between the lower limiting plate 7 and the bottom of the wedge block C3 and is used for providing reaction force in the locking and unlocking process of the locking strip to facilitate the disassembly. And a locking screw 8 is further included, as shown in fig. 8, the upper limiting plate 5 is fixed at the top end of the wedge block a1 through the locking screw 8, and a locking force is provided.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.