阅读说明：本技术 一种枝叶密布型沟槽分布的研磨垫及研磨装置 (Grinding pad and grinding device with densely distributed branches and leaves and grooves ) 是由 唐强 蒋锡兵 于 2021-10-20 设计创作，主要内容包括：本发明涉及研磨垫技术领域,具体涉及一种枝叶密布型沟槽分布的研磨垫及研磨装置。枝叶密布型沟槽分布的研磨垫包括研磨垫本体,研磨垫本体的表面开设有：圆环沟槽,位于研磨垫本体的中心区域；N级树枝沟槽,N≧2；第一级树枝沟槽设有多条且沿圆环沟槽的周向均布,其一端与圆环沟槽连通,另一端延伸至研磨垫本体的边缘；第二级树枝沟槽至第N级树枝沟槽皆对应上一级树枝沟槽设置,且其一端与上一级树枝沟槽的中部区域连通,另一端延伸至研磨垫本体的边缘。本发明提供的枝叶密布型沟槽分布的研磨垫,能够在研磨垫本体的边缘区域形成更为密集的沟槽,从而在研磨垫本体的边缘区域填充更多的研磨液,以此抵消边界效应产生的研磨垫磨平现象。(The invention relates to the technical field of grinding pads, in particular to a grinding pad with densely distributed branches and leaves and grooves and a grinding device. The grinding pad that branch and leaf densely covered type slot distributes includes the grinding pad body, and the surface of grinding pad body has seted up: the circular groove is positioned in the central area of the grinding pad body; n grade branch grooves, wherein N is not less than 2; the first-stage branch grooves are uniformly distributed along the circumferential direction of the circular ring grooves, one end of each first-stage branch groove is communicated with the circular ring grooves, and the other end of each first-stage branch groove extends to the edge of the grinding pad body; second level branch slot to Nth level branch slot all correspond last level branch slot setting, and its one end and the regional intercommunication in middle part of last level branch slot, the other end extends to the edge of grinding pad body. The grinding pad with densely distributed branches and leaves has the advantages that the denser grooves can be formed in the edge area of the grinding pad body, so that more grinding liquid is filled in the edge area of the grinding pad body, and the grinding phenomenon of the grinding pad caused by the boundary effect is counteracted.)

1. The utility model provides a branch and leaf densely distributed type slot distribution's grinding pad, includes grinding pad body (10), its characterized in that, the surface of grinding pad body (10) has been seted up:

an annular groove (11) located in a central region of the polishing pad body (10);

n grade branch grooves, wherein N is not less than 2;

the first-stage branch grooves (12) are uniformly distributed along the circumferential direction of the circular ring groove (11), one end of each first-stage branch groove is communicated with the circular ring groove (11), and the other end of each first-stage branch groove extends to the edge of the grinding pad body (10); second level branch slot (13) all correspond last level branch slot setting to Nth level branch slot, and its one end and the regional intercommunication in middle part of last level branch slot, the other end extends to the edge of grinding pad body (10).

2. The pad as claimed in claim 1, wherein the first-stage grooves (12) are in the shape of wavy curves.

3. The polishing pad with densely distributed branches and leaves according to claim 2, wherein the second to nth branch grooves (13, N) are arc-shaped.

4. The polishing pad with densely distributed branches and leaves as claimed in claim 2, wherein the number of the first-stage branch grooves (12) is 8-12.

5. The pad of claim 4, wherein N is less than or equal to 5.

6. The grinding pad with densely distributed branches and leaves and grooves as claimed in any one of claims 1 to 5, wherein the surface of the grinding pad body (10) is further provided with:

and the concentric groove (15) is circular and is arranged concentrically with the circular groove (11).

7. The polishing pad with densely distributed branches and leaves according to claim 6, wherein the concentric grooves (15) are formed in the central region and the edge region of the polishing pad body (10), and the number of the two regions is 3-5.

8. The pad of claim 7, wherein the concentric grooves (15) are further distributed between a central region and an edge region of the pad body (10).

9. The pad according to claim 8, wherein the distance between two adjacent concentric grooves (15) between the central region and the edge region of the pad body (10) increases radially outward, and the distance between the concentric grooves (15) in the edge region and the central region of the pad body (10) is smaller than the distance between the concentric grooves (15) in the two regions.

10. A grinding apparatus, comprising:

a grinding table (20);

the polishing pad according to any one of claims 1 to 9, which is fixed to the surface of a polishing platen (20).

Technical Field

The invention relates to the technical field of grinding pads, in particular to a grinding pad with densely distributed branches and leaves and grooves and a grinding device.

Background

CMP (chemical mechanical polishing) is a process that uses chemical etching and mechanical forces to planarize silicon wafers or other substrate materials. The polishing pad is a common consumable material in CMP, and is made of multiple layers of rubber, and the surface of the polishing pad is made of polyurethane fiber. When the grinding head is used, the grinding pad is adhered to the grinding platform, a silicon wafer or other workpieces to be processed are arranged on the lower surface of the grinding head, then the grinding head is pressed down to the upper surface of the grinding pad, and grinding is carried out through relative rotation of the grinding head and the grinding pad.

The pressure and relative rotation of the grinding head on the surface of the grinding pad can cause loss on the surface of the grinding pad, and the edge of the grinding pad is easy to form a boundary effect due to the stress condition, the motion condition, the abrasive particle aggregation phenomenon and the like of the edge of a workpiece, so that the loss is increased by the boundary effect, and a part of complex products can be generated in the edge groove of the grinding pad at the last stage, thereby causing product defects to a certain degree on a silicon wafer or other workpieces to be processed.

Disclosure of Invention

Therefore, the present invention is directed to overcome the defect in the prior art that the edge loss of the polishing pad is large at the later stage of polishing, which may generate a complex product affecting the product quality, and thereby provide a polishing pad and a polishing apparatus with densely-distributed grooves having branches and leaves, which can counteract the boundary effect.

In order to solve the above technical problems, the polishing pad with densely distributed branches and leaves provided by the present invention comprises a polishing pad body, wherein the surface of the polishing pad body is provided with:

the annular groove is positioned in the central area of the grinding pad body;

n grade branch grooves, wherein N is not less than 2;

the first-stage branch grooves are uniformly distributed along the circumferential direction of the circular ring grooves, one end of each first-stage branch groove is communicated with the circular ring grooves, and the other end of each first-stage branch groove extends to the edge of the grinding pad body; second level branch slot to Nth level branch slot all correspond last level branch slot setting, and its one end and the regional intercommunication in middle part of last level branch slot, the other end extends to the edge of grinding pad body.

Optionally, the first-stage branch grooves are in a wave curve shape.

Optionally, the second-level branch trench to the nth-level branch trench are arc-shaped.

Optionally, the number of the first-stage branch grooves is 8-12.

Optionally, N is less than or equal to 5.

Optionally, the surface of the polishing pad body is further provided with:

the concentric groove is circular and concentric with the circular groove.

Optionally, the concentric grooves are formed in the central area and the edge area of the polishing pad body, and the number of the two areas is 3-5.

Optionally, the concentric grooves are further distributed between a central region and an edge region of the polishing pad body.

Optionally, the distance between two adjacent concentric grooves located between the central region and the edge region of the polishing pad body increases along the radial direction, and the distance between the concentric grooves of the edge region and the central region of the polishing pad body is smaller than the distance between the concentric grooves of the two regions.

The present invention also provides a grinding apparatus comprising:

a grinding platform;

the polishing pad is fixed on the surface of the polishing platform.

The technical scheme of the invention has the following advantages:

1. according to the grinding pad with densely-distributed branches and leaves, provided by the invention, N-level branch grooves are formed on the surface of the grinding pad body, one ends of the branch grooves are communicated with the annular grooves, the other ends of the branch grooves extend to the edge of the grinding pad body, and more dense grooves can be formed in the edge area of the grinding pad body, so that more grinding liquid is filled in the edge area of the grinding pad body, the uniform grinding rate can be kept at the final stage of grinding, the grinding pad flattening phenomenon generated by the boundary effect is counteracted, the depth of the grooves from the middle to the edge of the grinding pad at the final stage of grinding is consistent, the probability of the appearance of a double product is effectively reduced, and the product yield is improved.

2. According to the grinding pad with densely-distributed branches and leaves and grooves, the concentric grooves are formed in the surface of the grinding pad body, and the positions and the number of the concentric grooves can be set adaptively according to the requirements of the grinding process of an actual product, so that the grinding pad is suitable for different process requirements.

3. The polishing apparatus of the present invention has any one of the above advantages because it has the polishing pad.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic view of a first embodiment of a polishing pad according to the present invention;

FIG. 2 is a schematic diagram of a second embodiment of a polishing pad according to the present invention;

FIG. 3 is a schematic view of a third embodiment of a polishing pad according to the present invention;

FIG. 4 is a schematic structural diagram of a second polishing apparatus according to an embodiment of the present invention.

Description of reference numerals:

10. a polishing pad body; 11. a circular ring groove; 12. a first level branch trench; 13. a second level branch trench; 14. a third level branch trench; 15. a concentric groove; 20. a grinding platform.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Example one

Referring to fig. 1 to 3, the present embodiment provides a polishing pad with densely-distributed branches and leaves, which includes a polishing pad body 10, wherein a circular groove 11 and N-level branch grooves are formed on a surface of the polishing pad body 10.

The annular groove 11 is located in the central region of the polishing pad body 10. As will be clear to those skilled in the art, the polishing pad body 10 is circular, and the annular groove 11 is located in the central region thereof, i.e., concentric with the polishing pad body 10.

N grade branch grooves, wherein N is not less than 2; as is clear to the person skilled in the art, N is an integer.

The first-stage branch grooves 12 are uniformly distributed along the circumferential direction of the circular groove 11, one end of each first-stage branch groove is communicated with the circular groove 11, and the other end of each first-stage branch groove extends to the edge of the grinding pad body 10; second level branch slot 13 all corresponds last level branch slot setting to nth level branch slot, and its one end and the regional intercommunication in middle part of last level branch slot, and the other end extends to the edge of grinding pad body 10. The "plurality" means ≧ 3. The branch groove is a strip groove structure, and can be a straight line or a curved line. The term "corresponds to the upper branch trench" means that at least one branch trench is provided corresponding to each upper branch trench, for example, 8 first branch trenches 12 are provided, and the second branch trenches 13 may correspond to the first branch trenches 12 one by one, and are also provided as 8; or two-to-one, namely 16 branch grooves 12 are arranged; or four of the first-level branch grooves 12 and the second-level branch grooves 13 are arranged in a one-to-one manner, and the remaining four first-level branch grooves 12 are arranged in a one-to-two manner, that is, the number of the second-level branch grooves 13 is 12. In fig. 1, N is 3, and 12 branch grooves are provided in each of the first-stage branch groove 12, the second-stage branch groove 13, and the third-stage branch groove 14.

The polishing pad of the embodiment can increase the groove density of the edge region of the polishing pad body 10, so that more polishing liquid is filled in the edge region, a uniform polishing rate can be kept at the final stage of polishing, the polishing pad flattening phenomenon generated by the boundary effect is counteracted, the depth of the groove from the middle to the edge of the polishing pad at the final stage of polishing is consistent, the probability of the appearance of a double product is effectively reduced, and the yield of products is improved.

As a preferred shape of the primary branch cannelure 12, the primary branch cannelure 12 is in the form of a wave curve. The wave-shaped curve can effectively delay the time of grinding chemical liquid thrown away due to centrifugal force when the grinding turntable rotates at high speed, and waste is avoided. Of course, in other embodiments, the first level branch cannelure 12 may be formed in other shapes such as a straight line or an arc.

As a preferred shape of the second-level branch trench 13, the second-level branch trenches 13 to the Nth-level branch trenches are arc-shaped. The arc shape can also delay the time of throwing away the grinding chemical liquid to a certain extent, and the processing is convenient and the spatial arrangement is easier. Of course, in other embodiments, the second level branch grooves 13 may be arranged in a straight line or other curved shapes.

Preferably, the number of the first-stage branch grooves 12 is 8-12, and specifically, the number of the first-stage branch grooves can be 8, 10 or 12.

Preferably, N is less than or equal to 5, and can be 2, 3, 4 or 5.

As a further improvement of the above technical solution, the surface of the polishing pad body 10 is further provided with:

the concentric groove 15 is circular and is disposed concentrically with the circular groove 11.

In practice, the location and number of concentric grooves 15 are determined according to product process requirements. For example, when the edge area of the product needs to be ground more, and the middle area needs to be ground less, the concentric grooves 15 may be opened in the edge area of the polishing pad body 10, and the number of the grooves is 3 to 5, specifically 3, 4, or 5, as shown in fig. 2; when there is no special polishing requirement, the concentric grooves 15 can be distributed on the whole surface of the polishing pad body 10, so that the polishing chemical liquid can achieve uniform effect on the whole, as shown in fig. 3; when less grinding is required towards the edge of the product, the concentric grooves 15 can be distributed on the whole surface of the polishing pad body 10, and the distance between two adjacent concentric grooves 15 increases outwards in the radial direction, so that the process requirement that the grinding is less towards the edge of the product can be met. In addition, multiple circles of concentric grooves 15 may be provided in the center region of the polishing pad in order to allow the polishing chemistry to stay for a longer period of time in the center region of the polishing pad.

Example two

As shown in fig. 4, the present embodiment provides a polishing apparatus, including:

a grinding table 20;

the polishing pad is fixed on the surface of the polishing platen 20.

In particular, the polishing pad is preferably affixed to the polishing platen 20.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.