阅读说明：本技术 一种高性能的轻量化环氧灌封材料 (High-performance lightweight epoxy potting material ) 是由 张福强 闫怀洁 李志鹏 秦治远 殷福星 于 2021-11-05 设计创作，主要内容包括：本发明为一种高性能的轻量化环氧灌封材料。该灌封材料是将有机组分环氧树脂、稀释剂、固化剂、促进剂和硅烷偶联剂,以及无机填料,室温下复合、灌封,于40～60℃下完成固化。通过无机填料降低灌封材料固化后的密度。本发明通过表面处理的漂珠、空心玻璃微珠降低环氧灌封材料的密度,满足特殊行业、特殊领域保护电子元器件、电子元器件组合的性能需求。(The invention relates to a high-performance light-weight epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler at room temperature, and curing is completed at 40-60 ℃. The density of the potting material after curing is reduced by the inorganic filler. The invention reduces the density of the epoxy encapsulating material through the floating beads and the hollow glass beads which are subjected to surface treatment, and meets the performance requirements of protecting electronic components and electronic component combinations in special industries and special fields.)

1. A high-performance light-weight epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components and inorganic filler at room temperature and curing at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises bisphenol A type epoxy resin, a diluent, a curing agent and an accelerator. The common epoxy resin is one or two of bisphenol A type epoxy resins E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, the accelerator is 2, 4, 6-tri (dimethylaminomethyl) phenol, and the coupling agent is one or two of epoxy silane 3- (2, 3-glycidoxy) propyl trimethoxy silane, 3- (2, 3-glycidoxy) propyl triethoxy silane and 2- (3, 4-epoxycyclohexyl) ethyl trimethoxy silane.

2. The inorganic filler according to claim 1, which is one or both of floating beads and hollow glass beads, and has a density of 0.25 to 0.60g/cm³。

Technical Field

The present invention relates to a potting material for electronic components, and more particularly to an organic/inorganic composite epoxy resin potting material.

Background

The epoxy resin is used for encapsulating the electronic components, so that air, moisture and carbon dioxide can be blocked, the working environment of the electronic components, the electronic component combination and the circuit board is improved, the service life of the components is prolonged, the stability of the electronic components in the transportation and use processes can be improved, and the electronic components, the electronic component combination and the circuit board are prevented from being damaged by mechanical force such as oscillation and impact. However, epoxy potting materials with good mechanical properties and protective properties and low density are required in some special industries and application fields.

CN105229078 discloses an epoxy casting resin system with good resistance to water, salt spray, inorganic acids, bases and most organic solvents. The epoxy resins have low viscosity while maintaining advantageous physical, thermal and electrical properties. The epoxy casting resin system can be used for at least partially covering electronic components or devices, the thermal conductivity of the epoxy casting resin system is improved by 24 percent compared with that of the similar products in the market, and the physical performance of the cured epoxy resin is improved by 10 to 20 percent. The resin system is divided into a resin part (part a) and a hardener part (part B) which are mixed together to start the reaction. Bisphenol F epoxy resin, butyl glycidyl ether, epoxy carbon black dispersoid, alumina, phosphonium salt, aluminum hydroxide and ammonium polyphosphate are used as a part A, and polyethylene glycol diamine and polyamine blend is used as a part B. The epoxy resin and hardener are mixed together to form a resin, which is poured into a container to cure. The mixed resin was then cured at 60 ℃ for 2 hours. The bisphenol F epoxy resin with higher price is used in the patent, the mass usage amount of aluminum hydroxide is 9%, the mass usage amount of aluminum oxide is up to 54%, the inorganic material filler improves the resistance of a material system to environmental destruction factors, but the usage amount of the filler is too high, the basic mechanical property is not facilitated, and particularly, the density of the cured epoxy resin system is obviously increased.

CN 109161166 discloses a fast-curing low-shrinkage epoxy casting filler, wherein a component A and a component B are mixed and reacted according to the mass ratio of 10-15: 1, and the component A comprises 20-40 parts of epoxy resin, 5-15 parts of epoxy diluent, 0.5-1 part of auxiliary agent, 50-70 parts of filler and 3-5 parts of water; the component B comprises 80-92 parts of amine curing agent and 8-20 parts of calcium oxide. The system adopts a reaction stable curing agent and a self-heat release system, can be quickly cured without being influenced by external environment, has stable reaction of the curing agent, low heat release and small contraction, but adds a certain amount of water in the component A and a certain amount of calcium oxide in the component B. The added water is difficult to volatilize completely, and the added calcium oxide is used as an electrolyte, particularly exists in the form of an electrolyte in the presence of water, so that the normal operation of electronic components is not facilitated. Meanwhile, the active silicon micro powder with different particle sizes is used, the total using amount is more than 50 parts, and the density of the solidified material is obviously increased.

The invention discloses a high-performance light-weight epoxy potting material, and more particularly relates to an organic/inorganic composite epoxy resin potting material. The epoxy resin-epoxy resin composite material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler, and is compounded and encapsulated at room temperature, and the curing is completed at 40-60 ℃.

Disclosure of Invention

The invention aims to provide a high-performance light-weight epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler at room temperature, and curing is completed at 40-60 ℃. The density of the potting material after curing is reduced by the inorganic filler.

The technical scheme of the invention is as follows:

a high-performance light-weight epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components and inorganic filler at room temperature and curing at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises bisphenol A type epoxy resin, a diluent, a curing agent and an accelerator. The common epoxy resin is one or two of bisphenol A type epoxy resins E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, the accelerator is 2, 4, 6-tri (dimethylaminomethyl) phenol, and the coupling agent is one or two of epoxy silane 3- (2, 3-glycidoxy) propyl trimethoxy silane, 3- (2, 3-glycidoxy) propyl triethoxy silane and 2- (3, 4-epoxycyclohexyl) ethyl trimethoxy silane.

The inorganic filler is one or two of floating beads and hollow glass beads, and the density of the inorganic filler is 0.25-0.60 g/cm³。

The invention has the beneficial effects that:

(1) the high-performance light-weight epoxy potting material has lower density and good mechanical strength after being cured.

(2) The floating beads and the hollow glass beads have high insulativity and stable physical and chemical properties, and have no adverse effect on the normal work of electronic components.

(3) The floating beads and the hollow glass beads treated by the epoxy silane have improved hydrophobicity, and the epoxy silane participates in curing, so that the dispersion stability of the floating beads and the hollow glass beads is improved, and the improvement of mechanical properties is facilitated.

Detailed Description

The following is further illustrated with reference to examples:

example one

35 parts of 1000-mesh pyrophyllite powder, and an ethanol solution of 3- (2, 3-epoxypropoxy) propyl trimethoxy silane are uniformly mixed, and the mixture is dried for 48 hours at room temperature for use. 100 parts of epoxy resin E-51 and 20 parts of 1, 4-butanediol diglycidyl ether are added into a stirring tank to be stirred, 10 parts of coupling-treated floating beads are added, and 35 parts of polyamide 650 and 2 parts of 2, 4, 6-tris (dimethylaminomethyl) phenol are added after uniform stirring. Stirring, removing bubbles, bottling, and curing at 60 deg.C.

Determination of compressive strength and modulus of elasticity: the determination method is referred to GB/T2567-2008.

Density measurement: the determination method is referred to GB/T6343-2009.

Example two

The implementation steps are the same as those in the first embodiment, except that: the coupling treatment is changed from 10 parts of floating beads to 20 parts.

And (3) performance measurement: the method is the same as the first embodiment.

EXAMPLE III

The implementation steps are the same as example two, and the difference is that: the coupling-treated floating beads are changed into coupling-treated hollow glass beads.

And (3) performance measurement: the method is the same as the first embodiment.

Comparative example

The implementation steps are the same as those in the first embodiment, except that: the potting material is not added with inorganic filler.

And (3) performance measurement: the method is the same as the first embodiment.

Table attached properties and performance of the high performance lightweight epoxy potting material of the present invention

	Example one	Example two	EXAMPLE III	Comparative example
					Compressive strength/MPa	88.6	87.5	78.8	65.3
Modulus of elasticity/GPa	4.0	4.6	3.2	1.8
					Density g/cm3	0.90	0.78	0.77	1.04

While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The invention is not the best known technology.