阅读说明：本技术 一种高性能的环氧灌封材料 (High-performance epoxy potting material ) 是由 张福强 闫怀洁 李志鹏 秦治远 殷福星 于 2021-11-05 设计创作，主要内容包括：本发明为一种高性能的环氧灌封材料。该灌封材料是将有机组分环氧树脂、稀释剂、固化剂和促进剂,以及无机填料,二者室温下复合、灌封,于40～60℃下完成固化。本发明通过层状分散的高岭土,在高湿度、强紫外和高盐雾环境下提高环氧灌封材料对电子元器件、电子元器件组合、线路板的保护作用。固化物不含有害的挥发物,利于环保。(The invention relates to a high-performance epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator and an inorganic filler at room temperature, and curing is completed at 40-60 ℃. According to the invention, through the layered dispersed kaolin, the protection effect of the epoxy encapsulating material on electronic components, electronic component combinations and circuit boards is improved under the environments of high humidity, strong ultraviolet and high salt mist. The condensate does not contain harmful volatile matters, and is beneficial to environmental protection.)

1. A high-performance epoxy potting material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator and inorganic filler, wherein the organic components are compounded and potted at room temperature, and the curing is completed at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises common bisphenol A epoxy resin, polyfunctional epoxy resin, diluent, curing agent and accelerator. The bisphenol A type epoxy resin is one or two of E-51 and E-44, the multifunctional epoxy resin is one or two of tetra-functional epoxy resin N, N, N ', N ' -tetracyclooxypropyl-4, 4 ' -diaminodiphenylmethane, tetra-functional epoxy resin N, N, N ', N ' -tetra (ethylene oxide methyl) -1, 3-xylylenediamine and tri-functional epoxy resin 3- (2, 3-epoxy propoxy) -N, N-di (2, 3-epoxy propyl) aniline, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, and the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified aliphatic amine 593, the promoter is 2, 4, 6-tri (dimethylaminomethyl) phenol.

2. The inorganic filler according to claim 1, which is one or both of kaolin treated with a silane coupling agent and kaolin not treated with a coupling agent.

Technical Field

The present invention relates to potting materials for electronic components, and more particularly to a high performance epoxy potting material.

Background

The epoxy resin is used for encapsulating the electronic components, so that air, moisture and carbon dioxide can be blocked, the working environment of the electronic components, the electronic component combination and the circuit board is improved, the service life of the components is prolonged, the stability of the electronic components in the transportation and use processes can be improved, and the electronic components, the electronic component combination and the circuit board are prevented from being damaged by mechanical force such as oscillation and impact. However, the traditional epoxy resin encapsulating material has limited barrier property after curing, and electronic components, electronic component combinations and circuit boards are difficult to work normally under the environment of high temperature, high humidity, strong ultraviolet and high salt mist.

In order to overcome the defects that the existing epoxy casting resin is easy to absorb moisture in air in the construction process of casting a cylinder, so that tiny bubbles exist after a casting body is formed, partial discharge between coils is easy to generate, short-circuit breakdown is caused, and the service life of a transformer is shortened, CN 101812217 discloses a partial discharge resistant epoxy casting resin which comprises 2 components, is simple in production process, does not have three wastes in production, and does not pollute the environment. The component A comprises 20-30 parts of E39D type epoxy resin, 50-90 parts of CYD128 type epoxy casting resin, 3-10 parts of 594 type epoxy resin reactive diluent, 10-40 parts of semiconductor resin slurry and 800-1200-mesh SiO₂80-120 parts. The component B is 100-140 parts of methyl tetrahydrophthalic anhydride and 1000-mesh 1500-mesh SiO₂80-190 parts of N, N-dimethylbenzylamine, 0.1-1.5 parts of N, N-dimethylbenzylamine and 20-70 parts of hydroxyl-terminated liquid rubber. Because the component B contains hydroxyl-terminated liquid rubber, the effects of heat resistance, thermal oxygen resistance and ultraviolet aging resistance are not good enough.

CN105229078 discloses an epoxy casting resin system with good resistance to water, salt spray, inorganic acids, bases and most organic solvents. The epoxy resins have low viscosity while maintaining advantageous physical, thermal and electrical properties. The epoxy casting resin system can be used for at least partially covering electronic components or devices, and compared with similar products in the market, the thermal conductivity is improved by 24 percent, the electric conductivity is improved by 9.5 percent, and the physical property of the cured epoxy resin is improved by 10 to 20 percent. While the disclosed materials can achieve advantageous properties such as thermal conductivity through the use of non-alumina filled epoxy resins (e.g., using boron nitride), these are significantly more expensive. Thus, the disclosed materials are an economically efficient way to have improved properties over other epoxy resins in their class. The resin system is divided into a resin part (part a) and a hardener part (part B) which are mixed together to start the reaction. Bisphenol F epoxy resin, butyl glycidyl ether, epoxy carbon black dispersoid, alumina, phosphonium salt, aluminum hydroxide and ammonium polyphosphate are used as a part A, and polyethylene glycol diamine and polyamine blend is used as a part B. 5 to 10 percent by weight of polyethylene glycol diamine is used as a reactant in the system. The epoxy resin and hardener are mixed together to form a resin, which is poured into a container to cure. The mixed resin was then cured at 60 ℃ for 2 hours. The patent uses bisphenol F epoxy resin with higher price, the mass usage of aluminum hydroxide is 9 percent, the mass usage of aluminum oxide is up to 54 percent, and the inorganic material filler improves the resistance of a material system to environmental destruction factors, but the usage of the filler is too high, which is not beneficial to basic mechanical properties, such as compressive strength and impact strength. In addition, aluminum hydroxide and aluminum oxide exist in the form of particles or powder in the epoxy resin, and the efficiency of resistance to the destructive action of environmental factors is low.

The invention discloses a high-performance epoxy potting material, and particularly relates to an organic/inorganic composite epoxy resin potting material. The epoxy resin-epoxy resin composite material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator and an inorganic filler, wherein the organic components of the epoxy resin, the diluent, the curing agent, the accelerator and the inorganic filler are compounded and encapsulated at room temperature, and the curing is completed at 40-60 ℃.

Disclosure of Invention

The invention aims to provide a high-performance epoxy potting material. The encapsulating material is prepared by compounding an organic component epoxy resin, a diluent, a curing agent, an accelerator and an inorganic filler at room temperature and curing at 40-60 ℃. The inorganic filler improves the protection effect on electronic components, electronic component combinations and circuit boards in high-humidity, strong-ultraviolet and high-salt-spray environments.

The technical scheme of the invention is as follows:

a high-performance epoxy potting material. The encapsulating material is prepared by compounding organic components and inorganic filler at room temperature and curing at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises common bisphenol A epoxy resin, polyfunctional epoxy resin, diluent, curing agent and accelerator. The bisphenol A type epoxy resin is one or two of E-51 and E-44, the multifunctional epoxy resin is one or two of tetra-functional epoxy resin N, N, N ', N ' -tetracyclooxypropyl-4, 4 ' -diaminodiphenylmethane, tetra-functional epoxy resin N, N, N ', N ' -tetra (ethylene oxide methyl) -1, 3-xylylenediamine and tri-functional epoxy resin 3- (2, 3-epoxy propoxy) -N, N-di (2, 3-epoxy propyl) aniline, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, and the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified aliphatic amine 593, the promoter is 2, 4, 6-tri (dimethylaminomethyl) phenol.

The inorganic filler is one or two of kaolin treated by a silane coupling agent and kaolin not treated by coupling.

The invention has the beneficial effects that:

(1) after the high-performance encapsulating material is cured, the protection effect on electronic components, electronic component combinations and circuit boards in high-humidity, strong-ultraviolet and high-salt-spray environments is improved.

(2) The physical and chemical properties of the kaolin are stable, and the normal work of electronic components is not influenced.

(3) The protective effect of the layered dispersed kaolin on electronic components, electronic component combinations and circuit boards in high-humidity, strong-ultraviolet and high-salt-mist environments is higher than that of spherical particles.

(4) The condensate does not contain harmful volatile matters, and is beneficial to environmental protection.

Detailed Description

The following is further illustrated with reference to examples:

example one

100 parts of epoxy resin E-51, 2 parts of tetrafunctional epoxy resin N, N, N ', N ' -tetracyclooxypropyl-4, 4 ' -diaminodiphenylmethane and 32 parts of 1, 4-butanediol diglycidyl ether are added into a stirring tank for stirring, 12 parts of silane coupling agent treated kaolin are added, and after uniform stirring, 25 parts of polyamide 650, 5 parts of aliphatic amine 593 and 2 parts of 2, 4, 6-tri (dimethylaminomethyl) phenol are added. Mixing at room temperature, removing bubbles, bottling, and curing at 40 deg.C.

Determination of compressive strength and modulus of elasticity: the determination method is referred to GB/T2567-2008.

Example two

The implementation steps are the same as those in the first embodiment, except that: the tetrafunctional epoxy resin N, N, N ', N ' -tetracyclooxypropyl-4, 4 ' -diaminodiphenylmethane is replaced by trifunctional epoxy resin 3- (2, 3-epoxypropoxy) -N, N-di (2, 3-epoxypropyl) aniline, and kaolin is changed from 12 parts to 20 parts.

And (3) performance measurement: the method is the same as the first embodiment.

EXAMPLE III

The implementation steps are the same as those in the first embodiment, except that: the kaolin is not treated with a coupling agent.

And (3) performance measurement: the method is the same as the first embodiment.

Comparative example

The implementation steps are the same as those in the first embodiment, except that: the potting material was not added with kaolin.

And (3) performance measurement: the method is the same as the first embodiment.

TABLE accompanying Performance of the high-Performance epoxy potting Material of the present invention

	Example one	Example two	EXAMPLE III	Comparative example
					Compressive strength/MPa	88.2	83.3	70.8	63.7
Modulus of elasticity/GPa	4.5	4.2	3.6	2.0

While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The invention is not the best known technology.