阅读说明：本技术 摄像头模组及具有所述摄像头模组的电子装置 (Camera module and electronic device with same ) 是由 李静伟 丁盛杰 宋建超 李宇帅 于 2020-07-03 设计创作，主要内容包括：一种摄像头模组,包括基板、镜头组件及支架。所述支架设置于所述基板和所述镜头组件之间。所述支架包括支撑板及设置于所述支撑板的支撑件。所述支撑板包括背对所述基板的第一表面及朝向所述基板的第二表面。所述支撑板上开设有贯穿口。所述贯穿口贯穿所述第一表面和所述第二表面。所述镜头组件设置于所述第一表面,且完成遮盖所述贯穿口。所述支撑件位于所述支撑板和所述基板之间。所述支撑件包括第一支撑部及多个间隔设置的第二支撑部。所述第一支撑部设置于所述第二表面,并环设于所述贯穿口的周缘。每一所述第二支撑部由所述第一支撑部的外表面向外延伸形成。本申请中还提供了一种具有所述摄像头模组的电子装置。(A camera module comprises a substrate, a lens assembly and a support. The bracket is arranged between the substrate and the lens assembly. The support comprises a support plate and a support piece arranged on the support plate. The support plate comprises a first surface facing away from the substrate and a second surface facing the substrate. The supporting plate is provided with a through hole. The through opening penetrates through the first surface and the second surface. The lens component is arranged on the first surface and covers the through hole after finishing. The support is located between the support plate and the base plate. The support piece comprises a first support portion and a plurality of second support portions arranged at intervals. The first supporting part is arranged on the second surface and is annularly arranged on the periphery of the through opening. Each second supporting part is formed by extending the outer surface of the first supporting part outwards. The application also provides an electronic device with the camera module.)

1. A camera module comprises a substrate and a lens component, and is characterized in that the camera module also comprises a bracket, the bracket is arranged between the substrate and the lens component and comprises a supporting plate and a supporting piece arranged on the supporting plate, the support plate comprises a first surface facing away from the substrate and a second surface facing towards the substrate, the supporting plate is provided with a through hole which penetrates through the first surface and the second surface, the lens component is arranged on the first surface, and the through hole is completely covered, the supporting piece is positioned between the supporting plate and the base plate, the supporting part comprises a first supporting part and a plurality of second supporting parts arranged at intervals, the first supporting part is arranged on the second surface, and the second supporting parts are annularly arranged on the periphery of the through opening, and each second supporting part is formed by outwards extending the outer surface of the first supporting part.

2. The camera module of claim 1, wherein a projection of the support member on the support plate is entirely within the support plate.

3. The camera module according to claim 1 or 2, wherein the substrate includes a circuit board and a heat dissipation plate, the circuit board includes an upper surface facing the lens assembly and a lower surface facing away from the lens assembly, the circuit board has an opening, the opening extends through the upper surface and the lower surface, the heat dissipation plate is disposed on the lower surface and covers the opening, a portion of the heat dissipation plate is exposed to the upper surface through the opening, and the support member is located between the upper surface and the second surface.

4. The camera module of claim 3, further comprising a photo sensor chip disposed on a portion of the heat dissipation plate exposed to the upper surface, wherein the first supporting portion is disposed around the photo sensor chip.

5. The camera module of claim 3, further comprising a filling member, wherein a gap is formed between two adjacent second supporting portions, and the filling member is filled in the gap and connects the supporting member, the second surface of the supporting plate and the upper surface of the circuit board.

6. The camera module of claim 3, wherein the lens assembly comprises a filter, a lens holder and a lens, the filter is disposed on the first surface and completely covers the through hole, the lens holder is disposed on the first surface and covers the filter, and the lens is disposed on the lens holder.

7. The camera module of claim 6, wherein the first surface is recessed toward the second surface to form a receiving groove, the receiving groove is connected to the through hole, and the filter is received in the receiving groove.

8. The camera module of claim 7, wherein the receiving cavity comprises a cavity bottom surface and a cavity side surface, the cavity side surface connects the cavity bottom surface and the first surface, and the optical filter is disposed on the cavity bottom surface and completely covers the through opening.

9. The camera module of claim 8, wherein an air escape slot is defined in a bottom surface of the slot, the air escape slot communicating with the through opening.

10. An electronic device, characterized in that the electronic device comprises the camera module according to any one of claims 1 to 9.

Technical Field

The present application relates to the field of electronic optical devices, and more particularly, to a camera module and an electronic apparatus having the same.

Background

With the progress of science and technology, cameras are more and more widely applied, for example: the cameras are arranged on electronic products such as mobile phones and computers, so that people can take pictures at any time and any place conveniently, and convenience and fun are brought to life of people. However, with the trend of light and thin electronic products, the size of the camera has more stringent requirements.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a camera module and an electronic device having the same, so as to reduce the space occupation of the camera module in the electronic device.

The application also provides a camera module, which comprises a substrate, a lens component and a bracket, wherein the bracket is arranged between the substrate and the lens component, the support comprises a support plate and a support piece arranged on the support plate, the support plate comprises a first surface back to the substrate and a second surface facing the substrate, the supporting plate is provided with a through hole which penetrates through the first surface and the second surface, the lens component is arranged on the first surface, and the through hole is completely covered, the supporting piece is positioned between the supporting plate and the base plate, the supporting part comprises a first supporting part and a plurality of second supporting parts arranged at intervals, the first supporting part is arranged on the second surface, and the second supporting parts are annularly arranged on the periphery of the through opening, and each second supporting part is formed by outwards extending the outer surface of the first supporting part.

Optionally, the projection of the support on the support plate is entirely located within the support plate.

Optionally, the substrate includes a circuit board and a heat dissipation plate, the circuit board includes an upper surface facing the lens assembly and a lower surface facing away from the lens assembly, an opening is formed in the circuit board, the opening penetrates through the upper surface and the lower surface, the heat dissipation plate is disposed on the lower surface and covers the opening, a portion of the heat dissipation plate is exposed to the upper surface through the opening, and the support is located between the upper surface and the second surface.

Optionally, the camera module further comprises a photosensitive chip, the photosensitive chip is arranged on the part exposed on the upper surface of the heat dissipation plate, and the first supporting part is annularly arranged on the photosensitive chip.

Optionally, the camera module further includes a filling member, wherein a gap is formed between two adjacent second supporting portions, and the filling member is filled in the gap and connects the supporting member, the second surface of the supporting plate, and the upper surface of the circuit board.

Optionally, the lens assembly includes a filter, a lens holder and a lens, the filter is disposed on the first surface and completely covers the through hole, the lens holder is disposed on the first surface and covers the filter, and the lens is disposed on the lens holder.

Optionally, the first surface is recessed toward the second surface to form an accommodating groove, the accommodating groove is communicated with the through hole, and the optical filter is accommodated in the accommodating groove.

Optionally, the receiving groove includes a groove bottom surface and a groove side surface, the groove side surface is connected to the groove bottom surface and the first surface, and the optical filter is disposed on the groove bottom surface and completely covers the through hole.

Optionally, an air escape groove is formed in the bottom surface of the groove, and the air escape groove is communicated with the through hole.

The application also provides an electronic device, which comprises the camera module.

The cooperation through backup pad and support piece is realized in this application the design of the no outer wall of support among the camera module, so, reduced the whole size of taking a photograph of camera module greatly in length direction and width direction, reduce the space occupancy of camera module in electronic device to adapt to the development trend of frivolous electronic equipment now.

Drawings

Fig. 1 is a block diagram of an electronic device according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of a camera module according to an embodiment of the present application.

Fig. 3 is an exploded view of the camera module shown in fig. 2.

Fig. 4 is an exploded view of a portion of the camera module shown in fig. 2.

Fig. 5 is a schematic structural view of the stent and the filler member shown in fig. 4.

Fig. 6 is a schematic structural view of the stent shown in fig. 5.

Fig. 7 is an exploded view of a portion of the camera module shown in fig. 2 at another viewing angle.

Fig. 8 is a schematic cross-sectional view of the camera module shown in fig. 2.

Description of the main elements

Electronic device 100

Camera module 10

Support 11

Supporting plate 111

First surface 1111

Second surface 1112

Through hole 1113

Receiving groove 1114

Slot bottom 1115

Trough side 1116

Air escape groove 1117

Support 112

First support part 1121

Second supporting part 1122

First supporting side plate 1123

Second supporting side plate 1124

Void 1125

Substrate 12

Circuit board 121

Upper surface 1211

Lower surface 1212

Openings 1213

Heat dissipation plate 122

Connecting piece 123

Lens assembly 13

Optical filter 131

Mirror base 132

Lens 133

First subsection 134

Top wall 1341

Peripheral wall 1342

Accommodating space 1343

Second subsection 135

Through hole 1351

Third connecting member 136

Photosensitive chip 14

Electronic component 15

Gap 151

Filling piece 16

First connecting member 17

Second connecting member 18

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1, the present application provides an electronic device 100. The electronic device 100 includes a camera module 10. The electronic device 100 is not limited to a mobile phone, a computer, a wearable device, or a monitoring device.

Referring to fig. 2, the camera module 10 includes a bracket 11, a substrate 12, and a lens assembly 13. The bracket 11 is disposed between the substrate 12 and the lens assembly 13. The bracket 11 includes a supporting plate 111 and a supporting member 112 disposed on the supporting plate 111. Referring to fig. 4 and fig. 6, the supporting plate 111 includes a first surface 1111 facing away from the substrate 12 and a second surface 1112 facing the substrate 12. The supporting plate 111 is provided with a through hole 1113. The through opening 1113 penetrates the first surface 1111 and the second surface 1112. The lens assembly 13 is disposed on the first surface 1111 and completely covers the through hole 1113. The support 112 is located between the support plate 111 and the base plate 12. The support 112 includes a first support portion 1121 and a plurality of second support portions 1122 disposed at intervals. The first supporting portion 1121 is disposed on the second surface 1112 and is disposed around the periphery of the through hole 1113. Each of the second supporting portions 1122 is formed by extending an outer surface of the first supporting portion 1121.

The cooperation through backup pad 111 and support piece 112 in this application realizes the no outer wall design of support 11 in camera module 10, so, has reduced camera module 10's overall dimension greatly in length direction and width direction, reduces the space occupancy of camera module 10 in electronic device 100 to adapt to the development trend that electronic equipment is frivolous at present.

Referring to fig. 2, the length direction of the camera module 10 is an X-axis direction, and the width direction of the camera module 10 is a Y-axis direction. The Y-axis direction is perpendicular to the X-axis direction.

In some embodiments, referring to fig. 4 and 8, the projection of the support 112 on the support plate 111 is entirely located within the support plate 111. The supporting member 112 is used for supporting the supporting plate 111, and simultaneously, the supporting plate 111 is also used together to implement the design without an outer wall of the bracket 11 in the camera module 10.

Wherein the supporting plate 111 and the supporting member 112 are integrally formed.

In the present embodiment, referring to fig. 6, the through hole 1113 has a rectangular shape. The first supporting portion 1121 is rectangular and includes two opposite first supporting side plates 1123 and two opposite second supporting side plates 1124. The two first supporting side plates 1123 connect the two second supporting side plates 1124. The support 112 includes six second supporting portions 1122. Each of the first supporting side plates 1123 is connected to two second supporting portions 1122, and each of the second supporting side plates 1124 is connected to one second supporting portion 1122. Of course, in other embodiments, the number of the second supporting portions 1122 may be adjusted according to actual needs, and may be four, five, seven, eight, and the like.

In other embodiments, the shape of the through hole 1113 may be adjusted according to actual requirements, and may be regular shapes such as diamond, circle, or other irregular shapes. The shape of the first supporting portion 1121 may also be adaptively adjusted according to actual requirements, and may be in a regular shape such as a diamond shape, a circular shape, or other irregular shapes.

In some embodiments, referring to fig. 4 and 7, the substrate 12 includes a circuit board 121 and a heat dissipation plate 122. The circuit board 121 includes an upper surface 1211 facing the lens assembly 13 and a lower surface 1212 facing away from the lens assembly 13. The circuit board 121 is provided with an opening 1213. The opening 1213 extends through the upper surface 1211 and the lower surface 1212. The heat dissipation plate 122 is disposed on the lower surface 1212 and covers the opening 1213. A portion of the heat spreader plate 122 is exposed to the upper surface 1211 through the opening 1213. Wherein, the heat dissipation plate 122 is arranged to enhance the supporting capability of the circuit board 121. The heat dissipation plate 122 is not limited to a stainless steel plate. At this time, the holder 11 is disposed on the upper surface 1211.

The camera module 10 further includes a photosensitive chip 14 electrically connected to the circuit board 121. The light sensing chip 14 is disposed on a portion of the heat dissipation plate 122 exposed to the upper surface 1211. Thus, the heat generated by the photo sensor 14 during operation can be transmitted to the outside through the heat dissipation plate 122, so as to effectively avoid the problem that the imaging quality of the camera module 10 is affected because the heat generated by the photo sensor 14 during operation cannot be dissipated in time.

Further, referring to fig. 4 and 7, the substrate 12 further includes a connection member 123. The connector 123 is connected between the circuit board 121 and the heat dissipation plate 122, and is used for fixing the heat dissipation plate 122 to the circuit board 121. At this time, the connecting member 123 is disposed on the lower surface 1212 and covers the opening 1213. A portion of the connector 123 is exposed to the upper surface 1211 through the opening 1213. The camera module 10 further includes a photosensitive chip 14 electrically connected to the circuit board 121. The photosensitive chip 14 is disposed on a portion of the connecting member 123 exposed to the upper surface 1211. In this way, by the arrangement of the connecting member 123, the heat dissipation plate 122 and the photosensitive chip 14 are fixedly connected at the same time. In some embodiments, the connecting member 123 is a thermally conductive silicone. Therefore, the heat generated by the photosensitive chip 14 during operation can be sequentially transmitted to the outside through the connecting member 123 and the heat dissipation plate 122, so as to effectively avoid the problem that the imaging quality of the camera module 10 is affected because the heat generated by the photosensitive chip 14 during operation cannot be dissipated in time.

In other embodiments, the connecting member 123 is not limited to a heat conductive silicone, but may be a double-sided adhesive tape.

In other embodiments, the heat dissipation plate 122 and the connection member 123 may be omitted. Thus, the circuit board 121 is not provided with the opening 1213.

Referring to fig. 3, 4 and 6, when the bracket 11 is disposed on the upper surface 1211, the first supporting portion 1121 is located between the second surface 1112 and the upper surface 1211 and surrounds the photosensitive chip 14 to close a gap between the supporting plate 111 and the circuit board 121, so as to avoid a problem of light leakage of the camera module 10.

Referring to fig. 4, a plurality of electronic components 15 are disposed on the upper surface 1211. The electronic element 15 may be one or more passive elements such as a resistor, a capacitor, a diode, a transistor, a relay, and a memory.

In the present embodiment, referring to fig. 4 and 8, the plurality of electronic components 15 are arranged in two rows, and the photosensitive chip 14 is located between the two rows of electronic components 15. The first supporting portion 1121 is located between the photosensitive chip 14 and the electronic components 15 to isolate the photosensitive chip 14 from the electronic components 15.

Wherein adjacently arranged electronic components 15 are spaced apart to form a gap 151. In this way, due to the gap 151, when the holder 11 is disposed on the upper surface 1211, the second support portion 1122 corresponding to the gap 151 may be accommodated in the gap 151.

In some embodiments, referring to fig. 3, 4, 5, 6, and 8, the camera module 10 further includes a filler 16. A gap 1125 is formed between two adjacent second supporting portions 1122. The filling member 16 is filled in the gap 1125 to connect the supporting member 112, the second surface 1112 of the supporting plate 111 and the upper surface 1211 of the circuit board 121, and has a supporting and buffering function. Wherein the filling member 16 is not limited to silicone, glue, etc.

Further, referring to fig. 8, the camera module 10 further includes a first connecting member 17. The first connecting member 17 is connected between the upper surface 1211 and the supporting member 112. Wherein the first connecting member 17 is not limited to double-sided tape, glue, etc.

In other embodiments, the first connector 17 may be omitted. Thus, the first surface 1111 and the supporting member 112 can be connected by clamping, welding, screwing, or the like.

Referring to fig. 2 and 3, the lens assembly 13 is disposed on the first surface 1111 and covers the through hole 1113. In this embodiment, a second connection member 18 is disposed between the first surface 1111 and the lens assembly 13. The first surface 1111 and the lens assembly 13 are connected by the second connecting member 18. In one embodiment, the second connecting member 18 is not limited to double-sided tape, glue, etc.

In other embodiments, the second connector 18 may be omitted. In this way, the first surface 1111 and the lens assembly 13 can be connected by snapping, welding, screwing, or the like.

Referring to fig. 2 and 3, the lens assembly 13 includes an optical filter 131, a lens holder 132, and a lens 133.

The filter 131 is disposed on the first surface 1111 and completely covers the through hole 1113. The filter 131 may be used to filter other impurity light such as infrared light. Alternatively, the filter 131 may be blue glass, IR glass, or the like.

In some embodiments, referring to fig. 2 and 3, the first surface 1111 is recessed toward the second surface 1112 to form a receiving groove 1114. The accommodating groove 1114 is communicated with the through hole 1113.

Specifically, referring to fig. 2 and 3, the receiving groove 1114 includes a groove bottom surface 1115 and a groove side surface 1116. The slot side 1116 connects the slot bottom 1115 and the first surface 1111. The optical filter 131 is disposed on the slot bottom 1115, and completely covers the through hole 1113.

Referring to fig. 2 and 3, the groove bottom 1115 is provided with an air escape groove 1117. The air escape groove 1117 is communicated with the through hole 1113.

Further, referring to fig. 2 and 3, the lens assembly 13 further includes a third connecting member 136. The third connecting member 136 is connected between the groove bottom 1115 and the filter 131. Wherein the third connecting member 136 is not limited to double-sided tape, glue, etc.

Referring to fig. 2 and 3, the mirror base 132 includes a first section 134 and a second section 135 disposed on the first section 134. In the present embodiment, the first and second sub-portions 134 and 135 are integrally formed. In other embodiments, the first section 134 and the second section 135 can be formed by assembly.

Referring to fig. 2 and 3, the first section 134 includes a top wall 1341 and a peripheral wall 1342. The peripheral wall 1342 is disposed on a periphery of the top wall 1341 to form an accommodating space 1343 together with the top wall 1341. In this way, when the lens assembly 13 is disposed on the first surface 1111, the accommodating space 1343 and the accommodating groove 1114 are communicated, and the optical filter 131 is completely accommodated in the space where the accommodating space 1343 and the accommodating groove 1114 are communicated.

Referring to fig. 2 and 3, the second section 135 is used to mount the lens 133. In the present embodiment, the second sub 135 has a through hole 1351. The second part 135 is disposed on the top wall 1341, and the through holes 1351 communicate with the receiving space 1343. The lens 133 is accommodated in the through hole 1351.

Although the present application has been described in detail with reference to preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present application.