阅读说明：本技术 等离子体反应设备及物料处理方法 (Plasma reaction equipment and material treatment method ) 是由 王双印 陶李 于 2020-03-24 设计创作，主要内容包括：本发明涉及一种等离子体反应设备及物料处理方法,设备包括工作台、反应仓、真空模组、送气模块、射频模组及驱动件。反应仓可转动地装配于工作台,且具有反应腔,可以在反应腔内放置需要处理的物料,例如粉体物料。真空模组对反应腔抽真空,在反应腔内形成真空环境；送气模块向反应腔输送气体,射频模组围设于反应仓外周,向反应腔发射射频波,使反应腔内送入的气体发生电离形成等离子体来处理放置在反应仓内的物料,以改变物料表面的性能；驱动件对反应仓提供旋转驱动力,反应仓在驱动件的驱动下相对工作台转动,以使粉末状物料可以在反应仓内翻转同时与射频电离后的等离子体充分接触,可以对粉末状物料均匀地进行表面处理,提高处理效果。(The invention relates to a plasma reaction device and a material processing method. The reaction bin is rotatably assembled on the workbench and is provided with a reaction cavity, and materials to be processed, such as powder materials, can be placed in the reaction cavity. The vacuum module is used for vacuumizing the reaction cavity and forming a vacuum environment in the reaction cavity; the gas supply module supplies gas to the reaction chamber, the radio frequency module is arranged around the reaction chamber and emits radio frequency waves to the reaction chamber, so that the gas fed into the reaction chamber is ionized to form plasma to process the material in the reaction chamber, and the surface performance of the material is changed; the driving piece provides rotary driving force to the reaction bin, and the reaction bin rotates relative to the workbench under the driving of the driving piece, so that the powdery material can be fully contacted with the plasma after the radio frequency ionization in the reaction bin while being turned, the surface treatment can be uniformly carried out on the powdery material, and the treatment effect is improved.)

1. A plasma reaction apparatus, comprising:

a work table;

the reaction bin is rotatably assembled on the workbench and is provided with a reaction cavity;

the vacuum module is used for vacuumizing the reaction cavity;

the gas supply module is used for supplying gas to the reaction cavity;

the radio frequency module is arranged around the reaction bin and used for transmitting radio frequency waves to the reaction cavity; and

the driving piece is used for providing rotary driving force for the reaction bin, and the reaction bin is driven by the driving piece to rotate relative to the workbench.

2. The plasma reaction apparatus as claimed in claim 1, further comprising a stirring member protrudingly disposed in the reaction chamber.

3. The plasma reaction apparatus according to claim 1 or 2, wherein the reaction chamber comprises a reaction section and a mounting section, the reaction section and the mounting section are distributed along a first direction in which a rotation axis of the reaction chamber is located, and the mounting section is supported on the work table;

wherein the cross-sectional area of the reaction section in the cross-section perpendicular to the first direction is larger than the cross-sectional area of the mounting end in the cross-section perpendicular to the first direction.

4. The plasma reaction apparatus as claimed in claim 1, wherein the rf module comprises an rf power source, an rf coil, and the rf coil is disposed around the periphery of the reaction chamber, and the rf power source is disposed on the worktable and electrically connected to the rf coil.

5. The plasma reaction apparatus as claimed in claim 4, wherein the RF module further comprises a radiation shield, and the radiation shield is sleeved on the periphery of the RF coil facing away from the reaction chamber.

6. The plasma reaction apparatus according to claim 1 or 2, wherein the vacuum module comprises a vacuum pump and a vacuum gauge, the vacuum pump is selectively on-off connected with the reaction chamber and used for vacuumizing the reaction chamber, and the vacuum gauge is communicated with the reaction chamber and used for detecting the pressure in the reaction chamber.

7. The plasma reaction apparatus as claimed in claim 1 or 2, further comprising a cooling system, wherein the cooling system is in cooling heat exchange with the RF module.

8. The plasma reaction apparatus as claimed in claim 1 or 2, wherein the driving member is a magnetic fluid seal capable of outputting a rotational motion.

9. A method of material handling, comprising the steps of:

placing a material to be treated in a reaction cavity, and vacuumizing the reaction cavity;

introducing a processing gas into the reaction cavity, and rotating the reaction cavity;

and emitting radio frequency waves into the reaction cavity, and exciting the processing gas to form plasma to process the surface of the material.

10. A material processing method is characterized in that the processing gas is inert gas, radio frequency waves are emitted into the reaction cavity, and the inert gas is excited to form plasma to bombard and etch the surface of the material; or

The processing gas is a reaction gas, radio frequency waves are emitted into the reaction cavity, and the reaction gas is excited to form plasma to perform chemical reaction with the surface of the material; or

The processing gas is doping gas, radio frequency waves are emitted into the reaction cavity, and the doping gas is excited to form plasma so as to dope elements on the surface of the material;

the processing gas is a coating gas, radio frequency waves are emitted into the reaction cavity, and the materials excite the coating gas to form plasma materials which are deposited and coated on the surfaces of the materials.

Technical Field

The invention relates to the technical field of material processing, in particular to plasma reaction equipment and a material processing method.

Background

The plasma, also called plasma, is a fourth state of matter other than gases, liquids and solids, which is mainly formed after the gas is ionized by high-energy excitation, and contains various high-energy particles, mainly anions/cations, electrons, atoms and molecules. Plasmas can be divided into two categories: when the electron temperature is equal to the ion temperature, the high-temperature plasma is formed, and when the electron temperature is not equal to the ion temperature, the low-temperature plasma is formed. In the low-temperature plasma discharge process, although the electron temperature is high, the heavy particle temperature is low, and the whole system is in a low-temperature state, so that the low-temperature plasma is called as a low-temperature plasma and is also called as a non-equilibrium plasma. Based on the characteristic of low-temperature plasma, the plasma has wide application in the directions of material treatment, metal smelting, spraying, welding, analysis, catalysis and the like.

The common plasma treatment of the material surface is mainly to utilize high-energy particles in the plasma to bombard the material surface for achieving the purpose of treatment, or to ionize gas and then react with the material surface. When the high-energy particles in the plasma interact with the surface of the material, the series of modifications such as etching, doping and the like can be effectively carried out, and meanwhile, the plasma can also be used for synthesis, reduction and the like of various metal materials because the plasma generally has better reducibility. Generally, plasma processing is mainly used for processing an object with a fixed topography, such as a chip, a film, a workpiece, and the like, by using plasma. However, when powder materials are processed, especially when the powder materials are processed in batches, the conventional plasma reaction device can only process powder on the surface layer of the powder materials, and it is difficult to process the powder materials uniformly.

Disclosure of Invention

In view of the above, it is necessary to provide a plasma reaction apparatus and a material processing method, which can uniformly process a powder material by using a plasma.

A plasma reaction apparatus comprising:

a work table;

the reaction bin is rotatably assembled on the workbench and is provided with a reaction cavity;

the vacuum module is used for vacuumizing the reaction cavity;

the gas supply module is used for supplying gas to the reaction cavity;

the radio frequency module is arranged around the reaction bin and used for transmitting radio frequency waves to the reaction cavity; and

the driving piece is used for providing rotary driving force for the reaction bin, and the reaction bin is driven by the driving piece to rotate relative to the workbench.

Among the above-mentioned plasma reaction equipment, the reaction bin can be rotationally assembled in the workstation, and has the reaction chamber, can place the material that needs the processing in the reaction chamber, for example powder material. The vacuum module is used for vacuumizing the reaction cavity and forming a vacuum environment in the reaction cavity; the gas supply module supplies gas to the reaction chamber, the radio frequency module is arranged around the periphery of the reaction chamber and emits radio frequency waves to the reaction chamber, so that the gas fed into the reaction chamber is ionized to form plasma to process the material placed in the reaction chamber, and the surface performance of the material is changed. Simultaneously, the driving piece provides rotary driving power to the reaction bin, and the reaction bin rotates relative to the workstation under the drive of driving piece to make powdered material fully contact with the plasma after the radio frequency ionization simultaneously in the upset of reaction bin, can carry out surface treatment to powdered material uniformly, improve the treatment effect.

In one embodiment, the reaction chamber further comprises a stirring piece which is convexly arranged in the reaction chamber.

In one embodiment, the reaction bin comprises a reaction section and a mounting section, the reaction section and the mounting section are distributed along a first direction in which the rotation axis of the reaction bin is located, and the mounting section is supported on the workbench;

wherein the cross-sectional area of the reaction section in the cross-section perpendicular to the first direction is larger than the cross-sectional area of the mounting end in the cross-section perpendicular to the first direction.

In one embodiment, the radio frequency module comprises a radio frequency power supply and a radio frequency coil, the radio frequency coil is wound on the periphery of the reaction bin, and the radio frequency power supply is arranged on the workbench and electrically connected with the radio frequency coil.

In one embodiment, the radio frequency module further comprises a radiation shield, and the radiation shield is sleeved on the periphery of the radio frequency coil, which faces away from the reaction chamber.

In one embodiment, the vacuum module comprises a vacuum pump and a vacuum gauge, the vacuum pump and the reaction cavity can be selectively switched on and off for vacuumizing the reaction cavity, and the vacuum gauge is communicated with the reaction cavity and used for detecting the pressure in the reaction cavity.

In one embodiment, the radio frequency module further comprises a cooling system, and the cooling system is in cooling heat exchange with the radio frequency module.

In one embodiment, the driving member is a magnetic fluid seal capable of outputting rotary motion.

A method of material handling comprising the steps of:

placing a material to be treated in a reaction cavity, and vacuumizing the reaction cavity;

introducing a processing gas into the reaction cavity, and rotating the reaction cavity;

and emitting radio frequency waves into the reaction cavity, and exciting the processing gas to form plasma to process the surface of the material.

In one embodiment, the processing gas is an inert gas, radio frequency waves are emitted into the reaction cavity, and the inert gas is excited to form plasma to bombard and etch the surface of the material; or

The processing gas is a reaction gas, radio frequency waves are emitted into the reaction cavity, and the reaction gas is excited to form plasma to perform chemical reaction with the surface of the material; or

The processing gas is doping gas, radio frequency waves are emitted into the reaction cavity, and the doping gas is excited to form plasma so as to dope elements on the surface of the material;

the processing gas is a coating gas, radio frequency waves are emitted into the reaction cavity, and the materials excite the coating gas to form plasma materials which are deposited and coated on the surfaces of the materials.

Drawings

Fig. 1 is a schematic structural diagram of a plasma reaction apparatus according to an embodiment of the present invention.

100. A plasma reaction device; 10. a work table; 20. a reaction bin; 21. a reaction chamber; 22. a reaction section; 24. an installation section; 30. a stirring member; 40. a vacuum module; 42. a vacuum pump; 44. a vacuum gauge; 46. a control valve; 50. an air supply module; 60. a radio frequency module; 62. a radio frequency power supply; 64. a radio frequency coil; 66. a radiation shield; 70. a drive member; 80. a cooling system; 90. and (5) controlling the system.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As described in the background, plasma is an effective means of material modification synthesis. For example, high-energy particles in plasma can be effectively modified by etching, doping, and the like when interacting with the surface of a material, and can also be used for synthesis, reduction, and the like of various metal materials because plasma generally has good reducibility. However, the conventional methods for synthesizing and modifying materials are mainly chemical and high-temperature calcination methods, and when the methods for modifying or synthesizing materials are chemical or high-temperature calcination methods, the methods usually face the problems of complex process, high energy consumption, need of protective gas, serious pollution caused by treatment of a large amount of solvents, and the like, and the conventional methods can obviously increase the cost for modifying and synthesizing materials. For chemical methods, a large amount of solution containing reaction substances is generally used for treating materials, and then a series of processes such as cleaning and drying are performed, so that a large amount of solvent is consumed for reaction, a large amount of pollution is generated by cleaning, and a complicated process and a large amount of energy are required in the processes of treatment reaction and drying. In the high-temperature calcination method, materials are heated to a high temperature by using various reaction furnaces, and various inert gases or reaction gases are required to treat the materials, so that a lot of tail gas pollution is generated and a lot of energy is consumed.

Referring to fig. 1, in one embodiment of the present invention, a plasma reactor apparatus 100 for processing a material surface by using plasma is provided. The plasma ionizes the gas to generate a series of high-energy particles, the high-energy particles can effectively interact with the material, the surface of the material can be quickly treated, the surface performance of the material is changed, and the method has the characteristics of short treatment time, uniformity, controllability, low energy consumption, less pollution, simple process and the like.

The plasma reaction apparatus 100 includes a worktable 10, a reaction chamber 20, a vacuum module 40, a gas supply module 50, a radio frequency module 60 and a driving member 70, wherein the reaction chamber 20 is rotatably mounted on the worktable 10 and has a reaction chamber 21, and a material to be processed, such as a powder material, can be placed in the reaction chamber 21. The vacuum module 40 vacuumizes the reaction chamber 21 and forms a vacuum environment in the reaction chamber 21; the gas supply module 50 supplies gas to the reaction chamber 21, the radio frequency module 60 surrounds the periphery of the reaction chamber 20 and emits radio frequency waves to the reaction chamber 21, so that the gas fed into the reaction chamber 21 is ionized to form plasma to process the material placed in the reaction chamber 20, and the surface performance of the material is changed; furthermore, the rf module 60 directly surrounds the periphery of the reaction chamber 20, and the plasma excitation intensity in this region is the strongest, so as to improve the processing intensity of the plasma reaction apparatus 100. Meanwhile, the driving member 70 provides a rotational driving force for the reaction bin 20, and the reaction bin 20 is driven by the driving member 70 to rotate relative to the worktable 10, so that the powdery material can be turned in the reaction bin 20 and simultaneously fully contacted with the plasma after radio frequency ionization, the surface treatment can be uniformly carried out on the powdery material, and the treatment effect is improved.

In some embodiments, the plasma reaction apparatus 100 further includes a stirring member 30, the stirring member 30 is disposed in the reaction chamber 21 in a protruding manner, the reaction chamber 20 and the stirring member 30 therein rotate synchronously under the action of the driving member 70, the stirring member 30 protrudes relative to the reaction chamber 20 to break up the powder material turned over in the reaction chamber 20, and further stir and mix the powder material, so that the powder material can more uniformly contact with the plasma, and thus the powder material can be more uniformly processed.

Optionally, the stirring member 30 comprises at least one baffle plate, and the baffle plate is convexly arranged in the reaction chamber 21. In the embodiment, the stirring member 30 includes a plurality of baffle plates, each baffle plate extends along a direction parallel to the rotation axis of the reaction chamber 20, and the plurality of baffle plates are uniformly spaced on the inner wall of the reaction chamber 21 to scatter the rotating powder material from all directions of the reaction chamber 21, so as to uniformly process the powder material by using the plasma.

The reaction chamber 20 includes a reaction section 22 and a mounting section 24, the reaction section 22 and the mounting section 24 are distributed along a first direction in which the rotation axis of the reaction chamber 20 is located, and the mounting section 24 is supported on the work table 10 to assemble the reaction chamber 20 on the work table 10. Optionally, a bracket is provided on the work table 10, and the mounting section 24 of the reaction chamber 20 is rotatably supported on the bracket. The reaction section 22 is connected with the installation section 24, and the reaction section 22 is used for accommodating materials to be treated. The cross-sectional area of the reaction section 22 in the delayed first direction is larger than the cross-sectional area of the mounting section 24 in the direction perpendicular to the first direction, so that the accommodating space in the reaction section 22 has a larger volume and can accommodate more materials to be treated. Specifically, in this embodiment, the installation section 24 and the reaction section 22 are both cylindrical, and the ratio of the diameter of the reaction section 22 to the diameter of the installation section 24 is greater than or equal to four, so as to increase the volume of the chamber of the reaction chamber 21 and increase the throughput of materials. It is understood that the volume of the reaction section 22 can be designed according to actual requirements, and is not limited herein.

In some embodiments, the reaction chamber 20 is detachably mounted on the worktable 10, so that the reaction chamber 20 with different volume can be selected to be replaced on the plasma reaction apparatus 100 according to the processing requirement, so as to be suitable for processing materials with different volume, and improve the versatility of the plasma reaction apparatus 100. Alternatively, the reaction chamber 20 may be provided with a large volume to process a large batch of materials. Meanwhile, the driving member 70 drives the reaction chamber 20 to rotate at a high speed, so as to improve the uniformity of the processed material.

The vacuum module 40 includes a vacuum pump 42 and a vacuum gauge 44, wherein the vacuum pump 42 is selectively connected to or disconnected from the reaction chamber 21 for evacuating the reaction chamber 21 and creating a vacuum environment for the reaction chamber 21 to form plasma in the reaction chamber 21. The vacuum gauge 44 is connected to the reaction chamber 21 for detecting the pressure in the reaction chamber 21, and the pressure in the reaction chamber 21 can be adjusted to a target value according to the detection of the vacuum gauge 44, so that a suitable vacuum environment can be created.

Further, the vacuum module 40 further includes a control valve 46, the control valve 46 is connected between the vacuum pump 42 and the reaction chamber 20, the vacuum pump 42 and the reaction chamber 21 are connected or disconnected, the control valve 46 is opened when the reaction chamber 21 needs to be evacuated, so that the vacuum pump 42 is connected to the reaction chamber 21, and the control valve 46 is closed when the reaction chamber 21 does not need to be evacuated, so that the reaction chamber 21 is kept in the current pressure state.

The gas supply module 50 includes a gas supply device, a flowmeter and a rotary gas inlet valve, the gas supply device is communicated with the reaction chamber 20 through a gas supply pipeline and is used for supplying gas into the reaction chamber 20, the flowmeter is arranged on the gas supply pipeline and is used for detecting the amount of the gas supply, the rotary gas inlet valve is arranged at the tail end of the gas supply pipeline and is connected with the reaction chamber 20, the rotary gas inlet valve supplies gas into the reaction chamber 20, simultaneously, the gap between the reaction chamber 20 and the gas supply pipeline is sealed, the reaction chamber 20 is allowed to rotate, and thus, the rotary gas supply is realized. The air supply device comprises a plurality of air inlet channels, and a plurality of different gases can be conveyed and mixed through the plurality of air inlet channels. In practical applications, the plurality of gas inlet channels are switched according to requirements to deliver the required gas types to the reaction chamber 20.

The radio frequency module 60 comprises a radio frequency power supply 62 and a radio frequency coil 64, the radio frequency coil 64 is wound on the periphery of the reaction chamber 20, the radio frequency power supply 62 is arranged on the workbench 10 and is electrically connected with the radio frequency coil 64, when the radio frequency coil 64 is electrified through the radio frequency power supply 62, radio frequency waves can be emitted into the reaction cavity 21, the charged gas is excited and ionized by high energy to form plasma, and the plasma acts on the surface of the material to achieve the effect of changing the surface performance of the material. Optionally, the radio frequency coil 64 is a copper tube coil.

Further, the rf module 60 further includes a radiation shield 66, the radiation shield 66 is sleeved on the periphery of the rf coil 64 facing away from the reaction chamber 20, and shields the rf waves emitted by the rf coil 64 from radiating to the outside. Meanwhile, the radiation shielding cover 66 is sleeved outside the reaction bin 20, so that the outside of the radiation shielding cover 66 is prevented from being impacted when the reaction bin 20 is subjected to vacuum explosion, and the danger of the reaction bin 20 caused by the vacuum explosion is avoided. Moreover, a transparent window can be opened on the radiation shield 66 for observing the reaction process in the reaction chamber 20.

The reaction chamber 20 is driven to rotate by the driving member 70, the driving member 70 is a magnetic fluid sealing member capable of outputting a rotational motion, the reaction chamber 20 is driven to rotate by the magnetic fluid sealing member, and the reaction chamber 20 is sealed by the magnetic fluid sealing member, so that the sealing performance of the reaction chamber 21 in the rotating process is ensured.

The plasma reaction apparatus 100 further comprises a cooling system 80, wherein the cooling system 80 performs cooling heat exchange with the rf module 60 to take away heat generated during the operation of the rf module 60, thereby ensuring the normal operation of the rf module 60. Specifically, the cooling system 80 exchanges cooling heat with the radio frequency coil 64, and mainly cools the radio frequency coil 64 with a large heating value.

The plasma reaction apparatus 100 further comprises a control system 90, wherein the control system 90 comprises a controller and a control panel, the controller is in communication with the vacuum module 40, the gas supply module 50, the rf module 60, the driving member 70, the cooling system 80 and the control panel, and the controller is configured to receive real-time parameters of the vacuum module 40, the gas supply module 50, the rf module 60, the driving member 70 and the cooling system 80 and display operating parameters of each module on the control panel. Meanwhile, an operator can input target parameters of each module on the control panel, and after the controller receives a target instruction, the controller controls the corresponding module to adjust the operation parameters to the target parameters, so that automatic control of each module is realized.

Wherein, the sequence of starting each module by the controller is as follows: a vacuum module 40, a gas delivery module 50, a driver 70, a cooling system 80, a radio frequency module 60; after the reaction is finished, the sequence of closing each module by the controller is as follows: RF module 60, driver 70, gas delivery module 50 (stopping gas delivery when the gas is delivered to the reaction chamber 21 to atmospheric pressure), and cooling system 80.

When the plasma reaction equipment 100 is used for material treatment, a material to be treated is firstly placed in the reaction bin 20, then the reaction bin 20 is vacuumized through the vacuum pump 42, and then gas is fed into the reaction bin 20, so that the preparation work is completed. Then, the radio frequency power supply 62 is turned on, the radio frequency coil 64 is electrified to transmit radio frequency waves to the gas in the reaction bin 20, the gas is ionized by high-energy excitation in a vacuum environment to form plasma, and the plasma performs a processing function on the surface of the material to change the performance of the material surface, so that the processed material is obtained; finally, the residual gas in the reaction bin 20 is pumped out through the vacuum pump 42, and the reaction bin 20 can be opened to take out the treated material, so that the material processing is completed.

Based on the same inventive concept, in an embodiment of the present invention, a material processing method is further provided, including the following steps:

step S100, placing the material to be processed in the reaction cavity 21, and vacuumizing the reaction cavity 21. Specifically, the material to be treated is placed in the reaction chamber 20 of the plasma reaction apparatus, then the vacuum pump 42 in the plasma reaction apparatus 100 is turned on, and the reaction chamber 21 inside the reaction chamber 20 is evacuated, so that the pressure in the reaction chamber 21 is reduced to below 300 pa.

Step S300, introducing a process gas into the reaction chamber 21, and then rotating the reaction chamber 21. Specifically, the gas supply module 50 in the plasma reaction apparatus 100 is turned on to supply the process gas into the reaction chamber 21. Then, the driving member 70 in the plasma reaction apparatus 100 is operated to drive the reaction bin 20 to rotate, so that the powder material in the reaction chamber 21 is uniformly stirred.

Step S500, emitting radio frequency waves into the reaction chamber 21, and exciting the processing gas to form plasma to process the surface of the material. Specifically, the rf module 60 in the plasma reaction apparatus 100 emits rf waves into the reaction chamber 21 of the reaction chamber 20, excites the gas in the reaction chamber 21 to form plasma, and uniformly contacts the turned material to uniformly process the powder material.

Optionally, in the material processing process, different gases may be added into the reaction chamber 21 at different time intervals to excite different plasmas to process the material surface, so as to perform different etching, doping and chemical reaction processes, the processing time of each gas may be 1min-2h, any process therein may also be repeated, and the adjustment may be performed according to actual requirements.

In some embodiments, the process gas is an inert gas, and the bombardment etching treatment can be performed on the surface of the material. Namely, radio frequency waves are emitted into the reaction cavity 21, reaction gas is excited to form plasma to bombard and etch the surface of the material, the roughness of the surface of the material is increased, and the performance of the material is further changed.

Specifically, the material to be treated is placed in the reaction chamber 20 of the plasma reaction apparatus 100, the gas pressure in the reaction chamber 21 is reduced to below 300 pa by using the vacuum pump 42, and the inert gas (argon, helium, etc.) is introduced into the reaction chamber 21 by using the gas supply module 50, with the flow rate of 10 SCCM; controlling the rotating speed of the reaction bin 20 to be 0-200rpm to ensure that the materials are uniformly stirred; and (3) turning on the radio frequency power supply 62, exciting the plasma to etch the material, wherein the time of single etching can be set to be 1min-2h according to the state of the material to be processed, meanwhile, the single etching process can be repeated, finally, finishing the processing, and taking out the etched material.

For example, molybdenum disulfide is used as a high-performance electro-catalytic material and a transistor material, and the physical and chemical properties of molybdenum disulfide can be effectively changed by etching and constructing defects on the surface of molybdenum disulfide, so that the performance of molybdenum disulfide is improved. The molybdenum disulfide powder material is filled into the reaction cavity 21 of the plasma reaction equipment 100, the interior of the reaction cavity 21 is vacuumized to 10Pa, argon gas with the flow of 10SCCM is introduced, the rotation speed is started to be set to be 20r/min, and the cooling system 80 is opened to cool the radio frequency coil 64. And finally, starting the radio frequency module 60, setting the power to be 800W, setting the reaction time to be 10min, finally taking down the reaction bin 20, and pouring out the reaction product to obtain the plasma etched molybdenum disulfide (the defect-rich molybdenum disulfide has increased surface roughness and defects and is more applied to the electrochemical hydrogen evolution reaction).

In other embodiments, the process gas is a reactive gas, and radio frequency waves are emitted into the reaction chamber 21 to excite the reactive gas to form a plasma for chemical reaction with the surface of the material. That is, the plasma formed by ionizing the reaction gas can chemically react with the surface of the material, thereby changing the element content and performance of the surface of the material.

Specifically, the material adsorbed with the metal salt is placed in the reaction bin 20 of the plasma reaction equipment 100; the gas pressure in the reaction chamber 21 is reduced to below 300 Pa by using the vacuum pump 42, and the reaction gas (the monoatomic gas is ammonia, and the metal particles and the oxide are argon) is introduced into the reactor chamber by using the gas supply module 50; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) opening the radio frequency module 60, exciting the plasma to process the material, wherein the single reaction time can be 1min-2h (the times can be repeated) along with the state of the sample, and taking out the material after finishing, thus obtaining the corresponding needed single atom, metal particle or oxide.

For example, a method of enhancing the hydrophilicity of a material surface is provided: putting the material to be treated into a reaction bin 20 of the plasma reaction equipment 100; reducing the gas pressure in the reaction chamber 21 to below 300 Pa by using the vacuum pump 42, and introducing oxygen into the reactor chamber by using the gas supply module 50; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) turning on the radio frequency power supply 62, exciting the plasma to carry out hydrophilic treatment reaction on the material, wherein the time of single reaction can be 1min-2h (the times can be repeated), so that oxygen-containing functional groups are formed on the surface of the material, and taking out the material after the reaction is finished, thus obtaining the material with better hydrophilicity.

As another example, a method of enhancing the hydrophobicity of a surface of a material is provided: putting the material to be treated into a reaction bin 20 of the plasma reaction equipment 100; reducing the gas pressure in the reaction chamber 21 to below 300 pa by using the vacuum pump 42, and introducing the carbon tetrafluoride gas into the reactor chamber by using the gas supply module 50; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) turning on the radio frequency power supply 62, exciting the plasma to perform hydrophobic water treatment reaction on the material, wherein the time of single reaction can be 1min-2h (the times can be repeated), so that fluorine-containing functional groups are formed on the surface of the material, and taking out the material after the reaction is finished, thus obtaining the material with better hydrophobicity.

For another example, a method of synthesizing a metal nanoparticle-supported material is provided. The platinum nano-particle material loaded by the carbon material has wide application in fuel cells and various catalytic reactions, and the common synthetic method mainly adopts a chemical method and a high-temperature calcination method, but has the defects of high energy consumption, large pollution and complex process. In order to effectively solve the above problem, in this embodiment, a graphene material adsorbed with platinum salt (chloroplatinic acid) is loaded into the reaction chamber 20 of the plasma reaction apparatus 100, the interior of the reaction chamber 20 is evacuated to 10Pa, argon gas with a flow rate of 10SCCM is introduced, the rotation speed of the reaction chamber 20 is set to 20r/min, and the cooling system 80 is opened to cool the rf coil 64. And finally, starting the radio frequency module 60, setting the power to be 800W, and setting the reaction time to be 5min, so as to obtain the graphene-loaded platinum nanoparticle material.

For another example, a method of synthesizing a metal monatomic support material is provided. The metal single atom has wide application in various catalytic reactions, and the common synthetic method mainly adopts a chemical method and a high-temperature calcination method, but has the defects of high energy consumption, large pollution and complex process. In order to effectively solve the above problems, in this embodiment, a graphene material with an adsorbed iron salt (ferric chloride, the mass ratio of which is 3% of the total mass) is loaded into the reaction chamber 20 of the plasma reaction apparatus 100, the interior of the reaction chamber 20 is evacuated to 10Pa, ammonia gas with a flow rate of 10SCCM (the ammonia gas provides nitrogen doping sites for anchoring single atoms) is introduced, the rotation speed of the reaction chamber 20 is set to 20r/min, and the cooling system 80 is opened to cool the rf coil 64. And finally, starting the radio frequency module 60, setting the power to be 800W, and setting the reaction time to be 5min to obtain the graphene-loaded iron monatomic material.

In other embodiments, the process gas is a dopant gas, and radio frequency waves are emitted into the reaction chamber 21 to excite the dopant gas to form a plasma to dope elements on the surface of the material.

Specifically, a material to be processed is placed in the reaction chamber 21 of the plasma reaction apparatus 100; reducing the gas pressure in the reaction chamber 21 to below 300 Pa by using the vacuum pump 42, and introducing the reaction gas into the reaction chamber 21 by using the gas supply module 50; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) turning on the radio frequency power supply 62, exciting the plasma to dope the material, wherein the single reaction time can be 1min-2h (the times can be repeated) along with the state of the sample, and taking out the material after finishing.

For example, graphene, as a high-performance electro-catalytic material and a transistor material, can effectively change the physicochemical properties thereof after being doped on the surface thereof, especially after being doped with nitrogen, thereby improving the performance thereof. In this embodiment, the graphene material is loaded into the reaction chamber 21 of the plasma reaction apparatus 100, the reaction chamber 21 is evacuated to 10Pa, the rotation speed of the reaction chamber 20 is set to 20r/min, ammonia gas with a flow rate of 10SCCM is introduced into the reaction chamber 20, and the circulating cooling water is opened to cool the rf coil 64. And finally, starting the radio frequency module 60, setting the power to be 800W, setting the reaction time to be 5min, wherein the main component of the graphene is carbon, and nitrogen is introduced after the nitrogen plasma etching, so that the nitrogen-doped graphene can be obtained finally.

In other embodiments, the process gas is a cladding gas, and radio frequency waves are emitted into the reaction chamber 21 to excite the cladding gas to form a plasma material deposit material cladding the material surface.

Specifically, a material to be treated is placed in a plasma reactor; reducing the gas pressure in the reaction chamber 21 to below 300 Pa by using a vacuum pump 42, and introducing methane gas into the reaction chamber 21 by using a gas supply device; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) opening the radio frequency module 60, exciting plasma to process the material, wherein the single reaction time can be 1min-2h (the times can be repeated) along with the state of the sample, and realizing the carbon coating treatment on the surface of the material.

For example, coated carbon synthesis to produce composites is an enhancement of LiFePO₄Material conductivity and LiFePO₄Electrical conductivity between the particles and the collectorThe effective method of (2) and carbon coating can effectively improve the rate capability of the material. In the embodiment, an efficient carbon coating method is provided, plasma is used for carbon coating of the electrode material, and the coated carbon has the characteristics of amorphous shape and porosity. Firstly, LiFePO is added₄The (lithium battery common electrode material) material is loaded into the reaction cavity 21 of the plasma reaction device 100, the reaction cavity 21 is vacuumized to 10Pa, the rotating speed of the reaction cabin 20 is set to 20r/min, methane with 10SCCM flow is introduced (the methane plasma can deposit carbon on the surface of an object), and the cooling system 80 is started to cool the radio frequency coil 64. Then, the radio frequency module 60 is started, the power is set to 1000W, the reaction time is set to 30min, and finally the carbon-coated LiFePO can be obtained₄An electrode material.

For another example, a method for coating a metal compound on a surface of a material is provided: putting the material to be treated into a reaction bin 20 of the plasma reaction equipment 100; reducing the gas pressure in the reaction chamber 21 to 300 pa or less by using the vacuum pump 42, and introducing the metal source gas into the reactor chamber by using the gas supply module 50; the rotating speed of the reaction bin 20 is controlled to ensure that the materials are uniformly stirred; and (3) turning on the radio frequency power supply 62, exciting the plasma to carry out metal compound coating treatment reaction on the material, wherein the time length of a single reaction can be 1min-2h (the times can be repeated), so that the surface layer of the material is coated by the metal compound, and taking out the material after the reaction is finished, thus obtaining the material coated by the metal compound.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.