阅读说明：本技术 具有正面和背面天线的射频装置 (Radio frequency device with front and back antennas ) 是由 彼得·拉姆 于 2021-03-25 设计创作，主要内容包括：本发明的实施例提供了一种射频装置。所述射频装置包括具有射频电路的射频设备。此外,所述射频装置包括具有至少两个天线的柔性基板,其中,所述射频电路耦合到所述至少两个天线,并且其中,所述柔性基板至少部分地围绕所述射频设备布置,其中,所述至少两个天线中的至少一个第一天线被布置在所述射频设备的第一面附近并且所述至少两个天线中的至少一个第二天线被布置在所述射频设备的与所述第一面相对的第二面附近。(An embodiment of the present invention provides a radio frequency device. The radio frequency apparatus includes a radio frequency device having a radio frequency circuit. Further, the radio frequency apparatus includes a flexible substrate having at least two antennas, wherein the radio frequency circuitry is coupled to the at least two antennas, and wherein the flexible substrate is disposed at least partially around the radio frequency device, wherein at least one first antenna of the at least two antennas is disposed near a first face of the radio frequency device and at least one second antenna of the at least two antennas is disposed near a second face of the radio frequency device opposite the first face.)

1. A radio frequency device (100) comprising:

a radio frequency device (102) having radio frequency circuitry (104), and

a flexible substrate (106) having at least two antennas (108_1, 108_2),

wherein the radio frequency circuit (104) is coupled to the at least two antennas (108_1, 108_2) and

wherein the flexible substrate (106) is arranged at least partially around the radio frequency device (102), wherein at least one first antenna (108_1) of the at least two antennas (108_1, 108_2) is arranged near a first face (110_1) of the radio frequency device (102) and at least one second antenna (108_2) of the at least two antennas (108_1, 108_2) is arranged near a second face (110_2) of the radio frequency device (102) opposite to the first face (110_ 1).

2. The radio frequency device (100) of claim 1,

wherein the flexible substrate (106) is at least partially bent around the radio frequency device (102).

3. The radio frequency device (100) of claim 1,

wherein a first portion (112_1) of the flexible substrate (106) comprising the at least one first antenna (108_1) is arranged near or abutting on the first face (110_1) of the radio frequency device (102),

wherein a second portion (112_2) of the flexible substrate (106) comprising the at least one second antenna (108_2) is arranged near or abutting on the second face (110_2) of the radio frequency device (102).

4. The radio frequency device (100) of claim 1,

wherein the flexible substrate (106) comprises a metallization (116),

wherein the radio frequency circuit (104) is coupled to the at least two antennas (108_1, 108_2) via the metallization (116).

5. The radio frequency device (100) of claim 4,

wherein the metallization (116) is arranged in the same layer plane of the flexible substrate (106) as the at least two antennas (108_1, 108_2), or

Wherein the metallization (116) is arranged in a different layer plane of the flexible substrate (106) than the at least two antennas (108_1, 108_ 2).

6. The radio frequency device (100) of claim 4,

wherein the radio frequency device (102) comprises at least one terminal (114) coupled to the radio frequency circuitry (104),

wherein the at least one terminal (114) is coupled to the metallization (116) of the flexible substrate (106).

7. The radio frequency device (100) of claim 1,

wherein the radio frequency device (102) is a radio frequency board or a radio frequency IC.

8. A participant device (130) of a mobile radio communications system,

wherein the participating device (130) comprises a radio frequency apparatus (100) according to claim 1.

9. A method (200) for manufacturing a radio frequency device (100), the method (200) comprising:

-providing (202) a radio frequency device (102) with a radio frequency circuit (104),

providing (204) a flexible substrate (106) with at least two antennas (108_1, 108_2),

arranging (206) the flexible substrate (106) at least partially around the radio frequency device (102) such that at least one first antenna (108_1) of the at least two antennas (108_1, 108_2) is arranged near a first face (110_1) of the radio frequency device (102) and at least one second antenna (108_2) of the at least two antennas (108_1, 108_2) is arranged near a second face (110_2) of the radio frequency device (102) opposite to the first face (110_1), and

connecting (208) at least one terminal (114) of the radio frequency device (102) coupled to the radio frequency circuitry (104) to the at least two antennas (108_1, 108_ 2).

10. The method (200) of claim 9,

wherein the flexible substrate (106) is bent at least partially around the radio frequency device (102) when the flexible substrate is arranged (206) at least partially around the radio frequency device (102).

11. The method (200) of claim 9,

wherein a first portion (112_1) of the flexible substrate (106) comprising the at least one first antenna (108) is arranged near or abutting on the first face (110_1) of the radio frequency device (102) when the flexible substrate (106) is arranged (206) at least partially around the radio frequency device (102),

wherein a second portion (112_2) of the flexible substrate (106) comprising the at least one second antenna (108_2) is arranged near or abutting on the second face (110_2) of the radio frequency device (102) when the flexible substrate (106) is arranged (206) at least partially around the radio frequency device (102).

12. The method (200) of claim 9,

wherein, when connecting (208) at least one terminal (114) of the radio frequency device (102) coupled to the radio frequency circuitry (104) to the at least two antennas (108_1, 108_2), the at least one terminal (114) of the radio frequency device (102) is connected to at least one terminal (113) of the flexible substrate (106) coupled to the at least two antennas (108_1, 108_ 2).

13. The method (200) of claim 12,

wherein, when connecting (208) at least one terminal (114) of the radio frequency device (102) coupled to the radio frequency circuitry (104) to the at least two antennas (108_1, 108_2), an electrically conductive connection is provided between the terminal (114) of the radio frequency device (102) and the terminal (113) of the flexible substrate (106).

14. The method (200) of claim 9,

wherein the at least two antennas (108_1, 108_2) are provided in the flexible substrate (106) when the flexible substrate (106) is provided (204).

15. The method (200) of claim 14,

wherein, when the flexible substrate (106) is provided (204), a metallization (116) connected to the at least two antennas (108_1, 108_2) is provided in the flexible substrate.

16. The method (200) of claim 15,

wherein the metallization (116) is provided in the same layer plane of the flexible substrate (106) as the at least two antennas (108_1, 108_2), or

Wherein the metallization (116) is provided in a different layer plane of the flexible substrate (106) than the at least two antennas (108_1, 108_ 2).

17. The method (200) of claim 15,

wherein, when the flexible substrate (106) is provided (204), a connection is provided between at least one terminal of the flexible substrate (106) and the metallization (116).

Technical Field

Embodiments of the present invention relate to radio frequency devices, and in particular, to radio frequency devices having front and back antennas. Other embodiments relate to methods for manufacturing radio frequency devices.

Background

Traditionally, when establishing a system for mobile communication, the electrical connection of the rear antenna structure is achieved via vertical connections (so-called copper pillars) within a Printed Circuit Board (PCB), as exemplarily shown in fig. 1.

In particular, fig. 1 shows a cross-sectional view [1] of an antenna board 10 with a back antenna structure 12 connected via a so-called copper pillar 14.

However, such radio frequency circuits (radio frequency integrated circuits — RFICs) having back antenna structures electrically linked via vertical connections are relatively expensive and complex to manufacture.

It is therefore an underlying object of the invention to provide a radio frequency circuit with a back-side antenna structure which is cheaper and easier to manufacture.

Disclosure of Invention

This object is achieved by the independent claims.

Further advantageous developments are the subject matter of the dependent claims.

Embodiments provide a radio frequency device. The radio frequency apparatus includes a radio frequency device having a radio frequency circuit. Furthermore, the radio frequency apparatus comprises a flexible substrate having at least two antennas, wherein the radio frequency circuitry is coupled to the at least two antennas, and wherein (such that, for example) the flexible substrate is arranged at least partially around the radio frequency device, wherein at least one first antenna of the at least two antennas is arranged near a first face (e.g. a first surface) of the radio frequency device and at least one second antenna of the at least two antennas is arranged near a second face (e.g. a second surface) of the radio frequency device opposite to the first face.

In an embodiment, the flexible substrate is bent at least partially around the radio frequency device.

In an embodiment, a first portion of the flexible substrate comprising the at least one first antenna is arranged near the first side of the radio frequency device, wherein a second portion of the flexible substrate comprising the at least one second antenna is arranged near the second side of the radio frequency device.

In an embodiment, a first portion of the flexible substrate comprising the at least one first antenna abuts on the first side of the radio frequency device, wherein a second portion of the flexible substrate comprising the at least one second antenna abuts on the second side of the radio frequency device.

In an embodiment, the at least two antennas may be arranged in different planes of the radio frequency device.

In an embodiment, the first portion of the flexible substrate and the second portion of the flexible substrate may be arranged in different planes of the radio frequency device.

In an embodiment, the radio frequency device may be arranged between the at least two antennas.

In an embodiment, the flexible substrate may comprise metallization, wherein the radio frequency circuitry may be coupled to the at least two antennas via the metallization.

In an embodiment, the metallization is arranged in the same layer plane of the flexible substrate as the at least two antennas.

In an embodiment, the metallization is arranged in a different layer plane of the flexible substrate than the at least two antennas.

In an embodiment, the radio frequency device comprises: at least one terminal coupled to the radio frequency circuitry, wherein the at least one terminal is coupled to the metallization of the flexible substrate.

In an embodiment, the radio frequency device is a Radio Frequency Integrated Circuit (RFIC).

Other embodiments provide a mobile radio communications device comprising a radio frequency apparatus according to any of the embodiments previously described herein.

Other embodiments provide a method for manufacturing a radio frequency device. The method comprises the following steps: a radio frequency device having a radio frequency circuit is provided. Further, the method comprises: a flexible substrate having at least two antennas is provided. Further, the method comprises: disposing the flexible substrate at least partially around the radio frequency device such that at least one first antenna of the at least two antennas is disposed near a first face of the radio frequency device and at least one second antenna of the at least two antennas is disposed near a second face of the radio frequency device opposite the first face. Further, the method comprises: connecting at least one terminal of the radio frequency device coupled to the radio frequency circuitry to the at least two antennas.

In an embodiment, the flexible substrate is bent at least partially around the radio frequency device when the flexible substrate is arranged at least partially around the radio frequency device.

In an embodiment, a first portion of the flexible substrate comprising the at least one first antenna is arranged near or abutting on the first face of the radio frequency device when the flexible substrate is arranged at least partially around the radio frequency device, wherein a second portion of the flexible substrate comprising the at least one second antenna is arranged near or abutting on the second face of the radio frequency device when the flexible substrate is arranged at least partially around the radio frequency device.

In an embodiment, when connecting the at least one terminal of the radio frequency device coupled to the radio frequency circuitry to the at least two antennas, the at least one terminal of the radio frequency device is connected to the at least one terminal of the flexible substrate coupled to the at least two antennas.

In an embodiment, when connecting at least one terminal of the radio frequency device coupled to the radio frequency circuitry to the at least two antennas, a conductive connection is provided between the terminal of the radio frequency device and the terminal of the flexible substrate.

In an embodiment, the at least two antennas are provided in the flexible substrate when the flexible substrate is provided.

In an embodiment, when the flexible substrate is provided, metallization connected to the at least two antennas is provided in the flexible substrate.

In an embodiment, the metallization is provided in the same layer plane of the flexible substrate as the at least two antennas.

In an embodiment, the metallization is provided in a different layer plane of the flexible substrate than the at least two antennas.

In an embodiment, when the flexible substrate is provided, a connection is provided between at least one terminal of the flexible substrate and the metallization.

Other embodiments provide an apparatus. The apparatus comprises radio frequency circuitry. Further, the apparatus comprises: at least one conductive connection from a top surface of the radio frequency circuitry to at least one terminal member. Further, the apparatus comprises: a flexible substrate having an antenna therein, the antenna being conductively connected to metallization; and at least one electrically conductive connection between the terminal component and the metallization, wherein the flexible substrate is arranged around the radio frequency circuitry such that at least one antenna is located above the radio frequency circuitry and at least one antenna is located below the radio frequency circuitry.

Embodiments of the present invention provide a system arrangement for a mobile radio communications device using radio frequency circuitry (e.g. RFIC) on a flexible substrate with integrated antenna structures (front and rear antennas) for front and rear reception and transmission.

Embodiments of the present invention provide a method for manufacturing an electronic radio frequency system, in particular a highly integrated so-called system-in-package for use in mobile communication.

Embodiments of the present invention enable the electrical connection of at least one radio frequency circuit to a front antenna and a back antenna via a special flexible wiring substrate with integrated antenna structures (front and back antennas).

Drawings

Embodiments of the invention will be described in more detail below with reference to the accompanying drawings, in which:

figure 1 shows a cross-sectional view of a conventional antenna board with a back antenna structure coupled via a so-called copper pillar 1,

figure 2 shows a schematic cross-sectional view of a radio frequency device according to an embodiment of the invention,

figure 3 shows a schematic cross-sectional view of a radio frequency device according to another embodiment of the invention,

figure 4 shows a schematic block circuit diagram of a participating device 130 of a mobile radio communication system having radio frequency means according to an embodiment of the present invention,

FIG. 5 shows a flow chart of a method for manufacturing a radio frequency device, according to an embodiment of the invention, an

Fig. 6 shows a flow diagram of a method for connecting a radio frequency circuit to an arrangement of antennas according to an embodiment of the invention.

Detailed Description

In the following description of embodiments of the invention, identical elements or elements of identical effect are provided with the same reference numerals in the figures, so that the description thereof is equally interchangeable.

Fig. 2 shows a schematic cross-sectional view of a radio frequency device 100 according to an embodiment of the invention. The radio frequency device 100 includes: a radio frequency device 102 including radio frequency circuitry 104; and a flexible substrate 106 having at least two antennas 108_1 and 108_2, wherein the radio frequency circuit 100 is coupled (or connected) to the at least two antennas 108_1 and 108_2, and wherein the flexible substrate 106 is at least partially arranged around the radio frequency device 102, wherein at least one first antenna 108_1 of the at least two antennas 108_1 and 108_2 is arranged near a first face 110_1 of the radio frequency device 102 and at least one second antenna 108_2 of the at least two antennas 108_1 and 108_2 is arranged near a second face 110_2 of the radio frequency device opposite to the first face 110_ 1.

In an embodiment, the at least one first antenna 108_1 may thus form at least one front antenna of the radio frequency device 100, wherein the at least one second antenna 108_2 may form at least one back antenna of the radio frequency device 100.

To accomplish this, the flexible substrate 106 (which may be as shown in fig. 2) may be bent at least partially around the radio frequency device 102 such that, for example, a first portion 112_1 of the flexible substrate 106 including at least one first antenna 108_1 is disposed near or abutting on the first face 110_1 of the radio frequency device 102 and a second portion 112_2 of the flexible substrate 106 including at least one second antenna 108_2 is disposed near or abutting on the second face 110_2 of the radio frequency device 102.

In fig. 2, the radio frequency device 100 illustratively includes only two antennas 108_1 and 108_ 2. However, it is noted that in embodiments the radio frequency device 100 may also comprise more than two antennas. Thus, the RF device 100 may include up to n antennas, n being a natural number greater than or equal to 2, n ≧ 2. Here, at least one first antenna of the n antennas may be arranged near the first side 110_1 of the radio frequency device 102, and at least one second antenna of the n antennas may be arranged near the second side 110_2 of the radio frequency device 102.

The radio frequency arrangement 100 may for example comprise 4 antennas, wherein at least one first antenna 108_1 of the 4 antennas (e.g. 1 antenna, 2 antennas or 3 antennas of the 4 antennas) may for example be arranged near the first face 110_1 of the radio frequency device 102, wherein at least one second antenna 108_2 of the 4 antennas (e.g. 1 antenna, 2 antennas or 3 antennas of the 4 antennas) may for example be arranged near the second face 110_1 of the radio frequency device 102.

In an embodiment, the radio frequency device may be a radio frequency board or a Radio Frequency Integrated Circuit (RFIC).

As already mentioned, the radio frequency circuit 104 may be coupled to at least two antennas 108_1 and 108_ 2. Coupled here means directly connected (e.g., via a wire), or indirectly connected (e.g., with a coupling element (e.g., a capacitive coupler) connected in between).

In an embodiment, the radio frequency circuitry 104 may be coupled to the at least two antennas 108_1 and 108_2 via at least one terminal 114 of the radio frequency device 102 coupled to the radio frequency circuitry.

Optionally, the flexible substrate 106 may include at least one terminal 113 coupled (or connected) to the at least two antennas 108_1 and 108_ 2. In this case, at least one terminal 114 of the radio frequency device 102 may be coupled (or connected) to at least one terminal 113 of the flexible substrate.

Here, the at least one terminal 114 of the radio frequency device 102 may be arranged exclusively at a single face of the radio frequency device 102, such as the first face 110_1 (shown in fig. 2) of the radio frequency device 102, or alternatively at the second face 110_2 of the radio frequency device.

Here, the at least two antennas 108_1 and 108_2 may be coupled (or connected) to the at least one terminal 114 via metallization, as shown in fig. 3.

Fig. 3 shows a schematic cross-sectional view of a radio frequency device 100 according to another embodiment of the invention. As an addition to fig. 2, in fig. 3 a metallization 116 is shown, wherein at least two antennas 108_1 and 108_2 are coupled (or connected) to at least one terminal 114 of the radio frequency device 102 via this metallization 116.

Here, the metallization 116 may be arranged in a different plane of the flexible substrate 106 than the at least two antennas 108_1 and 108_ 2. Illustratively, the flexible substrate 106 (as shown in fig. 3) may include three planes 118_1, 118_2, and 118_3, wherein the at least two antennas 108_1 and 108_2 may be disposed (or formed) in the first plane 118_1 of the flexible substrate 106, and the metallization may be disposed (or formed) in the third plane 118_3 of the flexible substrate 106.

Alternatively, the metallization 116 may also be arranged (or formed) in the same plane of the flexible substrate 106 as the at least two antennas 108_1 and 108_2, e.g. in the first plane 118_1 of the flexible substrate 106. In this case, the flexible substrate may also include only a single plane.

In other words, fig. 3 shows a schematic block circuit diagram of the apparatus 100 according to an embodiment. The apparatus 100 comprises a radio frequency circuit arrangement 102. Further, the apparatus 100 comprises: at least one conductive connection 115 from the top surface of the radio frequency circuitry 102 to the at least one terminal member 114. Further, the apparatus 100 comprises: a flexible substrate 106 and at least one conductive connection 117, wherein there are an antenna 108_1 and an antenna 108_2 in the flexible substrate 106, the antenna 108_1 and the antenna 108_2 are conductively connected to the metallization 116, the at least one conductive connection 117 is between the terminal part 114 and the metallization 116, wherein the flexible substrate 106 is arranged around the radio frequency circuit device 102 such that the at least one antenna 108_1 is located above the radio frequency circuit device 102 and the at least one antenna 108_2 is located below the radio frequency circuit device 102.

In an embodiment, the layer plane of the antenna may be used for electrical connection of the antenna instead of metallization.

As exemplarily shown in fig. 4, the aforementioned radio frequency apparatus 100 may be implemented, for example, in a participant device of a mobile radio communication system.

Fig. 4 shows a schematic block circuit diagram of a participant device 130 of a mobile radio communication system (e.g., 3G, LTE or 5G) including a radio frequency apparatus 100 according to an embodiment of the present invention.

In an embodiment, the radio frequency apparatus 100 may be connected to a baseband component 132, e.g., a baseband board, of the participant device 130.

The participant devices 130 may illustratively be mobile terminal devices (user equipment) or internet of things (IoT) nodes.

Fig. 5 shows a flow diagram of a method 200 for manufacturing a radio frequency device according to an embodiment of the invention. The method 200 includes step 202: a radio frequency device 102 is provided having radio frequency circuitry 104. Further, the method 200 comprises step 204: a flexible substrate 106 having at least two antennas 108_1 and 108_2 is provided. Further, the method 200 comprises step 206: the flexible substrate 106 is arranged at least partially around the radio frequency device 102 such that at least one first antenna 108_1 of the at least two antennas 108_2 is arranged near a first face 110_1 of the radio frequency device 102 and at least one second antenna 108_2 of the at least two antennas 108_1 and 108_2 is arranged near a second face 110_2 of the radio frequency device 120 opposite to the first face 110_ 1. Further, the method 200 includes step 208: at least one terminal 114 of the radio frequency device 102 coupled to the radio frequency circuitry 104 is connected to at least two antennas 108_1 and 108_ 2.

Fig. 6 shows a flow diagram of a method 220 for connecting the radio frequency circuit 102 to the arrangement of antennas 108_1 and 108_2 according to an embodiment of the invention. The method 220 includes step 222: a radio frequency circuit arrangement 102 is provided. Further, the method 220 includes the step 224: at least one conductive connection 115 is provided from the top surface of the radio frequency circuitry 102 to the at least one terminal member 114. Further, the method 220 includes the step 226: a flexible substrate 106 is provided. Further, the method 220 includes the step 228: antennas 108_1 and 108_2 are provided in the flexible substrate 106, the antennas 108_1 and 108_2 being connected to the metallization 116 in an electrically conductive manner. Further, the method 220 includes the step 230: at least one electrically conductive connection 117 is provided between the terminal part 114 and the metallization 116. Further, the method 220 includes the step 232: the flexible substrate 106 is arranged around the radio frequency circuitry device 102 such that at least one antenna 108_1 is located above the radio frequency circuitry device 102 and at least one antenna 108_2 is located below the radio frequency circuitry device 102.

In an embodiment, the layer plane of the antenna 108_1 may also be used for electrical connection of the antenna 108_1 instead of the metallization 116. This means that the metallization for antenna control can be provided by the same process steps as for manufacturing the antenna structure.

Although some aspects have been described in connection with an apparatus, it should be understood that these aspects also represent a description of the corresponding method, such that a block or element of the apparatus is understood to be also a corresponding method step or a feature of a method step. Similarly, aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding apparatus. Some or all of the method steps may be performed by (or using) hardware means, such as a microprocessor, a programmable computer or electronic circuitry, for example. In some embodiments, some or several of the most important method steps may be performed by such means.

The above-described embodiments are merely illustrative of the principles of the present invention. It is to be understood that modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. Accordingly, the invention is intended to be limited only by the scope of the appended claims and not by the specific details set forth herein which have been presented using the description and discussion of the embodiments.

List of references

[1]SystemPlus Report2018 by System Plus ConSussing | Qualcomm WiGig60 GHz Chipset Smartphone Edition (System + report)2018, system + consult | highpass WiGig60 GHz chipset smart phone version).