阅读说明：本技术 用于无掩模光刻技术的半色调方案 (Half-tone scheme for maskless lithography ) 是由 克里斯多弗·丹尼斯·本彻 约瑟夫·R·约翰逊 托马斯·L·莱蒂格 于 2020-01-24 设计创作，主要内容包括：本文描述的实施方式提供光刻工艺的系统、软件应用、及方法,以在单程中写入全色调部分及灰色调部分。实施方式包括经构造以提供掩模图案数据至光刻系统的控制器。控制器经构造以通过至少灰色调组的空间光调制器像素和全色调组的空间光调制器像素来在空间上划分多个空间光调制器像素。当由控制器划分时,灰色调组的空间光调制器像素是可操作的,以将第一数量的多次发射投射至多个全色调曝光多边形及多个灰色调曝光多边形,而全色调组的空间光调制器像素是可操作的,以将第二数量的多次发射投射至多个全色调曝光多边形。(Embodiments described herein provide systems, software applications, and methods of a lithographic process to write full tone portions and gray tone portions in a single pass. Embodiments include a controller configured to provide mask pattern data to a lithography system. The controller is configured to spatially divide the plurality of spatial light modulator pixels by at least the spatial light modulator pixels of the gray tone group and the spatial light modulator pixels of the full tone group. When divided by the controller, the spatial light modulator pixels of the gray tone group are operable to project a first number of multiple shots to the plurality of full tone exposure polygons and the plurality of gray tone exposure polygons, and the spatial light modulator pixels of the full tone group are operable to project a second number of multiple shots to the plurality of full tone exposure polygons.)

1. A system, comprising:

a flat plate;

a movable stage capable of being disposed over the plate, the stage configured to support a substrate having a photoresist disposed thereon;

an encoder coupled to the stage, the encoder configured to provide a position of the substrate to a controller, the controller configured to provide mask pattern data to a lithography system, the mask pattern data having a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons; and

a lithography system support coupled to the plate, the lithography system support having an opening to allow passage of the plate under the lithography system support, wherein:

the lithography system has a processing unit with a plurality of image projection systems that receive the mask pattern data;

each image projection system includes a spatial light modulator having a plurality of spatial light modulator pixels to project a plurality of shots; and is

The controller is configured to spatially divide the spatial light modulator pixels by at least a gray tone set of spatial light modulator pixels and a full tone set of spatial light modulator pixels; when divided by the controller, the controller may,

the spatial light modulator pixels of the gray tone group are operable to project a first number of the plurality of shots to the full tone exposure polygon and the gray tone exposure polygon; and

the full-tone set of spatial light modulator pixels is operable to project a second number of the multiple shots to the full-tone exposed polygon.

2. The system of claim 1, wherein each spatial light modulator pixel of the plurality of spatial light modulator pixels of the spatial light modulator is independently controllable and is configured to project a write beam corresponding to a pixel of a plurality of pixels.

3. The system of claim 2, wherein the spatial light modulator is an array of electrically addressable elements.

4. The system of claim 3, wherein the spatial light modulator pixels of at least one electrically addressable element are mirrors spatially divided by the gray tone group and the full tone group.

5. The system of claim 1, wherein:

said first number of said multiple shots being equal to said second number of said multiple shots such that a gray tone dose is equal to one-half of a full tone dose;

the first quantity is less than the second quantity such that the gray tone dose is less than half of the full tone dose; and is

The first quantity is greater than the second quantity such that the gray tone dose is greater than half of the full tone dose.

6. A non-transitory computer readable medium storing instructions that, when executed by a processor, cause a computer system to:

providing mask pattern data having a plurality of exposure polygons to a processing unit of a lithography system, the processing unit having a plurality of image projection systems that receive the mask pattern data, the mask pattern data having a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons; and

performing a single scan of the substrate having the photoresist disposed thereon under the image projection system:

projecting at least a first number of multi-shots to the full-tone exposure polygon and the gray-tone exposure polygon through spatial light modulator pixels of a gray-tone group; and

projecting at least a first number of the plurality of shots to the full-tone exposed polygon through a full-tone set of spatial light modulator pixels.

7. The non-transitory computer readable medium of claim 6, wherein each image projection system includes a spatial light modulator having spatial light modulator pixels of the gray tone set and spatial light modulator pixels of the full tone set to project the multiple emissions to a plurality of address points of a collective emission pattern.

8. The non-transitory computer readable medium of claim 7, wherein the multiple emissions form a plurality of graytone portions having graytone emission address points exposed to the first number of the multiple emissions and the multiple emissions form a plurality of full tone portions having full tone emission address points exposed to the first number and the second number of the multiple emissions.

9. The non-transitory computer-readable medium of claim 6, wherein the first number of the multiple shots corresponds to a gray tone dose and a combination of the first number and the second number of the multiple shots corresponds to a full tone dose.

10. The non-transitory computer readable medium of claim 9, wherein:

said first number of said multiple shots being equal to said second number of said multiple shots such that said gray tone dose is equal to one-half of said full tone dose;

the first quantity is less than the second quantity such that the gray tone dose is less than half of the full tone dose; and is

The first quantity is greater than the second quantity such that the gray tone dose is greater than half of the full tone dose.

11. The non-transitory computer readable medium of claim 6, wherein the light beam generated by the light source of each image projection system has an intensity.

12. A method comprising the steps of:

providing mask pattern data having a plurality of exposure polygons to a processing unit of a lithography system, the processing unit having a plurality of image projection systems that receive the mask pattern data, the mask pattern data having a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons; and

performing a single scan of the substrate having the photoresist disposed thereon under the plurality of image projection systems:

projecting, by a spatial light modulator pixel of a gray tone group, at least a first number of multiple shots to the full tone exposure polygon and the gray tone exposure polygon; and

projecting at least a second number of the multiple shots to the full-tone exposed polygon through a full-tone set of spatial light modulator pixels.

13. The method of claim 12, wherein the first number of the multiple shots corresponds to a gray tone dose and a combination of the first number and the second number of the multiple shots corresponds to a full tone dose.

14. The method of claim 14, wherein:

said first number of said multiple shots equal to said second number of said multiple shots results in said gray tone dose being equal to one-half of said full tone dose;

the first quantity is less than the second quantity such that the gray tone dose is less than half of the full tone dose; and is

The first quantity is greater than the second quantity such that the gray tone dose is greater than half of the full tone dose.

15. The method of claim 12, wherein each image projection system comprises a spatial light modulator having the gray tone set of spatial light modulator pixels and the full tone set of spatial light modulator pixels to project the multiple shots to multiple address points of an aggregate emission pattern.

Technical Field

Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to systems, software applications, and methods of photolithography processes to write full tone portions and gray tone portions in a single pass.

Background

Photolithography is widely used in the manufacture of semiconductor devices, such as for back-end processing of semiconductor devices, and display devices, such as Liquid Crystal Displays (LCDs). For example, large area substrates are often employed in the manufacture of LCDs. LCDs (or flat panel displays) are commonly used in active matrix displays such as computers, touch pad devices, Personal Digital Assistants (PDAs), cell phones, television screens, and the like. Generally, flat panel displays include a layer of liquid crystal material sandwiched between two plates as the phase change material at each pixel. When power from a power source is applied at or through the liquid crystal material, the amount of light passing through the liquid crystal material is controlled (i.e., selectively modulated) at the pixel locations, enabling an image to be generated on the display.

With known lithography systems, in order to write a pattern having a plurality of full-tone portions (full-tone portions having a full-tone dose) and a plurality of gray-tone portions (gray-tone portions having a gray-tone dose) into a photoresist disposed over a substrate, the substrate is required to pass under a writeable area of the lithography system multiple times. Multiple passes of the substrate under the writable area of the digital lithography system reduces throughput.

Accordingly, there is a need in the art for systems, software applications, and methods for lithographic processes that write full tone portions and gray tone portions in a single pass.

Disclosure of Invention

In one embodiment, a system is provided. The system includes a plate, and a movable platform positionable above the plate. The stage is configured to support a substrate having a photoresist disposed thereon, and the encoder is coupled to the stage and configured to provide a position of the substrate to a controller configured to provide mask pattern data to the lithography system. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons. The lithography system support is coupled to a plate having an opening to allow the platen to pass under the lithography system support. The lithography system has a processing unit with a plurality of image projection systems that receive mask pattern data. Each image projection system includes a spatial light modulator having a plurality of spatial light modulator pixels to project multiple shots (shots). The controller is configured to spatially divide the plurality of spatial light modulator pixels by at least spatial light modulator pixels of the gray tone group and the full tone group. When divided by the controller, the spatial light modulator pixels of the gray tone group are operable to project a first number of multi-shots to the plurality of full-tone exposure polygons and the plurality of gray-tone exposure polygons. When divided by the controller, the spatial light modulator pixels of the full-tone group are operable to project a second number of multiple shots to the plurality of full-tone exposure polygons.

In another embodiment, a non-transitory computer readable medium is provided. The computer readable medium stores instructions that, when executed by the processor, cause the computer system to perform the steps of: providing mask pattern data having a plurality of exposure polygons to a processing unit of a lithography system, projecting at least a first number of multiple shots to a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons by spatial light modulator pixels of a gray-tone group and projecting at least a second number of multiple shots to a plurality of full-tone exposure polygons by spatial light modulator pixels of the full-tone group in a single scan of a substrate having a photoresist disposed thereon under a plurality of image projection systems. The processing unit has a plurality of image projection systems that receive mask pattern data. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons.

In yet another embodiment, a method is provided. The method includes providing mask pattern data having a plurality of exposure polygons to a processing unit of a lithography system. The processing unit has a plurality of image projection systems that receive mask pattern data. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons. In a single scan of a substrate having a photoresist disposed thereon under a plurality of image projection systems, the method comprising: at least a first number of multi-shots are projected by the spatial light modulator pixels of the halftone group to the plurality of full-tone exposure polygons and the plurality of gray-tone exposure polygons, and at least a second number of multi-shots are projected by the spatial light modulator pixels of the full-tone group to the plurality of full-tone exposure polygons.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

FIG. 1 is a perspective view of a system according to an embodiment.

FIG. 2A is a schematic cross-sectional view of an image projection system according to one embodiment.

Fig. 2B and 2C are schematic diagrams of a spatial light modulator according to an embodiment.

FIG. 3 is a schematic diagram of a computing system, according to an embodiment.

FIG. 4 is a schematic diagram of a single pass lithography application according to an embodiment.

FIG. 5 is a schematic diagram of a controller according to an embodiment.

FIG. 6A is a schematic plan view of a substrate after a photolithography process according to an embodiment.

Fig. 6B-6D are cross-sectional views of exposure of a photoresist at a cross-section according to an embodiment.

FIG. 7 is a flow chart of a method of a photolithography process according to one embodiment.

FIG. 8 is a flow chart of a method of a photolithography process according to one embodiment.

FIG. 9 is a flow chart of a method of a photolithography process according to one embodiment.

10A-10S are schematic plan views of a full tone exposure polygon and a gray tone exposure polygon during a method of a photolithography process, according to an embodiment.

FIG. 11 is a flow chart of a method of a photolithography process according to an embodiment.

12A-12F are schematic plan views of a full tone exposure polygon and a gray tone exposure polygon during a method of a photolithography process, according to an embodiment.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

Detailed Description

Embodiments described herein provide systems, software applications, and methods of a lithographic process, such as a digital lithographic process, to write full tone portions and gray tone portions in a single pass. One embodiment of the system includes a controller configured to provide mask pattern data to a lithography system. The mask pattern data has a plurality of full-tone exposure polygons and a plurality of gray-tone exposure polygons. The lithography system has a processing unit with a plurality of image projection systems that receive mask pattern data. Each image projection system includes a spatial light modulator having a plurality of spatial light modulator pixels to project a plurality of shots. The controller is configured to spatially divide the plurality of spatial light modulator pixels by at least the spatial light modulator pixels of the gray tone group and the spatial light modulator pixels of the full tone group. When divided by the controller, the spatial light modulator pixels of the gray tone group are operable to project a first number of multi-shots to the plurality of full-tone exposure polygons and the plurality of gray-tone exposure polygons. When divided by the controller, the spatial light modulator pixels of the full-tone group are operable to project a second number of multiple shots to the plurality of full-tone exposure polygons.

Fig. 1 is a perspective view of a system 100, such as a digital lithography system, which may benefit from embodiments described herein. The system 100 includes a platform 114 and a processing device 104. The platform 114 is supported by a pair of rails 116 disposed on the plate 102. The substrate 120 is supported by the stage 114. The platform 114 is supported by a pair of rails 116 disposed on the plate 102. As indicated by the coordinate system shown in fig. 1, the platform 114 moves along a pair of rails 116 in the X direction. In one embodiment, which may be combined with other embodiments described herein, the pair of rails 116 is a pair of parallel magnetic channels. As shown, each rail of the pair of rails 116 extends in a straight path. An encoder 118 is coupled to the stage 114 to provide information of the position of the stage 114 to a controller 122.

The controller 122 is generally designed to facilitate the control and automation of the process techniques described herein. The controller 122 may be coupled to or in communication with the processing device 104, the platform 114, and the encoder 118. The processing apparatus 104 and the encoder 118 may provide information regarding substrate processing and substrate alignment to the controller 122. For example, the processing tool 104 may provide information to the controller 122 to alert the controller 122 that substrate processing is complete. The controller 122 facilitates control and automation of the methods of the photolithography process to write full tone portions and gray tone portions in a single pass. A program (or computer instructions), which may be read by the controller 122, which may be referred to as an imaging program, determines which tasks may be performed on the substrate 120. The program includes mask pattern data and code to monitor and control process time and substrate position. The mask pattern data corresponds to a pattern to be written in the photoresist using electromagnetic radiation.

Substrate 120 comprises any suitable material, such as glass, that is used as a component of a flat panel display. In other embodiments, which can be combined with other embodiments described herein, the substrate 120 is made of other materials that can be used as a component of a flat panel display. The substrate 120 has a thin film layer to be patterned formed thereon (such as a pattern etch thereof), and a photoresist layer formed on the thin film layer to be patterned, the photoresist layer being sensitive to electromagnetic radiation (e.g., UV or deep UV "light"). Positive tone photoresists include portions of the photoresist that are each soluble in a photoresist developer that is applied to the photoresist after a pattern is written into the photoresist using electromagnetic radiation when exposed to radiation. Negative-working photoresists comprise portions of the photoresist that, when exposed to radiation, will be individually insoluble in a photoresist developer that is applied to the photoresist after a pattern is written into the photoresist using electromagnetic radiation. The chemical composition of the photoresist determines whether the photoresist is a positive or negative photoresist. Examples of photoresists include, but are not limited to, at least one of the following: diazonaphthoquinone, phenol formaldehyde resin, polymethyl methacrylate, polymethyl glutarimide, and SU-8. After exposing the photoresist to electromagnetic radiation, the photoresist is developed to leave a patterned photoresist on the underlying thin film layers. The underlying thin film is then pattern etched through the openings in the photoresist using the patterned photoresist to form part of the electronic circuitry of the display panel.

The processing apparatus 104 includes a support 108 and a processing unit 106. The processing device 104 spans the pair of rails 116 and is disposed on the plate 102 and thus includes an opening 112 for passage of the pair of rails 116 and the platform 114 under the processing unit 106. The processing unit 106 is supported above the plate 102 by supports 108. In one embodiment, which can be combined with other embodiments described herein, the processing unit 106 is a pattern generator configured to expose photoresist in a photolithography process. In some embodiments, which can be combined with other embodiments described herein, the pattern generator is configured to perform a maskless lithography process. The processing unit 106 includes a plurality of image projection systems. An example of an image projection system is shown in fig. 2A. In one embodiment, which may be combined with other embodiments described herein, the processing unit 106 includes up to 84 image projection systems. Each image projection system is disposed in a housing 110. The processing unit 106 may be used for maskless direct pattern writing of a photoresist or other electromagnetic radiation sensitive material.

Fig. 2A is a schematic cross-sectional view of an image projection system 200 that may be used in the system 100. The image projection system 200 includes a spatial light modulator 210 and projection optics 212. The components of the image projection system 200 vary depending on the spatial light modulator 210 used. The spatial light modulator 210 comprises an array of electrically addressable elements. The electrically addressable components include, but are not limited to, digital micro-mirrors, Liquid Crystal Displays (LCDs), liquid crystal on silicon (LCoS) devices, ferroelectric liquid crystal on silicon (LCoS) devices, and micro-shutters (microshutter). The spatial light modulator 210 comprises a plurality of spatial light modulator pixels. Each spatial light modulator pixel of the plurality of spatial light modulator pixels is individually controllable and is configured to project a write beam corresponding to one pixel of the plurality of pixels. The collection of the plurality of pixels forms a pattern that is written into the photoresist, which is referred to herein as a mask pattern. The projection optics 212 include a projection lens, such as a 10x objective lens, for projecting light onto the substrate 120. In operation, each spatial light modulator pixel of the plurality of spatial light modulator pixels is in an "on" position or an "off" position based on mask pattern data provided to spatial light modulator 210 by controller 122. Each spatial light modulator pixel in the "on" position forms a write beam, which the projection optics 212 then projects onto the photoresist layer surface of the substrate 120 to form one pixel of the mask pattern.

In one embodiment, which may be combined with other embodiments described herein, spatial light modulator 210 is a DMD. Image projection system 200 includes light source 202, aperture 204, lens 206, frustrated prism assembly 208, DMD, and projection optics 212. The DMD includes a plurality of mirrors (i.e., a plurality of spatial light modulator pixels). Each mirror of the plurality of mirrors corresponds to a pixel, which may correspond to a pixel of the mask pattern. In some embodiments, which can be combined with other embodiments described herein, the DMD includes more than about 4,000,000 mirrors. Light source 202 is any suitable light source capable of generating light having a predetermined wavelength, such as a Light Emitting Diode (LED) or a laser. In one embodiment, which may be combined with other embodiments described herein, the predetermined wavelength is in the blue or near Ultraviolet (UV) range, such as less than about 450 nm. The frustrated prism assembly 208 comprises a plurality of reflective surfaces. In operation, a light beam 201 is generated by a light source 202. The light beam 201 is reflected by the frustrated prism assembly 208 to the DMD. When the beam 201 reaches the mirrors of the DMD, each mirror in the "on" position reflects the beam 201, i.e., forms a write beam (also referred to as a "shot"), which the projection optics 212 then projects to impinge on the photoresist layer surface of the substrate 120. A plurality of writing beams 203 (also referred to as multiple shots) form a plurality of pixels of the mask pattern.

Fig. 2B and 2C are schematic diagrams of the spatial light modulator 210 as a DMD. A plurality of mirrors 213 (also known as a plurality of spatial light modulator pixels) are arranged in a grid having M rows and N columns. In FIG. 2B, rows 214, 216, 218, 220, 222, 224, and columns 215, 217, 219, 221, 223, and 225 are shown. In method 700 of the photolithographic process of writing full tone portions and gray tone portions in a single pass, controller 122 (as shown in FIG. 2B) divides N columns and M rows of mirrors 213 into gray tone bins 226 and full tone bins 227. In embodiments of methods 700, 800, 900 (as described herein), the division of the N columns and M rows of mirrors 213 is dependent on the movement of the platform 114. When the movement of the stage 114 is substantially perpendicular to the N columns, the N columns are divided by the controller 122. When the movement of the platform 114 is substantially perpendicular to the M rows, the M rows are divided by the controller 122. When the movement of the platform 114 is neither substantially perpendicular to the N columns nor substantially perpendicular to the M rows, the array of grids having M rows and N columns is divided by the controller 122. In the embodiment described below, the movement of the stage 114 is substantially perpendicular to the N columns, and thus the N columns are divided by the controller 122. However, embodiments of the methods 700, 800, 900 described below may be performed by dividing N rows when the movement of the platform 114 is substantially perpendicular to the N rows, and by dividing an array of grids having M rows and N columns when the movement of the platform 114 is neither substantially perpendicular to the N columns nor substantially perpendicular to the M rows. In one embodiment of method 700, which may be combined with other embodiments described herein, gray tone group 226 and full tone group 227 have the same number of columns. In method 800 of a photolithographic process that writes full tone portions and gray tone portions in a single pass, controller 122 (as shown in FIG. 2B) divides N columns of mirrors 213 into gray tone bins 226 and full tone bins 227 having different numbers of columns. In a method 900 of a photolithographic process that writes full tone portions and gray tone portions in a single pass, the controller 122 (as shown in FIG. 2C) divides the N columns of mirrors 213 into gray tone groups 226, full tone groups 227, and remaining groups 228. In one embodiment, which can be combined with other embodiments described herein, the gray tone group 226 and the full tone group 227 have the same number of columns. In another embodiment, which may be combined with other embodiments described herein, gray tone group 226 has a different number of columns than full tone group 227.

FIG. 3 is a schematic diagram of a computing system 300 configured for writing a full-tone portion and a gray-tone portion in a single pass, in which embodiments of the present disclosure may be implemented. As shown in fig. 3, the computing system 300 may include a plurality of servers 308, a single-pass lithography application 312, and a plurality of controllers (i.e., computers, personal computers, mobile/wireless devices) 122 (only two of which are illustrated for clarity), each connected to a communication network 306 (e.g., the internet). Server 308 may communicate with database 314 via a local connection, such as a Storage Area Network (SAN) or Network Attached Storage (NAS), or with database 314 over the internet. Server 308 is configured to directly access data included in database 314 or to interface with a database manager configured to manage data included within database 314.

Each controller 122 may include known components of a computing device, such as: a processor, system memory, a hard drive, a battery, an input device (such as a mouse and keyboard), and/or an output device (such as a monitor or graphical user interface), and/or a combination of input/output devices (such as a touch screen that not only receives input but also displays output). Each server 308 and one-way lithography application 312 may include a processor and system memory (not shown) and may be configured to manage content stored in database 314, for example, using associated database software and/or a file system. The I/O device interface 408 (as shown in fig. 4) may be programmed to utilize a network protocol, such as, for example, the TCP/IP protocol, to communicate with another I/O device interface, the controller 122, and the one-way lithography application 312. The single pass lithography application 312 may communicate directly with the controller 122 through the communication network 306. The controller 122 is programmed to execute software 304 (such as programs and/or other software applications) and access applications managed by the server 308.

In the embodiments described below, the controller 122 may be separately operated by a user, and the controller 122 may be connected to the server 308 through the communication network 306. Pages, images, data, documents, and the like may be displayed to a user via the controller 122. Information and images may be displayed via a display device and/or a graphical user interface in communication with controller 122.

It will be noted that the controller 122 may be a personal computer, a laptop mobile computing device, a smart phone only, a video game console, a home digital media player, a networked television, a set-top box, and/or other computing device having components suitable for communicating with the communication network 306 and/or desired applications or software. The controller 122 may also execute other software applications configured to receive content and information from the single pass lithography application 312.

Fig. 4 is a schematic diagram of a single pass lithography application 312. The single pass lithography application 312 includes, without limitation, a Central Processing Unit (CPU)402, a network interface 404, a memory 420, and a storage device 430 that communicate via an interconnect 406. The one-way lithography application 312 may also include an I/O device interface 408 to connect an I/O device 410 (e.g., keyboard, video, mouse, audio, touch screen, etc.). The single pass lithography application 312 may further include a network interface 504 (shown in fig. 5), the network interface 504 being structured to transmit data via a data communications network.

The CPU 402 retrieves and executes program instructions stored in the memory 420, and generally controls and coordinates the operation of the other system components. Similarly, the CPU 402 stores and retrieves application data residing in the memory 420. CPU 402 is included to represent a single CPU, multiple CPUs, a single CPU having multiple processing cores, and the like. The interconnect 406 is used to transfer program instructions and application data between the CPU 402, the I/O device interface 408, the storage 430, the network interface 404, and the memory 420.

Memory 420 is typically included to represent random access memory and, in operation, stores software applications and data for use by the CPU 402. Although illustrated as a single unit, storage device 430 may be a combination of fixed and/or removable storage devices, such as a fixed disk drive, floppy disk drive, hard disk drive, flash drive, tape drive, removable memory card, CD-ROM, DVD-ROM, Blu-ray, HD-DVD, optical storage, Network Attached Storage (NAS), cloud storage, or a Storage Area Network (SAN) configured to store non-volatile data.

Memory 420 may store instructions and logic for executing application platform 426, and application platform 426 may include single pass lithography application software 428. Storage 430 may include a database 432, database 432 configured to store data 434 and associated application platform content 436. Database 432 may be any type of storage device.

A network computer is another type of computer system that can be used in conjunction with the disclosure provided herein. Network computers typically do not include a hard disk or other mass storage device, and the executable programs are loaded into memory 420 from a network connection for execution by CPU 502 (shown in FIG. 5). A typical computer system will usually include at least one processor, memory, and an interconnect coupling the memory to the processor.

Fig. 5 is a schematic diagram of controller 122, controller 122 being used to access single pass lithography application 312 and retrieve or display data associated with application platform 426. The controller 122 may include, without limitation, a Central Processing Unit (CPU)502, a network interface 504, an interconnect 506, a memory 520, a storage 530, and support circuits 540. The controller 122 may also include an I/O device interface 508 that connects I/O devices 510 (e.g., keyboard, display, touch screen, and mouse devices) to the controller 122.

Like CPU 402, CPU 502 is included to represent a single CPU, multiple CPUs, a single CPU with multiple processing cores, etc., while memory 520 is typically included to represent random access memory. The interconnect 506 may be used to transfer program instructions and application data between the CPU 502, the I/O device interface 508, the storage device 530, the network interface 504, and the memory 520. The network interface 504 may be configured to transmit data via the communication network 306, such as to transmit content from the single pass lithography application 312. The storage device 430, such as a hard disk drive or solid State Storage Drive (SSD), may store nonvolatile data. The storage device 530 may include a database 531. Database 531 may include data 532, other content 534, and a video processing unit 536 with data 538 and control logic 539. Illustratively, memory 520 may include an application interface 522, which may itself display software instructions 524, and/or store or display data 526. The application interface 522 may provide one or more software applications that allow the controller to access data or other content hosted by the single pass lithography application 312.

As shown in fig. 1, the system 100 includes a controller 122. The controller 122 includes a Central Processing Unit (CPU)502, a memory 520, and support circuits 540 (or I/O508). The CPU 502 may be one of any form of computer processor used in an industrial setting for controlling various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitoring processes (e.g., processing time and substrate position). Memory 520 (shown in FIG. 5) is connected to CPU 502 and may be one or more of commercially available memory, such as Random Access Memory (RAM), Read Only Memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. Software instructions and data may be encoded and stored in memory for instructing the CPU 502. Support circuits 540 are also connected to the CPU 502 for supporting the processor in a known manner. Support circuits 540 may include a known cache 542, a power supply 544, clock circuits 546, input/output circuitry 548, subsystems 550, and the like. A program (or computer instructions) readable by the controller 122 determines which tasks may be performed on the substrate 120. The program may be software readable by the controller 122 and may include code to monitor and control, for example, process time and substrate position.

It should be borne in mind, however, that these terms and the like are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. Unless specifically stated otherwise as apparent from the following discussions, it is appreciated that throughout the specification discussions utilizing terms such as "processing" or "computing" or "calculating" or "determining" or "displaying" or the like, refer to the action and processes of a computer system (or similar electronic computing device), that manipulate and transform data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage, transmission or display devices.

The present examples also relate to apparatus for performing the operations herein. This apparatus may be specially constructed for the required purposes, or it may comprise a general-purpose computer selectively enabled or reconfigured by a computer program stored in the computer. Such a computer program may be stored in a computer readable storage medium, such as, but is not limited to, read-only memory (ROM), random-access memory (RAM), EPROM, EEPROM, flash memory, magnetic or optical cards, any type of disk including floppy disks, optical disks, CD-ROMs, and magneto-optical disks, or any type of media suitable for storing electronic instructions, and each coupled to a computer system interconnect.

The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems may be used with programs in accordance with the teachings herein, or it may prove convenient to construct a more specialized apparatus to perform the necessary method operations. The architecture that can be used for a wide variety of these systems is apparent from the description above. Moreover, the present examples are not described with reference to any particular programming language, and thus the various examples may be implemented using a wide variety of programming languages.

As explained in more detail herein, embodiments of the present disclosure pertain to lithography applications regarding the ability to apply mask pattern data 610 to a substrate 120 in a single pass lithography process. Embodiments described herein relate to a software application platform. This software application platform includes a method of writing a full tone portion and a gray tone portion in a single pass.

Fig. 6A is a schematic plan view of the substrate 120 after the photolithography process. A plurality of full-tone portions 602 and a plurality of gray-tone portions 604 are written in the photoresist 601, the plurality of full-tone portions 602 are exposed to a full-tone dose 606 (shown in fig. 6B to 6D) of the intensity of light emitted from the light source 202, and the plurality of gray-tone portions 604 are exposed to a gray-tone dose 608 (shown in fig. 6B to 6D) of the intensity of light emitted from the light source 202. In one embodiment, which may be combined with other embodiments described herein, the intensity is about 10mJ/cm²To about 200mJ/cm². During the photolithography process, the mask pattern data 610 has a plurality of full-tone exposed polygons 612 corresponding to the full-tone portions 602 formed by the photolithography process, and a plurality of gray-tone exposed polygons 614 corresponding to the gray-tone portions 604 formed by the photolithography process. A photoresist 601 is disposed over the substrate 120. In one embodiment, which can be combined with other embodiments described herein, the substrate 120 has a thin film layer to be patterned (such as by pattern etching) formed thereon, and a photoresist is disposed on the thin film layer to be patterned.

Fig. 6B to 6D are sectional views of exposure of the photoresist 601 at the section 603. Cross section 603 includes a plurality of full tone portions 602 exposed to full tone doses 606 and a plurality of gray tone portions 604 exposed to gray tone doses 608. The full tone dose 606 corresponds to the percentage of photoresist 601 developed by exposing the plurality of full tone portions 602 to full tone percentages of the intensity of light emitted from the light source 202. The gray tone dose 608 corresponds to the percentage of the photoresist 601 that is developed by exposing the plurality of gray tone portions 604 to a gray tone percentage of the intensity of light emitted from the light source 202. The width of each of the plurality of full-tone portions 602 controls the full-tone dose 606 from a full-tone percentage in intensity unless the width of one of the plurality of full-tone portions 602 is greater than the width of one of the spatial light modulator pixels. For example, a width of one of the plurality of full-tone portions 602 that is less than a width of one of the spatial light modulator pixels results in a full-tone dose 606 of the full-tone portion being less than a full-tone percentage. A width of one of the plurality of full-tone portions 602 that is greater than or equal to a width of one of the spatial light modulator pixels results in a full-tone dose 606 of the full-tone portion being equal to a full-tone percentage. The width of each of the plurality of gray-tone portions 604 controls the gray-tone dose 608 from the gray-tone percentage in intensity unless the width of one of the plurality of gray-tone portions 604 is greater than the width of one of the spatial light modulator pixels. For example, a width of one of the plurality of gray tone portions 604 that is less than a width of one of the spatial light modulator pixels results in a gray tone dose 608 of the gray tone portion being less than the gray tone percentage. The width of one of the plurality of gray tone portions 604 that is greater than or equal to the width of one of the spatial light modulator pixels results in a gray tone dose 608 of the gray tone portion being equal to the gray tone percentage. In one embodiment, which can be combined with other embodiments described herein, each of the plurality of full-tone portions 602 and the plurality of gray-tone portions 604 has a same width that is less than a width of a spatial light modulator pixel.

As shown in fig. 6B and as further explained herein, method 700 makes the graytone percentage half of the full tone percentage by having the same number of columns of graytone groups 226 and full tone groups 227. For example, a gray tone group 226 having 50% of the columns and a full tone portion having 50% of the columns results in a gray tone percentage of 50% and a full tone percentage of 100%. The gray tone dose 608 is 42% developed by a gray tone percentage of 50% of the intensity of the light emitted by the light source 202 that is exposed to each of the plurality of gray tone portions 604 having the same width that is less than the width of the spatial light modulator pixel. The full-tone dose 606 is developed 84% by a full-tone percentage of 100% of the intensity of light emitted by the light source 202 that is exposed to each of a plurality of full-tone portions 602 having the same width that is less than the width of a spatial light modulator pixel.

As shown in fig. 6C and as further illustrated herein, method 800 provides a graytone percentage that is greater than half of the full-tone percentage by having different numbers of columns of graytone groups 226 and full-tone groups 227. For example, a gray tone group 226 having 55% of the columns and a full tone portion having 45% of the columns results in a gray tone percentage of 55% and a full tone percentage of 95%. The gray tone dose 608 is 48.1% developed by a gray tone percentage of 55% of the intensity of light emitted by the light source 202 that is exposed to none of the plurality of gray tone portions 604 having the same width that is less than the width of the spatial light modulator pixel. The full-tone dose 606 is developed 87.5% by a full-tone percentage of 95% of the intensity of light emitted by the light source 202 that is exposed to each of a plurality of full-tone portions 602 having the same width that is less than the width of a spatial light modulator pixel.

As shown in fig. 6D and as further described herein, method 900 makes the graytone percentage less than half of the fullstone percentage by graytone group 226, fullstone group 227, and remaining groups 228 (graytone group 226 and fullstone group 227 have the same number of columns). For example, a graytone group 226 having 48% of the columns, a full-tone portion having 48% of the columns, and a remaining group 228 having 4% of the columns results in a graytone percentage of 48% and a full-tone percentage of 104%. The gray tone dose 608 is 40.86% developed by a gray tone percentage of 48% of the intensity of the light emitted by the light source 202 that is exposed to each of the plurality of gray tone portions 604 having the same width that is less than the width of the spatial light modulator pixel. The full-tone dose 606 is developed by 85.47% of the full-tone percentage of 104% of the intensity of light emitted by the light source 202 that is exposed to each of a plurality of full-tone portions 602 having the same width that is less than the width of a spatial light modulator pixel.

Fig. 7 is a flow diagram of a method 700 of a lithographic process of writing a full-tone portion 602 and a gray-tone portion 604 in a single pass. Fig. 10A-10F are schematic plan views of a full-tone exposure polygon 1002 and a gray-tone exposure polygon 1004 during method 700. In operation 701, the controller 122 divides the N columns of mirrors 213 into gray tone groups 226 and full tone groups 227 having the same number of columns, as described above. In operation 702, the processing unit 106 projects multiple shots into the full tone exposure polygon 1002 and the gray tone exposure polygon 1004 as the substrate 120 is scanned under the image projection system 200 in a single pass. As each emission of the plurality of emissions is projected to one of the plurality of address points 1008, the plurality of spatial light modulator pixels of the spatial light modulator 210 form a collective emission pattern 1006. Each address point represents the center point of a pixel. In one embodiment, which may be combined with other embodiments described herein, the collective emission pattern 1006 is a hexagonal close-packed (HCP) pattern, although other patterns may be used for the collective emission pattern 1006. The multiple shots are a number of shots to form a full-tone portion of the plurality of full-tone portions 602 exposed to the full-tone dose 606. For example, the plurality of transmissions is between 50 transmissions and 500 transmissions.

As shown in fig. 10A, a first gray-tone emission 1010A of the multiple emissions from the gray-tone group 226 of the spatial light modulator 210 is projected to the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 to at least a first address point 1008a of the plurality of address points 1008. Each of the multiple shots in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 have an intensity of light emitted from the light source 202. As shown in fig. 10B, a second gray-tone emission 1010B from gray-tone group 226 is projected onto full-tone exposure polygon 1002 and gray-tone exposure polygon 1004. As shown in fig. 10C, the graytone group 226 is reused to project multiple shots from the graytone group 226 to the full-tone exposed polygon 1002 and the graytone exposed polygon 1004 until a final graytone shot 1010n of the multiple shots is projected to at least one final address point 1008 n. The division of the spatial light modulator 210 for the method 700 would result in a final gray tone emission 1010n that is half a dot of the multiple emissions. As shown in fig. 10D, the full-tone group 227 projects a first full-tone emission 1012a of the multiple emissions to at least one first address point 1008a of the multiple address points 1008 inside the full-tone exposure polygon 1002. As shown in fig. 10E, the full tone group 227 projects a second full tone emission 1012b of the multiple emissions to at least one second address point 1008b of the plurality of address points 1008 inside the full tone exposure polygon 1002. As shown in fig. 10F, the multiple shots are projected with full tone group 227 repeated until a final full tone shot 1012n of the multiple shots is projected to at least one final address point 1008 n.

Fig. 8 is a flow diagram of a method 800 of a photolithographic process for writing a full-tone portion 602 and a gray-tone portion 604 in a single pass. Fig. 10G-10L are schematic plan views of full-tone exposure polygon 1002 and gray-tone exposure polygon 1004 during method 800. In operation 801, the controller 122 divides the N columns of mirrors 213 into gray tone groups 226 and full tone groups 227 having different numbers of columns, as described above. The gray tone group 226 has more columns than the full tone group 227. In operation 802, the processing unit 106 projects multiple shots in the full tone exposure polygon 1002 and the gray tone exposure polygon 1004 as the substrate 120 is scanned under the image projection system 200 in a single pass.

As shown in fig. 10G, a first gray-tone emission 1010a of the multiple emissions from the gray-tone group 226 of the spatial light modulator 210 is projected to the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 to at least one first address point 1008a of the plurality of address points 1008. Each of the multiple shots in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 have an intensity of light emitted from the light source 202. As shown in fig. 10H, a second gray-tone emission 1010b from gray-tone group 226 is projected onto full-tone exposure polygon 1002 and gray-tone exposure polygon 1004. As shown in fig. 10I, the graytone group 226 is reused to project multiple shots from the graytone group 226 to the full-tone exposed polygon 1002 and the graytone exposed polygon 1004 until a final graytone shot 1010n of the multiple shots is projected to at least one final address point 1008 n. The division of the spatial light modulator 210 for the method 800 results in the final gray tone emission 1010n being emitted more times than half a dot of the multiple emissions. Thus, the final full-tone emission 1012n will not address each of the address points 1008 in the full-tone exposed polygon 1002, resulting in a gray-tone percentage greater than half the full-tone percentage, because a portion of the plurality of address points 1008 inside the full-tone exposed polygon 1002 will not be addressed twice.

As shown in fig. 10J, the full-tone group 227 projects a first full-tone emission 1012a of the multiple emissions to at least one first address point 1008a of the multiple address points 1008 inside the full-tone exposure polygon 1002. As shown in fig. 10K, the full tone group 227 projects a second full tone emission 1012b of the multiple emissions to at least one second address point 1008b of the plurality of address points 1008 inside the full tone exposure polygon 1002. As shown in fig. 10L, the multiple shots are projected with full tone group 227 repeated until a final full tone shot 1012n of the multiple shots is projected to at least one final address point 1008 n. After the final full tone emission 1012n is projected to the at least one final address point 1008n, a portion of the plurality of address points 1008 inside the full tone exposed polygon 1002 is not addressed twice.

FIG. 9 is a flow chart of a method 900 of a photolithographic process for writing a full-tone portion 602 and a gray-tone portion 604 in a single pass. Fig. 10M-10S are schematic plan views of a full-tone exposure polygon 1002 and a gray-tone exposure polygon 1004 during method 900. In operation 901, the controller 122 divides the N columns of mirrors 213 into the gray tone group 226, the full tone group 227, and the remaining groups 228, as described above. The gray tone group 226 and the full tone group 227 have the same number of columns. In operation 902, the processing unit 106 projects multiple shots in the full tone exposure polygon 1002 and the gray tone exposure polygon 1004 as the substrate 120 is scanned under the image projection system 200 in a single pass.

As shown in fig. 10M, a first gray-tone emission 1010a of the multiple emissions from the gray-tone group 226 of the spatial light modulator 210 is projected to the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 to at least one first address point 1008a of the plurality of address points 1008. Each emission of the multiple emissions in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 has an intensity of light emitted from the light source 202. As shown in fig. 10N, a second gray-tone emission 1010b from gray-tone group 226 is projected onto full-tone exposure polygon 1002 and gray-tone exposure polygon 1004. As shown in fig. 10O, the graytone group 226 is reused to project multiple shots from the graytone group 226 to the full-tone exposed polygon 1002 and the graytone exposed polygon 1004 until a final graytone shot 1010n of the multiple shots is projected to at least one final address point 1008 n. The division of the spatial light modulator 210 for the method 900 results in each address point of the plurality of address points 1008 inside the gray-tone exposed polygon 1004 being addressed.

As shown in fig. 10P, the full-tone group 227 projects a first full-tone emission 1012a of the multiple emissions to at least one first address point 1008a of the multiple address points 1008 inside the full-tone exposure polygon 1002. As shown in fig. 10Q, the full-tone group 227 projects a second full-tone emission 1012b of the multiple emissions to at least one second address point 1008b of the multiple address points 1008 inside the full-tone exposure polygon 1002. As shown in fig. 10R, the multiple shots are projected with full tone group 227 repeated until a final full tone shot 1012n of the multiple shots is projected to at least one final address point 1008 n. As shown in fig. 10S, the remaining group 228 of spatial light modulators 210 projects the remaining shots 1014 of the plurality of shots to address points inside the full-tone exposure polygon 1002, resulting in half of the full-tone percentage being greater than the gray-tone percentage. In an embodiment, which can be combined with other embodiments described herein, the remaining sets 228 of spatial light modulators 210 are utilized to project the remaining emissions 1014 of the multiple emissions to address points inside the graytone exposure polygon 1004, half of the full graytone percentage being less than the graytone percentage.

FIG. 11 is a flow chart of a method 1100 of a photolithographic process for writing a full-tone portion 602 and a gray-tone portion 604 in a single pass. Fig. 12A-12F are schematic plan views of a full-tone exposure polygon 1002 and a gray-tone exposure polygon 1004 during method 1100. The controller 122 temporally divides the plurality of spatial light modulator pixels of the spatial light modulator 210 by the first and second shots of the multiple shots in the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004. The controller 122 includes a transmission counter to time divide the first and second transmissions of the plurality of transmissions. The controller 122 includes a control loop for simulating the intensity of light emitted from the light source 202. The control loop provides analog emission of the intensity of the first emission and the second emission at predetermined locations throughout the photoresist 601.

The processing unit 106 projects multiple shots as the substrate 120 is scanned under the image projection system 200 in a single pass. A first emission and a second emission of the plurality of emissions are projected in the full tone exposure polygon 1002. In one embodiment, which may be combined with other embodiments described herein, only the first shot of the multiple shots is projected into the gray-tone exposure polygon 1004 as shown. In another embodiment, which may be combined with other embodiments described herein, only a second emission of the multiple emissions is projected in the gray-tone exposure polygon 1004.

For the sake of facilitating explanation, fig. 11 and fig. 12A to 12F will be explained with reference to the gray-tone emission of the multiple shots projected in the gray-tone exposure polygon 1004, and the gray-tone emission and the full-tone emission of the multiple shots projected in the full-tone exposure polygon 1002. It will be noted that in one embodiment, which can be combined with other embodiments described herein, as shown in fig. 12A-12F, the grey tone emission is a first emission and the full tone emission is a second emission, while in another embodiment, which can be combined with other embodiments described herein, the grey tone emission is a second emission and the full tone emission is a first emission.

In operation 1101, multiple shots are projected into the full tone exposure polygon 1002 and the gray tone exposure polygon 1004. As shown in fig. 12A, multiple-shot gray-tone shots 1210a (which are gray-tone shots) are projected onto full-tone exposure polygon 1002 and gray-tone exposure polygon 1004 to at least one first address point 1008a of a plurality of address points 1008. As shown in fig. 12B, a multi-shot full tone emission 1210B (which is a full tone emission) is projected inside the full tone exposure polygon 1002 to at least one second address dot 1008B as the substrate 120 is scanned under the image projection system 200. In one embodiment, which can be combined with other embodiments described herein, as shown in fig. 12C, a half-point emission 1210h of the multiple emissions is a gray-tone emission projected inside the full-tone exposure polygon 1002 and the gray-tone exposure polygon 1004 to at least one final address point 1008 n. In another embodiment, which can be combined with other embodiments described herein, the half-point emission 1210h of the multiple emissions is a full-tone emission projected inside the full-tone exposure polygon 1002. After one-half of the multiple shots are fired 1210h, the plurality of gray tone portions 604 have gray tone fired address points of the plurality of address points 1008 that are exposed by a first intensity percentage. The plurality of full-tone portions 602 have gray-tone emissive address points exposed to a second intensity percentage (i.e., gray-tone percentage of intensity) and full-tone emissive address points exposed to a first intensity percentage. In one embodiment, which may be combined with other embodiments described herein, the second intensity is less than the first intensity. The combination of the first intensity and the second intensity (i.e., the percent of full tone of the intensity) corresponds to the full tone dose 606. The second intensity (i.e., the gray tone percentage) corresponds to the gray tone dose 608.

In one embodiment, which can be combined with other embodiments described herein, as shown in fig. 12D, an emission 1210D of the multiple emissions after a half-point emission 1210h that is a gray tone emission is a full tone emission that is projected to a full tone exposure polygon 1002 to project to at least one first address point 1008a of the plurality of address points 1008. In another embodiment, which can be combined with other embodiments described herein, the emission 1210d of the multiple emissions after the half-point emission 1210h that is a full-tone emission that is projected to the full-tone exposure polygon 1002. In an embodiment that may be combined with other embodiments described herein, where the graytone emission is the second emission and the full-tone emission is the first emission, emission 1210d after half-point emission 1210h, which is the graytone emission, is the graytone emission projected into both the full-tone exposure polygon 1002 and the graytone exposure polygon 1004. As shown in fig. 12E, as the substrate 120 is scanned under the image projection system 200, a full tone emission 1210E of multiple emissions after a half-tone emission 1210h is projected inside the full tone exposure polygon 1002 and the gray tone exposure polygon 1004 to at least one second address point 1008 b. As shown in fig. 12F, a final emission 1210n, which is a full-tone emission, of the multiple emissions is projected inside the full-tone exposure polygon 1002 to at least one final address point 1008 n.

With multiple shots, the multiple gray-tone portions 604 have full-tone shots and gray-tone shot address points of the multiple address points 1008 that are exposed by the second intensity. The plurality of full-tone portions 602 have full-tone emission and gray-tone emission address points exposed to a combination of the second intensity and the first intensity. The ability to time-divide the gray-tone emission and the full-tone emission in multiple shots, and the simulated emissions of the first intensity and the second intensity, will allow the full-tone dose 606 for the multiple full-tone portions 602 and the gray-tone dose 608 for the multiple gray-tone portions 604 to vary across the photoresist 601.

To summarize, a system, software application, and method are provided for a lithographic process that writes full tone portions and gray tone portions in a single pass. A single pass provides greater throughput. Temporal and spatial division of a spatial light modulator of the system between a first emission and a second emission of the plurality of emissions provides simulated emissions of the second intensity and the first intensity from the light source in a single pass. The simulated emission of the second tone and the first intensity allows a full tone dose for each of the plurality of full tone portions and a gray tone dose for each of the plurality of gray tone portions to vary across the photoresist. Variations in the full tone dose and the gray tone dose across the photoresist can tolerate variations due to: photoresist thickness, developer non-uniformity during photoresist development, non-uniformity in etch transfer processes, and any other process before or after a photolithography process.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.