阅读说明：本技术 静电驱动热开关 (Electrostatic driven thermal switch ) 是由 鲁圣国 马久明 姚英邦 陶涛 梁波 赵小波 于 2021-02-04 设计创作，主要内容包括：本发明公开一种静电驱动热开关,包括热开关上极、热开关下极及设置在热开关上极及热开关下极之间的支撑体；热开关下极包括底层基板、设置在底层基板上的导电下电极及下极板；热开关上极包括与支撑体远离下极板的一端相连的上极板、与上极板相连的导电上电极及设置在导电上电极上的变色油墨层；底层基板、导电下电极及下极板的内部均设有导热部。本发明通过在所述底层基板、所述导电下电极及所述下极板上均嵌设有导热部,在需要对与本发明相连的器件导热时,所述导热部可以高效的将器件的热量传递到所述热开关上极,以辐射的方式与环境空间换热,实现散热的效果,且所述导电上电极上设有变色油墨层,强化热开关上极的辐射传热能力,提高散热能力。(The invention discloses an electrostatic driving thermal switch, which comprises a thermal switch upper pole, a thermal switch lower pole and a support body arranged between the thermal switch upper pole and the thermal switch lower pole; the lower electrode of the thermal switch comprises a bottom substrate, a conductive lower electrode and a lower polar plate, wherein the conductive lower electrode and the lower polar plate are arranged on the bottom substrate; the upper electrode of the thermal switch comprises an upper polar plate connected with one end of the support body far away from the lower polar plate, a conductive upper electrode connected with the upper polar plate and a color-changing ink layer arranged on the conductive upper electrode; the bottom substrate, the conductive lower electrode and the lower electrode plate are all internally provided with heat conducting parts. According to the invention, the heat conducting parts are embedded on the bottom substrate, the conductive lower electrode and the lower polar plate, when heat conduction is required for a device connected with the heat-conducting.)

1. An electrostatically actuated thermal switch, comprising: the electrostatic driving thermal switch comprises a thermal switch upper pole, a thermal switch lower pole and a support body arranged between the thermal switch upper pole and the thermal switch lower pole; the lower electrode of the thermal switch comprises a bottom substrate, a conductive lower electrode arranged on the bottom substrate and a lower polar plate, one surface of the lower polar plate is attached to the conductive lower electrode, and the other surface of the lower polar plate is connected with the support body; the upper electrode of the thermal switch comprises an upper polar plate connected with one end of the support body far away from the lower polar plate, a conductive upper electrode connected with the upper polar plate and a color-changing ink layer arranged on the conductive upper electrode; the bottom substrate, the conductive lower electrode and the lower electrode plate are all internally provided with heat conducting parts.

2. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the upper polar plate comprises a connecting part connected with the support body, a bent part connected with the connecting part, and a contact part connected with the bent part and used for contacting with the lower polar plate for heat conduction.

3. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the upper polar plate is made of polydimethylsiloxane or PVDF material; the lower polar plate is made of any one of a Karpura strip, polyethylene, polyvinyl chloride and aluminum oxide.

4. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the heat conducting part is made of graphene composite materials.

5. An electrostatically actuated thermal switch as claimed in claim 1 wherein: and a gold coating is arranged on one surface of the upper polar plate, which is close to the lower pole of the thermal switch.

6. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the one side of going up the polar plate and keeping away from the thermal switch lower extreme is equipped with first ya keli pressure sensitive adhesive layer, electrically conductive upper electrode passes through first ya keli pressure sensitive adhesive layer with it links to each other to go up the polar plate.

7. An electrostatically actuated thermal switch as claimed in claim 1 wherein: a second acrylic pressure-sensitive adhesive layer is arranged on one surface of the conductive lower electrode, which is far away from the bottom substrate; the lower polar plate is connected with the conductive lower electrode through the second acrylic pressure-sensitive adhesive layer.

8. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the conductive upper electrode and the conductive lower electrode are made of copper foils.

9. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the bottom substrate is made of silica gel or epoxy resin.

10. An electrostatically actuated thermal switch as claimed in claim 1 wherein: the support body is made of acrylic ester.

Technical Field

The embodiment of the invention relates to the technical field of thermal switches, in particular to an electrostatic driving thermal switch.

Background

A thermal switch is a device that achieves thermal control by changing the thermal resistance of a heat conduction path. The thermal insulation material plays a role in opening and closing in a thermal path, and is widely applied to the thermal management fields of power electronic equipment, power devices, microelectronic chips, high-power engineering systems and the like. Currently, thermal switches have been developed that exploit a number of different driving principles.

The electrostatic driving thermal switch is concerned by many researchers by virtue of the characteristics of light weight, small volume, low power consumption, simple operation, low cost and the like. A typical electrostatically actuated thermal switch is comprised of: the outermost layer is a high-emissivity heat dissipation film, the middle layer adopts a heat insulation support structure to form a heat dissipation film moving space, and the lowermost layer is a high-heat-conduction substrate (the high-heat-conduction substrate has better thermal contact with a heat source) with a low-emissivity film on the surface layer. When the heat dissipation switch works, the electrostatic force is used for controlling the contact area between the heat dissipation film and the substrate to realize the conversion of a heat exchange mode between heat radiation and heat conduction, and the heat conduction channel thermal resistance is changed to realize the active adjustment of the heat dissipation power by the heat switch. However, in the conventional electrostatic-drive thermal switch, the heat-conducting property of the switch substrate is poor, the heat-dissipating capacity of the upper layer is low, the components need to be manufactured through fine processing, and the production difficulty and the cost are both too high.

Disclosure of Invention

The present invention provides an electrostatically driven thermal switch for solving the technical problems presented in the background art.

The invention provides an electrostatic driving thermal switch, which comprises a thermal switch upper pole, a thermal switch lower pole and a support body arranged between the thermal switch upper pole and the thermal switch lower pole; the lower electrode of the thermal switch comprises a bottom substrate, a conductive lower electrode arranged on the bottom substrate and a lower polar plate, one surface of the lower polar plate is attached to the conductive lower electrode, and the other surface of the lower polar plate is connected with the support body; the upper electrode of the thermal switch comprises an upper polar plate connected with one end of the support body far away from the lower polar plate, a conductive upper electrode connected with the upper polar plate and a color-changing ink layer arranged on the conductive upper electrode; the bottom substrate, the conductive lower electrode and the lower electrode plate are all internally provided with heat conducting parts.

Further, the upper polar plate comprises a connecting part connected with the support body, a bent part connected with the connecting part, and a contact part connected with the bent part and used for being in contact with the lower polar plate for heat conduction.

Furthermore, the upper polar plate is made of polydimethylsiloxane or PVDF material; the lower polar plate is made of any one of a Karpura strip, polyethylene, polyvinyl chloride and aluminum oxide.

Further, the heat conducting portion is made of a graphene composite material.

And further, a gold coating is arranged on one surface of the upper polar plate, which is close to the lower pole of the thermal switch.

Furthermore, the side, far away from the thermal switch lower pole, of the upper polar plate is provided with a first acrylic pressure-sensitive adhesive layer, and the conductive upper electrode is connected with the upper polar plate through the first acrylic pressure-sensitive adhesive layer.

Furthermore, a second acrylic pressure-sensitive adhesive layer is arranged on one surface of the conductive lower electrode, which is far away from the bottom substrate; the lower polar plate is connected with the conductive lower electrode through the second acrylic pressure-sensitive adhesive layer.

Furthermore, the conductive upper electrode and the conductive lower electrode are both made of copper foil.

Furthermore, the bottom substrate is made of silica gel or epoxy resin.

Furthermore, the support body is made of acrylic ester.

By adopting the technical scheme, the invention has at least the following beneficial effects: according to the invention, the heat conducting parts are embedded on the bottom substrate, the conductive lower electrode and the lower polar plate, when heat conduction is required for a device connected with the heat-conducting.

Drawings

Fig. 1 is a perspective view of an electrostatically actuated thermal switch of the present invention.

Fig. 2 is a partial cross-sectional view of the bottom substrate, the conductive bottom electrode, the bottom plate and the heat conducting portion of the electrostatically actuated thermal switch of the present invention.

Fig. 3 is a perspective view of the upper plate of the electrostatically actuated thermal switch of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. It is to be understood that the embodiments described below by referring to the drawings are exemplary intended for explaining the present invention and are not to be construed as limiting the present invention, and features in the embodiments of the present invention may be combined with each other without conflict.

As shown in fig. 1-3, the present invention provides an electrostatically driven thermal switch, which comprises an upper thermal switch pole, a lower thermal switch pole, and a support 8 disposed between the upper thermal switch pole and the lower thermal switch pole; the lower electrode of the thermal switch comprises a bottom substrate 1, a conductive lower electrode 2 arranged on the bottom substrate 1 and a lower polar plate 3, one surface of the lower polar plate is attached to the conductive lower electrode 2, and the other surface of the lower polar plate is connected with the support body 8; the upper electrode of the thermal switch comprises an upper polar plate 5 connected with one end of the support body 8 far away from the lower polar plate 3, a conductive upper electrode 6 connected with the upper polar plate 5 and a color-changing ink layer 7 arranged on the conductive upper electrode 6; the bottom substrate 1, the conductive lower electrode 2 and the lower electrode plate 3 are all internally provided with heat conducting parts 4; therefore, the in-plane thermal conductivity of the heat conducting part 4 is converted into the inter-plane thermal conductivity of the bottom substrate 1, the lower conductive electrode 2 and the heat conducting part 4 in the lower electrode plate 3, so that the heat conducting part 4 can directly conduct the heat of a device, the heat conducting part 4 conducts heat, and the lower electrode plate 3 serves as an electrostatic driving part, so that the heat conducting and electrostatic driving are completed by two parts, and the problems of low heat conducting efficiency and high manufacturing progress requirement caused by the fact that the electrostatic driving part and the heat conducting part 4 are realized by one part in the traditional electrostatic driving thermal switch are solved.

In this embodiment, the heat conducting portions 4 are embedded in the bottom substrate 1, the conductive lower electrode 2 and the lower electrode plate 3, so that when heat conduction is required for a device connected to the present invention, the heat conducting portions 4 can efficiently transfer heat of the device to the upper electrode of the thermal switch, and exchange heat with an environmental space in a radiation manner, so as to achieve a heat dissipation effect, and the color-changing ink layer 7 is arranged on the conductive upper electrode 6, so that the radiation heat transfer capability of the upper electrode of the thermal switch is enhanced, and the heat dissipation capability is improved; during specific work, when the hot switch works, the upper pole of the hot switch and the lower pole of the hot switch are respectively connected with the positive pole and the negative pole of a direct current power supply. When the temperature of the device needs to be locked, the power switch is turned off, the circuit is disconnected, and the upper pole of the thermal switch and the lower pole of the thermal switch are separated from each other (the preset separation distance is 1-5 mm), so that the upper pole of the thermal switch and the lower pole of the thermal switch are not in contact conduction, and the temperature locking effect is achieved; when the device needs to be radiated, the power switch is closed, and under the action of electrostatic force, the upper polar plate 5 drives the conductive upper electrode 6 and the color-changing ink layer 7 to be pressed downwards, and the conductive upper electrode and the color-changing ink layer gradually approach the lower polar plate 3 until the thermal switch is in a closed state after being attached. The heat conducted by the heat conduction part 4 is transferred to the upper pole of the thermal switch in a heat conduction mode, and the upper pole of the thermal switch exchanges heat with the environmental space in a radiation mode, so that the heat dissipation of the device is realized; when the heat circuit needs to be disconnected when the heat dissipation effect is achieved, the power switch is turned off, the upper polar plate 5 loses the holding of the electric field force, the upper polar plate 5 and the lower polar plate 3 are separated, the straight state is recovered, and the heat switch completes one working cycle. In this embodiment, the heat radiation capability of the upper electrode of the thermal switch is enhanced by the color-changing ink, specifically, the color-changing ink is transparent at a temperature below 40 ℃, the heat emissivity is low and is 0.8, and the color-changing ink at a temperature above 40 ℃ is changed into black, and the emissivity is high and is 0.9. When the device is required to dissipate heat, the upper polar plate 5 is in direct contact with the heat conducting part 4, so that the temperature of the color-changing ink is higher than the color-changing temperature and is black, the emissivity is 0.9, the effect of enhancing radiation heat exchange is achieved, the heat dissipating capacity of the thermal switch in a conduction state is improved, and the on-off ratio is improved.

In an embodiment, the upper plate 5 includes a connection portion 51 connected to the support 8, a bent portion 52 connected to the connection portion 51, and a contact portion 53 connected to the bent portion 52 for contacting and conducting heat with the lower plate 3; in this embodiment, the contact portion 53 of the upper electrode plate 5 and the lower electrode plate 3, which are in contact with each other and conduct heat, is connected to the connecting portion 51 through the bent portion 52, so that after the heat dissipation of the device is completed, the power supply is turned off, and under the action of the restoring force of the bent portion 52, the contact portion 53 and the lower electrode plate 3 can be driven to be separated, so as to release the heat dissipation of the device.

In a specific embodiment, the upper plate 5 is made of polydimethylsiloxane or PVDF material; the lower polar plate 3 is made of any one of Kepton (Kepton), polyethylene, polyvinyl chloride and aluminum oxide; the contact between the upper pole plate 5 and the lower pole plate 3 can be realized under the action of an electric field force by utilizing the excellent electro-deformation performance of the Polydimethylsiloxane (PDMS) and the PVDF (polyvinylidene fluoride), the upper pole plate 5 and the lower pole plate 3 can be separated when the action of the electric field force is lost, and the lower pole plate 3 adopts Kepton (Kepton, polyimide), polyethylene, polyvinyl chloride and aluminum oxide as dielectrics, so that the conduction with the upper pole of the thermal switch is realized, and the electric field force is formed.

In a specific embodiment, the heat conducting portion 4 is made of graphene composite material; arranging the graphene composite material as a heat conducting part 4 in the bottom substrate 1, the conductive lower electrode 2 and the lower electrode plate 3, so that the in-plane thermal conductivity of graphene is converted into the inter-plane thermal conductivity among the bottom substrate 1, the conductive lower electrode 2 and the lower electrode plate 3, and the inter-plane directional thermal conductivity of the lower electrode of the thermal switch reaches 816.9 +/-12.8W/m.K, which is far higher than that of common high-heat-conductivity metal silver and copper; the heat dissipation device is embedded into the bottom substrate 1, the conductive lower electrode 2 and the lower electrode plate 3 and plays a role in quickly transferring heat, so that the device can be quickly dissipated through the upper electrode of the thermal switch in a power-on state.

In a specific embodiment, a gold coating is arranged on one surface of the upper polar plate 5, which is abutted against the lower pole of the thermal switch; when the temperature of the device needs to be locked, the power switch is turned off, the circuit is disconnected, the upper pole of the thermal switch is separated from the lower pole of the thermal switch, and the heat conducted from the upper pole of the thermal switch and the radiator can only carry out radiation heat exchange; because the gold coating is sprayed on the lower surface of the upper polar plate 5, the characteristic that the thermal emissivity of the gold coating is 0.01 is utilized, the net heat exchange between the lower pole of the thermal switch and the upper pole of the thermal switch is small after multiple reflections, and the comprehensive thermal resistance is large, so that heat loss can be effectively prevented, and the effect of locking the temperature is achieved.

In a specific embodiment, a first acrylic pressure sensitive adhesive layer is arranged on one surface of the upper electrode plate 5 away from the lower electrode of the thermal switch, and the conductive upper electrode 6 is connected with the upper electrode plate 5 through the first acrylic pressure sensitive adhesive layer; the good electric conductivity and viscidity of acrylic pressure-sensitive adhesive are utilized to realize the conductive upper electrode 6 and the upper electrode plate 5 are connected, so that the upper electrode of the thermal switch can form electric field force with the lower electrode of the thermal switch under the condition of electrification, and meanwhile, heat can be led out, and the heat dissipation effect is achieved.

In a specific embodiment, a second acrylic pressure-sensitive adhesive layer is arranged on one surface of the conductive lower electrode 2 away from the bottom substrate 1; the lower electrode plate 3 is connected with the conductive lower electrode 2 through the second acrylic pressure-sensitive adhesive layer; the conductive lower electrode 2 is connected with the lower pole plate 3 by utilizing the good conductivity and viscosity of the acrylic pressure-sensitive adhesive, so that the upper pole of the thermal switch and the lower pole of the thermal switch can form an electric field force under the electrified condition.

In an optional embodiment, the conductive upper electrode 6 and the conductive lower electrode 2 are both made of copper foil; it should be emphasized that the conductive upper electrode 6 and the conductive lower electrode 2 can be replaced by other materials, and only the electric field force is formed in the energized state.

In an optional embodiment, the bottom substrate 1 is made of silica gel or epoxy resin; it is emphasized that other cured materials with some adhesion may be used instead of the base substrate 1.

In an alternative embodiment, the supporting body 8 is made of acrylic ester, and by utilizing the low thermal conductivity of acrylic ester, the lower thermal switch pole can be prevented from conducting the heat of the device to the upper thermal switch pole through the supporting body 8 in a state that the upper thermal switch pole and the lower thermal switch pole are separated, so as to influence the temperature locking effect on the device, and it should be emphasized that the supporting body 8 can also be replaced by other adhesive substances with low thermal conductivity.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.