阅读说明：本技术 曝光模组及印刷线路板曝光设备 (Exposure module and printed circuit board exposure equipment ) 是由 赵渊 于 2021-02-09 设计创作，主要内容包括：本发明提供了一种曝光模组及印刷线路板曝光设备,所述曝光模组包括光源组件和光波导组件,所述光源组件根据所述待曝光的印刷线路板的曝光位置变换中间图案,并将所述中间图案投射到所述光波导组件的入光端；所述光波导组件包括多个导光体,多个所述导光体在光波导组件的入光端按第一图案排列、在光波导组件的出光端按第二图案排列,每一所述导光体的入端构成第一图案的一个图像单元,每一所述导光体的出端构成第二图案的一个图像单元,且所述第一图案的宽度小于所述待曝光的印刷线路板的宽度,所述第二图案的宽度不小于所述待曝光的印刷线路板的宽度。本发明可大大降低曝光设备的成本,同时也避免了多个曝光头之间的位移量协调。(The invention provides an exposure module and a printed circuit board exposure device, wherein the exposure module comprises a light source component and an optical waveguide component, the light source component transforms an intermediate pattern according to the exposure position of the printed circuit board to be exposed and projects the intermediate pattern to the light inlet end of the optical waveguide component; the optical waveguide assembly comprises a plurality of light guide bodies, the light guide bodies are arranged at the light inlet end of the optical waveguide assembly according to a first pattern, the light outlet end of the optical waveguide assembly is arranged according to a second pattern, the input end of each light guide body forms an image unit of the first pattern, the output end of each light guide body forms an image unit of the second pattern, the width of the first pattern is smaller than that of the printed circuit board to be exposed, and the width of the second pattern is not smaller than that of the printed circuit board to be exposed. The invention can greatly reduce the cost of the exposure equipment and simultaneously avoid the coordination of the displacement among a plurality of exposure heads.)

1. An exposure module comprises a light source component and an optical waveguide component, wherein the optical waveguide component receives light emitted by the light source component through a light inlet end and exposes a printed circuit board to be exposed through a light outlet end;

the optical waveguide assembly comprises a plurality of light guide bodies, the plurality of light guide bodies are arranged according to a first pattern at the light inlet end of the optical waveguide assembly, the plurality of light guide bodies are arranged according to a second pattern at the light outlet end of the optical waveguide assembly, the input end of each light guide body forms an image unit of the first pattern, the output end of each light guide body forms an image unit of the second pattern, the width of the first pattern is smaller than that of the printed circuit board to be exposed, and the width of the second pattern is not smaller than that of the printed circuit board to be exposed.

2. The exposure module of claim 1, wherein the light guide is formed of optical fibers, and the optical waveguide assembly includes m x n optical fibers, an entrance end of each of the optical fibers forming a pixel of the first pattern, and an exit end of each of the optical fibers forming a pixel of the second pattern;

the pixel points of the first pattern form an m × n first matrix, the pixel points of the second pattern are arranged into n × s rows along a first direction, each row comprises m/s pixel points arranged along a second direction, the first direction is parallel to the width direction of the printed circuit board to be exposed, m and n are positive integers respectively, s is a positive integer greater than or equal to 2, and m is an integral multiple of s.

3. The exposure module of claim 2, wherein the pixels of the second pattern form a second matrix of (m/s) x (n x s).

4. The exposure module according to claim 2, wherein the pixels of the second pattern form t second matrices, each of the second matrices includes n × s/t pixels arranged along the first direction, wherein t is a positive integer, and n × s is an integer multiple of t;

the t second matrixes are arranged into two adjacent rows along a second direction, in each row, a pixel point of a tail column of each second matrix and a pixel point of a head column of one second matrix of the adjacent row are positioned on the same straight line, and the second direction is vertical to the first direction; or the t second matrixes are arranged into t adjacent rows along the second direction, and in each row, the pixel point of the tail column of each second matrix and the pixel point of the head column of one second matrix in the adjacent row are positioned on the same straight line.

5. The exposure module according to claim 3 or 4, wherein, in each row of pixels of the second matrix, the pixels of adjacent rows are sequentially spaced apart by a predetermined distance in the first direction, and the distance between the first pixel and the last pixel in the second direction in the first direction is equal to the diameter of the optical fiber.

6. The exposure module according to claim 1, wherein the light guide is composed of planar light guide media, and the optical waveguide assembly includes i planar light guide media, wherein i is an integer greater than or equal to 2; the first pattern is composed of input ends of i plane light guide media which are arranged along a second direction, and the second pattern is composed of output ends of i plane light guide media which are arranged along a first direction; the first direction is a long side direction of a cross section of the planar light guide medium, and the second direction is a short side direction of the cross section of the planar light guide medium.

7. The exposure module according to claim 1, wherein the light source assembly comprises a light emitting unit, a DMD device and a lens assembly, and the DMD device is configured to generate an intermediate pattern according to a control signal from an upper computer and project light emitted from the light emitting unit to the lens assembly according to the intermediate pattern; the lens group is used for injecting the light projected by the DMD device into the light inlet end of the optical waveguide component.

8. The exposure module according to claim 1, wherein the optical waveguide assembly comprises a housing, the housing comprises a first opening and a second opening, the plurality of light guides are respectively mounted in the housing, the light input end of the optical waveguide assembly extends out of the first opening, and the light output end of the optical waveguide assembly exposes the printed circuit board to be exposed through the second opening;

the shell is L-shaped, the plane of the first opening is perpendicular to the width direction of the printed circuit board to be exposed, and the plane of the second opening is parallel to the width direction of the printed circuit board to be exposed;

the light source component is arranged on the shell in a mode that emergent light is parallel to the width direction of the printed circuit board to be exposed, and the emergent end of the light source component is opposite to the light inlet end of the optical waveguide component.

9. A printed wiring board exposure apparatus comprising the exposure module according to any one of claims 1 to 8.

10. The apparatus according to claim 9, wherein the apparatus comprises a driving device, and the printed wiring board to be exposed is moved relative to the exposure module by the driving device.

Technical Field

The invention relates to the field of printed circuit board production, in particular to an exposure module and a printed circuit board exposure device.

Background

The exposure is to irradiate the organic high molecular material by light rays, decompose the organic high molecular material into free radicals, and then initiate the photopolymerization monomer to carry out polymerization crosslinking reaction to form a macromolecular structure which is not easy to dissolve in dilute alkali liquor. Exposure is an important process in the production of PCBs (Printed Circuit boards), and the quality of exposure directly affects the stability of the PCB quality. At present, the PCB exposure process is mainly realized by an exposure machine. With the continuous development of consumer electronics, the demand for PCB boards is more and more precise, and accordingly, the requirements for the precision and the exposure speed of exposure equipment are higher and higher.

Among the existing exposure machine, because the exposure head is mostly square and the size is limited, when exposing objects of PCB (printed circuit board) equal width, most utilize a plurality of exposure heads to carry out the roll formula exposure that constantly removes, need a plurality of exposure heads that set up side by side to carry out the piecemeal exposure concatenation to PCB on an exposure equipment promptly. A plurality of exposure heads have not only increased the total cost of exposure machine by a wide margin, require this a plurality of exposure heads to operate steadily, the displacement volume is stable moreover in exposure process, nevertheless shake or the displacement volume has the deviation to cause the bad scheduling problem of exposure concatenation slightly appearing in the operation. Moreover, the exposure head is required to run stably and have stable displacement, so that the requirements on the machining and assembling precision are quite high, and the overall cost of the exposure machine is further increased.

Disclosure of Invention

The invention aims to solve the technical problems that the exposure machine is high in cost and high in requirements on processing and assembling precision due to the fact that a plurality of exposure heads are used for exposure in a blocking mode, and provides a novel integrated exposure module and a printed circuit board exposure device.

The technical scheme for solving the technical problems is that the exposure module comprises a light source component and an optical waveguide component, wherein the optical waveguide component receives light emitted by the light source component through a light inlet end and exposes a printed circuit board to be exposed through a light outlet end, the light source component transforms an intermediate pattern according to the exposure position of the printed circuit board to be exposed and projects the intermediate pattern to the light inlet end of the optical waveguide component;

the optical waveguide assembly comprises a plurality of light guide bodies, the plurality of light guide bodies are arranged according to a first pattern at the light inlet end of the optical waveguide assembly, the plurality of light guide bodies are arranged according to a second pattern at the light outlet end of the optical waveguide assembly, the input end of each light guide body forms an image unit of the first pattern, the output end of each light guide body forms an image unit of the second pattern, the width of the first pattern is smaller than that of the printed circuit board to be exposed, and the width of the second pattern is not smaller than that of the printed circuit board to be exposed.

As a further improvement of the present invention, the light guide body is formed by optical fibers, and the optical waveguide assembly includes m × n optical fibers, an input end of each optical fiber forms one pixel point of the first pattern, and an output end of each optical fiber forms one pixel point of the second pattern;

the pixel points of the first pattern form an m × n first matrix, the pixel points of the second pattern are arranged into n × s rows along a first direction, each row comprises m/s pixel points arranged along a second direction, the first direction is parallel to the width direction of the printed circuit board to be exposed, m and n are positive integers respectively, s is a positive integer greater than or equal to 2, and m is an integral multiple of s.

As a further refinement of the invention, the pixels of the second pattern constitute a second matrix of (m/s) × (n × s).

As a further improvement of the present invention, the pixel points of the second pattern form t second matrices, each of the second matrices includes n × s/t pixel points arranged along the first direction, the t is a positive integer, and the n × s is an integer multiple of the t;

the t second matrixes are arranged into two adjacent rows along a second direction, in each row, a pixel point of a tail column of each second matrix and a pixel point of a head column of one second matrix of the adjacent row are positioned on the same straight line, and the second direction is vertical to the first direction; or the t second matrixes are arranged into t adjacent rows along the second direction, and in each row, the pixel point of the tail column of each second matrix and the pixel point of the head column of one second matrix in the adjacent row are positioned on the same straight line.

As a further improvement of the present invention, in each row of the pixels of the second matrix, the pixels in adjacent rows are sequentially spaced by a preset distance in the first direction, and the distance between the first pixel and the last pixel in the second direction in the first direction is equal to the diameter of the optical fiber.

As a further improvement of the present invention, the light guide body is composed of a planar light guide medium, and the optical waveguide assembly includes i planar light guide media, where i is an integer greater than or equal to 2; the first pattern is composed of input ends of i plane light guide media which are arranged along a second direction, and the second pattern is composed of output ends of i plane light guide media which are arranged along a first direction; the first direction is a long side direction of a cross section of the planar light guide medium, and the second direction is a short side direction of the cross section of the planar light guide medium.

As a further improvement of the present invention, the light source assembly includes a light emitting unit, a DMD device and a lens assembly, and the DMD device is configured to generate an intermediate pattern according to a control signal of an upper computer, and project light emitted by the light emitting unit to the lens assembly according to the intermediate pattern; the lens group is used for injecting the light projected by the DMD device into the light inlet end of the optical waveguide component.

As a further improvement of the present invention, the optical waveguide assembly comprises a housing, the housing comprises a first opening and a second opening, the plurality of light guiding members are respectively mounted in the housing, and the light input end of the optical waveguide assembly extends out of the first opening, and the light output end of the optical waveguide assembly exposes the printed circuit board to be exposed through the second opening;

the shell is L-shaped, the plane of the first opening is perpendicular to the width direction of the printed circuit board to be exposed, and the plane of the second opening is parallel to the width direction of the printed circuit board to be exposed;

the light source component is arranged on the shell in a mode that emergent light is parallel to the width direction of the printed circuit board to be exposed, and the emergent end of the light source component is opposite to the light inlet end of the optical waveguide component.

The invention also provides a printed circuit board exposure device which comprises the exposure module.

As a further improvement of the present invention, the printed wiring board exposure apparatus includes a driving device, and the printed wiring board to be exposed moves relative to the exposure module under the driving of the driving device.

According to the exposure module and the printed circuit board exposure equipment, the middle pattern generated by the light source component is converted into the circuit pattern matched with the width of the printed circuit board to be exposed through the optical waveguide component, so that the scanning exposure of the printed circuit board to be exposed can be completed by only one exposure head, the cost of the exposure equipment is greatly reduced, and meanwhile, the coordination of the displacement among a plurality of exposure heads is avoided.

Drawings

FIG. 1 is a schematic structural diagram of an exposure module according to an embodiment of the present invention;

FIG. 2 is a schematic view of another angle of the exposure module according to the embodiment of the present invention;

FIG. 3 is a schematic diagram of a light exit end of an optical waveguide assembly in an exposure module according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of an optical waveguide assembly in an exposure module according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a light-incident end of an optical waveguide assembly in an exposure module according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a light exit end of an optical waveguide assembly in an exposure module according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a partial enlarged structure of the second matrix in FIG. 5;

FIG. 8 is a schematic view of a light exit end of an optical waveguide assembly in an exposure module according to another embodiment of the present invention;

fig. 9 is a schematic view of a light-emitting end of an optical waveguide assembly in an exposure module according to another embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1 to 4, the structural schematic diagrams of the exposure module according to the embodiments of the present invention are shown, and the exposure module can be applied to an exposure apparatus in a Printed Circuit Board (PCB) exposure process, and implement scanning exposure of a PCB. The exposure module of the present embodiment includes a light source assembly 11 and an optical waveguide assembly 12, wherein the optical waveguide assembly 12 receives light emitted by the light source assembly 11 through a light incident end 121 thereof, and exposes a printed circuit board to be exposed through a light emitting end 122 thereof, thereby implementing a line layout on the printed circuit board to be exposed.

In the present embodiment, the light source assembly 11 can transform the intermediate pattern according to the exposure position of the printed wiring board to be exposed, and project the intermediate pattern to the light incident end 121 of the light guide assembly 12. Specifically, the intermediate pattern is generated according to the trace of the printed circuit board to be exposed, for example, when a certain pixel point of the intermediate pattern corresponds to the trace of the printed circuit board to be exposed, the state of the pixel point is non-luminous (i.e., off), and when a certain pixel point of the intermediate pattern corresponds to the non-trace of the printed circuit board to be exposed, the state of the pixel point is luminous (i.e., on). In one embodiment of the present invention, the intermediate pattern may be formed by stitching one or more lines of images of a predetermined height on the circuit board to be exposed to a rectangular area.

The optical waveguide assembly 12 includes a plurality of light guides, and receives an image unit on the intermediate pattern generated by the light source assembly 11 through the input ends of the plurality of light guides, and then performs exposure processing on the printed circuit board to be exposed through the output ends of the plurality of light guides, that is, each light guide performs exposure or non-exposure on a corresponding position of the printed circuit board to be exposed according to the state of an image unit on the intermediate pattern.

The plurality of light guides are arranged in a first pattern at the light entrance end of the optical waveguide assembly 12 and in a second pattern at the light exit end of the optical waveguide assembly 12, the entrance end (i.e., the first end) of each light guide constituting a picture element of the first pattern and the exit end (i.e., the second end) of each light guide constituting a picture element of the second pattern. That is, the arrangement of the light guides at the light entrance end 121 of the optical waveguide assembly 12 is different from the arrangement of the light guides at the light exit end 122 of the optical waveguide assembly 12. The first pattern is adapted to the shape and size of the emitting end of the light source assembly 11. Specifically, as shown in fig. 4-5, limited to the shape and size of the emitting end of the light source assembly 11, the width L2 of the first pattern is smaller than the width of the printed wiring board to be exposed, and as shown in fig. 3 and 6, the width L1 of the second pattern is not smaller than the width of the printed wiring board to be exposed, so that scanning exposure of the printed wiring board in units of rows can be realized by a single exposure module, that is, one exposure module exposes one or more rows of the printed wiring board to be exposed at least at a time.

Above-mentioned exposure module, through changing the arrangement of light guide in optical waveguide subassembly 12 at its income light end 121 and light-emitting end 122, the middle pattern that produces light source subassembly 11 converts the circuit pattern with the width looks adaptation of the printed wiring board of treating the exposure, thereby make the exposure width of single exposure module and the width looks adaptation of the printed wiring board of treating the exposure, thereby only need an exposure head can accomplish the scanning type exposure (unidirectional movement) of the printed wiring board of treating the exposure, and need not the reciprocating motion concatenation, greatly reduced the cost of exposure equipment, the displacement volume coordination between a plurality of exposure heads has also been avoided simultaneously, the concatenation mistake that has avoided the displacement volume inconsistent and lead to has been avoided. In particular, when the width of the second pattern is larger than the width of the printed wiring board to be exposed, the width of the printed wiring board to be exposed can be adapted by adjusting the intermediate pattern generated by the light source assembly 11.

Referring to fig. 5-9, in one embodiment of the present invention, the light guide is formed of optical fibers 123, the optical waveguide assembly 12 includes m × n optical fibers 123, the input end of each optical fiber 123 forms a pixel of the first pattern, and the output end of each optical fiber 123 forms a pixel of the second pattern. Accordingly, the pixel points of the first pattern form an m × n first matrix, that is, the optical fibers 123 are arranged in a rectangle of m rows and n columns at the light input end 121 of the optical waveguide component 12; the pixel points of the second pattern are arranged in n × s rows along the first direction X, and each row includes m/s pixel points arranged along the second direction Y, that is, the optical fibers 123 are arranged in m/s rows and n × s rows at the light-emitting end 122 of the optical waveguide component 12. The first direction is parallel to the width direction of the printed circuit board to be exposed, m and n are positive integers respectively, s is a positive integer greater than or equal to 2 and m is an integral multiple of s, and the second direction Y is perpendicular to the first direction X. Of course, in practical applications, the first direction X and the second direction Y may have other included angles.

In a specific application, the m, n, and s may be adjusted according to the shape and size of the emitting end of the light source assembly 11, the exposure accuracy and size of the printed circuit board to be exposed, and other requirements, such as m: n is equal to the aspect ratio of the exit end of the light source assembly 11. Moreover, the arrangement of the optical fibers 123 at the light-in end 121 and the light-out end 122 of the optical waveguide component 12 can also be adjusted as needed, and accordingly, the light source assembly 11 only needs to adjust the algorithm for generating the intermediate pattern according to the arrangement of the optical fibers 123 at the light-in end 121 and the light-out end 122 of the optical waveguide component 12.

Referring to fig. 6, in an embodiment of the present invention, the pixel points of the second pattern form a second matrix of (m/s) × (n × s). That is, the optical fibers 123 are arranged in a rectangular shape with m/s rows and n × s columns at the light exit end 122 of the optical waveguide module 12.

In particular, as shown in fig. 7, to improve the exposure accuracy, in each row of pixels of the second matrix, the pixels in adjacent rows are sequentially spaced apart by a predetermined distance (e.g., 0.5 μm) in the first direction, and a distance d between a first pixel and a last pixel in the second direction Y in the first direction X is equal to a diameter of the optical fiber 123 (the distance is offset by a diameter of the optical fiber 123 on either side), and at this time, the second direction Y forms an included angle greater than 90 ° with respect to the X direction. That is, the difference between the first row and the last row of the second matrix is an optical fiber in the first direction X, so that each pixel point on the printed circuit board to be exposed is exposed by m/s optical fibers in the second direction Y, the sawteeth of the circuit on the printed circuit board are reduced, and the exposure precision higher than the resolution of a circular exposure point is achieved.

Referring to fig. 8, the pixel points of the second pattern at the light-emitting end 122 of the optical waveguide component 12 may further form t second matrices, where each second matrix includes n × s/t pixel points arranged along the first direction X, and each column includes m/s pixel points arranged along the second direction Y, where t is a positive integer and n × s is an integer multiple of t. In addition, in this embodiment, the t second matrices are arranged in two adjacent rows along a second direction Y, and in each row, a pixel point of a tail column of each second matrix and a pixel point of a head column of one second matrix of the adjacent row are located on the same straight line, and the second direction Y is perpendicular (including being close to perpendicular) to the first direction X.

Alternatively, as shown in fig. 9, the t second matrices may be further arranged along the second direction Y into t adjacent rows, and in each row, a pixel point at a tail column of each second matrix and a pixel point at a head column of one second matrix in the adjacent row are located on the same straight line.

Further, the light guide body may be constituted by a planar light guide medium, and the optical waveguide assembly 12 includes i planar light guide media, i being an integer greater than or equal to 2. The first pattern of the light incident end 121 of the optical waveguide assembly 12 is formed by the incident ends of i planar light guiding mediums arranged along the second direction Y, and the second pattern of the light emergent end 122 is formed by the emergent ends of i planar light guiding mediums arranged along the first direction X. The first direction X is a long side direction of a cross section of the planar light guide medium, and the second direction Y is a short side direction of the cross section of the planar light guide medium.

To improve the exposure accuracy, a plurality of planar light guiding media may be arranged in the manner of fig. 9.

As shown in fig. 1-2, in an embodiment of the present invention, the light source assembly 11 of the exposure module includes a light emitting unit 111, a DMD device 112 and a lens assembly 113, and light emitted from the light emitting unit 111 is reflected to the lens assembly 113 through the DMD device 112, and is converted into parallel light by the lens assembly 113 and then projected to the light incident end 121 of the optical waveguide assembly 12. Specifically, the light emitting unit 111 may be an LED array, and the wavelength of the emitted light may correspond to the material of the coating on the printed wiring board to be exposed. Of course, in practical applications, the light emitting unit 111 and the DMD device 112 may be replaced by an LED lattice.

Specifically, the DMD device 112 is connected to an upper computer (for example, an industrial personal computer of an exposure device), generates an intermediate pattern according to a control signal from the upper computer (the control signal is related to a track of an exposure position of a printed circuit board to be exposed), projects light emitted from the light emitting unit 111 to the lens group 113 according to the intermediate pattern, converts the light projected from the DMD device 112 into parallel light by the lens group 113, and then projects the parallel light into the light incident end 121 of the optical waveguide assembly 12, that is, projects the parallel light into the incident end of each optical waveguide.

As shown in fig. 1-4, to improve the integration of the exposure module, the optical waveguide assembly 12 of the exposure module includes a housing 120, the housing 120 includes a first opening and a second opening, a plurality of light guides are respectively installed in the housing 120, a light-input end 121 of the optical waveguide assembly 12 extends out of the first opening, and a light-output end 122 of the optical waveguide assembly 12 exposes the printed circuit board to be exposed through the second opening.

In particular, to reduce the volume of the exposure module, the housing 120 of the optical waveguide assembly 12 may have an L-shape, and the plane of the first opening is perpendicular to the first direction X, and the plane of the second opening is parallel to the first direction X. The light source assembly 11 is mounted to the housing 120 in such a manner that the outgoing light is parallel to the first direction X, and the outgoing end of the light source assembly 11 is opposite to the incoming end 121 of the light waveguide assembly 12.

The invention also provides a printed circuit board exposure device which comprises the exposure module shown in the figures 1-9. And scanning exposure of the printed circuit board to be exposed is realized through the exposure module.

As a further improvement of the present invention, the above-mentioned printed circuit board exposure apparatus includes a driving device, in this embodiment, the exposure module is fixed, and the printed circuit board to be exposed is driven by the driving device to move relative to the exposure module, and during the movement of the printed circuit board, the surface to be exposed of the printed circuit board to be exposed is translated and passed through the light-emitting end 122 of the optical waveguide component 12 of the exposure module, so that the light emitted from the light-emitting end 122 of the optical waveguide component 12 of the exposure module realizes scanning exposure.

According to the printed circuit board exposure equipment, the middle pattern generated by the light source assembly is converted into the circuit pattern matched with the width of the printed circuit board to be exposed through the optical waveguide assembly, so that the scanning exposure of the printed circuit board to be exposed can be completed by only one exposure head, the cost of the exposure equipment is greatly reduced, and meanwhile, the coordination of the displacement among a plurality of exposure heads is avoided.

Of course, in practical application, the scanning exposure of the printed circuit board to be exposed can also be realized by driving the exposure module to move along the surface of the printed circuit board to be exposed.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.