阅读说明：本技术 钙钛矿太阳电池组件及其制备方法 (Perovskite solar cell module and preparation method thereof ) 是由 夏锐 陈达明 冯志强 陈奕峰 于 2021-03-12 设计创作，主要内容包括：本发明提供了一种钙钛矿太阳电池组件及其制备方法,电池组件包括：导电基底,导电基底包括基层和导电层；分隔槽,贯穿导电层而将导电层分隔为区域阵列,区域阵列的每一行包括分隔的多个导电区域；电子传输层、钙钛矿层和空穴传输层,依次位于每个导电区域之上；多个开口,每一开口依次贯穿每个导电区域上的电子传输层、钙钛矿层和空穴传输层,以露出每个导电区域；以及多个电极。采用本发明的钙钛矿太阳电池组件及其制备方法可以改变太阳电池组件内部的连接方式,提升太阳电池组件的稳定性和可靠性。(The invention provides a perovskite solar cell module and a preparation method thereof, wherein the cell module comprises: a conductive substrate including a base layer and a conductive layer; the separation groove penetrates through the conductive layer to separate the conductive layer into an area array, and each row of the area array comprises a plurality of separated conductive areas; an electron transport layer, a perovskite layer and a hole transport layer, which are sequentially positioned on each conductive region; a plurality of openings, each opening sequentially penetrating through the electron transport layer, the perovskite layer, and the hole transport layer on each conductive region to expose each conductive region; and a plurality of electrodes. By adopting the perovskite solar cell module and the preparation method thereof, the internal connection mode of the solar cell module can be changed, and the stability and reliability of the solar cell module are improved.)

1. A perovskite solar cell assembly comprising:

a conductive substrate including a base layer and a conductive layer;

a separation groove penetrating the conductive layer to separate the conductive layer into an area array, each row of the area array including a plurality of separated conductive areas;

an electron transport layer, a perovskite layer and a hole transport layer, which are sequentially positioned on each conductive region;

a plurality of openings, each opening sequentially penetrating through the electron transport layer, the perovskite layer and the hole transport layer on each of the conductive regions to expose each of the conductive regions; and

a plurality of electrodes comprising: a first common electrode contacting the hole transport layer above the leftmost conductive region of each row, a second common electrode contacting the rightmost conductive region through the rightmost opening of each row, and a plurality of connection electrodes, each connection electrode contacting a first conductive region exposed by the first opening through the first opening in each row and contacting the hole transport layer above the second conductive region, the first and second conductive regions being adjacent on the conductive layer.

2. The perovskite solar cell assembly of claim 1, wherein the first common electrode comprises a shank and a plurality of teeth, each tooth extending from the shank and contacting the hole transport layer over each row of the leftmost conductive region.

3. The perovskite solar cell assembly of claim 1, wherein the second common electrode comprises a shank and a plurality of teeth, each tooth extending from the shank and contacting the rightmost conductive region through the rightmost opening of each row.

4. The perovskite solar cell assembly of claim 1, wherein each of the connection electrodes comprises a shank passing through the first opening to contact the first conductive region exposed by the first opening and a tooth extending from the shank and contacting the hole transport layer over the second conductive region.

5. The perovskite solar cell assembly of claim 1, wherein the thickness of the electrode is from 30 to 100 nm.

6. The perovskite solar cell assembly of claim 1, wherein the width of the opening is 1 to 10 mm.

7. The perovskite solar cell assembly of claim 1, further comprising:

the packaging material is packaged on the plurality of electrodes; and

and the back plate is packaged under the conductive substrate.

8. A preparation method of a perovskite solar cell module comprises the following steps:

providing a conductive substrate comprising a base layer and a conductive layer;

cutting the conductive layer to form a through separation groove, wherein the separation groove divides the conductive layer into an area array, and each row of the area array comprises a plurality of separated conductive areas;

forming an electron transport layer, a perovskite layer and a hole transport layer on each conductive region in sequence;

forming openings sequentially through the electron transport layer, perovskite layer and hole transport layer on each of the conductive regions, each of the openings exposing each of the conductive regions;

forming a first common electrode contacting the hole transport layer over the leftmost conductive region of each row, a second common electrode contacting the rightmost conductive region through the rightmost opening of each row, and a plurality of connection electrodes, each connection electrode contacting a first conductive region exposed by the first opening through the first opening in each row and contacting the hole transport layer over the second conductive region, the first and second conductive regions being adjacent on the conductive layer.

9. The method of claim 8, further comprising:

and cleaning the conductive substrate.

10. The method of claim 8, wherein the step of cutting the conductive layer to form through separation grooves comprises physical scribing and laser etching, and the separation grooves have a width of 0.1-1 mm.

11. The method of claim 8, wherein the step of forming the first common electrode, the second common electrode, and the plurality of connection electrodes comprises a thermal evaporation method or a screen printing method, and the thickness of the first common electrode, the second common electrode, and the plurality of connection electrodes is 30 to 100 nm.

12. The method of claim 8, further comprising: and covering the packaging material and the back plate to package the perovskite solar cell module.

13. The method of claim 12, wherein the step of covering the encapsulant and the back sheet to encapsulate the perovskite solar cell assembly comprises: the encapsulation is completed by hot pressing, wherein the pressing temperature is 80 to 150 ℃ and the pressing time is 1 to 60 minutes.

Technical Field

The invention mainly relates to the field of solar cells, in particular to a perovskite solar cell module and a preparation method thereof.

Background

Perovskite technology has gained continuous attention in recent years in both academic and industrial sectors by virtue of its high efficiency and low cost. The maximum authentication efficiency of the small-area perovskite solar cell in a laboratory at present reaches 25.5%, and the small-area perovskite solar cell can be comparable to the traditional solar cell, so that the small-area perovskite solar cell has a wide commercial prospect. Research on the preparation of perovskite solar cell modules is a necessary way for commercialization of perovskites.

Fig. 1 is a cross-sectional perspective view of a solar cell module 10. At present, most perovskite solar cell modules are structured by etching and isolating, and a structure that the sub-cells 11, 12 and 13 are connected in series as shown in fig. 1 is formed. The bottom of cell assembly 10 is made up of a non-conductive Glass layer and a discontinuous arrangement of conductive Glass FTO layers.

Taking the sub-cell 11 as an example, an electron transport layer etl (electron transport layer), a Perovskite layer (Perovskite), and a hole transport layer htl (hole transport layer) are used, and a metal layer Au layer is covered thereon to form a metal electrode.

The structure shown in fig. 1 and the conventional manufacturing method have many problems, for example, because the sub-batteries are connected in series, a certain sub-battery connected in series may fail or even the whole battery assembly may be damaged due to instability of the perovskite layer and other factors during the operation of the battery assembly.

Disclosure of Invention

The invention aims to provide a perovskite solar cell module and a preparation method thereof, which can change the connection mode inside the solar cell module and improve the stability and reliability of the solar cell module.

In order to solve the above technical problems, the present invention provides a perovskite solar cell module, comprising: a conductive substrate including a base layer and a conductive layer; a separation groove penetrating the conductive layer to separate the conductive layer into an area array, each row of the area array including a plurality of separated conductive areas; an electron transport layer, a perovskite layer and a hole transport layer, which are sequentially positioned on each conductive region; a plurality of openings, each opening sequentially penetrating through the electron transport layer, the perovskite layer and the hole transport layer on each of the conductive regions to expose each of the conductive regions; and a plurality of electrodes comprising: a first common electrode contacting the hole transport layer above the leftmost conductive region of each row, a second common electrode contacting the rightmost conductive region through the rightmost opening of each row, and a plurality of connection electrodes, each connection electrode contacting a first conductive region exposed by the first opening through the first opening in each row and contacting the hole transport layer above the second conductive region, the first and second conductive regions being adjacent on the conductive layer.

In one embodiment of the invention, the first common electrode comprises a shank and a plurality of teeth, each tooth extending from the shank and contacting the hole transport layer over each row of the leftmost conductive region.

In an embodiment of the invention, the second common electrode comprises a shank and a plurality of teeth, each tooth extending from the shank and contacting the rightmost conductive region through the rightmost opening of each row.

In an embodiment of the present invention, each of the connection electrodes includes a shank portion contacting the first conductive region exposed by the first opening through the first opening, and a tooth portion extending from the shank portion and contacting the hole transport layer over the second conductive region.

In an embodiment of the invention, the thickness of the electrode is 30 to 100 nm.

In an embodiment of the invention, the width of the opening is 1-10 mm.

In an embodiment of the present invention, the method further includes: the packaging material is packaged on the plurality of electrodes; and a back plate encapsulated under the conductive substrate.

In order to solve the above technical problems, the present invention also provides a method for preparing a perovskite solar cell module, comprising the following steps: providing a conductive substrate comprising a base layer and a conductive layer; cutting the conductive layer to form a through separation groove, wherein the separation groove divides the conductive layer into an area array, and each row of the area array comprises a plurality of separated conductive areas; forming an electron transport layer, a perovskite layer and a hole transport layer on each conductive region in sequence; forming openings sequentially through the electron transport layer, perovskite layer and hole transport layer on each of the conductive regions, each of the openings exposing each of the conductive regions; forming a first common electrode contacting the hole transport layer over the leftmost conductive region of each row, a second common electrode contacting the rightmost conductive region through the rightmost opening of each row, and a plurality of connection electrodes, each connection electrode contacting a first conductive region exposed by the first opening through the first opening in each row and contacting the hole transport layer over the second conductive region, the first and second conductive regions being adjacent on the conductive layer.

In an embodiment of the present invention, the preparation method further includes: and cleaning the conductive substrate.

In an embodiment of the invention, the step of cutting the conductive layer to form a through separation groove includes physical scribing and laser etching, and the width of the separation groove is 0.1-1 mm.

In an embodiment of the present invention, the step of forming the first common electrode, the second common electrode, and the plurality of connection electrodes includes a thermal evaporation method or a screen printing method, and the first common electrode, the second common electrode, and the plurality of connection electrodes have a thickness of 30 to 100 nm.

In an embodiment of the present invention, the preparation method further includes: and covering the packaging material and the back plate to package the perovskite solar cell module.

In an embodiment of the present invention, the step of covering the packaging material and the back sheet to package into the perovskite solar cell module includes: the encapsulation is completed by hot pressing, wherein the pressing temperature is 80 to 150 ℃ and the pressing time is 1 to 60 minutes.

Compared with the prior art, the invention has the following advantages:

the perovskite solar cell module and the preparation method thereof divide the conducting layer part of the whole conducting substrate into a plurality of conducting areas which are arranged according to an array, then cover the electron transmission layer, the perovskite layer and the hole transmission layer in sequence, and are provided with openings which penetrate through all the layers and reach the conducting areas, and finally prepare the metal electrode through a graphical design mask, thereby realizing the connection mode of series-parallel combination of sub-cells on the substrate.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the principle of the invention. In the drawings:

FIG. 1 is a sectional perspective view of a solar cell module;

FIGS. 2 a-2 f are schematic exploded plan views of layers of a perovskite solar cell module according to an embodiment of the invention;

FIGS. 3 a-3 f are schematic exploded perspective views of layers of a perovskite solar cell assembly according to an embodiment of the invention;

FIG. 4 is a schematic structural diagram of an electrode in a perovskite solar cell assembly according to an embodiment of the invention; and

fig. 5 is a schematic flow chart of a method for manufacturing a perovskite solar cell module according to an embodiment of the invention.

List of reference numerals in fig. 1 to 4

10 solar cell module

Sub-cell in 11-13 solar cell module 10

20 perovskite solar cell module

21 conductive substrate

211 base layer

212 conductive layer

2120 external electrode

22 dividing groove

220 conductive region

2200 leftmost conductive region

2201 rightmost conductive region

23 physical layer

231 electron transport layer

232 perovskite layer

233 hole transport layer

24 encapsulation layer

25 opening

251 rightmost opening

26 metal electrode layer

260 first common electrode

261 second common electrode

262 connecting electrode

2600 first common electrode handle

2601 to 2603 first common electrode teeth

2610 second common electrode shank

2611 ~ 2613 second common electrode tooth portion

2620 connection electrode handle

2621 connection electrode tooth part

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only examples or embodiments of the application, from which the application can also be applied to other similar scenarios without inventive effort for a person skilled in the art. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present application; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of protection of the present application is not to be construed as being limited. Further, although the terms used in the present application are selected from publicly known and used terms, some of the terms mentioned in the specification of the present application may be selected by the applicant at his or her discretion, the detailed meanings of which are described in relevant parts of the description herein. Further, it is required that the present application is understood not only by the actual terms used but also by the meaning of each term lying within.

It will be understood that when an element is referred to as being "on," "connected to," or "in contact with" another element, it can be directly on, connected or coupled to, or in contact with the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to" or "directly contacting" another element, there are no intervening elements present.

The invention provides a perovskite solar cell module, which can change the connection mode in the solar cell module and improve the stability and reliability of the solar cell module.

As shown in fig. 2f and 3f, there are a top plan view and a perspective view, respectively, of a perovskite solar cell assembly 20 in an embodiment of the invention. Fig. 2a to 2e are schematic exploded plan views of the layers of the perovskite solar cell module 20 according to the present invention in this embodiment, and fig. 3a to 3e are schematic exploded perspective views of the layers of the perovskite solar cell module 20 according to the present embodiment.

The structure of a perovskite solar cell module 20 according to an embodiment of the present invention is described below with reference to fig. 2a to 3 f.

First, as shown in fig. 3f, the battery module 20 includes the conductive base 21, the plurality of separation grooves 22, and the solid layer 23 is understood as the solid layer 23 in which the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233 are sequentially stacked as shown in fig. 3 c. Further, an encapsulating layer 24 is provided on the solid layer 23, thereby encapsulating the battery module 20.

Specifically, as shown more clearly in fig. 3a, the conductive substrate 21 includes a base layer 211 and a conductive layer 212.

Illustratively, in some embodiments of the present invention, the base layer 211 is a glass substrate or an organic substrate such as polyethylene terephthalate, polyimide, or the like. In some other embodiments of the present invention, the conductive layer 212 may be FTO, ITO, AZO, GZO, Ag nanowire, or other transparent conductive material, and has a thickness of 100 to 500 nm.

Further, as shown in fig. 2b, 2c and 3b, when the conductive layer 21 is separated, an external electrode position 2120 is reserved at an edge position of the conductive layer 21, and the region can be directly used as an access port or a wiring region for electrically connecting the battery assembly 20 and the outside.

As shown in fig. 2b and 3b, a plurality of separation grooves 22 penetrate the conductive layer 212 to separate the conductive layer 212 into an area array, each row of the area array including a plurality of separated conductive areas 220. Since the plurality of separation grooves 22 penetrate the conductive layer 212, the plurality of conductive regions 220 after separation are not electrically conductive, each conductive region 220 can be regarded as a base of one electrode in the battery assembly, and a description will be made on a connection manner between the electrodes.

As described above, the bonded solid layer 23 in which the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233 are sequentially coated on each conductive region 220 is denoted by reference numeral 23 shown in fig. 2c and 3 c. After being sequentially arranged, the hole transport layer 233 is located on the upper surface of the solid layer 23.

Illustratively, the electron transport layer 231 may be one or more of TiO2, SnO2, ZnO2, IZO, fullerene and derivatives (C60, C70, PCBM), BaSnO3, or AZO, and the preparation method may be a sputtering method or a sol-gel method, and the thickness is 5 to 100 nm. The perovskite layer 232 is made of perovskite material with a chemical formula of ABX3, wherein A is one or more of Cs, Rb, CH3NH3 or CH2(NH2)2, B is Pb, and X is one or more of I or Br, and the preparation method is a thermal evaporation method or a solution method. Finally, the hole transport layer 233 is an inorganic hole conductive material such as NiOx, CuSCN, and CuAlO2, or some high-temperature resistant organic hole conductive material such as poly [ bis (4-phenyl) (2,4, 6-trimethylphenyl) amine ].

It is to be understood that the solid layer 23 identified by the hatched area in fig. 2c or the gray area in fig. 3c is an abstract and simple representation of the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233, which are arranged in this order, for the sake of simplicity of the drawing. The present invention is not limited to the arrangement and structure of the layers, and for example, the shapes of the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233 may not be completely the same in some cases, or there may be a difference in the size of the layers, or the like.

Further, as shown in fig. 2d and 3d, a plurality of openings 25 penetrating the solid layer 23 are provided on the solid layer 23 formed by combining the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233. Each opening 25 penetrates the electron transport layer 231, the perovskite layer 232, and the hole transport layer 233 in this order from bottom to top, thereby finally exposing the conductive region 220 on the hole transport layer 233 in the size of the opening 25.

For example, in some embodiments of the present invention, the above method for configuring the plurality of openings 25 may employ a physical scribing method or a wiping method using a chemical solvent, so as to ensure that a portion (represented by the size of the opening 25) of the conductive layer 212 (i.e., each conductive region 220) located below the electron transport layer 231, the perovskite layer 232 and the hole transport layer 233 is exposed, so that the different electrodes can be connected and electrically conducted through the conductive layer 212 exposed at the position of the opening 25.

In an embodiment of the invention, the width of the conductive region exposed on the conductive layer through the opening is 1 to 10mm, but the invention is not limited thereto.

Preferably, in this embodiment, as shown in fig. 2d and 3d, each opening 25 is located on the solid layer 23 directly above one of the conductive regions 220, and for each row of adjacent conductive regions 220, the positions of the openings 25 are located at the upper edge of the former and the lower edge of the latter, respectively, so as to facilitate the connection of the subsequent electrodes, but the invention is not limited thereto. In other embodiments, the location and arrangement of the openings 25 may vary depending on the desired manner of electrode connection.

As further shown in fig. 2e and 3e, on the top surface of the solid layer 23 having the plurality of openings 25, there is also a metal electrode layer 26, and the battery assembly 20 has a plurality of electrodes due to the coverage of the metal electrode layer 26 and its connection to the conductive areas 220 sized with the plurality of openings 25.

In some embodiments of the present invention, the material of the metal electrode 26 may be Au, Ag, Al, Cu, etc., and the preparation method is thermal evaporation or screen printing.

In an embodiment of the invention, the thickness of the metal electrode layer (i.e., the thickness of the first common electrode, the second common electrode, and the plurality of connection electrodes) is 30 to 100nm, but the invention is not limited thereto.

More specifically, as described above, the plurality of separation grooves 22 penetrate the conductive layer 212 to separate the conductive layer 212 into the area array, and each row of the area array includes a plurality of separated areas 220. Referring now to fig. 2b and 3b, the array of regions has leftmost and rightmost conductive regions 2200 and 2201 at the leftmost and rightmost sides of each row, respectively.

It will be appreciated that since fig. 2a to 3f only show regions having two columns, the two columns shown in the figures are the leftmost conductive region 2200 and the rightmost conductive region 2201 respectively. In other embodiments of the present invention, columns of other conductive regions 220 are also arranged between the leftmost conductive region 2200 and the rightmost conductive region 2201.

As shown further in fig. 2e and 3e, the plurality of electrodes in the battery assembly 20 have a first common electrode 260 and a second common electrode 261. Wherein the first common electrode 260 contacts the first common electrode 260 of the hole transport layer (shown as the uppermost surface of the physical layer 23 in fig. 2e and 3 e) above the leftmost conductive region 2200 of each row.

Referring now to fig. 2d and 3d, as described above, the plurality of openings 25 are staggered to expose two adjacent conductive regions 220 in each row, and the rightmost openings 251 of the rightmost conductive regions 2201 in each row of the area array are exposed. As further shown in fig. 2e and 3e, the second common electrode 261 contacts the rightmost conductive region 2201 through the rightmost opening 251 of each row.

In addition to the first and second common electrodes 260 and 261 described above, there is a connection electrode 262 among the above-described plurality of electrodes, between the first and second common electrodes 260 and 261 in each row. Each connection electrode 262 contacts the first conductive region exposed by the first opening through the first opening in each row and contacts the hole transport layer over the second conductive region, the first conductive region and the second conductive region being adjacent on the conductive layer.

It will be appreciated that fig. 2 a-3 f only show two columns of conductive regions 220, and therefore the leftmost conductive region 2200 and the rightmost conductive region 2201 are naturally adjacent on the conductive layer 212. Thus, only the first common electrode 260 located at the leftmost side, the second common electrode 261 located at the rightmost side, and one connection electrode 262 therebetween are shown in the drawing, and thus, the connection electrode 262 of each row shown in fig. 2e and 3e, the hole transport layer 233 above the first opening, i.e., the opening on the leftmost conductive region 2200, crossed in the row, and the hole transport layer above the contacted second conductive region, i.e., the hole transport layer 233 above the rightmost conductive region 2201, are shown.

However, the present invention is not limited to the position and number of the connection electrodes 262. In other embodiments of the invention, there are multiple connecting electrodes in each row.

As shown in fig. 4, it is a schematic structural diagram of a plurality of electrodes in the perovskite solar cell module 20 in the above embodiment.

Specifically, as shown in fig. 4, the first common electrode 260 includes a handle 2600 and a plurality of teeth 2601, 2602, and 2603, each of which extends from the handle 2600, and the number of teeth represents the number of rows of the battery assembly in some embodiments. Referring to fig. 2e and 3e, each tooth 2601, 2602, and 2603 contacts the hole transport layer 233 (shown as the upper surface of the solid layer 23 in fig. 2e and 3 e) of each row of leftmost conductive regions 2200.

Similarly, as shown in fig. 4, the second common electrode 261 includes a shank 2610 and a plurality of teeth 2611, 2612, and 2613, each of which also extends from the shank 2610. As shown with reference to fig. 2e and 3e, each tooth 2611, 2612, and 2613 extends from the handle 2610, through the rightmost opening 251 on each row of rightmost conductive regions 2201 to contact the rightmost conductive regions 2201.

In this embodiment, the plurality of connecting electrodes 262 are "knife" shaped, also each having a shank 2620 and a tooth 2621. It will be appreciated that, as shown with reference to figures 2e and 3e, for any two adjacent conductive regions 220 in the same row on the conductive layer 212, the former is defined as the first conductive region and the latter is defined as the second conductive region. The shank 2620 of one of the connection electrodes is located on the front first conductive region and passes through the first opening on the front first conductive region to contact the front first conductive region exposed by the first opening, and the tooth 2621 of the connection electrode is located on the rear second conductive region and contacts the hole transport layer above the rear second conductive region. Further, the second conductive region where the tooth 2621 of the connection electrode is located is the first conductive region again for the next connection electrode adjacent to the same row, and so on. The connection electrodes 262 are sequentially connected in a forward and reverse alternating fashion in each row, and are connected to the first and second common electrodes 260 and 261 of the battery assembly 20 at the leftmost and rightmost sides of each row, respectively.

In some other embodiments of the present invention, a back plate is further disposed under the conductive substrate, and is encapsulated with the encapsulating material to protect the battery module.

For example, the material of the encapsulating layer 24 may be ethylene-vinyl acetate copolymer, polyolefin fiber, polyurethane, polyamide, polyester, polyolefin, surlyn resin or epoxy resin. The packaging back plate can be glass or an organic back plate, and the pressing temperature is 80-150 ℃ and the pressing time is 1-60 minutes in the packaging process of the laminating machine.

The perovskite solar cell module is characterized in that the perovskite solar cell module is provided with a plurality of openings, and the openings are matched with the patterned metal electrode layers, so that the electrodes in each line in the perovskite solar cell module are connected in series, and the electrodes in other lines connected in parallel with the electrodes in the other lines can work even if one electrode in one line fails, and the stability and the reliability of the perovskite solar cell module are effectively improved.

The invention also provides a preparation method of the perovskite solar cell module, which can change the connection mode in the solar cell module and improve the stability and reliability of the solar cell module.

Fig. 5 is a schematic flow chart of a method 50 for manufacturing a perovskite solar cell module according to an embodiment of the invention. FIG. 5 uses a flowchart to illustrate operations performed by a system according to embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in the exact order in which they are performed. Rather, various steps may be processed in reverse order or simultaneously. Meanwhile, other operations are added to or removed from these processes.

As shown in fig. 5, a method 50 of fabricating a perovskite solar cell module includes the steps of:

51: providing a conductive substrate, wherein the conductive substrate comprises a base layer and a conductive layer;

52: cutting the conductive layer to form a through separation groove, wherein the separation groove divides the conductive layer into an area array, and each row of the area array comprises a plurality of separated conductive areas;

53: forming an electron transport layer, a perovskite layer and a hole transport layer on each conductive region in sequence;

54: forming openings which sequentially penetrate through the electron transport layer, the perovskite layer and the hole transport layer on each conductive region, wherein each opening exposes each conductive region;

55: forming a first common electrode contacting the hole transport layer over the leftmost conductive region of each row, a second common electrode contacting the rightmost conductive region through the rightmost opening of each row, and a plurality of connection electrodes, each connection electrode contacting the first conductive region exposed by the first opening through the first opening in each row and contacting the hole transport layer over the second conductive region, the first region and the second region being adjacent on the conductive layer.

In an embodiment of the invention, the method for manufacturing a perovskite solar cell module further includes cleaning the conductive substrate.

Illustratively, in an embodiment of the invention, the step of cutting the conductive layer to form the through separation grooves includes physical scribing and laser etching, and the width of the separation grooves is 0.1-1 mm.

In an embodiment of the present invention, the step of forming an electrode contacting the partial conductive region and the hole transport layer in each region includes a thermal evaporation method or a screen printing method, and the thickness of the electrode is 30 to 100 nm.

In some other embodiments of the present invention, the method for manufacturing a perovskite solar cell module further includes covering the packaging material and the back sheet to package the perovskite solar cell module.

Illustratively, the step of covering the packaging material and the back sheet to package the perovskite solar cell module comprises: the encapsulation is completed by hot pressing, wherein the pressing temperature is 80 to 150 ℃ and the pressing time is 1 to 60 minutes.

It is understood that the manufacturing method 50 shown in fig. 5 may be applied to the battery assembly 20 shown in fig. 2a to 3f, although the present invention is not limited thereto. Further, the exploded schematic plan view and the perspective view of the respective layers of the battery assembly 20 in the order of fig. 2a to 2f or the order of fig. 3a to 3f can also be regarded as an effect view of each step corresponding to the manufacturing method 50. Therefore, for further details regarding the manufacturing method 50, reference may be made to the above description of the perovskite solar cell module 20 shown in fig. 2a to 3f, which is not repeated herein.

The preparation method of the perovskite component can change the connection mode inside the solar cell component, so that the stability and reliability of the solar cell component in the using process are improved.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only, and is not intended to limit the present application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

Although the present application has been described with reference to the present specific embodiments, it will be recognized by those skilled in the art that the foregoing embodiments are merely illustrative of the present application and that various changes and substitutions of equivalents may be made without departing from the spirit of the application, and therefore, it is intended that all changes and modifications to the above-described embodiments that come within the spirit of the application fall within the scope of the claims of the application.