阅读说明：本技术 能实现容量可变所需的多段升压的电子发生装置 (Electronic generator capable of realizing multi-stage boosting required by capacity variation ) 是由 李仁豪 洪英杓 朴芝英 李文求 李泰勳 朴灿永 孙憼汉 于 2019-12-11 设计创作，主要内容包括：本发明的电子发生装置的特征在于,包括：放电针模块,放电针模块具备支撑板及结合于支撑板的多个放电针；放电板模块,放电板模块与多个放电针隔开配置；放电板,放电板能滑动地结合于放电板模块内部；支撑结构物,支撑结构物具备供放电针模块及放电板模块能分离地结合的结合板；及电路模块,电路模块具备主板和多个分散处理板,主板将结合板置于之间,与结合板隔开位于放电针模块的对面,多个分散处理板连接到主板,向多个放电针个别地施加高电压、高频脉冲电源；多个分散处理板包括：将交流电源升压的高电压升压部；及连接于高电压升压部而对升压的交流进行直流变换及半波整流的直流变换部。(An electron generating apparatus according to the present invention includes: a discharge needle module having a support plate and a plurality of discharge needles coupled to the support plate; a discharge plate module disposed to be spaced apart from the plurality of discharge needles; the discharge plate can be combined in the discharge plate module in a sliding way; a support structure having a coupling plate for detachably coupling the discharge needle module and the discharge plate module; and a circuit module including a main board and a plurality of discrete processing boards, the main board having a bonding board interposed therebetween and being spaced apart from the bonding board and located opposite to the discharge needle module, the plurality of discrete processing boards being connected to the main board and individually applying a high-voltage, high-frequency pulse power to the plurality of discharge needles; the plurality of dispersion treatment plates includes: a high voltage boosting unit for boosting the AC power supply; and a DC conversion unit connected to the high-voltage boosting unit and performing DC conversion and half-wave rectification on the boosted AC.)

1. An electron generating device comprising:

a discharge needle module (150), wherein the discharge needle module (150) is provided with a support plate (151) and a plurality of discharge needles (155) that are coupled to the support plate;

a discharge plate module (160), the discharge plate module (160) being disposed spaced apart from the plurality of discharge needles;

a discharge plate (170), the discharge plate (170) being slidably coupled inside the discharge plate module (160);

a support structure (140), wherein the support structure (140) is provided with a coupling plate (145) to which the discharge needle module (150) and the discharge plate module (160) are detachably coupled; and

a circuit module (130), wherein the circuit module (130) comprises a main board (131) and a plurality of distributed processing boards (135), the main board (131) is arranged between the combination boards and is positioned opposite to the discharge needle module, the plurality of distributed processing boards (135) are connected to the main board, and high-voltage and high-frequency pulse power supplies are respectively applied to the plurality of discharge needles;

the plurality of dispersion treatment plates (135) include:

a high voltage boosting unit (1353) for boosting the AC power supply; and

and a DC conversion unit (1354) connected to the high-voltage boosting unit (1353) and configured to perform DC conversion and half-wave rectification on the boosted AC.

2. The electron generating apparatus according to claim 1,

the DC converter (1354) is composed of a plurality of diode and capacitor pairs connected in parallel and converts AC current in a plurality of stages.

3. The electron generating apparatus according to claim 1,

the discharge plate module (160) includes a bent portion (161) coupled to a lower end of the coupling plate and a discharge plate accommodating portion (163) coupled to a lower end of the bent portion.

4. The electron generating device according to claim 1,

the support structure (140) comprises a body (141), wherein the body (141) provides an inner space for accommodating the discharge needle module and the discharge plate module, the upper part of the body is open, the body comprises a bottom plate (142), a side wall part (143) formed by extending from the bottom plate, and a flange part (144) formed by extending from the upper part of the side wall part to the outer direction,

the flange portion can be pulled out of the discharge plate (170) through the flange through-hole, and the discharge plate (170) is slidably coupled to the discharge plate module (160) through the flange projection (148).

5. An electron generating device, comprising:

a main board including a plurality of connection portions arranged at intervals on an upper surface thereof;

a plurality of distributed processing boards connected to the plurality of connection portions, respectively, and having a high-voltage, high-frequency pulse conversion circuit mounted thereon; and

a joining device that functions to join the plurality of dispersion treatment plates;

the dispersion treatment plates respectively include:

an amplification unit that amplifies a DC power supply and converts the amplified DC power supply into an AC power supply;

a high voltage boosting section that boosts the alternating-current power supply converted by the amplifying section; and

a dc conversion unit connected to the high-voltage boost unit, the dc conversion unit performing dc conversion and half-wave rectification on the boosted ac;

the DC converter is composed of a plurality of diode and capacitor pairs connected in parallel, and converts AC current in a plurality of stages.

6. An electron generating device, comprising:

a discharge needle module (150), wherein the discharge needle module (150) is provided with a support plate (151) and a plurality of discharge needles (155) that are coupled to the support plate;

a discharge plate module (160), the discharge plate module (160) being disposed spaced apart from the plurality of discharge needles;

a discharge plate (170), the discharge plate (170) being slidably coupled inside the discharge plate module (160);

a support structure (140), wherein the support structure (140) is provided with a coupling plate (145) to which the discharge needle module (160) and the discharge plate module (160) are detachably coupled; and

a circuit module (130), wherein the circuit module (130) comprises a main board (131) and a plurality of distributed processing boards (135), the main board (131) is arranged between the combination boards and is positioned opposite to the discharge needle module, the plurality of distributed processing boards (135) are connected to the main board, and high-voltage and high-frequency pulse power supplies are respectively applied to the plurality of discharge needles;

the discharge plate module (160) includes a bent portion (161) coupled to a lower end of the coupling plate and a discharge plate accommodating portion (163) coupled to a lower end of the bent portion.

7. The electron generating device according to claim 6,

the support structure (140) comprises a body (141), wherein the body (141) provides an inner space for accommodating the discharge needle module and the discharge plate module, the upper part of the body is open, the body comprises a bottom plate (142), a side wall part (143) formed by extending from the bottom plate, and a flange part (144) formed by extending from the upper part of the side wall part to the outer direction,

the flange section is capable of pulling out a discharge plate (170) slidably coupled to the discharge plate module (160) through the flange through-hole in a state of being coupled to the side wall section by the flange projection (148).

8. The electron generating apparatus according to claim 6,

a plurality of through holes are formed in the discharge plate (170) so as to correspond to the plurality of discharge needles, respectively.

9. The electron generating apparatus according to claim 6,

the coupling plate is coupled to the body in a manner of covering the open upper portion of the body.

Technical Field

The present invention relates to an electron generator used for water treatment, pollutant treatment, deodorization, and the like, and more particularly, to an electron generator capable of improving operation stability and power efficiency by realizing a multi-stage voltage increase required for capacity variation.

Background

As a generally known means or structure for causing anions to be generated under atmospheric pressure conditions, a corona discharge means is representative. The corona discharge system is a structure in which a high voltage is applied to electrodes in accordance with their polarities to induce corona discharge between the electrodes.

The corona discharge generated as described above can be classified into positive corona and negative corona according to the voltage condition applied to the electrodes in terms of polarity. Among them, the positive corona system is widely used in the field of industrial equipment, although the characteristics of the positive corona system are more spatially extended than those of the negative corona system.

The systems for generating free electrons, anions, and the like are classified into a pulse power system, an ac power system, a dc power system, and the like, according to the type of power supply device that applies power to each electrode. In this case, the conventional ozone generator or the conventional anionic oxygen generator using a pulse power supply is generally configured as a needle-plate structure including a discharge needle and a ground portion. The positive electrode is in the form of a plate, the negative electrode is in the form of a needle, and when a pulse power source is applied to each electrode, corona discharge is generated, and at this time, ozone or anionic oxygen is generated. However, the conventional power generating device includes a plurality of discharge needles, and the structure for applying power to each of the plurality of discharge needles is complicated, and there is a problem that workability is lowered when replacing components.

Further, the conventional electron generating devices have a limit in practical use due to durability problems, and also have a limit in decreasing efficiency in terms of power consumption.

(patent document 1) Korean patent laid-open publication No. 10-0529749 "high-voltage and high-frequency pulse type electronic generator for treating pollutants" (11/22/2005)

(patent document 2) Korean patent laid-open publication No. 10-1042141 "electronic generator for high-frequency pulse deodorizing" (2011, 16/06/10)

Disclosure of Invention

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide an electron generator which is excellent in workability by facilitating management of contamination occurring during a discharge process by a discharge plate slidably coupled to a discharge plate module constituting an electron generating unit and improving maintenance management by a simple power supply connection structure.

Further, the present invention aims to provide an electronic generator that can realize multi-stage boosting required for capacity variation, and improve the stability of operation and power efficiency.

The present invention for achieving the above object is an electron generating device including: a discharge needle module 150, the discharge needle module 150 including a support plate 151 and a plurality of discharge needles 155 coupled to the support plate; a discharge plate module 160, the discharge plate module 160 being disposed to be spaced apart from the plurality of discharge needles; a discharge plate 170, the discharge plate 170 being slidably coupled inside the discharge plate module 160; a support structure 140, wherein the support structure 140 includes a coupling plate 145 for detachably coupling the discharge needle module 160 and the discharge plate module 160; and a circuit module 130, the circuit module 130 including a main board 131 and a plurality of distributed processing boards 135, the main board 131 placing the bonding board therebetween and being located opposite to the discharge needle module with a space therebetween, the plurality of distributed processing boards 135 being connected to the main board and applying a high-voltage, high-frequency pulse power to the plurality of discharge needles individually; the plurality of dispersion treatment plates 135 includes: a high voltage boosting unit 1353 for boosting the ac power; and a dc conversion unit 1354 connected to the high-voltage boosting unit 1353 and performing dc conversion and half-wave rectification on the boosted ac.

The electronic generator according to the present invention as described above can easily manage contamination generated during a discharge process by slidably coupling the discharge plates to the discharge plate module constituting the electronic generator, and can improve maintenance management by a simple power supply connection structure, thereby providing an electronic generator having excellent workability.

In addition, multi-stage boosting required for capacity variation is enabled, improving the stability of operation and power efficiency.

Drawings

Fig. 1 shows a side view of an electron generating device according to an embodiment of the present invention.

Fig. 2 shows a front view of the electron generating device of fig. 1.

Fig. 3 is a view enlarging a portion "a" of fig. 2.

Fig. 4 is a view enlarging a portion "B" of fig. 2.

Fig. 5 is a diagram showing a circuit configuration of a circuit module according to an embodiment of the present invention.

Fig. 6 is a diagram illustrating an operation flow of the circuit block shown in fig. 5.

Fig. 7 is a diagram illustrating a circuit configuration of a circuit module of another embodiment of the present invention.

Detailed Description

Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various forms different from each other, and the embodiments are provided only for making the disclosure of the present invention more complete, and to inform the scope of the invention to a person of ordinary skill in the art completely. In the drawings, like numbering refers to like elements.

The electron generating device of the present invention will be described with reference to fig. 1 to 4.

Fig. 1 and 2 are side and front views of an electron generator according to an embodiment of the present invention, showing the inside thereof.

The electron generating device 100 includes a housing 110 and an electron generating unit 120 housed inside the housing 110. Inside the case 110, a control part controlling the electron generating part 120 and a power supply part supplying power may be located at an upper portion of the electron generating part 120 and received together.

The electron generator 120 includes a circuit module 130, a support structure 140 disposed below the circuit module 130, a discharge needle module 150 electrically connected to the circuit module 130, a discharge plate module 160 disposed below the discharge needle module 150 in a spaced-apart manner, and a plurality of electromagnetic field generators disposed in a state of being accommodated in the support structure 140.

The circuit module 130 includes a main board 131, a plurality of distributed processing boards 135 connected to the main board 131, and a coupling device 138 that functions to couple the plurality of distributed processing boards 135.

The main plate 131 has a substantially flat plate shape and includes a plurality of connection portions to which the plurality of dispersion treatment plates 135 are connected. The plurality of connecting portions are arranged on the main board 131 so as to be spaced apart from each other in the lateral direction and the longitudinal direction. The dispersion processing board 135 is located above the main board 131.

The plurality of distributed processing boards 135 are provided with independent high-voltage and high-frequency pulse conversion circuits so that individual high-voltage and high-frequency pulse power supplies can be applied to the respective high-voltage and high-frequency pulse conversion circuits. The plurality of distributed processing boards 135 are respectively connected to the connection portions provided on the main board 131 on the upper surface of the main board 131.

The main board 131 and the plurality of discrete processing boards 135 connected to the main board 131 form the integrated circuit module 130 while maintaining a state of being strongly bonded by the bonding device 138.

The circuit module 130 and the support structure 140 can be separately combined.

An embodiment of the circuit module 130 and a control flow based on the embodiment will be described in detail later with reference to fig. 5 and 6.

The support structure 140 includes a body 141 and a coupling plate 145, and the coupling plate 145 is detachably coupled to an open upper end of the body 141.

The main body 141 includes a bottom plate 142, a side wall 143 extending from the bottom plate 142, and a flange 144 extending from an upper side of the side wall 143 in an outward direction.

A plurality of electromagnetic field generators are mounted on the bottom plate 142 and the sidewall 143 in the inner space of the main body 141. In the inner space of the body 141, electrons are moved from the upper portion to the lower portion by means of a plurality of electromagnetic field generators. The coupling plate 145 is separably coupled by means of a coupling means such as a screw in a manner of covering the opened upper portion of the body 141.

The circuit module 130, the discharge needle module 150, and the discharge plate module 160 are separably coupled to the coupling plate 145. The circuit module 130 places the bonding plate 145 therebetween, is located outside the support structure 140, and the discharge needle module 150 and the discharge plate module 160 are located in the inner space of the body 141.

The coupling plate 145 is made of an electrical insulator material, and a plurality of connection protrusions 146 formed to correspond to the dispersion processing plate 135 one by one may be attached to the coupling plate 145. The connection projection 146 is formed to project from the coupling plate 145 toward the corresponding dispersion processing plate 135, and is made of a conductive material.

On the other hand, the coupling projection 158 functions to detachably couple the coupling plate 145 and the discharge needle module 150. That is, the coupling projection 146 and the coupling projection 158 are formed to be exposed in the vertical direction with respect to the coupling plate 145.

The discharge needle module 150 is electrically coupled to the corresponding dispersion processing plate 135 through the connection protrusion 146 and the coupling protrusion 158.

The coupling plate 145 is formed by a pair of coupling plates in staggered layers along the upper and lower portions. Specifically, the bonding board 145 includes: an upper coupling plate 145a, the upper coupling plate 145a being connected to the circuit module 130 through a connection protrusion 146; and a lower coupling plate 145b, the lower coupling plate 145b being coupled to the support plate 151 of the discharge needle module 150 by coupling protrusions 158. The lower coupling plate 145b has a structure to cover the open upper portion of the body 141 in a state of being connected to the upper end of the support plate 151 of the discharge needle module 150. On the other hand, the upper bonding plate is formed to have a staggered shape while maintaining a smaller width than the lower bonding plate. Specifically, the upper bonding plate 145a may be in the form of a PCB bonding plate, and the lower bonding plate 145b may be in the form of an STS discharge portion rectangular box.

The coupling plate 145 is formed by stacking a pair of coupling plates, and thus has an advantage of being easily replaced while maintaining a light weight state, as compared with a case of using a single coupling plate. In addition, the configuration in which the plurality of coupling plates are formed of different materials and stacked can reduce the generation of an induced current that may be generated at the side end of the coupling plate 145.

The flange portion 144 is combined on an upper area of the side wall portion 143 in a structure communicating with the inner space of the body 141. That is, in the basic structure constituting the rectangular plate, the flange through hole 147 having a predetermined width is formed in the longitudinal direction. A flange protrusion 148 is formed along the discharge plate module 160 side along the inner edge of the flange through-hole. That is, the flange portion 144 is coupled to the side wall portion 143 via the flange projection, and the discharge plate 170 slidably coupled to the discharge plate module 160 can be drawn out via the flange through hole 147.

The present invention makes it possible to periodically manage dust that can be collected on the discharge plate module 160 through the discharge plate 170. That is, the foreign particles trapped in the region of the discharge plate module 160 are accumulated during the discharge process, and eventually the discharge plate function cannot be performed, and the entire repair apparatus is required, so that the discharge plate 170 can be pulled out through the lower end portion side of the discharge plate module 160, thereby being easily replaced and cleaned.

The discharge needle module 150 includes a support plate 151 and a plurality of discharge needles 155 coupled to the support plate 151.

The support plate 151 is substantially flat plate-shaped, and the coupling plate 145 is interposed therebetween and located opposite the main plate 131 with a predetermined distance from the coupling plate 145. The support plate 151 is made of an electrically insulating material. A plurality of discharge needles 155 are coupled to the support plate 151.

The discharge needles 155 protrude from the support plate 151 to the opposite side of the coupling plate 145 in a state of penetrating the support plate 151 from the upper portion to the lower portion. The discharge needles 155 are made of a conductive material, and as an example, a case where screws are coupled to the supporting plate 151 will be described. In the screw as the discharge needle 155, a screw cap is located on the coupling plate 145 side, and a long body is protruded to the opposite side.

Adjacent ones of the plurality of discharge needles 155 form a discharge needle group electrically connected. In the present embodiment, the case where one discharge needle group includes four discharge needles 155 is described, but the present invention is not limited thereto. The four discharge needles 155 forming the discharge needle group are electrically connected to each other by means of a conductive member (not shown in the drawing). The conductive member has a structure to be connected to a connection protrusion extended at the lower end of the coupling plate 145 in a state where the upper end of the support plate 151 keeps the four discharge needles 155 connected to each other.

One discharge pin group is connected to a high voltage from a corresponding one of the distributed processing boards 135. The four discharge needles 155 forming one discharge needle group are electrically connected.

The discharge plate module 160 has a substantially flat plate shape and is made of a conductive material. The discharge plate module 160 is disposed in the internal space of the body 141 of the support structure 140 so as to be spaced apart from the plurality of discharge needles 155 by a predetermined distance.

The discharge plate module 160 has a bent portion 161 coupled to a lower end of the coupling plate 145 and a discharge plate accommodating portion 163 coupled to a lower end of the bent portion. The discharge plate accommodating part 163 has a height corresponding to the flange protrusion 148 constituting the flange part 144, and one side of the discharge plate accommodating part facing the flange protrusion is opened, and the other side of the discharge plate accommodating part has a closed state so as to correspond to an entrance restriction place of the entered discharge plate.

The discharge plate module 160 is detachably coupled to the coupling plate 145 together with the discharge needle module 150 by means of a coupling device. Corona discharge occurs between the discharge needles 155 and the discharge plate module 160, and ionized electrons and radicals are discharged from the discharge needles 155, which are negative electrodes, to the discharge plate module 160, which is positive electrodes.

The discharge plate 170 is provided with a plurality of through holes located at the shortest distance one by one in correspondence with the plurality of discharge needles 155. In the initial stage of discharge, when foreign substances such as dust discharged from the discharge needles 155 are accumulated on the discharge plate 170, the through-holes keep the discharge at the shortest distance, thereby improving the discharge efficiency.

The plurality of electromagnetic field generators are attached to the bottom plate 142 and the side wall 143 of the main body 141, respectively, and move electrons and radicals emitted from the discharge needles 155 to the bottom plate 142 side. The plurality of electromagnetic field generators may be each composed of an iron core made of a galvanized steel sheet and a coil wound around the iron core, and may be any one capable of generating an electromagnetic field.

Fig. 5 is a diagram illustrating a circuit configuration diagram of a circuit module according to an embodiment of the present invention, and fig. 6 is a diagram illustrating an operation flow of the circuit module shown in fig. 5, which shows an example of a circuit embodiment of a distributed processing board included in the circuit module.

Each of the distributed processing boards 135 may include a conversion unit 1351, an amplification unit 1352, a high-voltage boost unit 1353, and a dc conversion unit 1354.

Since the ac power supplied from the power supply unit is supplied to the conversion units 1351 and 61, the conversion unit 1351 converts the supplied ac power into the dc power 62.

The amplifier 1352 amplifies the dc power converted by the converter 1351 and converts the amplified dc power back to the ac power 63.

The high voltage boosting unit 1353 boosts 64 the ac power supply amplified and converted into the ac power supply by the amplifying unit 1352. Therefore, a potential is formed at the plurality of discharge needles 155, and as the potential increases, supersaturation of electrons can be induced. The surface of the high-voltage boosting portion 1353 may have a shielding structure, and the surface of the high-voltage boosting portion 1353 may be molded with an insulating plastic resin material, for example, to form a shielding structure. This is to cope with the voltage reversal to the high voltage boosting unit 1353 due to the closed loop of the positive line described later.

The dc converter 1354 is connected to the high-voltage booster 1353, and performs dc conversion and half-wave rectification 65 on the boosted ac current. The dc converter 1354 is configured by connecting a plurality of diode and capacitor pairs in parallel to convert ac current in a plurality of stages. Therefore, the boosting can be performed in multiple stages, and as a result, the capacity can be freely changed, and the power efficiency can be optimized.

In addition, the capacitor realizes both double voltage amplification and half-wave rectification, and the negative electrode lines connected to the capacitor are connected to the discharge needles 1355 and 66. Thus, the current amplified by the double voltage in the capacitor is applied to the discharge needles 1355 and 67.

On the other hand, a large potential difference is formed between the negative electrode line and the discharge needles 1355 due to the closed loop of the positive electrode line, and a current can be concentrated in the discharge needles 1355 through the negative electrode line to induce an oversaturated state of electrons.

Fig. 7 is a diagram showing a circuit configuration of a circuit module according to another embodiment of the present invention, in which a portion indicated by a red broken line on the left side represents a pulse generator and a circuit portion for performing ac voltage amplification and conversion, and a portion indicated by a blue broken line on the right side represents a circuit portion for performing multi-stage boosting.

Each stage of the circuit part for performing multi-stage boosting is configured by using 2 diodes and 2 capacitors, and configured to output a half-wave rectified dc power supply.

The above description is merely an exemplary description of the technical idea of the present invention, and various modifications and variations can be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to be limiting but to illustrate the technical idea of the present invention, and the scope of the technical idea of the present invention is not limited by such embodiments. The scope of the present invention should be construed in accordance with the following claims, and all technical ideas within the scope of equivalents thereof should be construed to be included in the scope of the claims.