阅读说明：本技术 一种多重兆声聚焦喷淋清洗装置及其使用方法 (Multi-megasonic focusing spraying cleaning device and using method thereof ) 是由 殷振 张鹏 张坤 刘子豪 曹自洋 田勇博 黄彦瑛 黄志蕾 戴晨伟 苗情 于 2021-08-19 设计创作，主要内容包括：本发明公开了一种多重兆声聚焦喷淋清洗装置,包括机床部件、多重兆声聚焦喷淋清洗部件、喷淋清洗液泵入装置、电气控制装置；机床部件包括底座、工件固定平台、二维运动平台、粗调机构、微调机构；多重兆声聚焦喷淋清洗部件包括夹持连接装置、兆声聚焦陶瓷晶片、晶片被衬、兆声耦合液、喷淋清洗液泵入口；喷淋清洗液泵入装置包括喷淋清洗液槽、清洗液泵和清洗液管路；本发明采用多组兆声聚焦陶瓷晶片,对喷淋清洗液进行多重兆声聚焦喷淋从而实现对工件的清洗,可以有效清洗晶原等零部件上的微纳米颗粒,提高清洗效率和清洗质量。(The invention discloses a multi-megasonic focusing spraying cleaning device, which comprises a machine tool part, a multi-megasonic focusing spraying cleaning part, a spraying cleaning liquid pumping device and an electric control device, wherein the machine tool part is connected with the machine tool part through a pipeline; the machine tool component comprises a base, a workpiece fixing platform, a two-dimensional motion platform, a coarse adjustment mechanism and a fine adjustment mechanism; the multi-megasonic focusing spray cleaning component comprises a clamping connecting device, a megasonic focusing ceramic wafer, a wafer lining, megasonic coupling liquid and a spray cleaning liquid pump inlet; the spraying cleaning liquid pumping device comprises a spraying cleaning liquid groove, a cleaning liquid pump and a cleaning liquid pipeline; the invention adopts a plurality of groups of megasonic focusing ceramic wafers to carry out multiple megasonic focusing spraying on the sprayed cleaning solution so as to clean the workpiece, can effectively clean micro-nano particles on parts such as crystal sources and the like, and improves the cleaning efficiency and the cleaning quality.)

1. A multi-megasonic focusing spraying cleaning device is characterized by comprising a machine tool part, a multi-megasonic focusing spraying cleaning part, a spraying cleaning liquid pumping device and an electric control device;

the machine tool component comprises a base, a two-dimensional motion platform, a workpiece fixing platform, a coarse adjustment mechanism and a fine adjustment mechanism;

the base is arranged at the lowest part of the multi-megasonic focusing spraying cleaning device, the two-dimensional motion platform is arranged above the base, the workpiece fixing platform is arranged above the two-dimensional motion platform, the workpiece is arranged above the workpiece fixing platform, and the two-dimensional motion platform can drive the workpiece fixing platform and the workpiece to perform planar two-dimensional motion; the coarse adjustment mechanism is arranged on one side of the base, the lower end of the coarse adjustment mechanism is connected with the base, the upper end of the coarse adjustment mechanism is connected with the fine adjustment mechanism, and the fine adjustment mechanism is connected with the multi-megasonic focusing spraying cleaning component; the coarse adjustment mechanism can drive the fine adjustment mechanism and the multi-megasonic focusing spraying cleaning component to move up and down at a large distance, and the fine adjustment mechanism can drive the multi-megasonic focusing spraying cleaning component to move up and down at a small distance;

the multi-megasonic focusing spray cleaning component comprises a megasonic focusing ceramic wafer, a wafer lining, megasonic coupling liquid, a sealing taper sleeve, a clamping connecting device, a spray cleaning liquid pump inlet and a megasonic controller;

three or more groups of megasonic focusing ceramic wafers are arranged in the multi-megasonic focusing spray cleaning component, all the megasonic focusing ceramic wafers are arranged concentrically and coaxially with the rotary axis, megasonic coupling liquid is fully filled between every two groups of megasonic focusing ceramic wafers, the distance between every two groups of megasonic focusing ceramic wafers is integral multiple of megasonic vibration wavelength of the megasonic focusing ceramic wafers, namely a = n₁λ，b=n₂λ，c=n₃λ, where λ is the wavelength at which the megasonic focusing ceramic wafer vibrates, n₁、n₂、n₃Is a positive integer; a wafer lining is arranged on the back surface of the outmost megasonic focusing ceramic wafer; all megasonic focusing ceramic wafers and megasonic coupling liquid are arranged in a sealing taper sleeve, and the sealing taper sleeve is provided with a spraying cleaning liquid pump inlet; one end of the clamping and connecting device is connected with the sealing taper sleeve, and the other end of the clamping and connecting device is connected with the fine adjustment mechanism; the megasonic focusing ceramic wafers are all connected with a megasonic controller;

the spray cleaning liquid pumping device comprises a spray cleaning liquid groove, a cleaning liquid pump and a cleaning liquid pipeline, wherein the cleaning liquid pump can pump the spray cleaning liquid in the spray cleaning liquid groove into a spray cleaning liquid pump inlet on the sealing taper sleeve.

2. The multi-megasonic focused spray cleaning device as claimed in claim 1, wherein the two-dimensional motion stage of the machine tool component is a linear motor driven type of motion stage or a ball screw driven type of motion stage.

3. The multi-megasonic focused spray cleaning apparatus as claimed in claim 1, wherein the drive motor of the machine tool component is a stepper motor or a servo motor; the vertical fine adjustment motor of the machine tool component is a stepping motor or a servo motor.

4. The multiple megasonic focused spray cleaning apparatus of claim 1 wherein the megasonic focused ceramic wafer has an operating frequency of 0.8MHz to 5.0 MHz.

5. The multi-megasonic focused spray cleaning apparatus of claim 1, wherein the method of use comprises the steps of:

turning on a main power switch of an electric control device, starting a numerical control system of a machine tool component, operating the machine tool component, and returning a multi-megasonic focusing spray cleaning component to the original point of a mechanical coordinate of the machine tool component;

step two, clamping the workpiece: a workpiece needing spray cleaning is placed on a workpiece fixing platform, and the workpiece fixing platform is an angle-adjustable device and can adjust six degrees of freedom of the workpiece;

step three, compiling a workpiece two-dimensional plane motion spraying cleaning program in the numerical control system and storing the program;

fourthly, carrying out height zero setting on the multi-megasonic focusing spraying cleaning part: starting a driving motor of a fine adjustment mechanism to drive a multi-megasonic focusing and spraying cleaning component to move up and down, stopping the driving motor when the focus of the multi-megasonic focusing and spraying cleaning component is close to a workpiece, starting a vertical fine adjustment motor to finely adjust the focus of the multi-megasonic focusing and spraying cleaning component until the surface of the workpiece is close to the focus of the multi-megasonic focusing and spraying cleaning component, and finishing the height zero adjustment of the multi-megasonic focusing and spraying cleaning component;

opening a spraying cleaning liquid pumping device, enabling the spraying cleaning liquid to enter the multi-megasonic focusing spraying cleaning part from a spraying cleaning liquid tank through a cleaning liquid pump, a cleaning liquid pipeline and a spraying cleaning liquid pump inlet, filling the interior of the multi-megasonic focusing spraying cleaning part, and then enabling the spraying cleaning liquid to flow out from a nozzle at the lower end of the multi-megasonic focusing spraying cleaning part;

opening the megasonic controller, and starting the megasonic focusing ceramic wafer in the multi-megasonic focusing spray cleaning part to work;

step seven, executing a hole machining program: in the processing process, the workpiece is kept still, the multi-megasonic focusing spraying cleaning component is kept to move in a vertical state, the surface of the workpiece is always kept near the focus of the multi-megasonic focusing spraying cleaning component, and the multi-megasonic focusing spraying cleaning component correspondingly moves according to the programmed and stored hole processing program; after the program execution is finished, the workpiece spraying and cleaning are finished;

step eight, the megasonic controller is closed, and the megasonic focusing ceramic wafer in the multi-megasonic focusing spraying cleaning component stops working; closing the spraying cleaning liquid pumping device, and stopping spraying the cleaning liquid; and returning the multi-megasonic focusing spray cleaning component to the origin of coordinates of the machine tool.

Technical Field

The invention relates to the technical field of spray cleaning, in particular to a multi-megasonic focusing spray cleaning device and a using method thereof.

Background

In order to reduce the influence of impurities on the yield of chips, not only the single cleaning efficiency needs to be improved in the actual production, but also cleaning needs to be frequently performed before and after almost all processes, and the cleaning step accounts for about 33% of the whole step. The commonly used megasonic cleaning megasonic transducer comprises a flat plate type, an arc plate type and the like, and can be directly arranged at the bottom of the tank body, the working frequency is between 800kHz and 1MHz, and the power is between 100W and 600W. In order to improve the cleaning capability of the megasonic transducer, the invention adopts a multi-megasonic focusing spraying cleaning structure, which can effectively improve the propagation direction and energy density of megasonic energy and make the cleaning effect more obvious.

Disclosure of Invention

The invention provides a novel multi-megasonic focusing spraying cleaning device, aiming at overcoming the problems of the existing megasonic cleaning and improving the cleaning efficiency and the cleaning quality.

The purpose of the invention is realized by the following technical scheme:

the multi-megasonic focusing spraying cleaning device is characterized by comprising a machine tool part, a multi-megasonic focusing spraying cleaning part, a spraying cleaning liquid pumping device and an electric control device.

The machine tool component comprises a base, a two-dimensional motion platform, a workpiece fixing platform, a coarse adjustment mechanism and a fine adjustment mechanism.

The base is arranged at the lowest part of the multi-megasonic focusing spraying cleaning device, the two-dimensional motion platform is arranged above the base, the workpiece fixing platform is arranged above the two-dimensional motion platform, the workpiece is arranged above the workpiece fixing platform, and the two-dimensional motion platform can drive the workpiece fixing platform and the workpiece to perform planar two-dimensional motion; the coarse adjustment mechanism is arranged on one side of the base, the lower end of the coarse adjustment mechanism is connected with the base, the upper end of the coarse adjustment mechanism is connected with the fine adjustment mechanism, and the fine adjustment mechanism is connected with the multi-megasonic focusing spraying cleaning component; the coarse adjustment mechanism can drive the fine adjustment mechanism and the multi-megasonic focusing spraying cleaning component to move up and down at a large distance, and the fine adjustment mechanism can drive the multi-megasonic focusing spraying cleaning component to move up and down at a small distance.

The multi-megasonic focusing spray cleaning component comprises a megasonic focusing ceramic wafer, a wafer lining, megasonic coupling liquid, a sealing taper sleeve, a clamping connecting device, a spray cleaning liquid pump inlet and a megasonic controller.

Three or more groups of megasonic focusing ceramic wafers are arranged in the multi-megasonic focusing spray cleaning component, all the megasonic focusing ceramic wafers are arranged concentrically and coaxially with the rotary axis, megasonic coupling liquid is fully filled between every two groups of megasonic focusing ceramic wafers, the distance between every two groups of megasonic focusing ceramic wafers is integral multiple of megasonic vibration wavelength of the megasonic focusing ceramic wafers, namely a = n₁λ，b=n₂λ，c=n₃λ, where λ is the wavelength at which the megasonic focusing ceramic wafer vibrates, n₁、n₂、n₃Is a positive integer; a wafer lining is arranged on the back surface of the outmost megasonic focusing ceramic wafer; all megasonic focusing ceramic wafers and megasonic coupling liquid are arranged in a sealing taper sleeve, and the sealing taper sleeve is provided with a spraying cleaning liquid pump inlet; one end of the clamping and connecting device is connected with the sealing taper sleeve, and the other end of the clamping and connecting device is connected with the fine adjustment mechanism; the megasonic focusing ceramic wafers are all connected with a megasonic controller.

The spray cleaning liquid pumping device comprises a spray cleaning liquid groove, a cleaning liquid pump and a cleaning liquid pipeline, wherein the cleaning liquid pump can pump the spray cleaning liquid in the spray cleaning liquid groove into a spray cleaning liquid pump inlet on the sealing taper sleeve.

The electric control device is used for controlling the two-dimensional plane motion of a two-dimensional motion platform in a machine tool component, the up-and-down displacement of the coarse adjustment mechanism and the fine adjustment mechanism, the start and stop of the spraying cleaning liquid pumping device and the vibration start and stop of the megasonic focusing ceramic wafer.

The two-dimensional motion platform in the machine tool component is a linear motor drive type work moving platform or a ball screw drive type work moving platform.

The driving motor in the machine tool component is a stepping motor or a servo motor; the vertical fine adjustment motor of the machine tool component is a stepping motor or a servo motor.

The working frequency of the megasonic focusing ceramic wafer is 0.8MHz-5.0 MHz.

The electric control device is used for controlling the two-dimensional plane motion of a two-dimensional motion platform in a machine tool component, the up-and-down displacement of the coarse adjustment mechanism and the fine adjustment mechanism, the start and stop of the spraying cleaning liquid pumping device and the vibration start and stop of the megasonic focusing ceramic wafer.

The use method of the multi-megasonic focusing spraying cleaning device comprises the following steps:

turning on a main power switch of an electric control device, starting a numerical control system of a machine tool component, operating the machine tool component, and returning a multi-megasonic focusing spray cleaning component to the original point of a mechanical coordinate of the machine tool component;

step two, clamping the workpiece: a workpiece needing spray cleaning is placed on a workpiece fixing platform, and the workpiece fixing platform is an angle-adjustable device and can adjust six degrees of freedom of the workpiece;

step three, compiling a workpiece two-dimensional plane motion spraying cleaning program in the numerical control system and storing the program;

fourthly, carrying out height zero setting on the multi-megasonic focusing spraying cleaning part: starting a driving motor of a fine adjustment mechanism to drive a multi-megasonic focusing and spraying cleaning component to move up and down, stopping the driving motor when the focus of the multi-megasonic focusing and spraying cleaning component is close to a workpiece, starting a vertical fine adjustment motor to finely adjust the focus of the multi-megasonic focusing and spraying cleaning component until the surface of the workpiece is close to the focus of the multi-megasonic focusing and spraying cleaning component, controlling the precision error of the workpiece to be within 0.5mm, and finishing the height zero adjustment of the multi-megasonic focusing and spraying cleaning component;

opening a spraying cleaning liquid pumping device, enabling the spraying cleaning liquid to enter the multi-megasonic focusing spraying cleaning part from a spraying cleaning liquid tank through a cleaning liquid pump, a cleaning liquid pipeline and a spraying cleaning liquid pump inlet, filling the interior of the multi-megasonic focusing spraying cleaning part, and then enabling the spraying cleaning liquid to flow out from a nozzle at the lower end of the multi-megasonic focusing spraying cleaning part;

step six, the megasonic controller is opened, and the megasonic focusing ceramic wafer in the multi-megasonic focusing spraying cleaning component starts to work;

step seven, executing a hole machining program: in the processing process, the workpiece is kept still, the multi-megasonic focusing spraying cleaning component is kept to move in a vertical state, the surface of the workpiece is always kept near the focus of the multi-megasonic focusing spraying cleaning component, the multi-megasonic focusing spraying cleaning component correspondingly moves according to the programmed and stored hole processing program, and the horizontal moving speed of the multi-megasonic focusing spraying cleaning component is adjustable within 0.01-500 mm/min; after the program execution is finished, the workpiece spraying and cleaning are finished;

step eight, the megasonic controller is closed, and the megasonic focusing ceramic wafer in the multi-megasonic focusing spraying cleaning component stops working; closing the spraying cleaning liquid pumping device, and stopping spraying the cleaning liquid; and returning the multi-megasonic focusing spray cleaning component to the origin of coordinates of the machine tool.

The invention discloses a multi-megasonic focusing spraying cleaning device, which adopts a plurality of groups of megasonic focusing ceramic wafers to perform multi-megasonic focusing spraying cleaning on a workpiece, improves the propagation direction and energy density of megasonic energy, can effectively clean micro-nano particles on parts such as crystal sources and the like, and effectively improves the cleaning efficiency and the cleaning quality; and the cleaning is carried out by adopting a spraying mode, so that the problem that the cleaning solution causes secondary pollution to the cleaned parts when the parts are cleaned in the water tank is avoided.

Drawings

FIG. 1 is a schematic view of a multiple megasonic focused spray cleaning apparatus of the present invention;

FIG. 2 is a schematic view of a multi-megasonic focused spray cleaning assembly of the present invention;

FIG. 3 is a schematic view of the spray cleaning solution pumping apparatus of the present invention;

in the figure, 1-a multi-megasonic focusing spray cleaning part, 2-a spray cleaning liquid pumping device, 3-a fine adjustment mechanism, 4-a coarse adjustment mechanism, 5-a workpiece, 6-a workpiece fixing platform, 7-a two-dimensional movement platform and 8-a base;

101-multiple megasonic focusing spray cleaning part focus, 102-sealing taper sleeve, 103-megasonic focusing ceramic wafer, 104-megasonic focusing ceramic wafer, 105-clamping connecting device, 106-megasonic focusing ceramic wafer, 107-megasonic coupling liquid, 108-wafer lining, 109-spray cleaning liquid pump inlet, 110-nozzle, 111-megasonic controller;

201-spraying cleaning liquid groove, 202-cleaning liquid pump, 203-cleaning liquid pipeline, and 204-cleaning liquid.

Detailed Description

The invention is further illustrated by the following examples in conjunction with the accompanying drawings:

a multi-megasonic focusing spray cleaning device comprises a machine tool part, a multi-megasonic focusing spray cleaning part 1, a spray cleaning liquid pumping device 2 and an electric control device.

The machine tool component comprises a base 8, a two-dimensional motion platform 7, a workpiece fixing platform 6, a coarse adjustment mechanism 4 and a fine adjustment mechanism 3.

The base 8 is arranged at the lowest part of the multi-megasonic focusing spraying cleaning device, the two-dimensional motion platform 7 is arranged above the base 8, the working stroke of the two-dimensional motion platform 7 is 400mm multiplied by 400mm, the workpiece fixing platform 6 is arranged above the two-dimensional motion platform 7, the area of the workpiece fixing platform 6 is 420mm multiplied by 420mm, the workpiece 5 is arranged above the workpiece fixing platform 6, and the two-dimensional motion platform 7 can drive the workpiece fixing platform 6 and the workpiece 5 to perform planar two-dimensional motion; the coarse adjustment mechanism 4 is arranged on one side of the base 8, the stroke of the coarse adjustment mechanism 4 is 300mm, the lower end of the coarse adjustment mechanism is connected with the base 8, the upper end of the coarse adjustment mechanism is connected with the fine adjustment mechanism 3, the fine adjustment mechanism 3 is connected with the multi-megasonic focusing spraying cleaning component 1, and the stroke of the fine adjustment mechanism 3 is 50 mm.

The multi-megasonic focusing spray cleaning component 1 comprises megasonic focusing ceramic wafers (103, 104, 106), a wafer lining 108, megasonic coupling liquid 107, a sealing taper sleeve 102, a clamping connecting device 105 and a spray cleaning liquid pump inlet 109.

The multi-megasonic focusing spray cleaning component 1 is provided with three groups of megasonic focusing ceramic wafers (103, 104 and 106), the radius of the lowermost megasonic focusing ceramic wafer 103 is 50.24mm, the radius of the middle megasonic focusing ceramic wafer 104 is 75.36mm, the radius of the uppermost megasonic focusing ceramic wafer 106 is 100.48mm, the opening angles of the three groups of megasonic focusing ceramic wafers (103, 104 and 106) are 83 degrees, the interval between two adjacent three groups of the three groups of megasonic focusing ceramic wafers (103, 104 and 106) is 25.12mm, all the megasonic focusing ceramic wafers are arranged concentrically and coaxially with a rotation axis, megasonic coupling liquid 107 is fully filled between every two groups of the wafers, the back side of the uppermost megasonic focusing ceramic wafer 106 is provided with a wafer lining 108, the wafer lining 108 is made of silica gel, and the thickness of the wafer lining 108 is 3 mm; all megasonic focusing ceramic wafers (103, 104 and 106) and megasonic coupling liquid 107 are arranged in a sealing taper sleeve 102, and a spraying cleaning liquid pump inlet 109 is arranged on the sealing taper sleeve 102; one end of the clamping and connecting device 105 is connected with the sealing taper sleeve 102, and the other end is connected with the fine adjustment mechanism 3; all megasonic focusing ceramic wafers (103, 104, 106) are connected to megasonic ultrasound.

The spray cleaning liquid pumping device 2 comprises a spray cleaning liquid tank 201, a cleaning liquid pump 202 and a cleaning liquid pipeline 203, wherein the spray cleaning liquid tank 201 is 400mm multiplied by 500mm, the cleaning liquid pump 202 can pump the cleaning liquid in the spray cleaning liquid tank 201 into a spray cleaning liquid pump inlet 109 on the sealed taper sleeve 102, and the maximum power of the cleaning liquid pump 202 is 0.25 kw.

The two-dimensional motion platform 7 in the machine tool part is a working moving platform in the form of a linear motor drive.

The driving motor in the machine tool component is a servo motor; the vertical fine adjustment motor of the machine tool component is a servo motor.

The working frequency of the megasonic focusing ceramic wafer is 2.0 MHz.

The multi-megasonic focusing spraying cleaning device comprises the following steps:

step one, turning on a main power switch of an electric control device, starting a numerical control system of a machine tool component, operating the machine tool component, and returning the multi-megasonic focusing spray cleaning component 1 to the original point of mechanical coordinates of the machine tool component;

step two, clamping the wafer workpiece 5: the wafer diameter is 150mm, the wafer workpiece 5 needing spray cleaning is placed in the middle of the workpiece fixing platform 6, the workpiece fixing platform 6 is an angle adjustable device, six degrees of freedom of the wafer workpiece 5 can be adjusted, and the level of the workpiece 5 is adjusted through the adjusting device;

step three, programming and storing a two-dimensional plane motion spraying cleaning program of the workpiece 5 in the numerical control system;

fourthly, carrying out height zero setting on the multi-megasonic focusing spraying cleaning component 1: firstly, starting a driving motor of a fine adjustment mechanism 3, stopping the driving motor when a focus 1 of a multi-megasonic focusing and spraying cleaning component approaches a wafer workpiece 5, starting a vertical fine adjustment motor to finely adjust the focus 1 of the multi-megasonic focusing and spraying cleaning component until the surface of the wafer workpiece 5 is near the focus 1 of the multi-megasonic focusing and spraying cleaning component, controlling the precision error within 0.5mm, and finishing the height zero adjustment of the multi-megasonic focusing and spraying cleaning component 1;

step five, a spraying cleaning liquid pumping device 2 is opened, and spraying cleaning liquid 204 enters the multiple megasonic focusing spraying cleaning part 1 from a spraying cleaning liquid tank 201 through a cleaning liquid pump 202, a cleaning liquid pipeline 203 and a spraying cleaning liquid pump inlet 109, fills the interior of the multiple megasonic focusing spraying cleaning part 1, and then flows out through a nozzle 110 at the lower end of the multiple megasonic focusing spraying cleaning part 1;

step six, the megasonic controller 111 is opened, and the megasonic focusing ceramic wafers (103, 104 and 106) in the multi-megasonic focusing spray cleaning component 1 start to work;

step seven, executing a hole machining program: in the processing process, the workpiece 5 is kept still, the multi-megasonic focusing spraying cleaning component 1 is kept to move in a vertical state, the surface of the wafer workpiece 5 is always kept near the focus 1 of the multi-megasonic focusing spraying cleaning component, the multi-megasonic focusing spraying cleaning component 1 correspondingly moves according to the programmed and stored hole processing program, and the horizontal moving speed of the multi-megasonic focusing spraying cleaning component 1 is 50 mm/min; after the program execution is finished, the spraying and cleaning of the workpiece 5 are finished;

step eight, the megasonic controller 111 is closed, and the megasonic focusing ceramic wafers (103, 104 and 106) in the multi-megasonic focusing spray cleaning component 1 stop working; the spraying cleaning liquid pumping device 2 is closed, and the spraying cleaning liquid 204 stops spraying; the multi-megasonic focusing spray cleaning component 1 returns to the origin of coordinates of the machine tool.

According to the invention, multiple groups of megasonic focusing ceramic wafers (103, 104 and 106) are adopted to perform multiple megasonic focusing spraying cleaning on the workpiece 5, so that micro-nano particles on parts such as wafers can be effectively cleaned, the cleaning efficiency and the cleaning quality are effectively improved, compared with common cleaning tank type ultrasonic cleaning, the efficiency of cleaning micro-nano particles with the diameter of less than 10 micrometers can be improved by 2 times, and the cleaning is performed by adopting a spraying mode, so that the secondary pollution of the cleaning liquid 204 in a water tank to the cleaned parts is avoided, and the cleaning quality is improved.

The above are preferred embodiments of the present invention, and all changes made according to the technical scheme of the present invention that produce functional effects do not exceed the scope of the technical scheme of the present invention belong to the protection scope of the present invention.