Heater and stage

文档序号:590521 发布日期:2021-05-25 浏览:20次 中文

阅读说明:本技术 加热器和载物台 (Heater and stage ) 是由 花待年彦 巽新 关谷健二 相川尚哉 高梨雅也 于 2019-10-01 设计创作,主要内容包括:一种加热器具有:折叠的加热器线;第一绝缘体,其设置于加热器线;金属护套,其被设置成与第一绝缘体的至少一部分接触;第一绝缘部件,其被配置为与从金属护套的第一端部取出的加热器线的一方的至少一部分平行;第二绝缘部件,其被配置为与所述第一绝缘部件的至少一部分平行,并与从金属护套的第一端部取出的加热器线的另一方的至少一部分平行;第三绝缘部件,其被配置为与第一绝缘部件以及第二绝缘部件的至少一部分平行,且被设置为束缚第一绝缘部件以及第二绝缘部件;以及,圆筒部件,其被配置为与金属护套以及第三绝缘部件的至少一部分平行。(A heater has: a folded heater wire; a first insulator disposed on the heater line; a metal sheath disposed in contact with at least a portion of the first insulator; a first insulating member disposed in parallel with at least a part of one of the heater wires taken out from the first end of the metal sheath; a second insulating member arranged in parallel with at least a part of the first insulating member and at least a part of the other of the heater wires taken out from the first end of the metal sheath; a third insulating member arranged in parallel with at least a part of the first insulating member and the second insulating member and configured to bind the first insulating member and the second insulating member; and a cylindrical member arranged in parallel with at least a part of the metal sheath and the third insulating member.)

1. A heater is provided with:

a folded heater wire;

a first insulator disposed on the heater line;

a metal sheath disposed in contact with at least a portion of the first insulator;

a first insulating member arranged in parallel with at least a part of one of the heater wires taken out from a first end of the metal sheath;

a second insulating member arranged in parallel with at least a part of the first insulating member and with at least a part of the other of the heater wires taken out from the first end of the metal sheath;

a third insulating member configured to be parallel to at least a portion of the first insulating member and the second insulating member and arranged to bind the first insulating member and the second insulating member; and

a cylindrical member arranged in parallel with at least a portion of the metal sheath and the third insulating member.

2. The heater of claim 1,

the cylindrical member has a predetermined thickness and is formed of a single cylindrical member.

3. The heater of claim 1,

the inner diameter of the cylindrical member is substantially the same as the outer diameter of the metal sheath.

4. The heater of claim 1,

the first insulating member, the second insulating member, and the third insulating member protrude in a direction opposite to a direction in which the metal sheath is provided with respect to the cylindrical member.

5. The heater of claim 1,

a part of the metal sheath is cylindrical,

the insulating tube is disposed between the first insulator and the third insulating member in the cylindrical axial direction of the metal sheath, and has a first through hole and a second through hole.

6. The heater of claim 4,

one end of the heater wire and the other end of the heater wire protrude further than the first, second, and third insulating members in a direction in which the first, second, and third insulating members protrude.

7. The heater of claim 6, further comprising a pair of lead wires connected to one end of the heater wire and the other end of the heater wire.

8. The heater of claim 5,

one end of the heater wire is inserted into the first through hole, and the other end of the heater wire is inserted into the second through hole.

9. The heater of claim 5, wherein

The first through hole, the second through hole, and at least a part of one of the heater wires and at least a part of the other of the heater wires are arranged in parallel.

10. The heater of claim 5, wherein the first insulating member, the second insulating member, and the third insulating member are each in contact with the insulating tube.

11. The heater of claim 1,

the heater wire is in the shape of a strip.

12. The heater of claim 1,

the heater wire has a spiral structure.

13. The heater of claim 1,

the heater wire has a double helix structure.

14. The heater of claim 1,

the metal sheath contains aluminum.

15. The heater of claim 1,

the outer diameter of the metal sheath is 3.0mm to 6.0 mm.

16. The heater of claim 1,

the cylindrical member contains aluminum.

17. The heater of claim 1,

the cylindrical member has an outer diameter of 4.0mm to 10.0 mm.

Technical Field

Embodiments of the present invention relate to a heater and a stage including the heater.

Background

Semiconductor devices are mounted on almost all electronic devices, and play an important role in the functions of the electronic devices. A semiconductor device is a device utilizing semiconductor characteristics of silicon or the like. A semiconductor device is configured by stacking a semiconductor film, an insulating film, and a conductive film on a substrate and patterning these films. These films are stacked by an evaporation method, a sputtering method, a Chemical Vapor Deposition (CVD) method, a chemical reaction of a substrate, or the like, and patterned by a photolithography process. The photoetching process comprises the following steps: forming a resist film on the film for patterning; exposing the resist film; forming a resist mask by development; removing a portion of the film by etching; and removing the resist mask.

The characteristics of the above-described film largely depend on the conditions for forming the film or the conditions for patterning. One of the conditions is the temperature of the substrate. In most cases, the temperature of the substrate is controlled by adjusting the temperature of a stage (hereinafter referred to as stage) on which the substrate is placed. One of the heaters for heating the stage is a sheath heater in order to heat the substrate and suppress the temperature distribution in the substrate to be uniform. For example, patent document 1 discloses a stage including a plurality of sheath heaters, in which heating wires (heater wires) are disposed in a metal sheath.

(Prior art document)

(patent document)

Patent document 1: japanese laid-open patent publication No. 2009-91660

Disclosure of Invention

(problems to be solved by the invention)

In order to improve the uniformity of the temperature distribution in the substrate, a stage having a heater at a high density is required. Further, in order to provide the heater on the stage at a high density, there is a problem in that the diameter of the heater becomes smaller. Further, there is a problem in that the reliability of the heater with a reduced diameter is improved so as to prevent the heater from being damaged due to the reduction of the diameter of the heater, and the heat generating wire in the heater from being broken.

Accordingly, an object of an embodiment of the present invention is to provide a sheath heater having improved reliability and a reduced diameter. In addition, a stage having a heater for precisely controlling the temperature of a substrate is provided.

(measures taken to solve the problems)

One embodiment of the present invention is a heater including: a folded heater wire; a first insulator disposed on the heater line; a metal sheath disposed in contact with at least a portion of the first insulator; a first insulating member disposed in parallel with at least a part of one of the heater wires taken out from the first end of the metal sheath; a second insulating member arranged in parallel with at least a part of the first insulating member and at least a part of the other of the heater wires taken out from the first end of the metal sheath; a third insulating member arranged in parallel with at least a part of the first insulating member and the second insulating member and configured to bind the first insulating member and the second insulating member; and a cylindrical member arranged in parallel with at least a part of the metal sheath and the third insulating member.

In another embodiment, the cylindrical member may have a prescribed thickness and be composed of one cylindrical member.

In another embodiment, the inner diameter of the cylindrical member may be substantially the same as the outer diameter of the metal sheath.

In another embodiment, the first insulating member, the second insulating member, and the third insulating member may protrude in a direction opposite to a direction in which the metal sheath is provided with respect to the cylindrical member.

In another embodiment, a part of the metal sheath may be cylindrical, and the metal sheath may include an insulating tube having a first through hole and a second through hole, the insulating tube being disposed between the first insulator and the third insulating member along the cylindrical axial direction of the metal sheath.

In another embodiment, one end of the heater wire and the other end of the heater wire may protrude further than the first insulating member, the second insulating member, and the third insulating member in a direction in which the first insulating member, the second insulating member, and the third insulating member protrude.

In another embodiment, the heater may further include a pair of lead wires connected to one end of the heater wire and the other end of the heater wire.

In another embodiment, one of the heater wires may be inserted into the first through hole and the other of the heater wires may be inserted into the second through hole.

In another embodiment, at least a part of one of the first through hole, the second through hole, and the heater line and at least a part of the other of the heater lines may be arranged in parallel.

In another embodiment, the first insulating member, the second insulating member, and the third insulating member may each be in contact with an insulating tube.

In another embodiment, the heater wire may be in the form of a ribbon.

In another embodiment, the heater wire may have a spiral structure.

In another embodiment, the heater wire may have a double helix structure.

In another embodiment, the metal sheath may contain aluminum.

In another embodiment, the outer diameter of the metal sheath may be 3.0mm or more and 6.0mm or less.

In another embodiment, the cylindrical member may contain aluminum.

In another embodiment, the outer diameter of the cylindrical member may be 4.0mm or more and 10.0mm or less.

Drawings

Fig. 1A is a sectional view showing a structure of a heater which is one of the embodiments of the present invention.

Fig. 1B is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 1C is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 1D is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 2A is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 2B is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 2C is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 3A is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 3B is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 3C is a sectional view showing a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 4 is a flowchart illustrating a method of manufacturing a heater according to one embodiment of the present invention.

Fig. 5A is a perspective view and a plan view showing a structure of a stage according to one embodiment of the present invention.

Fig. 5B is a perspective view and a plan view showing the structure of the stage according to one embodiment of the present invention.

Fig. 6A is a sectional view showing the structure of a stage according to one embodiment of the present invention.

Fig. 6B is a sectional view showing the structure of the stage according to one embodiment of the present invention.

Fig. 7A is a sectional view showing the structure of a stage according to one embodiment of the present invention.

Fig. 7B is a sectional view showing the structure of the stage according to one embodiment of the present invention.

Fig. 8 is a plan view showing the structure of a stage according to one embodiment of the present invention.

Fig. 9A is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 9B is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 10A is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 10B is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 11A is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 11B is a sectional view showing the structure of a heater which is one of the embodiments of the present invention.

Fig. 12 is a schematic cross-sectional view of a film processing apparatus including a stage according to an embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view of a film deposition apparatus including a stage according to an embodiment of the present invention.

Fig. 14 is a schematic cross-sectional view of a film deposition apparatus including a stage according to an embodiment of the present invention.

Fig. 15 is a schematic cross-sectional view of a film deposition apparatus including a stage according to an embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the invention disclosed in the present application will be described with reference to the drawings. However, the present invention can be carried out in various forms without departing from the spirit thereof, and should not be construed as being limited to the description of the embodiments shown below.

In order to make the description more clear, the drawings are intended to schematically show the width, thickness, shape, etc. of each component, as compared with the actual form, but the drawings are only an example and do not limit the explanation of the present invention. Further, in the present specification and the respective drawings, there are the following cases: elements having the same functions as those described in the existing drawings are given the same reference numerals, and redundant description is omitted. For convenience of description, the terms "upper" and "lower" are used to describe the directions of the heater unit (when the substrate is mounted).

In the present specification and the drawings, the same reference numerals are used when a plurality of the same or similar structures are collectively shown, and a lower case letter is attached to each of the plurality of structures to indicate them distinctively. In the case of separately indicating a plurality of portions in one structure, the same reference numerals are used, and hyphens and natural numbers are further used.

1. First embodiment

In the present embodiment, a sheath heater 110 according to one embodiment of the present invention will be described.

1-1. Structure of sheath heater

A cross-sectional view of the sheath heater 110 is shown in fig. 1. Fig. 1A is a sectional view showing the structure of the sheath heater 110. Fig. 1B is a sectional view showing the structure along the chain lines B1 and B2. Fig. 1C is a sectional view showing the structure along the chain lines C1 and C2. Fig. 1D is a sectional view showing the structure along the chain lines D1 and D2.

The sheath heater 110 has a function of generating heat by energization. The sheath heater 110 is provided to heat the second support plate 104 (see fig. 5A) and the first support plate 102 (see fig. 5A) of the stage 100 (see fig. 5A). This enables the substrate placed on the stage 100 to be heated.

As shown in fig. 1A, the sheath heater 110 includes a metal sheath 115, a heater wire 118, a first insulator 116, a second insulator 136, a first insulating member 122, a connecting member 126, a cylindrical member 124, a second insulating member 128, a third insulating member 138, a third insulator 132, a fourth insulator 134, a pair of lead wires 112, and a pair of terminals 114. Fig. 1A shows a sheath heater 110 of a so-called single-terminal type. In this specification and the like, the configuration of the sheath heater 110 according to one embodiment of the present invention is described by taking the sheath heater 110 of one-terminal type as an example, but the same configuration as the sheath heater 110 according to one embodiment of the present invention may be applied to a sheath heater of two-terminal type. In the plan view of fig. 1A, the right side is referred to as an upper portion, and the left side is referred to as a lower portion.

The metal sheath 115 has a cylindrical shape with a first end (closed end) closed and a second end (open end) open. In this specification and the like, an example in which the shape of the distal end of the metal sheath 115 is a semicircular shape is shown, but the present invention is not limited to this example. For example, the shape of the distal end of the metal sheath 115 may be a planar shape or a conical shape. The shape may be any shape that can heat the second support plate 104 (see fig. 5A) and the first support plate 102 (see fig. 5A) described later by heat generation of the sheath heater 110.

The heater wire 118 is arranged to be folded inside the metal sheath 115, to reciprocate in the cylindrical axial direction of the metal sheath 115, and both ends thereof are taken out from the second end (open end) of the metal sheath 115. That is, one heater wire 118 is arranged so as to form two shafts (two cores) in most of the metal sheath 115 in the cylindrical axial direction, and one of the two shafts and one of the terminals, and the other of the two shafts and the other terminal are taken out from the second end (open end) of the metal sheath 115. One of the two axes and the other of the two axes of one heater line 118 are arranged substantially parallel or parallel to the cylindrical axis direction of the metal sheath 115. At least a part of one of the two axes of one heater line 118 and at least a part of the other of the two axes may be arranged substantially parallel or parallel to the cylindrical axis direction of the metal sheath 115. Further, the heater wire 118 is disposed with a gap inside the metal sheath 115. In addition, the heater line 118 includes a heat generating line and a non-heat generating line.

The heater wire 118 and the metal sheath 115 are insulated with the first insulator 116 provided in the gap. That is, the heater wire 118 is surrounded by the first insulator 116, and the first insulator 116 is surrounded by the metal sheath 115. In addition, the first insulator 116 is provided to fill the inside of the metal sheath 115 between the second end (open end) and the first end (closed end) of the metal sheath 115 up to the vicinity of the second end (open end). The first insulator 116 may be provided to contact at least a part of the metal sheath 115, may be provided to contact at least a part of the heater wire 118, may be provided to insulate the heater wire 118 from the metal sheath 115 without contacting the metal sheath 115, or may be provided to insulate the heater wire 118 from the metal sheath 115 without contacting the heater wire 118. That is, the first insulator 116 may be provided so as to insulate the heater wire 118 and the metal sheath 115.

A second insulator 136 is provided on the upper portion of the first insulator 116. The second insulator 136 is disposed in contact with an upper portion of the first insulator 116 and at least a portion of the inside of the metal sheath 115. With the second insulator 136, the first insulator 116 can be sealed within the metal sheath 115, and the heater wire 118 can be secured within the metal sheath 115. The second insulator 136 may also be referred to as a sealant or adhesive, etc.

The first insulating member 122 is provided on the upper portion of the second insulator 136. The first insulating member 122 is disposed in contact with an upper portion of the second insulator 136 and at least a portion of the inside of the metal sheath 115. The first insulating member 122 has at least a first through hole and a second through hole. One of the two ends of the heater wire 118 taken out from the second end (open end) of the metal sheath 115 is inserted into the first through hole, and the other end is inserted into the second through hole. Therefore, the both ends of the heater wire 118 are inserted into the first insulating member 122 from the side where the second insulator 136 is disposed, and are removed from the side where the second insulator 136 is not disposed. Here, at least a part of the first through hole and at least a part of the second through hole may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115. At least a part of the heater wire 118 inserted into the first through hole and the second through hole may be arranged substantially parallel or parallel to the cylindrical axis of the metal sheath 115. Still further, it may be also provided that at least a portion of the first through hole and at least a portion of the second through hole are substantially parallel or parallel to at least a portion of the heater wire 118 inserted into the first through hole and the second through hole. The first insulating member 122 may also be referred to as a protection tube, an insulating tube, or the like.

The cylindrical member 124 is disposed such that a part thereof is in contact with the metal sheath 115. The cylindrical member 124 is connected to the metal sheath 115 by a connecting member 126. The cylindrical member 124 may be formed of a single member having a predetermined thickness without including a step-like step or a step-like structure. Cylindrical member 124 is formed of a single member having a predetermined thickness without including a step-like step or a step-like structure, and thus the inner diameter of cylindrical member 124 and the outer diameter of metal sheath 115 can be made substantially the same, and the outer diameter of cylindrical member 124 and the outer diameter of metal sheath 115 can also be made substantially the same. Therefore, the diameter of the sheath heater 110 of one of the embodiments of the present invention can be thinned. Barrel member 124 may also be referred to as an adapter.

In the upper portion of the first insulating member 122, two second insulating members 128 are disposed in contact with the first insulating member 122. The second insulating member 128 has a through hole. One of the two ends of the heater wire 118 taken out of the first through hole of the first insulating member 122 is inserted into the first second insulating member 128, and the other end is inserted into the second through hole. Thus, the two second insulating members 128 are inserted from the side where the first insulating member 122 is disposed, and are taken out from the side where the first insulating member 122 is not disposed. Here, the two second insulating members 128 may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115, or a part of the two second insulating members 128 may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115. The heater wire 118 inserted into the two second insulating members 128 may be also provided substantially parallel to the cylindrical axis of the metal sheath 115, or a part of the heater wire 118 may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115. The outer diameter of the second insulating member 128 is preferably smaller than the outer diameter of the first insulating member 122, and is preferably the same as the diameter of the first through hole and the diameter of the second through hole of the first insulating member 122. Further, the length of the second insulating member 128 is longer than the length of a third insulating member 138 described later. The length of the second insulating member 128 is a length protruding from the end of the cylindrical member 124 where the connecting member 126 is not provided.

In an upper portion of the first insulating member 122, a third insulating member 138 is provided in contact with the first insulating member 122. The third insulating member 138 has a through hole. The two second insulating members 128 are inserted into the third insulating member 138. Therefore, the third insulating member 138 is inserted into the two second insulating members 128 from the side where the first insulating member 122 is disposed, and is removed from the side where the first insulating member 122 is not disposed. That is, the third insulating member 138 is provided so as to surround at least a part of the two second insulating members 128. In other words, the third insulating member 138 is provided to bind at least a part of the two second insulating members 128. Thereby, the heater wire 118 is doubly surrounded by the second insulating member and the third insulating member 138. Here, the third insulating member 138 may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115, or at least a part of the third insulating member 138 may be provided substantially parallel or parallel to the cylindrical axis of the metal sheath 115. In addition, the outer diameter of the third insulating member 138 is preferably smaller than the outer diameter of the first insulating member 122. The third insulating member 138 has a length that protrudes from the end of the cylindrical member 124 where the connecting member 126 is not provided. In the present specification and the drawings, an example in which the second insulating member 128 does not contact the third insulating member 138 is shown, but the present invention is not limited to this example. At least a part of the outer side (outer wall) of the second insulating member 128 may be in contact with at least a part of the inner side (inner wall) of the third insulating member 138. In addition, although the third insulating member 138 is shown as an insulating member in this specification and the like, the third insulating member 138 may have conductivity. The third insulating member 138 may be configured to bind at least a part of the two second insulating members 128.

A third insulator 132 is provided inside the cylindrical member 124. The third insulator 132 is provided in contact with a part of the metal sheath 115, a part of the first insulating member 122, a part of the inner wall of the cylindrical member 124, and a third insulating member 138. The third insulating member 138 is fixed in contact with the first insulating member 122 by the third insulator 132. The third insulator 132 is provided to fill the cylindrical member 124 up to the vicinity of the end of the cylindrical member 124 where the connection member 126 is not provided. The third insulator 132 may also be referred to as a sealant, an adhesive, or the like.

A fourth insulator 134 is provided on the upper portion of the third insulator 132. The fourth insulator 134 is provided in contact with a part of the metal sheath 115, a part of the third insulator 132, a part of the inner wall of the cylindrical member 124, and the third insulating member 138. The fourth insulator 134 may also be referred to as a sealant, an adhesive, or the like. The fourth insulator 134 prevents moisture such as moisture, solvent, and the like from entering the inside of the sheath heater 110. In addition, in the case where the sheath heater 110 is used in an environment where moisture resistance is not required, the fourth insulator 134 may not be provided. By not providing the fourth insulator 134, the manufacturing process of the sheathed heater 110 can be simplified.

The second insulating member and the third insulating member are provided to protrude from the fourth insulator 134. Further, both ends of the heater wire 118 are provided to further protrude from the second insulating member and the third insulating member.

A pair of lead wires 112 are connected to both ends of the heater wire 118. A pair of terminals 114 are connected to the lead wires 112. The pair of terminals 114 may be connected to both ends of the heater wire 118 without the lead wire 112.

As shown in fig. 1B, 1C, and 1D, the outer diameter of the heater wire 118 is D1, the inner diameter and the outer diameter of the metal sheath 115 are D2 and D3, respectively, the thickness of the metal sheath 115 is D4, the outer diameter of the cylindrical member 124 is D5, the diameters of the first through hole 123a and the second through hole 123B are D6, the outer diameters of the second insulating member 128a and the second insulating member 128B are D7, the outer diameter of the third insulating member 138 is D8, the distance between the heater wire 118 is g1, and the distance between the outer wall of the heater wire 118 and the metal sheath 115 is g 2. The outer diameter of the first insulating member 122 is also d2, and the inner diameter of the cylindrical member 124 is also d 3. Fig. 1B, 1C, and 1D are cross-sectional views showing cross sections orthogonal to the cylindrical axis. The outer diameter d1 of the heater wire 118 may be selected from the range of 0.1mm or more and 2.0mm or less. The inner diameter d2 of the metal sheath 115 can be selected from the range of 3.0mm or more and 4.0mm or less, and the outer diameter d3 of the metal sheath 115 can be selected from the range of 3.0mm or more and 6.0mm or less, respectively. The thickness d4 of the metal sheath 115 can be selected from the range of 0.5mm or more and 1.0mm or less. The distance g1 between the metal sheath 115 and each heater wire 118 disposed in the metal sheath 115 may be selected from the range of 0.3mm or more and 1.0mm or less, or the range of 0.4mm or more and 1.0mm or less. The distance g2 between the portion of the heater wire 118 that is folded back from one end and the portion that is folded back from the other end may be selected from the range of 0.3mm or more and 2.0mm or less, or from 0.4mm or more and 1.0mm or less. The outer diameter d5 of the cylindrical member 124 can be selected from the range of 4.0mm or more and 10.0mm or less. The outer diameter d7 of the second insulating member 128a and the second insulating member 128b may be selected from the range of 1.0mm or more and 4.5mm or less. The outer diameter d8 of the third insulating member 138 may be selected from the range of 2.0mm or more and 9.0mm or less.

The heater wire 118 may be made of an electrical conductor that generates joule heat when energized. Specifically, a metal selected from tungsten, tantalum, molybdenum, platinum, nickel, chromium, and cobalt, or an alloy containing these metals may be used. Examples of the alloy include an alloy of nickel and chromium, and an alloy containing nickel, chromium, and cobalt.

A first insulator 116 may be provided to prevent the heater wire 118 from contacting the metal sheath 115 and shorting out. The material for the first insulator 116 may be selected from insulating materials having a thermal conductivity of 10W/mK or more and 200W/mK. By using such a material, the heat energy generated by the heater wire 118 can be efficiently transferred to the metal sheath 115. The first insulator 116 may be, for example, magnesium oxide, aluminum oxide, boron nitride, or aluminum nitride.

The metal sheath 115 contains a metal selected from metals having a thermal conductivity of 200W/mK or more and 430W/mK or less. By selecting such a metal, the thermal energy generated by the heater wire 118 can be efficiently transferred to the first and second support plates 102 and 104. The metal preferably has a thickness of 5X 10-625X 10,/K or more-6Thermal expansion coefficient of not more than K. This can suppress deformation due to thermal expansion, and can provide the sheath heater 110 with high reliability. Specifically, a metal such as aluminum, titanium, or stainless steel, or an alloy thereof can be used for the metal sheath 115.

For the second insulator 136, a ceramic-based sealant can be used, for example. As the ceramic-based sealing agent, a material containing magnesium oxide, aluminum nitride, silicon oxide, silicon carbide, or the like can be used.

The first insulating member 122 may be formed of a material containing alumina, zirconia, magnesia, aluminum nitride, silica, or the like.

The connecting member 126 may be formed using brazing. Examples of the material used for the connecting member 126 include an alloy containing silver, copper and zinc, an alloy containing copper and zinc, copper containing a trace amount of phosphorus, aluminum and its alloy, an alloy containing titanium, copper and nickel, an alloy containing titanium, zirconium and copper, an alloy containing titanium, zirconium, copper and nickel, and the like.

The cylindrical member 124 may be made of the same material and have the same characteristics as those of the metal sheath 115.

The second insulating member 128 and the third insulating member 138 may use an insulating tube formed of, for example, vinyl chloride, silicon rubber, fluorine-based polymer, polyimide, fabric of glass fiber or ceramic fiber, or the like.

For example, a ceramic adhesive, an epoxy adhesive, or a glass adhesive can be used as the third insulator 132. The same material as the second insulating insulator 136 may be used for the ceramic-based adhesive.

The fourth insulator 134 may use, for example, a fluorine-based adhesive.

The shape of the cross section perpendicular to the cylindrical axis of the sheath heater 110 is not limited, and the sheath heater 110 having various structures can be used. For example, the shape may be a circular shape as shown in fig. 1B or a polygonal shape as shown in fig. 10B and 11B described later, or may be an elliptical shape although not shown. In the case where the cross-sectional shape is a circular shape, the force required for deformation is not dependent on the direction of bending, and therefore the sheath heater 110 can be easily bent in any direction. Therefore, the sheath heater 110 can be easily disposed in a groove formed in the first support plate 102, the second support plate 104, or the like, which will be described later.

The conventional sheath heater has, for example, the following structure: in the pair of heater wires taken out from the open end of the metal sheath, an insulating member such as an insulating tube is attached to maintain a certain distance between one heater wire and the other heater wire, and further, lead wires are connected to the one heater wire and the other heater wire, respectively, and the pair of lead wires are bound by the insulating member such as the insulating tube. At least a part of such a structure is called a fastening portion. In addition, the conventional sheath heater has a structure in which the above-described structure is inserted into, for example, a two-step stepped tubular member, and the two-step stepped tubular member and the metal sheath are connected by brazing. Therefore, the conventional sheath heater has a large diameter due to at least the fastening portion and the stepped cylindrical member.

On the other hand, the sheath heater according to the embodiment of the present invention does not include the fastening portion and the stepped tubular member of the conventional sheath heater. As described above, in the sheath heater 110 according to the embodiment of the present invention, the pair of heater wires 118 taken out from the open end of the metal sheath 115 is surrounded by the second insulating member 128 having a smaller outer diameter than the metal sheath 115 and the third insulating member 138 having a smaller outer diameter than the metal sheath 115, and further surrounded by the cylindrical member 124 having the same outer diameter as the metal sheath 115. Thereby, the sheath heater 110 can be formed thin. In addition, insulation between the metal sheath 115 and the heater wire 118 can be ensured, and short circuit of the heater wire 118 can be prevented. Further, the sheath heaters 110 can be arranged at high density on the stage 100 described later. Therefore, the temperature distribution on the substrate can be made uniform, and the temperature distribution on the substrate can be further reduced.

1-2. manufacture of sheathed heaters

Fig. 2 and 3 are sectional views illustrating a method of manufacturing the sheath heater 110. Fig. 4 is a flowchart illustrating a method of manufacturing the sheath heater 110. Here, the production of the sheath heater will be described with reference to fig. 1A and 2 to 4. In the plan views of fig. 1A, 2, and 3, the right side is referred to as an upper portion, and the left side is referred to as a lower portion.

As shown in fig. 2A and step 31(S31) in fig. 4, when the manufacture of the sheath heater 110 is started, the second insulator 136 is injected into the metal sheath 115 surrounding the first insulator 116 and the heater wire 118. In the present embodiment, a ceramic-based sealant is used for the second insulator 136. Here, the heater wire 118 is folded inside the metal sheath 115, and both ends thereof are taken out from one end of the metal sheath 115. The length of the pair of heater wires 118 taken out from one end of the metal sheath 115 is sufficiently longer than the length of the metal sheath 115.

Then, as shown in fig. 2B and step 33(S33) in fig. 4, both ends of the heater wire 118 taken out from one end of the metal sheath 115 are inserted into the first insulating member 122. Specifically, one of the two ends of the heater wire 118 is inserted into the first through hole 123a included in the first insulating member 122, and the other of the two ends of the heater wire 118 is inserted into the second through hole 123b included in the first insulating member 112. In the present embodiment, a ceramic insulating tube having two through holes is used as the first insulating member 122. At this time, the length d9 of the first insulating member 122 protruding from the metal sheath 115 may also be measured. Whether the heater wire 118 is inserted into the first insulating member 122 and whether the first insulating member 122 is properly disposed at the metal sheath 115 can be confirmed by measuring the length d 9.

Then, as shown in fig. 2C and step 35(S35) in fig. 4, metal sheath 115 is inserted into cylindrical member 124, and metal sheath 115 and cylindrical member 124 are connected by connecting member 126. In the present embodiment, the metal sheath 115 and the cylindrical member 124 are connected by silver brazing using a silver brazing material made of silver as the connecting member 126. In the present embodiment, the cylindrical member 124 is made of a material containing aluminum, and a member having an outer diameter d5 of about 6.5mm, an inner diameter d3 of about 4.5mm, and a thickness of about 1.0mm is used for the cylindrical member 124.

Then, as shown in step 37(S37) in fig. 3A and 4, both ends of the heater wire 118 are inserted into the third insulating member 138 into which the two second insulating members 128 are inserted. Specifically, one of the two ends of the heater wire 118 is inserted into the second insulating member 128a inserted into the third insulating member 138, and the other of the two ends of the heater wire 118 is inserted into the second insulating member 128b inserted into the third insulating member 138 b. In the present embodiment, an insulating tube formed of polyimide is used for the second insulating member 128 and the third insulating member 138. In addition, the second insulating member 128 uses an insulating tube having an outer diameter d7 of about 2mm, and the third insulating member 138 uses an insulating tube having an outer diameter d8 of about 4 mm.

Then, as shown in fig. 3B and step 39(S39) in fig. 4, the third insulator 132 is injected into the cylindrical member 124. In the present embodiment, a ceramic-based adhesive is used for the third insulator 132.

Then, as shown in fig. 3C and step 41(S41) in fig. 4, the fourth insulator 134 is injected into the cylindrical member 124. In this embodiment, a fluorine-based adhesive is used for the fourth insulator 134. The fourth insulator 134 is disposed to cover the third insulator 132 and to surround the second insulating member 128.

Further, as shown in step 43(S43) in fig. 1A and 4, a pair of lead wires 112 are connected to both ends of the heater wire 118. Finally, as shown in step 45(S45) in fig. 1A and 4, the pair of terminals 114 is connected to the pair of leads 112.

As described above, the sheath heater 110 is manufactured. Further, the manufacturing method of the sheath heater 110 described using fig. 1A, 2 to 4 is only an example, and is not limited to this example. The method of manufacturing the sheath heater 110 may be appropriately selected without departing from the structure of the sheath heater 110 according to one embodiment of the present invention.

By making the sheath heater 110 in the above manner, the sheath heater 110 can be formed thin.

2. Second embodiment

In this embodiment, a stage 100 according to one embodiment of the present invention will be described. Descriptions of the same or similar structures as those of the first embodiment may be omitted.

Fig. 5A and 5B show a perspective view and a top view, respectively, of the stage 100. Fig. 6A and 6B show sectional views along the chain lines a1 and a2 in fig. 5B. As shown in fig. 5A-6B, stage 100 has a first support plate 102, a second support plate 104, a shaft 108, and at least one sheath heater 110. Fig. 5A to 6B show an example in which two sheath heaters, a first sheath heater 110a and a second sheath heater 110B, are provided. In consideration of the legibility of the drawing, the illustration of the first support plate 102 is omitted in fig. 5A, and the illustration of the sheath heater 110 is omitted in fig. 6B.

The first support plate 102 is configured to have a flat upper surface, and a semiconductor substrate including silicon or a compound semiconductor, an insulating substrate including an insulator such as quartz or glass, or the like is disposed thereon. The first support plate contains a metal selected from metals having a thermal conductivity of 200W/mK or more and 430W/mK or less. By using a metal having a high thermal conductivity, the thermal energy generated by the sheath heater 110 can be efficiently received. In addition, the metal preferably has a value of 5X 10-625X 10,/K or more-6Thermal expansion coefficient of not more than K. Specific metals satisfying such characteristics include metals such as titanium, aluminum, and stainless steel. Although not shown, the first support plate 102 may be provided with an electrostatic chuck for fixing a substrate, a through hole for supplying a gas having high thermal conductivity such as helium gas between the substrate and the stage 100, or a circulation path for circulating a liquid medium.

The second support plate 104 is disposed below the first support plate 102. The second support plate 104 also contains a metal that can be used for the first support plate 102. The metal contained in the second support plate 104 and the metal contained in the first support plate 102 may be the same or different. In different cases, the respective metals may be selected such that the difference between the thermal expansion rates of the metals contained in the first support plate 102 and the second support plate 104 is 10 × 10-6below/K. This can suppress deformation due to thermal expansion, and can provide the stage 100 with high reliability.

In addition, the upper face 104-3 of the second support plate 104 is engaged with the first support plate 102. The joining of the first support plate 102 and the second support plate 104 may be performed by welding, screwing, or brazing. Examples of the brazing filler metal used for brazing include alloys containing silver, copper and zinc, alloys containing copper and zinc, copper containing a trace amount of phosphorus, aluminum and alloys thereof, alloys containing titanium, copper and nickel, alloys containing titanium, zirconium and copper, and alloys containing titanium, zirconium, copper and nickel.

The stage 100 may further include a third support plate (not shown). A third support plate as an arbitrary structure may be disposed under the second support plate 104. The third support plate comprises the same structure as the first support plate 102 or the second support plate 104. The third support plate may also engage the lower face 104-4 of the second support plate 104. The joining of the third support plate and the second support plate 104 may also be performed by welding, screw fixation, brazing, or the like, as in the joining of the first support plate 102 and the second support plate 104.

The shaft 108 is provided to support the first support plate 102 and the second support plate 104. The lead wire 112 for supplying power to the heater wire 118 of the sheath heater 110 described later is hollow. When the electrostatic chuck is provided, a wiring for supplying power to the electrostatic chuck is also arranged in the shaft 108. Although illustration is omitted in view of the legibility of the drawing, the shaft 108 may be connected to the rotating mechanism. By connecting the shaft 108 to the rotation mechanism, the stage 100 can be rotated about the long axis of the shaft 108. The shaft 108 may be joined to the second support plate 104 by welding, screwing, brazing, or the like. In addition, in the case of using a third support plate, the shaft 108 engages with the third support plate, also supporting the third support plate.

The sheath heater 110 may be applied to the structure described in the first embodiment. The sheath heater 110 has a function of generating heat by energization. The sheath heater 110 is provided to heat the second support plate 104 and the first support plate 102. Thereby, the substrate placed on the stage 100 is heated.

A groove (first groove 120) is provided on the upper surface 104-3 of the second support plate 104 (fig. 6B), and the first sheath heater 110a and the second sheath heater 110B are disposed in the first groove 120 (fig. 6A). In the example shown in fig. 6A, 6B, the first support plate 102 has a flat lower surface, and no groove is provided on the lower surface. Accordingly, the depth of the first groove 120 is the same or substantially the same as the outer diameter of the sheath heater 110. Specifically, the depth of the first groove 120 may be greater than 100% and less than 150%, greater than 100% and less than 120%, or greater than 100% and less than 110% of the outer diameter of the sheath heater 110. To reduce the in-plane temperature distribution of the first support plate 102, the first grooves 120 are formed to exist at a uniform density in the upper face 104-3.

The first end T1 of the first sheath heater 110a is located in a region 109 where the first support plate 102 and the second support plate 104 overlap the shaft 108 (a region shown by a circle with a dotted line in fig. 5B). The first sheath heater 110a bent at the first end T1 extends into the shaft 108 through the through hole 130 (fig. 6B) formed in the second support plate 104, and is connected to a heater power supply (not shown) via the lead wire 112 and the terminal 114.

Like the first end T1 of the first sheath heater 110a, the first end T2 of the second sheath heater 110B is also located in the region 109 (region shown by the dotted circle in fig. 5B) where the first support plate 102 and the second support plate 104 overlap the shaft 108. The second sheath heater 110B bent at the first end T2 extends into the shaft 108 through the through hole 130 (fig. 6B) formed in the third support plate 106, and is connected to a heater power supply (not shown) via the lead wire 112 and the terminal 114 (fig. 6A).

By applying the structure, the freedom degree of the layout of the sheath heater is greatly improved, and the substrate can be heated more uniformly.

As described in the first embodiment, the diameter of the conventional sheath heater is larger than the diameter of the sheath heater 110 provided in the stage 100 according to one of the embodiments of the present invention. Since there is a limit to the size of the shaft 108 included in the stage, when a plurality of conventional sheath heaters are used for the stage, it is difficult to dispose the end portions of the plurality of conventional sheath heaters in the region 109. As a result, the number of sheath heaters that can be configured is limited. Thus, it is impossible to subdivide the upper surface of the stage into a plurality of segments and perform precise temperature control for each segment. Therefore, it is difficult to uniformly heat the substrate.

In contrast, the sheath heater 110 included in the stage 100 according to one embodiment of the present invention has a small diameter. Therefore, even if a plurality of sheath heaters 110 are disposed on the stage 100, the ends of the plurality of sheath heaters can be disposed in the region 109. In addition, the sheath heaters 110 have a high degree of freedom in arrangement, and can subdivide the upper surface of the stage into a plurality of sections and perform accurate temperature control for each section. Therefore, the substrate can be uniformly heated.

3. Third embodiment

In this embodiment, a modification of the stage 100 described in the second embodiment will be described with reference to fig. 7A and 7B. Like fig. 6A, these figures are sectional views along the chain lines a1 and a2 of fig. 5B. There are cases where the description of the same or similar structure as that of the first embodiment or the second embodiment is omitted.

3-1 modification example 1

As shown in fig. 7A, in the first modification, a groove (first groove 120) is not formed in the upper surface 104-3 of the second support plate 104, but a groove (second groove 140) is formed in the lower surface of the first support plate 102. In the first modification, the sheath heater 110 is received in the second groove 140. The depth of the second groove 140 is the same or substantially the same as the outer diameter of the sheath heater 110. Specifically, the depth of the second groove 140 may be greater than 100% and less than 150%, greater than 100% and less than 120%, or greater than 100% and less than 110% of the outer diameter of the sheath heater 110.

In the first modification, the contact area between the sheath heater 110 and the first support plate 102 can be increased by making the depth of the second groove 140 the same as or substantially the same as the outer diameter of the sheath heater 110. Thereby, the heat energy generated by the sheath heater 110 can be efficiently transferred to the first support plate 102.

In the first modification, a structure in which the depth of the second groove 140 is the same as or substantially the same as the outer diameter of the sheath heater 110 is exemplified, but the depth of the second groove 140 is not limited to this structure. For example, the outer diameter of the sheath heater 110 and the depth of the second groove 140 may also be different. In the case where there is a space between the outer diameter of the sheath heater 110 and the second groove 140, deformation caused by thermal expansion of the sheath heater 110 can be suppressed. Thus, a highly reliable stage can be provided.

3-2 modification example two

Alternatively, as shown in fig. 7B, the first groove 120 may be formed on the upper surface 104-3 of the second support plate 104, and the second groove 140 may be formed on the lower surface of the first support plate 102. In the second modification, the sum of the depth of the first groove 120 and the depth of the second groove 140 is the same as or substantially the same as the outer diameter of the sheath heater 110. Specifically, the sum of the depth of the first groove 120 and the depth of the second groove 140 may be greater than 100% and less than 150%, greater than 100% and less than 120%, or greater than 100% and less than 110% of the outer diameter of the sheath heater 110.

In the second modification, the contact area between the sheath heater 110 and the first and second support plates 102 and 104 can be increased by making the sum of the depth of the first groove 120 and the depth of the second groove 140 the same as or substantially the same as the outer diameter of the sheath heater 110. Accordingly, the heat energy generated by the sheath heater 110 can be efficiently transferred to the first and second support plates 102 and 104.

In the second modification, a structure in which the sum of the depth of the first groove 120 and the depth of the second groove 140 is the same as or substantially the same as the outer diameter of the sheath heater 110 is exemplified, but the sum of the depth of the first groove 120 and the depth of the second groove 140 is not limited to this structure. For example, the outer diameter of the sheath heater 110 may also be different from the sum of the depth of the first groove 120 and the depth of the second groove 140. When there is a space between the outer diameter of the sheath heater 110 and the first groove 120 and the second groove 140, deformation caused by thermal expansion of the sheath heater 110 can be suppressed. Therefore, a highly reliable stage can be provided.

4. Fourth embodiment

In the present embodiment, the stage 150 in which a plurality of sheath heaters 110 independently driven are arranged will be described. The following embodiment is an example of the present embodiment, and does not limit the number of sheath heaters 110 provided in the stage 100. There are cases where the description of the same or similar structure as that of the first to third embodiments is omitted.

Fig. 8 shows a top view of the stage 150. In view of the legibility of the drawing, the illustration of the first support plate 102 is omitted in fig. 8. As shown in fig. 8, in the stage 150, four sheath heaters (a first sheath heater 110a, a second sheath heater 110b, a third sheath heater 110c, and a fourth sheath heater 110d) are arranged in a quarter circle, respectively. That is, the four sheath heaters (the first sheath heater 110a, the second sheath heater 110b, the third sheath heater 110c, and the fourth sheath heater 110d) are disposed on the stage 150 with good symmetry. In the example shown in fig. 8, the first to fourth sheath heaters 110a to 110d having circular arcs with different radii are arranged.

The first to fourth sheath heaters 110a to 110d have the same shape and may be configured such that one of the first to fourth sheath heaters 110a to 110d overlaps with the other if rotated by 90 ° about an axis passing through the center of the second support plate 104.

Even if the above-described layout is adopted, since the diameter of the plurality of sheath heaters 110 provided in the stage 150 according to one embodiment of the present invention is small, the end portions of the plurality of sheath heaters 110 can be arranged in the region 109. In addition, by adopting the above-described layout, the plurality of sheath heaters 110 having high symmetry can be arranged on the second support plate 104 at high density. Therefore, the temperature of the substrate can be controlled more uniformly and more accurately.

5. Fifth embodiment

In the present embodiment, a configuration of the sheath heater 110 different from that of the first embodiment will be described. There are cases where the description of the same or similar structure as that of the first embodiment is omitted.

The sheath heater 110 used in the stage 100 of the present embodiment is not limited, and a sheath heater 110 having various structures may be used. Fig. 9A shows a cross-sectional view of a single-terminal sheath heater 110 provided with a ribbon-shaped heater wire 118, as an example. Fig. 9B is a view showing a section along the chain lines E1 and E2 perpendicular to the long axis. Fig. 10A is a cross-sectional view of a single-terminal sheath heater 110 including a ribbon-shaped heater wire 118 having a spiral structure. Fig. 10B is a view showing a section along the chain lines F1 and F2 perpendicular to the long axis. Fig. 11A is a cross-sectional view of a single-terminal sheath heater 110 including a strip-shaped heater wire 118 having a double-spiral structure. Fig. 11B is a view showing a section along the chain lines G1 and G2 perpendicular to the long axis.

The sheath heater 110 shown in fig. 9A is different from the sheath heater 110 shown in the first embodiment in that a heater wire 118 in a band shape is folded inside a metal sheath 115, and both ends thereof are taken out from one end of the metal sheath 115.

The sheath heater 110 shown in fig. 9A has a quadrangular cross-sectional shape, and a ribbon-shaped heater wire 118 is used. As shown in fig. 10A, the heater wire 118 may be twisted inside the metal sheath 115, and a portion folded from one end and a portion folded from the other end may be independently formed into a spiral structure. In the case where the ribbon-shaped heater wire 118 has a spiral structure, the spiral structure may be adjusted so that the pitch L1 is 1.0mm or more and 3.0mm or less, 1.0mm or more and 2.5mm or less, or 1.0mm or more and 2.0mm or less. By adopting such a spiral structure, the length of the heater wire 118 corresponding to the metal sheath 115 per unit length can be increased, and the resistance value of the sheath heater 110 can be increased. Further, since the heater wire 118 can be provided with spring characteristics, disconnection of the heater wire 118 during deformation or thermal expansion can be suppressed. Therefore, even if, for example, the difference in thermal expansion coefficient between the metal sheath 115 and the heater wire 118 is large, the sheath heater 110 with high reliability can be provided.

As shown in fig. 9B and 10B, the normal line of the heater wire 118 is substantially perpendicular to the direction in which the metal sheath 115 extends. Further, in the two portions of the heater wire 118 opposed to each other, the faces of the heater wire 118 are substantially parallel. Further, by making the winding direction of the spiral structure the same and making the pitch L1 the same, the distance g2 between the two portions of the heater wire 118 facing each other can be kept constant, and as a result, short-circuiting of the heater wire 118 can be prevented. However, in the two portions of the heater wire 118 opposed to each other, the winding direction of the spiral or the pitch L1 may also be different from each other.

As shown in fig. 11A, the heater wire 118 may be formed to have a double-spiral structure in two portions of the heater wire 118 facing each other. In this case, the heater wire 118 may be configured such that the pitch L2 of the helical structure thereof is 1.0mm or more and 6.0mm or less, 1.0mm or more and 2.5mm or less, or 1.0mm or more and 2.0mm or less.

Referring to fig. 9B, 10B and 11B, the width d10 of the heater wire 118 may be selected from a range of 0.1mm or more and 2.0mm or less, and the thickness d11 may be selected from a range of 0.1mm or more and 0.5mm or less. The inner diameter d2 of the metallic sheath 115 may be selected from the range of 3.0mm or more and 4.0mm or less, the thickness d4 may be selected from the range of 0.5mm or more and 1.0mm or less, and the outer diameter d3 may be selected from the range of 3.0mm or more and 6.0 mm. The distance g1 between the heater wire 118 and the metal sheath 115 may be selected from a range of 0.3mm or more and 1.0mm or less, or from 0.4mm or more and 1.0mm or less. The distance g2 between the portion folded from one end of the heater wire 118 and the portion folded from the other end may be selected from the range of 0.3mm or more and 2.0mm or less, or from 0.4mm or more and 1.0mm or less. This enables the sheath heater 110 to be made thin. Therefore, the sheath heater 110 can be disposed on the stage 100 at a high density. Therefore, the temperature distribution of the substrate can be further reduced. In addition, insulation between the metal sheath 115 and the heater wire 118 can be ensured, and short circuit of the heater wire 118 can be prevented.

The shape of the cross section perpendicular to the long axis of the sheath heater 110 is not limited. For example, the cross-section perpendicular to the longitudinal axis of the sheath heater 110 may have a circular shape as shown in fig. 1B, or may have a polygonal or elliptical shape although not shown. In the case where the sectional shape is circular, the force required for deformation is independent of the direction of bending, and therefore the sheath heater 110 can be easily bent in any direction. This makes it possible to easily dispose the sheath heater 110 in the groove formed in the first support plate 102, the second support plate 104, and the like shown in fig. 5 to 8.

6. Sixth embodiment

In the present embodiment, a film deposition apparatus and a film processing apparatus including the stage 100 or the stage 150 will be described. In the present embodiment, a film deposition apparatus and a film processing apparatus including the stage 100 will be described as an example. There are cases where the description of the same or similar structures as those of the first to fifth embodiments is omitted.

6-1 etching device

Fig. 12 shows a cross-sectional view of an etching apparatus 200 as one of the film processing apparatuses. The etching apparatus 200 can perform dry etching on various films. The etching apparatus 200 has a chamber 202. The chamber 202 provides a space for etching a film of an electric conductor, an insulator, a semiconductor, or the like formed on a substrate.

The exhaust device 204 is connected to the chamber 202, and thereby the inside of the chamber 202 can be set to a reduced pressure atmosphere. The chamber 202 is further provided with an inlet pipe 206 for introducing a reaction gas, and the reaction gas for etching is introduced into the chamber through a valve 208. The reaction gas may, for example, be carbon tetrafluoride (CF)4) Octafluorocyclobutane (C-C)4F6) Perfluorocyclopentane (decafluorocyclopentane) (C-C)5F10) Perfluorobutadiene (C)4F6) And the like.

A microwave source 212 may be disposed in an upper portion of the chamber 202 via a waveguide 210. The microwave source 212 has an antenna or the like for supplying microwaves, and outputs microwaves of, for example, 2.45GHz, high-frequency microwaves of Radio Frequency (RF) such as 13.56 MHz. The microwaves generated by the microwave source 212 are propagated to the upper portion of the chamber 202 through the waveguide 210, and are introduced into the interior of the chamber 202 through the window 214 containing quartz, ceramic, or the like. The reaction gas is converted into plasma by the action of microwaves, and the film is etched by electrons, ions, and radicals contained in the plasma.

The stage 100 according to one embodiment of the present invention is disposed at a lower portion of the chamber 202 to dispose a substrate. The substrate is disposed on the stage 100. A power supply 224 is connected to the stage 100 to supply high-frequency power to the stage 100, and an electric field generated by the action of the microwave is formed in a direction perpendicular to the surface of the stage 100 or the surface of the substrate. Magnets 216, 218 and 220 may also be disposed on the upper and side of chamber 202. The magnets 216, 218 and 220 may be permanent magnets or electromagnets with electromagnetic coils. The magnetic field component parallel to the stage 100 and the substrate surface generated by the magnets 216, 218, and 220 cooperates with the electric field generated by the microwave, whereby electrons in the plasma are resonated by the lorentz force and are bound to the stage 100 and the substrate surface. As a result, high-density plasma can be generated on the substrate surface.

The stage 100 is further connected to a heater power supply 230 that controls the sheath heater 110 provided in the stage 100. The stage 100 may be connected to a power supply 226 for electrostatic chuck for fixing the substrate to the stage 100, a temperature controller 228 for controlling the temperature of the medium circulating inside the stage 100, and a rotation control device (not shown) for rotating the stage 100, as optional configurations.

As described above, the stage 100 according to one embodiment of the present invention is used in the etching apparatus 200. By using this stage 100, the substrate can be uniformly heated, and the heating temperature can be accurately controlled. Therefore, various films provided on the substrate can be uniformly etched by the etching apparatus 200.

6-2.CVD apparatus

Fig. 13 is a sectional view of a CVD apparatus 300 as one of the film forming apparatuses. CVD apparatus 300 has a chamber 302. The CVD apparatus 300 chemically reacts the reaction gas to provide a place where various films are chemically formed on the substrate.

An exhaust 304 is coupled to the chamber 302 to enable a reduction in pressure within the chamber 302. The chamber 302 may be further provided with an introduction pipe 306 for introducing a reaction gas, and the reaction gas for film formation may be introduced into the chamber 302 through a valve 308. As the reaction gas, various gases can be used depending on the film to be formed. The gas may be a liquid at normal temperature. For example, a thin film of silicon, silicon oxide, silicon nitride, or the like can be formed by using silane, dichlorosilane, tetraethoxysilane, or the like. Alternatively, a metal thin film of tungsten, aluminum, or the like can be formed by using tungsten fluoride, trimethylaluminum, or the like.

Similarly to the etching apparatus 200, a microwave source 312 may be provided on the upper portion of the chamber 302 via the waveguide 310. Microwaves generated by a microwave source 312 are directed into the interior of the chamber 302 via a waveguide 310. The reaction gas is converted into plasma by the microwave, the chemical reaction of the gas is promoted by various active species contained in the plasma, and a product obtained by the chemical reaction is deposited on the substrate to form a thin film. The magnet 344 for increasing the density of the plasma may be disposed in the chamber 302 as an arbitrary structure. The stage 100 according to the first embodiment may be provided below the chamber 302, and the thin film may be deposited in a state where the substrate is placed on the stage 100. Similarly to the etching apparatus 200, a magnet 316 and a magnet 318 may be further provided on the side surface of the chamber 302.

The stage 100 may be further connected to a heater power supply 330 for controlling the sheath heater 110 provided in the stage 100. The stage 100 may further include a power supply 324 for supplying high-frequency power to the stage 100, a power supply 326 for the electrostatic chuck, a temperature controller 328 for controlling the temperature of the medium circulating inside the stage 100, a rotation control device (not shown) for rotating the stage 100, and the like, as arbitrary configurations.

6-3 sputtering device

Fig. 14 is a sectional view of a sputtering apparatus 400 as one of the film forming apparatuses. The sputtering apparatus 400 has a chamber 402. The sputtering apparatus 400 provides a place for collision of high-speed ions with a target and deposition of target atoms generated at this time on a substrate.

An exhaust 404 for depressurizing the chamber 402 may be connected to the chamber 402. The chamber 402 may be provided with an introduction pipe 406 and a valve 408 for introducing a sputtering gas such as argon into the chamber 402.

In the lower part of the chamber 402, a target table 410 may be provided, and a target 412 may be provided on the target table 410, wherein the target table 410 holds a target containing a material for film formation and functions as a cathode. A high frequency power source 414 may be coupled to the end station 410 and a plasma may be generated within the chamber 402 using the high frequency power source 414.

The stage 100 according to the first embodiment may be disposed on an upper portion of the chamber 402. In this case, the thin film is formed in a state where the substrate is set on the stage 100. Like the etching apparatus 200 and the CVD apparatus 300, the heater power supply 430 may be connected to the stage 100. The stage 100 may be further connected to a power supply 424 for supplying high-frequency power to the stage 100, a power supply 426 for the electrostatic chuck, a temperature controller 428, and a rotation control device (not shown) for rotating the stage 100.

The argon ions accelerated by the plasma generated within the chamber 402 collide with the target 412, ejecting atoms from the target 412. The ejected atoms fly toward and deposit on a substrate disposed under the stage 100 during the period when the shutter 416 is opened.

In the present embodiment, the configuration in which the stage 100 is provided above the chamber 402 and the target table 410 is provided below the chamber 402 is exemplified, but the present embodiment is not limited to this configuration, and the sputtering apparatus 400 may be configured such that the target 412 is positioned above the stage 100. Alternatively, the stage 100 may be provided such that the main surface of the substrate is arranged perpendicular to the horizontal plane, and the target table 410 may be provided so as to face the stage 100.

6-4 evaporation device

Fig. 15 is a sectional view of a vapor deposition device 500 which is one of the film formation devices. The evaporation apparatus 500 has a chamber 502. The evaporation apparatus 500 provides a space for evaporating a material of the evaporation source 510 and depositing the evaporated material onto a substrate.

An exhaust 504 for making the inside of the chamber 502 a high vacuum is connected to the chamber 502. The chamber 502 may be provided with an introduction pipe 506 for returning the chamber 502 to the atmospheric pressure, and an inert gas such as nitrogen, argon, or the like may be introduced into the chamber 502 through a valve 508.

The stage 100 may be disposed on an upper portion of the chamber 502. The deposition of the material is performed in a state where the substrate is disposed under the stage 100. The stage 100 may be further connected to a heater power supply 528, similarly to the etching apparatus 200, the CVD apparatus 300, and the sputtering apparatus 400. The stage 100 may further include a power supply 524 for the electrostatic chuck, a temperature controller 526, and a rotation control device 530 for rotating the stage 100, as an optional configuration. The stage 100 may further have a mask holder 516 for fixing the metal mask between the substrate and the evaporation source 510. Thus, the metal mask can be disposed near the substrate so that the opening of the metal mask overlaps with the region where the material is deposited.

The evaporation source 510 may be disposed at a lower side of the chamber, and the evaporation source 510 is filled with a material to be evaporated. The evaporation source 510 may be provided with a heater for heating the material, and the heater is controlled by the control device 512. The inside of the chamber 502 is brought into a high vacuum by using the exhaust device 504, and the evaporation source 510 is heated to vaporize the material, thereby starting evaporation. When the rate of evaporation becomes constant, shutter 514 is opened, thereby starting deposition of material on the substrate.

As described above, the stage according to one of the embodiments can be used in the film deposition apparatus such as the CVD apparatus 300, the sputtering apparatus 400, or the vapor deposition apparatus 500 according to the embodiment. By using the stage, the substrate can be uniformly heated, and the heating temperature can be accurately controlled. Therefore, by using these film forming apparatuses, various films having controlled characteristics can be uniformly formed on the substrate.

As embodiments of the present invention, the above-described embodiments may be combined and implemented as appropriate, as long as they do not contradict each other. In addition, as long as the gist of the present invention is achieved, addition, deletion, or design change of appropriate components by those skilled in the art based on the respective embodiments is also included in the scope of the present invention.

Further, even other operational effects different from the operational effects of the above-described embodiments may be understood as the operational effects of the present invention, as apparent from the description of the present specification or as easily predicted by those skilled in the art.

(description of reference numerals)

100: an object stage; 102: a first support plate; 104: a second support plate; 104-3: an upper face;

104-4: a lower face; 106: a third support plate; 108: a shaft; 109: an area;

110: a sheath heater; 110 a: a first sheath heater; 110 b: a second sheath heater;

110 c: a third sheath heater; 110 d: a fourth sheath heater; 112: a lead wire; 114: a terminal;

115: a metal sheath; 116: a first insulator; 118: a heater wire; 120: a first groove;

122: a first insulating member; 124: a cylindrical member; 126: a connecting member; 130: a through hole;

140: a second groove; 150: an object stage; 200: an etching device; 202: a chamber;

204: an exhaust device; 206: an introducing pipe; 208: a valve; 210: a waveguide; 212: a microwave source;

214: a window; 216: a magnet; 218: a magnet; 220: a magnet;

224: a power source; 226: a power source; 228: a temperature controller; 230: a heater power supply; 300: a device;

302: a chamber; 304: an exhaust device; 306: an introducing pipe; 308: a valve; 310: a waveguide;

312: a microwave source; 316: a magnet; 318: a magnet; 324: a power source; 326: a power source;

328: a temperature controller; 330: a heater power supply; 344: a magnet; 400: a sputtering device;

402: a chamber; 404: an exhaust device; 406: an introducing pipe; 408: a valve; 410: a target platform;

412: a target; 414: a high frequency power supply; 416: a baffle plate; 424: a power source; 426: a power source;

428: a temperature controller; 430: a heater power supply; 500: an evaporation device; 502: a chamber;

504: an exhaust device; 506: an introducing pipe; 508: a valve; 510: a vapor deposition source; 512: a control device;

514: a baffle plate; 516: a mask holder; 524: a power source; 526: a temperature controller;

528: a heater power supply; 530: a rotation control device.

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