阅读说明：本技术 用于半导体用石英板的抛光上盘装置及抛光上盘方法 (Polishing upper disc device and polishing upper disc method for quartz plate for semiconductor ) 是由 单佩 陈佳骅 于 2021-01-05 设计创作，主要内容包括：本发明属于半导体用石英板上盘技术领域,具体涉及一种抛光上盘装置及抛光上盘方法。其中,用于半导体用石英板的抛光上盘装置,包括底座,底座上设有水平移动机构,水平移动机构上分别设有高温恒温水箱和低温恒温水箱,还包括升降篮,升降篮内底面上设置有升降篮卡槽,升降篮通过升降气缸安装在高温恒温水箱和低温恒温水箱上方,升降篮内设有加压提篮,加压提篮通过加压气缸安装在升降篮顶部的内壁上,加压提篮内底面设有加压卡槽,加压卡槽上卡接吸盘装置,吸盘装置的底面穿过加压卡槽后位于升降篮内底面上方,吸盘装置的底面用于吸住半导体用石英板。本发明结构简单,操作便利；提高了操作员工的工作环境,降低安全隐患。(The invention belongs to the technical field of an upper plate of a quartz plate for a semiconductor, and particularly relates to an upper plate polishing device and an upper plate polishing method. Wherein, a polishing hanging wall device for quartz plate for semiconductor, the on-line screen storage device comprises a base, be equipped with horizontal migration mechanism on the base, be equipped with high temperature constant temperature water tank and low temperature constant temperature water tank on the horizontal migration mechanism respectively, still include the lift basket, be provided with the lift basket draw-in groove on the bottom surface in the lift basket, the lift basket passes through the lift cylinder and installs in high temperature constant temperature water tank and low temperature constant temperature water tank top, be equipped with the pressurization hand-basket in the lift basket, the pressurization hand-basket passes through the pressurization cylinder and installs on the inner wall at lift basket top, the bottom surface is equipped with the pressurization draw-in groove in the pressurization hand-basket, joint sucking disc device on the pressurization draw-in groove, sucking disc device's bottom surface is located. The invention has simple structure and convenient operation; the working environment of operators is improved, and the potential safety hazard is reduced.)

1. A polishing and disc loading device for a quartz plate for a semiconductor comprises a base and is characterized in that a horizontal moving mechanism is arranged on the base, a high-temperature constant-temperature water tank and a low-temperature constant-temperature water tank are respectively arranged on the horizontal moving mechanism, and the horizontal moving mechanism drives the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank to horizontally move;

the lifting basket is mounted above the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank through a lifting cylinder, and the lifting cylinder drives the lifting basket to do lifting motion;

a pressurizing lifting basket is arranged in the lifting basket, the pressurizing lifting basket is installed on the inner wall of the top of the lifting basket through a pressurizing air cylinder, the pressurizing air cylinder is provided with a pressure adjusting device, and the pressurizing air cylinder drives the pressurizing lifting basket to do lifting motion;

the bottom surface is equipped with the pressurization draw-in groove in the pressurization hand-basket, joint sucking disc device on the pressurization draw-in groove, sucking disc device's bottom surface passes be located behind the pressurization draw-in groove bottom surface top in the lifting basket, sucking disc device's bottom surface is used for holding the quartz plate for the semiconductor.

2. The polishing upper disc device for the quartz plate for the semiconductor according to claim 1, wherein two groups of purification devices are further arranged on the bottom plate, each group of purification devices comprises a water pool to be purified, an RO reverse osmosis water purifier, a heat exchanger, a first submersible pump and a second submersible pump, the first submersible pump is connected with an inlet of one group of heat exchange tubes in the heat exchanger, an outlet of one group of heat exchange tubes in the heat exchanger is connected with the water pool to be purified, the water pool to be purified is connected with an inlet of the RO reverse osmosis water purifier through the second submersible pump, and an outlet of the RO reverse osmosis water purifier is connected with an inlet of the other group of heat exchange tubes in the heat exchanger;

a first submersible pump in the group of the purification devices is connected with the high-temperature constant-temperature water tank, and the outlet of another group of heat exchange tubes in the heat exchanger in the group of the purification devices is connected with the high-temperature constant-temperature water tank;

and the first submersible pump in the other group of the purification devices is connected with the low-temperature constant-temperature water tank, and the outlet of the other group of heat exchange tubes in the exchanger in the other group of the purification devices is connected with the low-temperature constant-temperature water tank.

3. The polishing upper disc device for the quartz plate for the semiconductor, as set forth in claim 1, wherein the horizontal moving mechanism comprises a guide rail fixed on the base and a thrust cylinder, the bottoms of the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank are slidably connected with the guide rail, a telescopic rod of the thrust cylinder is respectively connected with the bottom of the high-temperature constant-temperature water tank and the bottom of the low-temperature constant-temperature water tank, and the telescopic rod of the thrust cylinder stretches and retracts to drive the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank to horizontally slide on the guide rail.

4. The polishing upper plate device for a quartz plate for a semiconductor, according to claim 1, wherein said chuck device comprises a chuck housing having an inverted T-shaped longitudinal section, wherein said vertical section of said chuck housing is a hollow cylindrical structure, said horizontal section of said chuck housing is a disc structure with an open bottom, a disc-shaped chuck surface is provided in said horizontal section of said chuck housing, said bottom surface of said chuck surface is flush with the bottom surface of said horizontal section of said chuck housing, a plurality of chuck cylinders are arranged on said chuck surface, a cylinder piston is installed in each of said chuck cylinders, each of said cylinder pistons is connected to a pressing stem shaft, said pressing stem shaft is provided in said chuck housing, and said vertical section passing through said chuck housing protrudes from the top of said chuck housing;

a ring-shaped handle is sleeved outside the vertical section of the sucker shell and the extending part of the pressing handle shaft, a circle of limiting bulges are arranged on the inner wall of the handle, a circle of limiting flange is arranged on the upper outer surface of the extending part of the pressing handle shaft, a pressure spring is wound on the outer surface of the extending part of the pressing handle shaft and is positioned between the top of the vertical section of the sucker shell and the limiting flange, and the limiting flange of the pressing handle shaft is limited below the limiting bulges;

the outer surface of the vertical section of the sucker shell is also provided with a clamping structure for clamping the pressurizing clamping groove.

5. The polishing upper plate device for a quartz plate for a semiconductor, according to claim 4, wherein an inner thread is provided on an inner wall of the handle from bottom to top, and an outer surface of the vertical section of the suction cup housing and an outer surface of the protruding portion of the pressing stem are respectively provided with an outer thread which is threadedly connected with the inner thread.

6. The polishing upper plate device for a quartz plate for a semiconductor, according to claim 4, wherein a ring of first flange is provided on an outer surface of the vertical section of the chuck housing, a ring of second flange is provided on a top of the first flange, a bottom surface of the first flange is connected to the horizontal section of the chuck housing, and the handle is provided above the second flange;

the circumferential surface of the second flange is provided with at least one bulge for clamping the pressurizing clamping groove, the pressurizing clamping groove comprises a circular pressurizing through groove communicated from top to bottom, the circumferential surface of the inner wall of the pressurizing through groove is provided with at least one pressurizing bayonet in an outward digging manner, the length and the width of the pressurizing bayonet are larger than those of the bulge, the diameter of the second flange is smaller than that of the pressurizing through groove, and the outer diameter of the transverse section of the sucker shell is larger than that of the pressurizing through groove;

the first flange, the second flange and the protrusion form the clamping structure;

the distance from the top surface of the transverse section of the sucker shell to the bottom surface of the second flange is greater than the thickness of the pressurizing clamping groove.

7. The polishing upper disc device for the quartz plate for the semiconductor as claimed in claim 4, wherein the sucker casing is a sucker casing made of an aluminum alloy material, the sucker surface is a sucker surface made of an aluminum alloy surface layer wrapping a polyurethane block, the bottom surface of the aluminum alloy surface layer is provided with a plurality of sucker holes, the sucker cylinder is arranged in the polyurethane block, and the bottom surface of the cylinder piston is communicated with the sucker holes.

8. The polishing upper disc device for the quartz plate for the semiconductor as claimed in claim 1, wherein the lifting basket clamping groove is arranged in the middle of the inner bottom surface of the lifting basket, and a positioning frame for sleeving the quartz bottom plate is arranged outside the lifting basket clamping groove;

the bottom surface of the lifting basket is provided with a plurality of water drainage holes communicated up and down, and the clamping groove of the lifting basket is also provided with a plurality of water drainage holes communicated up and down.

9. The polishing upper plate device for the quartz plate for the semiconductor as claimed in any one of claims 1 to 8, wherein a plurality of bottom plate holes are dug downwards on the top surface of the quartz bottom plate, a bottom plate cylinder is arranged in each bottom plate hole, an expansion piston is independently arranged in each bottom plate cylinder, absolute ethyl alcohol is arranged in a cylinder body of each expansion piston, when the expansion pistons are heated, the volume of the absolute ethyl alcohol expands to push the expansion pistons to move, the expansion pistons compress the volume of the bottom plate cylinders, when the expansion pistons are cooled down, the volume of the absolute ethyl alcohol is reduced to drive the expansion pistons to move, the volume of the bottom plate cylinders is increased, when the bottom plate holes are blocked by the quartz plate for the semiconductor, the bottom plate cylinders form a vacuum environment, and the quartz plate for the semiconductor is adsorbed on the quartz bottom plate.

10. The upper plate polishing method using the upper plate polishing device for a quartz plate for semiconductors according to any one of claims 1 to 9, characterized by comprising the steps of:

setting the water temperature in a high-temperature constant-temperature water tank to be a first preset temperature, setting the water temperature in a low-temperature constant-temperature water tank to be a second preset temperature, raising a lifting basket, raising a pressurizing lifting basket, moving the high-temperature constant-temperature water tank to the position below the lifting basket, placing a quartz bottom plate in a lifting basket clamping groove of the lifting basket bottom plate, and sleeving a positioning frame on the quartz bottom plate;

after a pressing handle shaft on the sucker device is pressed down, the pressing handle shaft is contacted with a quartz plate for a semiconductor to be hung on the plate, the pressing handle shaft is loosened, the quartz plate for the semiconductor is sucked up, and the sucker device with the quartz plate for the semiconductor is clamped into a pressurizing clamping groove below the pressurizing basket;

immersing a quartz bottom plate in the lifting basket into a high-temperature constant-temperature water tank by using a lifting cylinder, wherein the sucker device is not in contact with the water in the high-temperature constant-temperature water tank, and after the quartz bottom plate is heated for a first preset time, adjusting the pressure of a pressurizing cylinder to a first preset pressure value so that the pressurizing cylinder drives the quartz plate for the semiconductor on the sucker device to be in contact with the quartz bottom plate;

the lifting cylinder is used for driving the lifting basket to lift from the high-temperature constant-temperature water tank, the low-temperature constant-temperature water tank is moved to the position below the lifting basket, the lifting cylinder is used for driving the quartz bottom plate in the lifting basket to sink into the low-temperature constant-temperature water tank, after second preset time, the pressure of the pressurizing cylinder is adjusted to be a third preset pressure value, the third preset pressure value is smaller than the first preset pressure value, the pressurizing cylinder drives the pressurizing basket to lift, so that the pressurizing basket does not apply pressure to the sucking disc device any more, at the moment, the sucking disc device and the pressurizing basket have a buffer gap, the sucking disc device is not lifted, after a pressing handle shaft on the sucking disc device is pressed, the pressurizing cylinder is used for driving the sucking disc device to lift to leave the low-temperature constant-temperature water tank, and the sucking disc device automatically leaves the quartz plate for the semiconductor, and driving a lifting basket to lift from the low-temperature constant-temperature water tank by using a lifting cylinder, taking down the positioning frame, and taking down the quartz bottom plate which adsorbs the quartz plate for the semiconductor to polish.

Technical Field

The invention belongs to the technical field of an upper plate of a quartz plate for a semiconductor, and particularly relates to an upper plate polishing device and an upper plate polishing method.

Background

As semiconductors are applied in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., the importance of semiconductors is very great from the viewpoint of technological or economic development. Quartz plates for semiconductors are key components in the overall process of semiconductor manufacturing. Especially, the specification of the quartz plate for the semiconductor is changed along with the change of the specification, and the requirement of technical parameters is higher and higher; according to related data, the chip self-sufficiency rate in China is about 70% in the next 5 years, and the chip self-sufficiency rate in China is only about 30% in 2019, so that the chip industry can continue to keep high-speed development due to the improvement of the overall industry prospect. The demand for quartz plates for high-end semiconductors will necessarily increase substantially.

Polishing a quartz plate for a semiconductor, namely firstly placing a specific aluminum plate on a heating electric furnace for heating, then melting rosin wax on the aluminum plate, then placing the semiconductor quartz plate to be polished on the aluminum plate with the melted rosin wax, polishing after cooling, then placing the aluminum plate adhered with the semiconductor quartz plate on a heating furnace for heating after polishing is finished, and taking the semiconductor quartz plate out after the melted rosin wax; according to the traditional semiconductor quartz plate feeding device, an aluminum plate is good in heat conductivity, the melting point and the freezing point of rosin wax are low, a heating furnace is used for heating the aluminum plate to melt the rosin wax, and the rosin wax is solidified to fix the semiconductor quartz plate after cooling. In addition, the aluminum plate is easy to deform during heating and cooling, the thickness of the rosin wax layer is not uniform after the rosin wax is solidified, the heating and cooling time is long, and the heat energy is not recycled, so that the polishing precision is reduced, the polishing quality is influenced, the plate hanging efficiency is low, and the use cost is high.

Disclosure of Invention

The invention aims to solve the technical problems that safety accidents are easy to happen when a traditional quartz plate feeding device for a semiconductor heats rosin by using a heating furnace, the working environment is severe, the thickness of rosin wax is uneven in the rosin wax solidification process, the surface type of the semiconductor quartz plate is influenced, and the polishing precision is influenced very much, and provides a polishing feeding device and a polishing feeding method for the quartz plate for the semiconductor.

The polishing upper disc device for the quartz plate for the semiconductor comprises a base, wherein a horizontal moving mechanism is arranged on the base, a high-temperature constant-temperature water tank and a low-temperature constant-temperature water tank are respectively arranged on the horizontal moving mechanism, and the horizontal moving mechanism drives the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank to horizontally move;

the lifting basket is mounted above the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank through a lifting cylinder, and the lifting cylinder drives the lifting basket to do lifting motion;

a pressurizing lifting basket is arranged in the lifting basket, the pressurizing lifting basket is installed on the inner wall of the top of the lifting basket through a pressurizing air cylinder, the pressurizing air cylinder is provided with a pressure adjusting device, and the pressurizing air cylinder drives the pressurizing lifting basket to do lifting motion;

the bottom surface is equipped with the pressurization draw-in groove in the pressurization hand-basket, joint sucking disc device on the pressurization draw-in groove, sucking disc device's bottom surface passes be located behind the pressurization draw-in groove bottom surface top in the lifting basket, sucking disc device's bottom surface is used for holding the quartz plate for the semiconductor.

When the water tank is used, the water in the high-temperature constant-temperature water tank and the water in the low-temperature constant-temperature water tank are deionized water, the deionized water in the high-temperature constant-temperature water tank is set to be 50 ℃, and the deionized water in the low-temperature constant-temperature water tank is set to be 25 ℃. The lifting basket and the pressurizing lifting basket are lifted through the lifting cylinder, the high-temperature constant-temperature water tank is moved to the lower part of the lifting basket through the horizontal moving mechanism, and the quartz bottom plate is placed in a clamping groove of the lifting basket on the inner bottom surface of the lifting basket. The semiconductor quartz plate to be hung on the tray is contacted and sucked through the sucker device, the sucker device which is sucked with the semiconductor quartz plate is clamped on the pressurizing clamping groove of the pressurizing basket, and the semiconductor quartz plate is positioned below the bottom surface of the pressurizing basket and above the quartz bottom plate. And driving the lifting cylinder to immerse the quartz bottom plate in the lifting basket into the high-temperature constant-temperature water tank, wherein the sucker device and the quartz plate for the semiconductor are not in contact with deionized water in the high-temperature constant-temperature water tank in the process. After the heating is carried out for the first preset time, the pressurizing cylinder is controlled to drive the quartz plate for the semiconductor on the sucker device to slowly descend to be in contact with the quartz bottom plate and continue descending and pressurizing. The lifting cylinder is driven to drive the lifting basket to be lifted from the high-temperature constant-temperature water tank. And after the second preset time, the pressurizing cylinder is driven to drive the pressurizing basket to ascend, so that the pressurizing basket does not apply pressure to the sucker device any more, the sucker device is driven to release the quartz plate for the semiconductor, and the pressurizing cylinder is driven to drive the sucker device to ascend to leave the low-temperature constant-temperature water tank. And driving the lifting cylinder to drive the lifting basket to be lifted up from the low-temperature constant-temperature water tank, and taking down the quartz bottom plate which adsorbs the quartz plate for the semiconductor to be polished.

The bottom plate is also provided with two groups of purification devices, each group of purification devices comprises a water pool to be purified, an RO reverse osmosis water purifier, a heat exchanger, a first submersible pump and a second submersible pump, the first submersible pump is connected with the inlet of one group of heat exchange tubes in the heat exchanger, the outlet of one group of heat exchange tubes in the heat exchanger is connected with the water pool to be purified, the water pool to be purified is connected with the inlet of the RO reverse osmosis water purifier through the second submersible pump, and the outlet of the RO reverse osmosis water purifier is connected with the inlet of the other group of heat exchange tubes in the heat exchanger;

a first submersible pump in the group of the purification devices is connected with the high-temperature constant-temperature water tank, and the outlet of another group of heat exchange tubes in the heat exchanger in the group of the purification devices is connected with the high-temperature constant-temperature water tank;

and the first submersible pump in the other group of the purification devices is connected with the low-temperature constant-temperature water tank, and the outlet of the other group of heat exchange tubes in the exchanger in the other group of the purification devices is connected with the low-temperature constant-temperature water tank. So that the high-temperature constant-temperature water tank and the low-temperature constant-temperature water tank are provided with independent purifying devices for purification. Purifier during operation takes the water in high temperature constant temperature water tank or the low temperature constant temperature water tank out through first immersible pump, and after heat exchanger and the water after RO reverse osmosis water purifier purifies carried out the heat exchange, the water in high temperature constant temperature water tank or the low temperature constant temperature water tank gets into and treats the purifying water pond, will treat the water in the purifying water pond and squeeze into RO reverse osmosis water purifier through the second immersible pump and evolve, and the water after RO reverse osmosis water purifier evolves gets into in high temperature constant temperature water tank or the low temperature constant temperature water tank after the interchanger carries out the heat exchange.

The horizontal migration mechanism is including fixing guide rail and thrust cylinder on the base, high temperature constant temperature water tank with the bottom sliding connection of low temperature constant temperature water tank the guide rail, thrust cylinder's telescopic link is connected respectively high temperature constant temperature water tank's bottom low temperature constant temperature water tank's bottom, thrust cylinder's telescopic link is flexible to be driven high temperature constant temperature water tank with low temperature constant temperature water tank is in horizontal sliding motion on the guide rail.

The sucker device comprises a sucker shell with an inverted T-shaped longitudinal section, wherein a vertical section of the sucker shell is of a hollow cylindrical structure, a transverse section of the sucker shell is of a disc structure with an open bottom surface, a disc-shaped sucker surface is arranged in the transverse section of the sucker shell, the bottom surface of the sucker surface is flush with that of the transverse section of the sucker shell, a plurality of sucker cylinders are arranged on the sucker surface, a cylinder piston is arranged in each sucker cylinder, each cylinder piston is connected with a pressing handle shaft, and the pressing handle shaft is arranged in the sucker shell and extends out of the top of the sucker shell through the vertical section of the sucker shell;

a ring-shaped handle is sleeved outside the vertical section of the sucker shell and the extending part of the pressing handle shaft, a circle of limiting bulges are arranged on the inner wall of the handle, a circle of limiting flange is arranged on the upper outer surface of the extending part of the pressing handle shaft, a pressure spring is wound on the outer surface of the extending part of the pressing handle shaft and is positioned between the top of the vertical section of the sucker shell and the limiting flange, and the limiting flange of the pressing handle shaft is limited below the limiting bulges;

the outer surface of the vertical section of the sucker shell is also provided with a clamping structure for clamping the pressurizing clamping groove. The handle shaft is pressed at the handle, the cylinder piston enters the sucker cylinder, air in the sucker cylinder is compressed, the handle shaft is pressed at the handle, the cylinder piston moves in the sucker cylinder, and the quartz plate for the semiconductor can be sucked by the pressure reduction of the sucker cylinder.

The inner wall of the handle is provided with internal threads from bottom to top, and the outer surface of the vertical section of the sucker shell and the outer surface of the extending part of the pressing handle shaft are respectively provided with external threads connected with the internal threads in a threaded mode.

The outer surface of the vertical section of the sucker shell is provided with a circle of first flange, the top of the first flange is provided with a circle of second flange, the bottom surface of the first flange is connected with the horizontal section of the sucker shell, and the handle is arranged above the second flange;

the circumferential surface of the second flange is provided with at least one bulge for clamping the pressurizing clamping groove, the pressurizing clamping groove comprises a circular pressurizing through groove communicated from top to bottom, the circumferential surface of the inner wall of the pressurizing through groove is provided with at least one pressurizing bayonet in an outward digging manner, the length and the width of the pressurizing bayonet are larger than those of the bulge, the diameter of the second flange is smaller than that of the pressurizing through groove, and the outer diameter of the transverse section of the sucker shell is larger than that of the pressurizing through groove;

the first flange, the second flange and the protrusion form the clamping structure. So that the sucking disc shell can aim at the pressurization draw-in groove from pressurization basket below and go up the card and go into behind the pressurization draw-in groove, rotate the sucking disc shell and make the protruding card on the second flange on the bottom surface of pressurization draw-in basket, and under the restriction of the horizontal segment of sucking disc shell, the sucking disc device card is on the pressurization draw-in groove.

The distance from the top surface of the transverse section of the sucker shell to the bottom surface of the second flange is greater than the thickness of the pressurizing clamping groove. So that the pressurizing lifting basket and the sucker device are provided with a buffer gap on the premise of clamping.

The sucking disc shell is the sucking disc shell that adopts the aluminum alloy material, the sucking disc face is the sucking disc face that adopts aluminum alloy superficial layer parcel polyurethane piece, the bottom surface of aluminum alloy superficial layer is equipped with a plurality of sucking disc holes, the sucking disc cylinder sets up in the polyurethane piece, the bottom surface UNICOM of cylinder piston the sucking disc hole.

The middle part of the inner bottom surface of the lifting basket is provided with the lifting basket clamping groove, and a positioning frame for sleeving the quartz bottom plate is arranged outside the lifting basket clamping groove;

the bottom surface of the lifting basket is provided with a plurality of water drainage holes communicated up and down, and the clamping groove of the lifting basket is also provided with a plurality of water drainage holes communicated up and down.

The semiconductor quartz substrate comprises a quartz substrate and is characterized in that a plurality of substrate holes are dug downwards on the top surface of the quartz substrate, a substrate cylinder is arranged in each substrate hole, an expansion piston is independently arranged in each substrate cylinder, absolute ethyl alcohol is arranged in a cylinder body of each expansion piston, when the expansion pistons are heated, the volume of the absolute ethyl alcohol expands to push the expansion pistons to move, the expansion pistons compress the volume of the substrate cylinders, after the expansion pistons are cooled, the volume of the absolute ethyl alcohol is reduced to drive the expansion pistons to move, the volume of the substrate cylinders is increased, and when the substrate holes are plugged by the quartz plates for semiconductors, the substrate cylinders form a vacuum environment, so that the quartz plates for semiconductors are adsorbed on the quartz substrate.

The polishing and disc loading method for the quartz plate for the semiconductor comprises the following steps:

setting the water temperature in a high-temperature constant-temperature water tank to be a first preset temperature, setting the water temperature in a low-temperature constant-temperature water tank to be a second preset temperature, raising a lifting basket, raising a pressurizing lifting basket, moving the high-temperature constant-temperature water tank to the position below the lifting basket, placing a quartz bottom plate in a lifting basket clamping groove of the lifting basket bottom plate, and sleeving a positioning frame on the quartz bottom plate;

after a pressing handle shaft on the sucker device is pressed down, the pressing handle shaft is contacted with a quartz plate for a semiconductor to be hung on the plate, the pressing handle shaft is loosened, the quartz plate for the semiconductor is sucked up, and the sucker device with the quartz plate for the semiconductor is clamped into a pressurizing clamping groove below the pressurizing basket;

immersing a quartz bottom plate in the lifting basket into a high-temperature constant-temperature water tank by using a lifting cylinder, wherein the sucker device is not in contact with the water in the high-temperature constant-temperature water tank, and after the quartz bottom plate is heated for a first preset time, adjusting the pressure of a pressurizing cylinder to a first preset pressure value so that the pressurizing cylinder drives the quartz plate for the semiconductor on the sucker device to be in contact with the quartz bottom plate;

the lifting cylinder is used for driving the lifting basket to lift from the high-temperature constant-temperature water tank, the low-temperature constant-temperature water tank is moved to the position below the lifting basket, the lifting cylinder is used for driving the quartz bottom plate in the lifting basket to sink into the low-temperature constant-temperature water tank, after second preset time, the pressure of the pressurizing cylinder is adjusted to be a third preset pressure value, the third preset pressure value is smaller than the first preset pressure value, the pressurizing cylinder drives the pressurizing basket to lift, so that the pressurizing basket does not apply pressure to the sucking disc device any more, at the moment, the sucking disc device and the pressurizing basket have a buffer gap, the sucking disc device is not lifted, after a pressing handle shaft on the sucking disc device is pressed, the pressurizing cylinder is used for driving the sucking disc device to lift to leave the low-temperature constant-temperature water tank, and the sucking disc device automatically leaves the quartz plate for the semiconductor, and driving a lifting basket to lift from the low-temperature constant-temperature water tank by using a lifting cylinder, taking down the positioning frame, and taking down the quartz bottom plate which adsorbs the quartz plate for the semiconductor to polish.

The invention has the beneficial effects that:

(1) the utilization rate of water can be improved, heat can be recycled, and resource waste is reduced;

(2) the working environment of operators can be improved, and the potential safety hazard is reduced;

(3) the quartz bottom plate can be directly contacted with the quartz plate for the semiconductor, so that the polishing precision is improved;

(4) the plate loading device can realize plate loading of products with different specifications, improves the utilization rate of the tool clamp and reduces the production cost;

(5) the method is simple to operate, can be used for hanging the wafers on the quartz plates for the semiconductors needing to be hung simultaneously, is convenient to use, and has high efficiency and low cost.

Drawings

FIG. 1 is a schematic structural diagram of the present invention;

FIG. 2 is another schematic structural view of FIG. 1;

FIG. 3 is a schematic view of a lifting basket according to the present invention;

FIG. 4 is a schematic illustration of a position relationship of a lift basket and a pressurized basket of the present invention;

FIG. 5 is a schematic view of a pressurized basket according to the present invention;

FIG. 6 is a schematic view of a suction cup device according to the present invention;

FIG. 7 is a cross-sectional view of FIG. 6;

FIG. 8 is a schematic view of a structure of the quartz baseplate of the present invention;

FIG. 9 is a cross-sectional view A-A of FIG. 8;

FIG. 10 is a schematic view of one construction of the expansion piston of the present invention;

fig. 11 is an internal cross-sectional view of fig. 10.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific drawings.

Referring to fig. 1 and 2, the polishing upper plate device for the quartz plate for the semiconductor comprises a base 1, wherein a horizontal moving mechanism is arranged on the base 1, a high-temperature constant-temperature water tank 2 and a low-temperature constant-temperature water tank 3 are respectively arranged on the horizontal moving mechanism, and the horizontal moving mechanism drives the high-temperature constant-temperature water tank 2 and the low-temperature constant-temperature water tank 3 to horizontally move. Horizontal migration mechanism is including fixing guide rail 11 and thrust cylinder 12 on base 1, high temperature constant temperature water tank 2 and low temperature constant temperature water tank 3 set up side by side, and the equal sliding connection guide rail 11 in bottom of high temperature constant temperature water tank 2 and low temperature constant temperature water tank 3, the bottom of high temperature constant temperature water tank 2, the bottom of low temperature constant temperature water tank 3 are connected respectively to the telescopic link of thrust cylinder 12, the flexible horizontal sliding motion on guide rail 11 that drives high temperature constant temperature water tank 2 and low temperature constant temperature water tank 3 of the telescopic link of thrust cylinder 12.

Still include lifting basket 4, lifting basket 4 is installed in high temperature constant temperature water tank 2 and low temperature constant temperature water tank 3 top through lift cylinder 41, and lift cylinder 41 drives lifting basket 4 and is the elevating movement. Specifically, the housing of the lifting cylinder 41 is fixed to the horizontal section of an inverted L-shaped connecting rod, and the vertical section of the connecting rod is fixed to the base 1. The lifting piston of the lifting cylinder 41 is vertically arranged and the bottom of the lifting piston is fixed with the top of the lifting basket 4.

Referring to fig. 3, a lifting basket clamping groove 42 for placing the pressurizing lifting basket is arranged in the middle of the inner bottom surface of the lifting basket 4, and a positioning frame 43 for sleeving the quartz bottom plate is arranged outside the lifting basket clamping groove 42. A plurality of water drainage holes 44 which are communicated up and down are arranged on the bottom surface of the lifting basket 4, and a plurality of water drainage holes 44 which are communicated up and down are also arranged on the lifting basket clamping groove 42.

Referring to fig. 4, a pressurizing basket 5 is arranged on a lifting basket clamping groove 42 of the lifting basket 4, the pressurizing basket 5 is installed on the inner wall of the top of the lifting basket 4 through a pressurizing cylinder 51, the pressurizing cylinder 51 is provided with a pressure adjusting device, and the pressurizing cylinder 51 drives the pressurizing basket 5 to move up and down after adjusting pressure through the pressure adjusting device. Specifically, the shell of the pressurizing cylinder 51 is fixed on the inner wall of the middle part of the top of the lifting basket 4, and the pressurizing piston of the pressurizing cylinder 51 is vertically arranged and the bottom of the pressurizing piston is fixed with the top of the pressurizing lifting basket 5.

Referring to fig. 5, a pressurizing clamping groove is formed in the inner bottom surface of the pressurizing lifting basket 5, a sucker device 6 is clamped on the pressurizing clamping groove, the bottom surface of the sucker device 6 penetrates through the pressurizing clamping groove and then is located above the inner bottom surface of the lifting basket 4, and the bottom surface of the sucker device 6 is used for sucking a quartz plate 7 for a semiconductor. The pressurizing clamping groove comprises a circular pressurizing through groove 52 communicated up and down, and at least one pressurizing bayonet 53 is dug outwards on the circumferential surface of the inner wall of the pressurizing through groove 52.

Referring to fig. 6 and 7, the suction cup device 6 includes a suction cup housing 61 with an inverted T-shaped longitudinal section, a vertical section of the suction cup housing 61 is a hollow cylindrical structure, a horizontal section of the suction cup housing 61 is a disc structure with an open bottom surface, a disc-shaped suction cup surface 62 is arranged in the horizontal section of the suction cup housing 61, the bottom surface of the suction cup surface 62 is flush with the bottom surface of the horizontal section of the suction cup housing 61, a plurality of suction cup cylinders 63 are arranged on the suction cup surface 62, a cylinder piston 64 is installed in each suction cup cylinder 63, each cylinder piston 64 is connected with a pressing stem 65, and the pressing stem 65 is arranged in the suction cup housing 61 and extends out of the top of the suction cup housing 61 through the vertical section of the suction. The outer vertical section of the sucker shell 61 and the extending part of the pressing handle shaft 65 are sleeved with a circular ring-shaped handle 66, the inner wall of the handle 66 is provided with a circle of limiting bulges 661, the upper outer surface of the extending part of the pressing handle shaft 65 is provided with a circle of limiting flanges 651, the outer surface of the extending part of the pressing handle shaft 65 is wound with a pressure spring 67, the pressure spring 67 is positioned between the top of the vertical section 61 of the sucker shell and the limiting flanges 651, and the limiting flanges 651 of the pressing handle shaft 65 are limited below the limiting bulges 661. An internal thread is arranged on the inner wall of the handle 66 from bottom to top, and external threads connected with the internal thread are respectively arranged on the outer surface of the vertical section of the sucker shell 61 and the outer surface of the extending part of the pressing handle shaft 65, so that the pressure spring 67 is convenient to mount in a threaded connection mode. The pressing stem 65 at the handle 66 is pressed, the cylinder piston 64 enters the chuck cylinder 63, the air in the chuck cylinder 63 is compressed, the pressing stem 65 at the handle 66 is released, the cylinder piston 64 moves in the chuck cylinder 63, and the chuck cylinder 63 is reduced in pressure to chuck the semiconductor quartz plate 7.

Referring to fig. 6 and 7, the outer surface of the vertical section of the suction cup shell 61 is further provided with a clamping structure for clamping the pressurizing clamping groove. The snap-fit structure includes a first flange 681, a second flange 682, and a projection 683. The outer surface of the vertical section of the sucker housing 61 is provided with a circle of first flanges 681, the top of the first flanges 681 is provided with a circle of second flanges 682, the bottom surface of the first flanges 681 is connected with the horizontal section of the sucker housing 61, and the handle 66 is arranged above the second flanges 682. At least one protrusion 683 for being clamped with the pressure clamping groove is arranged on the circumferential surface of the second flange 682, and as shown in fig. 6, three protrusions 683 are arranged on the circumferential surface of the second flange 682. The length and width of the pressurizing bayonet 53 is greater than the length and width of the protrusion 683, the diameter of the second flange 682 is smaller than the diameter of the pressurizing through groove 52, and the outer diameter of the transverse section of the suction cup housing 61 is greater than the diameter of the pressurizing through groove 52. So that the sucker housing 61 can be aligned with the pressurizing clamping groove from the lower side of the pressurizing basket 5 and clamped into the pressurizing clamping groove upwards, the sucker housing 61 is rotated to clamp the protrusion 683 on the second flange 682 on the bottom surface of the pressurizing basket 5, and the sucker device 6 is clamped on the pressurizing clamping groove under the limitation of the transverse section of the sucker housing 61. Preferably, the distance from the top surface of the transverse section of the suction cup housing 61 to the bottom surface of the second flange 682 is greater than the thickness of the pressure slot. So that the pressurizing lifting basket 5 and the suction cup device 6 are provided with a buffer gap on the premise of clamping.

The sucking disc shell 61 is the sucking disc shell 61 that adopts the aluminum alloy material, and sucking disc face 62 is the sucking disc face 62 that adopts aluminum alloy superficial layer parcel polyurethane piece, and the bottom surface of aluminum alloy superficial layer is equipped with a plurality of sucking disc holes, and sucking disc cylinder 63 sets up in the polyurethane piece, the bottom surface UNICOM sucking disc hole of cylinder piston 64.

Referring to fig. 8 to 11, a plurality of bottom plate holes 81 are dug downwards on the top surface of the quartz bottom plate 8, a bottom plate cylinder 82 is arranged in each bottom plate hole 81, an expansion piston 83 is independently arranged in each bottom plate cylinder 82, absolute ethyl alcohol 84 is arranged in a cylinder body of the expansion piston 83, as shown in fig. 10, a filling opening is arranged on the surface of the cylinder body and communicated with the inside and the outside of the cylinder body, a filling sealing plug is arranged on the filling opening to plug the filling opening, and the absolute ethyl alcohol 84 is filled in the cylinder body by opening the filling sealing plug. When the expansion piston 83 is heated, the volume of the absolute ethyl alcohol 84 expands to push the expansion piston 83 to move, the expansion piston 83 compresses the volume of the bottom plate cylinder 82, after the expansion piston 83 is cooled, the volume of the absolute ethyl alcohol 84 is reduced to drive the expansion piston 83 to move, the volume of the bottom plate cylinder 82 is increased, when the bottom plate hole 81 is blocked by the semiconductor quartz plate 7, the bottom plate cylinder 82 forms a vacuum environment, and then the semiconductor quartz plate 7 is adsorbed on the quartz bottom plate 8. As shown in fig. 11, the structure of the suction cup cylinder 63 in the suction cup surface 62 of the present invention is similar to that of the bottom plate cylinder 82, except that the cylinder body of the cylinder piston 64 corresponding to the suction cup cylinder 63 is not filled with absolute ethyl alcohol 84, but is connected to the pressing stem 65 through the end of the cylinder piston 64, and the cylinder piston 64 is lifted up and down by pressing the pressing stem 65, thereby increasing or decreasing the volume of the suction cup cylinder 63 corresponding to the cylinder piston 64.

Referring to fig. 1 and 2, two groups of purification devices are further arranged on the bottom plate, each group of purification devices comprises a water tank 91 to be purified, an RO reverse osmosis water purifier 92, a heat exchanger 93, a first submersible pump 94 and a second submersible pump 95, the first submersible pump 94 is connected with an inlet of a group of heat exchange tubes in the heat exchanger 93, an outlet of a group of heat exchange tubes in the heat exchanger 93 is connected with the water tank 91 to be purified, the water tank 91 to be purified is connected with an inlet of the RO reverse osmosis water purifier 92 through the second submersible pump 95, and an outlet of the RO reverse osmosis water purifier 92 is connected with an inlet of another. Wherein, the first submersible pump 94 in one group of purification devices is connected with the high-temperature constant-temperature water tank 2, and the outlet of the other group of heat exchange tubes in the heat exchanger 93 in one group of purification devices is connected with the high-temperature constant-temperature water tank 2. The first submersible pump 94 in the other group of purification devices is connected with the low-temperature constant-temperature water tank 3, and the outlet of the other group of heat exchange tubes in the exchangers in the other group of purification devices is connected with the low-temperature constant-temperature water tank 3. So that the high-temperature constant-temperature water tank 2 and the low-temperature constant-temperature water tank 3 are both provided with independent purification devices for purification. The purifier during operation, take the water in high temperature constant temperature water tank 2 or the low temperature constant temperature water tank 3 out through first immersible pump 94, after heat exchanger 93 carries out the heat exchange with the water after RO reverse osmosis water purifier 92 purifies, get into the water in high temperature constant temperature water tank 2 or the low temperature constant temperature water tank 3 and treat purifying water tank 91, will treat that the water in purifying water tank 91 squeezes into RO reverse osmosis water purifier 92 through second immersible pump 95 and evolve, the water after RO reverse osmosis water purifier 92 evolves carries out the heat exchange through the interchanger and then gets into in high temperature constant temperature water tank 2 or the low temperature constant temperature water tank 3.

The polishing and disc loading method for the quartz plate for the semiconductor comprises the following steps:

and S1, setting the water temperature in the high-temperature constant-temperature water tank 2 to be a first preset temperature, and setting the water temperature in the low-temperature constant-temperature water tank 3 to be a second preset temperature. Lifting the lifting basket 4, lifting the pressurizing lifting basket 5, moving the high-temperature constant-temperature water tank 2 to the position below the lifting basket 4, placing the quartz bottom plate 8 in a lifting basket clamping groove 42 of the bottom plate of the lifting basket 4, and sleeving the quartz bottom plate 8 with a positioning frame 43.

Wherein the first preset temperature is preferably 50 ℃ and the second preset temperature is preferably 25 ℃.

S2, the pressing stem 65 of the suction cup device 6 is pressed down and brought into contact with the quartz plate 7 for semiconductor to be mounted on the tray, the pressing stem 65 is released, the quartz plate 7 for semiconductor is sucked up, and the suction cup device 6 with the quartz plate 7 for semiconductor sucked thereon is engaged with the lower pressing groove of the pressing basket 5.

S3, immersing the quartz bottom plate 8 in the lifting basket 4 into the high-temperature constant-temperature water tank 2 by using the lifting cylinder 41, enabling the sucker device 6 not to contact with water in the high-temperature constant-temperature water tank 2, adjusting the pressure of the pressurizing cylinder 51 to be a first preset pressure value after the quartz bottom plate 8 is heated for a first preset time, enabling the pressurizing cylinder 51 to drive the quartz plate 7 for the semiconductor on the sucker device 6 to contact with the quartz bottom plate 8, and adjusting the pressure of the pressurizing cylinder 51 to be a second preset pressure value after the quartz bottom plate 8 is contacted, wherein the first preset pressure value is smaller than the second preset pressure value. So that the quartz plate 7 for semiconductor is pressed against the quartz base plate 8.

Wherein, the first preset time is preferably 3 minutes, the first preset pressure value is preferably 0.1MPa, and the second preset pressure value is preferably 0.3 MPa.

S4, using the lifting cylinder 41 to drive the lifting basket 4 to lift from the high temperature constant temperature water tank 2, moving the low temperature constant temperature water tank 3 to the lower part of the lifting basket 4, using the lifting cylinder 41 to drive the quartz bottom plate 8 in the lifting basket 4 to sink into the low temperature constant temperature water tank 3, after a second preset time, adjusting the pressure of the pressurizing cylinder 51 to be a third preset pressure value, wherein the third preset pressure value is smaller than the first preset pressure value, the pressurizing cylinder 51 drives the pressurizing basket 5 to lift, so that the pressurizing basket 5 does not apply pressure to the sucker device 6 any more, at the moment, the sucker device 6 is not lifted because of a buffer gap with the pressurizing basket 5, after pressing the pressing handle shaft 65 on the sucker device 6, using the pressurizing cylinder 51 to drive the sucker device 6 to lift away from the low temperature constant temperature water tank 3, the sucker device 6 automatically leaves the quartz plate 7 for semiconductor, using the lifting cylinder 41 to drive the constant temperature lifting basket 4 to lift from the low temperature constant temperature water tank 3, the positioning frame 43 is removed, and the quartz base plate 8 having adsorbed the quartz plate 7 for semiconductor is removed and polished.

Wherein, the second preset time is preferably 5 minutes, and the third preset pressure value is preferably 0.05 MPa.

After polishing is finished and in the process of dishing, a quartz bottom plate 8 for adsorbing a quartz plate 7 for the semiconductor is placed in a lifting basket clamping groove 42 of a lifting basket 4, the lifting basket 4 is placed in a high-temperature constant-temperature water tank 2 to be soaked for a third preset time, and then the quartz plate 7 for the semiconductor is sucked out manually by using a sucking disc device 6. Among them, the third preset time is preferably 2 minutes.

The specification of the quartz substrate 8 of the invention can be adjusted according to the specification parameters of the semiconductor quartz plate 7 product, and since the substrate holes 81 on the quartz substrate 8 are relatively independent, the quartz substrate 8 can be used as a substrate tool for a slightly small and special-shaped semiconductor quartz plate 7. The setting temperature of the water temperature in the high temperature constant temperature water tank 2, the setting temperature of the water temperature in the low temperature constant temperature water tank 3, and the pressurizing pressure at different stages of the pressurizing cylinder 51 according to the present invention may be set in advance in accordance with the specification parameters of the semiconductor quartz plate 7. The set temperature of the water in the high temperature constant temperature water tank 2 and the set temperature of the water in the low temperature constant temperature water tank 3 can be automatically adjusted by the heat exchangers 93 in the two groups of purification devices.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.