阅读说明：本技术 头芯片、液体喷射头以及液体喷射记录装置 (Head chip, liquid ejecting head, and liquid ejecting recording apparatus ) 是由 平田雅一 久保田禅 山村祐树 蓝知季 于 2020-11-27 设计创作，主要内容包括：本发明提供能够抑制头芯片的制造成本同时谋求消耗电力的降低和印刷画质的提高的头芯片等。本公开的一个实施方式所涉及的头芯片具备：促动器板,具有多个吐出槽和多个电极；喷嘴板,具有多个喷嘴孔；以及盖板,具有壁部、第一贯通孔以及第二贯通孔。多个喷嘴孔包括：多个第一喷嘴孔,向第一贯通孔侧偏离而配置；和多个第二喷嘴孔,向第二贯通孔侧偏离而配置。在与第一喷嘴孔连通的第一吐出槽中,与第一贯通孔连通的部分的第一截面积比与第二贯通孔连通的部分的第二截面积更小。电极中的沿着吐出槽的延伸方向的两端的位置分别在沿着既定方向的多个电极中相互对齐。(The invention provides a head chip and the like which can reduce the manufacturing cost of the head chip and simultaneously seek the reduction of the power consumption and the improvement of the printing image quality. A head chip according to an embodiment of the present disclosure includes: an actuator plate having a plurality of discharge grooves and a plurality of electrodes; a nozzle plate having a plurality of nozzle holes; and a cover plate having a wall portion, a first through hole, and a second through hole. The plurality of nozzle holes includes: a plurality of first nozzle holes that are disposed offset toward the first through hole; and a plurality of second nozzle holes that are arranged offset toward the second through hole. In the first ejection groove communicating with the first nozzle hole, a first cross-sectional area of a portion communicating with the first through hole is smaller than a second cross-sectional area of a portion communicating with the second through hole. The positions of both ends of the electrodes along the extending direction of the discharge groove are aligned with each other among the plurality of electrodes along the predetermined direction.)

1. A head chip for ejecting a liquid, comprising:

an actuator plate having: a plurality of discharge grooves arranged in parallel along a predetermined direction; and a plurality of electrodes provided individually on the side walls of the plurality of ejection grooves and extending in the extending direction of the ejection grooves;

a nozzle plate having a plurality of nozzle holes individually communicating with the plurality of discharge grooves; and

a cover plate having: a wall portion covering the discharge groove; a first through hole formed on one side of the wall portion along an extending direction of the discharge groove, and configured to allow the liquid to flow into the discharge groove; and a second through hole formed on the other side of the wall portion along the extending direction of the discharge groove and configured to allow the liquid to flow out from the discharge groove,

the plurality of nozzle holes includes:

a plurality of first nozzle holes that are disposed offset toward the first through hole in the extending direction of the discharge groove with respect to a center position of the discharge groove in the extending direction; and

a plurality of second nozzle holes that are disposed offset toward the second through hole side of the discharge groove in the extending direction with respect to a center position of the discharge groove in the extending direction,

in the first discharge groove which is the discharge groove communicating with the first nozzle hole, a first cross-sectional area which is a cross-sectional area of the flow path of the liquid in a portion communicating with the first through-hole is smaller than a second cross-sectional area which is a cross-sectional area of the flow path of the liquid in a portion communicating with the second through-hole,

in a second discharge groove which is the discharge groove communicating with the second nozzle hole, the second cross-sectional area is smaller than the first cross-sectional area,

the positions of both ends of the electrodes in the extending direction of the discharge groove are aligned with each other in the plurality of electrodes in the predetermined direction.

2. The head chip according to claim 1,

the electrode includes:

a first portion provided on the side wall of the discharge groove on the nozzle plate side; and

a second portion provided on the side wall of the discharge groove on the cover plate side,

a length of the second portion in an extending direction of the discharge groove is smaller than a length of the first portion in the extending direction of the discharge groove, and,

the positions of both ends of each of the first portion and the second portion in the extending direction of the discharge groove are aligned with each other in the plurality of electrodes in the predetermined direction.

3. The head chip according to claim 1 or claim 2,

a first expanding flow path portion that expands a third cross-sectional area, which is a cross-sectional area of a flow path of the liquid in the vicinity of the first nozzle hole, is formed in the vicinity of the first nozzle hole,

a second expanding flow path portion that expands a fourth cross-sectional area that is a cross-sectional area of a flow path of the liquid near the second nozzle hole is formed near the second nozzle hole,

a center position of the first expanding channel portion in an extending direction of the discharge groove coincides with a first center position as a center position of the first nozzle hole, or is shifted to the first through hole side in the extending direction of the discharge groove than the first center position,

a center position of the second expanding flow path portion in the extending direction of the discharge groove coincides with a second center position that is a center position of the second nozzle hole, or is shifted to the second through hole side along the extending direction of the discharge groove than the second center position.

4. The head chip according to claim 3,

further comprising an alignment plate disposed between the actuator plate and the nozzle plate and having a third through hole for aligning the nozzle hole for each nozzle hole,

the first expanded flow path portion and the second expanded flow path portion are each configured to include the third through hole in the alignment plate.

5. The head chip according to claim 1 or claim 2,

in the first discharge groove, a fifth cross-sectional area that is a cross-sectional area of the flow path of the liquid at a position corresponding to the wall surface of the wall portion on the first through hole side is smaller than a sixth cross-sectional area that is a cross-sectional area of the flow path of the liquid at a position corresponding to the wall surface of the wall portion on the second through hole side, and,

the sixth cross-sectional area is smaller than the fifth cross-sectional area in the second discharge groove.

6. A liquid ejecting head comprising the head chip according to any one of claims 1 to 5.

7. A liquid ejecting recording apparatus comprising the liquid ejecting head according to claim 6.

Technical Field

The present disclosure relates to a head chip, a liquid ejection head, and a liquid ejection recording apparatus.

Background

Liquid ejecting recording apparatuses including liquid ejecting heads are used in various fields, and various types of liquid ejecting heads have been developed as the liquid ejecting heads (see, for example, patent document 1). In addition, such a liquid ejecting head is provided with a head chip that ejects ink (liquid).

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-178209.

Disclosure of Invention

Problems to be solved by the invention

In such a head chip, it is generally required to improve print image quality by suppressing manufacturing cost and reducing power consumption. It is desirable to provide a head chip, a liquid ejecting head, and a liquid ejecting recording apparatus, which can reduce the manufacturing cost of the head chip and improve the print image quality while reducing the power consumption.

Means for solving the problems

A head chip according to an embodiment of the present disclosure includes: an actuator plate having a plurality of discharge grooves arranged in parallel in a predetermined direction, and a plurality of electrodes provided individually on side walls of the plurality of discharge grooves and extending in an extending direction of the discharge grooves; a nozzle plate having a plurality of nozzle holes individually communicating with the plurality of discharge grooves; and a cover plate having a wall portion covering the discharge groove, a first through-hole formed on one side of the wall portion along an extending direction of the discharge groove and configured to allow the liquid to flow into the discharge groove, and a second through-hole formed on the other side of the wall portion along the extending direction of the discharge groove and configured to allow the liquid to flow out from the discharge groove. The plurality of nozzle holes include: a plurality of first nozzle holes that are disposed offset toward a first through hole side of the ejection groove in the extending direction with reference to a center position of the ejection groove in the extending direction; and a plurality of second nozzle holes that are offset toward a second through hole side of the discharge groove in the extending direction with reference to a center position of the discharge groove in the extending direction. In the first discharge groove which is a discharge groove communicating with the first nozzle hole, a first cross-sectional area which is a cross-sectional area of a flow path of the liquid in a portion communicating with the first through hole is smaller than a second cross-sectional area which is a cross-sectional area of a flow path of the liquid in a portion communicating with the second through hole, and in the second discharge groove which is a discharge groove communicating with the second nozzle hole, the second cross-sectional area is smaller than the first cross-sectional area. Further, the positions of both ends of the electrodes in the extending direction of the ejection grooves are aligned with each other in the plurality of electrodes in the predetermined direction.

A liquid ejecting head according to an embodiment of the present disclosure includes a head chip according to an embodiment of the present disclosure.

A liquid ejecting recording apparatus according to an embodiment of the present disclosure includes the liquid ejecting head according to the embodiment of the present disclosure.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the head chip, the liquid ejecting head, and the liquid ejecting recording apparatus according to the embodiment of the present disclosure, it is possible to reduce power consumption and improve print image quality while suppressing the manufacturing cost of the head chip.

Drawings

Fig. 1 is a schematic perspective view showing a schematic configuration example of a liquid jet recording apparatus according to an embodiment of the present disclosure.

Fig. 2 is a schematic bottom view showing a configuration example of the liquid ejecting head in a state where the nozzle plate is detached.

Fig. 3 is a schematic diagram showing an example of a cross-sectional structure along the line III-III shown in fig. 2.

Fig. 4 is a schematic diagram showing an example of a cross-sectional structure along the line IV-IV shown in fig. 2.

Fig. 5 is a schematic diagram showing an example of a top-view configuration of the liquid ejecting head on the upper surface side of the cap plate shown in fig. 3 and 4.

Fig. 6 is a schematic diagram showing a top view configuration example of the vicinity of the end of the actuator plate shown in fig. 3 and 4.

Fig. 7 is a schematic diagram showing a detailed configuration example of the vicinity of the discharge passage in the cross-sectional configuration example shown in fig. 3 and 4.

Fig. 8 is a schematic view showing an example of a method of forming the common electrode shown in fig. 7.

Fig. 9 is a schematic bottom view showing a configuration example of a state in which the nozzle plate is detached from the liquid jet head according to comparative example 1.

Fig. 10 is a schematic diagram showing an example of a cross-sectional structure along the X-X line shown in fig. 9.

Fig. 11 is a schematic diagram showing an example of a cross-sectional configuration of the vicinity of a discharge channel in the liquid jet head according to comparative example 2.

Fig. 12 is a schematic diagram showing an example of a top-view configuration of the top surface side of the cap plate in the liquid jet head according to comparative example 3.

Fig. 13 is a schematic diagram showing a cross-sectional configuration example of the vicinity of a discharge channel in the liquid jet head according to comparative example 3.

Fig. 14 is a schematic diagram showing an example of a cross-sectional configuration of the liquid jet head according to modification 1.

Fig. 15 is a schematic diagram showing another example of the cross-sectional configuration of the liquid jet head according to modification 1.

Fig. 16 is a schematic diagram showing another example of the cross-sectional structure of the head chip shown in fig. 14 and 15.

Fig. 17 is a schematic cross-sectional view showing an example of a positional relationship between the nozzle hole and the extended channel portion according to modification 1 and the like.

Fig. 18 is a schematic cross-sectional view showing another example of the positional relationship between the nozzle hole and the extended channel portion according to modification 1 and the like.

Fig. 19 is a schematic cross-sectional view showing an example of a positional relationship between the nozzle hole and the extended channel portion according to modification example 2 and the like.

Fig. 20 is a schematic cross-sectional view showing another example of the positional relationship between the nozzle hole and the extended channel portion according to modification 2 and the like.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description is made in the following order.

1. Embodiment (example of the case where nozzle holes are arranged alternately and discharge grooves and common electrodes are arranged in a row)

2. Modification example

Modification 1 (example of case where an alignment plate having an expanded flow path portion is further provided)

Modification 2 (example of the case where the center position of the divergent channel section coincides with the center position of the nozzle hole)

3. Other modifications are possible.

< 1> embodiment >

[ A. integral Structure of Printer 1]

Fig. 1 schematically shows a schematic configuration example of a printer 1 as a liquid ejecting recording apparatus according to an embodiment of the present disclosure in a perspective view. The printer 1 is an ink jet printer that performs recording (printing) of images, characters, and the like on recording paper P as a recording medium with ink 9 described later. The recording medium is not limited to paper, and may be made of a material capable of being recorded, such as ceramic or glass.

As shown in fig. 1, the printer 1 includes a pair of transport mechanisms 2a and 2b, an ink tank 3, an inkjet head 4, a circulation flow path 50, and a scanning mechanism 6. These components are accommodated in a frame 10 having a predetermined shape. In the drawings used in the description of the present specification, the scale of each member is appropriately changed so that each member can be recognized.

Here, the printer 1 corresponds to a specific example of the "liquid ejecting recording apparatus" in the present disclosure, and the inkjet heads 4 (the inkjet heads 4Y, 4M, 4C, and 4K described later) correspond to a specific example of the "liquid ejecting head" in the present disclosure. The ink 9 corresponds to a specific example of "liquid" in the present disclosure.

As shown in fig. 1, the transport mechanisms 2a and 2b are each a mechanism for transporting the recording paper P along the transport direction d (X-axis direction). These conveying mechanisms 2a and 2b respectively include a grid roller 21, a pinch roller 22, and a drive mechanism (not shown). The driving mechanism is a mechanism for rotating the grid roller 21 around the axis (rotating in the Z-X plane), and is constituted by a motor or the like, for example.

(ink tank 3)

The ink tank 3 is a tank that accommodates the ink 9 therein. As the ink tanks 3, in this example, as shown in fig. 1, four types of tanks that individually contain four colors of ink 9 of yellow (Y), magenta (M), cyan (C), and black (K) are provided. That is, an ink tank 3Y containing yellow ink 9, an ink tank 3M containing magenta ink 9, an ink tank 3C containing cyan ink 9, and an ink tank 3K containing black ink 9 are provided. These ink tanks 3Y, 3M, 3C, and 3K are arranged in parallel along the X-axis direction in the housing 10.

The ink tanks 3Y, 3M, 3C, and 3K have the same configuration except for the color of the ink 9 contained therein, and will be collectively described as the ink tank 3 hereinafter.

(ink-jet head 4)

The inkjet head 4 is a head that ejects (discharges) droplet-shaped ink 9 from a plurality of nozzles (nozzle holes H1, H2) described later onto a recording sheet P to perform recording (printing) of images, characters, and the like. As this inkjet head 4, as shown in fig. 1 in this example, four heads that individually eject the four color inks 9 contained in the ink tanks 3Y, 3M, 3C, and 3K described above are also provided. That is, an ink jet head 4Y that ejects yellow ink 9, an ink jet head 4M that ejects magenta ink 9, an ink jet head 4C that ejects cyan ink 9, and an ink jet head 4K that ejects black ink 9 are provided. These ink jet heads 4Y, 4M, 4C, and 4K are arranged in parallel along the Y axis direction in the housing 10.

Since the inkjet heads 4Y, 4M, 4C, and 4K have the same configuration except for the color of the ink 9 used, they will be collectively described as the inkjet head 4 hereinafter. Further, a detailed configuration example of the ink jet head 4 will be described later (fig. 2 to 6).

(circulation flow path 50)

As shown in fig. 1, the circulation channel 50 has channels 50a and 50 b. The flow path 50a is a portion that reaches the inkjet head 4 from the ink tank 3 via a liquid feed pump (not shown). The flow path 50b is a portion that reaches the ink tank 3 from the inkjet head 4 via a liquid feed pump (not shown). In other words, the flow path 50a is a flow path through which the ink 9 flows from the ink tank 3 toward the inkjet head 4. The flow path 50b is a flow path through which the ink 9 flows from the inkjet head 4 to the ink tank 3.

As described above, in the present embodiment, the ink 9 circulates between the inside of the ink tank 3 and the inside of the ink jet head 4. The flow paths 50a and 50b (supply pipes for the ink 9) are each formed of, for example, a flexible hose having flexibility.

(scanning mechanism 6)

The scanning mechanism 6 is a mechanism for scanning the inkjet head 4 in the width direction (Y-axis direction) of the recording paper P. As shown in fig. 1, the scanning mechanism 6 includes: a pair of guide rails 61a, 61b extending in the Y-axis direction; a carriage 62 movably supported on these guide rails 61a, 61 b; and a drive mechanism 63 that moves the carriage 62 in the Y-axis direction.

The drive mechanism 63 includes: a pair of pulleys 631a and 631b disposed between the guide rails 61a and 61 b; an endless belt 632 wound around the pulleys 631a and 631 b; and a drive motor 633 for rotationally driving the pulley 631 a. The four ink jet heads 4Y, 4M, 4C, and 4K are arranged in parallel along the Y axis direction on the carriage 62.

The scanning mechanism 6 and the transport mechanisms 2a and 2b constitute a moving mechanism for relatively moving the inkjet head 4 and the recording paper P. Further, the moving mechanism is not limited to this type, and may be, for example, the following type (so-called "single pass type"): the inkjet heads 4 are fixed while only the recording medium (recording paper P) is moved, so that the inkjet heads 4 and the recording medium are moved differently.

[ detailed Structure of ink-jet head 4 ]

Next, a detailed configuration example of the ink jet head 4 (head chip 41) will be described with reference to fig. 2 to 6 in addition to fig. 1.

Fig. 2 schematically shows an example of the structure of the ink-jet head 4 in a state where the nozzle plate 411 is removed (appearing later) in a bottom view (X-Y bottom view). Fig. 3 schematically shows an example of the cross-sectional structure (an example of the Y-Z cross-sectional structure) of the ink-jet head 4 along the line III-III shown in fig. 2. Similarly, fig. 4 schematically shows an example of the cross-sectional structure (an example of the Y-Z cross-sectional structure) of the ink-jet head 4 along the line IV-IV shown in fig. 2. Fig. 5 schematically shows a top view configuration example (X-Y top view configuration example) of the inkjet head 4 on the upper surface side of the cap 413 (appearing later) shown in fig. 3 and 4. Fig. 6 schematically shows an example of a top-view configuration (X-Y plane configuration) of the actuator plate 412 (shown later) shown in fig. 3 and 4 in the vicinity of the end portion along the Y-axis direction.

Note that, in fig. 3 to 6, for convenience, the discharge channel C1e and the nozzle hole H1 which are arranged corresponding to the nozzle row An1 described later among the discharge channels C1e and C2e described later and the nozzle holes H1 and H2 described later are representatively illustrated. That is, the discharge channel C2e and the nozzle hole H2 arranged corresponding to the nozzle row An2 described later have the same configuration, and therefore, illustration thereof is omitted.

The ink jet head 4 of the present embodiment is a so-called side shooter type ink jet head that ejects ink 9 from a central portion in the extending direction (Y axis direction) of a plurality of channels (a plurality of channels C1 and a plurality of channels C2) in a head chip 41 described later. The ink jet head 4 is a circulation type ink jet head that circulates the ink 9 between the ink tank 3 and the circulation flow path 50.

As shown in fig. 3 and 4, the inkjet head 4 includes a head chip 41. The ink jet head 4 is provided with a circuit board and a Flexible Printed Circuit (FPC) as a control means (a means for controlling the operation of the head chip 41) which is not shown.

The circuit board is a board on which a drive circuit (electric circuit) for driving the head chip 41 is mounted. The flexible printed board is a board for electrically connecting a drive circuit on the circuit board and a drive electrode Ed to be described later in the head chip 41. In such a flexible printed circuit board, a plurality of lead electrodes are printed and wired.

As shown in fig. 3 and 4, the head chip 41 is a member for ejecting the ink 9 in the Z-axis direction, and is configured using various kinds of plates. Specifically, as shown in fig. 3 and 4, the head chip 41 mainly includes a nozzle plate (ejection orifice plate) 411, an actuator plate 412, and a cover plate 413. The nozzle plate 411, the actuator plate 412, and the cover plate 413 are bonded to each other using, for example, an adhesive, and are stacked in this order along the Z-axis direction. In the following description, the cover 413 side is referred to as an upper side and the nozzle plate 411 side is referred to as a lower side along the Z-axis direction.

(nozzle plate 411)

The nozzle plate 411 is made of a film material such as polyimide having a thickness of, for example, about 50 μm, and is bonded to the lower surface of the actuator plate 412 as shown in fig. 3 and 4. However, the material of the nozzle plate 411 is not limited to a resin material such as polyimide, and may be, for example, a metal material.

As shown in fig. 2, two nozzle rows (nozzle rows An1, An2) extending in the X-axis direction are provided in the nozzle plate 411. These nozzle rows An1, An2 are arranged at predetermined intervals along the Y axis direction. In this way, the ink jet head 4 (head chip 41) of the present embodiment is a two-line type ink jet head (head chip).

As will be described in detail later, the nozzle row An1 has a plurality of nozzle holes H1 formed in parallel at predetermined intervals in the X-axis direction. The nozzle holes H1 penetrate the nozzle plate 411 in the thickness direction (Z-axis direction), and communicate with the discharge channel C1e of the actuator plate 412 described later, as shown in fig. 3 and 4, for example. The formation pitch of the nozzle holes H1 in the X-axis direction is the same as (the same pitch as) the formation pitch of the discharge channel C1e in the X-axis direction. As will be described later in detail, the ink 9 supplied from the discharge channel C1e is discharged (ejected) from the nozzle hole H1 in the nozzle row An 1.

As will be described in detail later, the nozzle row An2 similarly has a plurality of nozzle holes H2 formed in parallel at predetermined intervals in the X-axis direction. These nozzle holes H2 also penetrate the nozzle plate 411 in the thickness direction thereof and individually communicate with the inside of a discharge channel C2e in the actuator plate 412, which will be described later. The formation pitch of the nozzle holes H2 in the X axis direction is the same as the formation pitch of the discharge channel C2e in the X axis direction. As will be described later in detail, the ink 9 supplied from the discharge channel C2e is also discharged from the nozzle hole H2 in the nozzle row An 2.

As shown in fig. 2, the nozzle holes H1 in the nozzle row An1 and the nozzle holes H2 in the nozzle row An2 are arranged so as to be different from each other in the X-axis direction. Therefore, in the ink-jet head 4 of the present embodiment, the nozzle holes H1 in the nozzle row An1 and the nozzle holes H2 in the nozzle row An2 are arranged in a staggered manner (staggered arrangement). The nozzle holes H1 and H2 are tapered through holes each having a diameter that gradually decreases downward (see fig. 3 and 4).

Here, in the nozzle plate 411 of the present embodiment, as shown in fig. 2, among the plurality of nozzle holes H1 in the nozzle row An1, the nozzle holes H1 adjacent in the X-axis direction are arranged offset from each other along the extending direction (Y-axis direction) of the ejection channel C1 e. That is, the nozzle holes H1 in the nozzle row An1 are arranged in a staggered manner in the X-axis direction as a whole. Specifically, as shown in fig. 2, the plurality of nozzle holes H1 in the nozzle row An1 includes a plurality of nozzle holes H11 belonging to a nozzle row An11 extending in the X-axis direction, and a plurality of nozzle holes H12 belonging to a nozzle row An12 extending in the X-axis direction. The nozzle holes H11 are disposed offset toward the positive side in the Y-axis direction (the first supply slit Sin1 side described later) with respect to the center position of the discharge channel C1e in the extending direction (Y-axis direction). On the other hand, the nozzle holes H12 are disposed offset to the negative side in the Y-axis direction (the first discharge slit Sout1 side described later) with respect to the center position of the discharge channel C1e in the extending direction.

Similarly, in the nozzle plate 411, as shown in fig. 2, among the nozzle holes H2 in the nozzle row An2, the nozzle holes H2 adjacent in the X-axis direction are arranged offset from each other in the extending direction (Y-axis direction) of the discharge channel C2 e. That is, the nozzle holes H2 in the nozzle row An2 are arranged in a staggered manner in the X-axis direction as a whole. Specifically, as shown in fig. 2, the plurality of nozzle holes H2 in the nozzle row An2 includes a plurality of nozzle holes H21 belonging to a nozzle row An21 extending in the X-axis direction, and a plurality of nozzle holes H22 belonging to a nozzle row An22 extending in the X-axis direction. The nozzle holes H21 are disposed offset to the negative side (the second supply slit side described later) in the Y-axis direction with respect to the center position of the discharge channel C2e along the extending direction (Y-axis direction). On the other hand, the nozzle holes H22 are disposed offset to the positive side in the Y-axis direction (the second discharge slit side described later) with respect to the center position of the discharge channel C2e in the extending direction.

Further, details of the arrangement structures of the nozzle holes H1(H11, H12) and H2(H21, H22) will be described later.

(actuator plate 412)

The actuator plate 412 is a plate made of a piezoelectric material such as PZT (lead zirconate titanate). As shown in fig. 3 and 4, the actuator plate 412 is formed by laminating two piezoelectric substrates having different polarization directions in the thickness direction (Z-axis direction) (so-called chevron type). However, the structure of the actuator plate 412 is not limited to this chevron type. That is, for example, the actuator plate 412 may be configured by one (single) piezoelectric substrate in which the polarization direction is set unidirectionally along the thickness direction (Z-axis direction) (so-called cantilever type).

As shown in fig. 2, two rows of passage rows (passage rows 421 and 422) extending in the X-axis direction are provided in the actuator plate 412. These channel rows 421 and 422 are arranged at predetermined intervals along the Y-axis direction.

As shown in fig. 2, the actuator plate 412 has a discharge region (ejection region) for the ink 9 in a central portion (formation region of the channel rows 421 and 422) along the X-axis direction. On the other hand, in the actuator plate 412, non-discharge regions (non-ejection regions) of the ink 9 are provided at both end portions (non-formation regions of the channel rows 421, 422) in the X axis direction. The non-discharge region is located outside the discharge region in the X-axis direction. As shown in fig. 2, both ends of the actuator plate 412 in the Y-axis direction constitute tail portions 420, respectively.

The channel row 421 has a plurality of channels C1 as shown in fig. 2. These channels C1 extend in the Y-axis direction within the actuator plate 412 as shown in fig. 2. As shown in fig. 2, the passages C1 are arranged in parallel with each other at predetermined intervals in the X-axis direction. Each channel C1 is defined by a drive wall Wd formed of a piezoelectric body (actuator plate 412), and is a concave groove portion in a cross-sectional view taken along the Z-X direction.

The channel row 422 also has a plurality of channels C2 extending in the Y-axis direction, as shown in fig. 2. As shown in fig. 2, the passages C2 are arranged in parallel with each other at predetermined intervals in the X-axis direction. Each of the passages C2 is also defined by the above-described drive wall Wd, and is a concave groove portion in a cross-sectional view taken along the Z-X plane.

Here, as shown in fig. 2 to 6, in the channel C1, there are a discharge channel C1e (discharge groove) for discharging the ink 9 and a dummy channel C1d (non-discharge groove) for not discharging the ink 9. Each of the discharge channels C1e communicates with a nozzle hole H1 in the nozzle plate 411 (see fig. 3, 4, and 6), while each of the dummy channels C1d does not communicate with the nozzle hole H1 and is covered from below by the upper surface of the nozzle plate 411.

The plurality of discharge passages C1e are arranged in parallel so that at least a part of them overlap each other in the predetermined direction (X-axis direction), and particularly in the example of fig. 2, the entirety of the plurality of discharge passages C1e is arranged so as to overlap each other in the X-axis direction. As a result, as shown in fig. 2, the discharge passages C1e are arranged in a line in the X-axis direction as a whole. Similarly, the plurality of dummy channels C1d are arranged in parallel in the X-axis direction, and in the example of fig. 2, the entirety of the plurality of dummy channels C1d is arranged in a row in the X-axis direction. In the channel row 421, the discharge channels C1e and the dummy channels C1d are alternately arranged in the X-axis direction (see fig. 2).

As shown in fig. 2 to 4, the channel C2 includes a discharge channel C2e (discharge groove) for discharging the ink 9 and a dummy channel C2d (non-discharge groove) for not discharging the ink 9. Each of the discharge channels C2e communicates with the nozzle hole H2 in the nozzle plate 411, while each of the dummy channels C2d does not communicate with the nozzle hole H2 and is covered from below by the upper surface of the nozzle plate 411 (see fig. 3 and 4).

The plurality of discharge passages C2e are arranged in parallel so that at least a part of them overlap each other in the predetermined direction (X-axis direction), and particularly in the example of fig. 2, the entirety of the plurality of discharge passages C2e is arranged so as to overlap each other in the X-axis direction. As a result, as shown in fig. 2, the discharge passages C2e are arranged in a line in the X-axis direction as a whole. Similarly, the plurality of dummy channels C2d are arranged in parallel in the X-axis direction, and in the example of fig. 2, the entirety of the plurality of dummy channels C2d is arranged in a row in the X-axis direction. In the channel row 422, the discharge channels C2e and the dummy channels C2d are alternately arranged in the X-axis direction (see fig. 2).

The discharge passages C1e and C2e correspond to a specific example of the "discharge groove" in the present disclosure. The X-axis direction corresponds to a specific example of "predetermined direction" in the present disclosure, and the Y-axis direction corresponds to a specific example of "extending direction of discharge groove" in the present disclosure.

Here, as shown in fig. 2 to 4, the discharge passage C1e in the passage row 421 and the dummy passage C2d in the passage row 422 are arranged on a straight line along the extending direction (Y-axis direction) of the discharge passage C1e and the dummy passage C2 d. As shown in fig. 2, the dummy channel C1d in the channel row 421 and the discharge channel C2e in the channel row 422 are arranged on a straight line along the extending direction (Y-axis direction) of the dummy channel C1d and the discharge channel C2 e.

As shown in fig. 4, for example, each discharge passage C1e has an arc-shaped side surface in which the cross-sectional area of each discharge passage C1e gradually decreases from the cover plate 413 side (upper side) toward the nozzle plate 411 side (lower side). Similarly, each discharge passage C2e has an arc-shaped side surface in which the cross-sectional area of each discharge passage C2e gradually decreases from the cover plate 413 side toward the nozzle plate 411 side. The arcuate side surfaces of the discharge passages C1e and C2e are formed by cutting with a cutter, for example.

The detailed structure of the vicinity of the discharge path C1e (and the vicinity of the discharge path C2e) shown in fig. 3 and 4 will be described later.

As shown in fig. 3, 4, and 6, the drive wall Wd has drive electrodes Ed extending in the Y-axis direction on inner surfaces facing each other in the X-axis direction. The drive electrode Ed includes a common electrode (common electrode) Edc provided on an inner surface facing the discharge channels C1e, C2e and an individual electrode (active electrode) Eda provided on an inner surface facing the dummy channels C1d, C2 d. The driving electrodes Ed (the common electrode Edc and the individual electrode Eda) are formed on the inner surfaces of the driving walls Wd over the entire depth direction (Z-axis direction) (see fig. 3 and 4).

The pair of common electrodes Edc facing each other in the same discharge channel C1e (or the discharge channel C2e) are electrically connected to each other at a common terminal (common wiring) not shown. In addition, the pair of individual electrodes Eda facing each other within the same dummy channel C1d (or dummy channel C2d) are electrically isolated from each other. On the other hand, the pair of individual electrodes Eda facing each other through the discharge channel C1e (or the discharge channel C2e) are electrically connected to each other at individual terminals (individual wires) not shown.

Here, the flexible printed board for electrically connecting the driving electrodes Ed and the circuit board is mounted on the tail portion 420 (near the end portion of the actuator plate 412 in the Y-axis direction). A wiring pattern (not shown) formed on the flexible printed circuit board is electrically connected to the common wiring and the individual wiring. Thereby, a drive voltage is applied to each drive electrode Ed from the drive circuit on the circuit board via the flexible printed board.

In the tail portion 420 of the actuator plate 412, the end portions of the dummy channels C1d and C2d in the extending direction (Y-axis direction) are configured as follows.

That is, first, in the dummy passages C1d and C2d, one side thereof along the extending direction is an arc-shaped side surface in which the cross-sectional area of each dummy passage C1d and C2d is gradually reduced toward the nozzle plate 411 (see fig. 3 and 4). The arc-shaped side surfaces of the dummy channels C1d and C2d are also formed by cutting with a cutter, for example, in the same manner as the arc-shaped side surfaces of the discharge channels C1e and C2 e. On the other hand, in the dummy passages C1d, C2d, the other sides thereof in the extending direction (tail 420 side) are opened up to the end in the Y-axis direction in the actuator plate 412 (see symbol P2 shown by broken lines in fig. 3, 4, and 6). As shown in fig. 3, 4, and 6, for example, the individual electrodes Eda arranged in the dummy channels C1d and C2d so as to face each other on both side surfaces in the X-axis direction also extend to the end portions in the Y-axis direction of the actuator plate 412.

Further, the machining slits SL shown in fig. 6 are respectively slits formed in the Y-axis direction so as to isolate the individual electrode Eda and the common electrode Edc on the surface of the actuator plate 412 from each other, and are formed, for example, as follows. That is, the processing slits SL are formed by, for example, predetermined laser processing when the actuator plate 412 is formed. In addition, the individual electrode Eda and the common electrode Edc include an individual electrode pad Pda and a common electrode pad Pdc (refer to fig. 6), respectively, which are pad portions electrically connected to these electrodes, respectively, and to the aforementioned flexible printed substrate. Between the common electrode pad Pdc and the individual electrode pad Pda, a groove D (see fig. 6) for separating these pads is formed by cutting with a cutter after the above-described predetermined laser processing.

(cover 413)

As shown in fig. 3 to 5, the cover 413 is arranged to close the passages C1 and C2 (the passage rows 421 and 422) in the actuator plate 412. Specifically, the cover plate 413 is bonded to the upper surface of the actuator plate 412 and has a plate-like structure.

As shown in fig. 3 to 5, the cover 413 is formed with a pair of inlet-side common channels Rin1 and Rin2, a pair of outlet-side common channels Rout1 and Rout2, and wall portions W1 and W2, respectively.

The wall portion W1 is disposed so as to cover the discharge passage C1e and the dummy passage C1d, and the wall portion W2 is disposed so as to cover the discharge passage C2e and the dummy passage C2d (see fig. 3 and 4).

The inlet-side common flow paths Rin1 and Rin2 and the outlet-side common flow paths Rout1 and Rout2 extend in the X-axis direction as shown in fig. 5, for example, and are arranged in parallel with each other at predetermined intervals in the X-axis direction. The inlet-side common flow path Rin1 and the outlet-side common flow path Rout1 are formed in regions of the actuator plate 412 corresponding to the channel row 421 (the plurality of channels C1) (see fig. 3 to 5). On the other hand, the inlet-side common flow path Rin2 and the outlet-side common flow path Rout2 are formed in regions of the actuator plate 412 corresponding to the passage row 422 (the plurality of passages C2) (see fig. 3 and 4).

The inlet-side common flow path Rin1 is formed in each of the channels C1 in the vicinity of the inner end (the side of the wall portion W1) in the Y-axis direction, and is formed as a concave groove portion (see fig. 3 to 5). In the inlet-side common flow path Rin1, a first supply slit Sin1 (see fig. 3 to 5) that penetrates the cap plate 413 in the thickness direction (Z-axis direction) is formed in a region corresponding to each discharge passage C1 e. Similarly, the inlet-side common flow path Rin2 is formed in the vicinity of the inner end (the side of the wall portion W1) of each channel C2 in the Y-axis direction, and is a concave groove portion (see fig. 3 and 4). In the inlet-side common flow path Rin2, second supply slits (not shown) that penetrate the cover 413 in the thickness direction thereof are also formed in regions corresponding to the discharge passages C2 e.

Note that each of the first supply slit Sin1 and the second supply slit corresponds to one specific example of the "first through hole" in the present disclosure.

The outlet-side common flow path Rout1 is formed in the vicinity of the outer end (the other side of the wall portion W1) of each channel C1 in the Y axis direction, and is a concave groove portion (see fig. 3 to 5). In the outlet-side common flow path Rout1, first discharge slits Sout1 (see fig. 3 to 5) penetrating the cap 413 in the thickness direction thereof are formed in regions corresponding to the respective discharge channels C1 e. Similarly, the outlet-side common flow path Rout2 is formed in the vicinity of the outer end (the other side of the wall portion W1) of each channel C2 in the Y-axis direction, and is a concave groove portion (see fig. 3 and 4). In the outlet-side common flow path Rout2, second discharge slits (not shown) penetrating the cover 413 in the thickness direction thereof are also formed in regions corresponding to the respective discharge channels C2 e.

Note that each of the first ejection slit Sout1 and the second ejection slit corresponds to a specific example of the "second through hole" in the present disclosure.

Here, as shown in fig. 5, for example, the first supply slit Sin1 and the first discharge slit Sout1 of each of the discharge channels C1e form a first slit pair Sp 1. In the first slit pair Sp1, a first supply slit Sin1 and a first discharge slit Sout1 are arranged in parallel along the extending direction (Y-axis direction) of the discharge channel C1 e. Similarly, a second slit pair (not shown) is formed by the second supply slit and the second discharge slit of each discharge passage C2 e. In the second slit pair, a second supply slit and a second discharge slit are arranged in parallel along the extending direction (Y-axis direction) of the discharge path C2 e.

In this way, the inlet-side common flow path Rin1 and the outlet-side common flow path Rout1 communicate with the discharge channels C1e via the first supply slit Sin1 and the first discharge slit Sout1, respectively (see fig. 3 to 5). That is, the inlet-side common flow path Rin1 is a common flow path communicating with each of the first supply slits Sin1 of each of the first slit pairs Sp1 described above, and the outlet-side common flow path Rout1 is a common flow path communicating with each of the first discharge slits Sout1 of each of the first slit pairs Sp1 (see fig. 5). The first supply slit Sin1 and the first discharge slit Sout1 are through holes through which the ink 9 flows between the discharge channel C1e and the supply slit Sin1, respectively. Specifically, as indicated by the broken-line arrows in fig. 3 and 4, the first supply slit Sin1 is a through hole for allowing the ink 9 to flow into the discharge channel C1e, and the first discharge slit Sout1 is a through hole for allowing the ink 9 to flow out of the discharge channel C1 e. On the other hand, in each dummy passage C1d, the inlet-side common flow path Rin1 and the outlet-side common flow path Rout1 are not all connected. Specifically, each dummy channel C1d is closed by the bottom of these inlet-side common flow path Rin1 and outlet-side common flow path Rout 1.

Similarly, the inlet-side common flow path Rin2 and the outlet-side common flow path Rout2 communicate with the discharge passages C2e through the second supply slit and the second discharge slit, respectively. That is, the inlet-side common flow path Rin2 is a common flow path communicating with each of the second supply slits of each of the second slit pairs described above, and the outlet-side common flow path Rout2 is a common flow path communicating with each of the second discharge slits of each of the second slit pairs. The second supply slit and the second discharge slit are through holes through which the ink 9 flows between the discharge channel C2e and the supply slit. Specifically, the second supply slit is a through hole for allowing the ink 9 to flow into the discharge channel C2e, and the second discharge slit is a through hole for allowing the ink 9 to flow out of the discharge channel C2 e. On the other hand, in each dummy passage C2d, the inlet-side common flow path Rin2 and the outlet-side common flow path Rout2 are not all connected (see fig. 3 and 4). Specifically, each dummy passage C2d is closed by the bottom of the inlet-side common flow path Rin2 and the outlet-side common flow path Rout2 (see fig. 3 and 4).

[ detailed structures of the discharge channels C1e and C2e in the vicinity thereof ]

Next, referring to fig. 2 to 5, the detailed structures of the nozzle holes H1 and H2 and the cap plate 413 in the vicinity of the discharge channels C1e and C2e will be described.

First, in the head chip 41 of the present embodiment, as described above, the plurality of nozzle holes H1 include two kinds of nozzle holes H11, H12, and the plurality of nozzle holes H2 also include two kinds of nozzle holes H21, H22 (see fig. 2).

Here, the center position Pn11 of each nozzle hole H11 is offset toward the positive side in the Y axis direction (the side of the first supply slit Sin 1) with respect to the center position Pc1 of the discharge channel C1e along the extending direction (Y axis direction) (i.e., the center position of the wall portion W1 along the Y axis direction) (see fig. 3 and 5). Similarly, the center position of each nozzle hole H21 is offset to the negative side (second supply slit side) in the Y axis direction with respect to the center position of the discharge channel C2e in the extending direction (Y axis direction) (i.e., the center position of the wall portion W2 in the Y axis direction) (see fig. 2).

On the other hand, the center position Pn12 of each nozzle hole H12 is offset to the negative side in the Y axis direction (the first discharge slit Sout1 side) with respect to the center position Pc1 of the discharge channel C1e along the extending direction (see fig. 4 and 5). Similarly, the center position of each nozzle hole H22 is offset toward the positive side (second discharge slit side) in the Y-axis direction with respect to the center position of the discharge channel C2e along the extending direction (Y-axis direction) (see fig. 2).

Therefore, in the discharge channel C1e (C1e1) communicating with each nozzle hole H11, the cross-sectional area of the flow path of the ink 9 at the portion communicating with the first supply slit Sin1 (first inlet side flow path cross-sectional area Sfin1) is smaller than the cross-sectional area of the flow path of the ink 9 at the portion communicating with the first discharge slit Sout1 (first outlet side flow path cross-sectional area Sfout1) (Sfin1< Sfout 1: refer to FIG. 3). Similarly, in the discharge channel C2e communicating with each nozzle hole H21, the cross-sectional area of the flow path of the ink 9 at the portion communicating with the second supply slit (the second inlet side flow path cross-sectional area Sfin2) is smaller than the cross-sectional area of the flow path of the ink 9 at the portion communicating with the second discharge slit (the second outlet side flow path cross-sectional area Sfout2) (Sfin2< Sfout 2).

On the other hand, in the discharge channel C1e (C1e2) communicating with each nozzle hole H12, the first outlet-side flow path sectional area Sfout1 is smaller than the first inlet-side flow path sectional area Sfin1 (Sfout1< Sfin 1: refer to FIG. 4). Similarly, in the discharge channel C2e communicating with the nozzle holes H22, the second outlet-side flow path cross-sectional area Sfout2 is smaller than the second inlet-side flow path cross-sectional area Sfin2 (Sfout2< Sfin 2).

In the discharge channel C1e1, the cross-sectional area of the flow path of the ink 9 at the position corresponding to the wall surface on the first supply slit Sin1 side of the wall W1 (wall surface position flow path cross-sectional area Sf5) is smaller than the cross-sectional area of the flow path of the ink 9 at the position corresponding to the wall surface on the first discharge slit Sout1 side of the wall W1 (wall surface position flow path cross-sectional area Sf6) (Sf5< Sf 6: see fig. 3). Similarly, in the discharge channel C2e communicating with each nozzle hole H21, the cross-sectional area of the flow path of the ink 9 at the position corresponding to the wall surface on the second supply slit side of the wall portion W2 (wall surface position flow path cross-sectional area Sf5) is smaller than the cross-sectional area of the flow path of the ink 9 at the position corresponding to the wall surface on the second discharge slit side of the wall portion W2 (wall surface position flow path cross-sectional area Sf 6).

On the other hand, in the discharge passage C1e2, the wall-surface-position flow-path cross-sectional area Sf6 is smaller than the wall-surface-position flow-path cross-sectional area Sf5 (Sf6< Sf 5: see fig. 4). Similarly, in the discharge channel C2e communicating with the nozzle holes H22, the wall surface position passage sectional area Sf6 is smaller than the wall surface position passage sectional area Sf 5.

In fig. 3 and 4, the end of the pump chamber is formed in a cut-and-raised shape at a position corresponding to one of the wall surface position flow path sectional areas Sf5 and Sf6, and the end of the pump chamber is formed in a straight shape at a position corresponding to the other. That is, as long as the magnitude relation of the wall surface position flow path sectional areas Sf5 and Sf6 is the above-described magnitude relation, for example, both end portions of the pump chamber may be in a cut-and-raised shape.

Here, the discharge channel C1e1 and the discharge channel C2e communicating with the nozzle hole H21 described above correspond to one specific example of the "first discharge groove" in the present disclosure. Similarly, the discharge channel C1e2 and the discharge channel C2e communicating with the nozzle hole H22 correspond to a specific example of the "second discharge groove" in the present disclosure. In addition, the first inlet side flow path sectional area Sfin1 and the second inlet side flow path sectional area each correspond to one specific example of the "first sectional area" in the present disclosure. Similarly, the first outlet side flow path sectional area Sfout1 and the second outlet side flow path sectional area correspond to one specific example of the "second sectional area" in the present disclosure. The wall surface position flow path cross-sectional area Sf5 described above corresponds to a specific example of the "fifth cross-sectional area" in the present disclosure. Similarly, the wall surface position flow path sectional area Sf6 described above corresponds to one specific example of the "sixth sectional area" in the present disclosure. Further, the center position Pn11 of the nozzle hole H11 and the center position of the nozzle hole H21 described above correspond to one specific example of the "first center position" in the present disclosure. Similarly, the center position Pn12 of the nozzle hole H12 and the center position of the nozzle hole H22 described above correspond to one specific example of the "second center position" in the present disclosure, respectively.

In the head chip 41, the first pump length Lw1 (see fig. 3 and 4) which is the distance between the first supply slit Sin1 and the first discharge slit Sout1 in the first slit pair Sp1 is the same for all the first slit pairs Sp1 (see fig. 5). Likewise, the second pump length, which is the distance between the second supply slit and the second discharge slit in the aforementioned second slit pair, is also the same for all the second slit pairs.

In the head chip 41, the relationship between the Y-axis direction length (first supply slit length Lin1) of the first supply slit Sin1 and the Y-axis direction length (first discharge slit length Lout1) of the first discharge slit Sout1 is alternately exchanged between the first slit pairs Sp1 adjacent in the X-axis direction (see fig. 5). That is, for example, in the case where the first slit pair Sp1 has a size relationship of (Lin1> Lout1), the first slit pairs Sp1 located on both sides of the first slit pair Sp1 adjacent to each other have a size relationship of (Lin1< Lout 1). For example, in the case where the first slit pair Sp1 has a size relationship of (Lin1< Lout1), the first slit pairs Sp1 located on both sides of the first slit pair Sp1 adjacent to each other have a size relationship of (Lin1> Lout1), respectively, in opposite directions.

Similarly, the magnitude relationship between the Y-axis direction length of the second supply slit (second supply slit length) and the Y-axis direction length of the second discharge slit (second discharge slit length) is also alternately exchanged between the pairs of second slits adjacent in the X-axis direction as described above.

In the head chip 41, the Y-axis direction length (first inlet-side flow path width Win1) of the inlet-side common flow path Rin1 is constant along the extending direction (X-axis direction) of the inlet-side common flow path Rin1 (see fig. 5). The length of the outlet-side common flow path Rout1 in the Y-axis direction (first outlet-side flow path width Wout1) is also constant along the extending direction (X-axis direction) of the outlet-side common flow path Rout1 (see fig. 5).

Similarly, the Y-axis direction length (second inlet-side flow path width) of the inlet-side common flow path Rin2 is also constant along the extending direction (X-axis direction) of the inlet-side common flow path Rin 2. The length of the outlet-side common flow path Rout2 in the Y-axis direction (second outlet-side flow path width) is also constant along the extending direction (X-axis direction) of the outlet-side common flow path Rout 2.

[ detailed Structure of common electrode Edc ]

Next, a detailed configuration example of the vicinity of the discharge channel C1e (C1e1, C1e2) (a detailed configuration example of the common electrode Ed) will be described with reference to fig. 7 and 8 in addition to fig. 3 and 4. Note that, the detailed configuration example of the common electrode Ed in the discharge channel C2e is the same as the detailed configuration example of the common electrode Ed in the discharge channel C1e (C1e1, C1e2) described below, and thus the description thereof is omitted.

Fig. 7 schematically shows a detailed configuration example of the vicinity of the discharge passage C1e in the cross-sectional configuration example shown in fig. 3 and 4. Specifically, fig. 7(a) and 7(B) show a detailed configuration example of the vicinity of the discharge passage C1e1 in the cross-sectional configuration example shown in fig. 3 and a detailed configuration example of the vicinity of the discharge passage C1e2 in the cross-sectional configuration example shown in fig. 4, respectively. Fig. 8 (fig. 8 a and 8B) schematically shows an example of a method for forming the common electrode Edc shown in fig. 7 a and 7B.

First, as shown in fig. 7 a and 7B, for example, in the ink jet head 4 (head chip 41) of the present embodiment, the positions of both ends of the common electrode Edc in the extending direction (Y axis direction) of the discharge path C1e are aligned with each other in the plurality of common electrodes Edc in the X axis direction. That is, as described above, in the discharge channels C1e1 and C1e2 in which the nozzle holes H11 and H12 are arranged offset from each other in the Y axis direction (staggered arrangement), the positions of both ends of the common electrode Edc are also matched and are not offset in the Y axis direction. In other words, in the plurality of discharge channels C1e arranged in parallel in the X-axis direction, the corresponding plurality of common electrodes Edc are arranged in a row in the X-axis direction (not in a staggered arrangement). The same applies to the arrangement of the common electrodes Edc in a row in the plurality of discharge channels C2e arranged in parallel in the X-axis direction.

Specifically, first, each common electrode Edc includes a first portion Edc1 provided on the side wall on the nozzle plate 411 side (lower side) and a second portion Edc2 provided on the side wall on the cap plate 413 side (upper side) in the discharge passages C1e, C2e (see fig. 7 a and 7B). The length (electrode length Le2) of the second portion Edc2 in the extending direction (Y axis direction) of the discharge passages C1e and C2e is smaller than the length (electrode length Le1) of the first portion Edc1 in the Y axis direction (Le2< Le 1). That is, each common electrode Edc has a two-stage configuration including such a first portion Edc1 and a second portion Edc 2. Further, the positions of both ends of each of these first and second portions Edc1 and Edc2 in the Y-axis direction are aligned with (coincide with) each other at the plurality of common electrodes Edc in the X-axis direction, respectively. That is, as shown in fig. 7(a) and 7(B), the end positions Pe1a, Pe1B in the first portion Edc1 are aligned with each other between the discharge passages C1e1, C1e2, respectively, and the end positions Pe2a, Pe2B in the second portion Edc2 are aligned with each other between the discharge passages C1e1, C1e2, respectively. The same applies to the points at which the positions of both ends of each of the first portion Edc1 and the second portion Edc2 are aligned, in the plurality of discharge passages C2e arranged in parallel in the X-axis direction.

Here, the first portion Edc1 described above corresponds to one specific example of the "first portion" in the present disclosure. The second portion Edc2 described above corresponds to one specific example of the "second portion" in the present disclosure.

The common electrode Edc including the first portion Edc1 and the second portion Edc2 can be formed by, for example, a method (a vacuum evaporation method based on oblique evaporation in two stages) shown in fig. 8(a) and 8 (B).

That is, first, as shown in fig. 8 a, for example, vacuum deposition is performed to form the first portion Edc1 in a state where the discharge passages C1e (C1e1, C1e2) in the actuator plate 412 are formed. Specifically, as shown in fig. 8(a), oblique vapor deposition is performed in a first stage at a predetermined angle in a vapor deposition direction Ev1 which is directed upward through an opening Ap1 located on the lower side of each of the discharge channels C1e1 and C1e 2. Thus, a first portion Edc1 having a length (the electrode length Le1) substantially equal to the width of the opening Ap1 is formed on the lower side in each of the discharge channels C1e1 and C1e 2.

Next, as shown in fig. 8B, for example, vacuum vapor deposition for forming the second portion Edc2 is performed using a mask M having a predetermined opening Ap2 (for example, rectangular shape). Specifically, as shown in fig. 8B, through the opening Ap2 of the mask M, the second-stage oblique vapor deposition is performed in the vapor deposition direction Ev2 directed downward (in the respective discharge channels C1e1 and C1e2) at a predetermined angle. Thus, a second portion Edc2 having a length (the electrode length Le2 described above) substantially equal to the width of the opening Ap2 is formed on the upper side (the upper side of the first portion Edc 1) in each of the discharge channels C1e1 and C1e 2.

By performing the vacuum evaporation in the two-stage oblique evaporation as described above, the common electrode Edc including the first portion Edc1 and the second portion Edc2 is formed. In addition, as will be described in detail later, in the present embodiment, the common electrode Edc in both the discharge channels C1e1 and C1e2 can be formed at once using the mask M having the opening Ap2 described above.

[ actions and effects ]

(A. basic operation of Printer 1)

In the printer 1, a recording operation (printing operation) of an image, characters, or the like on the recording paper P is performed as follows. In addition, as an initial state, the four ink tanks 3(3Y, 3M, 3C, and 3K) shown in fig. 1 are each filled with ink 9 of the corresponding color (four colors) sufficiently. The ink 9 in the ink tank 3 is filled in the ink jet head 4 through the circulation flow path 50.

In such an initial state, if the printer 1 is operated, the raster rollers 21 of the transport mechanisms 2a and 2b are rotated, respectively, and the recording paper P is transported in the transport direction d (X-axis direction) between the raster rollers 21 and the pinch rollers 22. Simultaneously with such a conveying operation, the driving motor 633 of the driving mechanism 63 operates the endless belt 632 by rotating the pulleys 631a and 631b, respectively. Thereby, the carriage 62 reciprocates along the width direction (Y-axis direction) of the recording paper P while being guided by the guide rails 61a, 61 b. Then, at this time, the four-color ink 9 is appropriately discharged to the recording paper P by the respective ink jet heads 4(4Y, 4M, 4C, 4K), and a recording operation of an image, characters, or the like on the recording paper P is performed.

(B. detailed operation in the ink-jet head 4)

Next, the detailed operation of the ink jet head 4 (the ejection operation of the ink 9) will be described. That is, in the ink jet head 4 (side-shooter type), the ejection operation using the ink 9 in the shear (shear) mode is performed as follows.

First, if the reciprocating movement of the carriage 62 (see fig. 1) is started, the drive circuit on the circuit board applies a drive voltage to the drive electrodes Ed (the common electrode Edc and the individual electrode Eda) in the ink-jet head 4 via the flexible printed board. Specifically, the drive circuit applies a drive voltage to each of the drive electrodes Ed disposed on a pair of drive walls Wd that demarcate the discharge channels C1e and C2 e. Thereby, the pair of driving walls Wd are deformed so as to protrude toward the dummy channels C1d and C2d adjacent to the discharge channels C1e and C2e, respectively.

Here, since the actuator plate 412 is of the chevron type as described above, the drive wall Wd is bent in a V shape around the middle position in the depth direction of the drive wall Wd by applying the drive voltage by the drive circuit described above. By the bending deformation of the driving wall Wd, the discharge passages C1e and C2e are deformed to bulge as if they were.

Incidentally, in the case where the structure of the actuator plate 412 is not of such a chevron type, but of the aforementioned cantilever type, the drive wall Wd is bent in a V shape as follows. That is, in the case of the cantilever type, the driving electrode Ed is fitted up to the upper half portion in the depth direction by oblique evaporation, and thus the driving force reaches only the portion where the driving electrode Ed is formed, whereby the driving wall Wd (at the end portion in the depth direction of the driving electrode Ed) is bent and deformed. As a result, even in this case, since the drive wall Wd is deformed in a V-shape, the discharge passages C1e and C2e are deformed in a bulging manner.

In this manner, the volumes of the discharge channels C1e, C2e increase due to bending deformation based on the piezoelectric thickness shear effect at the pair of drive walls Wd. Further, the ink 9 stored in the inlet-side common flow paths Rin1 and Rin2 is guided into the discharge paths C1e and C2e due to the increase in the volumes of the discharge paths C1e and C2 e.

Then, the ink 9 guided into the discharge channels C1e, C2e is propagated as a pressure wave to the insides of the discharge channels C1e, C2 e. Then, at the timing (or the timing in the vicinity thereof) when the pressure wave reaches the nozzle holes H1, H2 of the nozzle plate 411, the driving voltage applied to the driving electrode Ed becomes 0 (zero) V. As a result, the driving wall Wd is restored from the state of the bending deformation, and as a result, the temporarily increased volumes of the discharge passages C1e and C2e are restored.

In this way, in the process of returning the volumes of the discharge channels C1e, C2e to their original volumes, the pressures inside the discharge channels C1e, C2e increase, and the ink 9 inside the discharge channels C1e, C2e is pressurized. As a result, the droplet-shaped ink 9 is discharged to the outside (toward the recording paper P) through the nozzle holes H1 and H2 (see fig. 3 and 4). In this manner, the ejection operation (discharge operation) of the ink 9 from the ink jet head 4 is performed, and as a result, the recording operation of the image, characters, and the like on the recording paper P is performed.

(C, circulation action of ink 9)

Next, the circulation operation of the ink 9 through the circulation flow path 50 will be described in detail with reference to fig. 1, 3, and 4.

In the printer 1, the ink 9 is sent from the ink tank 3 to the flow path 50a by the liquid sending pump. The ink 9 flowing in the flow path 50b is pumped into the ink tank 3 by the aforementioned liquid-feeding pump.

At this time, in the inkjet head 4, the ink 9 flowing from the inside of the ink tank 3 through the flow path 50a flows into the inlet-side common flow paths Rin1 and Rin 2. The ink 9 supplied to the inlet-side common flow paths Rin1 and Rin2 is supplied into the discharge channels C1e and C2e of the actuator plate 412 through the first supply slit Sin1 or the second supply slit (see fig. 3 and 4).

The ink 9 in the discharge channels C1e and C2e flows into the outlet-side common channels Rout1 and Rout2 through the first discharge slit Sout1 or the second discharge slit (see fig. 3 and 4). The ink 9 supplied to the outlet-side common flow paths Rout1 and Rout2 is discharged to the flow path 50b and flows out of the ink jet head 4. Then, the ink 9 discharged to the flow path 50b is returned to the ink tank 3. In this way, the circulation operation of the ink 9 through the circulation flow path 50 is performed.

Here, when an ink having high drying property is used in an ink jet head which is not a circulation type, local high viscosity or solidification of the ink occurs due to drying of the ink in the vicinity of the nozzle hole, and as a result, a problem that the ink is not discharged may occur. On the other hand, in the ink jet head 4 (circulation type ink jet head) of the present embodiment, since the fresh ink 9 is always supplied to the vicinity of the nozzle holes H1 and H2, the above-described disadvantage that the ink is not discharged is avoided.

(action, Effect)

Next, the operation and effect of the ink jet head 4 of the present embodiment will be described in detail in comparison with comparative examples (comparative examples 1 to 4).

(D-1. comparative example 1)

Fig. 9 schematically shows a configuration example in which the nozzle plate 101 according to comparative example 1 is removed (appearing later) from the inkjet head 104 according to comparative example 1 in a bottom view (X-Y bottom view). Fig. 10 schematically shows an example of the cross-sectional configuration (an example of the Y-Z cross-sectional configuration) of the ink jet head 104 according to comparative example 1 along the X-X line shown in fig. 9.

As shown in fig. 9 and 10, in the inkjet head 104 (head chip 100) of comparative example 1, the arrangement of the nozzle holes H1 and H2 differs in the inkjet head 4 (head chip 41) of the present embodiment. In addition, in the cap plate 103 in this head chip 100, unlike the cap plate 413 in the head chip 41, the aforementioned first inlet side flow path sectional area Sfin1 and first outlet side flow path sectional area Sfout1 are equal to each other (Sfin1= Sfout 1: refer to fig. 10).

Specifically, in the nozzle plate 101 of comparative example 1, unlike the nozzle plate 411 of the present embodiment, the nozzle holes H1, H2 in the nozzle rows An101, 102 are arranged in a row along the extending direction (X-axis direction) of the nozzle rows An101, 102, respectively (see fig. 9). That is, unlike the case of the present embodiment described above, in comparative example 1, the center position Pn1 of each nozzle hole H1 coincides with the center position Pc1 of the discharge channel C1e along the extending direction (Y-axis direction) (i.e., the center position of the wall portion W1 along the Y-axis direction) (see fig. 10). Similarly, in comparative example 1, the center position of each nozzle hole H2 coincides with the center position of the discharge channel C2e along the extending direction (Y-axis direction) (i.e., the center position of the wall portion W2 along the Y-axis direction).

In comparative example 1, since the nozzle holes H1 and H2 are arranged in a row along the X axis direction as described above, for example, when the distance between the adjacent nozzle holes H1 or the distance between the adjacent nozzle holes H2 becomes smaller as the resolution of the printed pixel increases, for example, the following possibility exists. That is, in such a case, the distance between the droplets ejected at the same time and flying toward the recording medium (recording paper P or the like) decreases, and therefore, there are cases where: the droplets flying between the nozzle holes H1, H2 and the recording medium are locally concentrated. This increases the influence (generation of air flow) on each flying droplet, and as a result, uneven density of the texture occurs on the recording medium, which may degrade the print image quality.

(D-2. comparative example 2)

Fig. 11 schematically shows an example of a cross-sectional configuration of the vicinity of the discharge channel C1e in the ink jet head 204 according to comparative example 2. Specifically, fig. 11(a) and 11(B) show a detailed configuration example of the vicinity of the discharge path C1e1 and a detailed configuration example of the vicinity of the discharge path C1e2, respectively.

In the inkjet head 204 (head chip 200) of this comparative example 2, the arrangement position of each common electrode Edc is different from the inkjet head 4 (head chip 41) of the present embodiment. Specifically, (a part of) the common electrodes Edc are arranged offset from each other in the Y axis direction in the discharge channels C1e1, C1e2 of the actuator plate 202, and are arranged in a staggered manner in the same manner as the nozzle holes H11, H12 (see fig. 11 a, 11B). In detail, in this example, with respect to the first portion Edc1 in the common electrode Edc, the end positions Pe1a, Pe1b are aligned with each other in the ejection passages C1e1, C1e2, respectively. On the other hand, with respect to the second portion Edc2, the end positions Pe2a, Pe2b are not all aligned with each other (shifted from each other in the Y-axis direction) in the discharge passages C1e1, C1e 2.

In comparative example 2, for example, the openings Ap2 (see fig. 8 a) of the mask M used for forming the common electrodes Edc by the above-described method (vacuum deposition) have a complicated shape. Specifically, in this comparative example 2, as described above, in the discharge channels C1e1 and C1e2, (a part of) the common electrodes Edc are arranged offset from each other (staggered arrangement), and thus, for example, the openings Ap2 of the mask M also need to be arranged in a staggered manner. In addition, when the openings Ap2 of the mask M are arranged in a staggered manner, it is difficult to align the openings Ap2 of the mask M with the discharge channels C1e1 and C1e2, and thus it is difficult to form the common electrode Edc in both the discharge channels C1e1 and C1e 2. As a result, in comparative example 2, it is likely that the formation of the common electrodes Edc becomes difficult.

(D-3. comparative examples 3 and 4)

Fig. 12 schematically shows an example of a planar configuration (X-Y planar configuration) of the upper surface side of the cap plate 303 in the inkjet head 304 according to comparative example 3. Fig. 13 schematically shows an example of a cross-sectional configuration of the inkjet head 304 according to comparative example 3 in the vicinity of the discharge path C1 e. Specifically, fig. 13(a) and 13(B) show a detailed configuration example of the vicinity of the discharge path C1e1 and a detailed configuration example of the vicinity of the discharge path C1e2, respectively.

As shown in fig. 13, the inkjet head 304 of this comparative example 3 corresponds to the inkjet head 4 (see fig. 3, 4, and 7) of the embodiment in which a head chip 300 is provided in place of the head chip 41. In the head chip 300 of comparative example 3, the actuator plate 302 and the cover plate 303 described below are provided in place of the actuator plate 412 and the cover plate 413, respectively, in the head chip 41, and the other configurations are basically the same.

Specifically, as shown in fig. 12 and 13, in the actuator plate 302 of comparative example 3, unlike the actuator plate 412 of the embodiment (see fig. 5), the arrangement structures of the discharge passages C1e and C2e are as follows. That is, in the actuator plate 302, unlike the actuator plate 412, the entire plurality of discharge passages C1e (and the entire plurality of discharge passages C2e) are arranged in a staggered manner in the X-axis direction (arranged so as to be alternately offset in the Y-axis direction) (see fig. 12).

In the cover 303 of comparative example 3, the first pump length Lw1 and the second pump length are the same in all the first slit pair Sp1 and the second slit pair (see fig. 12), as in the cover 413 of the embodiment (see fig. 5).

On the other hand, in this cap plate 303, unlike the cap plate 413, the aforementioned first supply slit length Lin1 and second supply slit length, and the aforementioned first discharge slit length Lout1 and second discharge slit length are identical to each other (refer to fig. 12: Lin1= Lout1, second supply slit length = second discharge slit length). In the cover plate 303, unlike the cover plate 413, the first supply slit Sin1 and the second supply slit and the first discharge slit Sout1 and the second discharge slit are arranged alternately along the extending direction (X-axis direction) of the inlet-side common flow paths Rin1 and Rin2 and the outlet-side common flow paths Rout1 and Rout2, respectively (see fig. 12).

Here, as shown in fig. 13(a) and 13(B), in comparative example 3, as described above, the discharge channels C1e1 and C1e2 are arranged alternately with each other, but unlike comparative example 2, the arrangement positions of the common electrodes Edc are as follows. That is, in this comparative example 3, as the discharge channels C1e1, C1e2 are arranged to intersect with each other, the end positions Pe1a, Pe1b are all misaligned (shifted from each other in the Y-axis direction) between the discharge channels C1e1, C1e2 with respect to the first portion Edc1 in the common electrode Edc. On the other hand, with respect to the second portion Edc2, the end positions Pe2a, Pe2b are aligned with each other in the discharge passages C1e1, C1e2, respectively.

For these reasons, in comparative example 3, unlike comparative example 2 described above, the opening Ap2 of the mask M used for forming each common electrode Edc can be formed in a simple shape (for example, rectangular shape) as in the present embodiment (see fig. 8B). That is, for example, as in comparative example 2, the openings Ap2 of the mask M are not necessarily arranged in a staggered manner, and the common electrode Edc in both the ejection channels C1e1 and C1e2 can be formed at the same time. Therefore, in comparative example 3, as in the present embodiment, the formation of the common electrodes Edc is easier than in comparative example 2.

However, in this comparative example 3, as described above, the end positions Pe1a and Pe1b of the first portion Edc1 are offset from each other in the discharge passages C1e1 and C1e2, respectively, while the end positions Pe2a and Pe2b of the second portion Edc2 are aligned with each other in the discharge passages C1e1 and C1e2, respectively, and therefore, the following is performed. That is, in this comparative example 3, it is difficult to select the length of each common electrode Edc along the extending direction (Y-axis direction) (in the example of fig. 13(a) and 13(B), the electrode length Le2 of the second portion Edc 2) to be larger. Specifically, the electrode length Le2 of the second portion Edc2 is shorter than in the case of the present embodiment shown in fig. 7(a) and 7 (B). This is because if the end position Pe2a or the end position Pe2b in the second portion Edc2 is located more outside than the end position Pe1a or the end position Pe1b in the first portion Edc1, a burr is liable to be generated when the common electrode Edc is formed. As described above, in comparative example 3, it is difficult to select the length of each common electrode Edc along the extending direction to be large, and therefore the area of each common electrode Edc becomes small, and as a result, there is a possibility that the voltage efficiency when driving the head chip 300 is lowered.

Incidentally, in the configuration of this comparative example 3, in the case where the pump length in each of the discharge channels C1e, C2e is extended to be larger than that in comparative example 3 in order to secure the length of each of the common electrodes Edc in the extending direction (comparative example 4), the following is performed. That is, in the configuration of comparative example 4, since the first pump length Lw1 (and the pump length in each discharge channel C2e) in each discharge channel C1e is relatively long, the value of the on pulse peak (AP) defined by each discharge channel C1e and C2e is also large. This AP corresponds to 1/2 periods (1AP = (natural vibration period of ink 9)/2) of the natural vibration period of the ink 9 in each of the discharge channels C1e, C2e, and corresponds to a drive pulse width for maximizing the ejection speed of the ink 9. As described above, in comparative example 4, since the value of AP is increased, the driving waveform per one drop is increased, and thus it may be difficult to drive the head chip at a high frequency.

(D-4. this embodiment mode)

In contrast, the ink jet head 4 (head chip 41) of the present embodiment has the following configuration, for example, unlike the comparative examples 1 to 4.

First, in the present embodiment, unlike comparative example 1, the nozzle holes H1 adjacent to each other in the X-axis direction (and the nozzle holes H2 adjacent to each other in the X-axis direction) among the plurality of nozzle holes H1, H2 are arranged offset from each other in the extending direction (Y-axis direction) of the discharge channels C1e, C2 e. Specifically, the center position Pn11 of the nozzle hole H11 is offset toward the first supply slit Sin1 with respect to the center position Pc1 of the discharge channel C1e in the extending direction (Y axis direction), and the center position Pn12 of the nozzle hole H12 is offset toward the first discharge slit Sout1 with respect to the center position Pc 1. Similarly, the center position of the nozzle hole H21 is shifted toward the second supply slit side with respect to the center position of the discharge channel C2e in the extending direction (Y-axis direction), and the center position of the nozzle hole H22 is shifted toward the second discharge slit side with respect to the center position of the discharge channel C2e in the extending direction.

Thus, in the present embodiment, the following is compared with comparative example 1. That is, the distance between the adjacent nozzle holes H1 (and the distance between the adjacent nozzle holes H2) is larger than that in the case where the nozzle holes H1 and H2 are arranged in a row along the X-axis direction (comparative example 1). Therefore, the distance between the droplets ejected at the same time and flying toward the recording medium (recording paper P or the like) increases, and thus the situation where the droplets flying from the nozzle holes H1, H2 to the recording medium are locally concentrated can be alleviated. As a result, in the present embodiment, the influence (generation of air flow) on each flying droplet can be suppressed, and as a result, the generation of the uneven density of the texture on the recording medium as described above can be suppressed as compared with comparative example 1.

In the present embodiment, the entirety of the plurality of discharge passages C1e (and the entirety of the plurality of discharge passages C2e) is arranged in a row in the X-axis direction in the actuator plate 412. Thus, in the present embodiment, the existing structure is maintained in the entirety of the plurality of discharge passages C1e (and in the entirety of the plurality of discharge passages C2e), and as a result, the formation of the discharge passages C1e (and the discharge passages C2e) is facilitated.

Further, in the present embodiment, in the discharge channel C1e1, the first inlet side flow path sectional area Sfin1 is smaller than the first outlet side flow path sectional area Sfout1, and in the discharge channel C1e2, the first outlet side flow path sectional area Sfout1 is smaller than the first inlet side flow path sectional area Sfin 1. In this embodiment, since the positions of both ends of the common electrode Edc in the extending direction (Y-axis direction) of the discharge path C1e are aligned with each other in the plurality of common electrodes Edc in the X-axis direction, the following is also possible.

That is, first, in the present embodiment, compared to the case of the comparative example 2, the opening Ap2 of the mask M used when forming the common electrodes Edc can be made to have a simple shape (for example, a rectangular shape). That is, for example, as in comparative example 2, the openings Ap2 of the mask M are not necessarily arranged in a staggered manner, and the common electrode Edc in both the ejection channels C1e1 and C1e2 can be formed at the same time. Therefore, in the present embodiment, the formation of the common electrodes Edc is facilitated as compared with comparative example 2.

In addition, in the present embodiment, the length of each common electrode Edc along the extending direction (Y-axis direction) (for example, the electrode length Le2 of the second portion Edc 2) can be selected to be larger than that in the case of the aforementioned comparative example 3. Thus, in the present embodiment, the area of each common electrode Edc is increased as compared with comparative example 3, and as a result, the voltage efficiency when driving the head chip 41 is improved.

In the present embodiment, unlike comparative example 4 described above, it is not necessary to increase the pump length in each of the discharge passages C1e and C2e, and therefore the pump length is as follows. That is, in the present embodiment, the above-described AP value is smaller than that of comparative example 4, and thus the head chip 41 is easily driven at a high frequency.

For the above reasons, in the present embodiment, the discharge channels C1e and C2e can be easily formed, the voltage efficiency when the head chip 41 is driven can be improved, and the occurrence of uneven grain density on the recording medium can be suppressed. Therefore, in the ink jet head 4 (head chip 41) of the present embodiment, it is possible to reduce the power consumption and improve the print image quality while suppressing the manufacturing cost of the head chip 41. In addition, in the present embodiment, as described above, high-frequency driving can be realized, and the high-viscosity ink 9 (high-viscosity ink) can be discharged.

In addition, in the present embodiment, the positions of both ends of each of the first portion Edc1 and the second portion Edc2 of the common electrode Edc (the aforementioned end positions Pe1a, Pe1b, Pe2a, Pe2b) are aligned with each other in the plurality of common electrodes Edc along the X-axis direction, respectively, and thus the following is made. That is, even in the case where each common electrode Edc has a structure (two-stage structure) including such first portion Edc1 and second portion Edc2, each common electrode Edc is easily formed. In addition, since the aforementioned electrode length Le2 in second portion Edc2 is smaller than the aforementioned electrode length Le1 in first portion Edc1, the following is made. That is, in forming the common electrode Edc, burrs are less likely to be generated, as compared to, for example, a case where the electrode length Le2 of the second portion Edc2 is larger than the electrode length Le1 of the first portion Edc 1. Therefore, the burr removal step can be omitted, and the number of steps can be reduced. For the above reasons, in the present embodiment, the manufacturing cost of the head chip 41 can be further suppressed.

In the present embodiment, the wall surface position flow path cross-sectional area Sf5 is smaller than the wall surface position flow path cross-sectional area Sf6 in the discharge path C1e1 among the discharge paths C1e, and the wall surface position flow path cross-sectional area Sf6 is smaller than the wall surface position flow path cross-sectional area Sf5 in the discharge path C1e 2. The same magnitude relationship is also established in the discharge passage C2 e. Thus, in the present embodiment, for example, the length of each common electrode Edc in the extending direction (for example, the electrode length Le1 or the electrode length Le2) can be set larger than in the case where the wall surface position flow path sectional areas Sf5 and Sf6 are equal to each other. Therefore, the area of each common electrode Edc is further increased, and the voltage efficiency when driving the head chip 41 is further improved, and as a result, the power consumption can be further reduced.

In the present embodiment, as described above, in the structure in which the nozzle holes H1 adjacent to each other in the X-axis direction (and the nozzle holes H2 adjacent to each other) are arranged to be offset from each other in the Y-axis direction while maintaining the existing structure in the entirety of the plurality of discharge channels C1e (and the entirety of the plurality of discharge channels C2e), the following can be made as in the conventional structure. That is, the first pump length Lw1 and the second pump length described above can be made the same (common) in all the first slit pairs Sp1 and all the second slit pairs, respectively. Thus, in the present embodiment, variations in discharge characteristics between the adjacent nozzle holes H1 (and between the adjacent nozzle holes H2) can be suppressed, and as a result, the print image quality can be further improved. In the present embodiment, the following is performed, as compared with the case of comparative example 2 (the case where the first and second supply slits Sin1 and Sout1 and the second discharge slits are arranged in a staggered manner in the X axis direction). That is, in comparative example 2, the entire plurality of discharge paths C1e (and the entire plurality of discharge paths C2e) are also arranged in a staggered manner in the X-axis direction (see fig. 12). On the other hand, in the present embodiment, as in the conventional structure, the entire plurality of discharge channels C1e (and the entire plurality of discharge channels C2e) can be formed (processed) without being staggered (see fig. 5), and thus the workability of the head chip 41 is improved (the head chip can be processed while maintaining the conventional manufacturing process). Thus, in the present embodiment, the manufacturing process of the head chip 41 can be simplified.

In the present embodiment, the flow path widths (the first inlet side flow path width Win1 and the second inlet side flow path width) of the inlet side common flow paths Rin1 and Rin2 and the flow path widths (the first outlet side flow path width Wout1 and the second outlet side flow path width) of the outlet side common flow paths Rout1 and Rout2 are constant along the extending direction (the X axis direction) of the common flow paths, respectively, and therefore, the following is performed. That is, the existing structure can be maintained for each of the inlet-side common flow paths Rin1 and Rin2 and the outlet-side common flow paths Rout1 and Rout 2.

In the present embodiment, one side of each of the dummy passages C1d and C2d along the extending direction (Y-axis direction) is the side surface described above, and the other side along the extending direction is open to the end of the actuator plate 412 along the Y-axis direction, and therefore, the following is performed. That is, as described above, in the structure in which the nozzle holes H1 adjacent in the X-axis direction are arranged offset from each other (and the nozzle holes H2 adjacent thereto) in the Y-axis direction, the nozzle holes H1 and H2 can be arranged at high density in the nozzle plate 411 without changing the size of the entire head chip 41 (chip size). Further, since the other side of each of the dummy channels C1d and C2d is open up to the end, the individual electrode Eda individually disposed in each of the dummy channels C1d and C2d can be formed separately (in an electrically insulated state) from the common electrode Edc disposed in each of the discharge channels C1e and C2e (see fig. 6). For these reasons, in the present embodiment, the chip size of the head chip 41 can be reduced, and the manufacturing process of the head chip 41 can be simplified.

<2. modification >

Next, modifications (modifications 1 and 2) of the above embodiment will be described. The same components as those in the embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

[ modification 1]

(integral constitution)

Fig. 14 and 15 schematically show examples of cross-sectional configurations (examples of Y-Z cross-sectional configurations) of the ink jet head 4a according to modification 1. Specifically, fig. 14 is a cross-sectional structure example corresponding to fig. 3 in the embodiment; fig. 15 is a cross-sectional structure example corresponding to fig. 4 in the embodiment. Fig. 16 schematically shows another cross-sectional configuration example (Z-X cross-sectional configuration example) of the head chip 41a shown in fig. 14 and 15.

As shown in fig. 14 and 15, the inkjet head 4a of modification 1 corresponds to the inkjet head 4 (see fig. 3 and 4) of the embodiment in which a head chip 41a is provided in place of the head chip 41. The head chip 41a of modification 1 is provided with a positioning plate 415 to be described below in addition to the head chip 41, and the other configurations are basically the same. The ink jet head 4a corresponds to a specific example of the "liquid jet head" in the present disclosure.

As shown in fig. 14 to 16, the alignment plate 415 is disposed between the actuator plate 412 and the nozzle plate 411. The alignment plate 415 has a plurality of openings H31 and H32 for aligning the nozzle holes H1 and H2 in manufacturing the head chip 41a for each of the nozzle holes H1(H11, H12) and H2(H21 and H22). Specifically, an opening H31 is disposed for each nozzle hole H11, H21, and an opening H32 is disposed for each nozzle hole H12, H22 (see fig. 14 to 16).

These openings H31, H32 communicate between the nozzle holes H11, H12, H21, H22 and the discharge channels C1e1, C1e2, respectively, and form substantially rectangular openings in the X-Y plane. The length (opening length) of each opening H31, H32 in the Y axis direction is larger than the length of each nozzle hole H11, H12, H21, H22 in the Y axis direction (see fig. 14, 15). The length of the openings H31, H32 in the X axis direction is greater than the length of the nozzle holes H11, H12, H21, H22 in the X axis direction and the length of the discharge channels C1e, C2e in the X axis direction (see fig. 16). That is, as shown in fig. 16, for example, such openings H31, H32 allow slight positional deviation (positional deviation in the X-Y plane) in the nozzle holes H1, H2 and prevent such positional deviation. By providing such an alignment plate 415, alignment between the actuator plate 412 and the nozzle plate 411 is facilitated when the head chip 41 is manufactured.

The openings H31 and H32 correspond to a specific example of the "third through hole" in the present disclosure.

Here, in the head chip 41a of modification 1, the divergent flow path portions 431 and 432 described below are formed so as to include the openings H31 and H32 in the alignment plate 415 as described above, respectively.

The expanding channel portion 431 is formed in the vicinity of the nozzle holes H11 and H21, and serves as a channel for expanding the cross-sectional area of the channel of the ink 9 in the vicinity of the nozzle holes H11 and H21 (the nozzle hole-vicinity channel cross-sectional area Sf3), as will be described later (see fig. 14, for example). Similarly, the expanding flow path portion 432 is formed in the vicinity of the nozzle holes H12 and H22, and is a flow path for expanding the cross-sectional area of the flow path of the ink 9 in the vicinity of the nozzle holes H12 and H22 (the nozzle hole-vicinity flow path cross-sectional area Sf4), as will be described later (see fig. 15, for example).

Further, such an expanded flow path portion 431 corresponds to one specific example of the "first expanded flow path portion" in the present disclosure. Likewise, the expanded flow path portion 432 corresponds to one specific example of the "second expanded flow path portion" in the present disclosure. The flow path cross-sectional area Sf3 in the vicinity of the nozzle hole corresponds to a specific example of the "third cross-sectional area" in the present disclosure. Similarly, the flow passage sectional area Sf4 in the vicinity of the nozzle hole corresponds to one specific example of the "fourth sectional area" in the present disclosure.

(details of the expanding channel parts 431 and 432)

Next, the detailed structure of the expanding channel sections 431 and 432 will be described with reference to fig. 17 and 18 in addition to fig. 14 and 15. Fig. 17 and 18 schematically show, in cross section (Y-Z cross section), an example of the positional relationship between the nozzle holes H1 and H2 and the expanding channel section according to modification 1 and the like. Specifically, fig. 17(a) shows the cross-sectional structure in the vicinity of VII in fig. 14 in an enlarged manner, and fig. 17(B) shows the cross-sectional structure of an ink jet head 504 (head chip 500) according to comparative example 5 described later in comparison with fig. 17 (a). Fig. 18 a shows an enlarged cross-sectional structure of the vicinity of VIII in fig. 15, and fig. 18B shows a cross-sectional structure of an ink jet head 604 (head chip 600) according to comparative example 6 described later in comparison with fig. 18 a.

First, in the head chip 41a according to modification 1, both end portions of the divergent flow path portions 431 and 432 (the openings H31 and H32) in the Y axis direction are located inward (so-called pump chambers) of both end portions of the wall portion W1 (or the wall portion W2) in the Y axis direction (see fig. 14 and 15).

Specifically, as shown in fig. 14, the end portion of the expanding flow path portion 431 on the first supply slit Sin1 side is located on the first discharge slit Sout1 side with the end portion of the wall portion W1 on the first supply slit Sin1 side as a reference position. The end portion of the expanding flow path portion 431 on the first discharge slit Sout1 side is also located on the first supply slit Sin1 side with respect to the end portion of the wall portion W1 on the first discharge slit Sout1 side as a reference position. Similarly, the end portion on the second supply slit side in the expanded flow path portion 431 is positioned on the second discharge slit side with respect to the end portion on the second supply slit side in the wall portion W2 as a reference position. The second discharge slit-side end of the divergent flow path portion 431 is also positioned closer to the second supply slit than the second discharge slit-side end of the wall portion W2, which is the reference position.

On the other hand, as shown in fig. 15, the end portion on the first discharge slit Sout1 side in the expanded flow path portion 432 is positioned on the first supply slit Sin1 side with the end portion on the first discharge slit Sout1 side in the wall portion W1 as a reference position. The end portion of the expanded flow path portion 432 on the first supply slit Sin1 side is also positioned on the first discharge slit Sout1 side with the end portion of the wall portion W1 on the first supply slit Sin1 side as a reference position. Similarly, the second discharge slit side end of the expanded flow path portion 432 is positioned closer to the second supply slit than the second discharge slit side end of the wall portion W2, which is the reference position. The second supply slit side end of the expanded flow path portion 432 is also positioned on the second discharge slit side with respect to the second supply slit side end of the wall portion W2 as a reference position.

As shown in fig. 17(a), in the head chip 41 according to modification 1, the center position Ph31 of the divergent channel section 431 along the Y axis direction is shifted toward the first supply slit Sin1 side along the Y axis direction from the center position Pn11 of the nozzle hole H11. Similarly, in the head chip 41, the center position Ph31 of the expanding flow path portion 431 in the Y axis direction is shifted toward the second supply slit side in the Y axis direction from the center position of the nozzle hole H21.

In contrast, in the head chip 500 of comparative example 5 shown in fig. 17(B), the center position Ph31 in the Y axis direction in the divergent channel section 501 is shifted to the first discharge slit Sout1 side in the Y axis direction opposite to the center position Pn11 of the nozzle hole H11. Similarly, in the head chip 500 of comparative example 5, the center position Ph31 along the Y axis direction in the extended flow path portion 501 is shifted to the second discharge slit side in the Y axis direction to the opposite side of the center position of the nozzle hole H21.

On the other hand, as shown in fig. 18(a), in the head chip 41a of modification 1, the center position Ph32 in the Y axis direction in the extended flow path portion 432 is shifted toward the first discharge slit Sout1 side in the Y axis direction from the center position Pn12 of the nozzle hole H12. Similarly, in the head chip 41a, the center position Ph32 of the extended flow path portion 432 in the Y axis direction is shifted to the second discharge slit side in the Y axis direction from the center position of the nozzle hole H22.

In contrast, in the head chip 600 of comparative example 6 shown in fig. 18(B), the center position Ph32 in the extended channel portion 602 in the Y axis direction is shifted to the first supply slit Sin1 side in the Y axis direction opposite to the center position Pn12 of the nozzle hole H12. Similarly, in the head chip 600 of comparative example 6, the center position Ph32 of the extended flow path portion 602 in the Y axis direction is shifted to the second supply slit side in the Y axis direction to the opposite side of the center position of the nozzle hole H22.

(action, Effect)

The same effects can be obtained basically by the same operation as the inkjet head 4 (head chip 41) of the embodiment also in the inkjet head 4a (head chip 41a) of modification 1 of the above configuration.

In particular, in modification 1, the extended flow path portions 431 and 432 are formed in the head chip 41a, respectively, as described above. Specifically, an expanding flow path portion 431 (see fig. 14) is formed near the nozzle holes H11 and H21 to expand the cross-sectional area of the flow path of the ink 9 near the nozzle holes H11 and H21 (the nozzle hole-near flow path cross-sectional area Sf 3). In addition, an expanding flow path portion 432 (see fig. 15) is formed near the nozzle holes H12 and H22 to expand the cross-sectional area of the flow path of the ink 9 near the nozzle holes H12 and H22 (the nozzle hole-near flow path cross-sectional area Sf 4).

In addition, in modification 1, as described above, the center position Ph31 of the divergent channel section 431 in the Y axis direction is shifted toward the first supply slit Sin1 side in the Y axis direction from the center position Pn11 of the nozzle hole H11 (see fig. 17 a). Similarly, the center position Ph31 in the Y axis direction in the expanding flow path portion 431 is shifted to the second supply slit side in the Y axis direction from the center position of the nozzle hole H21. Further, the center position Ph32 in the Y axis direction in the extended channel portion 432 is shifted to the first discharge slit Sout1 side in the Y axis direction than the center position Pn12 of the nozzle hole H12 (see fig. 18 a). Similarly, the center position Ph32 in the Y axis direction in the expanded flow path portion 432 is shifted to the second discharge slit side in the Y axis direction from the center position of the nozzle hole H22.

In modification 1, by forming the extension flow path portions 431 and 432 at the above-described arrangement positions, the following is obtained as compared with the embodiment (the configuration in which the alignment plate 415 having the extension flow path portions 431 and 432 is omitted; see fig. 3 and 4).

That is, in this modification 1, the difference in the first inlet side flow path cross-sectional area Sfin1 between the discharge channels C1e1 and C1e2 is smaller than that in the embodiment, and the pressure loss from the inflow side of the ink 9 to the nozzle holes H11 and H12 is also smaller. As a result, in modification 1, the pressure difference at the stable time near the nozzle holes H11 and H12 between the discharge channels C1e1 and C1e2 is smaller than in the embodiment, and the head value margin on the entire head chip 41 is increased, so that the discharge characteristics of the ink 9 in the ink jet head 4 are improved. Such an action is similarly generated between the discharge channel C2e communicating with the nozzle holes H21 and the discharge channel C2e communicating with the nozzle holes H22.

Incidentally, when the above-described pressure difference increases, specifically, for example, as described below, the discharge characteristic of the ink 9 may decrease. That is, for example, in one of the discharge channels C1e1 and C1e2, the pressure at which an appropriate meniscus (meniscus) is formed is high, but in the other, the pressure in the vicinity of the nozzle hole H11 or the nozzle hole H12 is too high, and the meniscus is broken, and there is a possibility that the ink 9 leaks. On the other hand, if the pressure is too low, the meniscus is broken, and air bubbles are mixed into the discharge channel C1e1 or the discharge channel C1e2, and as a result, the ink 9 may not be discharged.

Similarly, a drop in the discharge characteristics of the ink 9 due to such a pressure difference may occur between the discharge channel C2e communicating with the nozzle holes H21 and the discharge channel C2e communicating with the nozzle holes H22.

In contrast, in the cases of comparative examples 5 and 6 (see fig. 17B and 18B), the arrangement positions of the expanded flow path portions 501 and 602 are different from those of the modified example 1, and therefore, the following is provided. That is, in comparative example 5, for example, as described above, the center position Ph31 along the Y axis direction in the expanding channel section 501 is shifted to the first discharge slit Sout1 side in the Y axis direction in the opposite direction to the center position Pn11 of the nozzle hole H11 (see fig. 17 (B)). In comparative example 6, for example, as described above, the center position Ph32 of the expanded channel section 602 in the Y axis direction is shifted toward the first supply slit Sin1 side in the Y axis direction to the opposite side of the center position Pn12 of the nozzle hole H12 (see fig. 18B). Therefore, in comparative examples 5 and 6, for example, the pressure difference at the time of stabilization of the vicinity of the nozzle holes H11 and H12 between the discharge channels C1e1 and C1e2 is increased in an opposite manner, and the water head margin is further decreased, and thus the discharge characteristics of the ink 9 may be further decreased.

In modification 1, the expanding flow path portions 431 and 432 are respectively configured to include the openings H31 and H32 (openings for positioning the nozzle holes H1 and H2) in the positioning plate 415, and thus are as follows. That is, the divergent flow paths 431 and 432 can be formed easily and accurately by using the existing openings H31 and H32 of the alignment plate 415. Therefore, the manufacturing cost of the head chip 41a can be further reduced, and the discharge characteristics of the ink 9 can be further improved, thereby further improving the print image quality.

In modification 1, the both end portions of the divergent flow path portions 431 and 432 (the openings H31 and H32) in the Y axis direction are located further inward (inside the pump chamber) than the both end portions of the wall portion W1 (or the wall portion W2) in the Y axis direction, as described above (see fig. 14 and 15), and hence the following are provided. That is, for example, in the discharge channels C1e1 and C1e2, the unevenness of the pressure characteristics is reduced, and the discharge characteristics of the ink 9 are further improved, and as a result, the print image quality can be further improved.

[ modification 2]

(constitution)

Fig. 19 and 20 schematically show, in cross section (Y-Z cross section), an example of the positional relationship between the nozzle holes H1 and H2 and the expanding channel section according to modification 2 and the like. Specifically, fig. 19(a) shows a cross-sectional structure of the divergent channel section 431b and the like in the ink-jet head 4b (head chip 41b) according to modification 2. Fig. 19B and 19C show cross-sectional configurations (cross-sectional configurations shown in fig. 17 a and 17B) of the expanded flow path portion 431 and the like of modification 1 and the expanded flow path portion 501 and the like of comparative example 5, respectively, in comparison. Fig. 20 a shows a cross-sectional structure of the divergent channel section 432b and the like in the ink jet head 4b (head chip 41b) according to modification 2. Fig. 20(B) and 20(C) show a comparison of the cross-sectional structures of the expanded flow path portion 432 of modification 1 and the expanded flow path portion 602 of comparative example 6 (the cross-sectional structures shown in fig. 18(a) and 18(B), respectively).

As shown in fig. 19(a) and 20(a), the inkjet head 4b of modification 2 is provided with a head chip 41b in place of the head chip 41a in the inkjet head 4a of modification 1. The ink jet head 4b corresponds to a specific example of the "liquid jet head" in the present disclosure.

In the head chip 41b, instead of the divergent channel sections 431 and 432 in the head chip 41a, divergent channel sections 431b and 432b (see fig. 19 a and 20 a) described below are formed, respectively.

Such an expanded flow path portion 431b corresponds to a specific example of the "first expanded flow path portion" in the present disclosure. Similarly, the expanded flow path portion 432b corresponds to one specific example of the "second expanded flow path portion" in the present disclosure.

As shown in fig. 19(a), the center position Ph31 of the expanding channel portion 431b along the Y-axis direction coincides with the center position Pn11 of the nozzle hole H11. Similarly, the center position Ph31 in the Y axis direction in the expanding channel section 431b coincides with the center position of the nozzle hole H21.

As shown in fig. 20(a), the center position Ph32 of the expanded channel portion 432b in the Y axis direction coincides with the center position Pn12 of the nozzle hole H12. Similarly, the center position Ph32 in the Y axis direction in the expanded flow path portion 432b coincides with the center position of the nozzle hole H22.

(action, Effect)

The inkjet head 4b (head chip 41b) of modification 2 having such a configuration can basically obtain the same effects by the same operations as the inkjet head 4a (head chip 41a) of modification 1.

Specifically, in modification 2, unlike modification 1, as described above, the center position Ph31 in the Y-axis direction in the expanding flow path portion 431b coincides with the center position Pn11 of the nozzle hole H11 and the center position of the nozzle hole H21, respectively. Similarly, as described above, the center position Ph32 in the Y axis direction in the expanded flow path portion 432b coincides with the center positions Pn12 of the nozzle hole H12 and the nozzle hole H22, respectively. In modification 2 as described above, the head chip 41b as a whole has an increased head value margin due to the same operation as in modification 1 described above, and as a result, the discharge characteristics of the ink 9 in the ink jet head 4b are improved. Therefore, also in modification 2, as in modification 1, the print image quality can be improved while suppressing the manufacturing cost of the head chip 41 b.

<3 > other modifications

The present disclosure has been described above by way of the embodiments and the modifications, but the present disclosure is not limited to these embodiments and the like, and various modifications are possible.

For example, in the above-described embodiments and the like, the description has been given by specifically taking examples of the configurations (shapes, arrangements, numbers, and the like) of the respective members in the printer and the inkjet head, but the present invention is not limited to the above-described embodiments and the like, and other shapes, arrangements, numbers, and the like may be used. The values, ranges, magnitude relationships, and the like of the various parameters described in the above embodiments and the like are not limited to those described in the above embodiments and the like, and other values, ranges, magnitude relationships, and the like may be used.

Specifically, for example, in the above-described embodiment and the like, the description is given by taking the two-column type (having two nozzle rows An1, An2) ink jet head 4 as An example, but not limited to this example. That is, for example, a one-line type (having one nozzle row) ink jet head or a multi-line type (having three or more nozzle rows) ink jet head having three or more lines (for example, three or four lines) may be used.

In the above-described embodiments and the like, examples of the offset arrangement (staggered arrangement) of the nozzle holes H1(H11, H12), H2(H21, H22), structural examples of various plates (nozzle plate, actuator plate, cover plate, and alignment plate), and the like are specifically described, but not limited to these examples. That is, other configuration examples are possible for the offset arrangement of the nozzle holes and the configuration of the plates.

In the above-described embodiments, the case where each discharge channel (discharge groove) and each dummy channel (non-discharge groove) extend in the Y-axis direction (orthogonal direction to the parallel arrangement direction of the channels) in the actuator plate has been described as an example, but the present invention is not limited to this example. That is, for example, each of the discharge channels and each of the dummy channels may extend in an oblique direction (a direction forming an angle with each of the X-axis direction and the Y-axis direction) in the actuator plate.

In addition, in the above-described embodiment and the like, the shape of the common electrode Edc (two-stage configuration including the aforementioned first portion Edc1 and second portion Edc 2) is specifically described, but the shape of the common electrode Edc is not limited to this example. In addition, in the above-described embodiment and the like, the case where the electrode length Le2 of the second portion Edc2 is smaller than the electrode length Le1 of the first portion Edc in the common electrode Edc1 is exemplified (Le2< Le1), but the present invention is not limited to this example. That is, depending on the situation, it may also be that these electrode lengths Le1, Le2 are equal to each other (Le1= Le2), or conversely that the electrode length Le1 is smaller than the electrode length Le2 (Le1< Le2), for example.

For example, the cross-sectional shapes of the nozzle holes H1 and H2 are not limited to the circular shapes described in the above embodiments, and may be polygonal shapes such as elliptical shapes and triangular shapes, or star-shaped shapes. In addition, the cross-sectional shapes of the discharge channels C1e and C2e and the dummy channels C1d and C2d are formed by cutting with a cutter to form an arc-shaped (curved surface-shaped) side surface in the above-described embodiment and the like, but the present invention is not limited to this example. That is, for example, the discharge channels C1e and C2e and the dummy channels C1d and C2d may be formed by a machining method (etching, sandblasting, or the like) other than cutting by a cutter, so that the cross-sectional shapes thereof are various side shapes other than circular arc shapes.

In the above-described modifications 1 and 2, the case where all of the divergent flow path sections 431, 432, 431b, and 432b are configured to include the openings H31 and H32 in the alignment plate 415 has been described as an example, but the present invention is not limited to this example. In other words, the expanding flow path portions 431, 432, 431b, and 432b may be provided in the nozzle plate 411 or the actuator plate 412, respectively.

In the above-described embodiments and the like, the circulating type inkjet head used by circulating the ink 9 between the ink tank and the inkjet head has been described, but the present invention is not limited to this example. That is, the present disclosure may be applied to an ink jet head of a non-circulation type that is used without circulating the ink 9, depending on the situation.

As the structure of the inkjet head, various types of structures can be applied. That is, for example, in the above-described embodiments, a so-called side-shooter type ink jet head that ejects the ink 9 from the center portion in the extending direction of each ejection channel in the actuator plate is exemplified. However, without being limited to this example, the present disclosure may also be applied in other types of inkjet heads.

Further, the form of the printer is not limited to the form described in the above embodiments and the like, and various forms such as a MEMS (Micro Electro Mechanical Systems) form can be applied.

The series of processing described in the above embodiments and the like may be performed by hardware (circuit) or may be performed by software (program). In the case of software, the software is constituted by a program group for causing a computer to execute each function. Each program may be loaded in advance into the computer and used, or may be installed in the computer from a network or a recording medium and used.

In the above-described embodiments and the like, the printer 1 (ink jet printer) is described as an example of the "liquid jet recording apparatus" in the present disclosure, but the present disclosure is not limited to this example, and the present disclosure can be applied to apparatuses other than the ink jet printer. In other words, the "liquid ejection head" (inkjet head) of the present disclosure can also be applied to other apparatuses than inkjet printers. Specifically, for example, the "liquid ejection head" of the present disclosure can also be applied to a device such as a facsimile or an on-demand printer.

In addition, the various examples described above may be applied in any combination.

The effects described in the present specification are merely examples, are not limited, and other effects may be provided.

In addition, the present disclosure can also take the following configuration.

(1) A head chip for ejecting a liquid, comprising: an actuator plate having a plurality of discharge grooves arranged in parallel in a predetermined direction, and a plurality of electrodes provided individually on side walls of the plurality of discharge grooves and extending in an extending direction of the discharge grooves; a nozzle plate having a plurality of nozzle holes individually communicating with the plurality of discharge grooves; and a cover plate having a wall portion covering the discharge groove, a first through hole formed on one side of the wall portion along an extending direction of the discharge groove and adapted to allow the liquid to flow into the discharge groove, and a second through hole formed on the other side of the wall portion along the extending direction of the discharge groove and adapted to allow the liquid to flow out from the discharge groove, the plurality of nozzle holes including: a plurality of first nozzle holes that are disposed offset toward the first through hole in the extending direction of the discharge groove with reference to a center position of the discharge groove in the extending direction; and a plurality of second nozzle holes that are disposed offset toward the second through hole in the extending direction of the discharge groove with reference to a center position of the discharge groove in the extending direction, wherein a first cross-sectional area that is a cross-sectional area of a flow path of the liquid in a portion communicating with the first nozzle hole is smaller than a second cross-sectional area that is a cross-sectional area of a flow path of the liquid in a portion communicating with the second through hole in the first discharge groove that is the discharge groove communicating with the first nozzle hole, the second cross-sectional area is smaller than the first cross-sectional area in the second discharge groove that is the discharge groove communicating with the second nozzle hole, and positions of both ends of the electrodes in the extending direction of the discharge groove are aligned with each other in the plurality of electrodes in the predetermined direction.

(2) The head chip according to item (1) above, wherein the electrode includes: a first portion of the side wall provided on the nozzle plate side in the discharge groove; and a second portion of the side wall provided on the cap plate side in the ejection groove, wherein a length of the second portion in the extending direction of the ejection groove is smaller than a length of the first portion in the extending direction of the ejection groove, and positions of both ends of each of the first portion and the second portion in the extending direction of the ejection groove are aligned with each other in the plurality of electrodes in the predetermined direction.

(3) The head chip according to the above (1) or (2), wherein a first expanding channel portion that expands a third cross-sectional area that is a cross-sectional area of the channel of the liquid in the vicinity of the first nozzle hole is formed in the vicinity of the first nozzle hole, and a second expanding channel portion that expands a fourth cross-sectional area that is a cross-sectional area of the channel of the liquid in the vicinity of the second nozzle hole is formed in the vicinity of the second nozzle hole, a center position of the first expanding channel portion in the extending direction of the ejection groove coincides with a first center position that is a center position of the first nozzle hole, or a center position of the second expanding channel portion in the extending direction of the ejection groove deviates toward the first through hole side from the first center position, and a center position of the second expanding channel portion in the extending direction of the ejection groove coincides with a second center position that is a center position of the second nozzle hole, or is offset further toward the second through hole than the second center position along the extending direction of the discharge groove.

(4) The head chip described in (3) above further comprising an alignment plate that is disposed between the actuator plate and the nozzle plate and that has a third through hole for aligning the nozzle holes for each of the nozzle holes, wherein the first extended flow path portion and the second extended flow path portion are each configured to include the third through hole in the alignment plate.

(5) The head chip according to any one of the above (1) to (4), wherein a fifth cross-sectional area, which is a cross-sectional area of the flow path of the liquid at a position corresponding to the wall surface on the first through hole side of the wall portion, is smaller than a sixth cross-sectional area, which is a cross-sectional area of the flow path of the liquid at a position corresponding to the wall surface on the second through hole side of the wall portion, in the first ejection groove, and the sixth cross-sectional area is smaller than the fifth cross-sectional area in the second ejection groove.

(6) A liquid ejecting head comprising the head chip described in any one of (1) to (5) above.

(7) A liquid ejecting recording apparatus comprising the liquid ejecting head described in the above (6).

Description of the symbols

1 … … Printer

10 … … frame body

2a, 2b … … conveying mechanism

21 … … grid roller

22 … … pinch roll

3(3Y, 3M, 3C, 3K) … … ink tank

4(4Y, 4M, 4C, 4K), 4a, 4b … … ink jet head

41. 41a, 41b … … head chip

411 … … nozzle plate

412 … … actuator plate

413 … … cover plate

415 … … alignment board

420 … … tail

421. 422 … … channel column

431. 431a, 431b, 432a, 432b … … expanding flow path section

50 … … circulation flow path

50a, 50b … … flow path (supply pipe)

6 … … scanning mechanism

61a, 61b … … guide rail

62 … … carriage

63 … … driving mechanism

631a, 631b … … pulley

632 … … endless belt

633 … … driving motor

9 … … ink

P … … recording paper

d … … conveying direction

H1, H11, H12, H2, H21, H22 … … nozzle orifices

H31 and H32 … … openings

Nozzle arrays of An1, An11, An12, An2, An21, An22 … …

C1, C2 … … channel

C1e (C1e1, C1e2), C2e … … spitting channel

C1d, C2d … … dummy channel (non-spitting channel)

Wd … … drive wall

Ed … … drive electrode

Eda … … Individual electrode (active electrode)

Edc … … common electrode (common electrode)

Edc1 … … first part

Second part of Edc2 … …

Pda … … individual electrode pad

Pdc … … common electrode pad

D … … groove

Inlet side common flow path for Rin1 and Rin2 … …

Outlet side common flow path of Rout1 and Rout2 … …

Sin1 … … first supply slit

Sout1 … … first discharge slit

Sp1 … … first slit pair

W1, W2 … … wall part

Lw1 … … first pump length

Lin1 … … first feed slit length

Lout1 … … first discharge slit length

Le1, Le2 … … electrode length

First inlet side flow channel Width of Win1 … …

First outlet side flow channel Width of Wout1 … …

First inlet side flow passage sectional area of Sfin1 … …

First outlet side flow passage sectional area of Sfout1 … …

Sf3, Sf4 … … nozzle hole nearby flow path cross section

Cross-sectional area of flow path at wall surface positions of Sf5 and Sf6 … …

Pc1, Pn11, Pn12, Ph31 and Ph32 … … center positions

End positions of Pe1a, Pe1b, Pe2a and Pe2b … …

M … … mask

Ap1 and Ap2 … … openings

Eva 1 and Ev2 … … vapor deposition directions

SL … … makes slits.