阅读说明：本技术 一种超小型片式元件生产设备 (Subminiature piece formula component production facility ) 是由 余小辉 于 2021-07-02 设计创作，主要内容包括：本发明公开了一种超小型片式元件生产设备,涉及片式元件生产设备技术领域,包括输送载体,所述输送载体的内部活动连接有多组固定组件,所述输送载体的内部分别安装有与固定组件相配合的水平传动机构与竖直传动机构,且水平传动机构与竖直传动机构之间相互配合,所述水平传动机构包括第一输出轴、活动板与第一缓冲组件。本发明在使用时,需要拿取片式元件时,通过旋转水平传动机构,使其将固定组件打开,这一过程中,水平传动机构通过传动机构的作用,带动竖直传动机构进行工作,从而将放置组件从而输送载体的内部移动出来,且固定组件打开与放置组件的上升为同步进行,即固定组件完全打开时,固定组件也完成移出,大大降低了整体的劳动成本。(The invention discloses subminiature chip component production equipment, which relates to the technical field of chip component production equipment and comprises a conveying carrier, wherein a plurality of groups of fixed components are movably connected inside the conveying carrier, a horizontal transmission mechanism and a vertical transmission mechanism which are matched with the fixed components are respectively installed inside the conveying carrier, the horizontal transmission mechanism and the vertical transmission mechanism are mutually matched, and the horizontal transmission mechanism comprises a first output shaft, a movable plate and a first buffer component. When the device is used and a chip component needs to be taken, the horizontal transmission mechanism is rotated to open the fixing component, in the process, the horizontal transmission mechanism drives the vertical transmission mechanism to work under the action of the transmission mechanism, so that the placing component and the inner part of the conveying carrier are moved out, the opening of the fixing component and the lifting of the placing component are synchronously carried out, namely when the fixing component is completely opened, the fixing component is also moved out, and the integral labor cost is greatly reduced.)

1. A microminiature chip component manufacturing apparatus comprising a transport carrier (1), characterized in that: a plurality of groups of fixed assemblies (2) are movably connected inside the conveying carrier (1), a horizontal transmission mechanism and a vertical transmission mechanism which are matched with the fixed assemblies (2) are respectively installed inside the conveying carrier (1), and the horizontal transmission mechanism and the vertical transmission mechanism are matched with each other;

the horizontal transmission mechanism comprises a first output shaft (3), a movable plate (10) and a first buffer component (6), the outer side of the first output shaft (3) is matched with the fixed component (2) through a movable plate (10), and a first buffer component (6) connected with the conveying carrier (1) is arranged between the two corresponding groups of movable plates (10), the vertical transmission mechanism comprises a second output shaft (4), a connecting plate (12) and a second buffer component (14), the second output shaft (4) is arranged inside the conveying carrier (1), a connecting plate (12) is arranged at the outer side of the second output shaft (4) in a matching way, two groups of second buffer assemblies (14) are symmetrically arranged at the outer side of the second output shaft (4), a transmission assembly is arranged between the horizontal transmission mechanism and the vertical transmission mechanism, and a placing assembly (9) matched with the fixing assembly (2) is connected to the inside of the conveying carrier (1) in a sliding mode.

2. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the transmission assembly comprises a rotating shaft (17), a first worm gear (18) and a second worm gear (19), the rotating shaft (17) is movably connected inside the conveying carrier (1), and the first worm gear (18) and the second worm gear (19) are respectively arranged between the rotating shaft (17) and the first output shaft (3) and between the rotating shaft (17) and the second output shaft (4).

3. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the conveying carrier (1) comprises a main body (101), a placing cavity (102) and a first sliding groove (103), the placing cavity (102) matched with the fixing component (2) is formed in the top of the main body (101), and the first sliding groove (103) matched with the placing component (9) is formed in each of two sides of the inside of the placing cavity (102).

4. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: fixed subassembly (2) include first activity clamping bar (201), second activity clamping bar (202), connecting axle (203), first spring (204) and first push pedal (205), the inside of placing chamber (102) is connected with first activity clamping bar (201) and second activity clamping bar (202) respectively through connecting axle (203), the bottom is provided with two first springs (204) of symmetry between first activity clamping bar (201) and second activity clamping bar (202), first activity clamping bar (201) and second activity clamping bar (202) bottom all are provided with first push pedal (205) with fly leaf (10) matched with.

5. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the placing component (9) comprises a placing platform (901), a first sliding block (902) and a third spring (903), supporting columns (11) matched with the placing platform (901) are evenly arranged at the top of the connecting plate (12), the first sliding block (902) matched with the first sliding groove (103) is arranged on two sides of the placing platform (901), and the first sliding block (902) is connected with a supporting boss inside the conveying carrier (1) through the third spring (903).

6. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the outer side of the first output shaft (3) is respectively and uniformly provided with a second toothed area (15) and a third toothed area (16) which are matched with the corresponding movable plate (10), the outer side of the second output shaft (4) is provided with a first toothed area (13) which is matched with the connecting plate (12), and the second toothed area (15), the third toothed area (16) and the first toothed area (13) are matched with each other.

7. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the first buffer assembly (6) comprises a first fixed seat (601), a second spring (602) and a second push plate (603), the first fixed seat (601) is arranged between the movable plates (10), the second spring (602) is arranged on two sides of the first fixed seat (601), and the second push plate (603) is connected to the first fixed seat (601) through the second spring (602).

8. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the second buffer assembly (14) comprises a second fixed seat (1401), a fourth spring (1402) and a third push plate (1403), the second fixed seat (1401) is arranged at the outer side of the second output shaft (4) and located at two ends of the first toothed area (13), the fourth spring (1402) is arranged on the same side of the second fixed seat (1401), and the second fixed seat (1401) is connected with the third push plate (1403) through the fourth spring (1402).

9. A subminiature chip component manufacturing apparatus in accordance with claim 1, wherein: the bottom of carrying carrier (1) is provided with conveying platform (8), and conveying platform (8) are connected with carrying carrier (1) through magnetism structure of inhaling, carry carrier (1) inside bottom seted up with fly leaf (10) matched with second spout (7), the outside of carrying carrier (1) is provided with first output shaft (3) matched with rotary disk (5), and the outside of rotary disk (5) is provided with the hand crank.

Technical Field

The invention relates to the technical field of chip element production equipment, in particular to subminiature chip element production equipment.

Background

The chip component is a novel tiny component without lead or short lead, also called chip component, which is suitable for being installed on a printed board without through holes, is a special component of SMT, and the SMT is an abbreviation of surface mounting technology.

Although the existing subminiature chip component production equipment has a large number of types and quantities, the existing subminiature chip component production equipment still has certain problems, and brings certain inconvenience to the use of the subminiature chip component production equipment, wherein in the most important point, the chip component is easy to lose and cause waste when being transported on a production line because of small volume.

The notice number is: CN110993572A discloses a subminiature chip component production equipment convenient for protecting components, which is provided with a pull rod and a push plate, wherein the pull rod is pulled, the push plate is driven by the pull rod to move, when the moving plate is far away from the chip component, the push plate and the mounting seat form an elastic connection through a second spring to directly eject the chip component above the push plate, so when the chip component is taken, the pull rod is required to be pulled to both sides simultaneously to take out the chip component, the whole process is pipelined, which is too time-consuming and labor-consuming to meet the existing production requirements well, thereby greatly reducing the working efficiency.

Disclosure of Invention

Based on the above, the invention aims to provide a subminiature chip component production device, so as to solve the technical problems that in the prior art, when a chip component is taken, a pull rod needs to be pulled towards two sides simultaneously to take out the chip component, the whole process is in a pipeline type work, time and labor are wasted, the existing production requirements cannot be well met, the working efficiency is greatly reduced, the chip component is easy to collide with other parts during taking, certain damage is caused to the chip component, and the production cost is greatly improved.

In order to achieve the purpose, the invention provides the following technical scheme: a microminiature piece type element production device comprises a conveying carrier, wherein a plurality of groups of fixing assemblies are movably connected inside the conveying carrier, a horizontal transmission mechanism and a vertical transmission mechanism which are matched with the fixing assemblies are respectively installed inside the conveying carrier, and the horizontal transmission mechanism and the vertical transmission mechanism are matched with each other;

the horizontal transmission mechanism comprises a first output shaft, movable plates and a first buffer assembly, the outer side of the first output shaft is matched with the fixed assembly through the movable plates, the first buffer assembly connected with a conveying carrier is arranged between two groups of corresponding movable plates, the vertical transmission mechanism comprises a second output shaft, a connecting plate and a second buffer assembly, the second output shaft is arranged inside the conveying carrier, the connecting plate is arranged on the outer side of the second output shaft in a matched mode, two groups of second buffer assemblies are symmetrically arranged on the outer side of the second output shaft, the transmission assembly is arranged between the horizontal transmission mechanism and the vertical transmission mechanism, and the placing assembly matched with the fixed assembly is connected to the inner portion of the conveying carrier in a sliding mode.

By adopting the technical scheme, when the chip component taking device is used and a chip component needs to be taken, the horizontal transmission mechanism is rotated to open the fixed component, in the process, the horizontal transmission mechanism drives the vertical transmission mechanism to work under the action of the transmission mechanism, so that the placed component is moved out of the interior of the conveying carrier, and the opening of the fixed component and the lifting of the placed component are synchronously carried out, namely when the fixed component is completely opened, the fixed component is also moved out, and the integral labor cost is greatly reduced.

The transmission assembly further comprises a rotating shaft, a first worm gear and a second worm gear, the rotating shaft is movably connected inside the conveying carrier, and the first worm gear and the second worm gear are respectively arranged between the rotating shaft and the first output shaft and between the rotating shaft and the second output shaft.

Through adopting above-mentioned technical scheme, utilize transmission assembly's effect, be convenient for make and produce the transmission relation between horizontal drive mechanism and the vertical drive mechanism to be convenient for make whole better operation of carrying on.

The conveying carrier further comprises a main body, a placing cavity and a first sliding groove, wherein the top of the main body is provided with the placing cavity matched with the fixing component, and two sides of the inner part of the placing cavity are provided with the first sliding grooves matched with the placing component.

Through adopting above-mentioned technical scheme, utilize the effect of placing the chamber, be convenient for install fixed subassembly, recycle the effect of first spout, be convenient for and first slider between cooperate for place the more stable that the subassembly removed.

The movable push plate type spring rack is further arranged in that the fixed assembly comprises a first movable clamping rod, a second movable clamping rod, a connecting shaft, a first spring and a first push plate, the first movable clamping rod and the second movable clamping rod are respectively connected with the inside of the placing cavity through the connecting shaft, two symmetrical first springs are arranged at the bottom between the first movable clamping rod and the second movable clamping rod, and the first push plate matched with the movable plate is arranged at the bottoms of the first movable clamping rod and the second movable clamping rod.

Through adopting above-mentioned technical scheme, utilize fixed subassembly's effect, be convenient for fix the piece formula component, and utilize first movable clamping bar and the movable clamping bar of second to protect the piece formula component surface.

The invention is further provided that the placing component comprises a placing platform, a first sliding block and a third spring, supporting columns matched with the placing platform are uniformly arranged at the top of the connecting plate, the first sliding block matched with the first sliding groove is arranged on both sides of the placing platform, and the first sliding block is connected with a supporting boss in the conveying carrier through the third spring.

Through adopting above-mentioned technical scheme, the effect of placing the subassembly is utilized, is convenient for place the piece formula component, and the effect of recycling first slider is convenient for cooperate with first spout, utilizes the effect of third spring at last, is convenient for place the in-process that the subassembly moved down, starts cushioning effect to placing the subassembly.

The invention is further arranged in such a way that a second toothed area and a third toothed area which are matched with the corresponding movable plates are respectively and uniformly arranged on the outer side of the first output shaft, a first toothed area which is matched with the connecting plate is arranged on the outer side of the second output shaft, and the second toothed area, the third toothed area and the first toothed area are mutually matched.

Through adopting above-mentioned technical scheme, utilize under the second area of tooth district, the third area of tooth district and the first cooperation of taking between the tooth district for when fixed subassembly was to the fixed of piece formula component, the transport carrier was accomodate the piece formula component.

The invention is further arranged that the first buffer component comprises a first fixed seat, a second spring and a second push plate, the first fixed seat is arranged between two corresponding groups of the movable plates, the second spring is arranged on both sides of the first fixed seat, and the first fixed seat is connected with the second push plate through the second spring.

By adopting the technical scheme, the movable plate is firstly buffered by utilizing the action of the first buffer component, and the movable plate and the corresponding toothed area in a non-pressure state are butted by utilizing the elastic action of the second spring, so that the task is conveniently completed.

The invention is further arranged in that the second buffer component comprises a second fixed seat, a fourth spring and a third push plate, the second fixed seats are arranged at the two ends of the outer side of the second output shaft and positioned in the first toothed area, the fourth springs are arranged at the same side of the second fixed seat, and the second fixed seat is connected with the third push plate through the fourth springs.

Through adopting above-mentioned technical scheme, utilize the second buffer unit effect, be convenient for carry out cushioning effect to the connecting plate, utilize the effect of fourth spring, make connecting plate and first area tooth district under no pressure state dock, be convenient for accomplish the task.

The invention is further arranged in such a way that a conveying platform is arranged at the bottom of the conveying carrier and is connected with the conveying carrier through a magnetic attraction structure, a second sliding groove matched with the movable plate is formed in the bottom end of the interior of the conveying carrier, a rotating disc matched with the first output shaft is arranged on the outer side of the conveying carrier, and a handle is arranged on the outer side of the rotating disc.

Through adopting above-mentioned technical scheme, utilize conveying platform's effect, be convenient for carry the carrier to utilize the effect of magnetism to inhale, be convenient for dismantle and install the carrier of carrying.

In summary, the invention mainly has the following beneficial effects:

when the device is used and a chip component needs to be taken, the horizontal transmission mechanism is rotated to open the fixing component, and in the process, the horizontal transmission mechanism drives the vertical transmission mechanism to work under the action of the transmission mechanism, so that the placing component and the inner part of the conveying carrier are moved out, and the opening of the fixing component and the lifting of the placing component are synchronously carried out, namely when the fixing component is completely opened, the fixing component is also moved out, and the overall labor cost is greatly reduced;

the invention also utilizes the action of the first buffer component and the second buffer component to avoid the situation that the horizontal transmission mechanism and the vertical transmission mechanism are too fast to collide and shake due to improper operation, greatly reduce the shaking of the equipment, enable the chip component to be more stable when moving out, avoid unnecessary damage due to collision between the chip component and other equipment parts caused by ejection, protect the conveyed parts and reduce the use cost.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is an external structural schematic of the present invention;

FIG. 3 is an internal structural schematic of the present invention;

FIG. 4 is an enlarged view of the invention at A in FIG. 3;

FIG. 5 is an external view of the first output shaft of the present invention;

FIG. 6 is a schematic side sectional view of the present invention.

In the figure: 1. conveying the carrier; 101. a main body; 102. a placement chamber; 103. a first chute; 2. a fixing assembly; 201. a first movable clamping bar; 202. a second movable clamping bar; 203. a connecting shaft; 204. a first spring; 205. a first push plate; 3. a first output shaft; 4. a second output shaft; 5. rotating the disc; 6. a buffer assembly; 601. a first fixed seat; 602. a second spring; 603. a second push plate; 7. a second chute; 8. a conveying platform; 9. placing the component; 901. placing a platform; 902. a first slider; 903. a third spring; 10. a movable plate; 11. a support pillar; 12. a connecting plate; 13. a first toothed region; 14. a second buffer assembly; 1401. a second fixed seat; 1402. a fourth spring; 1403. a third push plate; 15. a second toothed region; 16. a third toothed region; 17. a rotating shaft; 18. a first worm gear; 19. a second worm gear.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following describes an embodiment of the present invention based on its overall structure.

An ultra-small chip component production device is shown in figures 1-6 and comprises a conveying carrier 1, wherein a plurality of groups of fixed assemblies 2 are movably connected inside the conveying carrier 1, a horizontal transmission mechanism and a vertical transmission mechanism which are matched with the fixed assemblies 2 are respectively installed inside the conveying carrier 1, and the horizontal transmission mechanism and the vertical transmission mechanism are mutually matched;

the horizontal transmission mechanism comprises a first output shaft 3, a movable plate 10 and a first buffer assembly 6, the outer side of the first output shaft 3 is matched with the fixed assembly 2 through the movable plate 10, the first buffer assembly 6 connected with the conveying carrier 1 is arranged between two groups of movable plates 10 correspondingly, the vertical transmission mechanism comprises a second output shaft 4, a connecting plate 12 and a second buffer assembly 14, the second output shaft 4 is arranged in the conveying carrier 1, the outer side of the second output shaft 4 is matched with the connecting plate 12, two groups of second buffer assemblies 14 are symmetrically arranged on the outer side of the second output shaft 4, a transmission assembly is arranged between the horizontal transmission mechanism and the vertical transmission mechanism, the inner part of the conveying carrier 1 is slidably connected with a placing assembly 9 matched with the fixed assembly 2, the horizontal transmission mechanism is rotated to open the fixed assembly 2, and in the process, the horizontal transmission mechanism is under the action of the transmission mechanism, drive vertical drive mechanism and carry out work to will place subassembly 9 and thus the inside of carrying carrier 1 removes out, and fixed subassembly 2 opens and goes on for the synchronization with the rising of placing subassembly 9, when fixed subassembly 2 opened completely promptly, fixed subassembly 2 also accomplished to shift out, greatly reduced holistic labour cost.

Referring to fig. 3, the transmission assembly includes a rotation shaft 17, a first worm gear 18 and a second worm gear 19, the rotation shaft 17 is movably connected inside the conveying carrier 1, the first worm gear 18 and the second worm gear 19 are respectively disposed between the rotation shaft 17 and the first output shaft 3, the second output shaft 4, and the horizontal transmission mechanism and the vertical transmission mechanism are in transmission connection by the action of the transmission assembly, so that the whole conveying carrier can better operate.

Referring to fig. 1, the conveying carrier 1 includes a main body 101, a placing cavity 102 and a first sliding groove 103, the top of the main body 101 is provided with the placing cavity 102 matched with the fixing component 2, the two sides inside the placing cavity 102 are both provided with the first sliding groove 103 matched with the placing component 9, the fixing component 2 is conveniently installed by using the effect of the placing cavity 102, and the effect of the first sliding groove 103 is reused to be conveniently matched with the first sliding block 902, so that the placing component 9 is more stably moved.

Referring to fig. 3, the fixing assembly 2 includes a first movable clamping bar 201, a second movable clamping bar 202, a connecting shaft 203, a first spring 204 and a first push plate 205, the interior of the placing cavity 102 is connected to the first movable clamping bar 201 and the second movable clamping bar 202 through the connecting shaft 203, two symmetrical first springs 204 are disposed at the bottom between the first movable clamping bar 201 and the second movable clamping bar 202, the first push plate 205 matched with the movable plate 10 is disposed at the bottom of the first movable clamping bar 201 and the second movable clamping bar 202, the fixing assembly 2 is utilized to fix the sheet type element, and the first movable clamping bar 201 and the second movable clamping bar 202 are utilized to protect the surface of the sheet type element.

Referring to fig. 6, the placing assembly 9 includes a placing platform 901, a first slider 902 and a third spring 903, the top of the connecting plate 12 is uniformly provided with supporting pillars 11 matching with the placing platform 901, both sides of the placing platform 901 are provided with the first slider 902 matching with the first sliding slot 103, the first slider 902 is connected with the supporting boss inside the conveying carrier 1 through the third spring 903, the sheet element is conveniently placed by using the effect of the placing assembly 9, the first slider 902 is matched with the first sliding slot 103 by using the effect of the first slider 902, and finally the third spring 903 is used to start a buffering effect on the placing assembly 9 in the process of moving down the placing assembly 9.

Referring to fig. 5, the outer side of the first output shaft 3 is uniformly provided with a second toothed region 15 and a third toothed region 16 respectively, which are matched with the corresponding movable plate 10, the outer side of the second output shaft 4 is provided with a first toothed region 13 matched with the connecting plate 12, and the second toothed region 15, the third toothed region 16 and the first toothed region 13 are matched with each other, so that the fixing component 2 fixes the sheet-type component and the transport carrier 1 stores the sheet-type component by using the mutual matching among the second toothed region 15, the third toothed region 16 and the first toothed region 13.

Referring to fig. 5, the first buffer assembly 6 includes a first fixing seat 601, a second spring 602 and a second push plate 603, the first fixing seat 601 is disposed between two corresponding sets of movable plates 10, the second spring 602 is disposed on both sides of the first fixing seat 601, and the first fixing seat 601 is connected to the second push plate 603 through the second spring 602, by using the effect of the first buffer assembly 6, the movable plate 10 moving under no pressure is firstly buffered, and by using the elastic force of the second spring 602, the movable plate 10 and the corresponding toothed area are butted in a non-pressure state, so as to complete the task.

Referring to fig. 4, the second buffer assembly 14 includes a second fixing seat 1401, a fourth spring 1402 and a third push plate 1403, the second fixing seat 1401 is disposed at both ends of the first toothed region 13 and outside the second output shaft 4, the fourth spring 1402 is disposed at the same side of the second fixing seat 1401, and the third push plate 1403 is connected to the second fixing seat 1401 through the fourth spring 1402, so that the second buffer assembly 14 can buffer the connecting plate 12, and the fourth spring 1402 can butt the connecting plate 12 and the first toothed region 13 in a non-pressure state, thereby facilitating the task.

Referring to fig. 1 and 2, a conveying platform 8 is disposed at the bottom of the conveying carrier 1, the conveying platform 8 is connected to the conveying carrier 1 through a magnetic attraction structure, a second chute 7 matched with a movable plate 10 is disposed at the bottom end inside the conveying carrier 1, a rotating disk 5 matched with the first output shaft 3 is disposed outside the conveying carrier 1, a handle is disposed outside the rotating disk 5, the conveying carrier 1 is conveyed conveniently by the aid of the conveying platform 8, and the conveying carrier 1 is detached and mounted conveniently by the aid of the magnetic attraction.

The working principle of the invention is as follows: when the device is used, the initial position of the fixing component 2 is in an open state, and the placing component 9 is positioned inside the conveying carrier 1, so that when a sheet element needs to be placed, the first output shaft 3 only needs to be rotated by the rotating disk 5, the second toothed area 15 and the third toothed area 16 are uniformly arranged at the outer side of the first output shaft 3 corresponding to the fixing component 2, and the rest parts are optical axes, so that the first output shaft 3 is rotated, the fixing component 2 keeps the open state under the action of the first buffer component 6, the rotating shaft 17 is driven to rotate under the action of the first worm gear 18, the second worm gear 19 is matched to drive the second output shaft 4 to rotate, the downward pressing force of the connecting plate 12 disappears, the connecting plate 12 is matched with the first toothed area 13 under the action of the fourth spring 1402, and under the action of the guide column, moving the connecting plate 12 upwards, and in cooperation with the action of the supporting column 11, slowly moving the placing platform 901 upwards along the first sliding chute 103 until the connecting plate 12 is contacted with the second buffer component 14 above the first toothed region 13, and then separating the connecting plate 12 from the first toothed region 13, so that the placing platform 901 is kept stationary, and then placing the chip component on the placing platform 901;

next, the first output shaft 3 is driven in the direction, under the action of the first buffer assembly 6 and the second buffer assembly 14, the connecting plate 12 is matched with the first toothed area 13, the movable plate 10 is matched with the corresponding second toothed area 15 and the third toothed area 16, that is, the connecting plate 12 is driven by the placing assembly 9 to move down, meanwhile, the movable plate 10 drives the corresponding first pushing plate 205 to move outwards, under the action of the connecting shaft 203, the first movable clamping rod 201 and the second movable clamping rod 202 move towards the sheet element, after the placing assembly 9 moves onto the supporting boss, the fixing assembly 2 also completes fixing, fixing protection of the sheet element is completed, and finally, the conveying carrier 1 and the conveying platform 8 are connected through magnetic attraction, so that disassembly, maintenance and installation are facilitated.

Although embodiments of the present invention have been shown and described, it is intended that the present invention should not be limited thereto, that the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples, and that modifications, substitutions, variations or the like, which are not inventive and may be made by those skilled in the art without departing from the principle and spirit of the present invention and without departing from the scope of the claims.