阅读说明：本技术 一种1.5 d腔内超声微探头及成像方法 (1.5D intracavity ultrasonic microprobe and imaging method ) 是由 简小华 徐杰 于 2021-02-25 设计创作，主要内容包括：本发明涉及1.5 D腔内超声微探头及成像方法,该探头包括声透镜、匹配层、压电层、背衬、柔性电路板、及连接线缆,其中压电层、背衬、柔性电路板形成阵列成像,阵列成像具有多组相隔开的阵元,每组阵元包括中心阵元N、阵元N-1和阵元N-2,其中阵元N-1和阵元N-2之间并联连接,中心阵元N通过电容与并联的阵元N-1和阵元N-2并联连通,且每组阵元仅需一根同轴线。本发明在不增加探头尺寸和传输线缆数的情况下,通过电容和仅需一根同轴线的连线方式,实现阵元N与并联的N-1和N-2所激发超声波的相位/时间延迟,进而改进其在空间的声场分布,改善成像质量,实现1.5D超声内窥镜探头的高性能超声成像,结构简单,成本低。(The invention relates to a 1.5D intracavity ultrasonic microprobe and an imaging method, the microprobe comprises an acoustic lens, a matching layer, a piezoelectric layer, a backing, a flexible circuit board and a connecting cable, wherein the piezoelectric layer, the backing and the flexible circuit board form array imaging, the array imaging is provided with a plurality of groups of array elements which are separated from each other, each group of array elements comprises a central array element N, an array element N-1 and an array element N-2, the array element N-1 and the array element N-2 are connected in parallel, the central array element N is connected with the array element N-1 and the array element N-2 which are connected in parallel through a capacitor, and each group of array elements only needs one coaxial line. Under the condition of not increasing the size of the probe and the number of transmission cables, the phase/time delay of ultrasonic waves excited by the array element N and the N-1 and N-2 connected in parallel is realized by a connection mode of a capacitor and only one coaxial line, so that the sound field distribution of the ultrasonic endoscope probe in space is improved, the imaging quality is improved, the high-performance ultrasonic imaging of the 1.5D ultrasonic endoscope probe is realized, the structure is simple, and the cost is low.)

1. A1.5D intracavity ultrasound microprobe, which comprises an acoustic lens, a matching layer, a piezoelectric layer, a backing, a flexible circuit board and a connecting cable, wherein the piezoelectric layer, the backing and the flexible circuit board form an array imaging, the array imaging has a plurality of groups of array elements which are separated, each group of array elements comprises a central array element N, and an array element N-1 and an array element N-2 which are separated from two end parts of the central array element N, wherein the array element N-1 and the array element N-2 are connected in parallel, and the intracavity ultrasound microprobe is characterized in that: the central array element N is connected with the array element N-1 and the array element N-2 which are connected in parallel through a capacitor in parallel, and only one coaxial line is needed for each group of array elements.

2. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: and the width of each array element in each group of array elements is equal.

3. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: the length ratio of a central array element N, an array element N-1 and an array element N-2 in each group of array elements is 2: 1: 1.

4. the 1.5D intracavity ultrasound microprobe of claim 3, wherein: the array element N-1 and the array element N-2 are respectively equal to the spacing distance between the central array element N.

5. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: and a blank gap is formed between every two adjacent groups of array elements, and high molecular polymers are filled in the blank gap.

6. The 1.5D intracavity ultrasound microprobe of claim 5, wherein: the high molecular polymer is epoxy resin or rubber.

7. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: and each group of array elements is connected with the negative electrode in common through a conductive matching layer or a bonding wire.

8. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: the backing is made of a conductive material and is positioned between the flexible circuit board and the piezoelectric layer.

9. The 1.5D intracavity ultrasound microprobe of claim 1, wherein: the backing is made of non-conductive material and is positioned at the bottom of the flexible circuit board.

10. An ultrasound imaging method characterized by: the ultrasonic imaging method adopts the 1.5D intracavity ultrasonic microprobe of any one of claims 1 to 9, and comprises the following steps:

1) and setting the time delay needed by the array element N-1 and the array element N-2 to be delta T according to the measurement requirement, and then determining the size of the capacitor C connected in parallel in the circuit by the following formula:

c = -R × ln ((E-V)/E)/Delta T formula (1)

In the formula (1), R is the impedance of the probe array element, E is the excitation voltage, V is the capacitor charging and discharging voltage, and meanwhile, the capacitance value required to be connected in parallel of each array element is determined according to the formula (1) to complete the manufacture and packaging of the endoscopic probe;

2) sequentially exciting each probe, receiving echo signals, performing beam forming and subsequent processing, wherein the received echo signals are delayed by a circuit,

t = -R × C × ln (V/U) formula (2)

T in formula (2) is specific delay time, R is the impedance of probe array element, C is the capacitance value, V is capacitance charging and discharging voltage, U is signal strength, simultaneously, in the echo processing process, because the delay that the probe circuit produced to combine the calculated result of formula (2), carry out time compensation to the echo of array element.

Technical Field

The invention belongs to the technical field of clinical medical treatment, and particularly relates to a 1.5D intracavity ultrasound microprobe and an imaging method adopting the 1.5D intracavity ultrasound microprobe.

Background

An ultrasonic endoscope is a technology for using ultrasonic waves for imaging examination of an internal cavity of a human body, and a small-sized ultrasonic probe is arranged at the front end of an interventional catheter and is inserted into an esophagus, a stomach and intestine, a bronchus and the like to perform real-time scanning imaging, auxiliary diagnosis and treatment and the like.

The existing intracavity ultrasonic probe is limited by the limited size of the cavity channel, and is mostly a 1-dimensional linear array, convex array or phased array probe, so that the resolution ratio of the probe in the thickness slicing direction is insufficient. And one very important use of the multi-array element intracavity ultrasonic probe is the guide puncture or treatment of in-vivo ultrasound, and the current probe technology causes the intracavity ultrasound diagnosis and treatment precision to be limited.

Meanwhile, each array element of the traditional intracavity probe is generally connected with a positive electrode and a negative electrode, wherein the negative electrodes are generally common to the ground and need a coaxial line. The traditional 1.5D probe connection mode is that the upper and lower array elements and the middle array element are separately connected, namely two coaxial lines are needed. Therefore, there is a need in the market for a 1.5D ultrasound endoscope probe that enables high performance ultrasound imaging without increasing the probe size and the number of transmission cables.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide an improved 1.5D intracavity ultrasonic microprobe.

Meanwhile, the invention also relates to an imaging method adopting the 1.5D intracavity ultrasonic microprobe.

In order to solve the technical problems, the invention adopts the following technical scheme:

the utility model provides a 1.5D intracavity supersound microprobe, its includes acoustic lens, matching layer, piezoelectric layer, backing, flexible circuit board and connecting cable, wherein piezoelectric layer, backing, flexible circuit board form the array formation of image, and the array formation of image has multiunit spaced array element, every group array element includes central array element N and with central array element N-1 and array element N-2 that both ends were separated, wherein array element N-1 with parallel connection between the array element N-2, central array element N passes through electric capacity and parallelly connected array element N-1 and array element N-2 parallel intercommunication, and only need a coaxial line for every group array element.

Preferably, the width of each array element in each group of array elements is equal. The method is beneficial to regulation and control of subsequent sound fields and is convenient for batch cutting processing and treatment.

According to a specific embodiment and preferred aspect of the present invention, the length ratio of the central array element N, the array element N-1 and the array element N-2 in each group of array elements is 2: 1: 1. the phase delay of the ultrasonic waves excited by the array element N and the parallel N-1 and N-2 is optimally realized, so that the sound field distribution of the ultrasonic waves in the space is improved, and the imaging quality is improved.

Preferably, array element N-1 and array element N-2 are spaced apart from the central array element N by the same distance. The symmetrical structure is more favorable for adjusting the sound field distribution of the probe in the space.

Preferably, a blank gap is formed between every two adjacent groups of array elements, and the blank gap is filled with high molecular polymer. The probe array element structure can be effectively ensured, and the damage of bending, collision and oxidation to the structure is avoided.

Further, the high molecular polymer is epoxy resin or rubber. Stable and reliable performance, convenient operation and low price.

According to yet another embodiment and preferred aspect of the present invention, each group of array elements is commonly connected to the negative electrode by a conductive matching layer or a bonding wire. In the embodiment, the cathode of the array element is connected with the ground in common by adopting the conductive matching layer, so that the implementation is more convenient, and the structure can be simplified.

Preferably, the backing is made of an electrically conductive material and the backing is located between the flexible circuit board and the piezoelectric layer. In this way, the flexible circuit board and the piezoelectric layer can be electrically connected through the backing.

Alternatively, the backing is made of a non-conductive material and is located on the bottom of the flexible circuit board.

In addition, a bonding wire and a bonding pad are formed on the flexible circuit board. Therefore, the circuit of each group of array elements is convenient to conduct.

The other technical scheme of the invention is as follows: an ultrasonic imaging method adopts the 1.5D intracavity ultrasonic microprobe and comprises the following steps:

1) and setting the time delay needed by the array element N-1 and the array element N-2 to be delta T according to the measurement requirement, and then determining the size of the capacitor C connected in parallel in the circuit by the following formula:

c = -R × ln ((E-V)/E)/Delta T formula (1)

In the formula (1), R is the impedance of the probe array element, E is the excitation voltage, V is the capacitor charging and discharging voltage, and meanwhile, the capacitance value required to be connected in parallel of each array element is determined according to the formula (1) to complete the manufacture and packaging of the endoscopic probe;

2) sequentially exciting each probe, receiving echo signals, performing beam forming and subsequent processing, wherein the received echo signals are delayed by a circuit,

t = -R × C × ln (V/U) formula (2)

T in formula (2) is specific delay time, R is the impedance of probe array element, C is the capacitance value, V is capacitance charging and discharging voltage, U is signal strength, simultaneously, in the echo processing process, because the delay that the probe circuit produced to combine the calculated result of formula (2), carry out time compensation to the echo of array element.

Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:

under the condition of not increasing the size of the probe and the number of transmission cables, the phase/time delay of ultrasonic waves excited by the array element N and the N-1 and N-2 connected in parallel is realized by a connection mode of a capacitor and only one coaxial line, so that the sound field distribution of the ultrasonic endoscope probe in space is improved, the imaging quality is improved, the high-performance ultrasonic imaging of the 1.5D ultrasonic endoscope probe is realized, and meanwhile, the ultrasonic endoscope probe is simple in structure and low in cost.

Drawings

FIG. 1 is a schematic front view of a 1.5D intracavity ultrasound microprobe of the present invention;

FIG. 2 is a schematic top view of the array element of FIG. 1;

FIG. 3 is a schematic view of the probe of FIG. 1;

wherein: 1. an acoustic lens; 2. a matching layer; 3. a piezoelectric layer; 4. a backing; 5. a flexible circuit board; C. a capacitor; n, central array element; n-1, N-2, array elements.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacted with the first and second features, or indirectly contacted with the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the 1.5D intracavity ultrasound microprobe according to the present embodiment includes an acoustic lens 1, a matching layer 2, a piezoelectric layer 3, a backing 4, a flexible circuit board 5, and a connection cable.

Specifically, the piezoelectric layer 3, the backing 4 and the flexible circuit board 5 form an array image, the array image has a plurality of groups of spaced array elements, each group of array elements includes a central array element N, and an array element N-1 and an array element N-2 spaced from two end portions of the central array element N.

As shown in fig. 2, the width of each array element in each group of array elements is equal.

The length ratio of the central array element N, the array element N-1 and the array element N-2 in each group of array elements is 2: 1: 1. the phase delay of the ultrasonic waves excited by the array element N and the parallel N-1 and N-2 is optimally realized, so that the sound field distribution of the ultrasonic waves in the space is improved, and the imaging quality is improved.

In this example, the array element N-1 and the array element N-2 are spaced apart from the central array element N by the same distance.

And a blank gap is formed between every two adjacent array elements, and the blank gap is filled with high molecular polymer. The probe array element structure can be effectively ensured, and the damage of bending, collision and oxidation to the structure is avoided.

Specifically, the high molecular polymer is epoxy resin or rubber. Stable and reliable performance, convenient operation and low price.

Referring to fig. 3, the array element N-1 and the array element N-2 are connected in parallel, the central array element N is connected in parallel with the array element N-1 and the array element N-2 through a capacitor C, and each group of array elements only needs one coaxial line.

Each group of array elements is connected with the negative electrode in common through the conductive matching layer 2 or the bonding wire. In this example, the conductive matching layer 2 is used to connect the cathodes of the array elements to the common ground, which is more convenient to implement and can simplify the structure.

The backing 4 is made of an electrically conductive material and the backing 4 is located between the flexible circuit board 5 and the piezoelectric layer 3. In this way, the flexible circuit board and the piezoelectric layer can be electrically connected through the backing.

In addition, a bonding wire and a bonding pad are formed on the flexible circuit board. Therefore, the circuit of each group of array elements is convenient to conduct.

In summary, the ultrasound imaging method of the present embodiment is as follows:

1) and setting the time delay needed by the array element N-1 and the array element N-2 to be delta T according to the measurement requirement, and then determining the size of the capacitor C connected in parallel in the circuit by the following formula:

c = -R × ln ((E-V)/E)/Delta T formula (1)

In the formula (1), R is the impedance of the probe array element, E is the excitation voltage, V is the capacitor charging and discharging voltage, and meanwhile, the capacitance value required to be connected in parallel of each array element is determined according to the formula (1) to complete the manufacture and packaging of the endoscopic probe;

2) sequentially exciting each probe, receiving echo signals, performing beam forming and subsequent processing, wherein the received echo signals are delayed by a circuit,

t = -R × C × ln (V/U) formula (2)

T in formula (2) is specific delay time, R is the impedance of probe array element, C is the capacitance value, V is capacitance charging and discharging voltage, U is signal strength, simultaneously, in the echo processing process, because the delay that the probe circuit produced to combine the calculated result of formula (2), carry out time compensation to the echo of array element.

Therefore, in the embodiment, under the condition that the size of the probe and the number of transmission cables are not increased, the phase/time delay of the ultrasonic waves excited by the array element N and the N-1 and the N-2 connected in parallel is realized through the connection mode of the capacitor and only one coaxial line, so that the sound field distribution of the ultrasonic endoscope probe in the space is improved, the imaging quality is improved, the high-performance ultrasonic imaging of the 1.5D ultrasonic endoscope probe is realized, and meanwhile, the structure is simple and the cost is low.

The present invention has been described in detail in order to enable those skilled in the art to understand the invention and to practice it, and it is not intended to limit the scope of the invention, and all equivalent changes and modifications made according to the spirit of the present invention should be covered by the present invention.