阅读说明：本技术 适于pcb上安装电声元件的方法及电声元件结构 (Method suitable for mounting electroacoustic element on PCB and electroacoustic element structure ) 是由 马格努斯·伯格伦 安德斯·诺德兰德 吕垚村 于 2019-10-23 设计创作，主要内容包括：本发明提供一种适于PCB上安装电声元件的方法及电声元件结构,以改善传统电声元件因回流焊炉的高温烘烤作用而影响其电气特性的问题,包括分离建构该电声元件的一器壳,该器壳包含一壳座与一基座,该壳座内安装多个发声组件,且该基座上安装至少二导电端子,粘着该基座与PCB,令该基座上的导电端子与该PCB上的至少二接点在一回流焊炉内相互粘着而电性连接,随即结合该壳座与该基座,令该壳座在该回流焊炉外和已粘着于该PCB上的基座结合成一体,而构装成粘着于该PCB上的电声元件。(The invention provides a method for mounting electroacoustic element on PCB and electroacoustic element structure, which is suitable for solving the problem that the traditional electroacoustic element affects its electric characteristic due to high temperature baking of reflow oven, and comprises separating a shell for constructing the electroacoustic element, wherein the shell comprises a shell base and a base, a plurality of sounding assemblies are mounted in the shell base, at least two conductive terminals are mounted on the base, the base and the PCB are adhered, the conductive terminals on the base and at least two contacts on the PCB are mutually adhered and electrically connected in a reflow oven, and then the shell base and the base are combined together, so that the shell base is outside the reflow oven and the base adhered on the PCB are combined into a whole, and the electroacoustic element adhered on the PCB is constructed.)

1. A method for mounting electro-acoustic components on a PCB, comprising the steps of:

(1) separating a shell for constructing the electroacoustic component, wherein the shell comprises a shell seat and a base which are independent in advance and can be combined into a whole, a plurality of sounding components are pre-installed in the shell seat, and at least two conductive terminals are pre-installed on the base;

(2) adhering the base and the PCB to enable the at least two conductive terminals on the base and the at least two contacts on the PCB to be adhered to each other in a reflow soldering furnace for electrical connection;

(3) combining the shell seat and the base, combining the shell seat outside the reflow soldering furnace and the base adhered on the PCB into a whole, and electrically connecting the at least two conductive terminals with at least one of the plurality of sounding components to form the electroacoustic element adhered on the PCB.

2. A method for mounting electro-acoustic components on a PCB as claimed in claim 1, wherein: the electroacoustic element is one of a piezoelectric buzzer, an electromagnetic buzzer and a moving coil type loudspeaker, and at least one of the sounding components is a circuit board.

3. A method for mounting electro-acoustic components on a PCB according to claim 1 or 2, characterised by: the base is made of heat-resistant plastic, and the shell seat and the sounding component are made of heat-resistant plastic except for the heat-resistant plastic.

4. An electro-acoustic component structure adapted for mounting on a PCB, comprising:

the shell seat is internally provided with a cavity, and a plurality of sounding components are arranged in the cavity;

the base is applied in a reflow soldering furnace, so that the at least two conductive terminals and at least two contacts on the PCB can be mutually adhered in the reflow soldering furnace and electrically connected;

the shell seat and the base can be arranged outside the reflow soldering furnace and integrated through the mutual combination of the connecting part and the butting part, so that the at least two conductive terminals are electrically connected with at least one of the plurality of sounding components.

5. Electro-acoustic element structure adapted for PCB mounting as claimed in claim 4, characterized by: the shell seat comprises a seat body and a group of seat covers arranged on the seat body, and the cavity is formed in the seat body.

6. Electro-acoustic element structure adapted for PCB mounting as claimed in claim 4, characterized by: the at least two conductive terminals are respectively bent to form a J-shaped body and exposed at two opposite end surfaces of the base.

7. Electro-acoustic element structure adapted for PCB mounting according to any of claims 4 to 6, characterized by: the electroacoustic element is a piezoelectric buzzer.

8. The electro-acoustic element structure adapted for PCB mounting of claim 7, wherein: the multiple sounding assemblies installed in the shell seat comprise a circuit board, at least two circuit terminals used for elastically contacting the at least two conductive terminals are arranged on the circuit board, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the circuit board in the shell seat is electrically connected with the conductive terminals on the base through the circuit terminals.

9. Electro-acoustic element structure adapted for PCB mounting according to any of claims 4 to 6, characterized by: the electroacoustic element is an electromagnetic buzzer.

10. The electro-acoustic element structure adapted for PCB mounting of claim 9, wherein: the multiple sounding assemblies mounted in the shell seat comprise a circuit board, the conductive terminals on the base are bent to form at least two circuit terminals in a tilting arm tilting form, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the circuit board in the shell seat tilts on the base and is electrically connected with the conductive terminals.

11. Electro-acoustic element structure adapted for PCB mounting according to any of claims 4 to 6, characterized by: the electroacoustic element is a moving coil type loudspeaker.

12. The electro-acoustic element structure adapted for PCB mounting of claim 11, wherein: the multiple sounding assemblies installed in the shell seat comprise a printed circuit electrode, the conductive terminal on the base is bent to form at least two line terminals in a tilting arm tilting form, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the printed circuit electrode in the shell seat tilts on the base and is electrically connected with the conductive terminal.

13. Electro-acoustic element structure adapted for PCB mounting as claimed in claim 4, characterized by: the base is made of heat-resistant plastic, and the shell seat and the sounding component are made of heat-resistant plastic except for the heat-resistant plastic.

Technical Field

The present invention relates to a structure and a mounting technique of an electroacoustic device, and more particularly, to a method for mounting an electroacoustic device on a PCB and a structure of the electroacoustic device.

Background

The electroacoustic component generally includes a piezoelectric buzzer, an electromagnetic buzzer, a dynamic speaker, and the like. The piezoelectric buzzer drives the vibrating membrane to vibrate and then sound by utilizing the piezoelectric effect of piezoelectric ceramics, the electromagnetic buzzer drives the metal vibrating membrane to vibrate and then sound by utilizing electromagnetism in the electrifying and non-electrifying processes, and the moving coil type loudspeaker drives the membrane to vibrate and then sound by utilizing the magnetic field effect generated by electrifying the coil. Therefore, the electroacoustic component is generally assembled on the PCB, and is driven by the conductive circuit provided by the circuit layer of the PCB to generate sound.

It is known that when electronic components such as ICs and electroacoustic components are assembled on a PCB, Surface Mount Technology (SMT) is generally relied on, solder paste is printed on the surface of the circuit layer of the PCB, then the electronic components are attracted and mounted on the PCB by a suction cup on a robot arm, and then the electronic components and the solder paste mounted on the surface of the PCB are soldered by a reflow oven (e.g., IR oven), so that the electronic components can be firmly bonded to the surface of the circuit layer of the PCB to conduct the conductive circuit of each electronic component on the PCB.

The electroacoustic device of the electronic devices is usually composed of a sound assembly (sound assembly) mounted in a housing. The electroacoustic component is, for example, a piezoelectric buzzer, and the sounding components to be mounted in the casing of the electroacoustic component include a piezoelectric buzzer (piezoelectric ceramic element), a diaphragm (diaphragm), a circuit board (circuit board), and conductive terminals (conductive terminals), etc., and these sounding components must be baked at a high temperature of about 245 ℃ in the reflow furnace during the soldering process in the reflow furnace, and in such a high temperature environment, in addition to the temperature resistance characteristics of the material of the casing, the electroacoustic component also affects the electrical characteristics of the sounding components such as the piezoelectric buzzer, the diaphragm, and the circuit board.

In view of the above problem, the manufacturers can only choose materials that can withstand the high temperature of the reflow oven to manufacture the housing and the sounding component of the electroacoustic device, but the manufacturing cost of the electroacoustic device is increased, and improvement is needed.

Disclosure of Invention

The aim of the invention is to minimize the impact of the high temperature baking of the reflow oven on the housing of the electroacoustic component and the sound generating assembly carried therein, so as to maintain the electrical characteristics of said components.

To this end, the present invention provides a method for mounting an electroacoustic component on a PCB, comprising the steps of:

(1) separating a shell for constructing the electroacoustic component, wherein the shell comprises a shell seat and a base which are independent in advance and can be combined into a whole, a plurality of sounding components are pre-installed in the shell seat, and at least two conductive terminals are pre-installed on the base;

(2) adhering the base and the PCB to enable the at least two conductive terminals on the base and the at least two contacts on the PCB to be adhered to each other in a reflow soldering furnace for electrical connection;

(3) combining the shell seat and the base, combining the shell seat outside the reflow soldering furnace and the base adhered on the PCB into a whole, and electrically connecting the at least two conductive terminals with at least one of the plurality of sounding components to form the electroacoustic element adhered on the PCB.

The method for mounting electro-acoustic components on a PCB is provided, wherein: the electroacoustic element is one of a piezoelectric buzzer, an electromagnetic buzzer and a moving coil type loudspeaker, and at least one of the sounding components is a circuit board.

The method for mounting electro-acoustic components on a PCB is provided, wherein: the base is made of heat-resistant plastic, and the shell seat and the sounding component are made of heat-resistant plastic except for the heat-resistant plastic.

The present invention also provides an electroacoustic component structure suitable for being mounted on a PCB, comprising:

the shell seat is internally provided with a cavity, and a plurality of sounding components are arranged in the cavity;

the base is applied in a reflow soldering furnace, so that the at least two conductive terminals and at least two contacts on the PCB can be mutually adhered in the reflow soldering furnace and electrically connected;

the shell seat and the base can be arranged outside the reflow soldering furnace and integrated through the mutual combination of the connecting part and the butting part, so that the at least two conductive terminals are electrically connected with at least one of the plurality of sounding components.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the shell seat comprises a seat body and a group of seat covers arranged on the seat body, and the cavity is formed in the seat body. Therefore, the sound production assembly can be conveniently installed in the shell seat.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the at least two conductive terminals are respectively bent to form a J-shaped body and exposed at two opposite end surfaces of the base.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the electroacoustic element is a piezoelectric buzzer.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the multiple sounding assemblies installed in the shell seat comprise a circuit board, at least two circuit terminals used for elastically contacting the at least two conductive terminals are arranged on the circuit board, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the circuit board in the shell seat is electrically connected with the conductive terminals on the base through the circuit terminals.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the electroacoustic element is an electromagnetic buzzer.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the multiple sounding assemblies mounted in the shell seat comprise a circuit board, the conductive terminals on the base are bent to form at least two circuit terminals in a tilting arm tilting form, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the circuit board in the shell seat tilts on the base and is electrically connected with the conductive terminals.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the electroacoustic element is a moving coil type loudspeaker.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the multiple sounding assemblies installed in the shell seat comprise a printed circuit electrode, the conductive terminal on the base is bent to form at least two line terminals in a tilting arm tilting form, and when the shell seat and the base are combined into a whole outside the reflow soldering furnace, the printed circuit electrode in the shell seat tilts on the base and is electrically connected with the conductive terminal.

The electro-acoustic element structure adapted for mounting on a PCB, wherein: the base is made of heat-resistant plastic, and the shell seat and the sounding component are made of heat-resistant plastic except for the heat-resistant plastic.

According to the technical means, the invention can be promoted as a whole to have the following effects: maintaining the electrical characteristics of the electroacoustic element which is adhered and mounted on the PCB, including the electrical characteristics of the piezoelectric buzzer, the vibrating membrane, the circuit board and other components in the electroacoustic element; in addition, the invention can also avoid using temperature resistant materials to manufacture the shell seat (comprising the seat body and the seat cover), the piezoelectric buzzer, the vibrating membrane, the circuit board and other components of the shell of the electroacoustic element, thereby reducing the production cost of the electroacoustic element.

The details of the above-described technical means and the specific implementation of the effective performance thereof are described with reference to the following embodiments and drawings.

Drawings

Fig. 1 is a sequence diagram of the steps of the installation method of the present invention.

Fig. 2a to 2e are schematic diagrams of operations for performing the mounting method of fig. 1, respectively.

Fig. 3 is an exploded perspective view of a first embodiment of the present invention, illustrating an embodiment of a piezoelectric buzzer as an electroacoustic element.

Fig. 4 is an exploded perspective view of the base of fig. 3 from another perspective.

Fig. 5 is a perspective view of the assembled components of fig. 3.

Fig. 6 is an enlarged sectional view of fig. 5.

Fig. 7 is a cross-sectional view of an embodiment of a second structure of the present invention, illustrating an implementation of an electromagnetic buzzer as an electroacoustic element.

Fig. 8 is a cross-sectional view of a third structural embodiment of the present invention, illustrating an implementation of a moving-coil speaker as an electroacoustic element.

Description of reference numerals: 10. 60, 70-shell; 11. 61, 71-shell base; 11a, 61a, 71 a-seat; 11b, 61b, 71 b-seat cover; 111-a chamber; 112-a first opening; 113-a connecting portion; 114-sound transmission hole; 115-a fixation plate; 116-a second opening; 117-limit post; 118-sponge; 12. 62, 72-base; 12 a-an outer end face; 12 b-an end wall; 12 c-inner end face; 121-a docking station; 122-a notch; 20-a sound emitting component; 21-piezoelectric buzzer chips; 22. 22a, 22 b-a diaphragm; 23. 23a, 23 b-wiring boards; 231. 311, 321-line terminals; 24-a coil; 25-magnetic pole; 26. 261-Magnetitum; 27-printed circuit electrodes; 281-a bias coil; 282-voice coil; 30. 31, 32-conductive terminals; 40-PCB; 41-contact; 50-reflow oven; S1-S3-description of the steps of the example.

Detailed Description

First, referring to fig. 1, a method for mounting an electroacoustic device on a PCB according to the present invention is described, which includes the following steps S1 to S3:

step S1: casing for separating and constructing electroacoustic component

Referring to fig. 2a, a housing 10 of an electroacoustic device is pre-formed by plastic injection molding, a housing base 11 and a base 12 which are independent from each other and can be integrated into a single body. The housing 11 is pre-installed with a plurality of sound components 20 that are susceptible to high temperature, the plurality of sound components 20 at least include a circuit board 23, and the base 12 is pre-installed with at least two conductive terminals 30. The base 12 is made of heat-resistant plastic, and the housing 11 and the sound component 20 are made of heat-resistant plastic. The heat-resistant plastic is plastic capable of withstanding high-temperature baking of about 245 ℃ in a reflow soldering furnace.

Step S2: adhesive base and PCB

Referring to fig. 2b and 2c sequentially, the solder paste is printed on the contacts 41 of the PCB40, and then the base 12 is picked up by an automatic arm, for example, and placed on the PCB40 (as shown in fig. 2 b), so that the conductive terminals 30 on the base 12 are in contact with the contacts 41 on the PCB40, and then the PCB40 is moved into a reflow oven 50 (as shown in fig. 2c), and the solder paste is melted by baking at about 245 ℃ in the reflow oven 50, so that the conductive terminals 30 on the base 12 and the contacts 41 on the PCB40 can be adhered to each other and electrically connected.

Step S3: combining the housing seat and the base

Referring to fig. 2d and fig. 2e sequentially, the PCB40 adhered to the base 12 is taken out from the reflow oven 50, so that the PCB40 adhered to the base 12 is away from the high temperature in the reflow oven 50, and the housing 11 can be picked up by an automatic arm at normal or room temperature, and the housing 11 is press-fastened or screwed to the base 12 adhered to the PCB40 (as shown in fig. 2 d), and when the housing 11 and the base 12 are combined into a whole, the conductive terminals 30 on the base 12 can be pressed against the two circuit terminals 231 on the circuit board 23 in the housing 11 to be electrically connected, thereby forming an integrated electroacoustic device adhered to the PCB40 (as shown in fig. 2 e). By doing so, the housing base 11 and the plurality of sound emitting components 20 mounted in the housing base 11 can be prevented from being disturbed by high temperature in the reflow oven 50.

In order to implement the above method, please refer to fig. 3 to fig. 6, which disclose a first structural embodiment of the present invention using a piezoelectric buzzer as an electroacoustic component, and explain that the piezoelectric buzzer includes the housing 11, the base 12 and the plurality of sounding components 20. Wherein:

a chamber 111 for mounting the plurality of sound emitting modules 20 is formed in the housing base 11, and a connecting portion 113 is formed on a wall of one end of the housing base 11. In this embodiment, the sounding element 20 includes a piezoelectric buzzer 21 made of piezoelectric ceramics, a diaphragm 22, a circuit board 23, etc. which are well known; the vibrating membrane 22 is made into a cone shape capable of vibrating in a reciprocating manner, the circumferential edge of the vibrating membrane 22 is fixed on the wall surface of the cavity 111, the central basin center area of the piezoelectric buzzer 21 is fixedly attached to the vibrating membrane 22, and the piezoelectric buzzer 21 is electrically connected with the circuit board 23 and further externally connected with a power supply end, so that the piezoelectric effect of the piezoelectric buzzer 21 is utilized to drive the vibrating membrane 22 to vibrate and sound.

In order to consider the convenience of assembling the sound generating module 20 in the housing 11, the housing 11 may be implemented to include a base 11a and a cover 11b disposed on the base 11 a; the cavity 111 is formed in the base 11a, and the cavity 111 has a fixing plate 115 therein, the fixing plate 115 may be fixed in the base 11a by press-fitting, or integrally extended from the wall surface of the cavity 111 of the base 11a, so as to fix the circuit board 23 by using the fixing plate 115 in the cavity 111; a first opening 112 and a second opening 116 are respectively formed at both ends of the seat body 11a, and the connecting portion 113 may be a single or multiple and is formed on the seat body 11a around the first opening 112 in a ring form or a spaced-apart form; the second opening 116 of the seat 11a is communicated with the chamber 111, and the seat cover 11b is assembled on the second opening 116 in a pressing manner, for example, and the diaphragm 23 is disposed between the seat 11a and the seat cover 11b and located in the chamber 111; at least one sound transmitting hole 114 is formed in the seat cover 11b, and the sound generated by the piezoelectric buzzer 21 when vibrating is transmitted to the outside through the sound transmitting hole 114.

The base 12 is formed in a lid shape capable of covering one end of the housing 11, and an abutting portion 121 for engaging the connecting portion 113 is formed on one end surface of the base 12. The connecting portion 113 and the abutting portion 121 may be implemented in a combination form of a rib and a groove with male and female fastening capabilities, or in a combination form of a thread and a locking connection.

When the connection portion 113 and the docking portion 121 are implemented in the form of the combination of the male and female locking ribs and the locking slots as shown in fig. 3 to 5, the automatic arm for picking up the housing 11 only needs to perform the alignment and pressing actions, so as to press and couple the housing 11 to the base 12 of the PCB 40; when the connection portion 113 and the abutting portion 121 are engaged with each other by a screw thread (not shown in the drawings) in a manner of relatively locking the screw threads, the automatic arm for picking up the housing 11 only needs to perform an alignment rotation operation to press and engage the housing 11 on the base 12 of the PCB 40. With the existing control technology of the robot arm, the two connection methods can make the conductive terminal 30 and the circuit terminal 231 accurately align with the positive and negative directions and be electrically connected stably when the housing 11 is combined with the base 12.

Furthermore, the abutting portion 121 is formed with at least one notch 122. When the housing 11 and the base 12 are integrated, a tool can push the connecting portion 113 through the notch 122, so that the connecting portion 113 and the abutting portion 121 are not maintained in the integrated state, and the housing 11 and the base 12 can be separated.

Furthermore, the base 12 is assembled with the two conductive terminals 30, the two conductive terminals 30 can be bent from a metal sheet to form a J-shaped body, so that each conductive terminal 30 can sequentially extend from the outer end surface 12a and the end wall 12b of the base 12 to the inner end surface 12c of the base 12 to be fastened and fixed on the base 12, and therefore, the two ends of the conductive terminal 30 can be respectively exposed on the two opposite end surfaces (the outer end surface 12a and the inner end surface 12c) of the base 12, so that the two ends of the conductive terminal 30 can be respectively electrically connected to the circuit terminal 231 of the circuit board 23 and the contact 41 on the PCB 40. Accordingly, when the PCB40 is powered on, an excitation voltage can be outputted to the piezoelectric buzzer 21 through the circuit board 23 in the piezoelectric buzzer (i.e. the electroacoustic component), so that the buzzer 21 attached to the center region of the flexible diaphragm 22 generates a vibration frequency, and then sounds.

The two line terminals 231 on the circuit board 23 may be made of an elastic member such as a helical compression spring, and the two line terminals 231 have a positive and negative polarity. When the housing 11 and the base 12 are integrated, the two circuit terminals 231 can be tightly contacted with the two conductive terminals 30 on the base 12 according to the requirement of the conductive paths in the positive and negative directions, so as to maintain the electrical connection therebetween.

Referring to fig. 3 and 6, a limiting pillar 117 is formed on the seat cover 11b, and the limiting pillar 117 extends from the seat cover 11b into the seat body 11a (i.e., into the cavity 111) to limit the amplitude of the diaphragm 22. The fixing plate 115 is fixed with a sponge 118, the sponge 118 can be regarded as a fitting of the sound component 20, and is disposed in the housing 11 together with the sound component 20, so as to prevent from being disturbed by the high temperature of the reflow oven, and the piezoelectric buzzer 21 is located between the limiting column 117 and the sponge 118. Thus, the piezoelectric buzzer 21 can maintain the stability of stable oscillation frequency by the constraint of the sponge 118 and the limit post 117 during oscillation.

Referring to fig. 7, a second embodiment of the present invention is disclosed, in which an electromagnetic buzzer is used as an electroacoustic device, and the greatest difference between the structure of the electromagnetic buzzer and the first piezoelectric buzzer is described, in which a plurality of sounding components 20 installed in a housing seat 61 of a housing 60 are replaced by a well-known circuit board 23a electrically connected to a coil 24, and a correspondingly assembled magnetic pole 25, a magnet 26, and a vibrating membrane 22a, and a two-line terminal 311 is made of an elastic element without a helical compression spring, and in a fine sense, the two-line terminal 311 is formed by bending a conductive terminal 30 on a base 12 to form a tilted arm tilting configuration, so that when the housing seat 61 and the base 62 are combined into a whole, the two-line terminal 311 can be electrically connected to positive and negative contacts on the circuit board 23a according to the positive and negative directions thereof. In addition, the sound component 20 is mounted on the inner structure of the casing seat 61 formed by combining the seat body 61a and the seat cover 61b, so that the electromagnetic buzzer can utilize the coil 24 to drive the vibration film 22a to vibrate and generate sound through the action between the magnetic pole 25 and the magnet 26 during the process of power-on and power-off. In addition, the rest of the structure and the installation manner of the present embodiment are substantially the same as those of the first embodiment, and particularly, the present embodiment is fully suitable for applying the above method of the present invention to perform the step of installing the electroacoustic component on the PCB.

Referring to fig. 8, a third embodiment of the present invention is disclosed, in which a moving-coil speaker is used as an electroacoustic device, and the maximum difference between the structure of the moving-coil speaker and the first piezoelectric buzzer is described, in which a plurality of sounding components 20 installed in the housing seat 71 of the housing 70 are replaced by well-known electrical connections among the printed circuit electrode 27, the polarization coil 281, and the voice coil 282, and the corresponding magnet 261 and diaphragm 22 b. The printed circuit electrode 27 is used to replace the circuit board of the first and second embodiments, and the two circuit terminals 321 are bent from the conductive terminals 32 on the base 72 to form a tilted-arm tilted configuration, so that when the housing 71 and the base 72 are combined into a whole, the two circuit terminals 321 can be electrically connected to the printed circuit electrode 27. In addition, the sound-generating assembly 20 is mounted on the inner structure of the casing 71 formed by combining the base 71a and the base 71b, so that the moving-coil speaker can utilize the printed circuit electrodes 27 to excite the polarization coil 281 and the voice coil 282 to generate a magnetic field effect to drive the diaphragm 22b to generate sound. In addition, the rest of the structure and the installation manner of the present embodiment are substantially the same as those of the first embodiment, and particularly, the present embodiment is fully suitable for applying the above-mentioned method of the present invention to perform the step of installing the electroacoustic component on the PCB.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.