阅读说明：本技术 一种芯片检测标记计数方法及其设备 (Chip detection mark counting method and device ) 是由 刘志明 孟红亮 曹小虎 刘健康 王永捷 于 2021-07-02 设计创作，主要内容包括：本发明提供了一种芯片检测标记计数方法及其设备,包括以下步骤：开启电机,芯片前进,芯片依次经过到位检测工位、次品芯片检测工位、芯片读写性能检测工位、标记工位。在此过程中,次品芯片检测工位对芯片的孔进行检测,芯片读写性能检测工位对芯片进行读写性能检测,标记工位按照前述检测反馈的信息对芯片进行新的标记。本发明提供的方案具有较高的自动化程度,节省空间,便于操作,能够进行个性化标记,可广泛地在IC卡生产企业中应用。(The invention provides a chip detection mark counting method and a device thereof, comprising the following steps: and starting the motor, enabling the chip to advance, and enabling the chip to sequentially pass through an in-place detection station, a defective chip detection station, a chip read-write performance detection station and a marking station. In the process, a defective chip detection station detects holes of the chip, a chip read-write performance detection station detects the read-write performance of the chip, and a marking station marks the chip newly according to the information fed back by the detection. The scheme provided by the invention has higher automation degree, saves space, is convenient to operate, can be used for personalized marking, and can be widely applied to IC card production enterprises.)

1. A full-automatic chip detection method is characterized by comprising the following steps:

the chip advances to pass through an in-place detection station, a defective chip detection station, a chip read-write performance detection station and a marking station in sequence,

after the in-place detection station detects a preset number of chips, the defective chip detection station detects whether the chips are marked chips or not, the chip read-write performance detection station detects the read-write performance of the chips, and the marking station marks the chips newly according to information fed back by the defective chip detection station and the chip read-write performance detection station.

2. The full-automatic chip detection method according to claim 1, characterized in that: chip information initialization is carried out on the chip by the chip read-write performance detection station, and/or the unique serial number of the chip and/or other chip information are read and recorded through the control system.

3. The fully automatic chip detection method according to claim 1 or 2, characterized in that: the driving device drives the material tray of the material receiving device to rotate, the material tray drives the material belt to advance, and the material belt drives the chip to advance.

4. The full-automatic chip detection method according to claim 3, characterized in that: and the in-place detection station and/or the defective chip detection station adopt a correlation sensor for detection.

5. The full-automatic chip detection method according to claim 4, characterized in that:

the opposite-jet sensor in the in-place detection station is used for detecting a first hole at the edge of the material belt and transmitting a signal to the control system so that the control system can judge whether the material belt reaches a preset number and/or reaches a correct position and further determine the stop time of the driving device;

and/or a correlation sensor in the defective chip detection station is used for detecting whether the chip has a second hole or not so as to judge whether the chip is a defective chip or not.

6. The full-automatic chip detection method according to claim 3, characterized in that: the marking station is a laser marking station, and any mark is marked on the non-chip area mark of the material belt, wherein the mark is a serial number and/or Chinese characters and/or graphs.

7. The fully automatic chip detection method according to any one of claims 1, 2, 4-6, characterized in that: and marking the chips by the marking station marks according to the information fed back by the defective chip detection station and/or the information fed back by the chip read-write performance detection station and/or the position information of the current chip and/or other information, and establishing a corresponding relationship between the detection results of the defective chip detection station and the chip read-write performance detection station through a control system for storage.

8. The fully automatic chip detection method according to any one of claims 1, 2, 4-6, characterized in that: adopting an energy-saving starting step and/or an energy-saving closing step;

the energy-saving starting step is that after the driving device is started, the in-place detection station, the defective chip detection station, the chip read-write performance detection station and the marking station are sequentially started;

the energy-saving closing step comprises the steps of sequentially stopping or closing an in-place detection station, a defective chip detection station, a chip read-write performance detection station and a marking station.

9. The full-automatic chip detection method according to claim 8, characterized in that: the energy-saving starting step is specifically that,

when the in-place detection device detects a first preset number of chips, chips are distributed on the defective chip detection station, the defective chip detection station is started and defective chip detection is carried out,

after the detection is finished, the driving device continues to operate, when the in-place detection device detects a second preset number of chips, chips are distributed on the defective chip detection station and the chip read-write performance detection station, the defective chip detection station detects defective chips, the chip read-write performance detection station is started and performs read-write performance detection,

when the in-place detection device carries out a third preset number of chips, chips are distributed on a defective chip detection station, a chip read-write performance detection station and a marking station, the defective chip detection station carries out defective chip detection, the chip read-write performance detection station carries out read-write performance detection, the marking station is started and marked,

then, carrying out in-place detection, punched chip detection, read-write performance detection and marking cyclic operation steps;

the energy-saving closing step is specifically that the detection of the station is automatically stopped or closed when the in-place detection station detects no chip or no chip passes through the station in a preset time, the detection of the station is automatically stopped or closed when a defective chip detection station cannot detect the chip or is informed of no chip, the detection of the station is automatically stopped or closed when a chip read-write detection station cannot detect the chip or is informed of no chip, and the marking device of the station is automatically stopped or closed when a marking station cannot detect the chip or is informed of no chip.

10. The fully automatic chip detection method according to any one of claims 1, 2, 4-6, and 9, wherein: in the detection of the read-write performance of the chip by the chip read-write performance detection station, one or more groups of probes are controlled by a cylinder or an electromagnetic driving device to downwards contact the two electrodes of the chip.

11. The fully automatic chip detection method according to claim 10, characterized in that: the probe is connected with the coil, the coil is a non-contact IC card chip coil, induction between the card reader and the non-contact IC card chip coil is controlled through a program in the control system, and the coil is arranged on the upper side of the card reader.

12. A chip detection mark counter, comprising: a chip in-place detection device (3), a defective chip detection device (4), a chip read-write performance detection device (5), a marking device (6) and a control system, which work by adopting the full-automatic chip detection method of any one of claims 1-11.

13. The chip detection mark counter of claim 12, wherein: the material strip detection device comprises a discharging device (2), a receiving device (7) and a material strip detection track (11), wherein the material strip detection track (11) is arranged between the discharging device (2) and the receiving device (7), and a chip in-place detection device, a defective chip detection device, a chip read-write performance detection device and a marking device are sequentially installed on the material strip detection track.

14. The chip detection mark counter according to claim 12 or 13, wherein:

the chip in-place detection device (3) comprises a chip position detection sensor and a first support (32), and a first light receiving end (31) of the chip position detection sensor is installed on the material belt detection track (11) through the first support (32);

the defective chip detection device (4) comprises a defective chip detection light sensor and a second support (42), and a second light receiving end (41) of the defective chip detection light sensor is installed on the material belt detection track (11) through the second support (42);

the chip position detection sensor and/or the defective chip detection light sensor are/is a correlation sensor.

15. The chip detection mark counter according to claim 12 or 13, wherein: the chip reading and writing performance detection device (5) comprises a reciprocating motion driving mechanism (51) and a chip reading and writing detection head (52), wherein the chip reading and writing detection head (52) is installed at one end of the reciprocating motion driving mechanism (51).

16. The chip detection mark counter of claim 15, wherein: the chip reading and writing detection head (52) comprises probes, one or more groups of probes are arranged, each group comprises two or more probes, the probes are connected with coils, the coils are arranged on the upper side of a card reader, the card reader (53) is provided with one or more identical card readers or a plurality of different card readers, the coils are provided with one or more identical coils or a plurality of different coils, and the reciprocating motion driving mechanism (51) is an electromagnet driving component, a hydraulic component, an air cylinder or other driving devices.

17. The chip detection mark counter according to any one of claims 12-13, wherein: the chip reading and writing performance detection device comprises a chip reading and writing roller, wherein a detection conductor is arranged on the chip reading and writing roller and comprises an annular structure (561, 562, 563, 564, 565 and 566), and teeth, needles or salient points are distributed on the annular structure.

18. The chip detection mark counter of claim 17, wherein: the chip read-write performance detection device comprises a probe, and the probe is connected with a detection conductor on the chip read-write roller.

19. The chip detection mark counter of claim 18, wherein: the chip reading and writing roller further comprises a roller cylinder (58), a material belt positioning ring and shafts (551 and 552), wherein the material belt positioning ring is respectively installed on two sides of the roller cylinder (58), the shaft (593) penetrates through the roller cylinder (58), two ends of the shaft (593) are installed on the first side support (591) and the second side support (592), and the annular structures (561, 562, 563, 564, 565 and 566) are installed on the roller cylinder (58).

20. The chip detectable mark counter according to any of claims 12-13, 16, 18-19, wherein: the marking device is a laser marking device which comprises a laser marking protective cover (61) and a laser (65), wherein the laser marking protective cover (61) is a transparent cover, and the laser (65) is installed above the laser marking protective cover (61).

21. The chip detection mark counter of claim 20, wherein: laser instrument (65) are including light-emitting camera lens (67) and mirror control system (68) shake, install in arm (68) laser instrument (65), arm (68) are through the slider along the guide rail up-and-down motion of alignment jig (67), and laser instrument (65) are installed in the one end of arm (68) through the telescoping device, and light-emitting camera lens (67) can rotate and/or can carry out about and fine setting around, and mirror control system (68) shake is installed in arm (68) or is installed in the box of light-emitting camera lens (67) top, arm (68) up-and-down motion is realized through hand wheel, motor drive or cylinder drive.

Technical Field

The invention relates to the field of chip detection, in particular to a method and equipment for full-automatic chip read-write detection, material belt subsection counting and personalized marking.

Background

The second generation identity card, the public transportation one-card and the like are non-contact IC cards, each non-contact IC card consists of an IC chip and an induction antenna, and the read-write operation is completed between the non-contact IC card and a card reader through radio waves. The non-contact IC card is a passive card, when a reader reads and writes the card, a signal sent by the reader is formed by two parts which are superposed: one part is a power supply signal, and after the signal is received by the card, the IC card generates a transient energy to supply the chip to work. The other part is command and data signals, commands the chip to complete the reading, modification, storage and the like of data, and returns signals to the reader-writer to complete one read-write operation.

IC-card manufacturing enterprise needs to purchase the IC-card chip to each big chip manufacturer, and the IC-card chip is preserved with the charging tray form more, fixes a plurality of IC-card chips on the material area of charging tray, and the chip manufacturer of every IC chip on the material area all can inspect, detects the IC chip for bad product, can set up the mark hole on bad IC chip. At present, most IC card enterprises adopt a manual mode to check the number of IC card chips after receiving a chip tray, and identify bad IC chips by observing marking holes through naked eyes manually, the checking mode has low efficiency and low identification efficiency, and cannot detect whether the read-write performance of the chips is normal, so that the tracing of the read-write damage reasons of the chips is inconvenient to carry out when the subsequent IC card packaging process has problems, and disputes are easy to generate. In the prior art, a small number of detection devices are provided, but the existing detection devices can only carry out one or two detection steps, and the devices have the problems of low detection efficiency, low automation degree, unreasonable spatial layout and the like.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a method and equipment for counting the detection marks of an IC card chip, aiming at solving the problems of low chip detection efficiency, interference of human factors, low automation degree and the like.

In order to achieve the purpose, the invention provides the following technical scheme: a full-automatic chip detection method is characterized by comprising the following steps: the chip advances, and passes through an in-place detection station, a defective chip detection station, a chip read-write performance detection station and a marking station in sequence, wherein after the in-place detection station detects a preset number of chips, the defective chip detection station detects whether the chip is a marked chip, the chip read-write performance detection station detects the read-write performance of the chip, and the marking station carries out new marking on the chip according to information fed back by the defective chip detection station and the chip read-write performance detection station.

The present invention can be applied to chips of various cards, such as contact chips and noncontact IC card chips. Preferably, the chip is a chip of an IC card, and preferably, the coil is a coil of a non-contact IC card chip, and the induction between the card reader and the coil of the non-contact IC card chip is controlled by a program in the control system. The coil is arranged on the upper side of the card reader.

Preferably, the chip read-write performance detection station initializes the chip information of the chip, and/or records the unique serial number and/or other information of the read chip through the control system. In order to adapt to different chips, the invention can adopt a plurality of chip conveying modes, preferably adopts the following conveying modes: the driving device drives the material tray of the material receiving device to rotate, the material tray drives the material belt to advance, and the material belt drives the chip to advance.

In order to improve the detection efficiency, the invention adopts optical signals for detection, and can be image detection, infrared, ultraviolet or other light. Preferably, the in-place detection station and/or the defective chip detection station are/is detected by a correlation sensor.

For the position detection of the chip, various detection methods can be adopted. Because there is the perforation in the edge of chip material area among the prior art, consequently the selection adopts the hole to take the edge to detect in order to judge the position of chip.

For the detection of inferior chips, various detection modes can be adopted. Since the marking method for punching the defective products often occurs in the prior art, the detection of the holes of the chip can be selected for judgment.

The invention uses the existing mark to detect the position or the problem, can reduce the cost and can improve the detection efficiency.

Preferably, the correlation sensor in the in-place detection station is used for detecting the first hole at the edge of the material belt and transmitting a signal to the control system, so that the control system can judge whether the material belt reaches a preset number and/or reaches a correct position, and further determine the stop time of the driving device; and/or a correlation sensor in the defective chip detection station is used for detecting whether the chip has a second hole or not so as to judge whether the chip is a defective chip or not.

In the prior art, some devices use a gear of a stepping motor to drive a hole at the edge of a material belt to advance, and then drive the material belt to advance to a detection station, so that the structure of the detection device is more complex. According to the invention, the in-place detection device is used for detecting the holes at the edge of the material belt, the light sensor is used for detecting and the control system is used for feeding back, so that the position of the driving device is more flexibly selected, the material belt in the detection track can smoothly and stably advance, and the influence on the appearance of the material belt is reduced. The hole may be a square hole in the embodiment, or may be a hole of other conventional shape or special shape. The number of wells may be counted, or the number of chips may be counted.

Preferably, the marking station is a laser marking station, and any mark is marked on the non-chip area mark of the material belt, wherein the mark is a serial number and/or Chinese characters and/or a graph.

Preferably, the marking station marks the chips according to the information fed back by the inferior chip detecting station and/or the information fed back by the chip reading and writing performance detecting station and/or the position information of the current chip and/or other information, and the detecting results of the inferior chip detecting station and the chip reading and writing performance detecting station are stored by establishing a corresponding relationship through the control system.

In order to save time and energy, the invention preferably adopts an energy-saving starting step and/or an energy-saving closing step; the energy-saving starting step is that after the driving device is started, the in-place detection station, the defective chip detection station, the chip read-write performance detection station and the marking station are sequentially started; the energy-saving closing step comprises the steps of sequentially stopping or closing an in-place detection station, a defective chip detection station, a chip read-write performance detection station and a marking station.

Preferably, the energy-saving starting step is specifically that when the in-place detection device detects a first predetermined number of chips, the defective chip detection station is distributed with chips, the defective chip detection station is started and defective chip detection is performed, the driving device continues to operate after the detection is completed, when the in-place detection device detects a second predetermined number of chips, the defective chip detection station and the chip read-write performance detection station are distributed with chips, the defective chip detection station performs defective chip detection, the chip read-write performance detection station is started and performs read-write performance detection, when the in-place detection device performs a third predetermined number of chips, the defective chip detection station, the chip read-write performance detection station and the marking station are distributed with chips, the defective chip detection station performs defective chip detection, the chip read-write performance detection station performs read-write performance detection, starting and marking a marking station; and then, carrying out in-place detection, punched chip detection, read-write performance detection and marking cyclic operation steps.

The energy-saving closing step is specifically that the detection of the station is automatically stopped or closed when the in-place detection station detects no chip or no chip passes through the station in a preset time, the detection of the station is automatically stopped or closed when a defective chip detection station cannot detect the chip or is informed of no chip, the detection of the station is automatically stopped or closed when a chip read-write detection station cannot detect the chip or is informed of no chip, and the marking device of the station is automatically stopped or closed when a marking station cannot detect the chip or is informed of no chip.

The starting can be a ready-to-run state in advance, and the driving or detection is started instantly when the running is needed, or the power-on running is started. Specific selection can be further set according to requirements of time, energy and the like.

In the preferred embodiment, the detection or marking is stopped, and the detection or marking is not performed in the power-on state, and the detection or marking can be performed at any time when the product passes through.

In the preferred embodiment, the power-off may be the stopping of the power-on, or the activation of the detecting device or the marking device after a long-time dormant state for detection.

Preferably, in the detection of the read-write performance of the chip by the chip read-write performance detection station, one or more groups of probes are controlled by the air cylinder or the electromagnetic driving device to downwards contact the two electrodes of the chip.

In order to solve the existing problems, the invention also provides a chip detection mark counter, which comprises: the system comprises a chip in-place detection device, a defective chip detection device, a chip read-write performance detection device, a marking device and a control system, and works by adopting the full-automatic chip detection method.

Preferably, the device comprises a feeding device, a receiving device and a material belt detection track, wherein the material belt detection track is arranged between the feeding device and the receiving device, and a chip in-place detection device, a defective chip detection device, a chip read-write performance detection device and a marking device are sequentially installed on the material belt detection track.

Preferably, the chip in-place detection device comprises a chip position detection sensor and a first support, and a first light receiving end of the chip position detection sensor is mounted on the material belt detection track through the first support; the defective chip detection device comprises a defective chip detection light sensor and a second support, wherein a second light receiving end of the defective chip detection light sensor is mounted on the material belt detection track through the second support; the chip position detection sensor and/or the defective chip detection light sensor are opposite sensors.

The feeding device and the receiving device can adopt a mode that the material tray rotates passively, and can also adopt an active mode and a passive mode. For convenience of assembly and use, preferably, the discharging device comprises a rotary buffer, and the rotary buffer is connected with the first material tray through a driven shaft; the material receiving device comprises a motor, and the motor is a stepping motor or a servo motor; the feeding device comprises a first guide frame, a first connecting arm is arranged on the first guide frame, the first connecting arm is provided with a rotating buffer, the rotating buffer is fixed at one end of the first connecting arm through an L-shaped support, the other end of the first connecting arm moves up and down in a guide rail of the first guide frame, and the rotating buffer is connected with a first material tray through a driven shaft; the material receiving device comprises a second guide frame, a second connecting arm is arranged on the second guide frame, and the motor is fixed on the second connecting arm through an L-shaped support; the first guide frame and the second guide frame are sectional materials.

Preferably, the chip read-write performance detection device comprises a reciprocating motion driving mechanism and a chip read-write detection head, wherein the chip read-write detection head is installed at one end of the reciprocating motion driving mechanism.

Preferably, the chip read-write detection head comprises probes, the probes are metal elastic probes, the probes are provided with one or more groups, each group comprises two or more probes, the probes are connected with coils, the coils are arranged on the upper sides of the card readers, the card readers are provided with one or more same card readers or a plurality of different card readers according to detection requirements, the coils are provided with one or more same coils or a plurality of different coils, and the reciprocating motion driving mechanism is an electromagnet driving assembly, a hydraulic assembly, a cylinder or other driving devices.

Preferably, the chip reading and writing performance detection device comprises a chip reading and writing roller, wherein a detection conductor is arranged on the chip reading and writing roller, the detection conductor comprises an annular structure, and teeth, needles or salient points are distributed on the annular structure.

Preferably, the chip read-write performance detection device comprises a probe, and the probe is connected with a detection conductor on the chip read-write roller.

Preferably, the chip reading and writing roller further comprises a roller, a material belt positioning ring and a shaft, wherein the material belt positioning ring is mounted on two sides of the roller respectively, the shaft penetrates through the roller, two ends of the shaft are mounted on the first side support and the second side support, and the annular structure is mounted on the roller.

Preferably, the probe is mounted on a probe base, the chip read-write roller is mounted on a read-write roller support member, the read-write roller support member includes a first side support and a second side support, and the probe base is connected with the upper portions of the first side support and the second side support.

Preferably, the material strip detection track is provided with a station channel for accommodating the material strip, and the station channel is provided with a groove for placing the light source emitting end and/or the card reader. Preferably, the marking device is a laser marking device, the laser marking device comprises a laser marking protective cover and a laser, the laser marking protective cover is a transparent cover, and the laser is installed above the laser marking protective cover. The protective cover can also be replaced by a non-transparent cover in order to save cost or facilitate manufacturing and installation.

Preferably, the laser instrument includes the light-emitting camera lens and shakes mirror control system, the laser instrument is installed in the arm, the arm passes through the slider and follows the guide rail up-and-down motion of alignment jig, and the laser instrument passes through the telescoping device and installs in the one end of arm, and the light-emitting camera lens can rotate and/or can carry out about and fine setting around, shakes mirror control system and installs in the arm, or install in the box of light-emitting camera lens top, the arm the up-and-down motion is realized through hand wheel, motor drive or cylinder drive.

The adjustment of the light-emitting lens can adopt a universal rotating device or a thread or a gear, a rack and other modes.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention has a plurality of processes of chip in-place detection, defective chip detection, chip read-write performance detection, marking and the like, realizes full automation of the whole process of IC card chip detection, and reduces the influence of human factors.

2. The invention adopts the opposite-emitting sensor to detect the position of the chip and the defective products, thereby improving the detection efficiency of the IC card chip and greatly reducing the missing rate.

3. The positions of the detection devices, the feeding device, the receiving device, the adjusting frame and the like on the rack are reasonable, and reasonable structural design is carried out on the supports, the adjusting frame and the like, so that the weight of the instrument is effectively reduced, and the occupied space of the instrument is reduced.

4. The invention can perform full-automatic read-write detection, material belt sectional counting and personalized marking. The marks can be visual marks such as numbers, characters, figures and the like on the material belt, and finally, the information such as the total number of the material discs, the number of good cores, the number of bad cores, the position of each chip, the unique serial number of the chip and the like is stored through a computer. Can be widely applied to various IC card production enterprises.

5. The invention can automatically complete the counting of the total number of the IC card chips on the whole tray, the counting of normal and abnormal chips, and the read-write detection or initialization of the chips on the material belt.

6. The invention improves the material receiving device and the material discharging device, and improves the stability of the advancing speed of the chip.

7. The roller type chip read-write performance detection device can realize read-write detection in chip movement, further realize detection of all detection stations in the chip movement, and improve detection efficiency.

Drawings

Fig. 1 is a general schematic diagram of an IC card chip detection mark counter.

Fig. 2 is a plan view of the IC card chip detection mark counter.

Fig. 3 is a partially enlarged view of the IC card chip detection mark counter.

FIG. 4 is a schematic diagram of a partial structure of the punched chip detection apparatus.

FIG. 5-1 is a schematic diagram of a partial structure of the device for detecting read/write performance of a chip.

FIG. 5-2 is a schematic diagram of a portion of another chip read/write performance detection apparatus.

Fig. 5-3 is an exploded view of the structure of fig. 5-2.

Fig. 6 is a schematic diagram of a partial structure of the laser marking apparatus.

FIG. 7-1 is a schematic view showing a partial structure of the discharging device.

Fig. 7-2 is a schematic view of a partial structure of the material receiving device.

Fig. 8 is a schematic diagram of a tape detection track.

Fig. 9-1 is a schematic diagram of a laser control box.

Fig. 9-2 is a schematic view of an adjustment bracket.

Fig. 10 is a schematic diagram of a tape for detecting IC card chips.

FIG. 11 is a flowchart of the power saving start-up procedure of the present invention.

FIG. 12 is a diagram of a control interface in a display according to the present invention.

In the figure: 1. a frame; 2. a discharging device; 3. a chip in-place detection device; 4. a punched chip detection device; 5. a chip read-write performance detection device; 6. a laser marking device; 7. a material receiving device; 8. a hand wheel; 9. a start key; 10. a stop key; 11. a material belt detection track; 12. a control and data processing computer; 13. a guide roller; 14. a support; 15. a display; 16. a keyboard; 17. a square hole; 18. a circular hole; 21. a first guide frame; 22. a first connecting arm; 23. a rotating damper; 24. an L-shaped bracket; 31. a first light receiving end; 32. a first bracket; 41. a second light receiving end; 42. a second bracket; 51. a reciprocating drive mechanism; 52. a chip read-write detection head; 53. a card reader; 541. a first inspection roller bearing; 542. a second inspection roller bearing; 551. a first material belt positioning ring; 552. a second material belt positioning ring; 561. a first read-write detection ring gear; 562. a second read-write detection ring gear; 563. a third read-write detection ring gear; 564. a fourth read-write detection ring gear; 565. a fifth read-write detection ring gear; 566. a sixth read-write detection ring gear; 571. detecting the probe; 572. a probe base; 58. a roller; 591. a first side support; 592. a second side bracket; 593. a shaft; 594. an aperture; 595. a base; 61. a protective cover; 63. a third support; 64. a fourth bracket; 65. a laser; 66. a laser control box; 67. a light emitting lens; 68. an arm; 69. a galvanometer control system; 70. an adjusting bracket; 71. a second guide frame; 72. a motor; 73. a second connecting arm; 74. an L-shaped bracket; 122. and (4) a groove.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 12.

The structure composition of the IC card chip detection mark counter is shown in figures 1 and 2, and the IC card chip detection mark counter comprises a rack 1, a discharging device 2, a receiving device 7, a chip in-place detection device 3, a punching chip detection device 4, a chip read-write performance detection device 5, a laser marking device 6 and a control system. The front portion of frame 1 installs blowing device 2 and material collecting device 7, be provided with material area between blowing device 2 and the material collecting device 7 and detect track 11. A start key 9 and a stop key 10 are arranged on one side of the frame. The control system includes a control and data processing computer 12.

The IC card chip detection mark counter comprises a display 15 and a keyboard 16, wherein the display 15 and the keyboard 16 can be independent displays and keyboards and are connected with an equipment control and data processing computer in a data line or wireless mode. In another embodiment of the invention, the display 15 and the keyboard 16 are mounted on the housing 1. In yet another embodiment of the invention, the display and keyboard are incorporated into the housing as part of the housing for further space saving.

Referring to fig. 3, the chip in-place detection device 3 includes a chip position detection sensor and a first support 32, the chip position detection sensor is a correlation sensor, the chip position detection sensor includes a first light receiving end 31 and a first light source transmitting end, the first light receiving end 31 is installed in the material strip detection track 11 through the first support 32, the first support 32 includes a riser and a transverse plate, the riser lower end is fixed in one side of the material strip detection track 11, and the transverse plate is fixed in the upper end of the riser. The first light receiving end 31 is fixed to the horizontal plate. The first light source emitting end is installed on the material belt detection track 11 and is arranged corresponding to the first light receiving end 31 on the transverse plate. In order to adjust the height, the vertical plate is provided with a long strip-shaped hole.

Referring to fig. 3 and 4, the punching chip detection device 4 detects whether the chip is a punching chip, and the punching chip detection device 4 includes a punching detection light sensor and a second bracket 42. The punching detection light sensor comprises a second light receiving end 41 and a second light source emitting end, and the second light receiving end 41 is installed on the material belt detection track 11 through a second support 42. Second support 42 includes a riser and a diaphragm, the riser lower extreme is fixed in one side that the material area detected track 11, the diaphragm is fixed in the upper end of riser, and the second light receiving terminal 41 that punches and detect optical line sensors is fixed in the diaphragm, second light receiving terminal 41 is the three that sets up side by side. The second light source transmitting end is installed on the material belt detection track and corresponds to the second light receiving end on the transverse plate. In order to adjust the height, the vertical plate is provided with a long strip-shaped hole.

The first bracket and the second bracket have the advantages of convenience in installation, adjustment and manufacture, and convenience for an operator to observe the detection condition.

Referring to fig. 3 and 5-1, the chip read/write performance detecting apparatus 5 includes a reciprocating drive mechanism 51 and a chip read/write detecting head 52. The reciprocating drive mechanism 51 is mounted to the tape detection rail 11 via the third bracket 63 of the laser marking device 6. One end of the reciprocating drive mechanism 51 is provided with a chip read-write detection head 52, and the reciprocating drive mechanism 51 drives the chip read-write detection head 52 to reciprocate up and down. The chip read-write detection head 52 includes a probe, which is a metal elastic probe. The probe has three groups, each group comprises two probes, each group of probes is connected with a coil, and the coil is arranged on the upper side of the card reader. The card reader 53 is disposed behind the tape detection track 11.

Preferably, the reader 53 and the coil may be selected to be the same reader or readers or different readers, or the same coil or coils, according to the detection requirement or the characteristics of the chip.

Preferably, the reader comprises a single chip microcomputer, a special intelligent module and an antenna, and is provided with a communication interface, a printing port, an I/O port and the like with a computer or a control system, so that the reader can be applied to different fields. The computer or control system controls the movement of each device by receiving and sending signals and receives signals of various sensors.

The reciprocating driving mechanism 51 may be an electromagnet driving assembly, or may be a hydraulic assembly or other power assembly such as an air cylinder, which can provide reciprocating motion, or may use a rack and pinion to transmit power provided by a driving assembly at another position.

Referring to fig. 5-2 and 5-3, in another embodiment of the present invention, the device for detecting the read/write performance of a chip includes a chip read/write roller and a probe 571, and the probe 571 contacts with the chip read/write roller. The chip reading and writing roller comprises a reading and writing detection toothed ring and a roller 58, wherein the reading and writing detection toothed ring is sleeved on the roller 58. The roller 58 is provided at both ends thereof with a first detecting roller bearing 541 and a second detecting roller bearing 542. The roller 58 is provided with a first strip positioning ring 551 and a second strip positioning ring 552 on both sides. The number of the probes 571 corresponds to the number of the read/write detecting ring gear, and the probes 571 contact one side of the read/write detecting ring gear.

Six read-write detection toothed rings are arranged on the chip read-write roller, namely a first read-write detection toothed ring 561, a second read-write detection toothed ring 562, a third read-write detection toothed ring 563, a fourth read-write detection toothed ring 564, a fifth read-write detection toothed ring 565 and a sixth read-write detection toothed ring 566. Every two read-write detection toothed rings form a group.

The chip read/write roll is mounted on a read/write roll support that includes a base 595, a first side frame 591 and a second side frame 592. The base is mounted on the tape detection track 11, and a recess in the base forms part of the station channel. The base mounts a first side frame 591 and a second side frame 592, the chip pick-and-place roller is mounted to the first and second side frames 591 and 592 by a shaft 593, and the shaft 593 passes through an aperture 594 of both frames. The base 595 serves to improve the stability of the chip read/write roller mounting.

The probe is mounted on a probe mount 572. The probe base 572 is attached to the upper portions of a first side frame 591 and a second side frame 592. The probe is located on the upper side of the roll. The position of the probe in this embodiment is a preferable mode, and in other embodiments, the probe may be disposed at other positions, for example, the probe is disposed at the outer side of the end of the roller, the read-write detection toothed ring is connected to a metal conductor embedded in the roller, the metal conductor is connected to the annular metal at the end of the roller, and the probe is connected to the annular metal at the end of the roller.

Preferably, in the present invention, the roller 58 is provided with a protrusion or a groove for facilitating the positioning of the read-write detection ring gear.

In another embodiment, one probe is in contact with two reading and writing detection toothed rings, the probe is arranged in a special conductor structure, for example, two conductors are respectively arranged on two sides of the probe for the toothed rings on the same side, and the two conductors are integrated to form one probe through a non-conductive material, so that the number of the probes on the roller is reduced, the installation stability and the replacement convenience are improved, and the size of the device is reduced. The non-conductive material may be ceramic, rubber, plastic, etc.

In another embodiment, the number of the probes and the read-write detection toothed ring is correspondingly adjusted according to the arrangement shape and the number of the chips to be detected. For example, a set of read/write detection ring gears may be provided, or a plurality of sets of detection ring gears may be provided. The number of detection rings included in each group may vary as desired, for example two or more. The number of probes corresponds to the number of teeth, and the number of probes can be reduced by integrating a part of the middle probes.

In another embodiment, the read/write detecting ring gear located in the middle portion is structurally integrated, for example, two read/write detecting ring gears are integrated into one component through a non-conductive material, so that the read/write detecting ring gear located in the middle portion can be conveniently mounted and dismounted. The non-conductive material may be ceramic, rubber, plastic, etc.

In another embodiment, the first side frame 591 and the second side frame 592 of the pick-and-write roller support are mounted on the tape detection rail 11. This kind of structure setting need not set up base 595 to be convenient for chip read-write performance detection device's change and cleanness. Furthermore, the reading and writing detection toothed ring can be replaced by other annular structures, and the annular structures are provided with bulges or pins.

Further, the probe may be replaced with a protrusion, a tooth, a wire, or the like.

Referring to fig. 1, 3, 6, 9-1, 9-2, the laser marking device 6 includes a laser marking shield 61, a laser 65, and a laser control box 66. Laser marking protection casing 61 is fixed in through third support 63 and fourth support 64 and takes the material to detect track 11, and laser instrument 65 is installed to the top of laser marking protection casing 61, and laser instrument 65 passes through the laser output optical cable and links to each other with laser instrument control box 66, laser instrument control box 65 has power module. The laser marking protective cover 61 is a transparent cover.

In order to facilitate assembly of the components, the third support 63 and the fourth support 64 are in an inverted Y shape, the bottoms of the two supports are provided with recesses for chips to pass through, the upper portions of the two supports are provided with transparent covers for installing on one side, and the third support is in an opaque structure, so that interference of laser on detection of the punched chips can be blocked.

In another embodiment of the invention, the two laser marking protective covers are symmetrically arranged.

The laser 65 comprises a light-emitting lens 67 and a galvanometer control system 69, the laser 65 is fixed on the adjusting frame 67, and a laser control box 66 and an equipment control and data processing computer 12 are respectively fixed on two sides of the adjusting frame 67. The adjustment bracket 67 supports the laser 65 by an arm 68. Vertical guide rail has on the alignment jig 67, arm 68 passes through the slider and moves up and down along the guide rail of alignment jig 67, and laser 65 is fixed in the one end of arm 68 through telescoping device, and light-emitting lens 67 on the laser 65 can rotate and can carry out the fine setting on the position of controlling and front and back. The galvanometer control system 69 may be mounted within the arm 68 or within a component above the exit lens 67. The upper end of the adjusting frame 70 is provided with a hand wheel 8 which is connected with a screw rod, threads are arranged in the slide block, and the up-and-down position of the laser is adjusted by rotating the up-and-down movement of the adjusting arm of the hand wheel.

In order to facilitate automatic adjustment, a hand wheel can be replaced by a motor, or hydraulic pressure and an air cylinder are used for directly driving the sliding block to move up and down.

In order to meet the production requirements, the laser marking can be a marking operation and can also be other laser marking modes. In order to meet the production and living requirements, the non-chip area marks of the material belt are marked arbitrarily, and the marks are serial numbers and/or Chinese characters and/or graphs.

In order to facilitate tracing, the chips are marked according to information fed back by the defective chip detection station and/or information fed back by the chip read-write performance detection station and/or position information of the current chip and/or other information, and the detection results of the defective chip detection station and the chip read-write performance detection station are stored by establishing a corresponding relation through a control system.

Preferably, for the convenience of installation and adjustment, avoid the collision, the alignment jig is installed in the frame middle part, and the cross section of alignment jig is oval.

Preferably, the up and down movement of the arm 68 can be driven by a motor or a pneumatic cylinder, and the automatic adjustment can be realized by a control system.

Referring to fig. 7-1 and 7-2, the discharging device 2 includes a first guide frame 21, a first connecting arm 22 is mounted on the first guide frame 21, a rotary buffer 23 is disposed on the first connecting arm 22, the rotary buffer is fixed to one end of the first connecting arm 22 through an L-shaped bracket 24, the other end of the first connecting arm 22 moves up and down in a guide rail of the first guide frame 21, the guide rail is a sliding groove, the first connecting arm 22 has two holes extending left and right, and the first connecting arm 22 adjusts the position of the tray in the left and right directions through the holes. The adjustment mode can be manual adjustment, and also can be automatic adjustment through a screw or a rack. In order to facilitate stable installation of the rotary damper, one end of the L-shaped bracket 24 is square, four corners of the square are respectively provided with a bolt, and the width of the arm of the L-shaped bracket in the vertical direction is smaller than the side length of the square. The rotating buffer is connected with the first material tray through the driven shaft. The driven shaft can be adjusted back and forth to adapt to charging trays with different thicknesses.

The material receiving device 7 comprises a second guide frame 71 and a motor 72, a second connecting arm 73 is mounted on the second guide frame 71, the motor 72 is fixed on the second connecting arm 73 through an L-shaped support 74, one end of the L-shaped support is square, four corners of the square are respectively provided with a bolt, and the width of the arm of the L-shaped support in the up-down direction is smaller than the side length of the square. The motor 72 is connected with the second tray through a driving transmission shaft. The motor 72 is a stepper motor or a servo motor.

The L-shaped support can not only ensure the support strength, but also reduce the weight, and is convenient for the observation of the operation condition of the device by an instrument operator.

For ease of manufacture and assembly, the first guide frame 21 and the second guide frame 71 are profiles having a central circular hole or cross-hole, and the profiles are industrial aluminum profiles. Preferably, the first guide frame 21 and the second guide frame 71 have one guide rail at each end and two guide rails at each end, and the first connecting arm 22 and the second connecting arm 73 can selectively connect one guide rail at each end to make the connecting arms more stable in the front-rear direction.

Referring to fig. 8, the tape detecting track 11 has a station channel 123 for accommodating the tape, two grooves 122 are disposed at the front of the station channel 123, and the first light source emitting end and the second light source emitting end are respectively located in the corresponding grooves.

In another embodiment of the present invention, the card reader is disposed in the groove of the tape detection track 11 or inside the tape detection track, so as to further facilitate the detection and reading and save space.

In order to ensure that the material belt is attached to the material belt detection track to stably run, two ends of the material belt detection track 11 are respectively provided with a guide roller 13, and the guide rollers 13 are fixed on the material belt detection track 11 through a support 14. The strip of material passes under the guide roller 13.

In another embodiment, to further improve the stability of the material belt, a plurality of rollers are used instead of the guide roller 13, or a plurality of rollers with different sizes are respectively installed at different positions of the material belt detection track 11.

In order to save space, the first bracket 32, the second bracket 42, the third bracket 63, and the fourth bracket 64 are disposed in parallel on the tape detection track.

FIG. 12 is a control interface displayed in the display of the present invention, the control interface including the following modules: connecting equipment, loading a laser marking template, marking a starting label, marking the maximum number, starting operation, pausing and ending operation. The modules are arranged in sequence from top to bottom on one side of the interface. The control interface also comprises a marking content preview module and an equipment running state display module.

To save space, control-related devices may be integrated into the housing 1, for example the internal components of the laser control box 66, the internal components of the control and data processing computer 12.

The working method of the invention is as follows: before operation, a first material tray to be detected is installed on a driven shaft of the discharging device 2, a second material tray is installed on an active transmission shaft of the material receiving device 7, an inner core sheet material belt of the first material tray penetrates through a station channel and then is fixed on the second material tray after detection, the second material tray is an empty material tray, after the operation is started, a motor 72 of the active transmission shaft is controlled by a computer to rotate at a certain speed to drive a chip material belt to move forwards, after a fixed number of correlation signals are detected by a correlation sensor of an in-place detection station, a driving shaft stops rotating, a punching chip detection station detects whether a chip is a punching chip or not, a chip read-write performance detection station carries out corresponding read-write performance detection or chip information initialization on the chip and records the read information such as a unique chip serial number through a computer program, and a laser marking station marks information fed back by the punching chip detection station and the chip read-write performance detection station and the current chip material belt position mark position information and other information of the chip material belt position And (4) establishing a corresponding relation between each detection result and the information which is visible and visible by the user through a computer program, and storing the corresponding relation until the material tray is detected completely.

Referring to fig. 10, the edge of the chip material tape to be detected has a plurality of square holes 17, and the square holes are distributed in a row along the edge of the material tape. There is also a row of square holes 17 on the other side of the strip. One of the chips has a hole 18 in one corner. Hole 18 indicates that the chip is defective or defective.

The in-place detection station detects the square hole 17 at the edge of the material belt through the correlation sensor and informs a computer whether the material belt is moved to the correct position. To determine whether the motor of the driving transmission shaft stops rotating. The square holes 17 may be replaced by round holes or holes of other shapes, or by special marks.

The punched chip detection station detects whether a corner of the chip has a hole 18 by a correlation sensor to determine whether the chip is a punched chip or a normal chip. The holes 18 may be round, square or other shaped holes, and may be replaced with easily identifiable indicia.

The IC card read-write performance detection station controls 3 groups of metal elastic probes to downwards contact the two poles of the chip through a cylinder or an electromagnetic valve. The probe is connected with the coil, the coil is arranged on the upper side of the card reader, and the card reader induces the coil. The card reader is controlled by a computer program to be inducted with the non-contact chip coil, the chip is read and written, and information such as the unique serial number of the chip is read and stored in a computer.

Preferably, in order to conveniently place and protect the coil, a slot for accommodating the coil is arranged at the upper part of the card reader or an accommodating device is independently arranged above the card reader for the coil; or the coil is arranged in the shell, and the coil and the shell are replaced together when the coil is replaced.

The laser marking station marks any mark on the non-chip area of the material belt, wherein the mark can be a serial number, a Chinese character graph or other information, so that operators in the subsequent IC card manufacturing step can trace the source of the chip, count the chip and the like through visual observation. The laser marking station may mark the surface of the chip to record the inspection of individual chips.

The IC card chip detection mark counter can store the information of the stations together through a computer program to form a corresponding relation, and is convenient for subsequent tracing. The IC card chip detection mark counter can count the total number and record a single chip, thereby facilitating subsequent statistical analysis.

Preferably, in order to save time and energy, a reasonable procedure is set for the initial stage of detection after the instrument is started. As shown in fig. 11, after the start-up, the tape is operated in sequence according to the arrow, and the last part of the cycle operation is performed until all the processes are distributed with chips. The method specifically comprises the following steps: the charging tray rotates by a certain range, and when the in-place detection device detects a preset number of chips, chips are distributed on the punching chip detection station. After the chip detection of punching is carried out, the material disc continues to rotate by a certain range, the material belt continues to advance, when the in-place detection device detects a preset number of chips, chips are distributed on a punching chip detection station and a chip read-write performance detection station, and the chip detection and the read-write performance detection are carried out. And then, the tray continues to rotate, when the in-place detection device detects a preset number of chips, the chips are distributed on the punching chip detection station, the chip read-write performance detection station and the laser marking station, and the punching chip detection, the read-write performance detection and the laser marking are carried out. Then, the invention carries out the circulation steps of in-place detection, punching chip detection, read-write performance detection and laser marking on the chip on the material belt.

And the detection of each station can be carried out when the chip is static or in the moving process of the chip. For detection during movement, detection of the in-place detection device and detection of the punched chip detection station can adopt a tracking system, such as an image tracking system for tracking the chip or other tracking systems.

On the premise of the same detection equipment, the detection precision of the chip is high when the chip is static, and the detection in the chip movement process saves time. And selecting detection in a stop state or in a chip motion state process according to the detection requirement.

Preferably, in order to further save time and energy, when the detection is performed to approach the final part of the tray, the in-place detection, the punching chip detection, the read-write performance detection and the laser marking are stopped in sequence according to the number of chips.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through the communication between two elements. The indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are for convenience of description only, and no device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Those skilled in the art can make numerous possible variations and modifications to the described embodiments, or modify equivalent embodiments, without departing from the scope of the invention. Therefore, any modification, equivalent change and modification made to the above embodiments according to the technology of the present invention are within the protection scope of the present invention, unless the content of the technical solution of the present invention is departed from.