阅读说明：本技术 Pcb板上电子元件的贴合方法、装置和存储介质 (Method and device for attaching electronic element on PCB (printed Circuit Board) and storage medium ) 是由 钟石明 于 2019-09-05 设计创作，主要内容包括：本发明公开了一种PCB板上电子元件的贴合方法,所述PCB板上电子元件的贴合方法包括以下步骤：获取PCB板的图像,确定所述PCB板的多个mark点；根据各个所述mark点确定所述PCB板的偏移量；根据所述偏移量调整PCB板的位置；控制电子元件移动,将所述电子元件与所述PCB板进行贴合,以将所述贴合物品与所述被贴合物品进行贴合。本发明还公开一种PCB板上电子元件的装置贴合和计算机可读存储介质。本发明提高了贴合PCB板的质量。(The invention discloses a method for attaching electronic elements on a PCB (printed circuit board), which comprises the following steps of: acquiring an image of a PCB, and determining a plurality of mark points of the PCB; determining the offset of the PCB according to each mark point; adjusting the position of the PCB according to the offset; and controlling the electronic element to move, and attaching the electronic element to the PCB so as to attach the attached article to the attached article. The invention also discloses device attaching of the electronic element on the PCB and a computer readable storage medium. The invention improves the quality of the attached PCB.)

1. A method for attaching electronic components to a PCB, comprising the steps of:

acquiring an image of a PCB, and determining a plurality of mark points of the PCB;

determining the offset of the PCB according to each mark point;

adjusting the position of the PCB according to the offset;

and controlling the electronic element to move, and attaching the electronic element to the PCB.

2. The method for attaching an electronic component to a PCB of claim 1, wherein the mark point is an end point on a diagonal of the PCB, the mark point includes a feature point and an open region, the feature point and the open region form concentric circles, and a radius of the feature point is one third of a radius of the open region.

3. The method for attaching electronic components to a PCB of claim 2, wherein the determining the offset of the PCB according to each mark point comprises:

connecting any two mark points to obtain a reference line;

determining a reference line corresponding to the reference line on a working plane where the PCB is located;

and determining the offset of the PCB according to the reference line and the reference line.

4. A method for attaching electronic components to a PCB as claimed in claim 3, wherein the step of connecting any two mark points to obtain a reference line comprises:

determining two mark points to be connected to serve as target mark points, and determining the central point of each target mark point;

connecting the central points of the two target mark points to obtain a reference line, wherein the step of determining the offset of the PCB according to the reference line and the reference line comprises the following steps:

determining an included angle between the reference line and the datum line as an offset angle;

rotating the reference line by the offset angle to obtain a rotated reference line, wherein the rotated reference line is parallel to or at least partially overlapped with the reference line;

and determining the transverse offset and the longitudinal offset of the PCB according to the end point of the rotated reference line and the end point of the reference line, wherein the offset comprises an offset angle, a transverse offset and a longitudinal offset.

5. A method according to claim 4, wherein a planar coordinate system is established on the working platform, the offset angle is calculated according to coordinates of an end point of a reference line and coordinates of an end point of the reference line, and the step of rotating the reference line by the offset angle to obtain a rotated reference line, wherein the step of rotating the reference line parallel to or at least partially overlapping the reference line comprises:

determining a midpoint of the reference line;

and rotating the reference line by the offset angle by taking the midpoint as a rotation center to obtain a rotated reference line.

6. The method of claim 4, wherein the determining the lateral offset and the longitudinal offset of the PCB according to the end point of the rotated reference line and the end point of the reference line comprises:

moving the rotated reference line to enable the end point of the rotated reference line to be overlapped with the corresponding end point on the datum line, and recording the moving distance of the reference line;

according to the moving distance of the reference line, obtaining the transverse offset and the longitudinal offset of the PCB, wherein the calculation method of the transverse offset and the longitudinal offset comprises the following steps: the end points of the reference line are denoted as a and B, the end points of the reference line are denoted as C and D, a corresponds to C, B corresponds to D, the offset angle is θ, the distance between the rotation center and the point B is denoted as r, the coordinates of B are denoted as (Xb, Yb), the coordinates of D are denoted as (Xd, Yd), the point B of the reference line after rotation is denoted as B ' (Xb ', Yb '), the transverse offset Δ X is Xb ' -Xd, the longitudinal offset Δ Y is Yb ' -Yd,

wherein Xb' ═ (Xb-rXb) cos theta- (Yb-rYb) sin theta + rXb,

Yb’＝(Xb-rXb)sinθ-(Yb-rYb)cosθ+rYb。

7. a method for attaching electronic components to a PCB as claimed in claim 6, wherein the step of adjusting the position of the PCB according to the offset comprises:

rotating the PCB with the midpoint as a rotation center according to the rotation angle;

and moving the PCB according to the transverse offset and the longitudinal offset.

8. The method according to any one of claims 1 to 7, wherein the PCB is placed in a fixed area of the work platform, the PCB includes a plurality of bonding positions, each bonding position corresponds to an electronic component, the step of controlling the movement of the electronic component and bonding the electronic component to the PCB includes:

determining each attaching position of the PCB;

acquiring the moving distance between the electronic element and each bonding position;

and sequentially attaching each electronic element to a corresponding attachment position according to the moving distance.

9. An attaching device for electronic components on a PCB, comprising an image collecting module, a memory, a processor, and an attaching program for electronic components on a PCB, which is stored in the memory and can be run on the processor, wherein the image collecting module is connected to the processor, and the attaching program for electronic components on a PCB is executed by the processor to implement the steps of the attaching method for electronic components on a PCB according to any one of claims 1 to 8.

10. A computer-readable storage medium, wherein the computer-readable storage medium stores a program for bonding electronic components on a PCB, and the program for bonding electronic components on a PCB is executed by a processor to implement the steps of the method for bonding electronic components on a PCB according to any one of claims 1 to 8.

Technical Field

The invention relates to the technical field of a bonding process, in particular to a bonding method and device for an electronic element on a PCB (printed circuit board) and a storage medium.

Background

The lamination is a calendering method in which two or more layers of thin films of the same or different types are laminated to form an integral film having a large thickness, or a method in which the surface of one article is laminated to the surface of another article.

At present, most of the fitting between articles is manually performed, and manual fitting is determined through human eyes, so that errors exist more or less, and the quality of a product obtained through fitting is poor.

Disclosure of Invention

The invention mainly aims to provide a method and a device for attaching electronic elements on a PCB (printed circuit board) and a storage medium, aiming at solving the problem of poor quality of attached products.

In a first aspect, an embodiment of the present invention provides a method for attaching an electronic component to a PCB, where the method includes:

acquiring an image of a PCB, and determining a plurality of mark points of the PCB;

determining the offset of the PCB according to each mark point;

adjusting the position of the PCB according to the offset;

and controlling the electronic element to move, and attaching the electronic element to the PCB.

Preferably, the mark point is an end point on a diagonal of the PCB, the mark point includes a feature point and a hollow region, the feature point and the hollow region form a concentric circle, and a radius of the feature point is one third of a radius of the hollow region.

Preferably, the determining the offset of the PCB according to each mark point includes:

connecting any two mark points to obtain a reference line;

determining a reference line corresponding to the reference line on a working plane where the PCB is located;

and determining the offset of the PCB according to the reference line and the reference line.

Preferably, the step of connecting any two mark points to obtain a reference line comprises:

determining two mark points to be connected to serve as target mark points, and determining the central point of each target mark point;

connecting the central points of the two target mark points to obtain a reference line, wherein the step of determining the offset of the PCB according to the reference line and the reference line comprises the following steps:

determining an included angle between the reference line and the datum line as an offset angle;

rotating the reference line by the offset angle to obtain a rotated reference line, wherein the rotated reference line is parallel to or at least partially overlapped with the reference line;

and determining the transverse offset and the longitudinal offset of the PCB according to the end point of the rotated reference line and the end point of the reference line, wherein the offset comprises an offset angle, a transverse offset and a longitudinal offset.

Preferably, a plane coordinate system is established on the working platform, the offset angle is calculated according to the coordinate of the end point of the datum line and the coordinate of the end point of the reference line, and the rotated reference line is obtained by rotating the reference line by the offset angle, wherein the step of parallel or at least partially overlapping the rotated reference line and the datum line comprises:

determining a midpoint of the reference line;

and rotating the reference line by the offset angle by taking the midpoint as a rotation center to obtain a rotated reference line.

Preferably, the determining the lateral offset and the longitudinal offset of the PCB according to the end point of the rotated reference line and the end point of the reference line includes:

moving the rotated reference line to enable the end point of the rotated reference line to be overlapped with the corresponding end point on the datum line, and recording the moving distance of the reference line;

according to the moving distance of the reference line, obtaining the transverse offset and the longitudinal offset of the PCB, wherein the calculation method of the transverse offset and the longitudinal offset comprises the following steps: the end points of the reference line are denoted as a and B, the end points of the reference line are denoted as C and D, a corresponds to C, B corresponds to D, the offset angle is θ, the distance between the rotation center and the point B is denoted as r, the coordinates of B are denoted as (Xb, Yb), the coordinates of D are denoted as (Xd, Yd), the point B of the reference line after rotation is denoted as B ' (Xb ', Yb '), the transverse offset Δ X is Xb ' -Xd, the longitudinal offset Δ Y is Yb ' -Yd,

wherein Xb' ═ (Xb-rXb) cos theta- (Yb-rYb) sin theta + rXb,

Yb’＝(Xb-rXb)sinθ-(Yb-rYb)cosθ+rYb。

preferably, the step of adjusting the position of the PCB board according to the offset includes:

rotating the PCB with the midpoint as a rotation center according to the rotation angle;

and moving the PCB according to the transverse offset and the longitudinal offset.

Preferably, the PCB is placed in a fixed area of the work platform, the PCB includes a plurality of attaching positions, each of the attaching positions corresponds to an electronic component, the step of controlling the electronic component to move and attaching the electronic component to the PCB includes:

determining each attaching position of the PCB;

acquiring the moving distance between the electronic element and each bonding position;

and sequentially attaching each electronic element to a corresponding attachment position according to the moving distance.

In a second aspect, an embodiment of the present invention provides a device for bonding electronic components on a PCB, where the device includes an image acquisition module, a memory, a processor, and a program for bonding electronic components on a PCB, which is stored in the memory and is executable on the processor, where the image acquisition module is connected to the processor, and the program for bonding electronic components on a PCB is executed by the processor to implement the steps of the method for bonding electronic components on a PCB according to any one of the first aspect of the present invention.

In a third aspect, an embodiment of the present invention provides a computer-readable storage medium, where the computer-readable storage medium stores a program for attaching electronic components on a PCB, and when the program is executed by a processor, the steps of the method for attaching electronic components on a PCB according to the first aspect are implemented.

In summary, according to the method and the device for attaching an electronic component to a PCB and the computer-readable storage medium provided by the present invention, the attaching device of the electronic component to the PCB acquires an image of an attached article acquired by the image acquisition module, so as to determine a plurality of mark points of the PCB according to the image, determine an offset of the PCB according to each mark point, and control the electronic component to move after adjusting the position of the PCB according to the offset, so as to complete the attachment of the PCB and the electronic component. Because the laminating device can confirm the offset of PCB board according to mark point, need not artifical the confirming, guaranteed the accuracy of offset to make the product yields that the laminating obtained higher, improved the quality of product.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a hardware architecture of a fitting apparatus for an article according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart illustrating a first embodiment of a mark point-based article attaching method according to the present invention;

FIG. 3 is a detailed flowchart of step S200 in FIG. 2;

FIG. 4 is a schematic flow chart illustrating a second embodiment of a mark point-based article attaching method according to the present invention;

fig. 5 is a schematic flow chart of a third embodiment of the mark point-based article attaching method according to the present invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The main solution of the embodiment of the invention is as follows: acquiring an image of a jointed article acquired by an image acquisition module, and determining a plurality of mark points of the jointed article according to the image; determining the offset of the attached article according to each mark point; and after the position of the attached article is adjusted according to the offset, controlling the attached article to move so as to attach the attached article and the attached article.

Because the laminating device can confirm the offset of the article being laminated according to the mark point, need not artifical the confirming, guaranteed the accuracy of offset to make the product yields that the laminating obtained higher, improved the quality of product.

As an implementation, the attaching means of the article may be as shown in fig. 1.

The embodiment scheme of the invention relates to a fitting device of an article, which comprises: a processor 101, e.g. a CPU, a memory 102, a communication bus 103, an image acquisition module 104. The communication bus 103 is used for realizing connection and communication among the components, and the image acquisition module 104 may be a camera. The memory 102 may be a high-speed RAM memory or a non-volatile memory (e.g., a disk memory). As shown in fig. 1, a memory 103 as a kind of computer storage medium may include a fit program of an article; and processor 101 may be configured to invoke a fit program for the article stored in memory 102 and perform the following operations:

acquiring an image of a jointed article acquired by an image acquisition module, and determining a plurality of mark points of the jointed article according to the image;

determining the offset of the attached article according to each mark point;

and after the position of the attached article is adjusted according to the offset, controlling the attached article to move so as to attach the attached article and the attached article.

In one embodiment, processor 101 may be configured to invoke a fit program for an article stored in memory 102 and perform the following operations:

connecting any two mark points to obtain a reference line, and determining a reference line corresponding to the reference line on the working plane where the attached article is located;

and determining the offset of the attached article according to the reference line and the reference line.

In one embodiment, processor 101 may be configured to invoke a fit program for an article stored in memory 102 and perform the following operations:

determining an included angle between the reference line and the datum line as an offset angle;

rotating the reference line by the offset angle to obtain a rotated reference line, wherein the rotated reference line is parallel to or at least partially overlapped with the reference line;

and determining the transverse offset and the longitudinal offset of the attached article according to the end point of the rotated reference line and the end point of the reference line, wherein the offset comprises an offset angle, a transverse offset and a longitudinal offset.

In one embodiment, processor 101 may be configured to invoke a fit program for an article stored in memory 102 and perform the following operations:

determining a midpoint of the reference line;

and rotating the reference line by the offset angle by taking the midpoint as a rotation center to obtain a rotated reference line.

In one embodiment, processor 101 may be configured to invoke a fit program for an article stored in memory 102 and perform the following operations:

determining two mark points to be connected to serve as target mark points, and determining the central point of each target mark point, wherein the mark points are identification positions formed by circles;

and connecting the central points of the two target mark points to obtain a reference line.

In one embodiment, processor 101 may be configured to invoke a fit program for an article stored in memory 102 and perform the following operations:

determining each fitting position of the fitted article;

acquiring the moving distance between the attached article and each attaching position;

and sequentially fitting each fitting article to the corresponding fitting position according to the moving distance.

According to the scheme, the attaching device of the article acquires the image of the attached article acquired by the image acquisition module, so that the multiple mark points of the attached article are determined according to the image, the offset of the attached article is determined according to each mark point, and after the position of the attached article is adjusted according to the offset, the attached article is controlled to move, so that the attachment of the attached article and the attached article is completed. Because the laminating device can confirm the offset of the article being laminated according to the mark point, need not artifical the confirming, guaranteed the accuracy of offset to make the product yields that the laminating obtained higher, improved the quality of product.

Based on the hardware framework of the attaching device of the article, the embodiment of the attaching method of the article based on the mark point is provided.

Referring to fig. 2, fig. 2 is a first embodiment of the mark point-based article attaching method of the present invention, which includes the following steps:

step S100, acquiring an image of a jointed article acquired by an image acquisition module, and determining a plurality of mark points of the jointed article according to the image;

in this embodiment, the execution main body is a fitting device of an article. For ease of description, the device is hereinafter referred to as a fit device for an article. The device comprises an image acquisition module and a driving mechanism, wherein the image acquisition module can be a camera or a camera, the device can comprise a plurality of image acquisition modules and is used for acquiring images of attached articles, and the device can also be provided with only one image acquisition module. The attached article is connected with the corresponding driving mechanism, and the driving mechanism can control the attached article to move relative to the attached article, so that the attached article and the attached article are attached.

In this embodiment, mark positioning is concerned. mark positioning refers to performing position correction on a bonded article by providing mark points on the bonded article. The mark points can be regarded as position identification points on the attached article, and the mark points are generally arranged in pairs, and the relative distance between the pair of mark points is as far as possible, so that two end points on the diagonal line of the attached article can be set as the pair of mark points.

When the attached article needs to be attached, the attached article is placed on the working platform, the device starts the image acquisition module to acquire the image of the attached article, and therefore a plurality of mark points of the attached article are determined according to the image. The attached article is placed in the fixed area of the working platform, and the position of the mark point on the attached article is generally fixed and unchangeable, so that the device can be provided with the image acquisition module on the fixed area to acquire the mark point at the position corresponding to the attached article.

Step S200, determining the offset of the attached article according to each mark point;

after determining the mark point, the apparatus may determine an offset of the attached article based on the mark point. Specifically, please refer to fig. 3, that is, step S200 includes:

step S210, connecting any two mark points to obtain a reference line, and determining a reference line corresponding to the reference line on the working plane where the attached article is located;

step S220, determining an offset of the attached article according to the reference line and the reference line.

The device can connect any pair of mark points, resulting in a straight line, which is defined as the reference line. Datum lines are arranged on the working plane, and the datum lines corresponding to different pairs of mark points are different. For example, a reference line is corresponding to a pair of mark points constructed by the upper left corner and the lower right corner of the attached article, and a reference line is corresponding to a pair of mark points constructed by the upper right corner and the lower left corner of the attached article.

After the device obtains the reference line, the reference line corresponding to the reference line is determined, the device moves the reference line to be overlapped with the reference line, and the moving distance of the reference line when the reference line moves to be overlapped with the reference line is the offset. It should be noted that, the end points of the reference line corresponding to the end points of the reference line need to be overlapped, for example, the end point a on the reference line is the top left corner mark point of the attached article and the end point B is the bottom right corner mark point of the attached article, the end point C of the reference line is the standard position representing the bottom right corner of the attached article on the working plane, and the end point D of the reference line is the standard position representing the top left corner of the attached article on the working plane, that is, the end point a corresponds to the end point D, and the end point B corresponds to the end point C, so when the reference line and the reference line are overlapped, the end point a and the end point D are overlapped, and the end point B and the end point C are overlapped.

And step S300, after the position of the attached article is adjusted according to the offset, controlling the attached article to move so as to attach the attached article and the attached article.

The offset amount may include an offset angle, a lateral offset amount, and a longitudinal offset amount. The offset angle is the rotation angle of the attached article. The attached article is correspondingly provided with the driving mechanism, the device can control the driving mechanism according to the offset, so that the position of the attached article is adjusted, the driving mechanism of the attached article is controlled by the device to move for a preset distance, the attached article is attached to the attached article, and the attachment of the article is completed.

In the technical scheme provided by this embodiment, the attaching device of the article acquires an image of the attached article acquired by the image acquisition module, so as to determine a plurality of mark points of the attached article according to the image, determine an offset of the attached article according to each mark point, and control the attaching article to move after adjusting the position of the attached article according to the offset, so as to complete the attachment of the attached article and the attached article. Because the laminating device can confirm the offset of the article being laminated according to the mark point, need not artifical the confirming, guaranteed the accuracy of offset to make the product yields that the laminating obtained higher, improved the quality of product.

Referring to fig. 4, fig. 4 is a second embodiment of the method for attaching an article based on mark points according to the present invention, where based on the first embodiment, the step S220 includes:

step S221, determining an included angle between the reference line and the reference line as an offset angle;

step S222, rotating the reference line by the offset angle to obtain a rotated reference line, wherein the rotated reference line is parallel to or at least partially overlapped with the reference line;

step S223, determining a lateral offset and a longitudinal offset of the attached article according to the end point of the rotated reference line and the end point of the reference line, where the offsets include an offset angle, a lateral offset, and a longitudinal offset.

In this embodiment, the reference line and the reference line may be located on the same plane, that is, both located on the working plane. The apparatus may establish a coordinate system for the working plane. Therefore, the end point of the reference line and the end point of the reference line have corresponding coordinates. The device can calculate the included angle between the two lines according to the coordinates of the end points of the datum lines and the coordinates of the end points of the reference lines. The included angle is the offset angle.

After the offset angle is determined, the device rotates the attaching surface by the offset angle, so that the reference line is parallel to or coincided with the datum line, namely the rotated reference line is obtained, and the offset is obtained according to the coordinate of the end point of the rotated reference line and the coordinate of the end point of the datum line. Specifically, assuming that the end points of the reference line are a and B, the end points of the reference line are C and D, a corresponds to C, B corresponds to D, the offset angle is θ, the distance between the center point of the bonding surface and the point B when rotated is r, the coordinates of B are (X B, Y B), the coordinates of D are (X D, Y D), and B ' (X B ', Y B ') is obtained after the reference line is rotated,

X b’＝(X b-rX b)cosθ-(Y b-rY b)sinθ+r X b；

Y b’＝(X b-rX b)sinθ-(Y b-rY b)cosθ+r Y b。

this gives the lateral offset Δ X of X b '-X d and the lateral offset Δ Y of Y b' -Y d.

When the reference line is parallel to or overlaps the reference line, the lateral shift amount Δ X is X b to X d, and the lateral shift amount Δ Y is Y b to Y d.

When the apparatus rotates the article to be attached by an offset angle, the apparatus can rotate with any point of the article to be attached as a rotation center. However, the rotated attached article may be separated from the working plane, so that the apparatus cannot acquire the coordinates of the attached article, and thus cannot determine the offset of the attached article. Therefore, the device can take the midpoint of the reference line as a rotation center, and the phenomenon that the rotated bonded object is separated from the working plane is avoided.

In the technical scheme provided by this embodiment, the device determines an included angle between the reference line and the reference line as an offset angle, and rotates the reference line by the offset angle to obtain a rotated reference line, so that the transverse offset and the longitudinal offset of the attached article are determined according to the end point of the rotated reference line and the end point of the reference line, and the device can accurately calculate the offset of the attached article.

Referring to fig. 5, fig. 5 is a third embodiment of the method for attaching an article based on mark points according to the present invention, where based on the first embodiment, the step S210 includes:

step S211, determining two mark points to be connected as target mark points, and determining the central point of each target mark point, wherein the mark points are identification positions formed by circles;

step S212, connecting the central points of the two target mark points to obtain a reference line.

In the present embodiment, the mark point is an identification position constituted by a circle. The mark point comprises a characteristic point and an open area, the characteristic point is positioned in the center of the open area, the shape of the open area is running, and the characteristic point and the open area form concentric circles. In order to improve the identification effect of the image acquisition module, the radius of the characteristic points is one third of the radius of the open area.

The device can determine pairs of mark points as target mark points; the device determines the center point of the mark point, wherein the center point is the center point of the feature point, namely the center of the mark point; the device then connects the two centers of the pair of mark points to obtain a reference line.

In the technical scheme provided by the embodiment, the device adopts the center point of the mark point as the end point of the reference line, so that the error between the reference line formed by the center point and the theoretical reference line of the attached article is reduced, and the offset of the attached article can be more accurately calculated by the device.

In one embodiment, the attached article is provided with a plurality of attaching positions, and each attaching position corresponds to one attached article. After the position of the article to be bonded is adjusted, the device calculates the movement distance between the article to be bonded and each bonding position, and stores the movement distance and the bonding position association corresponding to the movement distance. Thereby the device can each migration distance will laminate article and laminate to the laminating position that migration distance corresponds to accomplish the laminating of each laminating position by the article of laminating. For example, the attached article is a PCB, the PCB is provided with a plurality of attachment positions, each attachment position needs to be attached with a corresponding electronic component, and the electronic component is the attached article.

The invention also provides a device for attaching an article, which comprises an image acquisition module, a memory, a processor and an article attaching program which is stored in the memory and can run on the processor, wherein the image acquisition module is connected with the processor, and when being executed by the processor, the article attaching program realizes the steps of the article attaching method based on mark points in the embodiment.

The invention also provides a computer-readable storage medium, which stores an article attaching program, and when the article attaching program is executed by a processor, the computer-readable storage medium implements the steps of the article attaching method based on mark points as described in the above embodiment.

The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.