阅读说明：本技术 摄像头模组及其制备方法、电子设备 (Camera module, preparation method thereof and electronic equipment ) 是由 王富星 朱林波 于 2021-07-01 设计创作，主要内容包括：本申请公开了摄像头模组及其制备方法,以及电子设备,属于电子设备技术领域,所述压印镜片包括红外截止滤光片、第一压印面和第二压印面；所述红外截止滤光片的第一面上覆盖紫外吸收层,所述第一压印面压印于所述紫外吸收层远离所述红外截止滤光片的一面上,所述第二压印面压印于所述红外截止滤光片远离所述紫外吸收层的第二面上；所述压印镜片包括第一球面、第二球面、第一非球面切边和第二非球面切边。(The application discloses a camera module, a manufacturing method thereof and electronic equipment, and belongs to the technical field of electronic equipment, wherein an imprinting lens comprises an infrared cut-off filter, a first imprinting surface and a second imprinting surface; an ultraviolet absorption layer covers a first surface of the infrared cut-off filter, the first stamping surface is stamped on one surface, far away from the infrared cut-off filter, of the ultraviolet absorption layer, and the second stamping surface is stamped on a second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter; the stamped lens includes a first spherical surface, a second spherical surface, a first aspheric trim, and a second aspheric trim.)

1. A camera module, comprising: imprinting a lens;

the stamping lens comprises an infrared cut-off filter, a first stamping surface and a second stamping surface;

an ultraviolet absorption layer covers a first surface of the infrared cut-off filter, the first stamping surface is stamped on one surface, far away from the infrared cut-off filter, of the ultraviolet absorption layer, and the second stamping surface is stamped on a second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter;

the stamped lens includes a first spherical surface, a second spherical surface, a first aspheric trim, and a second aspheric trim.

2. The camera module of claim 1, further comprising: a lens mount;

a cavity matched with the shape of the cut edge of the imprinting lens is arranged in the lens base;

the stamped lens is secured in the cavity.

3. The camera module of claim 2, further comprising: a chip and a flexible printed circuit board;

the lens base is arranged on one surface of the chip far away from the flexible printed circuit board, and the chip is aligned with the imprinting lens and matched with the imprinting lens in size;

the chip is attached to the flexible printed circuit board.

4. The camera module of claim 3, further comprising: the camera comprises a first lens, a lens shell, a lens carrier and a lens chassis;

the first lens is provided with four cutting edges, and the outer edge of the position with the maximum diameter of the first lens is provided with a first thread;

the first lens is nested in a cavity of the lens shell, and the first threads are engaged with second threads arranged on the lens carrier;

the lens carrier is nested in a reserved cavity of the lens chassis.

5. The camera module of claim 4, wherein the lens chassis is secured in alignment with the lens mount.

6. A camera module preparation method is characterized by comprising the following steps:

preparing an ultraviolet absorption layer on a first surface of the infrared cut-off filter;

impressing printing glue on the ultraviolet absorption layer to prepare a first impressing surface;

stamping printing glue on one surface of the infrared cut-off filter, which is far away from the ultraviolet absorption layer, and preparing a second stamping surface to obtain a stamping lens base material;

and cutting the imprinting lens base material by adopting laser to obtain the imprinting lens, wherein the imprinting lens comprises a first spherical surface, a second spherical surface, a first aspheric surface trimming edge and a second aspheric surface trimming edge.

7. The method of claim 6, further comprising:

preparing a lens base for fixing the imprinting lens; the cavity of the lens base is matched with the shape of the edge of the stamped lens, and the cavity is used for nesting the stamped lens.

8. The method of claim 7, further comprising:

preparing a first lens comprising four cut edges, wherein the four cut edges are used for focusing and clamping in the process of assembling the first lens and a lens shell;

and preparing a first thread on the outer edge of the maximum diameter position of the first lens, wherein the first thread is in snap fit with a second thread arranged on the lens carrier.

9. The method of claim 6, further comprising:

and superposing and fixing the first lens, the lens shell, the lens carrier, the lens chassis, the imprinting lens, the lens base and the chip in sequence, and attaching the imprinting lens, the lens base and the chip to a flexible printed circuit board to prepare the camera module.

10. An electronic device comprising a processor, a memory, and a program or instructions stored on the memory and executable on the processor, wherein the electronic device further comprises the camera module of any of claims 1-5.

Technical Field

The embodiment of the application relates to the technical field of electronic equipment, in particular to a camera module, a manufacturing method of the camera module and the electronic equipment.

Background

Image shooting has become an important additional function of electronic equipment, and with the continuous improvement of user's demand for image shooting of electronic equipment, each party's technical team is dedicated to the technical research and development in the field of mobile phone shooting to reduce the shooting effect gap between electronic equipment and professional camera.

The structure of the existing camera module is shown in fig. 1, and the camera module comprises a lens 101, a camera shell 102, a camera carrier 103, a camera chassis 104, an infrared cut-off filter 105, a camera base 106, a chip 107 and a flexible circuit board 108 which are sequentially stacked. However, with the improvement of the image quality of the camera module and the stricter limitation of the overall dimension of the lens, purple fringing in the image shot by the camera module is more obvious.

Disclosure of Invention

The embodiment of the application aims to provide a camera module, a preparation method thereof and electronic equipment, and can solve the problem that purple fringing is obvious in a shot image in the prior art.

In order to solve the technical problem, the present application is implemented as follows: in a first aspect, an embodiment of the present application provides a camera module, including: imprinting a lens; the stamping lens comprises an infrared cut-off filter, a first stamping surface and a second stamping surface; an ultraviolet absorption layer covers a first surface of the infrared cut-off filter, the first stamping surface is stamped on one surface, far away from the infrared cut-off filter, of the ultraviolet absorption layer, and the second stamping surface is stamped on a second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter; the stamped lens includes a first spherical surface, a second spherical surface, a first aspheric trim, and a second aspheric trim.

In a second aspect, an embodiment of the present application provides a method for manufacturing a camera module, including: preparing an ultraviolet absorption layer on a first surface of the infrared cut-off filter; impressing printing glue on the ultraviolet absorption layer to prepare a first impressing surface; stamping printing glue on one surface of the infrared cut-off filter, which is far away from the ultraviolet absorption layer, and preparing a second stamping surface to obtain a stamping lens base material; and cutting the imprinting lens base material by adopting laser to obtain the imprinting lens, wherein the imprinting lens comprises a first spherical surface, a second spherical surface, a first aspheric surface trimming edge and a second aspheric surface trimming edge.

In a third aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and the electronic device further includes the camera module according to the first aspect.

In the embodiment of the application, the camera module is provided with the imprinting lens, and the imprinting lens comprises an infrared cut-off filter, a first imprinting surface and a second imprinting surface; the ultraviolet absorption layer covers the first surface of the infrared cut-off filter, the first stamping surface is stamped on the surface, far away from the infrared cut-off filter, of the infrared absorption layer, the second stamping surface is stamped on the second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter, and the ultraviolet absorption layer covering the infrared cut-off filter can absorb part of purple light to fade purple edges in a shot image. In addition, in this application embodiment, set up the impression lens into the shape that includes two spheres and two aspheric surfaces are cut edge, and the impression lens matches with the chip size and sets up in the cavity of camera lens base, can not additionally increase the thickness of camera module. Therefore, the camera module provided by the embodiment of the application can fade purple fringing in the shot image on the basis of not increasing the thickness of the camera module.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic diagram showing a prior art camera module;

FIG. 2 is a schematic diagram showing the configuration of an embossed lens according to an embodiment of the present application;

FIG. 3 is a schematic view showing a positional relationship between an infrared cut filter and an ultraviolet absorbing layer according to an embodiment of the present invention;

FIG. 4 is a schematic perspective view of an embossed lens according to an embodiment of the present application;

fig. 5 is a schematic structural diagram illustrating a camera module according to an embodiment of the present application;

fig. 6 is a schematic structural diagram illustrating a first lens according to an embodiment of the present application;

fig. 7 is an exploded view of a camera module according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram illustrating a structural change of a camera module under motor driving according to an embodiment of the present application;

fig. 9 is a flowchart illustrating steps of a method for manufacturing a camera module according to an embodiment of the present application;

FIG. 10 is a schematic illustration of an impression showing a first impression surface of an embodiment of the present application;

FIG. 11 is a schematic illustration of an impression showing a second impression surface of an embodiment of the present application;

FIG. 12 is a schematic view showing the cutting of a stamped lens according to an embodiment of the present application;

fig. 13 is a schematic structural view showing a lens mount according to an embodiment of the present application;

FIG. 14 is a sectional view showing a mounting structure of a stamp lens and a lens mount according to an embodiment of the present application;

fig. 15 is a schematic view illustrating an assembly process of the camera module according to the embodiment of the present application;

fig. 16 is a schematic view illustrating a dispensing position of the camera module according to the embodiment of the present application.

Fig. 17 is a schematic diagram showing a hardware configuration of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The following describes the camera module provided in the embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

Referring to fig. 2, a schematic structural diagram of an embossed lens according to an embodiment of the present application is shown.

The camera module of this application embodiment includes: imprinting a lens; the schematic structural diagram of the embossed lens is shown in fig. 2, and includes an infrared cut filter 201, a first embossed surface 202, and a second embossed surface 203. As shown in fig. 3, the first surface 2011 of the infrared cut filter 201 is covered with the ultraviolet absorbing layer 204. The first stamping surface 202 is stamped on one surface of the ultraviolet absorption layer 204 far away from the infrared cut filter 201, and the second stamping surface 203 is stamped on the second surface of the infrared cut filter 201 far away from the ultraviolet absorption layer 204.

The ultraviolet absorption layer 204 can absorb part of purple light during imaging, and the purple fringing effect of an image can be effectively improved.

Fig. 4 is a schematic perspective view of a stamped lens, as shown in fig. 4, when the stamped lens is prepared, two sides of an original lens 4(a) with a conventional shape are cut, and the structure of the stamped lens after cutting is shown in fig. 4(b), and includes a first spherical surface 205, a second spherical surface 206, a first aspheric cut 207 and a second aspheric cut 208.

Providing the stamped lenses in a shape that includes two spherical surfaces and two aspheric cut edges reduces the size of the lens mount opening.

The camera module is internally provided with an imprinting lens, and the imprinting lens comprises an infrared cut-off filter, a first imprinting surface and a second imprinting surface; the ultraviolet absorption layer covers the first surface of the infrared cut-off filter, the first stamping surface is stamped on the surface, far away from the infrared cut-off filter, of the infrared absorption layer, the second stamping surface is stamped on the second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter, and the ultraviolet absorption layer covering the infrared cut-off filter can absorb part of purple light to fade purple edges in a shot image. In addition, in this application embodiment, set up the impression lens into the shape that includes two spheres and two aspheric surfaces are cut edge, and the impression lens matches with the chip size and sets up in the cavity of camera lens base, can not additionally increase the thickness of camera module. Therefore, the camera module provided by the embodiment of the application can fade purple fringing in the shot image on the basis of not increasing the thickness of the camera module. The following describes a camera module in an alternative embodiment with reference to a schematic structural diagram of the camera module shown in fig. 5. Among them, P1, P2, P3, and P4 in fig. 5 indicate four core layers constituting the camera module lens.

In an alternative embodiment, the camera module comprises, in addition to the imprinted lens 20: a lens mount 30; a cavity matched with the shape of the cut edge of the imprinting lens 20 is arranged in the lens base 30; the stamped lens 30 is secured in the cavity.

The optionally-arranged impressing lens is arranged in the cavity, and the thickness of the camera module is not additionally increased.

In an optional embodiment, the camera module further comprises: a chip 40 and a flexible printed circuit board 50;

the lens base 30 is arranged on one side of the chip 40 far away from the flexible printed circuit board 50, and the chip 40 is aligned with the stamping lens 20 and matched with the stamping lens in size; the chip is attached in the flexible printed circuit board 50.

The structure that the imprinting lens 20 and the chip 40 are optionally arranged in the cavity of the lens base 30 and are finally attached to the flexible printed circuit board 50 does not increase the thickness of the camera module, and can ensure the firmness of the installation of the imprinting lens.

In an optional embodiment, the camera module further comprises: a first lens 60, a lens housing 70, a lens carrier 80, and a lens chassis 90. The first lens 60 and the impression lens 20 form a lens, the first lens 60 is used as the upper half part of the lens, and the impression lens 20 is used as the lower half part of the lens, and the lens carrier 80, the lens chassis 90 and the lens base 30 are combined and fixed.

The schematic structural diagram of the first lens 60 is shown in fig. 6, the first lens 60 is provided with four cut edges 601, and the outer edge of the maximum diameter position of the first lens 60 is provided with a first thread 602; the first lens 602 is nested in the cavity of the lens housing, and the first screw 602 is engaged with a second screw provided on the lens carrier; the lens carrier 80 is nested in a reserved cavity of the lens chassis.

This kind is convenient for carry out the focusing in the camera lens assembling process through first screw 602 cooperation assembly mode. It should be noted that, the above is only an example of a mode of assembling through screw fitting, and in an actual implementation process, a card slot mode may also be used for assembling.

In an alternative embodiment, the lens chassis is fixed in alignment with the lens mount. As shown in the exploded view of the camera module in fig. 7, the first lens 60, the lens housing 70, the lens carrier 80, the lens chassis 90, the imprinting lens 20, the lens mount 30, the chip 40, and the flexible printed circuit board 50 are sequentially stacked, and the camera module can be assembled into a whole by fixing the lens chassis and the lens mount thereto. Wherein, the stamping lens 20 can be cut according to the shape of the chip 40, and the lens base 30 can flexibly design a bearing surface according to the shape of the stamping lens 20, for example: the stamp lens 20 is cut out in a square shape according to the shape of the chip 40 as shown in fig. 7, and the lens mount 30 is designed as a square bearing surface.

In this alternative embodiment, the camera module is assembled by aligning and fixing the lens chassis 90 and the lens base 30, so that the assembly is simple and the firmness is high.

It should be noted that the camera module provided in the embodiment of the present application may also be designed as a zoom lens optical structure, and a motor with a suitable stroke is used to form a zoom structure with a smaller overall lens length. The camera module of the zoom structure drives the first lens 60 to move through the motor, so that the gap size between P3 and P4 in an optical system is changed, and the optical zoom of the camera module is realized. Fig. 8 is a schematic structural change diagram of a camera module driven by a motor, where fig. 8(a) is a schematic structural diagram of the camera module in a state where the first lens 60 is sunken, and fig. 8(b) is a schematic structural diagram of the camera module in a state where the first lens 60 is raised.

Referring to fig. 9, a flowchart illustrating steps of a method for manufacturing a camera module according to an embodiment of the present application is shown.

The camera module preparation method comprises the following steps:

step 901: an ultraviolet absorbing layer is prepared on the first surface of the infrared cut filter.

As shown in fig. 3, when preparing the imprint lens substrate, the ultraviolet absorption layer 204 needs to be prepared on the first surface 2011 of the infrared cut filter 201, and the ultraviolet absorption layer 204 may be coated on the first surface 2011 of the infrared cut filter 201 by spin coating.

Step 902: and stamping the printing glue on the ultraviolet absorption layer to prepare a first stamping surface.

As shown in fig. 10, an imprint schematic diagram of the first imprint surface 202 is that an imprint paste 2021 is added on the ultraviolet absorption layer covered by the infrared cut filter 201, and an imprint mold 2022 is used to perform imprint curing to prepare the first imprint surface 202.

Step 903: and stamping the printing glue on the surface of the infrared cut-off filter far away from the ultraviolet absorption layer to prepare a second stamping surface, so as to obtain the stamping lens base material.

As shown in fig. 11, after the first stamping surface 202 is stamped, the infrared cut filter 201 is turned over, the printing glue 2031 is stamped on the surface of the infrared cut filter away from the ultraviolet absorption layer, and the stamping mold 2032 is used to perform stamping and curing to prepare and generate the second stamping surface 203.

Step 904: and cutting the imprinting lens base material by adopting laser to obtain the imprinting lens.

Figure 12 illustrates schematically the cutting of a stamped lens substrate by laser cutting to achieve a plurality of stamped lenses 20, each stamped lens 20 comprising a first spherical surface 205, a second spherical surface, a first aspheric cutting edge 207 and a second aspheric cutting edge 208, wherein the second spherical surface is not shown in figure 12.

According to the camera module preparation method provided by the embodiment of the application, the ultraviolet absorption layer is prepared on the first surface of the infrared cut-off filter; imprinting printing glue on the ultraviolet absorption layer to prepare a first imprinting surface; stamping printing glue on one surface of the infrared cut-off filter, which is far away from the ultraviolet absorption layer, and preparing a second stamping surface to obtain a stamping lens base material; and cutting the imprinting lens base material by adopting laser to obtain the imprinting lens. According to the prepared imprinting lens, the ultraviolet absorption layer covered on the infrared cut-off filter can absorb part of purple light, so that purple edges in a shot image are faded.

In an optional embodiment, the method for manufacturing a camera module further includes: a lens mount for holding the imprinted lens is prepared.

The lens mount 60 is shown in fig. 13, and the cavity of the lens mount 30 matches the shape of the cut edge of the stamped lens 20 and is used to nest the stamped lens 20. In the actual implementation process, since the stamping lens 20 is trimmed in two directions, the dimension of the lens base 30 corresponding to the trimming direction of the stamping lens 20 can be adjusted synchronously. In the actual implementation process, the width of the camera module can be reduced by reducing the size of the lens base 30 in the direction corresponding to the edge cutting of the lens.

In this optional embodiment, the imprinting lens is set to have a shape including two spherical surfaces and two aspheric trimming edges, and the imprinting lens is set in the cavity of the lens base in a size matching manner with the chip, so that the thickness of the camera module is not additionally increased.

In an optional embodiment, the method for manufacturing a camera module further includes the following steps:

the method comprises the following steps: preparing a first lens comprising four cut edges, wherein the four cut edges are used for focusing and clamping in the process of assembling the first lens and a lens shell;

step two: a first thread is prepared on the outer edge of the first lens at the maximum diameter.

Wherein the first thread is engaged with a second thread provided on the lens carrier.

The optional embodiment is a process for preparing the first lens, and a schematic structural diagram of the prepared first lens 60 is shown in fig. 6, where the first lens 60 and the imprinting lens 20 form a lens whole of the camera module. The assembly is carried out in a thread meshing mode, and the operation is simple.

The sectional view of the mounting structure of the stamp lens 20 and the lens base 30 is shown in fig. 14, as shown in fig. 14, the core component of the lower half of the lens is the stamp lens 20, and the stamp lens 20 is disposed in the cavity of the lens base 30 and fixed by the glue 209.

After the components in the camera module are manufactured, as shown in the camera module explosion diagram in fig. 7, the first lens 60, the lens housing 70, the lens carrier 80, the lens chassis 90, the imprinting lens 20, the lens base 30 and the chip 40 are sequentially stacked and fixed, and attached to the flexible printed circuit board 50, so as to manufacture the camera module.

The assembly process of each component in the camera module is described in detail below with reference to fig. 15, and includes the following sub-steps:

the first substep: as shown in fig. 15(a), gold wire bonding is performed by attaching the chip 40 to the flexible printed circuit board 50;

and a second substep: as shown in fig. 15(b), the lens mount 30 and the imprinting lens 20 are assembled, dispensed, and baked;

and a third substep: as shown in fig. 15(c), the assembly of the lens base 30 and the imprinting lens 20 is attached to the flexible printed circuit board 50 by an AA (Active Alignment) assembly process to form a lower half of the camera module;

and a fourth substep: as shown in fig. 15(d), after the lens carrier 80 is engaged with the first lens 60 by a screw, it is fixed by dispensing;

and a fifth substep: as shown in fig. 15(e), the assembly of the lens carrier 80 and the first lens 60 is placed in the lens housing 70, the rear end of the lens carrier 80 is closed by using the lens chassis 90, and the assembly of the lens carrier 80 and the first lens 60 is fixed inside to form the upper half of the camera module;

and a sixth substep: as shown in fig. 15(f), the camera module is assembled by aligning the upper half of the camera module with the upper half of the camera module by an AA process and fixing the camera module with glue.

A plurality of positions in the camera module assembly process need to be fixed by dispensing with a dispensing process, and a schematic diagram of the dispensing positions of the assembled camera module is shown in fig. 16.

1 is the dispensing position between the first lens 60 and the lens carrier 80;

2 is a fixed dispensing position set on the first lens 60;

3 is the dispensing position of the lens chassis 90 and the lens housing 70;

4 is the dispensing position of the lens base 30 and the lens chassis 90;

5 is the dispensing position between the lens base and the impression lens 20;

6 is the dispensing position between the lens base 30 and the flexible printed circuit board 50;

and 7 is the dispensing position between the flexible printed circuit board 50 and the chip 40.

P1, P2, P3, and P4 in fig. 16 indicate four core layers constituting the camera module lens. In the actual realization process, can remove the metal spacer ring between P3 and P4, on the one hand, can alleviate the weight of camera module, on the other hand, is favorable to the miniaturized design of motor structure.

The camera module assembly process and the dispensing position setting mode provided in the optional embodiment enable the assembled camera module to be firm and firm.

Fig. 17 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.

The electronic device 1700 includes, but is not limited to: radio frequency unit 1701, network module 1702, audio output unit 1703, input unit 1704, sensor 1705, display unit 1706, user input unit 1707, interface unit 1708, memory 1709, and processor 1710. Those skilled in the art will appreciate that the electronic device 1700 may also include a power supply (e.g., a battery) for powering the various components, and that the power supply may be logically coupled to the processor 1710 via a power management system to manage charging, discharging, and power consumption management functions via the power management system. The electronic device structure shown in fig. 17 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description thereof is omitted.

The camera module that electronic equipment of this application embodiment included includes: the imprinting lens comprises an infrared cut-off filter, a first imprinting surface and a second imprinting surface; an ultraviolet absorption layer covers a first surface of the infrared cut-off filter, the first stamping surface is stamped on one surface, far away from the infrared cut-off filter, of the ultraviolet absorption layer, and the second stamping surface is stamped on a second surface, far away from the ultraviolet absorption layer, of the infrared cut-off filter; the stamped lens includes a first spherical surface, a second spherical surface, a first aspheric trim, and a second aspheric trim.

According to the electronic equipment provided by the embodiment of the application, on one hand, the ultraviolet absorption layer covers the infrared cut-off filter, so that part of purple light can be absorbed, and purple fringing in a shot image can be faded. On the other hand, the imprinting lens is arranged into a shape comprising two spherical surfaces and two non-spherical surface trimming edges, and the imprinting lens is arranged in the cavity of the lens base in a size matching mode with the chip, so that the thickness of the camera module cannot be increased additionally.

Optionally, the camera module further includes: a lens mount;

a cavity matched with the shape of the cut edge of the imprinting lens is arranged in the lens base;

the stamped lens is secured in the cavity.

Optionally, the camera module further includes: a chip and a flexible printed circuit board;

the lens base is arranged on one surface of the chip far away from the flexible printed circuit board, and the chip is aligned with the imprinting lens and matched with the imprinting lens in size;

the chip is attached to the flexible printed circuit board.

Optionally, the camera module further includes: the camera comprises a first lens, a lens shell, a lens carrier and a lens chassis;

the first lens is provided with four cutting edges, and the outer edge of the position with the maximum diameter of the first lens is provided with a first thread;

the first lens is nested in a cavity of the lens shell, and the first threads are engaged with second threads arranged on the lens carrier;

the lens carrier is nested in a reserved cavity of the lens chassis.

Optionally, the lens chassis is fixed in alignment with the lens mount.

It should be understood that in the embodiment of the present application, the input Unit 1704 may include a Graphics Processing Unit (GPU) 17041 and a microphone 17042, and the Graphics Processing Unit 17041 processes image data of a still picture or a video obtained by an image capturing device (such as a camera) in a video capturing mode or an image capturing mode. The display unit 1706 may include a display panel 17061, and the display panel 17061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. User input unit 1707 includes a touch panel 17071 and other input devices 17072. A touch panel 17071, also referred to as a touch screen. The touch panel 17071 may include two parts, a touch detection device and a touch controller. Other input devices 17072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein. The memory 1709 may be used to store software programs as well as various data, including but not limited to application programs and an operating system. The processor 1710 can integrate an application processor, which primarily handles operating systems, user interfaces, application programs, and the like, and a modem processor, which primarily handles wireless communications. It is to be appreciated that the modem processor described above may not be integrated into processor 1710.

The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the process of the embodiment of the camera module preparation method is implemented, and the same technical effect can be achieved, and in order to avoid repetition, details are not repeated here.

The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.

The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the above-mentioned embodiment of the camera module preparation method, and can achieve the same technical effect, and in order to avoid repetition, the details are not repeated here.

It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.