阅读说明：本技术 一种光模块弹性结构散热器 (Optical module elastic construction radiator ) 是由 廖相昭 池卫国 于 2020-12-23 设计创作，主要内容包括：本发明公开了一种光模块弹性结构散热器,包括：光模块和弹性散热结构,所述光模块设置光模块屏蔽罩中,所述光模块屏蔽罩顶部设置有开窗；所述弹性散热结构可拆卸的设置在所述光模块上方传递光模块所散发出的热量；所述弹性散热结构,包括：散热垫、导热块和散热结构,所述导热垫设置在光模块和导热块之间；所述导热块可浮动的设置在散热结构上；所述散热结构上还设置有弹性件,所述弹性件可驱动导热块进行上下浮动。本发明提供的光模块弹性结构散热器,适用于各种功率较高、芯片封装高度差较大器件,需多次插拔的散热应用,解决了芯片接触,多次插拔和散热的问题。(The invention discloses a radiator with an elastic structure of an optical module, which comprises: the optical module is arranged in an optical module shielding case, and the top of the optical module shielding case is provided with a window; the elastic heat dissipation structure is detachably arranged above the optical module to transfer heat emitted by the optical module; the elastic heat dissipation structure includes: the heat dissipation structure comprises a heat dissipation pad, a heat conduction block and a heat dissipation structure, wherein the heat conduction pad is arranged between the optical module and the heat conduction block; the heat conducting block is arranged on the heat radiating structure in a floating manner; the heat dissipation structure is further provided with an elastic piece, and the elastic piece can drive the heat conduction block to float up and down. The elastic structure radiator of the optical module is suitable for various devices with higher power and larger chip packaging height difference, and is applied to heat dissipation requiring multiple plugging and unplugging, so that the problems of chip contact, multiple plugging and unplugging and heat dissipation are solved.)

1. An optical module spring structure heat sink, comprising: the optical module is arranged in an optical module shielding case, and the top of the optical module shielding case is provided with a window; the elastic heat dissipation structure is detachably arranged above the optical module to transfer heat emitted by the optical module; the elastic heat dissipation structure includes: the heat dissipation structure comprises a heat dissipation pad, a heat conduction block and a heat dissipation structure, wherein the heat conduction pad is arranged between the optical module and the heat conduction block; the heat conducting block is arranged on the heat radiating structure in a floating manner; the heat dissipation structure is further provided with an elastic piece, and the elastic piece can drive the heat conduction block to float up and down.

2. The optical module elastic structure heat sink according to claim 1, wherein the thermal pad is made of a material having thermal conductivity, flexibility and elasticity.

3. The optical module resilient structure heat sink of claim 1, wherein the thermal pad has the same dimensions as the heat generating components in the optical module.

4. The optical module spring structure heat sink of claim 1, wherein the thermal conductive mass is comprised of copper.

5. The optical module spring structure heat sink of claim 1, wherein the thermal mass has the same dimensions as the thermal pad.

6. The optical module elastic structure heat sink according to claim 1, wherein the heat dissipation structure comprises: the heat sink comprises a temperature-equalizing plate, a heat sink main body and radiating fins, wherein the temperature-equalizing plate is arranged in a Z shape, one end of the temperature-equalizing plate is fixedly connected with the heat sink main body, and the other end of the temperature-equalizing plate is fixedly connected with a heat-conducting block; the heat sink is disposed on the heat sink body.

7. The optical module resilient structure heat sink according to claim 6, wherein a fin structure is provided on the heat sink.

8. The optical module elastic structure heat sink according to claim 1, wherein the elastic member is formed of a spring or a leaf spring.

Technical Field

The invention belongs to the technical field of heat dissipation devices of electronic devices, and particularly relates to an elastic structure radiator of an optical module.

Background

The optical module is an optoelectronic device for photoelectric and electro-optical conversion, and is an important part of 4G/5G communication equipment and data centers. With the increasing of communication speed and load, the heat productivity of the optical module is continuously improved. Meanwhile, the optical module is used as a sensitive optical device, when the working temperature is too high, the problems of overlarge transmitting optical power, wrong receiving signals, packet loss and the like can be caused, and even the optical module can be directly burnt out. Therefore, the heat dissipation design for the optical module is a major point and a difficult point.

Referring to fig. 1, in the conventional optical module, an optical module is mounted in an optical module shield, a window is formed in the top of the optical module shield, so that a part of the optical module is in contact with a heat sink, heat is conducted from the optical module to the heat sink through a contact surface, and then the heat is dissipated to the environment through air flow flowing through outer surfaces of fins and the like of the heat sink.

However, the conventional optical module has several problems in heat dissipation:

firstly, because the contact surface between the heat source and the radiator can not be completely flat, an air gap is inevitably formed, namely, a certain thermal contact resistance exists, and the temperature can be locally raised.

And secondly, the optical module needs to be inserted and pulled for many times during working, so that heat-conducting silicone grease cannot be coated on the contact surface, and the contact thermal resistance is reduced.

And thirdly, the optical module and the radiator are in fixed tight fit, the structure is deformed due to repeated plugging, the contact pressure cannot be ensured, and the thermal contact resistance is obviously increased when the contact pressure is reduced.

Fourthly, due to the small contact area, when heat is diffused in the radiator, the heat conduction resistance is large, and the temperature rise is not small.

And fifthly, the installation space of the radiator is limited, and the radiating area is limited.

Therefore, it is an urgent need to solve the problems of chip contact, multiple plugging and heat dissipation by providing a heat dissipation device suitable for various devices with high power and large height difference of chip package, which needs to be plugged and unplugged for multiple times.

Disclosure of Invention

In order to solve the problems in the existing optical module heat dissipation, a new scheme is needed.

Therefore, an object of the present invention is to provide a heat sink with an elastic structure for an optical module, so as to overcome the problems in the prior art.

In order to achieve the above object, the present invention provides an optical module elastic structure heat sink, comprising: the optical module is arranged in an optical module shielding case, and the top of the optical module shielding case is provided with a window; the elastic heat dissipation structure is detachably arranged above the optical module and used for dissipating heat transmitted by the optical module; the elastic heat dissipation structure includes: the heat dissipation structure comprises a heat dissipation pad, a heat conduction block and a heat dissipation structure, wherein the heat conduction pad is arranged between the optical module and the heat conduction block; the heat conducting block is arranged on the heat radiating structure in a floating manner; the heat dissipation structure is further provided with an elastic piece, and the elastic piece can drive the heat conduction block to float up and down.

Further, the heat conducting pad is made of a material with heat conductivity, flexibility and elasticity.

Further, the size of the thermal pad is the same as that of the heat generating component in the optical module.

Further, the heat conduction block is made of copper.

Further, the size of the heat conduction block is the same as that of the heat conduction pad.

Further, the heat dissipation structure includes: the heat sink comprises a temperature-equalizing plate, a heat sink main body and radiating fins, wherein the temperature-equalizing plate is arranged in a Z shape, one end of the temperature-equalizing plate is fixedly connected with the heat sink main body, and the other end of the temperature-equalizing plate is fixedly connected with a heat-conducting block; the heat sink is disposed on the heat sink body.

Furthermore, a fin structure is arranged on the radiating fin.

Further, the elastic piece is composed of a spring or a spring sheet.

According to the optical module elastic structure radiator provided by the invention, the temperature equalizing plate and the elastic structure are arranged on the radiator main body, so that the radiator can be ensured to be more completely contacted with a chip, can be plugged and pulled for multiple times, and is ensured to be more completely contacted with the chip, heat is transferred to a larger heat dissipation area through the heat pipe, the heat dissipation efficiency is improved, and the problems of chip contact, multiple plugging and heat dissipation are solved.

Drawings

The invention is further described below in conjunction with the appended drawings and the detailed description.

Fig. 1 is a schematic view of a heat dissipation structure of a conventional optical module;

FIG. 2 is a schematic view of the overall structure of the light module elastic structure heat sink in this example;

fig. 3 is an exploded view of the light module spring structure heat sink in this example.

The reference numbers in the figures mean:

the radiator comprises a radiator main body 1, a copper block 2, a radiating fin 3, a temperature equalizing plate 4, a radiating fin 5, a heat conducting gasket 6, an elastic component 7 and an optical module shielding case 8.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further explained below by combining the specific drawings.

The invention provides an optical module elastic structure radiator, which aims to solve the problems that the contact thermal resistance of the existing optical module and a radiator is too large, the contact pressure is reduced after the existing optical module and the radiator are plugged and unplugged for many times, the local temperature rise is increased, the heat conducting performance of the radiator is poor, the radiating area is insufficient when the space is limited, and the like.

Referring to fig. 2, the present example provides a light module elastic structure heat sink, including: the optical module comprises an optical module and an elastic heat dissipation structure, wherein the elastic heat dissipation structure is arranged above the optical module and can be in plug-in fit with the optical module.

Specifically, the optical module is arranged in an optical module shielding case 8, a window is arranged at the top of the optical module shielding case 8, so that the optical module is locally contacted with the radiator main body 1, and heat is conducted to the elastic heat dissipation structure from a heating chip of the optical module through a contact surface.

Elasticity heat radiation structure includes: the heat dissipation structure comprises a heat dissipation pad, a heat conduction block and a heat dissipation structure, wherein the heat conduction pad is arranged between the heating chip and the heat conduction block, and the heat conduction block is assembled and combined with the heat dissipation structure.

The heat conducting pad is used for filling an air gap between the heating chip and the heat conducting block, and the material adopted by the heat conducting pad has heat conductivity, flexibility and elasticity, so that the heat conducting pad can cover a very uneven surface and conduct heat generated by the heating chip, and therefore the efficiency and the service life of the chip can be improved.

Preferably, the heat conducting pad in this example is constituted by the heat conducting pad 6, and the size of the heat conducting pad is preferably the same as that of the heat generating chip.

The heat conduction block is used for conducting the heat of the heat conduction gasket 6 to the heat dissipation structure, and is made of metal with good heat conductivity.

Preferably, the heat conducting block in this example is made of a copper block 2, the size of which is preferably the same as the size of the heat conducting pad.

The copper block 2 is arranged on the heat dissipation structure and can form a copper block which floats up and down.

Further, the heat dissipation structure in this example includes: a vapor chamber 4, a heat sink body 1, and a heat sink.

When the radiator is specifically arranged, the temperature-equalizing plate 4 is arranged in a Z shape, one end of the Z-shaped temperature-equalizing plate 4 is fixedly arranged on the radiator main body 1, and the other end of the Z-shaped temperature-equalizing plate is arranged in a hanging mode and is welded with the copper block 2.

Spring 7 one end is fixed to be set up at radiator main part 1, and the other end contacts the setting with copper billet 2 front end, and such structure sets up, and when pressing elasticity heat radiation structure, radiator main part 1 gives spring 7 pressure, and spring 7 exerts pressure downwards, and copper billet 2 can float downwards, and after the pressure disappears, copper billet 2 can float upwards.

When the heat radiator is specifically arranged, the welding mode of the temperature-equalizing plate 4 and the heat radiator main body 1 can be adjusted according to practical application, and production processes such as solder paste welding, epoxy resin welding, high-heat-conductivity glue welding, pressing plate locking and the like can be adopted.

The size of the temperature equalizing plate 4 is preferably set to correspond to the size of the heat sink body 1, and the heat generated by the optical module can be efficiently conducted from the copper block 2 to the heat sink body 1 and the heat radiating fins.

The radiator main body 1 can be used for placing other components as a main component of the heat radiation structure, a groove is arranged on the radiator main body 1, and the radiator main body 1 is matched with the temperature equalizing plate 4 through the groove.

The fin structure is arranged on the heat dissipation sheet in the embodiment, and the total heat dissipation capacity of the heat dissipation structure can be improved by increasing the number of the fins in the same space.

The number of the radiating fins can be set according to actual needs, and preferably two radiating fins, namely a first radiating fin 3 and a second radiating fin 5, are arranged above and below the radiator main body 1 respectively and used for conducting multi-directional heat dissipation on the radiator main body 1.

Meanwhile, the radiator main body 1 is further provided with an elastic assembly 7 for ensuring that the heat radiation structure is tightly contacted with the optical module and providing long-term reliable contact pressure.

Preferably, the elastic member 7 here may be formed of a spring or a leaf spring.

Based on optical module elastic construction radiator that above-mentioned structure set up, during specific application, when pressing down elastic heat radiation structure, radiator main part 1 gives spring 7 pressure, spring 7 exerts pressure downwards, copper billet 2 can float downwards for heat conduction gasket 6 is inseparabler with the chip contact that generates heat, thereby the efficient conducts heat conduction gasket 6 with the heat that the optical module produced, conducts temperature equalizing plate 4 through copper billet 2 again, temperature equalizing plate 4 conducts the heat to radiator main part 1 and fin on again and dispels the heat.

The optical module elastic structure radiator provided by the invention utilizes the fixing and guiding functions of the main radiator 1 to limit the elastic component 7, the temperature-equalizing plate 4 and the copper block 2 within the design range, and ensures the contact between the radiator and a heating chip through the elastic characteristics of the elastic component 7 and the temperature-equalizing plate 4.

According to the optical module elastic structure radiator provided by the invention, heat conducted by a heat source is quickly and efficiently conducted to the fins of the radiator through the heat pipe or the temperature equalizing plate, so that the heat conduction resistance is reduced, and the radiating effect is further improved.

The optical module elastic structure radiator provided by the invention adopts a fin welding process, increases the radiating area in a limited space, improves the convection radiating effect and reduces the temperature.

The elastic structure radiator of the optical module can greatly improve the heat radiation performance and reliability of the optical module and ensure long-term high-load work of the optical module.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.