Wafer grinding device capable of controlling grinding temperature and grinding agent concentration

文档序号:755661 发布日期:2021-04-06 浏览:16次 中文

阅读说明:本技术 一种可控研磨温度和研磨剂浓度的晶片研磨装置 (Wafer grinding device capable of controlling grinding temperature and grinding agent concentration ) 是由 渠昊隆 于 2021-01-11 设计创作,主要内容包括:本发明涉及半导体相关领域,公开了一种可控研磨温度和研磨剂浓度的晶片研磨装置,包括主箱体,主箱体内设有开口向前的研磨腔,研磨腔下端壁固定连接有位于研磨腔内的研磨台,研磨腔右端壁固定连接有位于研磨腔内的温度传感器,研磨腔左侧设有出液腔,研磨腔左端壁固定连接有位于研磨腔内的喷嘴,通过活塞往复运动泵出磨液并量取磨料,磨液与磨料混合后再进行搅拌,最终输入到研磨腔内供晶片研磨,实现了磨料的定量输送,有利于磨料的充分混合,此外,通过磨料用量调节机构,可以调整研磨液中磨料的浓度,以配合不同规格的晶片加工,根据研磨温度调整研磨液流速,防止晶片因研磨温度过高而造成损坏。(The invention relates to the semiconductor related field, and discloses a wafer grinding device capable of controlling grinding temperature and grinding agent concentration, which comprises a main box body, wherein a grinding cavity with a forward opening is arranged in the main box body, the lower end wall of the grinding cavity is fixedly connected with a grinding table positioned in the grinding cavity, the right end wall of the grinding cavity is fixedly connected with a temperature sensor positioned in the grinding cavity, the left side of the grinding cavity is provided with a liquid outlet cavity, the left end wall of the grinding cavity is fixedly connected with a nozzle positioned in the grinding cavity, grinding liquid is pumped out through reciprocating motion of a piston and grinding agent is measured, the grinding liquid and the grinding agent are mixed and then stirred, and finally the mixture is input into the grinding cavity for grinding wafers, so that the quantitative conveying of the grinding agent is realized, the sufficient mixing of the grinding agent is facilitated, in addition, the concentration of the grinding agent in the grinding liquid can be adjusted through, prevent the wafer from being damaged due to the over-high grinding temperature.)

1. The utility model provides a wafer grinder of controllable grinding temperature and abrasive concentration, includes the main tank body, its characterized in that: a grinding cavity with a forward opening is arranged in the main box body, the lower end wall of the grinding cavity is fixedly connected with a grinding table positioned in the grinding cavity, the right end wall of the grinding cavity is fixedly connected with a temperature sensor positioned in the grinding cavity, the left side of the grinding cavity is provided with a liquid outlet cavity, the left end wall of the grinding cavity is fixedly connected with a nozzle positioned in the grinding cavity, the right end wall of the liquid outlet cavity is communicated with a nozzle pipe penetrating through the nozzle rightwards, the upper end wall of the liquid outlet cavity is communicated with a stirring cavity, the left side of the stirring cavity is provided with a bevel gear cavity, the right end wall of the bevel gear cavity is rotatably matched and connected with a stirring shaft extending leftwards into the bevel gear cavity and rightwards into the stirring cavity, the stirring shaft is fixedly connected with a plurality of stirring rods, the upper side of the stirring cavity is provided, the piston cavity is internally connected with a piston in a sliding fit manner, the right side of the piston cavity is provided with a liquid outlet baffle cavity, a middle cavity is communicated and arranged between the left end wall of the liquid outlet baffle cavity and the right end wall of the piston cavity, the left end wall of the liquid outlet baffle cavity is hinged with a liquid outlet baffle, the right end wall of the piston cavity is communicated and provided with a liquid inlet baffle cavity, the right end wall of the liquid inlet baffle cavity is hinged with a liquid inlet baffle, the upper side of the piston cavity is provided with a grinding liquid cavity, a grinding liquid pipe is communicated and arranged between the lower end wall of the grinding liquid cavity and the right end wall of the liquid inlet baffle cavity, the right side of the piston cavity is provided with a quantitative box cavity, a connecting rod cavity is communicated and arranged between the left end wall of the quantitative box cavity and the right end wall of the piston cavity, a quantitative box is connected with a quantitative box in the quantitative box in a, the quantitative box is internally provided with a quantitative cavity which is communicated up and down, the upper side of the quantitative box cavity is provided with an abrasive cavity, a blanking cavity is communicated between the lower end wall of the abrasive cavity and the upper end wall of the quantitative box cavity, the lower end wall of the blanking cavity is communicated with the upper end wall of the quantitative cavity, a mixing cavity is communicated and arranged between the right end wall of the liquid outlet baffle cavity and the right end wall of the mixing cavity, a blanking cavity is communicated and arranged between the upper end wall of the mixing cavity and the lower end wall of the quantitative box cavity, the rear side of the moving plate cavity is provided with a moving belt wheel cavity, the rear side of the moving belt wheel cavity is provided with a speed change cavity, the left end wall of the speed change cavity is communicated and provided with a cone friction wheel cavity, the front side of the cone friction wheel cavity is provided with a driven friction wheel cavity, the left end wall of the driven friction wheel cavity is communicated and provided with.

2. A wafer polishing apparatus with controllable polishing temperature and abrasive concentration as claimed in claim 1, wherein: a motor positioned at the rear side of the stirring belt wheel cavity is arranged in the main box body, the front end surface of the motor is fixedly connected with a driving shaft which forwards penetrates through the stirring belt wheel cavity and forwards extends into the driving friction wheel cavity, the driving shaft is fixedly connected with a driving friction wheel positioned in the driving friction wheel cavity, the driving shaft is also fixedly connected with a first belt wheel positioned in the stirring belt wheel cavity, the front end wall of the stirring belt wheel cavity is rotatably matched and connected with a stirring intermediate shaft which backwards extends into the stirring belt wheel cavity and forwards extends into the bevel gear cavity, the stirring intermediate shaft is fixedly connected with a second belt wheel positioned in the stirring belt wheel cavity, a stirring conveying belt is connected between the second belt wheel and the first belt wheel in a power matching manner, and a driving bevel gear positioned in the bevel gear cavity is also fixedly connected on the stirring intermediate shaft, and the stirring shaft is fixedly connected with a driven bevel gear positioned in the bevel gear cavity, and the driven bevel gear is meshed with the driving bevel gear.

3. A wafer polishing apparatus with controllable polishing temperature and abrasive concentration as claimed in claim 1, wherein: the rear end wall of the driven friction wheel cavity is connected with a conical friction wheel shaft which extends forwards into the driven friction wheel cavity and extends backwards into the conical friction wheel cavity in a rotating fit manner, the conical friction wheel shaft is fixedly connected with a driven friction wheel which is positioned in the driven friction wheel cavity, the driven friction wheel is abutted with the driving friction wheel, the conical friction wheel shaft is also fixedly connected with a conical friction wheel which is positioned in the conical friction wheel cavity, the rear end wall of the movable belt wheel cavity is connected with a speed change sleeve which extends forwards into the movable belt wheel cavity and extends backwards into the speed change cavity in a rotating fit manner, a speed change shaft which extends backwards into the speed change cavity is connected in a spline fit manner in the speed change sleeve, the speed change shaft is fixedly connected with a speed change friction wheel abutted with the conical friction wheel, the rear end surface of the speed change shaft is connected with a speed change disc in a rotating fit manner, and a spring is fixedly connected between the rear end surface of the speed change, and the rear end wall of the speed changing cavity is fixedly connected with an electromagnet which extends backwards into the main box body.

4. A wafer polishing apparatus with controllable polishing temperature and abrasive concentration as claimed in claim 1, wherein: the front end wall of the movable belt wheel cavity is connected with a rotating rod shaft which extends backwards into the movable belt wheel cavity and forwards into the movable plate cavity in a rotating matching way, a third belt wheel positioned in the moving belt wheel cavity is fixedly connected on the rotating rod shaft, a moving conveying belt is connected between the third belt wheel and the fourth belt wheel in a power fit manner, the rotating rod shaft is also fixedly connected with a rotating rod positioned in the moving plate cavity, the front end surface of the rotating rod is fixedly connected with a rotating pin positioned on the left side of the rotating rod shaft, a moving plate is connected in the moving plate cavity in a sliding fit manner, a rotating pin cavity which is communicated back and forth is arranged in the moving plate, the rotating pin cavity is connected with the rotating pin in a sliding fit mode, the right end face of the moving plate is fixedly connected with a push rod extending rightwards to the piston cavity, and the right end face of the push rod is fixedly connected with the left end face of the piston.

5. A wafer polishing apparatus with controllable polishing temperature and abrasive concentration as claimed in claim 1, wherein: quantitative case chamber rear end wall intercommunication is equipped with the fixed gear chamber, fixed gear chamber right side end wall normal running fit is connected with and extends to left fixed gear intracavity and extends to external fixed gear axle right, fixedly connected with is located on the fixed gear axle the fixed gear of fixed gear intracavity, it is located external knob to go back fixedly connected with on the fixed gear axle, quantitative chamber right-hand member wall normal running fit is connected with and extends to left quantitative intracavity and extend to right the removal gear axle of quantitative incasement, fixedly connected with is located on the removal gear axle the removal gear of quantitative incasement, the removal gear with the fixed gear meshing, on the removal gear axle screw-thread fit be connected with the ration piece that quantitative chamber sliding fit is connected.

Technical Field

The invention relates to the field of semiconductor correlation, in particular to a wafer grinding device capable of controlling grinding temperature and grinding agent concentration.

Background

In the conventional wafer polishing apparatus, polishing slurry is generally prepared in advance, and the types and concentrations of the polishing slurry required for polishing wafers of different specifications are different, so that an operator needs to prepare the polishing slurry again, which brings inconvenience to the polishing work and reduces the work efficiency.

Disclosure of Invention

The invention aims to provide a wafer grinding device capable of controlling grinding temperature and grinding agent concentration, which can overcome the defects in the prior art, thereby improving the practicability of equipment.

The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a wafer grinding device capable of controlling grinding temperature and grinding agent concentration, which comprises a main box body, wherein a grinding cavity with a forward opening is arranged in the main box body, the lower end wall of the grinding cavity is fixedly connected with a grinding table positioned in the grinding cavity, the right end wall of the grinding cavity is fixedly connected with a temperature sensor positioned in the grinding cavity, the left side of the grinding cavity is provided with a liquid outlet cavity, the left end wall of the grinding cavity is fixedly connected with a nozzle positioned in the grinding cavity, the right end wall of the liquid outlet cavity is communicated with a nozzle pipe penetrating through the nozzle rightwards, the upper end wall of the liquid outlet cavity is communicated with a stirring cavity, the left side of the stirring cavity is provided with a bevel gear cavity, the right end wall of the bevel gear cavity is rotatably matched and connected with a stirring shaft extending leftwards into the bevel gear cavity and rightwards into, the stirring device is characterized in that a movable plate cavity is arranged on the upper side of the stirring cavity, a piston cavity is communicated with the right end wall of the movable plate cavity, a piston is connected in the piston cavity in a sliding fit manner, a liquid outlet baffle cavity is arranged on the right side of the piston cavity, a middle cavity is communicated and arranged between the left end wall of the liquid outlet baffle cavity and the right end wall of the piston cavity, a liquid outlet baffle is hinged to the left end wall of the liquid outlet baffle cavity, a liquid inlet baffle cavity is communicated and arranged on the right end wall of the piston cavity, a liquid inlet baffle is hinged to the right end wall of the liquid inlet baffle cavity, a liquid grinding cavity is arranged on the upper side of the piston cavity, a grinding liquid pipe is communicated and arranged between the lower end wall of the grinding cavity and the right end wall of the liquid inlet baffle cavity, a quantitative box cavity is arranged on the right side of the piston cavity, a connecting rod cavity is communicated and arranged between the left end wall of the quantitative box cavity and the right end wall of the piston cavity, the quantitative box is internally provided with a quantitative cavity which is communicated up and down, the upper side of the quantitative box cavity is provided with an abrasive cavity, a blanking cavity is communicated between the lower end wall of the abrasive cavity and the upper end wall of the quantitative box cavity, the lower end wall of the blanking cavity is communicated with the upper end wall of the quantitative cavity, a mixing cavity is communicated and arranged between the right end wall of the liquid outlet baffle cavity and the right end wall of the mixing cavity, a blanking cavity is communicated and arranged between the upper end wall of the mixing cavity and the lower end wall of the quantitative box cavity, the rear side of the moving plate cavity is provided with a moving belt wheel cavity, the rear side of the moving belt wheel cavity is provided with a speed change cavity, the left end wall of the speed change cavity is communicated and provided with a cone friction wheel cavity, the front side of the cone friction wheel cavity is provided with a driven friction wheel cavity, the left end wall of the driven friction wheel cavity is communicated and provided with.

On the basis of the technical scheme, a motor positioned at the rear side of the stirring belt wheel cavity is arranged in the main box body, the front end surface of the motor is fixedly connected with a driving shaft which forwards penetrates through the stirring belt wheel cavity and forwards extends into the driving friction wheel cavity, the driving shaft is fixedly connected with a driving friction wheel positioned in the driving friction wheel cavity, the driving shaft is also fixedly connected with a first belt wheel positioned in the stirring belt wheel cavity, the front end wall of the stirring belt wheel cavity is rotationally and cooperatively connected with a stirring intermediate shaft which backwards extends into the stirring belt wheel cavity and forwards extends into the bevel gear cavity, the stirring intermediate shaft is fixedly connected with a second belt wheel positioned in the stirring belt wheel cavity, a stirring conveying belt is dynamically and cooperatively connected between the second belt wheel and the first belt wheel, and the stirring intermediate shaft is also fixedly connected with a driving bevel gear positioned in the bevel gear cavity, and the stirring shaft is fixedly connected with a driven bevel gear positioned in the bevel gear cavity, and the driven bevel gear is meshed with the driving bevel gear.

On the basis of the technical scheme, the rear end wall of the driven friction wheel cavity is connected with a conical friction wheel shaft which extends forwards into the driven friction wheel cavity and extends backwards into the conical friction wheel cavity in a rotating fit manner, the conical friction wheel shaft is fixedly connected with a driven friction wheel which is positioned in the driven friction wheel cavity, the driven friction wheel is abutted against the driving friction wheel, the conical friction wheel shaft is also fixedly connected with a conical friction wheel which is positioned in the conical friction wheel cavity, the rear end wall of the movable belt wheel cavity is connected with a speed change sleeve which extends forwards into the movable belt wheel cavity and extends backwards into the speed change cavity in a rotating fit manner, a speed change shaft which extends backwards into the speed change cavity is connected in a spline fit manner in the speed change sleeve, the speed change shaft is fixedly connected with a speed change friction wheel abutted against the conical friction wheel, and the rear end surface of the speed change shaft is connected with a speed change disc in a rotating, the variable speed chamber is characterized in that a spring is fixedly connected between the rear end face of the variable speed disc and the rear end wall of the variable speed chamber, and an electromagnet which extends backwards into the main box body is fixedly connected to the rear end wall of the variable speed chamber.

On the basis of the technical scheme, the front end wall of the movable belt wheel cavity is connected with a rotating rod shaft which extends backwards into the movable belt wheel cavity and forwards into the movable plate cavity in a rotating matching manner, a third belt wheel positioned in the moving belt wheel cavity is fixedly connected on the rotating rod shaft, a moving conveying belt is connected between the third belt wheel and the fourth belt wheel in a power fit manner, the rotating rod shaft is also fixedly connected with a rotating rod positioned in the moving plate cavity, the front end surface of the rotating rod is fixedly connected with a rotating pin positioned on the left side of the rotating rod shaft, a moving plate is connected in the moving plate cavity in a sliding fit manner, a rotating pin cavity which is communicated back and forth is arranged in the moving plate, the rotating pin cavity is connected with the rotating pin in a sliding fit mode, the right end face of the moving plate is fixedly connected with a push rod extending rightwards to the piston cavity, and the right end face of the push rod is fixedly connected with the left end face of the piston.

On the basis of the technical scheme, the rear end wall of the quantitative box cavity is communicated with a fixed gear cavity, the right end wall of the fixed gear cavity is connected with a fixed gear shaft which extends to the left side in the fixed gear cavity and extends to the outside to the right side, the fixed gear shaft is fixedly connected with a fixed gear which is positioned in the fixed gear cavity, the fixed gear shaft is further fixedly connected with a knob which is positioned outside, the right end wall of the quantitative cavity is connected with a movable gear shaft which extends to the left side in the quantitative cavity and extends to the right side in the quantitative box cavity, the movable gear shaft is fixedly connected with a movable gear which is positioned in the quantitative box cavity, the movable gear is meshed with the fixed gear, and the movable gear shaft is connected with a quantitative block which is connected with the quantitative cavity in a sliding fit in a threaded fit manner.

The invention has the beneficial effects that: the grinding fluid is pumped out through the reciprocating motion of the piston, the grinding material is measured, the grinding fluid is mixed with the grinding material and then stirred, finally the grinding fluid is input into the grinding cavity to grind the wafer, the quantitative conveying of the grinding material is realized, the sufficient mixing of the grinding material is facilitated, in addition, the concentration of the grinding material in the grinding fluid can be adjusted through the grinding material usage adjusting mechanism, the wafer processing of different specifications is matched, the flow rate of the grinding fluid is adjusted according to the grinding temperature, and the wafer is prevented from being damaged due to overhigh grinding temperature.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic diagram of the overall structure of a wafer polishing apparatus with controllable polishing temperature and polishing agent concentration according to the present invention.

Fig. 2 is a schematic sectional view of a-a in fig. 1.

FIG. 3 is a schematic cross-sectional view of B-B in FIG. 1.

Fig. 4 is a schematic sectional structure view of C-C in fig. 1.

Fig. 5 is an enlarged schematic view of the structure at D in fig. 1.

Detailed Description

The invention will now be described in detail with reference to fig. 1-5, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.

With reference to the accompanying drawings 1-5, the wafer grinding device capable of controlling grinding temperature and grinding agent concentration comprises a main box body 10, a grinding cavity 12 with a forward opening is arranged in the main box body 10, a grinding table 13 which is arranged in the grinding cavity 12 is fixedly connected to the lower end wall of the grinding cavity 12, a temperature sensor 11 which is arranged in the grinding cavity 12 is fixedly connected to the right end wall of the grinding cavity 12, a liquid outlet cavity 16 is arranged on the left side of the grinding cavity 12, a nozzle 14 which is arranged in the grinding cavity 12 is fixedly connected to the left end wall of the grinding cavity 12, a nozzle pipe 15 which penetrates through the nozzle 14 rightwards is communicated with the right end wall of the liquid outlet cavity 16, a stirring cavity 28 is communicated with the upper end wall of the liquid outlet cavity 16, a bevel gear cavity 52 is arranged on the left side of the stirring cavity 28, a right end wall of the bevel gear cavity 52 is rotatably matched with a stirring shaft 17 which extends leftwards into the bevel gear cavity 52 and, the stirring shaft 17 is fixedly connected with a plurality of stirring rods 18, the upper side of the stirring cavity 28 is provided with a movable plate cavity 19, the right end wall of the movable plate cavity 19 is communicated with a piston cavity 24, a piston 23 is connected in the piston cavity 24 in a sliding fit manner, the right side of the piston cavity 24 is provided with a liquid outlet baffle cavity 70, the left end wall of the liquid outlet baffle cavity 70 and the right end wall of the piston cavity 24 are communicated with each other and provided with an intermediate cavity 72, the left end wall of the liquid outlet baffle cavity 70 is hinged with a liquid outlet baffle 71, the right end wall of the piston cavity 24 is communicated with a liquid inlet baffle cavity 76, the right end wall of the liquid inlet baffle cavity 76 is hinged with a liquid inlet baffle 75, the upper side of the piston cavity 24 is provided with a grinding liquid cavity 78, the lower end wall of the grinding liquid cavity 78 and the right end wall of the liquid inlet baffle cavity 76 are communicated with each other and provided with a grinding liquid pipe 77, the right side of the piston cavity 24 is provided with a quantitative, the quantitative box cavity 60 is connected with a quantitative box 65 in a sliding fit manner, a connecting rod 73 connected with a connecting rod cavity 74 in a sliding fit manner is fixedly connected between the left end face of the quantitative box 65 and the right end face of the piston 23, a quantitative cavity 64 communicated up and down is arranged in the quantitative box 65, an abrasive cavity 79 is arranged on the upper side of the quantitative box cavity 60, a blanking cavity 80 is communicated between the lower end wall of the abrasive cavity 79 and the upper end wall of the quantitative box cavity 60, the lower end wall of the blanking cavity 80 is communicated with the upper end wall of the quantitative cavity 64, a mixing cavity 27 is communicated between the right end wall of the liquid outlet baffle cavity 70 and the right end wall of the stirring cavity 28, a blanking cavity 25 is communicated between the upper end wall of the mixing cavity 27 and the lower end wall of the quantitative box cavity 60, a movable pulley cavity 29 is arranged on the rear side of the movable plate cavity 19, a speed change cavity 46 is arranged on the rear side of the movable pulley cavity 29, a conical friction pulley cavity 42 is communicated with the left end, the front side of the conical friction wheel cavity 42 is provided with a driven friction wheel cavity 35, the left end wall of the driven friction wheel cavity 35 is communicated with a driving friction wheel cavity 36, and the rear side of the driving friction wheel cavity 36 is provided with a stirring belt wheel cavity 56 extending downwards.

In addition, in one embodiment, a motor 38 is disposed in the main casing 10 at the rear side of the stirring pulley cavity 56, a driving shaft 37 is fixedly connected to the front end surface of the motor 38 and extends forward through the stirring pulley cavity 56 and into the driving friction wheel cavity 36, a driving friction wheel 39 is fixedly connected to the driving shaft 37 and extends into the driving friction wheel cavity 36, a first pulley 58 is fixedly connected to the driving shaft 37 and extends into the stirring pulley cavity 56, a stirring intermediate shaft 54 is rotatably connected to the front end wall of the stirring pulley cavity 56 and extends backward into the stirring pulley cavity 56 and extends forward into the bevel gear cavity 52, a second pulley 55 is fixedly connected to the stirring intermediate shaft 54 and extends into the stirring pulley cavity 56, and a stirring belt 57 is connected between the second pulley 55 and the first pulley 58 in a dynamic fit manner, the stirring intermediate shaft 54 is also fixedly connected with a driving bevel gear 53 positioned in the bevel gear cavity 52, the stirring shaft 17 is fixedly connected with a driven bevel gear 59 positioned in the bevel gear cavity 52, and the driven bevel gear 59 is meshed with the driving bevel gear 53.

In addition, in one embodiment, a conical friction wheel shaft 47 extending forward into the driven friction wheel chamber 35 and extending backward into the conical friction wheel chamber 42 is connected to the rear end wall of the driven friction wheel chamber 35 in a rotationally matched manner, a driven friction wheel 40 located in the driven friction wheel chamber 35 is fixedly connected to the conical friction wheel shaft 47, the driven friction wheel 40 abuts against the driving friction wheel 39, a conical friction wheel 41 located in the conical friction wheel chamber 42 is further fixedly connected to the conical friction wheel shaft 47, a speed change sleeve 51 extending forward into the moving belt wheel chamber 29 and extending backward into the speed change chamber 46 is connected to the rear end wall of the moving belt wheel chamber 29 in a rotationally matched manner, a speed change shaft 49 extending backward into the speed change chamber 46 is connected to the speed change sleeve 51 in a splined manner, a speed change friction wheel 48 abutting against the conical friction wheel 41 is fixedly connected to the speed change shaft 49, the rear end face of the speed changing shaft 49 is connected with a speed changing disc 45 in a rotating fit mode, a spring 44 is fixedly connected between the rear end face of the speed changing disc 45 and the rear end wall of the speed changing cavity 46, and an electromagnet 43 which extends backwards into the main box body 10 is fixedly connected to the rear end wall of the speed changing cavity 46.

In addition, in one embodiment, a rotating rod shaft 31 extending backwards into the moving pulley cavity 29 and forwards into the moving plate cavity 19 is connected to the front end wall of the moving pulley cavity 29 in a rotating fit manner, a third pulley 34 located in the moving pulley cavity 29 is fixedly connected to the rotating rod shaft 31, a moving conveyor belt 30 is connected between the third pulley 34 and the fourth pulley 50 in a power fit manner, a rotating rod 33 located in the moving plate cavity 19 is further fixedly connected to the rotating rod shaft 31, a rotating pin 32 located on the left side of the rotating rod shaft 31 is fixedly connected to the front end face of the rotating rod 33, a moving plate 21 is connected to the moving plate cavity 19 in a sliding fit manner, a rotating pin cavity 20 penetrating forwards and backwards is arranged in the moving plate cavity 21, the rotating pin cavity 20 is connected with the rotating pin 32 in a sliding fit manner, a push rod 22 extending rightwards into the piston cavity 24 is fixedly connected to the right end face of the moving plate 21, the right end face of the push rod 22 is fixedly connected with the left end face of the piston 23.

In addition, in one embodiment, a fixed gear chamber 68 is provided in communication with the rear end wall of the dosing chamber 60, the right end wall of the fixed gear cavity 68 is connected with a fixed gear shaft 67 which extends leftwards into the fixed gear cavity 68 and rightwards to the outside in a rotating matching way, a fixed gear 66 positioned in the fixed gear cavity 68 is fixedly connected to the fixed gear shaft 67, the fixed gear shaft 67 is also fixedly connected with a knob 69 positioned outside, the right end wall of the quantitative cavity 64 is in rotating fit with a movable gear shaft 62 which extends leftwards into the quantitative cavity 64 and rightwards into the quantitative box cavity 60, a moving gear 61 positioned in the quantitative box cavity 60 is fixedly connected to the moving gear shaft 62, the movable gear 61 is meshed with the fixed gear 66, and the movable gear shaft 62 is in threaded fit connection with a quantitative block 63 in sliding fit connection with the quantitative cavity 64.

The fixing and connecting method in this embodiment includes, but is not limited to, bolting, welding, and the like.

As shown in fig. 1-5, when the apparatus of the present invention is in the initial state, the moving plate 21, the piston 23 and the quantitative box 65 are located at the leftmost end of the stroke, the upper end wall of the quantitative cavity 64 is communicated with the lower end wall of the blanking cavity 80, the spring 44 is in the relaxed state, the wafer is fixed on the grinding table 13 for grinding, and the temperature sensor 11 can detect the temperature;

sequence of mechanical actions of the whole device:

when the temperature sensor 11 and the motor 38 are started, the temperature sensor 11 detects the temperature of the wafer in real time, the motor 38 operates to drive the driving shaft 37 to rotate, the driving shaft 37 rotates to drive the conical friction wheel shaft 47 to rotate through the driving friction wheel 39 and the driven friction wheel 40, the conical friction wheel shaft 47 rotates to drive the speed change shaft 49 to rotate through the conical friction wheel 41 and the speed change friction wheel 48, the speed change shaft 49 rotates to drive the speed change sleeve 51 to rotate, the speed change sleeve 51 rotates to drive the rotating rod shaft 31 to rotate through the fourth belt wheel 50, the moving conveyor belt 30 and the third belt wheel 34, the rotating rod shaft 31 rotates to drive the rotating rod 33 to rotate so as to drive the rotating pin 32 to rotate around the rotating rod shaft 31, the rotating pin 32 rotates to drive the moving plate 21 to reciprocate in the moving plate cavity 19 through the acting force between the rotating pin 32 and the moving pin cavity 20, the moving plate 21 reciprocates to drive the, when the piston 23 moves leftwards, the pressure in the piston cavity 24 is reduced, the grinding fluid in the grinding fluid cavity 78 pushes the liquid inlet baffle plate 75 into the piston cavity 24 under the action of atmospheric pressure, when the piston 23 moves rightwards, the pressure in the piston cavity 24 is increased, the liquid outlet baffle plate 71 rotates under the action of gas pressure in the piston cavity 24 to enable the middle cavity 72 to be communicated with the mixing cavity 27, the grinding fluid in the piston cavity 24 enters the mixing cavity 27 through the middle cavity 72 and the liquid outlet baffle plate cavity 70, and the grinding fluid can be continuously input into the mixing cavity 27 through the reciprocating motion of the piston 23 in the piston cavity 24.

The piston 23 drives the quantitative box 65 to reciprocate in the quantitative box cavity 60 through the connecting rod 73 while the piston cavity 24 reciprocates, abrasive in the abrasive cavity 79 enters the quantitative cavity 64 through the blanking cavity 80 under the action of self gravity, the quantitative box 65 moves rightwards to enable the lower end wall of the quantitative cavity 64 to be communicated with the upper end wall of the blanking cavity 25, the abrasive in the quantitative cavity 64 enters the mixing cavity 27 through the blanking cavity 25 under the action of self gravity to be mixed with grinding fluid to form grinding fluid, the grinding fluid enters the stirring cavity 28 through the mixing cavity 27, the driving shaft 37 rotates and simultaneously drives the stirring intermediate shaft 54 to rotate through the first belt pulley 58, the stirring conveyor belt 57 and the second belt pulley 55, the stirring intermediate shaft 54 rotates to drive the stirring shaft 17 to rotate through the driving bevel gear 53 and the driven bevel gear 59 so as to drive the stirring rod 18 to rotate, the stirring rod 18 rotates to start stirring the grinding fluid entering the stirring cavity 28 so as to uniformly mix the abrasive with the grinding fluid, the uniformly mixed grinding fluid enters the grinding chamber 12 through the fluid outlet chamber 16 and the nozzle pipe 15 to grind the wafer.

When the wafer grinding temperature rises, the temperature sensor 11 detects that the temperature is higher than a set value, the temperature sensor 11 controls the electromagnet 43 to be electrified to generate magnetism, the speed-changing disk 45 moves upwards under the action of the magnetic attraction force of the electromagnet 43 to drive the speed-changing shaft 49 and the speed-changing friction wheel 48 to move upwards, the abutting position of the speed-changing friction wheel 48 moving upwards and the conical friction wheel 41 is changed to increase the rotating speed of the rotating rod shaft 31, so that the flow rate of grinding fluid is increased, the grinding fluid which participates in grinding in unit time is increased to take away more heat, so that the wafer grinding temperature is reduced, when the concentration of grinding fluid needs to be adjusted, the knob 69 is rotated to drive the fixed gear shaft 67 to rotate, the fixed gear shaft 67 rotates to drive the movable gear shaft 62 to rotate through the fixed gear 66 and the movable gear 61, the movable gear shaft 62 rotates to drive the quantitative block 63 to move in the quantitative cavity 64, and the loading, thereby changing the amount of the grinding material conveyed in each time and finally realizing the adjustment of the grinding material concentration.

The invention has the beneficial effects that: the grinding fluid is pumped out through the reciprocating motion of the piston, the grinding material is measured, the grinding fluid is mixed with the grinding material and then stirred, finally the grinding fluid is input into the grinding cavity to grind the wafer, the quantitative conveying of the grinding material is realized, the sufficient mixing of the grinding material is facilitated, in addition, the concentration of the grinding material in the grinding fluid can be adjusted through the grinding material usage adjusting mechanism, the wafer processing of different specifications is matched, the flow rate of the grinding fluid is adjusted according to the grinding temperature, and the wafer is prevented from being damaged due to overhigh grinding temperature.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

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