阅读说明：本技术 胶带贴附设备和控制方法 (Tape application apparatus and control method ) 是由 罗伟凯 唐仙华 于 2020-12-22 设计创作，主要内容包括：本发明公开了一种胶带贴附设备和控制方法,胶带具有相对的胶面和背胶面,包括：基座,基座能相对PCB载板移动,基座上能设置有胶带；第一贴附单元,与基座运动连接,并能与胶带的背胶面抵接；第二贴附单元,与基座运动连接,并能与所述胶带的背胶面抵接,第二贴附单元位于第一贴附单元的一侧；第一贴附单元包括朝向胶带的背胶面设置的第一吸附部；朝向胶带的背胶面设置的第二吸附部；能相对基座运动的裁切刀,能作用于胶带的胶面。本发明可以实现对于胶带的吸附,从而使得胶带可以保持紧绷状态。当裁切刀对胶带进行裁切时,由于每次的胶带都保持相同的紧绷状态,所以导致裁切出来的胶带长度相同,满足了胶带贴附精度的需要。(The invention discloses an adhesive tape attaching device and a control method, wherein an adhesive tape is provided with an adhesive surface and a back adhesive surface which are opposite, and the adhesive tape attaching device comprises: the base can move relative to the PCB carrier plate, and an adhesive tape can be arranged on the base; the first attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape; the second attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape, and the second attaching unit is positioned on one side of the first attaching unit; the first attaching unit comprises a first absorbing part arranged towards the back adhesive surface of the adhesive tape; a second adsorption part arranged towards the back adhesive surface of the adhesive tape; the cutting knife which can move relative to the base can act on the adhesive surface of the adhesive tape. The invention can realize the adsorption of the adhesive tape, so that the adhesive tape can keep a tight state. When the cutting knife cuts the adhesive tape, the length of the cut adhesive tape is the same because the adhesive tape keeps the same tight state every time, and the requirement of adhesive tape attaching precision is met.)

1. An adhesive tape attaching apparatus, the adhesive tape having opposite adhesive and backing surfaces, comprising:

the base can move relative to the PCB carrier plate, and an adhesive tape can be arranged on the base;

the first attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape;

the second attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape, and the second attaching unit is positioned on one side of the first attaching unit;

it is characterized in that the preparation method is characterized in that,

the first attaching unit comprises a first absorbing part arranged towards the back adhesive surface of the adhesive tape;

the adhesive tape attaching equipment further comprises a second adsorption part which is positioned between the first attaching unit and the second attaching unit and faces to the back adhesive surface of the adhesive tape;

the adhesive tape attaching equipment further comprises a cutting knife capable of moving relative to the base, and the cutting knife can act on the adhesive surface of the adhesive tape.

2. The tape application apparatus according to claim 1, wherein the cutting blade is located between the second suction portion and the second application unit.

3. The tape attaching apparatus according to claim 1, wherein a fixed blade groove capable of accommodating the cutting blade is provided at a lower end of the second suction portion.

4. The tape application apparatus of claim 1, comprising a roller portion rotatably coupled to the base, the roller portion being operable to receive a tape.

5. The tape application apparatus according to claim 1, wherein the second suction portion and the cutting blade are each movable in a horizontal direction.

6. The tape application apparatus according to claim 5, wherein the cutter head of the cutting blade is horizontally disposed.

7. The tape application apparatus of claim 1, wherein the first application unit comprises an encapsulated roller and the second application unit comprises an encapsulated roller.

8. A control method of adhesive tape attaching equipment is characterized by comprising the following steps:

attaching the adhesive tape to the PCB, and in the process, always maintaining the first position of the back adhesive surface of the adhesive tape to be adsorbed;

after the attachment is finished, adsorbing a second position of the back adhesive surface of the adhesive tape;

and cutting the adhesive surface of the adhesive tape under the condition that the first position and the second position of the back adhesive surface of the adhesive tape are adsorbed.

9. The method of controlling a tape application apparatus according to claim 8, wherein the step of cutting the adhesive surface of the tape in a state where the back adhesive surface of the tape is sucked at a first position and a second position "is performed between the cut position and the first position.

10. The method of controlling a tape application apparatus according to claim 8, wherein in the step of "cutting the adhesive surface of the tape in a state where the adhesive surface of the tape is sucked at a first position and a second position", the cutting position is located between the first position and the second position.

Technical Field

The invention relates to the field of sealing detection, in particular to adhesive tape attaching equipment and a control method.

Background

The tape attaching apparatus is used to attach a tape to a PCB board. The existing adhesive tape attaching equipment comprises a base, a first attaching unit, a second attaching unit and cutting scissors, wherein the base can move relative to a PCB carrier. First attached unit with the base motion is connected, and can with the gum surface butt of sticky tape, the attached unit of second is located one side of first attached unit. After the first attaching unit and the second attaching unit attach the adhesive tape to the PCB, the first attaching unit moves for a distance in a direction away from the PCB, and then the first attaching unit and the second attaching unit stop moving. Then, the cutting scissors are moved between the first attaching unit and the second attaching unit, and the tape is cut.

The existing adhesive tape attaching equipment does not fix the adhesive tape after the adhesive tape is attached to the PCB, so that the tightness of the adhesive tape is different, the cut adhesive tape is different in length, and the requirement of the adhesive tape attaching precision cannot be met.

Disclosure of Invention

In order to overcome the defects in the prior art, the embodiment of the invention provides adhesive tape attaching equipment and a control method, which are used for solving the problems that the cut adhesive tapes are different in length and cannot meet the requirement of adhesive tape attaching precision.

The embodiment of the application discloses: an adhesive tape attaching apparatus, the adhesive tape having opposite adhesive and backing surfaces, comprising: the base can move relative to the PCB carrier plate, and an adhesive tape can be arranged on the base; the first attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape; the second attaching unit is movably connected with the base and can be abutted against the back adhesive surface of the adhesive tape, and the second attaching unit is positioned on one side of the first attaching unit; the first attaching unit comprises a first absorbing part arranged towards the back adhesive surface of the adhesive tape; the adhesive tape attaching equipment also comprises a second adsorption part which is positioned between the first attaching unit and the second attaching unit and is arranged towards the back adhesive surface of the adhesive tape; the adhesive tape attaching device also comprises a cutting knife which can move relative to the base, and the cutting knife can act on the adhesive surface of the adhesive tape.

Further, the cutting knife is positioned between the second adsorption part and the second attaching unit.

Further, the lower end of the second adsorption part is provided with a fixed cutter groove capable of containing a cutting cutter.

Further, a roller part is rotatably connected with the base and can be used for placing the adhesive tape.

Further, both the second adsorption part and the cutting blade may be moved in the horizontal direction.

Further, the cutter head of the cutting knife is horizontally arranged.

Further, the first attaching unit comprises an encapsulated roller, and the second attaching unit comprises an encapsulated roller.

The embodiment of the application also discloses a control method of the adhesive tape attaching equipment, which is characterized by comprising the following steps:

attaching the adhesive tape to the PCB, and in the process, always maintaining the first position of the back adhesive surface of the adhesive tape to be adsorbed;

after the attachment is finished, adsorbing a second position of the back adhesive surface of the adhesive tape;

and cutting the adhesive surface of the adhesive tape under the condition that the first position and the second position of the back adhesive surface of the adhesive tape are adsorbed.

Further, in the step "the adhesive surface of the adhesive tape is cut in a state where the back adhesive surface of the adhesive tape is adsorbed at the first position and the second position", the second position is located between the cut position and the first position.

Further, in the step of "cutting the adhesive surface of the adhesive tape in a state where the adhesive surface of the adhesive tape is adsorbed at the first position and the second position", the cut position is located between the second position and an attaching position where the adhesive tape is attached to the PCB board.

The invention has the following beneficial effects:

through adding first absorption portion and second absorption portion, can realize the absorption to the sticky tape, again because the attached state of second unit holding to the sticky tape to make the sticky tape can keep the state of stretching tightly between first absorption portion to the second absorption portion and between second absorption portion to the attached unit of second. When the cutting knife cuts the adhesive tape, the length of the cut adhesive tape is the same because the adhesive tape keeps the same tight state every time, and the requirement of adhesive tape attaching precision is met.

In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of a tape application apparatus in an embodiment of the present invention;

FIG. 2 is a schematic structural view of a tape application apparatus according to an embodiment of the present invention;

FIG. 3 is a partial schematic view of a tape application apparatus in an embodiment of the invention;

reference numerals of the above figures: 1. a base; 12. a drum part; 2. a first attaching unit; 21. a first adsorption part; 22. a first telescopic part; 23. a first rotating section; 231. a guide portion; 24. a first roller; 3. a second attaching unit; 31. a second telescopic part; 32. a second roller; 4. a second adsorption part; 41. a fixed cutter groove; 5. cutting knife; 6. a vacuum generator.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 3, the tape attaching apparatus of the present embodiment, in which a tape has an adhesive surface and a back adhesive surface opposite to each other, includes:

the PCB loading device comprises a base 1, wherein the base 1 can be vertically arranged and can move in the horizontal and vertical directions under the drive of a motor, a PCB loading plate can be arranged in the area below the base 1, and the PCB loading plate can be driven by the motor and can move in the horizontal direction on a track. The base 1 can move relative to the PCB carrier. The base 1 may be provided with an adhesive tape so that the adhesive tape can move together with the base 1.

The first attaching unit 2, the first attaching unit 2 can be connected with the base 1 in a moving way. The first attaching unit 2 may include a first telescopic portion 22 fixedly connected to the base 1, a first rotating portion 23 rotatably connected to the base 1 and the first telescopic portion 22, and a first roller 24 fixedly connected to the first rotating portion 23, and the first rotating portion 23 may be provided with a guide portion 231 for guiding the adhesive tape. The lower end of the guide part 231 may include the first suction part 21, and in the first sticking unit 2, the lower end of the guide part 231, the first suction part 21, and the first roller 24 may all be in contact with the back adhesive surface of the tape. The first suction part 21 may communicate with the vacuum generator 6 to fix the tape by vacuum suction. Of course, the first suction part 21 may suck the tape by another way that can realize suction.

A second attaching unit 3, the second attaching unit 3 can be movably connected with the base 1. The second attaching unit 3 may include a second expansion part 31 fixedly connected to the base 1, and a second roller 32 fixedly connected to the second expansion part 31, and the second roller 32 may be fixedly connected to a downward end of the second expansion part 31, so that the second roller 32 may attach the adhesive tape. The second roller 32 can abut against the back adhesive surface of the adhesive tape. The second attaching unit 3 is located at the first attaching unit 2 so that one of the first attaching unit 2 and the second attaching unit 3 can attach an adhesive tape to a PCB and the other can perform a de-bubbling and de-wrinkling function on the adhesive tape attached to the PCB.

And a second adsorption part 4, wherein the second adsorption part 4 is positioned between the first attaching unit 2 and the second attaching unit 3 and is arranged towards the back adhesive surface of the adhesive tape. The second suction portion 4 may include a plurality of suction holes, so that the adhesive tape may be sucked at a plurality of points, thereby realizing more firm suction of the adhesive tape. The second suction portion 4 may communicate with the vacuum generator 6 to fix the tape by vacuum suction. Of course, the second suction unit 4 may suck the tape in another way that can realize suction.

The cutting knife 5 can be fixedly connected with the moving part which is not connected with the base 1, so that the cutting knife 5 can move relative to the base 1. The cutter head of the cutting knife 5 can be arranged opposite to the adhesive surface of the adhesive tape, so that the cutting knife 5 can act on the adhesive surface of the adhesive tape in the moving process and cut the adhesive tape.

In this embodiment, in the first attaching unit 2, the first stretching portion 22 is an air cylinder, one end of the first rotating portion 23 is rotatably connected to the base 1, and the other end of the first rotating portion 23 is fixedly connected to the first stretching portion 22, so that the first rotating portion 23 can rotate around the end connected to the base 1, and the first roller 24 is disposed at the end of the first rotating portion 23 close to the first stretching portion 22. In the second attaching unit 3, the second stretching portion 31 is a cylinder that stretches linearly, and the second roller 32 is fixedly connected to a downward end of the second stretching portion 31. The upper end of the first adsorption part 21 is fixedly connected with a vacuum generator 6, and the first adsorption part 21 and the second adsorption part 4 are communicated with the vacuum generator 6. The cutting blade 5 is provided between the second roller 32 and the second suction portion 4.

When the tape is attached, the first roller 24 and the second roller 32 attach the tape to the PCB, and during the attaching, a lower portion of the first roller 24 and a lower portion of the second roller 32 may be on the same horizontal line. After the first roller 24 and the second roller 32 are attached, the second attaching unit 3 stops moving, and the first attaching unit 2 moves away from the PCB carrier. Next, the second suction portion 4 sucks the back surface of the tape. Then, the cutting blade 5 starts moving and cuts the adhesive surface of the adhesive tape. In the whole process, the first suction part 21 always sucks the back adhesive surface of the adhesive tape.

By means of the structure, the adhesive tape can be adsorbed by adding the first adsorption part 21 and the second adsorption part 4, and the second attaching unit 3 keeps the attaching state of the adhesive tape, so that the adhesive tape can be kept in a tight state between the first adsorption part 21 and the second adsorption part 4 and between the second adsorption part 4 and the second attaching unit 3. When the cutting knife 5 cuts the adhesive tape, the length of the cut adhesive tape is the same because the adhesive tape keeps the same tension state every time, and the requirement of adhesive tape attaching precision is met.

Specifically, as shown in fig. 3, the cutting blade 5 may be located between the second adsorption part 4 and the second attachment unit 3. Because the second attaching unit 3 can press the adhesive tape in the process of attaching the adhesive tape to the PCB, and the second adsorption part 4 can adsorb the adhesive tape, so that the adhesive tape can be kept in a tight state between the second adsorption part 4 and the second attaching unit 3, and the adhesive tape is cut after the second attaching unit 3 and the second adsorption part 4 adsorb the adhesive tape. Of course, the cutting blade 5 may be provided between the second suction portion 4 and the first suction portion 21.

Specifically, as shown in fig. 3, the lower end of the second suction portion 4 is provided with a fixed blade groove 41 capable of accommodating the cutting blade 5. The fixed blade groove 41 may be a plurality of recesses arranged in parallel in the same direction as the direction of the cutting edge of the cutting blade 5, so that the cutting blade 5 can press the adhesive tape into the fixed blade groove 41 and cut the adhesive tape at this position in the process of cutting the adhesive tape. The arrangement of the fixed cutter groove 41 can prevent the phenomenon of slipping of the cutting cutter 5 in the process of cutting the adhesive tape in the way that the cutting cutter 5 and the adhesive tape are fixed in the fixed cutter groove 41, and the success rate of cutting the adhesive tape is improved.

Specifically, as shown in fig. 1 and 2, the adhesive tape dispenser comprises a roller part 12 rotatably connected with the base 1, and the roller part 12 can be used for placing an adhesive tape. The drum part 12 may be provided at an end of the first attaching unit 2 away from the second suction part 4 so that the tape may move from the drum part 12 to the second suction part 4 through the first attaching unit 2. The arrangement of the roller part 12 can enable the adhesive tape and the base 1 to move synchronously, the adhesive tape on the roller can automatically discharge along with the attaching process, the adhesive tape does not need to be artificially supplemented into the first attaching unit 2 and the second attaching unit 3 at any time, and time and labor are saved.

Specifically, as shown in fig. 3, both the second adsorption part 4 and the cutting blade 5 can move in the horizontal direction. And the second suction portion 4 can suck in a direction perpendicular to the tape since the tape has a downward portion after the tape is attached. Accordingly, the cutting blade 5 can move in the direction of the second adsorption part 4 after moving in the horizontal direction and cut the adhesive tape. Since the moving direction of the second adsorption part 4 and the cutting blade 5 is perpendicular to the moving direction of the adhesive tape, the second adsorption part 4 and the cutting blade 5 can move in the horizontal direction to ensure that a large adsorption force is generated on the adhesive tape and cutting is completed.

In a preferred embodiment, as shown in fig. 3, the cutting blade 5 has a blade head horizontally arranged, and when the second adsorption part 4 moves horizontally and adsorbs the back adhesive surface of the adhesive tape, the blade head of the cutting blade 5 is horizontally arranged, so that the cutting can be performed perpendicular to the adsorbed adhesive tape, thereby increasing the success rate of cutting the adhesive tape.

Specifically, the first attaching unit 2 may include an encapsulated roller, and the encapsulated roller of the first attaching unit 2 may attach the tape so that the tape is attached to the PCB. The second attaching unit 3 may include an encapsulated roller, and the encapsulated roller of the second attaching unit 3 may perform an operation of de-wrinkling and de-bubbling the tape that has been attached to the PCB. The rubber coating roller has certain elasticity, so that the first attaching unit 2 and the second attaching unit 3 can be placed to damage the adhesive tape or the PCB during operation.

The invention also provides an embodiment of a control method of the adhesive tape attaching equipment, which comprises the following steps:

attaching the adhesive tape to the PCB, and in the process, always maintaining the first position of the back adhesive surface of the adhesive tape to be adsorbed;

after the attachment is finished, adsorbing a second position of the back adhesive surface of the adhesive tape;

and cutting the adhesive surface of the adhesive tape under the condition that the first position and the second position of the back adhesive surface of the adhesive tape are adsorbed.

As shown in fig. 1 to 3, in the present embodiment, the first suction portion 21 is located at the first position and the second suction portion 4 is located at the second position, and the adhesive tape is cut by the cutting blade 5. In the process that the adhesive tape is attached to the PCB, the first position always adsorbs the back adhesive surface of the adhesive tape, so that the back adhesive surface of the adhesive tape can be adsorbed at the first position, and the adhesive tape is prevented from falling down in the moving process to pollute the adhesive surface. After the adhesive tape is attached, the back adhesive surface of the adhesive tape is adsorbed at the second position, and then the cutting knife 5 is moved to cut the adhesive surface of the adhesive tape.

Specifically, when carrying out the sticky tape and cutting, the second position is located between the position and the first position of cutting, adsorbs and the sticky tape is attached to the PCB board back at the second position to the sticky tape promptly, cuts the sticky tape that lies in the middle of PCB board and the second position.

Specifically, when the adhesive tape is cut, the cutting position is located between the first position and the second position, that is, after the adhesive tape is adsorbed at the first position and the second position, the adhesive tape between the two positions is cut.

The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.