阅读说明：本技术 侧向测温结构及电子设备 (Lateral temperature measurement structure and electronic equipment ) 是由 马维东 马维超 孟虹宣 桂小乐 郑腾飞 王博 刘建 于 2020-12-09 设计创作，主要内容包括：本发明涉及电子设备技术领域,具体公开一种侧向测温结构及电子设备,侧向测温结构包括：侧框,所述侧框围蔽形成容置空间,所述侧框的外侧面向里凹陷形成与所述容置空间连通的安装孔；测温探头,所述测温探头位于所述安装孔中,其测温表面外露；电路组件,所述电路组件位于所述容置空间中,用于接收以及分析所述测温探头获取的温度数据。本发明提供一种侧向测温结构及电子设备,具有整体厚度尺寸较小的优点,有利于满足电子设备轻薄化的设计需求。(The invention relates to the technical field of electronic equipment, and particularly discloses a lateral temperature measurement structure and electronic equipment, wherein the lateral temperature measurement structure comprises: the side frame is shielded to form an accommodating space, and the outer side surface of the side frame is recessed inwards to form a mounting hole communicated with the accommodating space; the temperature measuring probe is positioned in the mounting hole, and the temperature measuring surface of the temperature measuring probe is exposed; and the circuit component is positioned in the accommodating space and is used for receiving and analyzing the temperature data acquired by the temperature measuring probe. The invention provides a lateral temperature measurement structure and electronic equipment, which have the advantage of smaller overall thickness and size and are beneficial to meeting the design requirement of lightness and thinness of the electronic equipment.)

1. A lateral temperature measurement structure, comprising:

the side frame is shielded to form an accommodating space, and the outer side surface of the side frame is recessed inwards to form a mounting hole communicated with the accommodating space;

the temperature measuring probe is positioned in the mounting hole, and the temperature measuring surface of the temperature measuring probe is exposed;

and the circuit component is positioned in the accommodating space and is used for receiving and analyzing the temperature data acquired by the temperature measuring probe.

2. The lateral temperature measurement structure of claim 1, wherein a sealing ring is arranged between the temperature measurement probe and the wall of the mounting hole.

3. The lateral temperature measurement structure of claim 1 or 2, wherein the circuit assembly comprises a main board and a connecting circuit board, and the main board obtains the temperature data of the temperature measurement probe through the connecting circuit board.

4. The lateral temperature measurement structure of claim 3, wherein the connection circuit board is a flexible circuit board.

5. The lateral temperature measurement structure according to claim 3 or 4, wherein a reinforcing plate is fixedly arranged in the accommodating space, and the reinforcing plate is arranged opposite to one end of the temperature measurement probe extending into the accommodating space;

one end of the connecting circuit board close to the temperature measuring probe is fixed on one side of the reinforcing plate close to the temperature measuring probe.

6. The lateral temperature measurement structure of claim 5, wherein fixing holes are formed at both ends of the reinforcing plate;

two fixed bosses which are arranged at intervals are arranged above the temperature measuring probe, and each fixed boss is provided with a hot melting column;

each hot-melting column is inserted into one fixing hole.

7. The lateral temperature measurement structure of claim 5 or 6, wherein the side surface of the temperature measurement probe opposite to the reinforcing plate is a planar structure.

8. The lateral thermometric structure of claim 7, wherein the planar structure is electrically connected to the connection wiring board by a thermally conductive gel.

9. The lateral temperature measuring structure of any one of claims 1 to 8, wherein a ring-shaped clamping groove is formed in the circumferential direction of one end of the temperature measuring probe, which is located in the accommodating space;

the annular clamping groove is clamped with an arc-shaped clamping plate.

10. An electronic device, comprising a display screen and the lateral temperature measurement structure of any one of claims 1 to 9, wherein the display screen is configured to display a temperature detected by the lateral temperature measurement structure.

Technical Field

The invention relates to the technical field of electronic equipment, in particular to a lateral temperature measurement structure and electronic equipment.

Background

Many hand-worn electronic equipment's such as intelligent wrist-watch or intelligent bracelet bottom all is equipped with temperature probe to realize the monitoring of human temperature. However, the solution of installing the temperature probe to the bottom of the hand-wearing electronic device increases the thickness of the hand-wearing electronic device, and it is difficult to satisfy the market demand of lightness and thinness.

Therefore, the existing bottom temperature measuring structure needs to be improved to solve the problem that the whole thickness size is large.

Disclosure of Invention

An object of the present invention is to provide a lateral temperature measurement structure and an electronic device, which have the advantage of small overall thickness, and are beneficial to meeting the design requirement of light and thin electronic devices.

To achieve the above objects, in one aspect, the present invention provides a lateral temperature measurement structure, including:

the side frame is shielded to form an accommodating space, and the outer side surface of the side frame is recessed inwards to form a mounting hole communicated with the accommodating space;

the temperature measuring probe is positioned in the mounting hole, and the temperature measuring surface of the temperature measuring probe is exposed;

and the circuit component is positioned in the accommodating space and is used for receiving and analyzing the temperature data acquired by the temperature measuring probe.

Optionally, a sealing ring is arranged between the temperature measuring probe and the wall of the mounting hole.

Optionally, the circuit assembly includes a main board and a connecting circuit board, and the main board obtains the temperature data of the temperature measuring probe through the connecting circuit board.

Optionally, the connection circuit board is a flexible circuit board.

Optionally, a reinforcing plate is fixedly arranged in the accommodating space, and the reinforcing plate and one end of the temperature measuring probe extending into the accommodating space are arranged oppositely;

one end of the connecting circuit board close to the temperature measuring probe is fixed on one side of the reinforcing plate close to the temperature measuring probe.

Optionally, two ends of the reinforcing plate are provided with fixing holes;

two fixed bosses which are arranged at intervals are arranged above the temperature measuring probe, and each fixed boss is provided with a hot melting column;

each hot-melting column is inserted into one fixing hole.

Optionally, the side surface of the temperature probe opposite to the reinforcing plate is of a planar structure.

Optionally, the planar structure is electrically connected to the connection circuit board through a thermally conductive gel.

Optionally, an annular clamping groove is formed in the circumferential direction of one end, located in the accommodating space, of the temperature measuring probe;

the annular clamping groove is clamped with an arc-shaped clamping plate.

On the other hand, the electronic equipment comprises a display screen and the lateral temperature measuring structure, wherein the display screen is used for displaying the temperature detected by the lateral temperature measuring structure.

The invention has the beneficial effects that: the utility model provides a side direction temperature measurement structure and electronic equipment, temperature probe are located the side frame, and the temperature measurement surface exposes, when needs carry out the temperature measurement, can put the finger in temperature measurement surface department, and temperature probe automatic acquisition finger temperature conveys to circuit assembly and carries out data conversion analysis, finally shows the human body temperature on the display screen. Compared with the traditional bottom temperature measurement structure mode, the lateral temperature measurement structure provided by the embodiment has smaller overall thickness and size and lower requirement on the longitudinal space, and is favorable for meeting the design requirement of lightness and thinness of electronic equipment.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of a lateral temperature measurement structure according to an embodiment;

FIG. 2 is a schematic structural diagram of a heat-fusible column according to an embodiment;

fig. 3 is a schematic position diagram of a temperature detection device according to an embodiment.

In the figure:

1. a side frame; 101. fixing the boss; 102. hot melting the column;

2. a temperature measuring probe; 201. measuring the temperature of the surface; 202. an annular neck;

3. a circuit component;

301. connecting a circuit board; 3011. a connector; 3012. a temperature detection device;

302. a main board;

4. an arc-shaped clamping plate;

5. a thermally conductive gel;

6. a reinforcing plate.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the referred devices or elements must have the specific orientations, be configured to operate in the specific orientations, and thus are not to be construed as limitations of the present invention.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Referring to fig. 1 to 3, the present embodiment provides an electronic device, which includes a display screen and a lateral temperature measurement structure. Wherein, side direction temperature measurement structure includes side frame 1, temperature probe 2 and circuit assembly 3. The display screen is fixed above the side frame 1. The side frame 1 and the bottom of display screen enclose and cover and form the accommodation space, the lateral surface of side frame 1 is sunken inwards to form with the mounting hole of accommodation space intercommunication. The temperature measuring probe 2 is positioned in the mounting hole, and the temperature measuring surface 201 of the temperature measuring probe is exposed; in order to sense the external temperature. The circuit component 3 is positioned in the accommodating space and is respectively and electrically connected with the temperature measuring probe 2 and the display screen.

It should be noted that the temperature measurement probe 2 is located on the side frame 1, and the temperature measurement surface 201 is exposed, when temperature measurement is needed, a finger can be placed on the temperature measurement surface 201, the temperature measurement probe 2 automatically collects the skin temperature of a human body (for example, the finger, the wrist or other parts of the body) and transmits the skin temperature to the circuit component 3 for data conversion and analysis, and finally the temperature of the human body is displayed on the display screen. Compared with the traditional bottom temperature measurement structure mode, the lateral temperature measurement structure provided by the embodiment has smaller overall thickness and size and lower requirement on the longitudinal space, and is favorable for meeting the design requirement of lightness and thinness of electronic equipment.

It will be appreciated that the temperature probe 2 can also monitor the ambient temperature in real time when not in contact with the temperature sensing surface 201.

In this embodiment, the circuit module 3 includes a connection circuit board 301 and a main board 302 electrically connected to the display screen. One end of the connecting circuit board 301 is provided with a connector 3011 inserted with the main board 302, and the other end is provided with a temperature detection device 3012 for detecting the temperature of the temperature measurement probe 2. Optionally, the connection circuit board 301 is a flexible circuit board. The deformability of the flexible circuit board is strong, the thickness of the flexible circuit board is small, and the flexible circuit board is used for electrically connecting the main board 302 and the temperature measuring probe 2, so that the overall thickness of the lateral temperature measuring structure can be further reduced.

Furthermore, a reinforcing plate 6 is fixedly arranged in the accommodating space, and the reinforcing plate 6 is arranged opposite to one end of the temperature measuring probe 2 extending into the accommodating space. The temperature detection device 3012 at one end of the connecting circuit board 301 close to the temperature measurement probe 2 is fixed at one side of the reinforcing plate 6 close to the temperature measurement probe 2. It can be understood that the strength of the flexible circuit board is low, and the flexible circuit board is easy to loosen from the temperature measuring probe 2, so that the reinforcing plate 6 is arranged to reliably fix the connecting circuit board 301 close to one end of the temperature measuring probe 2.

Optionally, fixing holes are formed at two ends of the reinforcing plate 6. Two fixed bosses 101 arranged at intervals are arranged above the temperature measuring probe 2, and each fixed boss 101 is provided with a hot melting column 102. Each of the heat-fusible pillars 102 is inserted into one of the fixing holes. Specifically, the reinforcing plate 6 is stably installed through the hot-melting column 102, the process is simple, and the cost is low.

Further, the side face of the temperature measuring probe 2 opposite to the reinforcing plate 6 is a planar structure, and the planar structure is connected with the temperature detecting device 3012 on the connecting circuit board 301 through the heat conducting gel 5. The plane structure is beneficial to increasing the contact area of the temperature detection device 3012 and the temperature measurement probe 2, and the accuracy and reliability of measurement data are ensured. The heat conducting gel 5 can reduce contact thermal resistance and reduce loss in a data transmission process.

In this embodiment, a ring-shaped clamping groove is formed in the circumferential direction of one end of the temperature measuring probe 2, which is located in the accommodating space; the annular clamping groove is clamped with an arc-shaped clamping plate, and the arc-shaped clamping plate 4 is additionally arranged to prevent the temperature measuring probe 2 from being separated from the side frame 1 outwards. Furthermore, the arc-shaped clamping plate is provided with a notch so that the arc-shaped clamping plate can conveniently enter and exit the annular clamping groove.

Optionally, the installation process of the lateral temperature measurement structure provided by this embodiment is as follows:

firstly, clamping the arc-shaped clamping plate 4 into the annular clamping groove 202 to pre-fix the arc-shaped clamping plate 4 and the temperature measuring probe 2;

secondly, spot welding is carried out on the arc-shaped clamping plate 4 and the temperature measuring probe 2, and the temperature measuring probe 2 is guaranteed to be reliably fixed;

thirdly, heat conducting gel 5 is coated between the plane structure at the tail part of the temperature measuring probe 2 and the temperature detecting device 3012, gaps caused by design, materials, assembly and the like are filled, and meanwhile, the contact reliability is guaranteed;

and fourthly, finally inserting the reinforcing plate 6 on the connecting circuit board 301 into the hot-melting column 102, and carrying out hot melting on the hot-melting column 102 to realize the fixation of the reinforcing plate 6 on the middle frame.

Optionally, a sealing ring is arranged between the temperature measuring probe 2 and the wall of the mounting hole. Specifically, the sealing ring can play dustproof and waterproof effect, effectively protects the device in the accommodation space.

The electronic equipment provided by the embodiment has the following advantages:

firstly, the temperature measuring probe is laterally arranged, so that the thickness of the whole machine is reduced;

the environment temperature and the human body temperature can be detected;

a compressed sealing ring is arranged between the temperature measuring probe and the side frame, so that the waterproof and dustproof requirements of higher grade can be realized;

heat conducting gel is coated between the tail of the temperature measuring probe and the temperature detecting device, so that gaps caused by design, materials, assembly and the like are absorbed, and good contact between the detecting device and the probe is ensured;

the temperature detection device is fixed through the reinforcing sheet, is not easy to shift and has high reliability.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.