阅读说明：本技术 三维测定装置 (Three-dimensional measuring apparatus ) 是由 田端伸章 于 2018-09-27 设计创作，主要内容包括：本外观检查装置(100)(三维测定装置)包括：第一测定部(30),利用相移法测定三维信息；第二测定部(40),利用光切断法测定三维信息；及控制装置(50),基于第一测定部和第二测定部这双方的测定结果,取得测定对象的三维信息。(The appearance inspection device (100) (three-dimensional measurement device) comprises: a first measurement unit (30) that measures three-dimensional information by a phase shift method; a second measuring unit (40) for measuring three-dimensional information by a light section method; and a control device (50) that acquires three-dimensional information of the measurement object based on the measurement results of both the first measurement unit and the second measurement unit.)

1. A three-dimensional measurement device is provided with:

a first measurement unit that measures three-dimensional information by a phase shift method;

a second measuring unit for measuring three-dimensional information by a light section method; and

and a control unit that acquires three-dimensional information of the measurement object based on measurement results of both the first measurement unit and the second measurement unit.

2. The three-dimensional measurement apparatus according to claim 1,

the first measurement section includes a first imaging section and a first projection section that projects a first measurement pattern imaged by the first imaging section, one of the first imaging section and the first projection section is provided with an optical axis in a direction perpendicular to a reference plane, and the other of the first imaging section and the first projection section is provided with a plurality of first imaging sections and a plurality of second projection sections, and the optical axis is arranged in a direction inclined with respect to the direction of the optical axis of one of the first imaging sections and the second projection sections,

the second measurement unit includes: a second imaging unit having a telecentric optical system and an optical axis arranged in a direction inclined with respect to a vertical direction of the reference plane; and a second projection unit which is disposed at a position in a direction in which an optical axis of the second imaging unit is regularly reflected with respect to the reference surface, and which projects a linear second measurement pattern imaged by the second imaging unit.

3. The three-dimensional assay device according to claim 1 or 2,

the control unit is configured to acquire height information indicating a height at each position and reliability information indicating reliability of the height information at each position based on measurement by the first measurement unit, acquire the height information and the reliability information based on measurement by the second measurement unit, and acquire one piece of the height information based on the height information and the reliability information acquired by the measurement by the first measurement unit and the height information and the reliability information acquired by the measurement by the second measurement unit.

4. The three-dimensional measurement apparatus according to claim 3,

the first measurement unit is configured to measure three-dimensional information by projecting a first measurement pattern from a plurality of directions,

the control unit is configured to acquire a plurality of pieces of the height information and the reliability information based on the measurement by the first measurement unit, and acquire one piece of the height information based on the plurality of pieces of the height information and the plurality of pieces of the reliability information acquired by the measurement by the first measurement unit and the height information and the reliability information acquired by the measurement by the second measurement unit.

5. The three-dimensional measurement apparatus according to claim 4,

the control unit is configured to supplement the height information having a low degree of reliability of the reliability information measured by the second measuring unit with the height information measured by the first measuring unit.

6. The three-dimensional measurement apparatus according to claim 5,

the control unit is configured to, when it is estimated that the direction of the first measurement unit, in which the first measurement pattern is projected, is a shadow due to the measurement target, exclude a measurement result from the shadow-forming direction and supplement the height information.

7. The three-dimensional assay device of any one of claims 3 to 6,

the control unit is configured to acquire the reliability information at each position based on a luminance difference generated by a plurality of measurements by the first measurement unit.

8. The three-dimensional assay device of any one of claims 3 to 7,

the control unit is configured to acquire the reliability information at each position based on a luminance value obtained by measurement by the second measurement unit.

9. The three-dimensional assay device of any one of claims 1 to 8,

the control unit is configured to determine whether the projection shape based on the measurement result of the first measurement unit is noise or a structure based on the measurement result of the second measurement unit.

10. The three-dimensional assay device of any one of claims 1 to 9,

the control unit is configured to perform control as follows: the measurement is performed by the second measurement unit prior to the measurement by the first measurement unit, and the measurement height position of the first measurement unit is adjusted based on the measurement result by the second measurement unit.

11. The three-dimensional assay device of any one of claims 1 to 10,

the control unit is configured to perform control as follows: the second measurement unit performs measurement prior to the measurement performed by the first measurement unit, obtains planar position information of the measurement object based on a measurement result by the second measurement unit, and adjusts the planar position of the measurement performed by the first measurement unit.

12. The three-dimensional assay device of any one of claims 1 to 11,

the measurement object is a substrate on which an electronic component is mounted.

Technical Field

The present invention relates to a three-dimensional measurement device.

Background

Conventionally, a three-dimensional measuring apparatus is known. Such a three-dimensional measurement device is disclosed in, for example, japanese patent laid-open No. 2000-193432.

The above-mentioned japanese patent application laid-open No. 2000-193432 discloses a three-dimensional measurement device including a measurement unit that measures a three-dimensional shape by a light section method in which a linear laser beam is projected from a direction inclined with respect to a reference plane and imaged.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2000-193432

Disclosure of Invention

Problems to be solved by the invention

However, in the three-dimensional measurement device disclosed in japanese patent application laid-open No. 2000-193432, since the linear laser beam is projected from a direction inclined with respect to the reference plane, a region in which the laser beam is shaded by the three-dimensional shape of the measurement target appears. Therefore, there is a problem that it is difficult to measure the three-dimensional shape of the measurement target with high accuracy due to the influence of the shadow.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a three-dimensional measurement device capable of measuring three-dimensional information of a measurement target with high accuracy.

Means for solving the problems

A three-dimensional measurement device according to one aspect of the present invention includes: a first measurement unit that measures three-dimensional information by a phase shift method; a second measuring unit for measuring three-dimensional information by a light section method; and a control unit that acquires three-dimensional information of the measurement object based on measurement results of both the first measurement unit and the second measurement unit. In addition, the phase shift method is as follows: a grid-like bright and dark pattern (stripe pattern light) having a sine-wave light intensity distribution at equal intervals is projected onto a measurement object, a plurality of images obtained by shifting the positions (phases) of the bright and dark pattern are captured, and the three-dimensional shape (height) of the measurement object is calculated based on the difference in pixel values of the same portion in the plurality of captured images. The light section method is a method of projecting linear light onto a measurement object, capturing an image, and calculating the three-dimensional shape (height) of the measurement object based on the distortion (parallax) of the line in the image.

In the three-dimensional measurement device according to the aspect of the present invention, since the measurement target is measured by both the light section method and the phase shift method by the configuration described above, even at a position where light irradiation by the light section method becomes a shadow, the height information can be supplemented by the measurement by the phase shift method. Further, since the three-dimensional information can be acquired by a plurality of methods based on the light section method and the phase shift method, the accuracy of acquiring the three-dimensional information can be improved. This makes it possible to measure three-dimensional information of a measurement object with high accuracy.

In the three-dimensional measurement device according to the above aspect, it is preferable that the first measurement unit includes a first imaging unit and a first projection unit that projects a first measurement pattern imaged by the first imaging unit, one of the first imaging unit and the first projection unit has an optical axis arranged in a direction perpendicular to the reference plane, and the other of the first imaging unit and the first projection unit has a plurality of optical axes arranged in a direction inclined with respect to the direction of the optical axis of the one, and the second measurement unit includes: a second imaging unit having a telecentric optical system and an optical axis arranged in a direction inclined with respect to a vertical direction of the reference plane; and a second projection unit which is disposed at a position in a direction in which the optical axis of the second imaging unit is regularly reflected with respect to the reference surface, and which projects a linear second measurement pattern imaged by the second imaging unit. With this configuration, even if the measurement target is a reflection surface such as a mirror surface or a glass surface, the second image pickup unit can reliably pick up an image by the second image pickup unit arranged at a position in the direction in which the second measurement pattern projected from the second projection unit is regularly reflected. Further, since the second imaging unit has a telecentric optical system, it is possible to perform parallel imaging without deforming the second measurement pattern reflected by the reflection surface of the measurement object by the optical system. Thus, three-dimensional information can be measured with high accuracy even for a measurement object having a reflection surface. Further, by providing a plurality of first projecting units or first imaging units in the first measuring unit, the direction in which the first measurement pattern is projected or the direction in which the first measurement pattern is imaged can be made plural. Thus, even in a case where a shadow is generated in projection from one direction at a certain position, it is possible to suppress generation of a shadow in projection from another direction. This enables reliable measurement of three-dimensional information at a certain position.

In the three-dimensional measurement device according to the above aspect, it is preferable that the control unit is configured to acquire height information indicating a height at each position and reliability information indicating reliability of the height information at each position based on measurement by the first measurement unit, acquire the height information and the reliability information based on measurement by the second measurement unit, and acquire one piece of height information based on the height information and the reliability information acquired by the measurement by the first measurement unit and the height information and the reliability information acquired by the measurement by the second measurement unit. With this configuration, even when the height information obtained by the measurement by the first measurement unit is significantly different from the height information obtained by the measurement by the second measurement unit, one piece of height information with higher reliability can be obtained based on the respective pieces of reliability information.

In this case, it is preferable that the first measurement unit is configured to project the first measurement pattern from a plurality of directions to measure the three-dimensional information, and the control unit is configured to acquire a plurality of height information and reliability information based on the measurement by the first measurement unit, and acquire one height information based on the plurality of height information and the plurality of reliability information acquired by the measurement by the first measurement unit and the height information and the reliability information acquired by the measurement by the second measurement unit. With this configuration, since the plurality of height information are obtained by the first measuring unit using the phase shift method, one height information having higher reliability can be obtained.

In the above-described configuration in which the first measurement unit projects the first measurement pattern from a plurality of directions to measure the three-dimensional information, the control unit is preferably configured to supplement the height information having low reliability of the reliability information measured by the second measurement unit with the height information measured by the first measurement unit. With this configuration, even when the reliability is lowered due to the influence of shadows or the like in the measurement by the second measurement unit using the light section method, the height information can be supplemented by the measurement by the first measurement unit using the phase shift method.

In this case, it is preferable that the control unit is configured to exclude the measurement result from the direction in which the shadow is formed and supplement the height information when it is estimated that the direction in which the first measurement pattern is projected by the first measurement unit is in the shadow due to the measurement object. With this configuration, since the measurement result of the projection direction in which the accuracy is low due to the influence of the shadow in the projection directions of the plurality of first measurement patterns by the phase shift method can be excluded, the height information measured by the second measurement unit using the light section method can be supplemented with higher accuracy from the plurality of height information measured by the first measurement unit using the phase shift method.

In the above-described configuration in which the control unit obtains one piece of height information based on the height information and the reliability information obtained by the measurement by the first measurement unit and the height information and the reliability information obtained by the measurement by the second measurement unit, the control unit is preferably configured to obtain the reliability information at each position based on a luminance difference generated by a plurality of measurements by the first measurement unit. With this configuration, it is possible to easily acquire reliability information based on a luminance difference generated by a plurality of measurements by the first measurement unit using the phase shift method.

In the above-described configuration in which the control unit obtains one piece of height information based on the height information and the reliability information obtained by the measurement by the first measurement unit and the height information and the reliability information obtained by the measurement by the second measurement unit, the control unit is preferably configured to obtain the reliability information at each position based on the luminance value obtained by the measurement by the second measurement unit. With this configuration, it is possible to easily acquire reliability information based on the luminance value measured by the second measurement unit using the light section method.

In the three-dimensional measurement device according to the above aspect, the control unit is preferably configured to determine whether the projection shape based on the measurement result of the first measurement unit is noise or a structure, based on the measurement result of the second measurement unit. With this configuration, the virtual image appearing in the projected shape by the image pickup by the phase shift method of the first measurement unit can be determined as noise by the light section method of the second measurement unit, and therefore, by removing the noise, the height information can be acquired with higher accuracy.

In the three-dimensional measurement device according to the above aspect, the control unit is preferably configured to perform control such that: the measurement is performed by the second measurement unit prior to the measurement by the first measurement unit, and the measurement height position of the first measurement unit is adjusted based on the measurement result of the second measurement unit. With this configuration, the height position measured by the first measuring unit using the phase shift method can be adjusted to be along the three-dimensional shape of the measurement target based on the three-dimensional information measured by the second measuring unit using the light section method, and therefore, the image can be easily focused.

In the three-dimensional measurement device according to the above aspect, the control unit is preferably configured to perform control such that: the second measurement unit performs measurement prior to the measurement by the first measurement unit, obtains planar position information of the measurement object based on the measurement result of the second measurement unit, and adjusts the planar position of the measurement performed by the first measurement unit. With this configuration, the operation of acquiring the plane position information by the first measurement unit using the phase shift method can be omitted, and therefore, the time required for the measurement operation can be suppressed from becoming longer than the case of acquiring the plane position information again by the first measurement unit.

In the three-dimensional measurement device according to the above aspect, the measurement object is preferably a substrate on which an electronic component is mounted. With this configuration, three-dimensional information of the substrate on which the electronic component is mounted can be measured with high accuracy.

Effects of the invention

According to the present invention, as described above, three-dimensional information of a measurement target can be measured with high accuracy.

Drawings

Fig. 1 is a block diagram showing an appearance inspection apparatus according to an embodiment of the present invention.

Fig. 2 is a diagram showing a second measurement unit of the appearance inspection device according to the embodiment of the present invention.

Fig. 3 is a diagram showing a first measurement unit of the appearance inspection device according to the embodiment of the present invention.

Fig. 4 is a diagram for explaining acquisition of height information of the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 5 is a diagram for explaining the height measurement by the second measurement unit in the appearance inspection device according to the embodiment of the present invention.

Fig. 6 is a diagram for explaining the reliability of the height measurement by the second measurement unit in the appearance inspection device according to the embodiment of the present invention.

Fig. 7 is a diagram for explaining the determination of the reliability of the height measurement by the second measurement unit in the appearance inspection device according to the embodiment of the present invention.

Fig. 8 is a diagram for explaining the removal of noise from the height information in the visual inspection apparatus according to the embodiment of the present invention.

Fig. 9 is a diagram for explaining a shaded area at the time of measurement by the visual inspection apparatus according to the embodiment of the present invention.

Fig. 10 is a diagram for explaining determination of a shadow region in measurement by the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 11 is a diagram for explaining the exclusion of the measurement result of the shaded area at the time of measurement by the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 12 is a diagram for explaining grouping of measurement results of the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 13 is a diagram for explaining the integration of measurement results in the case where the reliability of the measurement results by the light section method is low in the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 14 is a diagram for explaining the integration of measurement results in the case where the reliability of the measurement results by the light section method of the appearance inspection apparatus according to the embodiment of the present invention is medium.

Fig. 15 is a diagram for explaining the integration of measurement results in the case where an outlier exists in the measurement results of the appearance inspection apparatus according to the embodiment of the present invention.

Fig. 16 is a flowchart for explaining the three-dimensional information acquisition process performed by the control device in the appearance inspection device according to the embodiment of the present invention.

Fig. 17 is a flowchart for explaining a first example of the per-visual-field height information combining process performed by the control device in the appearance inspection device according to the embodiment of the present invention.

Fig. 18 is a flowchart for explaining a second example of the per-visual-field height information combining process performed by the control device in the appearance inspection device according to the embodiment of the present invention.

Fig. 19 is a flowchart for explaining the image integration process performed by the control device in the appearance inspection device according to the embodiment of the present invention.

Fig. 20 is a diagram showing a second measurement unit of the appearance inspection device according to the first modification of the embodiment of the present invention.

Fig. 21 is a diagram showing a second measurement unit of the appearance inspection device according to the second modification of the embodiment of the present invention.

Fig. 22 is a diagram showing a first measurement unit of an appearance inspection device according to a third modification of the embodiment of the present invention.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings.

The structure of the appearance inspection apparatus 100 according to an embodiment of the present invention will be described with reference to fig. 1 to 15. The appearance inspection apparatus 100 is an example of the "three-dimensional measurement apparatus" of the present invention.

As shown in fig. 1, the appearance inspection apparatus 100 of the present embodiment is an apparatus that takes an image of a printed circuit board (hereinafter referred to as "board") 110 during or after manufacture in a board manufacturing process as an inspection target and performs various inspections of the board 110 and an electronic component 111 (see fig. 2) on the board 110. The appearance inspection apparatus 100 constitutes a part of a substrate manufacturing line for mounting an electronic component 111 on a substrate 110 to manufacture a circuit substrate. The substrate 110 is an example of the "measurement target" of the present invention.

As an outline of the substrate manufacturing process, first, solder (solder paste) is printed (applied) in a predetermined pattern on the substrate 110 having the wiring pattern formed thereon by a solder printing apparatus (not shown) (solder printing step). Next, the electronic component 111 is mounted (mounted) on the substrate 110 after solder printing by a surface mounting machine (not shown) (mounting step), whereby the terminal portions of the electronic component 111 are arranged on the solder. Then, the mounted substrate 110 is carried to a reflow furnace (not shown) to melt and solidify (cool) solder (reflow step), and the terminal portions of the electronic components 111 are soldered to the wiring of the substrate 110. Thereby, the electronic component 111 is fixed on the substrate 110 in a state of being electrically connected to the wiring, and the substrate manufacturing is completed.

The appearance inspection apparatus 100 is used for, for example, inspection of a printed state of solder on the substrate 110 after a solder printing process, inspection of a mounted state of the electronic component 111 after a mounting process, inspection of a mounted state of the electronic component 111 after a reflow process, or the like. Therefore, the appearance inspection apparatus 100 is provided in one or more substrate production lines. As the printing state of the solder, inspection of a printing position shift from a printing position on a design, a shape, volume, and height (coating amount) of the solder, presence or absence of bridging (short circuit), and the like is performed. As the mounting state of the electronic component 111, an inspection is performed as to whether the type and orientation (polarity) of the electronic component 111 are appropriate, whether the positional deviation amount of the electronic component 111 from the mounting position in design is within an allowable range, whether the solder bonding state of the terminal portion is normal, or the like. Further, as a common inspection content between the respective steps, detection of foreign matter such as dust or other adhering matter is also performed.

As shown in fig. 1, the appearance inspection apparatus 100 includes: a substrate transport conveyor 10 for transporting a substrate 110; a head moving mechanism 20 movable in the XY direction (horizontal direction) and the Z direction (vertical direction) above the substrate transport conveyor 10; a first measuring unit 30 and a second measuring unit 40 held by the head moving mechanism 20; and a control device 50 for controlling the appearance inspection device 100. The control device 50 is an example of the "control unit" of the present invention.

The substrate transport conveyor 10 is configured to be able to transport the substrate 110 in the horizontal direction, and stop and hold the substrate 110 at a predetermined inspection position. The substrate transport conveyor 10 is configured to transport the inspected substrate 110 in the horizontal direction from a predetermined inspection position, and to transport the substrate 110 out of the appearance inspection apparatus 100.

The head moving mechanism 20 is provided above the substrate transport conveyor 10, and is constituted by, for example, an orthogonal three-axis (XYZ-axis) robot using a ball screw axis and a servo motor. The head moving mechanism 20 includes an X-axis motor, a Y-axis motor, and a Z-axis motor for driving the X-axis, the Y-axis, and the Z-axis. The head moving mechanism 20 is configured to be able to move the first measuring unit 30 and the second measuring unit 40 in the XY direction (horizontal direction) and the Z direction (vertical direction) above the substrate transport conveyor 10 (substrate 110) by the X-axis motor, the Y-axis motor, and the Z-axis motor.

The first measurement unit 30 is configured to measure three-dimensional information by a phase shift method. The first measurement unit 30 includes a first imaging unit 31 and a first projection unit 32. The first measuring unit 30 is moved to a predetermined position above the substrate 110 by the head moving mechanism 20, and the first imaging unit 31, the first projecting unit 32, and the like are used, whereby the first measuring unit 30 is configured to perform imaging for appearance inspection of the substrate 110 and the electronic component 111 and the like on the substrate 110.

The first imaging unit 31 is configured to image the substrate 110 irradiated with the stripe pattern light by the first projecting unit 32. The first image pickup unit 31 includes an image pickup device such as a CCD image sensor or a CMOS image sensor. The first imaging unit 31 is configured to be able to image the substrate 110 in an imaging region having a substantially rectangular shape. The first imaging unit 31 is arranged with an optical axis 311 in a direction perpendicular to a reference plane in the horizontal direction. That is, the first imaging unit 31 is configured to image a two-dimensional image of the upper surface of the substrate 110 from a substantially vertically upward position. The first imaging unit 31 obtains a two-dimensional image under the illumination light from the first projection unit 32.

The first projecting section 32 is provided in plurality. Each of the plurality of first projecting units 32 is configured to project the first measurement pattern imaged by the first imaging unit 31 from a direction inclined with respect to the direction of the optical axis 311 of the first imaging unit 31. That is, the first measurement unit 30 is configured to measure three-dimensional information by projecting the first measurement pattern from a plurality of directions. As shown in fig. 3, a plurality of (4) first projection units 32 are arranged so as to surround the periphery of the first imaging unit 31 when viewed from above. The 4 first projecting units 32 are arranged at substantially equal angular (substantially 90 degrees) intervals at positions equidistant from the imaging center (first imaging unit 31). The 4 first projecting units 32 are configured to project the first measurement patterns from the a1 direction, the a2 direction, the A3 direction, and the a4 direction, respectively. As shown in fig. 1, the first projecting unit 32 is configured to project the first measurement patterns from directions inclined with respect to the optical axis 311 of the first imaging unit 31. The first projection unit 32 is configured to project a grid-like light and dark pattern (stripe pattern light) having an equal interval of a sinusoidal light intensity distribution as a first measurement pattern. The first projection unit 32 is configured to project the light and dark patterns so that the positions (phases) of the light and dark patterns are shifted.

The second measurement unit 40 is configured to measure three-dimensional information by a light section method. The second measuring unit 40 includes a second imaging unit 41 and a second projecting unit 42. The second measuring unit 40 is moved to a predetermined position above the substrate 110 by the head moving mechanism 20, and the second imaging unit 41, the second projecting unit 42, and the like are used, whereby the second measuring unit 40 is configured to perform imaging for appearance inspection of the substrate 110 and the electronic component 111 and the like on the substrate 110.

The second imaging unit 41 is configured to image the substrate 110 irradiated with the linear pattern light by the second projecting unit 42. The second image pickup unit 41 includes an image pickup device such as a CCD image sensor or a CMOS image sensor. The second imaging unit 41 is arranged with an optical axis in a direction inclined with respect to a vertical direction of a reference plane in the horizontal direction. As shown in fig. 2, the second imaging unit 41 has a telecentric optical system 411. The telecentric optical system 411 is configured to cause light parallel to the optical axis to enter the second image pickup unit 41.

The second projection unit 42 is disposed at a position in a direction in which the optical axis of the second imaging unit 41 is regularly reflected with respect to a reference surface in the horizontal direction. The second projecting unit 42 is configured to project a linear second measurement pattern imaged by the second imaging unit 41. The second projection unit 42 is configured to irradiate laser light. The second projection unit 42 is configured to irradiate laser light on a beam telecentrically (in parallel). The second projecting unit 42 and the second imaging unit 41 are configured to image the substrate 110 while scanning (moving) the linear laser beam. As shown in fig. 2, the second projecting section 42 is disposed with the optical axis inclined at an angle θ with respect to the vertical direction. The second imaging unit 41 is disposed with the optical axis inclined at an angle θ with respect to the vertical direction on the opposite side of the second projection unit 42 with respect to the vertical direction. Thus, even when the electronic component 111 is configured by a mirror surface and the second measurement pattern is substantially totally reflected, the second imaging unit 41 can image the second measurement pattern.

As shown in fig. 1, the control device 50 is configured to control each part of the appearance inspection device 100. The control device 50 includes a control unit 51, a storage unit 52, an image processing unit 53, an imaging control unit 54, a projection control unit 55, and a motor control unit 56.

The control unit 51 includes a processor such as a CPU (central processing unit) that performs logical operations, a ROM (Read Only Memory) that stores programs and the like for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. The control unit 51 is configured to control the respective units of the appearance inspection apparatus 100 via the image processing unit 53, the imaging control unit 54, the projection control unit 55, and the motor control unit 56 in accordance with a program stored in the ROM and software (program) stored in the storage unit 52. The control unit 51 controls the first measuring unit 30 and the second measuring unit 40 to perform various kinds of visual inspections on the substrate 110.

The storage unit 52 is a nonvolatile storage device capable of storing various data and reading data by the control unit 51. The storage unit 52 stores captured image data captured by the first imaging unit 31 and the second imaging unit 41, board data defining position information on the design of the electronic component 111 mounted on the board 110, a component shape database defining the shape of the electronic component 111 mounted on the board 110, information on the projection patterns (the first measurement pattern and the second measurement pattern) generated by the first projection unit 32 and the second projection unit 42, and the like. The control unit 51 performs inspection of solder on the substrate 110, inspection of a mounting state of the electronic component 111 mounted on the substrate 110, inspection of the completed substrate 110, and the like based on three-dimensional (three-dimensional shape) inspection by three-dimensional shape measurement performed by the first measurement unit 30 and the second measurement unit 40.

The image processing unit 53 is configured to perform image processing on the captured images (captured signals) captured by the first imaging unit 31 and the second imaging unit 41, and generate image data suitable for recognition (image recognition) of the electronic component 111 and the solder joint (solder) of the substrate 110.

The imaging control unit 54 is configured to read the imaging signals from the first imaging unit 31 and the second imaging unit 41 at a predetermined timing based on the control signal output from the control unit 51, and to output the read imaging signals to the image processing unit 53. The projection control unit 55 is configured to control the projection by the first projection unit 32 and the second projection unit 42 based on a control signal output from the control unit 51.

The motor control unit 56 is configured to control the driving of the servo motors (the X-axis motor, the Y-axis motor, and the Z-axis motor of the head moving mechanism 20, the motor (not shown) for driving the substrate transport conveyor 10, and the like) of the appearance inspection apparatus 100 based on the control signal output from the control unit 51. The motor control unit 56 is configured to acquire the positions of the first measuring unit 30, the second measuring unit 40, the substrate 110, and the like based on signals from encoders (not shown) of the respective servo motors.

Here, in the present embodiment, the control device 50 is configured to acquire three-dimensional information of the measurement target based on the measurement results of both the first measurement unit 30 and the second measurement unit 40.

Specifically, as shown in fig. 4, the control device 50 acquires height information indicating the height at each position and reliability information indicating the reliability of the height information at each position based on the measurement by the first measurement unit 30. Further, the control device 50 acquires the height information and the reliability information based on the measurement by the second measurement unit 40. The control device 50 is configured to acquire one piece of height information based on the height information and the reliability information acquired by the measurement by the first measurement unit 30 and the height information and the reliability information acquired by the measurement by the second measurement unit 40.

First, the control device 50 acquires the photocutting height information by the photocutting method of the second measuring unit 40. The second measuring unit 40 performs laser scanning with a predetermined scanning width to measure three-dimensional information of the entire substrate 110. The height information contains numerical information about the height for each position (corresponding to each pixel). Further, the control device 50 acquires the light cutoff reliability information. The reliability information contains, for each position (corresponding to each pixel), information on the reliability of the height at that position. For example, the information on the reliability is classified into three levels of high, medium, and low.

Next, the control device 50 acquires phase shift height information by the phase shift method of the first measurement unit 30. The first measuring unit 30 sequentially images the necessary positions on the substrate 110. In this case, since the first measuring unit 30 performs imaging by the first imaging unit 31 while performing projection by the 4 first projection units 32, 4 pieces of height information and reliability information can be obtained for one position. That is, the control device 50 acquires a plurality of pieces of height information and reliability information based on the measurement by the first measurement unit 30.

The control device 50 is configured to acquire one piece of height information based on the plurality of pieces of height information and the plurality of pieces of reliability information acquired by the measurement by the first measurement unit 30 and the height information and the reliability information acquired by the measurement by the second measurement unit 40.

In the phase shift method of the first measurement unit 30, a grid-like bright and dark pattern (stripe pattern light) having a sine-wave light intensity distribution at equal intervals is projected onto a measurement object, a plurality of images in which the positions (phases) of the bright and dark pattern are shifted are captured, and the three-dimensional shape (height) of the measurement object is calculated based on the difference in pixel values of the same portion in the plurality of captured images.

In the phase shift method by the first measuring unit 30, the control device 50 is configured to acquire reliability information at each position based on a luminance difference generated by a plurality of measurements by the first measuring unit 30. That is, the control device 50 is configured to,reliability information is obtained based on luminance differences generated by a plurality of measurements of phase shifts. Specifically, when the phase is shifted by pi/2 and the image is captured 4 times, the luminance values are d0, d1, d2, and d 3. The phase shift angle α is calculated as α ═ atan ((d2-d0)/(d3-d 1)). The reliability R was calculated as R √ ((d2-d0)²+(d3-d1)²)。

In the light section method of the second measurement unit 40, linear light is projected onto a measurement object, an image is captured, and the three-dimensional shape (height) of the measurement object is calculated based on the distortion (parallax) of the line in the image. For example, as shown in fig. 5, the pattern on the upper surface of the electronic element 111 and the pattern on the upper surface of the substrate 110 are shifted from each other by a parallax P in the imaging plane. Using this parallax P, the height h of the electronic element 111 is calculated as h ═ P/2sin θ.

In the light-section method using the second measuring unit 40, the control device 50 is configured to acquire reliability information at each position based on the luminance value obtained by the measurement using the second measuring unit 40. Specifically, as shown in fig. 6, when an electronic element 111 having a mirror surface is mounted on the substrate 110, the laser light reflected by the electronic element 111 is reflected by the mirror surface and reaches the second imaging unit 41. In this case, as shown in fig. 7, the peak value of the luminance value on the same line becomes large. When the peak value of the luminance value is greater than "high" of the reliability determination threshold, the control device 50 sets the reliability of the height information at the position to "high".

As shown in fig. 6, the laser light reflected by the substrate 110 is diffusely reflected and reaches the second imaging unit 41. In this case, as shown in fig. 7, the peak values of the luminance values on the same line become medium. When the peak value of the luminance value is equal to or greater than "high" and "medium" of the reliability determination threshold, the control device 50 sets the reliability of the height information at the position to "medium". The position where the reliability is "middle" also includes positions of members other than the mirror surface.

As shown in fig. 6, the laser light does not reach the second image pickup unit 41 at the portion shaded by the electronic component 111. In this case, as shown in fig. 7, the peak value of the luminance value on the same line becomes low. When the peak value of the luminance value is smaller than "medium" of the reliability determination threshold value, the control device 50 sets the reliability of the height information at the position to "low". In addition, the position where the reliability is "low" includes a shadow, a hole, a depression, and the like of the electronic component 111. Further, by changing the light amount of the laser beam in the second projection unit 42 to be larger, the brightness of the reflected light on the surface of the substrate 110 can be made high and the reliability can be improved. However, in this case, since the brightness of the reflected light of the mirror surface is too high, the light receiving state of the second imaging unit 41 is saturated, and there is a possibility that accurate measurement cannot be performed. Therefore, the light amount of the laser beam is preferably set to an appropriate light amount with high reliability, in which the brightness of the reflected light on the mirror surface is sufficient for measurement, and the light receiving state of the second imaging unit 41 is not saturated. In this case, the brightness of the reflected light is reduced on the surface of the substrate 110 and the upper surface of the member which is not a mirror surface, and the reliability is likely to be at an intermediate level. In some cases, both the reflected light from the mirror surface and the reflected light from the surface of the substrate 110 may have high reliability and may have a low light receiving state of the camera.

As shown in fig. 8, the control device 50 is configured to determine whether the projection shape based on the measurement result of the first measurement unit 30 is noise or a structure based on the measurement result of the second measurement unit 40. That is, as shown in fig. 8, when the projection shape observed by the phase shift method is not observed by the light section method, the control device 50 determines that it is noise and removes it. When the projection shape is observed by the phase shift method and also observed by the light section method, the control device 50 determines that the projection shape is a structure (electronic element 111) and is not a target for noise removal. For example, noise in the phase shift method is generated by a curved surface whose periphery is reflected on a solder fillet. Specifically, the solder fillet of the component joint portion becomes a curved surface of a half mirror surface. The peripheral substrate 110 surface or the component is reflected on the solder fillet portion together with the stripe pattern. Therefore, phase fringes of the surrounding environment are observed at the solder fillet portion, which becomes a factor of noise.

In addition, noise in the phase shift method is also generated by multiple reflections. For example, the stripes reflected by the side surfaces of the component are projected onto the surrounding substrate 110 surface or component (secondary reflection stripes). In this case, the secondary streak overlaps the primary streak in this region, and becomes a factor of noise. The generation of noise as described above is considered to be a factor in measuring a plurality of measurement values of different heights.

As shown in fig. 9 to 11, the control device 50 is configured to supplement the height information measured by the second measuring unit 40, which has a low degree of reliability, with the height information measured by the first measuring unit 30. Specifically, the control device 50 supplements the height information at a position with low reliability where the laser beam of the second projecting unit 42 is a shadow, using the height information measured by the phase shift method of the first measuring unit 30.

The controller 50 compares the heights of the regions B1 to B4 around the shadow region to determine which direction the shadow is projected. The control device 50 is configured to exclude the measurement result from the direction in which the shadow is formed and supplement the height information when it is estimated that the direction in which the first measurement unit 30 projects the first measurement pattern is in the shadow due to the measurement target.

Specifically, as shown in fig. 10, when the height of the region B2(B4) on the right side of the shadow region is higher than the region B1(B3) on the left side, the controller 50 determines that the projection from the right side is a shadow. That is, as shown in fig. 11, the control device 50 determines that the projection from the first projecting part 32 in the a1 direction is a shadow. In this case, in the shadow area, the image obtained by imaging the projection from the first projecting unit 32 in the a1 direction is not used for image supplement (integration).

When the height of the left region B1(B3) is higher than the right region B2(B4) in the shadow region, the controller 50 determines that the projection from the left side is a shadow. That is, the control device 50 determines that the projection from the first projecting section 32 in the direction a3 is a shadow. In this case, in the shadow area, the image obtained by imaging the projection from the first projecting unit 32 in the a3 direction is not used for image supplement (integration).

When the height of the left region B1(B3) of the shadow region is the same as the height of the right region B2(B4), the controller 50 determines that the projection from the right side and the projection from the left side are shadows. That is, the control device 50 determines that the projections from the first projecting part 32 in the a1 direction and the A3 direction are shadows. In this case, in the shaded area, the image obtained by imaging the projections from the first projector 32 in the a1 direction and the A3 direction is not used for image supplement (integration).

Further, the control device 50 is configured to perform the following control: the measurement is performed by the second measurement unit 40 before the measurement by the first measurement unit 30. Further, the control device 50 is configured to perform the following control: the measurement height position of the first measurement unit 30 is adjusted based on the measurement result of the second measurement unit 40. That is, the control device 50 adjusts the height position of the first measuring unit 30 to a position at which the imaging by the first measuring unit 30 is easily focused, based on the height position of the substrate 110 measured by the second measuring unit 40.

The control device 50 is configured to perform measurement by the second measurement unit 40 before the measurement by the first measurement unit 30, and to acquire the plane position information of the measurement target based on the measurement result by the second measurement unit 40. The control device 50 is configured to perform control for adjusting the plane position measured by the first measuring unit 30. Specifically, the control device 50 recognizes the reference mark of the substrate 110 based on the image pickup by the second measuring unit 40. Then, the control device 50 adjusts the position in the horizontal direction measured by the first measuring unit 30 based on the recognized reference mark.

The control device 50 is configured to integrate a plurality of measurement values (height information) measured by the first measurement unit 30 and measurement values (height information) measured by the second measurement unit 40 at each position (pixel of interest) to obtain one measurement value (height information). For example, as shown in fig. 12, the control device 50 groups and integrates the measurement values (height information) (P1, P2, P3, and P4) measured by the first measurement unit 30 and the measurement values (height information) (L1) measured by the second measurement unit 40. In the grouping, measurement values within the inter-data range threshold are set as the same group centering on each measurement value. The set of measurement values L1 was a set of only measurement values L1 (one piece of data). The set of measurement values P1 is the set of measurement values P1 and P2 (two data). The group of measurement values P2 is the group of measurement values P1, P2 and P3 (three data). The set of measurement values P3 is the set of measurement values P2 and P3 (two data). The measurement value P4 was composed of only the measurement value P4 (one piece of data).

Among the groups of measured values L1 and P1 to P4, the group having the largest amount of data was measured value P2. Therefore, the control device 50 integrates the average of the measurement values of the group having the largest number of data (the group of measurement values P2) as the measurement value obtained by integrating the height information. That is, the integrated measurement value H is calculated as (P1+ P2+ P3)/3.

The control device 50 is configured to integrate the measurement values (height information) at the respective positions (target pixels) based on the reliability of the measurement values (height information) measured by the second measurement unit 40. For example, as shown in fig. 13, when the reliability of the measurement value L1 measured by the second measurement unit 40 is low, the control device 50 excludes the measurement value L1 of the second measurement unit 40 having low reliability, and integrates the measurement values P1 to P4 of the first measurement unit 30 having reliability within the effective range. Specifically, the control device 50 integrates the average of a plurality of measurement values extracted according to the set tolerance among the measurement values P1 to P4 as the measurement value obtained by integrating the height information. In the case of the example of fig. 13, since the distance between the measurement values P1 and P2 is within the tolerance range, the integrated measurement value H is calculated as (P1+ P2)/2.

As shown in fig. 14, when the reliability of the measurement value L1 measured by the second measurement unit 40 is medium, the control device 50 integrates the average of the measurement values within the tolerance around the measurement value L1 as the measurement value after integrating the height information. This is the case where the measurement value by the second measurement unit 40 using the light section method is most reliable. In the case of the example of fig. 14, since the measurement values P3 and P4 are within the tolerance of the measurement value L1, the integrated measurement value H is calculated as (P3+ P4+ L1)/3.

As shown in fig. 15, even if the reliability of the measurement value L1 measured by the second measurement unit 40 is medium to high, the control device 50 integrates the measurement values after excluding the measurement value L1 in consideration of the collective state of the measurement values P1 to P4 measured by the first measurement unit 30. In the example of fig. 15, the measurement values P1 to P3 are grouped in the range of tolerance, which is the majority of the measurement values P1 to P4. Thus, the measured value L1, which is a distance to the measured values P1 to P3 to a tolerance or more, is an outlier. Similarly, the measured value P4, which is separated from the measured values P1 to P3 by a tolerance or more, is also an outlier. The integrated measurement value H was calculated as (P1+ P2+ P3)/3.

(explanation of three-dimensional information acquisition processing)

Next, a three-dimensional information acquisition process performed by the control device 50 will be described with reference to fig. 16.

In step S1 of fig. 16, the substrate 110 is carried in by the substrate transport conveyor 10. In step S2, the second measurement unit 40 performs light-section imaging. In this case, the entire substrate 110 is scanned (imaged).

In step S3, the field of view for imaging by the first measurement unit 30 is moved. In step S4, the first measurement unit 30 performs phase shift imaging in the field of view after the movement.

In step S5, height information of the imaged field of view is synthesized. In step S6, the first measurement unit 30 determines whether or not imaging of all the fields of view is completed. If the image capturing of all the fields of view is not completed, the process returns to step S3. If the image capturing of all the fields of view is completed, the process proceeds to step S7.

In step S7, the substrate 110 is carried out by the substrate transport conveyor 10. Then, the three-dimensional information acquisition process is ended.

(description of information composition processing for height of each field of view (first example))

With reference to fig. 17, the field height information-by-field combining process (first example) in step S5 in fig. 16 performed by the control device 50 will be described.

In step S11 of fig. 17, an image (height information) in which the phase-shifted images in the respective directions are integrated is created. Specifically, height information is created by integrating phase-shifted images captured from 4 directions.

In step S12, the reliability of the pixel of interest of the integrated image by the phase shift method is determined. If the reliability of the pixel of interest is low, the process proceeds to step S13, and if the reliability of the pixel of interest is high, the process proceeds to step S17.

In step S13, the reliability of the pixel of interest in the image obtained by the light section method is determined. If the reliability of the pixel of interest is low, the process proceeds to step S14, and if the reliability of the pixel of interest is high, the process proceeds to step S15. In step S14, the height information of the pixel of interest is deleted (no value).

In step S15, the height information of the target pixel is replaced with the measurement value of the image by the light section method. In step S16, it is determined whether or not the synthesis (integration) of the height information of all the pixels in the field of view is completed. If so, the each-field-height information synthesis process is ended. If not, the flow proceeds to step S17.

In step S17, the synthesis processing of the height information is switched to the next pixel. Then, the process returns to step S12.

(description of Each field of View height information composition processing (second example))

With reference to fig. 18, description will be made of the per-view-field height information combining process (second example) in step S5 of fig. 16 performed by the control device 50.

In step S21 in fig. 18, the reliability of the target pixel in the image obtained by the light section method is determined. If the reliability of the pixel of interest is high, the process proceeds to step S22, if the reliability of the pixel of interest is medium, the process proceeds to step S23, and if the reliability of the pixel of interest is low, the process proceeds to step S24. In step S22, the height information of the target pixel is set as the measurement value of the image by the light section method. Then, the process proceeds to step S25.

In step S23, a measurement value obtained by combining (integrating) the measurement value of the phase shift method image and the measurement value of the light-section method image in each direction is calculated. Then, the calculated measurement value is used as height information of the pixel of interest. Then, the process proceeds to step S25. In step S24, the measurement values obtained by combining (integrating) the measurement values of the images of the phase shift method in each direction are calculated. Then, the calculated measurement value is used as height information of the pixel of interest. Then, the process proceeds to step S25.

In step S25, it is determined whether or not the synthesis (integration) of the information of all the pixels in the field of view is completed. If so, the each-field-height information synthesis process is ended. If not, the flow proceeds to step S26. In step S26, the synthesis processing of the height information is switched to the next pixel. Then, the process returns to step S21.

(description of integration of images)

The image integration process performed by the control device 50 will be described with reference to fig. 19. In the integration processing of the images, processing is performed to integrate (synthesize) the measured height information (measurement values) at each position.

In step S31 of fig. 19, the data of the height information having low reliability is excluded from the objects to be integrated. In step S32, the number of valid data is determined. If the number of valid data is 2 or more, the process proceeds to step S33, if the number of valid data is 1, the process proceeds to step S39, and if the number of valid data is 0, the process proceeds to step S40.

In step S33, as shown in fig. 12, the valid data is grouped according to the inter-data range threshold. That is, valid data within the inter-data range threshold is set as one group centering on a certain valid data. The maximum number of groups of valid data is generated. In step S34, it is determined whether or not there are a plurality. If there are no groups having the largest number of data (if there is one group), the process proceeds to step S35, and if there are groups having the largest number of data, the process proceeds to step S36.

In step S35, the average value of the measurement values of the group having the largest number of data is set as the integrated measurement value. Then, the integration processing of the images is ended.

In step S36, it is determined whether or not there is a group including the measurement values by the light section method. If there is no group including the measurement values by the light section method, the routine proceeds to step S37, and if there is a group including the measurement values by the light section method, the routine proceeds to step S38. In step S37, the average value of the measurement values of the group having the smallest total distance between the plurality of data in the group is set as the integrated measurement value. Then, the integration processing of the images is ended.

In step S38, the average value of the measurement values of the group including the measurement values by the light section method is defined as the integrated measurement value. Then, the integration processing of the images is ended.

In step S39, the one valid data left without being excluded is used as the integrated measurement value. Then, the integration processing of the images is ended.

In step S40, the height information of the pixel of interest is deleted (no value). Then, the integration processing of the images is ended.

(effects of the embodiment)

In the present embodiment, the following effects can be obtained.

In the present embodiment, since the measurement object is measured by both the light section method and the phase shift method as described above, even at a position where the irradiation of light by the light section method becomes a shadow, the height information can be supplemented by the measurement by the phase shift method. Further, since the three-dimensional information can be acquired by a plurality of methods based on the light section method and the phase shift method, the accuracy of acquiring the three-dimensional information can be improved. This makes it possible to measure three-dimensional information of a measurement object with high accuracy.

In the present embodiment, as described above, the first measurement unit 30 includes: a first imaging unit 31 having an optical axis arranged in a direction perpendicular to a reference plane; the plurality of first projecting units 32 project the first measurement pattern imaged by the first imaging unit 31 from a direction inclined with respect to the optical axis direction of the first imaging unit 31. The second measurement unit 40 includes: a second imaging unit 41 having a telecentric optical system 411, in which an optical axis is arranged in a direction inclined with respect to a vertical direction of the reference plane; the second projecting unit 42 is disposed at a position in a direction in which the optical axis of the second imaging unit 41 is regularly reflected with respect to the reference surface, and projects a linear second measurement pattern imaged by the second imaging unit 41. Thus, even if the measurement object is a reflection surface such as a mirror surface or a glass surface, the second imaging unit 41 arranged at a position in the direction in which the second measurement pattern projected from the second projection unit 42 is regularly reflected can reliably perform imaging. Further, since the second imaging unit 41 has the telecentric optical system 411, it is possible to perform parallel imaging without deforming the second measurement pattern reflected by the reflection surface of the measurement object by the optical system. Thus, three-dimensional information can be measured with high accuracy even for a measurement object having a reflection surface. Further, by providing a plurality of first projecting units 32 in the first measuring unit 30, a plurality of directions in which the first measurement pattern is projected can be set. Thus, even in a case where a shadow is generated in projection from one direction at a certain position, it is possible to suppress generation of a shadow in projection from another direction. This enables reliable measurement of three-dimensional information at a certain position.

In the present embodiment, as described above, the control device 50 is configured to acquire one piece of height information based on the height information and the reliability information acquired by the measurement by the first measurement unit 30 and the height information and the reliability information acquired by the measurement by the second measurement unit 40. Thus, even when the height information obtained by the measurement by the first measurement unit 30 is greatly different from the height information obtained by the measurement by the second measurement unit 40, one height information having higher reliability can be obtained based on the respective reliability information.

In the present embodiment, as described above, the control device 50 is configured to acquire one piece of height information based on the plurality of pieces of height information and the plurality of pieces of reliability information acquired by the measurement by the first measurement unit 30 and the height information and the reliability information acquired by the measurement by the second measurement unit 40. Thus, since the first measurement unit 30 using the phase shift method acquires a plurality of pieces of height information, it is possible to acquire one piece of height information with higher reliability.

In the present embodiment, as described above, the control device 50 is configured to supplement the height information having low reliability of the reliability information measured by the second measuring unit 40 with the height information measured by the first measuring unit 30. Thus, even when the reliability is lowered by the influence of shading or the like in the measurement by the second measuring unit 40 using the light section method, the height information can be supplemented by the measurement by the first measuring unit 30 using the phase shift method.

In the present embodiment, as described above, the control device 50 is configured to exclude the measurement result from the direction in which the first measurement unit 30 projects the first measurement pattern and supplement the height information when it is estimated that the direction in which the first measurement unit 30 projects the first measurement pattern is a shadow due to the measurement target. Accordingly, since the measurement result of the projection direction in which the accuracy is low due to the influence of the shadow in the projection directions of the plurality of first measurement patterns can be excluded, the height information measured by the second measurement unit 40 using the light section method can be supplemented with higher accuracy from the plurality of height information measured by the first measurement unit 30 using the phase shift method.

In the present embodiment, as described above, the control device 50 is configured to acquire reliability information at each position based on the luminance difference generated by the plurality of measurements by the first measurement unit 30. This makes it possible to easily obtain reliability information based on the luminance difference generated by the plurality of measurements by the first measurement unit 30 using the phase shift method.

In the present embodiment, as described above, the control device 50 is configured to acquire reliability information at each position based on the luminance value obtained by the measurement by the second measurement unit 40. This makes it possible to easily acquire reliability information based on the luminance value measured by the second measuring unit 40 using the light section method.

In the present embodiment, as described above, the control device 50 is configured to determine whether the projection shape based on the measurement result of the first measurement unit 30 is noise or a structure based on the measurement result of the second measurement unit 40. Thus, the virtual image appearing in the projected shape by the image pickup by the phase shift method of the first measurement unit 30 can be determined as noise by the light section method of the second measurement unit 40, and therefore, by removing the noise, the height information can be acquired with higher accuracy.

In the present embodiment, as described above, the control device 50 is configured to perform the following control: the measurement is performed by the second measuring unit 40 before the measurement by the first measuring unit 30, and the measurement height position of the first measuring unit 30 is adjusted based on the measurement result by the second measuring unit 40. Thus, the measurement height position of the first measurement unit 30 using the phase shift method can be adjusted to be along the three-dimensional shape of the measurement object based on the three-dimensional information measured by the second measurement unit 40 using the light section method, and therefore, the image can be easily focused.

In the present embodiment, as described above, the control device 50 is configured to perform the following control: the second measurement unit 40 performs measurement before the measurement by the first measurement unit 30, obtains the planar position information of the measurement object based on the measurement result by the second measurement unit 40, and adjusts the planar position of the measurement performed by the first measurement unit 30. This makes it possible to omit the operation of acquiring the plane position information by the first measurement unit 30 using the phase shift method, and therefore, it is possible to suppress the time required for the measurement operation from becoming longer than the case of acquiring the plane position information again by the first measurement unit 30.

(modification example)

The embodiments disclosed herein are illustrative in all respects, and should not be construed as being limiting. The scope of the present invention is defined by the claims rather than the description of the above embodiments, and includes all modifications (variations) within the meaning and scope equivalent to the claims.

For example, in the above-described embodiment, the second projection unit is disposed at a position in a direction in which the optical axis of the second imaging unit is regularly reflected with respect to the reference surface. In the present invention, as in the first modification of the embodiment shown in fig. 20, the second imaging unit 41 may be disposed so as to have an optical axis in a direction perpendicular to the reference plane, and the second projection unit 42 may be disposed in a direction inclined at a predetermined angle with respect to the optical axis of the second imaging unit 41.

As in the second modification of the embodiment shown in fig. 21, the second imaging unit 41 may be disposed so as to have an optical axis in a direction perpendicular to the reference plane, and the plurality of second projection units 42 may be disposed in a direction inclined at a predetermined angle with respect to the optical axis of the second imaging unit 41.

In the above-described embodiment, the first imaging unit in which the optical axis is arranged in the direction perpendicular to the reference plane and the plurality of first projection units in which the optical axis is arranged in the direction inclined with respect to the optical axis direction of the first imaging unit are provided in the first measurement unit. In the present invention, as in the third modification of the embodiment shown in fig. 22, the first measurement unit 30 may be provided with a first projection unit 32 in which the optical axis is arranged in a direction perpendicular to the reference plane, and a plurality of first imaging units 31 in which the optical axis is arranged in a direction inclined with respect to the optical axis direction of the first projection unit 32. In this case, the telecentric optical system 321 may be provided in the first projection unit 32. Thereby, the first measurement pattern is projected perpendicularly to the reference plane. As a result, the occurrence of secondary streaks can be suppressed because secondary reflection can be suppressed. In addition, a plurality of first imaging units 31 may be arranged so as to surround the periphery of the first projection unit 32 when viewed from above. The plurality of first image pickup units 31 may be arranged at substantially equal angular intervals at equal distances from the projection center (first projection unit 32). Thus, by simultaneously performing imaging by the plurality of first imaging units 31, the imaging time can be shortened as compared with the case of performing imaging individually. That is, even if the imaging direction is increased, the increase of the imaging time can be suppressed.

In the above-described embodiments, the three-dimensional measurement device according to the present invention is applied to the appearance inspection device for inspecting the substrate, but the present invention is not limited thereto. The present invention can also be applied to other three-dimensional measurements such as a foreign matter inspection device, a solder printing inspection device, and a component inspection device. In addition, the present invention can also be applied to apparatuses other than the inspection substrate.

In the above-described embodiment, the example in which the 4 first projecting units are provided in the first measuring unit is shown, but the present invention is not limited to this. In the present invention, a single or a plurality of first projecting units other than 4 first measuring units may be provided.

In the above-described embodiment, the second imaging unit has a telecentric optical system and the second projection unit projects light telecentrically, but the present invention is not limited to this. In the present invention, the second projecting unit may project diffused light that is not telecentric, or the second imaging unit may not have a telecentric optical system.

In the above-described embodiment, an example in which the reliability information of the second measurement unit is classified into three levels, i.e., high, medium, and low is shown, but the present invention is not limited to this. In the present invention, the reliability information of the second measurement unit may be divided into two levels or four levels or more. The reliability information of the second measurement unit may be a non-rank numerical value.

In the above-described embodiment, for convenience of explanation, the control process of the control device (control unit) is described using a flow-driven process in which processes are sequentially performed according to the process flow, but the present invention is not limited to this. In the present invention, the process of the control unit may be performed by an event-driven (event-driven type) process that executes the process in units of events. In this case, the event may be completely event-driven, or may be performed by combining event driving and flow driving.

Description of the reference symbols

30 first measuring part

31 first image pickup unit

32 first projection part

40 second measurement unit

41 second image pickup unit

42 second projection unit

50 control device (control unit)

100 visual inspection apparatus (three-dimensional measuring apparatus)

110 substrate (object to be measured)

111 electronic component

411 telecentric optical system