阅读说明：本技术 一种智能冷热杯垫 (Intelligent cold and hot cup mat ) 是由 王雨 钱美希 杨菊 肖昊燃 丛铭健 严成钢 刘鹏晖 王朋 张艳玲 刘文典 王彦超 于 2020-12-03 设计创作，主要内容包括：本发明公开了一种智能冷热杯垫,包括底座、半导体制冷片和杯套。底座上设有插座,半导体制冷片上设有第一插头和第二插头。第一插头、第二插头、插座的配合满足无论半导体制冷片以哪一面朝上的方式插入,第一插头均可以与正极连接,第二插头均可以与负极连接。本发明上设有半导体制冷片,其两面分别可以制冷或者制热。翻转半导体制冷片后,可以在不同季节对水杯进行加热或制冷。同时,本发明还设有压力传感器、温度传感器,可以智能探测杯垫上是否有水杯以及杯中水的温度,以达到智能开关和智能调节功率的效果。(The invention discloses an intelligent cold and hot cup mat which comprises a base, a semiconductor refrigerating piece and a cup sleeve. The base is provided with a socket, and the semiconductor refrigeration piece is provided with a first plug and a second plug. The cooperation of first plug, second plug, socket satisfies no matter what side up mode is inserted to the semiconductor refrigeration piece, and first plug all can be connected with anodal, and the second plug all can be connected with the negative pole. The invention is provided with the semiconductor refrigerating sheet, and two sides of the semiconductor refrigerating sheet can be respectively refrigerated or heated. After the semiconductor refrigerating sheet is turned over, the water cup can be heated or refrigerated in different seasons. Meanwhile, the intelligent power control system is also provided with a pressure sensor and a temperature sensor, so that whether the cup is on the cup mat or not and the temperature of water in the cup can be intelligently detected, and the effects of intelligent switching and intelligent power regulation are achieved.)

1. An intelligent cold and hot cup mat is characterized by comprising a base, a semiconductor refrigerating piece and a cup sleeve;

the base is divided into an upper layer, a middle layer and a lower layer, the side part of the upper layer is provided with a socket allowing a semiconductor refrigerating sheet to be inserted and a supporting part supporting the semiconductor refrigerating sheet, the middle layer is provided with a fan and a heat dissipation hole for dissipating heat of the semiconductor refrigerating sheet, the lower layer is provided with a power supply, a control circuit board and a control switch, the upper layer is communicated with the middle layer, and a partition plate is arranged between the middle layer and the lower layer;

the semiconductor refrigeration piece comprises a refrigeration surface and a heating surface, a first plug and a second plug which are respectively connected with a positive electrode and a negative electrode are arranged on one side of the semiconductor refrigeration piece, a socket matched with the first plug and the second plug is arranged on one side of the upper layer, four jacks are arranged on the socket, the positions of the first plug and the second plug on the semiconductor refrigeration piece are in an asymmetric design, the first plug, the second plug and the socket are matched to meet the requirement that the first plug can be connected with the positive electrode and the second plug can be connected with the negative electrode no matter which side of the semiconductor refrigeration piece is inserted upwards;

the cup sleeve is arranged at the top of the base, an elastic ring is arranged at the bottom of the cup sleeve, a pressure sensor is arranged on the elastic ring, and two temperature sensors are respectively arranged at the middle part and the upper part of the cup sleeve;

the pressure sensor, the temperature sensor, the socket, the fan and the control switch are electrically connected with the control circuit board and the power supply.

2. The intelligent hot and cold cup mat of claim 1, wherein the power supply and the control circuit board are arranged inside the lower layer, and the control switch is arranged on the side of the lower layer.

3. The intelligent hot and cold cup mat of claim 1, wherein the fan is disposed inside the middle layer, and the heat dissipation holes are disposed on the side of the middle layer.

4. The intelligent hot and cold cup mat of claim 1, wherein the plug is disposed on a side of the upper layer away from the socket.

5. The intelligent cold and hot cup mat according to claim 1, characterized in that the cup sleeve is provided with an opening for accommodating a handle of a teacup.

6. The intelligent cold and hot cup mat according to claim 1, wherein the cup sleeve is of a folding structure.

7. The intelligent hot and cold coaster of claim 1, wherein the control switch comprises a power switch and a power control knob.

8. The intelligent hot and cold cup mat of claim 1, wherein the power source is a rechargeable battery or a battery box, and when the power source is a rechargeable battery, the side of the lower layer is further provided with a charging socket.

Technical Field

The invention relates to the field of articles for daily use, in particular to an intelligent cold and hot cup mat.

Background

Nowadays, with the change of labor modes, more and more people are in office, and for daily office staff, a cup of tea water with proper temperature can not only supplement water required by the body, but also relieve the working pressure. In hot summer, summer heat can be dissipated by a cup of cool tea water or cold drink, however, when the tea water or the cold drink is placed on a table, the temperature is increased, the taste is affected, and in winter, hot water is easy to become cold, the cold dissipation effect is affected, so that the cup with the heating and refrigerating functions is needed.

Disclosure of Invention

The invention aims to overcome the problems and provides an intelligent hot and cold cup mat. In order to achieve the purpose, the invention adopts the following technical scheme:

an intelligent cold and hot cup mat comprises a base, a semiconductor refrigerating piece and a cup sleeve;

the base is divided into an upper layer, a middle layer and a lower layer, the side part of the upper layer is provided with a socket allowing a semiconductor refrigerating sheet to be inserted and a supporting part supporting the semiconductor refrigerating sheet, the middle layer is provided with a fan and a heat dissipation hole for dissipating heat of the semiconductor refrigerating sheet, the lower layer is provided with a power supply, a control circuit board and a control switch, the upper layer is communicated with the middle layer, and a partition plate is arranged between the middle layer and the lower layer;

the semiconductor refrigeration piece comprises a refrigeration surface and a heating surface, a first plug and a second plug which are respectively connected with a positive electrode and a negative electrode are arranged on one side of the semiconductor refrigeration piece, a socket matched with the first plug and the second plug is arranged on one side of the upper layer, four jacks are arranged on the socket, the positions of the first plug and the second plug on the semiconductor refrigeration piece are in an asymmetric design, the first plug, the second plug and the socket are matched to meet the requirement that the first plug can be connected with the positive electrode and the second plug can be connected with the negative electrode no matter which side of the semiconductor refrigeration piece is inserted upwards;

the cup sleeve is arranged at the top of the base, an elastic ring is arranged at the bottom of the cup sleeve, a pressure sensor is arranged on the elastic ring, and two temperature sensors are respectively arranged at the middle part and the upper part of the cup sleeve;

the pressure sensor, the temperature sensor, the socket, the fan and the control switch are electrically connected with the control circuit board and the power supply.

As an improvement, the power supply and the control circuit board are arranged inside the lower layer, and the control switch is arranged on the side part of the lower layer.

As an improvement, the fan is arranged in the middle layer, and the heat dissipation holes are formed in the side part of the middle layer.

As an improvement, the plug is arranged on one side of the upper layer far away from the socket.

As an improvement, the cup sleeve is provided with an opening for accommodating the handle of the teacup.

As an improvement, the cup sleeve is of a folding structure.

As an improvement, the control switch comprises a power switch and a power control knob.

As an improvement, the power supply is a rechargeable battery or a battery box, and when the power supply is the rechargeable battery, a charging socket is further arranged on the side portion of the lower layer.

The invention has the advantages that:

the invention is provided with the semiconductor refrigerating sheet, and two sides of the semiconductor refrigerating sheet can be respectively refrigerated or heated. After the semiconductor refrigerating sheet is turned over, the water cup can be heated or refrigerated in different seasons. Meanwhile, the intelligent power control system is also provided with a pressure sensor and a temperature sensor, so that whether the cup is on the cup mat or not and the temperature of water in the cup can be intelligently detected, and the effects of intelligent switching and intelligent power regulation are achieved.

Drawings

FIG. 1 is a structural diagram of an intelligent hot and cold coaster in embodiment 1;

FIG. 2 is a structural diagram of a base and a cup holder of the intelligent hot and cold coaster in embodiment 1;

FIG. 3 is a bottom view of the intelligent cooling and heating cup pad in embodiment 1;

FIG. 4 is a diagram showing a structure of a middle layer of the intelligent hot and cold coaster in embodiment 1;

fig. 5 is a structural diagram of a semiconductor refrigerating sheet of an intelligent hot and cold coaster in embodiment 1;

FIG. 6 is a block diagram of an intelligent hot and cold coaster socket according to embodiment 1;

fig. 7 is an internal structure view of an intelligent hot and cold coaster according to embodiment 1.

The labels in the figures illustrate:

1-base, 11-upper layer, 111-jack, 112-supporting part, 113-socket, 114-first jack, 115-second jack, 116-third jack, 117-fourth jack, 12-middle layer, 121-fan, 122-heat dissipation hole, 13-lower layer, 131-power supply, 132-control circuit board, 133-control switch, 134-charging jack, 14-partition board, 2-semiconductor refrigeration piece, 21-refrigeration surface, 22-heating surface, 23-first plug, 24-second plug, 3-cup sleeve, 31-elastic ring, 32-pressure sensor, 33-temperature sensor and 34-opening.

Detailed Description

The present invention will be described in detail and specifically with reference to the following examples so as to facilitate the understanding of the present invention, but the following examples do not limit the scope of the present invention.

Example 1

The embodiment discloses an intelligent cold and hot cup mat which comprises a base 1, a semiconductor refrigerating piece 2 and a cup sleeve 3.

The base 1 is divided into an upper layer, a middle layer and a lower layer. The side part of the upper layer 11 is provided with a socket 111 for allowing the semiconductor refrigerating piece 2 to be inserted and a supporting part 112 for supporting the semiconductor refrigerating piece; the middle layer 12 is provided with a fan 121 and a heat dissipation hole 122 for dissipating heat of the semiconductor cooling sheet 2. The fan 121 is disposed inside the middle layer 12, and the heat dissipation hole 122 is disposed at a side portion of the middle layer 12.

The lower layer 13 is provided with a power supply 131, a control circuit board 132 and a control switch 133, the power supply and the control circuit board are arranged inside the lower layer, and the control switch 133 comprises a power supply switch and a power control knob which are all arranged on the side part of the lower layer. The upper layer 11 is communicated with the middle layer 12, and a clapboard 14 is arranged between the middle layer 12 and the lower layer 13.

The semiconductor chilling plate 2 includes a chilling surface 21 and a heating surface 22. A first plug 23 and a second plug 24 which are respectively connected with the positive electrode and the negative electrode are arranged on one side of the semiconductor refrigeration sheet 21. The upper layer 11 is provided with a socket 113 matched with the first plug 23 and the second plug 24. The socket 113 is provided on the side of the upper layer 11 remote from the outlet 111.

The socket 113 is provided with four insertion holes, including a first insertion hole 114, a second insertion hole 115, a third insertion hole 116 and a fourth insertion hole 117, which are electrically connected to each other as "+", "-", "+". The positions of the first plug 23 and the second plug 24 on the semiconductor chilling plate 2 are designed asymmetrically. As shown in the figure, the side edge of the first plug 23, which is away from the same side of the refrigerating sheet 2, is 1cm, the side edge of the second plug 24, which is away from the same side of the refrigerating sheet 2, is 2cm, and the heating surface 22 is arranged on the semiconductor refrigerating sheet 2. At this time, when the semiconductor chilling plate 2 is inserted, the first jack 114 is electrically connected with the first plug 23, the second jack 115 is vacant, the third jack 116 is electrically connected with the second plug 24, and the fourth jack 117 is vacant. When the heating surface 22 is inserted downward, the first jack 114 is empty, the second jack 115 is electrically connected to the second plug 24, the third jack 116 is empty, and the fourth jack 117 is electrically connected to the first plug 23. The first plug 23, the second plug 24 and the socket 113 are matched in such a way that the first plug 23 can be connected with the positive pole and the second plug 24 can be connected with the negative pole no matter which face of the semiconductor chilling plate 2 is inserted upwards.

The cup sleeve 3 is arranged at the top of the base 1, the elastic ring 31 is arranged at the bottom of the cup sleeve 3, the pressure sensor 32 is arranged on the elastic ring 31, the cup sleeve 3 is of a folding structure, and the middle part and the upper part of the cup sleeve are respectively provided with two temperature sensors 33. The cup sleeve 3 is also provided with an opening 34 for accommodating a handle of the teacup.

The pressure sensor 32, the temperature sensor 33, the socket 113, the fan 121 and the control switch 132 are electrically connected to the control circuit board 132 and the power source 131.

In this embodiment, the power source 131 is a rechargeable battery, and a charging socket 134 is further disposed on the side of the lower layer 13.

The embodiments of the present invention have been described in detail above, but they are merely exemplary, and the present invention is not equivalent to the above described embodiments. Any equivalent modifications and substitutions to those skilled in the art are also within the scope of the present invention. Accordingly, it is intended that all equivalent alterations and modifications be included within the scope of the invention, without departing from the spirit and scope of the invention.