阅读说明：本技术 沿厚度方向具有超高导热系数的导热性片材 (Thermal conductive sheet having ultra-high thermal conductivity in thickness direction ) 是由 高文廷 范勇 于 2020-11-04 设计创作，主要内容包括：本发明涉及材料领域,沿厚度方向具有超高导热系数的导热性片材,包括呈片状的导热片,所述导热片包括位于竖直方向上的导热片层,各导热片层并排排布,相邻的两片导热片层之间是将导热片层粘合在一起的粘合树脂所形成的粘合树脂层。本发明通过对石墨片、石墨烯片等导热片层的有序化排列,使导热片沿厚度方向的导热系数可达50W/m·K以上,远远高于常规的导热界面材料；此外,通过导热片层和粘合树脂基体的复合,赋予导热片较低的界面热阻和沿厚度方向良好的回弹性,解决了石墨片、石墨烯片等导热片层无法应用到填充缝隙场合的难题。(The invention relates to the field of materials, in particular to a thermal conductive sheet with ultrahigh thermal conductivity coefficient along the thickness direction, which comprises a flaky thermal conductive sheet, wherein the thermal conductive sheet comprises thermal conductive sheet layers positioned in the vertical direction, the thermal conductive sheet layers are arranged side by side, and an adhesive resin layer formed by adhesive resin for bonding the thermal conductive sheet layers together is arranged between two adjacent thermal conductive sheet layers. According to the invention, through the ordered arrangement of the heat conducting sheet layers such as graphite sheets, graphene sheets and the like, the heat conductivity coefficient of the heat conducting sheet in the thickness direction can reach more than 50W/m.K, which is far higher than that of the conventional heat conducting interface material; in addition, through the compounding of the heat-conducting sheet layer and the adhesive resin matrix, the heat-conducting sheet is endowed with low interface thermal resistance and good rebound resilience along the thickness direction, and the problem that the heat-conducting sheet layers such as graphite sheets, graphene sheets and the like cannot be applied to the occasion of gap filling is solved.)

1. Have super high thermal conductivity's thermal conductive sheet along thickness direction, including being flaky conducting strip, its characterized in that, the conducting strip is including being located the ascending heat conduction lamellar of vertical side, and each heat conduction lamellar arranges side by side, is the bonding resin layer that bonding resin formed with the heat conduction lamellar together between two adjacent heat conduction lamellar.

2. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the sum of the volumes of the respective heat-conducting sheet layers in the same heat-conducting sheet is 30 to 80% of the volume of the heat-conducting sheet.

3. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the thickness of the thermal conductive sheet is 0.3mm to 2 mm.

4. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the thermal conductive sheet layer is at least one of a graphite sheet, a graphene sheet, a carbon fiber cloth, an aluminum foil, and a copper foil.

5. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the thickness of the thermal conductive sheet layer is 10 μm to 150 μm.

6. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the adhesive resin layer is any one of polyorganosiloxane, epoxy resin, polyurethane, and acrylic resin.

7. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein thermal conductive particles are added to the adhesive resin layer.

8. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the thermal conductive particles are at least one of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, aluminum powder, silver powder, graphite powder, graphene, and carbon fiber.

9. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein a thermal conductive film is laminated on an outer surface of the thermal conductive sheet.

10. The thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction according to claim 1, wherein the thickness of the thermal conductive film is 100 μm to 300 μm.

Technical Field

The invention relates to the field of materials, in particular to a heat conduction material.

Background

With the development of science and technology, various electronic products are developed in the direction of miniaturization, integration and densification, meanwhile, under the driving of high performance and high efficiency, the working frequency of electronic equipment is rapidly increased, so that the generated heat is rapidly accumulated and increased, if the heat cannot be timely discharged, the long-time high temperature causes various problems of the electronic equipment, and the normal operation and even the service life of the electronic equipment are influenced. According to industry experience, when the temperature of the electronic equipment is increased by 10 ℃ during operation, the reliability of the electronic equipment is reduced by 50%, and at present, more than 55% of electronic equipment failures are caused by problems of a thermal management system. Therefore, improving thermal management systems for electronic devices is becoming increasingly technically critical. In the conventional electronic device, heat is conducted out through the heat sink, but heat accumulation is related to not only the heat-generating electronic component and the heat sink, but also the contact thermal resistance between the interfaces of the heat-generating electronic component and the heat sink, and a small gap between the heat-generating electronic component and the heat sink is almost occupied by air, which seriously affects heat transfer.

Disclosure of Invention

An object of the present invention is to provide a thermal conductive sheet having an ultrahigh thermal conductivity in the thickness direction, in order to solve the above-described problems.

The technical problem solved by the invention can be realized by adopting the following technical scheme:

have super high thermal conductivity's thermal conductive sheet along thickness direction, including being flaky conducting strip, its characterized in that, the conducting strip is including being located the ascending heat conduction lamellar of vertical side, and each heat conduction lamellar arranges side by side, is the bonding resin layer that bonding resin formed with the heat conduction lamellar together between two adjacent heat conduction lamellar.

Preferably, the sum of the volumes of the heat conducting sheet layers in the same heat conducting sheet is 30-80% of the volume of the heat conducting sheet.

Preferably, the thickness of the heat conducting sheet is 0.3mm-2 mm.

Preferably, the heat conducting sheet layer is at least one of a graphite sheet, a graphene sheet, carbon fiber cloth, an aluminum foil and a copper foil.

Further preferably, the thickness of the heat-conducting sheet layer is 10 μm to 150 μm.

Preferably, the adhesive resin layer is any one of polyorganosiloxane, epoxy resin, polyurethane, and acrylic resin.

Preferably, heat conductive particles are added to the adhesive resin layer.

Further preferably, the heat conducting particles are at least one of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, aluminum powder, silver powder, graphite powder, graphene and carbon fibers.

Preferably, the outer surface of the heat-conducting fin is compounded with a heat-conducting film.

Further preferably, the thickness of the heat conductive film is 100 μm to 300 μm.

Has the advantages that: according to the invention, through the ordered arrangement of the heat conducting sheet layers such as graphite sheets, graphene sheets and the like, the heat conductivity coefficient of the heat conducting sheet in the thickness direction can reach more than 50W/m.K, which is far higher than that of the conventional heat conducting interface material; in addition, through the compounding of the heat-conducting sheet layer and the adhesive resin matrix, the heat-conducting sheet is endowed with low interface thermal resistance and good rebound resilience along the thickness direction, and the problem that the heat-conducting sheet layers such as graphite sheets, graphene sheets and the like cannot be applied to the occasion of gap filling is solved.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further explained below.

Detailed description of the preferred embodiment 1

Have super high thermal conductivity's thermal conductive sheet along thickness direction, including being flaky conducting strip, the conducting strip is including being located the ascending heat conduction lamella of vertical side, and each heat conduction lamella arranges side by side, is the bonding resin layer that bonding resin formed with the heat conduction lamella together between two adjacent heat conduction lamellas.

Specific example 2

The thermal conductive sheet with the ultrahigh thermal conductivity coefficient along the thickness direction comprises a flaky thermal conductive sheet, and a thermal conductive film is compounded on the outer surface of the thermal conductive sheet. The thickness of the heat conducting film is 100-300 μm. The heat conducting sheet comprises heat conducting sheet layers located in the vertical direction, the heat conducting sheet layers are arranged side by side, and a bonding resin layer formed by bonding resin for bonding the heat conducting sheet layers together is arranged between every two adjacent heat conducting sheet layers.

Specific example 3

The thermal conductive sheet with ultrahigh thermal conductivity along the thickness direction comprises a flaky thermal conductive sheet, wherein a thermal conductive film is compounded on the outer surface of the side wall of the thermal conductive sheet and the bottom of the thermal conductive sheet. The heat-conducting film is in a groove shape with an upward opening. The heat conducting sheet comprises heat conducting sheet layers located in the vertical direction, the heat conducting sheet layers are arranged side by side, and a bonding resin layer formed by bonding resin for bonding the heat conducting sheet layers together is arranged between every two adjacent heat conducting sheet layers. Uncured thermosetting material particles may also be added to the adhesive resin layer. Thus, at the time of mounting, deformation of the heat conductive sheet is allowed by the fluidity of the uncured thermosetting material particles, and after mounting in place, the uncured thermosetting material is gradually cured again as heat conduction progresses. The structure can effectively ensure the sealing performance of the bonding interface and can adapt to irregular bonding interfaces.

Specific example 4

The difference between the specific embodiment 4 and the above embodiments is that the thickness of the heat conducting sheet layer gradually increases from top to bottom, and the thicknesses of the heat conducting sheet layers in the above embodiments are consistent from top to bottom. The bottom portions of the heat-conducting sheet layers of the present embodiment abut against each other. Thereby making the bottom more compact and the heat-conducting property better. And the structure that is big end down makes the holding power of heat conduction lamella stronger. The side wall of the heat conducting sheet layer can be provided with a through hole which extends through the resin direction or a groove with an outward opening, and bonding resin is filled in the through hole and the groove. Thereby improving the bonding firmness between the heat-conductive sheet layer and the bonding resin.

In the above embodiments, the sum of the volumes of the heat conducting sheet layers in the same heat conducting sheet is preferably 30% to 80% of the volume of the heat conducting sheet. The thickness of the heat-conducting sheet is preferably 0.3mm to 2 mm. The heat conducting sheet layer is preferably at least one of a graphite sheet, a graphene sheet, carbon fiber cloth, an aluminum foil and a copper foil. The thickness of the heat conducting sheet layer is preferably 10 μm to 150 μm. The adhesive resin layer is preferably any one of polyorganosiloxane, epoxy resin, polyurethane, and acrylic resin.

In the above embodiments, the adhesive resin layer may further contain heat conductive particles. The heat conducting particles are preferably at least one of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, aluminum powder, silver powder, graphite powder, graphene and carbon fibers. Thereby improving the heat conduction effect. The bonding resin layer may further contain color-changing particles whose color changes with temperature. Therefore, the problem of the current component is roughly estimated by observing the color of the color-changing particles. Moreover, the degree of color change, the color change speed and the changed color of the color-changing particles can be recorded through the planned change of the control temperature, and the change is taken as one of evaluation criteria for judging the performance of the heat-conducting sheet, so that the detection and evaluation of the performance of the heat-conducting sheet are realized.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.