阅读说明：本技术 一种基于柔性可拉伸加热膜的暖体假人制作方法及暖体假人 (Body warming dummy manufacturing method based on flexible stretchable heating film and body warming dummy ) 是由 李宇航 赵召 管锡祺 于雅楠 于 2020-11-15 设计创作，主要内容包括：本发明提供了一种基于柔性可拉伸加热膜的暖体假人制作方法及暖体假人,包括以下步骤：建立暖体假人三维模型,根据曲率对暖体假人不同部位进行分区；对所述暖体假人的各个部位分区进行曲面展开；以各个所述曲面的轮廓为边界设计可拉伸柔性均匀加热膜；制作可拉伸柔性均匀加热膜；将所述可拉伸柔性均匀加热膜贴附在所述暖体假人的对应分区部位。本发明采用柔性均匀加热装置,根据人体不同区域的形状设计可拉伸的双层电路,并用硅橡胶材料对可拉伸的双层电路进行曲面封装,保证了暖体假人温度的均匀性。(The invention provides a warm-up dummy manufacturing method based on a flexible stretchable heating film and a warm-up dummy, which comprises the following steps: establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature; carrying out curved surface unfolding on each part partition of the warm body dummy; designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary; manufacturing a stretchable flexible uniform heating film; and attaching the stretchable flexible uniform heating film to the corresponding subarea of the thermal manikin. The invention adopts the flexible uniform heating device, designs the stretchable double-layer circuit according to the shapes of different areas of the human body, and uses the silicon rubber material to carry out curved surface packaging on the stretchable double-layer circuit, thereby ensuring the temperature uniformity of the thermal manikin.)

1. A method for manufacturing a warm-up dummy based on a flexible stretchable heating film is characterized by comprising the following steps:

establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature;

carrying out curved surface unfolding on each part partition of the warm body dummy;

designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary;

manufacturing a stretchable flexible uniform heating film;

and attaching the stretchable flexible uniform heating film to the corresponding subarea of the thermal manikin.

2. The method of claim 1, wherein the stretchable flexible uniform heating film comprises a double layer circuit.

3. The method of making as defined in claim 2, wherein making a stretchable flexible uniform heating film comprises: manufacturing a double-layer circuit; and packaging the double-layer circuit by adopting a layered packaging process.

4. The method of claim 3, wherein the double-layer circuit is formed by copper-clad polyimide film.

5. The method of claim 3, wherein the circuit shape of the double-layer circuit is a serpentine configuration with periodically repeating unit cells, and edges are connected in a serpentine configuration according to a curved profile.

6. The method of manufacturing according to claim 4, wherein the manufacturing of the two-layer circuit comprises: setting parameters of the laser processing system according to the thickness of the material by using the laser processing system; firstly, cutting an integral structure of the double-layer circuit structure on a polyimide copper-clad film by laser, then selecting a part with a difference set between the shape of an upper-layer copper circuit of the double-layer circuit and a lower-layer polyimide support structure, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by a defocusing process, and leaving an upper-layer metal series circuit diagram above the polyimide support structure.

7. The method for manufacturing the double-layer circuit according to claim 3, wherein the step of encapsulating the double-layer circuit by adopting a layered encapsulation process comprises the following steps: designing a mould with an internal sunken outline matched with the curved surface outline according to the expanded curved surface outline of each subarea; curing Ecoflex in a mold as a substrate layer; placing the cut double-layer circuit on the solidified substrate layer; and curing the Ecoflex packaging layer on the substrate layer and the double-layer circuit.

8. The method of claim 6, wherein the depth of the internal recess is the sum of the thicknesses of the encapsulation layer and the substrate layer.

9. The method of claim 1, comprising applying a stretchable flexible uniform heating film to the thermal manikin at the corresponding zone with a silicone surface treatment and 3M glue and making electrical connections at the wafer locations of the wire ports.

10. A thermal manikin made by the method of making a thermal manikin based on a flexible stretchable heating film according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of human body efficacy test equipment, in particular to a warm-up dummy manufacturing method based on a flexible stretchable heating film and a warm-up dummy.

Background

The warm-up dummy is an instrument device which has the appearance of a human body and can simulate heat and moisture exchange between the human body and the environment, is a new biophysical test method which is gradually developed from the 40 th of the 20 th century, and the technology is widely applied to the fields of clothing, buildings, environments, aerospace, fire protection, traffic safety and the like, for example, the warm-up dummy is used for evaluating the comfort level of indoor environment, testing the thermal resistance of clothing and the like. The thermal environment can be objectively and systematically evaluated and the physiological response of the human body to the thermal environment can be predicted by utilizing the warm dummy to replace the real person to carry out experimental research, and under the conditions of severe and dangerous experimental environments, the risk coefficient of the experiment conducted by utilizing the real person is higher, the personal safety can not be guaranteed, the dummy is required to replace the real person to carry out the experiment, and the experimental safety is improved.

Due to the improvement of the recognition of the thermal manikin, the application range of the thermal manikin is expanded, the functions are continuously improved, and the manufacturing technology is also continuously improved. As a warm body dummy device for simulating heat and moisture exchange between a real human body and the environment, the more the physiological state of the human body can be simulated truly, the more the reality of the experimental data is. Because each main part of the thermal manikin is the non-developable surface, the traditional heating mode can not perfectly apply the surface of the thermal manikin, so that the condition of uneven temperature distribution can be generated, and meanwhile, the traditional heating wire winding method can not control the equidistant distribution, thereby causing the problem of poor temperature uniformity of the thermal manikin.

Disclosure of Invention

In order to solve the problems, the invention provides a warm body dummy and a warm body dummy manufacturing method based on a flexible stretchable heating film.

The invention provides a method for manufacturing a warm-up dummy based on a flexible stretchable heating film, which comprises the following steps: establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to curvature; carrying out curved surface unfolding on each part partition of the warm body dummy; designing a stretchable flexible uniform heating film by taking the contour of each curved surface as a boundary; manufacturing a stretchable flexible uniform heating film; and attaching the stretchable flexible uniform heating film to the corresponding subarea of the thermal manikin.

Further, the stretchable flexible uniform heating film comprises a double-layer circuit.

Further, the manufacturing of the stretchable flexible uniform heating film comprises: manufacturing a double-layer circuit; and packaging the double-layer circuit by adopting a layered packaging process.

Furthermore, the double-layer circuit is made of polyimide copper-clad film.

Furthermore, the circuit shape of the double-layer circuit adopts a snake-shaped configuration of a periodic repeating unit cell, and the edges are connected by adopting the snake-shaped configuration according to a curved surface contour.

Further, the manufacturing of the double-layer circuit comprises: setting parameters of the laser processing system according to the thickness of the material by using the laser processing system; firstly, cutting an integral structure of the double-layer circuit structure on a polyimide copper-clad film by laser, then selecting a part with a difference set between the shape of an upper-layer copper circuit of the double-layer circuit and a lower-layer polyimide support structure, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by a defocusing process, and leaving an upper-layer metal series circuit diagram above the polyimide support structure.

Further, the packaging of the double-layer circuit by adopting the layered packaging process comprises the following steps: designing a mould with an internal sunken outline matched with the curved surface outline according to the expanded curved surface outline of each subarea; curing Ecoflex in a mold as a substrate layer; placing the cut double-layer circuit on the solidified substrate layer; and curing the Ecoflex packaging layer on the substrate layer and the double-layer circuit.

Further, the depth of the internal recess is the sum of the thicknesses of the packaging layer and the substrate layer.

Further, the stretchable flexible uniform heating film is attached to the corresponding subarea of the thermal manikin by using a silica gel surface treating agent and 3M glue, and circuit connection is carried out at the position of the wafer of the wire port.

On the other hand, the invention also provides a warm body dummy which is manufactured by the warm body dummy manufacturing method based on the flexible stretchable heating film.

The invention has the beneficial effects that: according to the invention, the main part of the thermal manikin is partitioned according to the curvature, the main part is expanded in a partitioned mode, and a double-layer stretchable circuit is designed according to an expanded plane contour diagram, so that the error of the non-stretchable surface expanded by software can be compensated through the micro deformation of the stretchable circuit; the lower layer circuit of the double-layer circuit and the insulated parallel PI (polyimide) circuit can provide a supporting effect for the upper layer series copper circuit, and meanwhile, the equal interval distribution of a certain degree after stretching deformation is guaranteed, so that the purpose of uniform heating is achieved. The planar packaging has the advantages that the thickness of the packaging layer above the double-layer circuit can be kept consistent, and the planar packaging has the characteristics of uniform thickness and good controllability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a flow chart of a method of making a thermal manikin;

FIG. 2 is a sectional view of the main part of the thermal manikin;

FIG. 3 is a development view of the curved surface of each part region;

FIG. 4 is a diagram of a front half-face two-layer circuit design;

FIG. 5 is a diagram of a two-layer circuit design for the rear half of the face;

FIG. 6 is a flow chart of a layered packaging process for a two-layer circuit;

fig. 7 is a schematic view of the mold for the front and back half.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

As shown in fig. 1, a method for manufacturing a thermal manikin based on a flexible stretchable heating film specifically comprises the following steps:

and step S1, establishing a three-dimensional model of the warm body dummy, and partitioning different parts of the warm body dummy according to the curvature.

As shown in fig. 2: the three-dimensional model of the warm-up dummy is built by three-dimensional software, different parts of the warm-up dummy are partitioned according to curvature, the warm-up dummy is in a bilateral symmetry structure, so the warm-up dummy is divided into 12 part partitions of a front half face, a rear half face, a chest, a front upper abdomen, a back, a rear waist, a big arm, a small arm, a front lower abdomen, a hip, a thigh and a shank in the embodiment, and the part partitions of the warm-up dummy can be further increased on the basis of the 12 part partitions according to the application environment of the warm-up dummy, for example, the part partitions of a neck, a hand or a foot are increased, and/or the 12 part partitions are further subdivided.

And step S2, performing curved surface expansion on each part region of the thermal manikin.

As shown in fig. 3, the 12 part divisions divided in step S1 are each subjected to curved surface development.

And step S3, designing the stretchable flexible uniform heating film by taking the curved surface contours as boundaries.

The stretchable flexible uniform heating film capable of completely wrapping the head is designed and comprises a double-layer circuit, wherein the double-layer circuit consists of a lower-layer PI supporting configuration and an upper-layer metal circuit configuration. The upper layer metal circuit is in a series configuration, and the series circuit generates heat the same everywhere, so that the temperature distribution uniformity is ensured. The lower layer PI supporting configuration is a parallel configuration and is provided with a mesh configuration of middle supports, and the mesh configuration can support the upper layer metal circuit processed by laser and enable the upper layer metal circuit configuration to keep a characteristic shape.

In this embodiment, a head with the largest curvature is taken as an example, as shown in fig. 4-5, a double-layer circuit size configuration is designed by taking curved surface profiles of a front half face and a rear half face as boundaries, a circuit shape adopts a periodically repeated single-cell serpentine configuration, edges are connected according to the curved surface profiles by adopting the serpentine configuration, in order to ensure that the temperature uniformity of the outer surface of a final product is realized, parameters such as the distance between adjacent wires, the wire width, the wire thickness and the like need to be determined according to the heating power of a unit area and the mechanical tensile property of the wires, and a head area is taken as an example, the maximum distance between the adjacent wires is 4mm, the maximum line width is 1mm, and the maximum thickness is 0.

And step S4, manufacturing the stretchable flexible uniform heating film.

And step S41, manufacturing a double-layer circuit.

The PI copper-clad film is used as a processing material, the upper layer of the material is a copper material, the lower layer of the material is a polyimide material, and the middle of the material is an adhesive; setting parameters such as different powers, speeds, processing times and the like of the laser processing system by using the laser processing system according to the thickness of the material; firstly, laser cutting an integral structure of the double-layer circuit configuration on a PI copper-clad film, then taking a difference part between the upper-layer copper circuit shape and the lower-layer PI supporting configuration of the double-layer circuit, selecting heating parameters according to a heating copper stripping process in a laser system, carrying out heating copper stripping treatment by using a defocusing process, and leaving an upper-layer metal series circuit diagram above the PI supporting configuration.

And step S42, packaging the double-layer circuit by adopting a layered packaging process.

A flow chart of a layered packaging process of a double-layer circuit is shown in fig. 6, and the specific steps are as follows:

and step S421, designing a mold with an inner concave contour matched with the curved surface contour according to the partitioned expanded curved surface contour diagram.

The depth of the internal recess is the sum of the thicknesses of the encapsulation layer and the substrate layer and the mould is preferably processed using 3d printing techniques, the front and rear half-face moulds being as shown in figure 7.

And step S422, curing Ecoflex in the mold to be used as a substrate layer.

The preferred cured thickness of Ecoflex in this example is 1mm, the die internal floor area is known, and the required Ecoflex mass can be calculated from the volume and Ecoflex density. The double-layer circuit is arranged between the substrate layer and the packaging layer, and the double-layer circuit generates buckling deformation in the stretching and applying process and can be restrained by the substrate layer and the packaging layer. If the substrate layer is not provided with only the packaging layer, the stretched circuit is bent and tilted, the silicon rubber of the packaging layer cannot be perfectly attached to the surface of the dummy, air exists between the circuit and the cured silicon rubber packaging layer, and the local thermal resistance is increased to cause uneven temperature.

Selecting Ecoflex 00-30 in the embodiment, weighing an agent A and an agent B of the Ecoflex 00-30 according to a ratio of 1:1, pouring the weighed materials into a disposable small-size measuring cup, manually stirring the materials uniformly, slowly pouring the materials into a flat mold, and controlling the total amount of poured silica gel by using an electronic balance; when Ecoflex is cured, the flat mold is moved into a vacuum oven for vacuum defoaming and constant-temperature heating treatment, and the curing is carried out for 1 hour.

Step S423, the cut double-layer circuit is placed on the cured base layer.

Step S424, curing the Ecoflex package layer on the base layer and the dual-layer circuit.

In this embodiment, the curing thickness of Ecoflex is preferably 1mm, and a layer packaging process is adopted in this embodiment, which has the following advantages over an overall packaging process: the overall packaging process cannot ensure that a thin circuit is smoothly packaged in the silica gel layer, so that the temperature uniformity is affected. Uneven circuits have different distances to the upper surface of the packaging layer, and the farther the distance is, the lower the temperature is, so that uniform heating cannot be realized. Earlier solidification stratum basale in this application, after putting into double-deck circuit, the even encapsulated layer of postcure thickness because the basement is unanimous with the encapsulated layer material, interface problem can not appear in the centre, and plane solidification has guaranteed that circuit to encapsulated layer upper surface distance everywhere equals simultaneously.

And step S5, attaching the stretchable flexible uniform heating film to the corresponding subarea of the thermal manikin.

The stretchable flexible uniform heating film is attached to the corresponding subarea of the warm-up dummy by using a silica gel surface treating agent and 3M glue, and circuit connection is carried out at the position of the wire port wafer.

Example 2

A thermal manikin, which is manufactured by the manufacturing method of the embodiment 1.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.