阅读说明：本技术 一种基于热阻标准件的热阻测量仪器校准方法及装置 (Thermal resistance measuring instrument calibration method and device based on thermal resistance standard component ) 是由 郑世棋 李灏 翟玉卫 丁晨 刘霞美 程晓辉 范雅洁 于 2020-10-21 设计创作，主要内容包括：本发明适用于半导体技术领域,提供了一种基于热阻标准件的热阻测量仪器校准方法及装置,该方法包括：控制热阻标准件处于预设温度下,向热阻标准件输入预设测试电流,并测量热阻标准件的第一结电压,根据预设温度和第一结电压确定热阻标准件的校温曲线；向热阻标准件输入预设工作电流,待热阻标准件的结温稳定后,测量热阻标准件的第二结电压；基于校温曲线以及第二结电压,确定热阻标准件在预设工作电流下的结温,并根据结温确定热阻标准件的标准热阻值；根据标准热阻值对热阻测量仪器进行校准。本发明利用已标定准确热阻值的热阻标准件对热阻测量仪器进行校准,能够解决现有技术中的热阻测量仪器测量结果准确度低、一致性差的问题。(The invention is suitable for the technical field of semiconductors, and provides a thermal resistance measuring instrument calibration method and device based on a thermal resistance standard component, wherein the method comprises the following steps: controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature correction curve of the thermal resistance standard component according to the preset temperature and the first junction voltage; inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable; determining junction temperature of the thermal resistance standard component under a preset working current based on the temperature calibration curve and the second junction voltage, and determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature; and calibrating the thermal resistance measuring instrument according to the standard thermal resistance value. The invention utilizes the thermal resistance standard component with calibrated accurate thermal resistance value to calibrate the thermal resistance measuring instrument, and can solve the problems of low accuracy and poor consistency of the measuring result of the thermal resistance measuring instrument in the prior art.)

1. A thermal resistance measuring instrument calibration method based on a thermal resistance standard part is characterized by comprising the following steps:

controlling a thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;

inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized;

determining junction temperature of the thermal resistance standard component under the preset working current based on the temperature calibration curve and the second junction voltage, and determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature;

and calibrating the thermal resistance measuring instrument according to the standard thermal resistance value.

2. The method for calibrating a thermal resistance measuring instrument based on a thermal resistance standard according to claim 1, wherein the preset test current is a pulse current, and the preset working current is a direct current.

3. The method for calibrating a thermal resistance measuring instrument based on a thermal resistance standard according to claim 2, wherein the current peak value of the preset test current is the same as the current value of the preset working current.

4. The method for calibrating a thermal resistance measuring instrument based on a thermal resistance standard according to claim 1, wherein the determining a standard thermal resistance value of the thermal resistance standard according to the junction temperature comprises:

in the formula, R_θjxIs a standard thermal resistance value, T_jTo junction temperature, T_xIs the shell temperature, P, of a thermal resistance standard_HThe power dissipated to cause a thermal resistance standard junction temperature rise.

5. The method for calibrating a thermal resistance measuring instrument based on a thermal resistance standard according to claim 1, wherein the calibrating the thermal resistance measuring instrument according to the standard thermal resistance value comprises the following steps:

measuring the thermal resistance of the thermal resistance standard component by using a thermal resistance measuring instrument;

and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.

6. The method for calibrating a thermal resistance measuring instrument based on a thermal resistance standard component according to claim 1, wherein the thermal resistance standard component comprises two groups of pins, and the inputting of a preset test current into the thermal resistance standard component and the measuring of a first junction voltage of the thermal resistance standard component comprise:

inputting a preset test current to one group of pins of the thermal resistance standard component, and measuring a first junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component;

the step of inputting a preset working current to the thermal resistance standard part, and measuring a second junction voltage of the thermal resistance standard part after the junction temperature of the thermal resistance standard part is stabilized includes:

and inputting a preset working current to one group of pins of the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

7. The method of claim 6, wherein the diode chip of the thermal resistance standard is a silicon carbide schottky diode chip.

8. A thermal resistance measuring instrument calibration device based on a thermal resistance standard part is characterized by comprising:

the temperature calibration module is used for controlling a thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;

the temperature measurement module is used for inputting a preset working current to the thermal resistance standard component and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable;

the standard thermal resistance value calculation module is used for determining the junction temperature of the thermal resistance standard component under the preset working current based on the temperature calibration curve and the second junction voltage, and determining the standard thermal resistance value of the thermal resistance standard component according to the junction temperature;

and the calibration module is used for calibrating the thermal resistance measuring instrument according to the standard thermal resistance value.

9. The thermal resistance measurement instrument calibration device based on the thermal resistance standard according to claim 8, wherein the preset test current is a pulse current, and the preset working current is a direct current.

10. The thermal resistance measurement instrument calibration device based on the thermal resistance standard according to claim 9, wherein the current peak value of the preset test current is the same as the current value of the preset operating current.

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to a thermal resistance measuring instrument calibration method and device based on a thermal resistance standard component.

Background

The thermal resistance parameter is an important parameter for representing the heat dissipation performance of the semiconductor device, is directly related to the service life and the reliability of the semiconductor device, and is continuously promoted along with the development of the semiconductor device towards the miniaturization, high-power and high-integration directions.

At present, most of thermal resistance measuring instruments on the market measure the junction temperature of a semiconductor device by a low-current K coefficient method based on an electrical method measuring principle, and then calculate the thermal resistance of the semiconductor device. However, in the method, due to the switching between the working current and the test current in the temperature measurement process, the junction voltage of the semiconductor device has a peak at the moment of current switching, and finally the accuracy of the measurement result of the thermal resistance measurement instrument is reduced. Although instrument manufacturers also provide some correction methods for respective thermal resistance measurement instruments, the application effect of the correction methods on a part of semiconductor devices is limited on one hand, and on the other hand, the consistency of measurement results of different thermal resistance measurement instruments is poor due to different correction methods adopted by different manufacturers.

Disclosure of Invention

In view of this, the embodiment of the invention provides a thermal resistance measuring instrument calibration method and device based on a thermal resistance standard component, so as to solve the problems of low accuracy and poor consistency of the measurement result of the thermal resistance measuring instrument in the prior art.

The first aspect of the embodiment of the invention provides a thermal resistance measuring instrument calibration method based on a thermal resistance standard component, which comprises the following steps:

controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature correction curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;

inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable;

determining junction temperature of the thermal resistance standard component under a preset working current based on the temperature calibration curve and the second junction voltage, and determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature;

and calibrating the thermal resistance measuring instrument according to the standard thermal resistance value.

Optionally, the preset test current is a pulse current, and the preset working current is a direct current.

Optionally, the current peak value of the preset test current is the same as the current value of the preset working current.

Optionally, determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature includes:

in the formula, R_θjxIs a standard thermal resistance value, T_jTo junction temperature, T_xIs the shell temperature, P, of a thermal resistance standard_HThe power dissipated to cause a thermal resistance standard junction temperature rise.

Optionally, calibrating the thermal resistance measurement instrument according to the standard thermal resistance value, including:

measuring the thermal resistance of a thermal resistance standard component by using a thermal resistance measuring instrument;

and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.

Optionally, the thermal resistance standard component includes two groups of pins, a preset test current is input to the thermal resistance standard component, and a first junction voltage of the thermal resistance standard component is measured, including:

inputting a preset test current to one group of pins of the thermal resistance standard component, and measuring a first junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component;

inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized, wherein the method comprises the following steps:

and inputting a preset working current to one group of pins of the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

Optionally, the diode chip of the thermal resistance standard component is a schottky diode chip made of silicon carbide.

A second aspect of the embodiments of the present invention provides a thermal resistance measurement instrument calibration apparatus based on a thermal resistance standard, including:

the temperature correcting module is used for controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature correcting curve of the thermal resistance standard component according to the preset temperature and the first junction voltage;

the temperature measuring module is used for inputting a preset working current to the thermal resistance standard component and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable;

the standard thermal resistance value calculation module is used for determining the junction temperature of the thermal resistance standard component under the preset working current based on the temperature calibration curve and the second junction voltage, and determining the standard thermal resistance value of the thermal resistance standard component according to the junction temperature;

and the calibration module is used for calibrating the thermal resistance measuring instrument according to the standard thermal resistance value.

Optionally, the preset test current is a pulse current, and the preset working current is a direct current.

Optionally, the current peak value of the preset test current is the same as the current value of the preset working current.

Optionally, determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature includes:

in the formula, R_θjxIs a standard thermal resistance value, T_jTo junction temperature, T_xIs the shell temperature, P, of a thermal resistance standard_HThe power dissipated to cause a thermal resistance standard junction temperature rise.

Optionally, the calibration module is further configured to,

measuring the thermal resistance of a thermal resistance standard component by using a thermal resistance measuring instrument;

and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.

Alternatively, the thermal resistance standard includes two sets of pins,

the temperature correcting module is also used for inputting a preset test current to one group of pins of the thermal resistance standard component and measuring a first junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component;

the temperature measuring module is also used for inputting a preset working current to one group of pins of the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

Optionally, the diode chip of the thermal resistance standard component is a schottky diode chip made of silicon carbide.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

the method comprises the steps of inputting a preset test current to a thermal resistance standard component by controlling the thermal resistance standard component to be at a preset temperature, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature correction curve of the thermal resistance standard component according to the preset temperature and the first junction voltage; inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable; determining junction temperature of the thermal resistance standard component under a preset working current based on the temperature calibration curve and the second junction voltage, and determining a standard thermal resistance value of the thermal resistance standard component according to the junction temperature; and calibrating the thermal resistance measuring instrument according to the standard thermal resistance value. According to the invention, after the preset working current is input into the thermal resistance standard component and the junction temperature of the thermal resistance standard component is stable, the preset working current is directly used as the test current to measure the second junction voltage of the thermal resistance standard component, so that the junction voltage spike phenomenon caused when the working current is switched to the test current in the measurement process can be avoided, and the thermal resistance value of the thermal resistance standard component can be accurately measured; the thermal resistance measuring instrument is calibrated by using the thermal resistance standard component with the calibrated accurate thermal resistance value, and the problems of low accuracy and poor consistency of the measuring result of the thermal resistance measuring instrument in the prior art can be solved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic diagram of a flow chart of a calibration method for a thermal resistance measurement instrument based on a thermal resistance standard according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a temperature calibration curve of a thermal resistance standard according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a semiconductor device provided by an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a thermal resistance standard according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a calibration apparatus for thermal resistance measurement instrument based on a thermal resistance standard according to an embodiment of the present invention;

FIG. 6 is a diagram illustrating an exemplary temperature calibration module according to an embodiment of the present invention;

fig. 7 is a diagram illustrating a temperature measurement module according to an embodiment of the present invention.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

The first aspect of the embodiment of the present invention provides a thermal resistance measurement instrument calibration method based on a thermal resistance standard, and as shown in fig. 1, the method includes the following steps:

step S101, controlling the thermal resistance standard component to be at a preset temperature, inputting a preset test current to the thermal resistance standard component, measuring a first junction voltage of the thermal resistance standard component, and determining a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage.

In the embodiment of the invention, the thermal resistance standard component is controlled to be at the preset temperature, then the preset test current is input into the thermal resistance standard component to measure the first junction voltage of the thermal resistance standard component, and the preset temperature is changed to carry out a plurality of tests to finally obtain the temperature calibration curve of the thermal resistance standard component. The temperature calibration curve of the thermal resistance standard is shown in FIG. 2, in which V_tspJunction voltage, T, of a thermal resistance standard_jAs shown in FIG. 2, the junction voltage variation Δ V of the thermal resistance standard is the junction temperature of the thermal resistance standard_tspJunction temperature delta T with thermal resistance standard_jIn a multiple relationship, i.e. Δ V_tsp＝KΔT_jAnd K is the temperature correction coefficient.

Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration method based on the thermal resistance standard provided by the embodiment of the present invention, the preset test current is a pulse current, and the preset working current is a direct current.

Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration method based on the thermal resistance standard provided by the embodiment of the present invention, a current peak value of the preset test current is the same as a current value of the preset working current.

In the embodiment of the invention, the preset test current is set as the pulse current, and the pulse width of the pulse current is smaller than the preset pulse width, so that the thermal resistance standard component can be prevented from generating self-heating to influence the measurement accuracy of the first junction voltage under the condition that the pulse width of the pulse current is narrow enough. And, the accuracy of the standard thermal resistance value calculation result can be ensured by setting the current peak value of the preset test current to be the same as the current value of the preset working current.

And S102, inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

When the junction voltage of a semiconductor device is measured by a traditional low-current K coefficient method, because the current value of the test current is far smaller than the working current, after the semiconductor device is heated by the working current, the junction voltage of the semiconductor device is switched to the test current in the moment, and the junction voltage of the semiconductor device is subjected to instant peak due to rapid discharge, so that the measurement result of the junction voltage is inaccurate.

In the embodiment of the invention, the preset working current is input into the thermal resistance standard component for heating, and after the junction temperature of the thermal resistance standard component is stabilized, the preset working current is directly used as the test current to measure the second junction voltage of the thermal resistance standard component, so that the switching of the current can be avoided, and the measurement precision of the junction voltage can be improved.

And S103, determining the junction temperature of the thermal resistance standard component under the preset working current based on the temperature calibration curve and the second junction voltage, and determining the standard thermal resistance value of the thermal resistance standard component according to the junction temperature.

Optionally, as a specific implementation of the method for calibrating a thermal resistance measurement instrument based on a thermal resistance standard component provided in the embodiment of the present invention, determining a standard thermal resistance value of the thermal resistance standard component according to a junction temperature includes:

in the formula, R_θjxIs a standard thermal resistance value, T_jTo junction temperature, T_xIs the shell temperature, P, of a thermal resistance standard_HThe power dissipated to cause a thermal resistance standard junction temperature rise.

In the embodiment of the invention, the shell temperature T_xThe case temperature when the junction temperature of the thermal resistance standard component is stable is used as the reference position temperature of the thermal resistance standard component, and in practical application, other positions of the thermal resistance standard component can be selected as the reference position, which is not set by the invention.

Optionally, as a specific implementation manner of the method for calibrating a thermal resistance measurement instrument based on a thermal resistance standard provided in the embodiment of the present invention, the calibrating the thermal resistance measurement instrument according to the standard thermal resistance value includes:

measuring the thermal resistance of a thermal resistance standard component by using a thermal resistance measuring instrument;

and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.

In the embodiment of the present invention, after the thermal resistance measuring instrument to be calibrated is used to measure the thermal resistance of the thermal resistance standard component, the thermal resistance measuring instrument may be calibrated according to a difference between a measured value of the thermal resistance and a standard thermal resistance value, and other calibration methods may also be adopted, which is not limited in this invention. If the difference value between the measured value of the thermal resistance and the standard thermal resistance value is adopted to calibrate the thermal resistance measuring instrument, the thermal resistance measuring instrument can be adjusted, and the difference value can be added to the measurement result of each time of the thermal resistance measuring instrument to be used as the accurate value of the thermal resistance.

Optionally, as a specific implementation manner of the method for calibrating a thermal resistance measurement instrument based on a thermal resistance standard component provided in the embodiment of the present invention, the thermal resistance standard component includes two groups of pins, a preset test current is input to the thermal resistance standard component, and a first junction voltage of the thermal resistance standard component is measured, where the method includes:

inputting a preset test current to one group of pins of the thermal resistance standard component, and measuring a first junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component;

inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized, wherein the method comprises the following steps:

and inputting a preset working current to one group of pins of the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component through the other group of pins of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

In general, the junction voltage measured from a pin outside the semiconductor device includes not only the junction voltage of the diode chip but also interference voltages generated by a pin resistance, a lead resistance, a contact resistance, and the like in a part of the semiconductor device, and when the test current is small, the interference voltages are generatedIt can be ignored, but in the embodiment of the present invention, the interference voltage has a large influence on the measurement result due to the large test current. As shown in FIG. 3, the partial pin resistance, lead resistance and contact resistance inside the semiconductor device 30 are equivalent to R32, R33, and the junction voltage (V) measured from the pins 32, 33 outside the semiconductor device 30_tsp) The voltages of R32 and R33 are included in addition to the junction voltage of the diode chip 31.

In order to eliminate the influence of interference voltage on the measurement result, the invention designs a thermal resistance standard component with two groups of pins, as shown in FIG. 4. In the figure, two groups of pins are connected to a diode chip 41 of a thermal resistance standard component 40, wherein one group of pins 42 and 43 is used for inputting current, and the other group of pins 44 and 45 is used for measuring junction voltage (R42-R45 are all equivalent resistances), and the influence of interference voltage inside the thermal resistance standard component 40 on the junction voltage measurement result is avoided by separating an energizing loop from a measuring loop.

Optionally, as a specific implementation of the method for calibrating the thermal resistance measurement instrument based on the thermal resistance standard provided in the embodiment of the present invention, the diode chip 41 of the thermal resistance standard 40 is a schottky diode chip made of silicon carbide.

In the embodiment of the invention, the thermal resistance standard component manufactured by the Schottky diode chip is selected, the circuit structure is simple, the electrical stability is good, and the Schottky structure is high in switching speed and is more suitable for measuring the pulse current. And the silicon carbide belongs to a wide bandgap material, and can improve the heat resistance and the thermal stability of the thermal resistance standard component. It should be noted that, in practical applications, the device chip with MOSFET, IGBT or other PN junction structure may also be used to implement the technical solution of the present invention without considering the advantages of the schottky diode chip, and the present invention is not limited herein.

In addition, each thermal resistance standard component only has one standard thermal resistance value, in order to cover the calibration range of thermal resistance parameters, a series of thermal resistance standard components with different standard thermal resistance values are designed and manufactured in the embodiment of the invention, specifically, the standard thermal resistance values can be changed by methods such as adjusting the size of a diode chip, and the like, which is not limited in the invention.

A second aspect of the embodiments of the present invention provides a thermal resistance measurement instrument calibration apparatus based on a thermal resistance standard, and referring to fig. 5, a thermal resistance measurement instrument calibration apparatus 50 based on a thermal resistance standard includes:

the temperature calibration module 51 is configured to control the thermal resistance standard component to be at a preset temperature, input a preset test current to the thermal resistance standard component, measure a first junction voltage of the thermal resistance standard component, and determine a temperature calibration curve of the thermal resistance standard component according to the preset temperature and the first junction voltage.

And the temperature measuring module 52 is configured to input a preset working current to the thermal resistance standard component, and measure a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stabilized.

And the standard thermal resistance value calculating module 53 is configured to determine a junction temperature of the thermal resistance standard component at a preset working current based on the temperature calibration curve and the second junction voltage, and determine a standard thermal resistance value of the thermal resistance standard component according to the junction temperature.

And the calibration module 54 is used for calibrating the thermal resistance measuring instrument according to the standard thermal resistance value.

Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration apparatus based on the thermal resistance standard provided by the embodiment of the present invention, the preset test current is a pulse current, and the preset working current is a direct current.

Optionally, as a specific implementation manner of the thermal resistance measurement instrument calibration apparatus based on the thermal resistance standard provided by the embodiment of the present invention, a current peak value of the preset test current is the same as a current value of the preset working current.

Optionally, as a specific implementation manner of the calibration apparatus for a thermal resistance measurement instrument based on a thermal resistance standard component provided in the embodiment of the present invention, determining a standard thermal resistance value of the thermal resistance standard component according to a junction temperature includes:

in the formula, R_θjxIs a standard thermal resistance value, T_jTo junction temperature, T_xIs the shell temperature, P, of a thermal resistance standard_HThe power dissipated to cause a thermal resistance standard junction temperature rise.

Optionally, as a specific implementation of the calibration apparatus for thermal resistance measurement instrument based on thermal resistance standard provided in the embodiment of the present invention, the calibration module 54 is further configured to,

measuring the thermal resistance of a thermal resistance standard component by using a thermal resistance measuring instrument;

and calculating the difference value of the thermal resistance and the standard thermal resistance value, and calibrating the thermal resistance measuring instrument according to the difference value.

Alternatively, referring to fig. 4, as a specific implementation of the thermal resistance measurement instrument calibration apparatus based on the thermal resistance standard provided by the embodiment of the present invention, the thermal resistance standard 40 includes two sets of pins,

the temperature calibration module 51 is further configured to preset a test current to one group of pins of the thermal resistance standard component 40, and measure a first junction voltage of the thermal resistance standard component 40 through the other group of pins of the thermal resistance standard component 40;

the temperature measuring module 52 is further configured to input a preset operating current to one group of pins of the thermal resistance standard component 40, and measure a second junction voltage of the thermal resistance standard component 40 through the other group of pins of the thermal resistance standard component 40 after the junction temperature of the thermal resistance standard component 40 is stabilized.

Optionally, the diode chip 41 of the thermal resistance standard 40 is a schottky diode chip made of silicon carbide.

Specifically, referring to fig. 6, in the embodiment of the present invention, the functions of the temperature calibration module 51 may be implemented by a temperature control platform 511 and a pulse source measurement unit 512. The temperature control platform 511 is used for controlling the thermal resistance standard component 40 to be at a preset temperature, and the pulse source measurement unit 512 is used for outputting a preset test current with a narrow pulse width to the thermal resistance standard component 40, measuring a first junction voltage of the thermal resistance standard component 40, and obtaining a temperature calibration curve. The pulse source testing unit 512 may be a semiconductor tester, the pulse source testing unit 512 may be connected to one group of pins 42 and 43 of the thermal resistance standard component 40 to form an energizing circuit, a preset test current is input into the thermal resistance standard component 40, and meanwhile, the pulse source testing unit 512 may also be connected to the other group of pins 44 and 45 of the thermal resistance standard component 40 to form a test circuit, and measures a first junction voltage of the thermal resistance standard component 40.

Referring to fig. 7, in the embodiment of the present invention, the function of the temperature measuring module 52 can be realized by the dc current source 521 and the dc voltage meter 522. The direct current source 521 may be connected to one group of pins 42 and 43 of the thermal resistance standard component 40 to form an energizing circuit, a preset working current is input into the thermal resistance standard component 40, the direct current voltmeter 522 may be connected to the other group of pins 44 and 45 of the thermal resistance standard component 40 to form a testing circuit, and a second junction voltage of the thermal resistance standard component 40 is measured after the junction temperature of the thermal resistance standard component 40 is stabilized.

According to the invention, the thermal resistance standard component is controlled to be at the preset temperature, the preset test current is input into the thermal resistance standard component, the first junction voltage of the thermal resistance standard component is measured, and the temperature correction curve of the thermal resistance standard component is determined according to the preset temperature and the first junction voltage; inputting a preset working current to the thermal resistance standard component, and measuring a second junction voltage of the thermal resistance standard component after the junction temperature of the thermal resistance standard component is stable; the junction temperature of the thermal resistance standard component under the preset working current is determined based on the temperature calibration curve and the second junction voltage, the standard thermal resistance value of the thermal resistance standard component is determined according to the junction temperature, the thermal resistance value of the thermal resistance standard component can be accurately obtained, the thermal resistance measuring instrument is calibrated by using the thermal resistance standard component with the calibrated accurate thermal resistance value, and the problems of low accuracy and poor consistency of the measuring result of the thermal resistance parameter measuring instrument in the prior art can be solved.

It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.