阅读说明：本技术 易于制造且在高频带下性能可控的贴片天线设计 (Easy to manufacture and performance controllable patch antenna design at high frequency band ) 是由 T·张 N·坦贝 J·拉戈斯 N·桑达拉詹 于 2019-05-14 设计创作，主要内容包括：公开了一种用于天线的高频辐射器。高频辐射器是由辐射器板安装于其上的两个互锁的PCB杆形成的。在每个互锁PCB杆上布置的是馈线金属迹线与相对的金属迹线的两个组合,馈线金属迹线与相对的金属迹线布置于PCB杆的相对侧,并通过形成在PCB杆中的至少一个通孔和通孔内部的焊点电耦合在一起。与常规设计相比,这种高频辐射器的构造制造起来相当便宜,并且不易受焊接连接件尺寸不一致导致的阻抗匹配问题的影响。(A high-frequency radiator for an antenna is disclosed. The high frequency radiator is formed by two interlocking PCB bars on which the radiator plates are mounted. Disposed on each of the interlocking PCB bars are two combinations of a feed line metal trace and an opposing metal trace disposed on opposite sides of the PCB bar and electrically coupled together by at least one via formed in the PCB bar and a solder joint inside the via. The construction of such a high frequency radiator is considerably cheaper to manufacture than conventional designs and is less susceptible to impedance matching problems caused by non-uniform sizes of soldered connections.)

1. A radiator for an antenna, the radiator comprising:

a pair of PCB bars arranged in a criss-cross manner, each of the PCB bars having a front side and a rear side, wherein disposed on each PCB bar are a pair of feeder metal traces and a corresponding pair of opposing metal traces, wherein each combination of a feeder metal trace and a corresponding opposing metal trace is electrically coupled through at least one via formed in the PCB bar; and

a radiator plate mechanically coupled to the pair of PCB bars.

2. The radiator of claim 1, wherein the radiator plate comprises: a PCB substrate; and

and the metal plate is arranged on the PCB substrate.

3. The radiator of claim 1, wherein the radiator plate comprises: a metal plate; and

the metal plate is mechanically coupled to a non-conductive support infrastructure.

4. The radiator as claimed in claim 1, wherein each feed line metal trace comprises a feed line portion and a horizontal trace portion.

5. The radiator as claimed in claim 4, wherein the horizontal trace portion has a profile that substantially overlaps a profile of the respective opposing metal trace.

6. The radiator as claimed in claim 5, wherein the at least one via comprises a plurality of vias disposed between the horizontal trace portion and the respective opposing metal trace.

7. The radiator as claimed in claim 6, wherein the profile includes a length and a width, and wherein each via has a via length, and wherein the length, the width, the via length, via spacing and number of vias are selected to obtain a desired impedance match over the entire frequency range.

8. The radiator as claimed in claim 1, wherein each PCB bar comprises two PCB segments, each PCB segment having one combination of the feed metal trace and the respective opposing metal trace.

9. An antenna having a plurality of high frequency radiators, each of the high frequency radiators comprising:

a pair of PCB bars arranged in a criss-cross manner, each of the PCB bars having a front side and a rear side, wherein disposed on each PCB bar are a pair of feeder metal traces and a corresponding pair of opposing metal traces, wherein each combination of a feeder metal trace and a corresponding opposing metal trace is electrically coupled through at least one via formed in the PCB bar; and

a radiator plate mechanically coupled to the pair of PCB bars.

Technical Field

The present invention relates to wireless communications, and more particularly to an antenna capable of operating in a high frequency range.

Background

As mobile communication moves toward the 5G era, the demand for higher data rates through carrier aggregation has increased, resulting in the utilization of spectrum in higher frequency ranges. New 3GPP frequency bands such as the national broadband radio service (CBRS) spectrum (3550-. In view of the shorter wavelengths corresponding to these higher frequencies, slight imperfections or inaccuracies in the solder connections or radiator plate mounting can result in a large percentage of wavelength variation, resulting in poor impedance matching.

Fig. 1A shows a conventional high frequency radiator 100 comprising a PCB (printed circuit board) radiator plate 110 and a passive radiator plate 120, both mechanically mounted to a non-conductive support base 130. The PCB/radiator plate 110 is electrically coupled to four metal pins 140 that carry the RF signals to be radiated to the PCB radiator plate 110.

Fig. 1B is a cross-sectional view of a conventional high frequency radiator 100 showing the PCB/radiator board 110 and one of four metal pins 140. The metal pin 140 is electrically coupled to the PCB/radiator board 110 at a feed metal pad 160 by a solder joint 150 and to a feed line 170 by another solder joint. The other three metal pins 140 are similarly coupled.

Fig. 1C is a side view of a conventional high frequency radiator 100 showing the relative heights of the PCB/radiator plate 110 and the first passive radiator plate 120. A second passive radiator plate 122 or/and a third passive radiator 124 mechanically mounted to a non-conductive support base 130 can be added for better bandwidth. As is apparent from the illustration, the height or protrusion of solder joint 150 above PCB/radiator plate 110 is a significant percentage of the distance between PCB/radiator plate 110 and passive radiator plate 120.

The conventional high-frequency radiator 100 presents the following challenges. First, given four metal pins 140, each of which is soldered to a feed metal pad 160 and a corresponding feed line 170, eight solder connections are required to mount each conventional high frequency radiator 100 to the antenna array face. Further, given the height or protrusion of solder joint 150, and given standard manufacturing variations in soldering, the height of a given solder joint 150 can vary by a significant percentage of the distance between PCB/radiator board 110 and passive radiator board 120. These variations in the height of the solder joints 150 can cause considerable impedance mismatch in the conventional high frequency radiator 100. In addition, since the center of the plate 110/120/122/124 is mounted to the non-conductive support base 130, they may bend. This may result in a change in the distance between the PCB/radiator board 110 and the passive radiator board 120.

To assemble an antenna, a non-conductive support base 130, four metal pins 140, PCB/radiator board 110 and at least one passive radiator board 120 are required, as well as eight solder connections.

There is therefore a need for a high-frequency radiator which is less expensive to manufacture and which is also substantially unaffected by manufacturing variations such as welded and bent sheet metal.

Disclosure of Invention

An aspect of the present disclosure relates to a radiator for an antenna. The radiator comprises pairs of PCB bars arranged in a crossed manner, each of the PCB bars having a front side and a rear side, wherein a pair of feeder metal traces and a corresponding pair of opposing metal traces are arranged on each PCB bar, wherein each feeder metal trace in combination with the corresponding opposing metal trace is electrically coupled through at least one via formed in the PCB bar. The radiator further includes a radiator plate mechanically coupled to the pair of PCB bars.

Another aspect of the invention relates to an antenna having a plurality of high frequency radiators. Each of the high frequency radiators comprises a pair of PCB bars arranged in a crossed manner, each of the PCB bars having a front side and a back side, wherein a pair of feeder metal traces and a corresponding pair of opposing metal traces are arranged on each PCB bar, wherein each feeder metal trace in combination with the corresponding opposing metal trace is electrically coupled through at least one via formed in the PCB bar. Each of the high frequency radiators further comprises a radiator plate mechanically coupled to the pair of PCB bars.

Drawings

The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate a patch antenna design that is easy to manufacture and controllable in performance at high frequency bands. Together with the description, the drawings further serve to explain the principles of the patch antenna design described herein that is easy to manufacture and controllable in performance at high frequency bands, and thereby enable one skilled in the relevant art to manufacture and use the patch antenna design that is easy to manufacture and controllable in performance at high frequency bands.

Fig. 1A shows a conventional high-frequency radiator.

Fig. 1B is a sectional view of the conventional high-frequency radiator of fig. 1A.

Fig. 1C is a side view of the conventional high-frequency radiator of fig. 1A.

Fig. 2 shows a high-frequency radiator according to the present disclosure.

Fig. 3 shows two sides of a PCB bar for the high-frequency radiator of fig. 2.

Fig. 4A shows front and rear metal traces disposed on the front and rear sides of a PCB bar (with the PCB bar structure removed from illustration), connected by a plurality of conductive traces disposed within vias disposed in the PCB bar structure.

Fig. 4B is a "top" view of front and back metal traces connected by a plurality of conductive traces disposed within vias.

Fig. 4C is a side view of the front metal traces and example dimensions.

Fig. 5A is a top view of a PCB radiator board of an exemplary high frequency radiator according to the present disclosure.

Fig. 5B shows an alternative embodiment using metal patches instead of PCB radiator boards.

Fig. 6 illustrates an exemplary arrangement of high-frequency radiators, as they may be constructed on the array face.

Fig. 7 is an exemplary return loss plot corresponding to a high frequency radiator according to the present disclosure.

Fig. 8 is an exemplary isolation drawing corresponding to a high frequency radiator according to the present disclosure.

Fig. 9 is an exemplary azimuthal radiation pattern corresponding to a high frequency radiator according to the present disclosure.

Fig. 10 is an exemplary pitch radiation pattern corresponding to a high frequency radiator according to the present disclosure.

Detailed Description

Embodiments of a patch antenna design that is easy to manufacture and controllable in performance at high frequency bands will now be described in detail with reference to the accompanying drawings.

Fig. 2 illustrates an exemplary high frequency radiator 200 arranged on an array-face PCB 202 according to the present disclosure. The high frequency radiator 200 comprises a PCB radiator plate 210 mounted to two PCB bars 230 arranged in an interlocking cross configuration. Disposed on each PCB bar 230 are a feeder metal trace 240 and an opposing metal trace 245, each disposed on opposite sides of a respective PCB bar 230. The feed line metal traces 240 are coupled to an RF feed line (not shown) by solder connections 260.

Fig. 3 shows two sides of the PCB bar 230, including a front side and a back side. Disposed on the front side of the PCB bar 230 is a feed metal trace 240. The feed line metal trace 240 has a vertical feed line portion 320 and a horizontal trace portion 330. Disposed on the rear side of PCB bar 230 are opposing metal traces 245. The opposing metal traces 245 may have a profile (or dimension) that may substantially overlap the profile of the horizontal trace portion 330 of the feed line metal trace 240. Disposed within the feed metal trace 240 and the opposing metal trace 245 are a plurality of vias 350 that penetrate the PCB bar 230 and enable the feed metal trace 240 and the opposing metal trace 245 to be electrically coupled using solder or another form of electrical connection. The vias 350 may be arranged horizontally along the outline of the horizontal trace portion 330 and the opposing metal trace 245. The position of the horizontal trace portion 330 and its corresponding opposing metal trace 245 along the vertical dimension may be such that RF current flowing in the combination of the horizontal trace portion 330, the opposing metal trace 245, and the solder in the via 350 may apply RF radiation coupled with the PB radiator plate 210.

Variations of the PCB bar 230 are possible and within the scope of the present disclosure. For example, instead of a single PCB bar 230 having two pairs of feeder metal traces 240 and opposing metal traces 245, each feeder metal trace 240 and opposing metal trace 245 may have its own PCB bar assembly, and the two PCB bar assemblies may be physically coupled or separately mechanically coupled to the PCB radiator board 210. Further, while the PCB bar 230 is shown with two feeder metal traces 240 on one side and two opposing metal traces 245 on the other side, it will be readily appreciated that each combination of feeder metal traces 240 and opposing metal traces 245 may be reversed such that one feeder metal trace 240 may be on one side of the PCB bar 230 and the other feeder metal trace 240 may be on the other side of the PCB bar 230. Additionally, although the PCB bar 230 is shown as a single PCB assembly, the PCB bar 230 may be comprised of two separate PCB sections, each having a combination of a feed metal trace 240 and an opposing metal trace 245.

Fig. 4A shows feed line metal traces 240 and opposing metal traces 245 arranged on the front and back sides of a PCB bar (with the PCB bar structure removed from illustration), connected by a plurality of conductive traces arranged within vias 350 arranged in the PCB bar structure. Each combination of traces 240 and 245 coupled by a respective via 350 provides sufficient volume of conductive material in proper configuration and proximity to the PCB radiator plate 210 to pump sufficient RF flux into the PCB radiator plate 210 to cause the high frequency radiator 200 to operate at substantially the same efficiency as the conventional high frequency radiator 100, but with fewer components. In view of the rigid and interlocking nature of the PCB bar 230, the high frequency radiator 200 does not require the additional support structure required by the conventional high frequency radiator 100. Furthermore, the high-frequency radiator 200 requires only four welded connections 260 instead of eight.

In addition, the configuration of the feed line metal trace 240 and the opposing metal trace 245, and their corresponding vias 350, enables the solder joints within the vias 350 to be completed in a manner that does not protrude toward the PCB radiator board 210, and thus does not cause the inaccuracy of impedance matching that occurs with conventional high frequency radiators 100. In other words, the design of the high-frequency radiator 200 is tolerant to inaccuracies in the welding.

Fig. 4B is a "top" view of the feed line metal trace 240, the opposing metal trace 245 and its corresponding via 350, and fig. 4C is a side view of the feed line metal trace 240. Both figures include exemplary dimensions. The length of the metal traces, the width of the metal traces, the length of the vias (PCB substrate thickness), the spacing between the vias, and the number of vias may be specifically selected to achieve good impedance matching across the desired frequency band.

Fig. 5A is a top view of the PCB radiator plate 210 of the high frequency radiator 200, which comprises a metal plate 510 and intersecting holes 520 through which the interlocking PCB rods 230 mechanically engage to support the PCB radiator plate 210 and provide mechanical rigidity to the high frequency radiator 200.

Fig. 5B shows an alternative embodiment using a metal patch 550 in place of the PCB radiator plate 210. To ensure a stable and consistent orientation of the metal patch 550, a non-conductive support base structure 560 is provided. It will be understood that such variations are possible and are within the scope of the present disclosure.

Fig. 6 illustrates an arrangement of exemplary high-frequency radiators 200, as they may be constructed on the array face. Three high frequency radiators 200 coupled together to two RF signals through RF input ports 605a/b, input feeds 610a/b, fan-out feeds 615a/b and phase separation feeds 620a/b are shown. Each RF input signal is fed to a pair of feeder metal traces 240 on one of the PCB bars 230. As illustrated, a given RF input signal is split into two phase separated feeds 620 a/b. Given the difference in length between the split feeds 620a/b, the RF signal presented to one feeder metal trace 240 on a given PCB bar 230 will be phase shifted substantially 90 degrees from the RF signal presented to another front side feeder metal trace 240 on the same PCB bar 240. This serves two functions for the antenna: (1) rotating the polarization vector of the transmitted RF signal by 45 degrees; (2) the high frequency radiator 200 is enabled to operate in a circular polarisation mode by inputting a single RF signal into both RF inputs 605a/b but with a 90 degree phase offset between them.

Fig. 7 is a plot of return loss of an exemplary measurement corresponding to a high frequency radiator according to the present disclosure, and fig. 8 is a plot of isolation of an exemplary measurement corresponding to a high frequency radiator according to the present disclosure, depicting superior performance of high frequency radiator 200.

Fig. 9 is an exemplary azimuthal radiation pattern plot corresponding to a high-frequency radiator according to the present disclosure, and fig. 10 is an exemplary azimuthal radiation pattern plot corresponding to a high-frequency radiator according to the present disclosure, depicting superior performance of high-frequency radiator 200. The proposed structure shows good impedance matching and isolation characteristics that can be achieved and controlled.

While various embodiments of patch antenna designs have been described above that are easy to manufacture and controllable in performance at high frequency bands, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the disclosure. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims appended hereto and their equivalents.