阅读说明：本技术 一种脆性金属结合剂、金属结合剂砂轮及其制备方法和应用 (Brittle metal binding agent, metal binding agent grinding wheel and preparation method and application thereof ) 是由 赵赋 王冻冻 邴建立 杜晓旭 邵强 于 2020-10-30 设计创作，主要内容包括：本发明属于磨具磨削技术领域,具体涉及一种脆性金属结合剂、金属结合剂砂轮及其制备方法和应用。所述脆性金属结合剂,包括以下体积份数的原料：60-75份铜粉、15-25份锡粉、2-5份锌粉、2-5份银粉、3-8份石墨粉末和3-6份陶瓷粉末。采用本发明制备的脆性金属结合剂制备的砂轮,有效解决了复杂结构电子元器件中延性材料加工不良的问题。(The invention belongs to the technical field of grinding tools, and particularly relates to a brittle metal bonding agent, a metal bonding agent grinding wheel, and a preparation method and application thereof. The brittle metal bonding agent comprises the following raw materials in parts by volume: 60-75 parts of copper powder, 15-25 parts of tin powder, 2-5 parts of zinc powder, 2-5 parts of silver powder, 3-8 parts of graphite powder and 3-6 parts of ceramic powder. The grinding wheel prepared by the brittle metal bonding agent effectively solves the problem of poor processing of ductile materials in electronic components with complex structures.)

1. The brittle metal bonding agent is characterized by comprising the following raw materials in parts by volume: 60-75 parts of copper powder, 15-25 parts of tin powder, 2-5 parts of zinc powder, 2-5 parts of silver powder, 3-8 parts of graphite powder and 3-6 parts of ceramic powder.

2. The brittle metal bonding agent according to claim 1, wherein the copper powder, the tin powder, the zinc powder and the silver powder each have a particle size of 170 to 325 mesh, and the graphite powder and the ceramic powder each have a particle size of 700 to 800 mesh.

3. The brittle metal bond as claimed in claim 1, characterized in that the ceramic is Al₂O₃、SiC、SiO₂One or more of (a).

4. The method for preparing the brittle metal binder as claimed in any one of claims 1 to 3, wherein the method comprises the steps of sieving and mixing copper powder, tin powder, zinc powder and silver powder in the formula to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and mixing to obtain the brittle metal binder.

5. The method for manufacturing a metal bond grinding wheel according to claim 4, wherein the copper powder, the tin powder, the zinc powder and the silver powder are mixed by ball milling.

6. The method for preparing the metal bond grinding wheel by adopting the brittle metal bond as claimed in any one of claims 1 to 3 is characterized by comprising the following raw materials in parts by volume: 5-10 parts of diamond abrasive and 90-95 parts of brittle metal bonding agent.

7. The method of making a metal bond grinding wheel as defined in claim 6, including the steps of:

(1) uniformly mixing the diamond abrasive and the brittle metal bonding agent in the formula to obtain a grinding wheel mixture;

(2) and (3) putting the grinding wheel mixture into a mold for cold press molding, and sintering at 500-550 ℃ to obtain the metal bond grinding wheel.

8. The metal bond grinding wheel according to claim 6 is used for cutting electronic components.

Technical Field

The invention belongs to the technical field of grinding tools, and particularly relates to a brittle metal bonding agent, a metal bonding agent grinding wheel, and a preparation method and application thereof.

Background

The high-speed development of the electronic industry has driven electronic components's continuous innovation, no matter be ultra-thin, small, become more meticulous, perhaps complicated, jumbo size, module integration, and a lot of customization electronic components constantly appear, also proposed stricter, more complicated technical requirement to the processing of this type of product, for example to the process of this type of product by the monoblock cutting independent unit, need compromise each side particularity such as work piece material, structure, the problem of variety. Specific possible considerations are as follows:

1) the structure of the workpiece is complicated

The cutting channel of the electronic component is generally of a multilayer copper frame structure in the vertical direction, the middle of the cutting channel is filled with materials such as brittle plastics, the upper layer and the lower layer are more, and the problems of copper wire drawing, layering and the like are easily caused; unstable breaking structures may occur in the longitudinal and transverse directions of the cutting path, the corner positions of the workpiece are easy to deflect and fly particles in the cutting process, and the breaking phenomenon is generated on the grinding wheel for cutting;

2) high cutting resistance

The workpiece is thick, the number of layers is large, the size of a single unit is large, the cutting resistance is large, the problems of poor workpiece adsorption, cutting size deviation and the like are easily caused, and the workpiece is difficult to process;

3) high processing requirements

The requirements on the processing technology are high, the cutting speed of the grinding wheel needs to be over 180mm/s, the rotating speed is 30000-40000 rpm, the cutting grinding wheel is easy to break, and the grinding wheel needs to have high sharpness, strength and the like.

The existing diamond grinding wheel for cutting electronic components is mostly universal and is mostly suitable for cutting workpieces with simple structure and low processing technology requirement, and the diamond grinding wheel formed by sintering general universal bonding agents is not ideal in cutting effect of the electronic components with complex structure, large size and high processing technology requirement and has no pertinence, so that the research and development of a new bonding agent product are urgently needed.

Disclosure of Invention

In order to overcome the problems in the prior art, the invention provides a brittle metal bond, a metal bond grinding wheel, and a preparation method and application thereof. The grinding wheel prepared by the brittle metal bonding agent effectively solves the problem of poor processing of ductile materials in electronic components.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a brittle metal bond, a metal bond grinding wheel and a preparation method and application thereof comprise the following raw materials in parts by volume: 5-10 parts of diamond abrasive, 60-75 parts of copper powder, 15-25 parts of tin powder, 2-5 parts of zinc powder, 2-5 parts of silver powder, 3-8 parts of graphite powder and 3-6 parts of ceramic powder.

Preferably, the granularity of the copper powder, the tin powder, the zinc powder and the silver powder is 170-325 meshes. The zinc powder can soften the hardness of the binding agent, reduce the wear resistance of the binding agent and improve the sharpness of the grinding wheel; the silver powder can promote metallurgical reaction among all metals and promote the uniformity of the integral structure of the grinding wheel.

Preferably, the particle size of the graphite powder and the ceramic powder is 700-800 meshes. Graphite can play the lubrication action in the emery wheel use, reduces among electronic components materials such as copper, plastics and blocks up the adhesion of emery wheel, reduces the processing resistance to graphite and ceramic powder can improve the emery wheel sharpness.

Preferably, the ceramic is Al₂O₃、SiC、SiO₂One or more of (a).

The preparation method of the brittle metal bonding agent comprises the following steps of taking copper powder, tin powder, zinc powder and silver powder in a formula, sieving and uniformly mixing to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and uniformly mixing to obtain the brittle metal bonding agent.

Preferably, the copper powder, the tin powder, the zinc powder and the silver powder are mixed by ball milling.

The metal bond grinding wheel prepared by adopting the brittle metal bond comprises the following raw materials in parts by volume: 5-10 parts of diamond abrasive and 90-95 parts of brittle metal bonding agent.

Preferably, the diamond abrasive has a particle size of 600# to 320 #.

The preparation method of the metal bond grinding wheel comprises the following steps:

(1) uniformly mixing the diamond abrasive and the brittle metal bonding agent in the formula to obtain a grinding wheel mixture;

(2) and (3) putting the grinding wheel mixture into a mold for cold press molding, and sintering at 500-550 ℃ to obtain the metal bond grinding wheel.

The metal bond grinding wheel is used for cutting and processing electronic components, and is particularly used for cutting and processing electronic components.

Compared with the prior art, the invention has the beneficial effects that: effectively solve the bad problem of ductility material processing among the electronic components: a. by adopting a brittle bonding agent system, the performance of the bonding agent can show the characteristics of high brittleness, low plasticity, poor strength and easy abrasion, and the bonding agent can be brittle-broken in time under the conditions that the cutting edge is blocked and the cutting resistance is increased, so that the copper adhered together is peeled off; b. the bonding agent is supplemented with a large amount of dispersed particles and antifriction pore-forming materials, the strength of the bonding agent is continuously reduced, so that the abrasion speed of the bonding agent has the characteristic of being greater than the abrasion blunting speed of the abrasive, and the bonding agent falls off in tiny particles during abrasion instead of the common ductile falling mode of a metal bonding agent, the cutting and processing requirements of large-size electronic components with complex structures are met, and the method has great popularization significance.

Drawings

FIG. 1 is a microstructure topography of a brittle metal bond coupon of example 1;

FIG. 2 is a microstructure topography of a test block of the common binder of comparative example 1:

FIG. 3 is a diagram showing the effect of the metal bond grinding wheel of example 1 after cutting;

fig. 4 is a graph showing the effect of cutting using the metal bond grinding wheel of comparative example 1.

Detailed Description

The invention is further illustrated, but not limited, by the following examples and the accompanying drawings.

Example 1

The brittle metal bonding agent of the embodiment is composed of the following raw materials in parts by volume: 65 parts of Cu powder, 15 parts of Sn powder, 3 parts of Zn powder, 3 parts of Ag powder, 8 parts of graphite powder, 3 parts of SiC powder and 3 parts of SiO₂And (3) powder.

The preparation method of the brittle metal bonding agent comprises the following steps of taking copper powder, tin powder, zinc powder and silver powder in a formula, sieving and uniformly mixing to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and uniformly mixing to obtain the brittle metal bonding agent.

The metal bond grinding wheel prepared by adopting the brittle metal bond comprises the following raw materials in parts by volume: 6 parts of diamond abrasive (granularity 600# -520 #), and 94 parts of brittle metal bonding agent.

The preparation method of the metal bond grinding wheel comprises the following steps:

(1) uniformly mixing the diamond abrasive, the brittle metal bonding agent, the graphite powder and the ceramic powder in the formula to obtain a grinding wheel mixture;

(2) and putting the grinding wheel mixture into a mold for cold press molding, and sintering at 550 ℃ to obtain the metal bond grinding wheel.

Example 2

The brittle metal bonding agent of the embodiment is composed of the following raw materials in parts by volume: 70 parts of Cu powder, 20 parts of Sn powder, 2 parts of Zn powder, 2 parts of Ag powder, 3 parts of graphite powder and 3 parts of SiC powder.

The preparation method of the brittle metal bonding agent comprises the following steps of taking copper powder, tin powder, zinc powder and silver powder in a formula, sieving and uniformly mixing to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and uniformly mixing to obtain the brittle metal bonding agent.

The metal bond grinding wheel prepared by adopting the brittle metal bond comprises the following raw materials in parts by volume: 10 parts of diamond abrasive (granularity 420-380 #), and 90 parts of brittle metal bonding agent.

The preparation method of the metal bond grinding wheel comprises the following steps:

(1) uniformly mixing the diamond abrasive, the brittle metal bonding agent, the graphite powder and the ceramic powder in the formula to obtain a grinding wheel mixture;

(2) and putting the grinding wheel mixture into a mold for cold press molding, and sintering at 520 ℃ to obtain the metal bond grinding wheel.

Example 3

The brittle metal bonding agent of the embodiment is composed of the following raw materials in parts by volume: 60 parts of Cu powder, 25 parts of Sn powder, 5 parts of Zn powder, 4 parts of Ag powder, 3 parts of graphite powder and 3 parts of Al₂O₃And (3) powder.

The preparation method of the brittle metal bonding agent comprises the following steps of taking copper powder, tin powder, zinc powder and silver powder in a formula, sieving and uniformly mixing to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and uniformly mixing to obtain the brittle metal bonding agent.

The metal bond grinding wheel prepared by adopting the brittle metal bond comprises the following raw materials in parts by volume: 8 parts of diamond abrasive (granularity 600# -550 #), and 92 parts of brittle metal bonding agent.

The preparation method of the metal bond grinding wheel comprises the following steps:

(1) uniformly mixing the diamond abrasive, the brittle metal bonding agent, the graphite powder and the ceramic powder in the formula to obtain a grinding wheel mixture;

(2) and putting the grinding wheel mixture into a mold for cold press molding, and sintering at 500 ℃ to obtain the metal bond grinding wheel.

Example 4

The brittle metal bonding agent of the embodiment is composed of the following raw materials in parts by volume: 75 parts of Cu powder, 15 parts of Sn powder, 2 parts of Zn powder, 2 parts of Ag powder, 3 parts of graphite powder and 1 part of Al₂O₃Powder, 1 part of SiC powder and 1 part of SiO₂And (3) powder.

The preparation method of the brittle metal bonding agent comprises the following steps of taking copper powder, tin powder, zinc powder and silver powder in a formula, sieving and uniformly mixing to obtain a mixture A, adding graphite powder and ceramic powder in the formula into the mixture A, and uniformly mixing to obtain the brittle metal bonding agent.

The metal bond grinding wheel prepared by adopting the brittle metal bond comprises the following raw materials in parts by volume: 7 parts of diamond abrasive (granularity 530-450 #), and 93 parts of brittle metal bonding agent.

The preparation method of the metal bond grinding wheel comprises the following steps:

(1) uniformly mixing the diamond abrasive, the brittle metal bonding agent, the graphite powder and the ceramic powder in the formula to obtain a grinding wheel mixture;

(2) and putting the grinding wheel mixture into a mold for cold press molding, and sintering at 530 ℃ to obtain the metal bond grinding wheel.

Example 5

This example differs from example 1 in that: the diamond abrasive particle size is 360# -320 #.

Comparative example 1

This comparative example differs from example 1 in that: the type of metal binder is different.

The comparative example adopts a common metal bonding agent, and consists of the following raw materials in parts by volume: 85 parts of Cu powder and 15 parts of Sn powder.

The formula and the preparation process of the metal bond grinding wheel prepared by adopting the bonding agent of the comparative example are the same as those of the example 1.

Standard test blocks (standard test block size: 8X 55 mm; preparation method: corresponding bonding agent powder without adding diamond abrasive is placed in a corresponding sintering mold, and sintered at 550 ℃ to obtain the standard test blocks, and then performance test is carried out (wherein hardness is measured by adopting a Rockwell hardness tester according to GB-T230.1-2018 standard, and breaking strength is measured by adopting a three-point bending tester according to YB/T5349-.

Table 1 results of performance testing of standard test blocks prepared using the binders of example 1 and comparative example 1

Numbering	Density/g.cm-3	Hardness of/HRB	Flexural strength/MPa
				Comparative example 1	8.87	87	830
Example 1	6.95	97	300

As can be seen from the data in Table 1, compared with the common binder in comparative example 1, the standard test block prepared by using the brittle binder in example 1 has the characteristics of high hardness and low strength, so that the binder is more likely to be brittle and peeled off and is more likely to be worn, and the sharpness of the product is effectively improved.

The microstructure topography (i.e., SEM) of the brittle metal bond test piece of example 1 (i.e., the standard test piece prepared using the brittle metal bond of example 1) is shown in fig. 1, and the microstructure topography of the ordinary bond test piece of comparative example 1 (i.e., the standard test piece prepared using the ordinary bond of comparative example 1) is shown in fig. 2. As can be seen from fig. 1 and 2, in terms of microscopic morphology, the fracture of the brittle binder test block of example 1 is mainly characterized by brittle cleavage morphology and presents brittle material characteristics, and due to the addition of anti-wear pore-forming auxiliary materials (graphite and ceramic) in the binder, many pores exist, the continuity is poor, and the brittle peeling and the wear in a granular peeling mode are more likely to occur. The wearing mode of the brittle bonding agent is different from the wearing mode of the conventional bonding agent, and the processing problem of ductile materials can be effectively solved.

Cutting tests were performed using the grinding wheels (grinding wheel model outer diameter 58mm, thickness 0.3mm, inner hole 40mm) in example 1 and comparative example 1 (using an industry-specific dicing cutter, performing a cutting process of a workpiece according to a grinding wheel rotation speed of 30000rpm and a cutting feed of 30mm/s, wherein the specific workpiece is a PCB, the length is 270mm, the width is 90mm, the thickness is 0.8mm, the cutting is a size, the length is 30mm, the width is 30mm, the thickness is 0.8mm, the internal structure of the electronic component comprises a copper ductile frame and a plastic package material, the cutting process needs to cut and separate a corresponding composite material into corresponding cut sizes), the cut effects are shown in fig. 3 and fig. 4, respectively, and the cutting quality indexes are shown in table 2.

TABLE 2 index of cutting quality of grinding wheels of example 1 and comparative example 1

In table 2, the dimensional deviation of the electronic component after the grinding wheel cutting, the cutting distance of the grinding wheel (i.e. service life), the copper wire drawing length after the cutting (the extension length of the ductile copper metal frame around the workpiece), the notch (the notch size of the plastic packaging material around the workpiece), the feed speed parameter which can be achieved during the cutting process, and the like, which are prepared in comparative example 1 and example 1, are compared, and whether each parameter can reach the check index or not is determined. Wherein, the grinding wheel of comparative example 1 does not meet the 200m index at the cutting distance (i.e. service life), and the copper wire drawing length index does not meet the standard.

FIG. 3 is the surface state of the grinding wheel in example 1 after cutting at 30000rpm and a feeding speed of 30mm/s, wherein the ductile copper metal frame is slightly stretched, the copper wire drawing meets the index of less than or equal to 0.05mm, the plastic package material is hardly broken, and the index of less than or equal to 0.1mm is met; FIG. 4 shows the surface state of the grinding wheel in comparative example 1 after cutting at 30000rpm and a feeding speed of 30mm/s, in which the ductile copper metal frame is significantly extended and the copper wire drawing length reaches 0.087mm, which does not meet the index of less than or equal to 0.05 mm.