阅读说明：本技术 一种半导体激光器老化夹具及其应用 (Semiconductor laser aging clamp and application thereof ) 是由 邵长国 马崇彩 孙素娟 开北超 郑兆河 于 2020-03-18 设计创作，主要内容包括：本发明涉及一种半导体激光器老化夹具及其应用,包括水冷板、限位板、快速夹具和压条；限位板,设置在水冷板上表面,其上开设有至少一个与半导体激光器相匹配的限位孔；快速夹具,设置在水冷板一端；压条,一端与水冷板铰接,另一端通过快速夹具夹紧,其上开设有与限位孔一一对应的沉孔,沉孔内安装有弹性压块,弹性压块用于压紧半导体激光器。本发明半导体激光器老化夹具可一次性将多个半导体激光器放置在限位板上,并由压条同时固定在水冷板上,相比传统方式通过螺丝逐个固定半导体激光器,安装效率大大提高。(The invention relates to a semiconductor laser aging clamp and application thereof, wherein the clamp comprises a water cooling plate, a limiting plate, a rapid clamp and a pressing strip; the limiting plate is arranged on the upper surface of the water cooling plate and provided with at least one limiting hole matched with the semiconductor laser; the rapid clamp is arranged at one end of the water cooling plate; one end of the pressing strip is hinged with the water cooling plate, the other end of the pressing strip is clamped tightly through the rapid clamp, counter bores corresponding to the limiting holes one to one are formed in the pressing strip, and elastic pressing blocks are installed in the counter bores and used for pressing the semiconductor laser. The semiconductor laser aging clamp can place a plurality of semiconductor lasers on the limiting plate at one time and fix the semiconductor lasers on the water cooling plate through the pressing strips at the same time, and compared with the traditional mode that the semiconductor lasers are fixed one by one through screws, the semiconductor laser aging clamp has the advantage that the installation efficiency is greatly improved.)

1. The semiconductor laser aging clamp is characterized by comprising a water cooling plate, a limiting plate, a rapid clamp and a pressing strip;

the limiting plate is arranged on the upper surface of the water cooling plate and provided with at least one limiting hole matched with the semiconductor laser;

the rapid clamp is arranged at one end of the water cooling plate;

one end of the pressing strip is hinged with the water cooling plate, the other end of the pressing strip is clamped tightly through the rapid clamp, counter bores corresponding to the limiting holes one to one are formed in the pressing strip, and elastic pressing blocks are installed in the counter bores and used for pressing the semiconductor laser.

2. The jig for aging a semiconductor laser as claimed in claim 1, wherein the stopper plate is mounted on the upper surface of the water-cooled plate by bolts.

3. The semiconductor laser aging fixture according to claim 1, wherein a support is fixed to one end of the water-cooled plate, and one end of the pressing bar is connected to the support through a rotating shaft.

4. The semiconductor laser aging fixture of claim 3, wherein the holder is provided with a cavity, one end of the pressing bar is located in the cavity, and the rotating shaft penetrates through the pressing bar and two sides of the cavity.

5. A semiconductor laser aging jig according to claim 3, wherein a support is fixed to the other end of the water-cooled plate, and the quick clamp is mounted on the support.

6. The semiconductor laser aging fixture according to claim 5, wherein the rapid fixture comprises a frame, a side link A, a side link B and a connecting rod, flanges are arranged on two sides of the frame, one end of the side link A and one end of the side link B are hinged with the frame, the other end of the side link A and the other end of the side link B are hinged with the connecting rod, and one end of the connecting rod is used for clamping a pressing bar.

7. The jig for aging of a semiconductor laser as claimed in claim 6, wherein the support is provided with bolt holes, and both side flanges of the frame are mounted on the support by bolts.

8. The fixture for aging a semiconductor laser as claimed in claim 1, wherein the counterbore has a through hole and two bead spring retaining holes therein, the two bead spring retaining holes being located on both sides of the through hole.

9. The semiconductor laser aging fixture of claim 8, wherein the resilient pressing block is provided with a threaded hole and two pressing block spring limiting holes, the two pressing block spring limiting holes are located at two sides of the threaded hole, the screw penetrates through the through hole and then connects with the threaded hole, and a spring is placed between the two pressing block spring limiting holes and the two pressing block spring limiting holes.

10. A method of using the semiconductor laser aging jig according to any one of claims 1 to 9, comprising the steps of:

(1) firstly, mounting a limiting plate on the upper surface of a water cooling plate, and then placing a plurality of semiconductor lasers into limiting holes of the limiting plate one by one;

(2) the expansion amount of the elastic pressing block in the counter bore is adjusted through the screw, so that the pressure of the elastic pressing block is adjusted through the compression spring;

(3) one end of the pressing strip rotates around a rotating shaft of the support, the elastic pressing block is tightly pressed on the semiconductor laser by the falling of the pressing strip, and the other end of the pressing strip is clamped by the rapid clamp.

Technical Field

The invention relates to a semiconductor laser aging clamp and application thereof, and belongs to the technical field of semiconductor laser tools.

Background

Laser science has enjoyed tremendous success over the past few decades in making higher, faster, and smaller coherent light sources. Similar to electronic devices, the miniaturization and integration of photonic devices have wide application prospects. The semiconductor laser has the excellent characteristics of small volume, light weight, high conversion efficiency and the like, and is widely applied to the fields of display, industrial processing, medical treatment, pumping and the like. In recent years, with the rapid development of semiconductor material epitaxial growth technology, semiconductor laser waveguide structure optimization technology, cavity surface passivation technology, high-stability packaging technology and high-efficiency heat dissipation technology, particularly under the promotion of direct semiconductor laser industrial processing application and the pumping requirement of high-power optical fiber lasers, the rapid development of semiconductor lasers with high power and high beam quality provides a light source foundation for obtaining high-quality and high-performance direct semiconductor laser processing equipment and high-performance high-power optical fiber laser pumping sources. For example, in the field of communications, how to enable the output light of a laser to be transmitted more stably and over longer distances, and how to enable the output optical power of a semiconductor laser to be transmitted onto a laser gain medium more efficiently in a pumped solid-state laser, thereby obtaining higher pumping efficiency, all relate to the problem of coupling between the semiconductor laser and an optical fiber.

Generally, spatial beam combination and polarization beam combination mainly focus or image laser beams emitted by a semiconductor laser to the end face of a fiber core after shaping the laser beams through a fast axis and a slow axis. The light guide part of the optical fiber consists of a fiber core and a cladding, and the refractive index of the fiber core is slightly larger than that of the cladding. When the light divergence angle of the incident light to the end face of the fiber core of the optical fiber is smaller than the numerical aperture of the optical fiber, the light divergence angle of the incident light to the end face of the fiber core of the optical fiber is totally reflected at the interface of the fiber core and the cladding, and when the light divergence angle of the incident light to the end face of the fiber core of the optical fiber is larger than the numerical aperture of the optical fiber, the total reflection at the interface of the fiber core and the cladding can not occur even if the light divergence angle of the incident light to the fiber core of the optical fiber enters the fiber core, so that the light can be refracted out of the optical fiber rapidly and not transmitted at the fiber core to form cladding light, and the cladding light is converted into heat. However, the optical fiber coupling has a certain coupling efficiency due to the spatial beam combination and the polarization beam combination of the multi-die, and 100% coupling is difficult to realize. The aging of semiconductor lasers is a critical step in the fabrication of semiconductor lasers. In order to make the laser work in a stable state, the laser needs to work at high temperature and high current in advance to cause the laser to age to a more stable region in a performance curve. The aging efficiency of the semiconductor laser is an important link for improving the production efficiency in the production process. The aging time of the semiconductor laser is constant, and it is important to improve the mounting efficiency before aging, and most of the aging laser is screwed on the aging table before the aging laser is mounted. Therefore, the workload and the working time are greatly increased, the requirement of high efficiency cannot be met, the efficiency is low, the method is not suitable for batch production, and the economic benefit is poor.

For example, chinese patent document CN209389444U provides a semiconductor laser aging jig, in which a clamping device pushes a slider to slide forward so that a front end of the slider contacts with a rear end of a semiconductor laser, and the front end of the semiconductor laser contacts with a front end of a long hole, thereby realizing the compression fixation of the semiconductor laser in the long hole. The aging fixture is installed in a mode of pushing the sliding block to slide forwards, the speed is low, the economic benefit is low, and meanwhile, the structure of the aging fixture is relatively complex.

Chinese patent document CN103326231A discloses a semiconductor laser aging method and a fixture, the laser aging fixture has a conductive base fixed on the edge of a base, a groove is opened outside the base, a negative electrode plate is adhered on the base, and a fixing clamping strip is used for clamping a laser transition electrode plate on the negative electrode plate; the fixed rod can rotate up and down, a hanging ring is arranged on the cross arm of the fixed rod, a spring is fixed on the base, and the spring is hung on the hanging ring of the fixed rod through a hook to provide downward pressure for the vertical arm of the fixed rod. The heat sink with the laser is placed in the groove of the base, the transition electrode slice of the laser is fixed on the negative electrode slice of the base through the clamping strip, the bottom surface of the end part of the vertical arm of the fixing rod is pressed on the heat sink of the laser, the negative electrode slice of the base is communicated with the negative electrode of the power supply, and one screw of the base is communicated with the positive electrode of the power supply. Although the aging qualification rate and the aging efficiency are improved to a certain extent, only one laser can be fixed at a time, and the installation efficiency is too low.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a semiconductor laser aging clamp which is mainly used for improving the mounting efficiency of a semiconductor laser before aging, can mount a plurality of semiconductor lasers at one time, improves the aging qualification rate in the one-time aging process and ensures the consistency of the aging effect.

The invention also provides a use method of the semiconductor laser aging clamp.

The technical scheme of the invention is as follows:

a semiconductor laser aging clamp comprises a water-cooling plate, a limiting plate, a rapid clamp and a pressing strip;

the limiting plate is arranged on the upper surface of the water cooling plate and provided with at least one limiting hole matched with the semiconductor laser;

the rapid clamp is arranged at one end of the water cooling plate;

one end of the pressing strip is hinged with the water cooling plate, the other end of the pressing strip is clamped tightly through the rapid clamp, counter bores corresponding to the limiting holes one to one are formed in the pressing strip, and elastic pressing blocks are installed in the counter bores and used for pressing the semiconductor laser.

Preferably, the limiting plate is mounted on the upper surface of the water cooling plate through a bolt.

Preferably, a support is fixed at one end of the water cooling plate, and one end of the pressing strip is connected with the support through a rotating shaft.

Preferably, the support is provided with a concave cavity, one end of the pressing strip is located in the concave cavity, and the rotating shaft penetrates through the pressing strip and two sides of the concave cavity. The advantage of this design is that layering one end is located the cavity of support, and stability is better when rotatory layering, is favorable to compressing tightly fixed semiconductor laser.

Preferably, the other end of the water cooling plate is fixed with a support, and the quick clamp is installed on the support.

Preferably, the rapid clamp comprises a rack, a side link A, a side link B and a connecting rod, flanges are arranged on two sides of the rack, one ends of the side link A and the side link B are hinged to the rack, the other ends of the side link A and the side link B are hinged to the connecting rod, and one end of the connecting rod is used for clamping a pressing bar.

Preferably, the support is provided with bolt holes, and flanges at two sides of the rack are mounted on the support through bolts.

Preferably, a through hole and two layering spring limiting holes are arranged in the counter bore, and the two layering spring limiting holes are located on two sides of the through hole.

Preferably, the elastic pressing block is provided with a threaded hole and two pressing block spring limiting holes, the two pressing block spring limiting holes are located on two sides of the threaded hole, the screw penetrates through the through hole and then is connected with the threaded hole, and the spring is placed between the two corresponding pressing bar spring limiting holes and the two pressing block spring limiting holes.

Preferably, a graphite sheet is placed between the water cooling plate and the limiting plate.

A use method of a semiconductor laser aging clamp comprises the following steps:

(1) firstly, mounting a limiting plate on the upper surface of a water cooling plate, and then placing a plurality of semiconductor lasers into limiting holes of the limiting plate one by one;

(2) the expansion amount of the elastic pressing block in the counter bore is adjusted through the screw, so that the pressure of the elastic pressing block is adjusted through the compression spring;

(3) one end of the pressing strip rotates around a rotating shaft of the support, the elastic pressing block is tightly pressed on the semiconductor laser by the falling of the pressing strip, and the other end of the pressing strip is clamped by the rapid clamp.

The invention has the beneficial effects that:

1. the semiconductor laser aging clamp can place a plurality of semiconductor lasers on the limiting plate at one time and fix the semiconductor lasers on the water cooling plate through the pressing strips at the same time, compared with the traditional mode that the semiconductor lasers are fixed one by one through screws, the semiconductor laser aging clamp has the advantages that the installation efficiency is greatly improved, and meanwhile, the labor is saved.

2. The semiconductor laser aging clamp can select the limiting plates with different specifications according to use requirements, meets different arrangement requirements, and has good flexibility.

3. By using the semiconductor laser aging clamp, the qualification rate of an aged semiconductor laser can be improved in the one-time aging process, and the consistency of the aging effect is ensured.

4. The semiconductor laser aging clamp has the advantages of simple structure, scientific and reasonable design, convenience in operation and use and low cost, can firmly press the semiconductor laser through the elastic pressing block, has high stability and ensures the consistency of aging effects.

Drawings

FIG. 1 is a schematic perspective exploded view of the present invention;

FIG. 2 is a schematic view of a partial three-dimensional structure of a batten of the present invention;

FIG. 3 is a schematic perspective view of a briquette according to the present invention;

FIG. 4 is an exploded view of the heat dissipation system of the present invention;

FIG. 5 is a schematic perspective view of the burn-in system of the present invention;

in the figure: 1. the device comprises a pressing bar, 2 pressing blocks, 3 screws, 4 springs, 5 quick clamps, 6 a semiconductor laser, 7 a support, 8 a water cooling plate, 9 a limiting plate, 10 a support, 11 a rotating shaft, 12 a radiating fin, 13 a radiating fin water cooling plate, 14 an optical fiber fixing cover, 1-1 counter bores, 1-2 through holes, 1-3 pressing bar spring limiting holes, 2-1 pressing bar spring limiting holes and 2-2 threaded holes.

Detailed Description

The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.

Example 1:

as shown in fig. 1 to fig. 3, the embodiment provides an aging fixture for a semiconductor laser, which includes a water-cooling plate 8, a limiting plate 9, a rapid fixture 5 and a pressing strip 1;

the limiting plate 9 is arranged on the upper surface of the water cooling plate 8 and provided with at least one limiting hole matched with the semiconductor laser 6;

the rapid clamp 5 is arranged at one end of the water cooling plate 8;

one end of the pressing strip 1 is hinged with the water cooling plate 8, the other end of the pressing strip is clamped tightly through the rapid clamp 5, counter bores 1-1 which correspond to the limiting holes one by one are formed in the pressing strip, elastic pressing blocks 2 are installed in the counter bores 1-1, and the elastic pressing blocks 2 are used for pressing the semiconductor laser 6 tightly.

Specifically, the water cooling plate 8 is of a rectangular parallelepiped structure, and a circulation water channel is arranged in the water cooling plate for heat dissipation. The limiting plate 9 is a long strip-shaped plate, a plurality of long holes in a small airplane shape are arranged at intervals along the length direction of the limiting plate, and the shape and the size of each long hole are matched with those of the semiconductor laser 6; the number of the elongated holes is set according to the number of the aged semiconductor lasers, and one elongated hole accommodates one laser. In addition, the limiting plate 9 can be designed in series, different specifications can be manufactured according to different semiconductor lasers 6, and different requirements can be met.

The limiting plate 9 is installed on the upper surface of the water cooling plate 8 through bolts. The edges of the two sides of the limiting plate 9 are provided with fixed mounting holes, so that the limiting plate 9 can be conveniently mounted on the water cooling plate 8.

As shown in figure 1, a support 10 is fixed at the left end of the upper surface of the water cooling plate 8, the support 10 is provided with a concave cavity, one end of the pressing strip 1 is located in the concave cavity, and the rotating shaft 11 penetrates through the pressing strip 1 and two sides of the concave cavity. One end of the pressing strip 1 is positioned in a cavity of the support 10, so that the stability is better when the pressing strip 1 rotates around the rotating shaft 11, and the semiconductor laser 6 is conveniently pressed and fixed. The right end passes through a bolt fastening support 7, and four angular positions are connected with four bolts on the support 7, have seted up four mounting holes on the bottom plate both sides flange of rapid fixture 5, install on support 7 through four bolts.

Quick clamp 5 includes frame, side link A, side link B and connecting rod, and the both sides of frame are equipped with the flange, and fixed mounting is on support 7, and side link A and side link B's one end is articulated with the frame, and side link A and side link B's the other end is articulated with the connecting rod, and connecting rod one end is used for pressing from both sides tight layering. The quick clamp is designed according to the principle of a double-rocker mechanism in a plane four-rod mechanism, and the basic structure of the quick clamp consists of four components, namely a connecting rod, a rack, two side links and the like. When the three points of the two hinged points of the connecting rod and the side link A and the side link B and the hinged point of the side link A (or the side link B) and the frame are in the same straight line, the mechanism is in a dead point position, and at the moment, one end of the connecting rod clamps the pressing strip. The pressing bar pressed at this time cannot release the pressing head no matter how large the counter force (except the glass-failure counter force) is.

The batten 1 is a strip plate with a certain thickness, the length and width of the batten are 430 × 30 × 15(mm), a plurality of counter bores 1-1 are formed in the bottom surface of the batten, a through hole 1-2 and two batten spring limiting holes 1-3 are formed in the counter bores 1-1, and the two batten spring limiting holes 1-3 are located on two sides of the through hole 1-2.

The elastic pressing block 2 is provided with a threaded hole 2-2 and two pressing block spring limiting holes 2-1, the two pressing block spring limiting holes 2-1 are positioned at two sides of the threaded hole 2-2, the screw 3 penetrates through the through hole and then is connected with the threaded hole 2-2, and two springs 4 are arranged between the two corresponding pressing block spring limiting holes 1-3 and the two pressing block spring limiting holes 2-1. The number of the elastic pressing blocks 2 corresponds to the number of the semiconductor lasers 6 one by one, and one elastic pressing block 2 is used for pressing one semiconductor laser 6 and is independent of the other.

The elastic pressing block 2 is made of stainless steel materials. The pressing block 2 made of the stainless steel material has the advantages of good corrosion resistance, high strength, high hardness and long service life.

The semiconductor laser aging clamp is simple in structure, convenient to operate and low in cost. The aging fixture can age 15 lasers at one time, the aging qualification rate is more than 95%, the aging fixture is small in size, large in aging quantity and simple to operate, and aging efficiency and aging quantity are greatly improved. The working efficiency during aging is improved, and the installation time of the semiconductor laser 6 during aging is saved.

Example 2:

the semiconductor laser aging jig according to embodiment 1 is different in that: and a graphite sheet is arranged between the water cooling plate 8 and the limiting plate 9. When the semiconductor laser device is aged, the contact surface of the semiconductor laser device 6 is close, and the heat dissipation effect is better.

Example 3:

as shown in fig. 4 and 5, a method of using the jig of example 1 for aging a semiconductor laser will be described, using the jig of example 1 together with the heat sink 12, the heat sink water-cooling plate 13, the optical fiber fixing cover 14, and the grating before use. The optical fiber ferrule is fixed on the optical fiber fixing cover 14, the radiating fins 12 are fixed on the radiating fin water cooling plate 13, and the radiating fin water cooling plate 13 takes away heat through circulating water. The using process is as follows:

(1) firstly, mounting a limiting plate 9 on the upper surface of a water cooling plate 8 through a bolt, and then placing 15 semiconductor lasers 6 into limiting holes of the limiting plate 9 one by one;

(2) the expansion amount of the elastic pressing block 2 in the counter bore 1-1 is adjusted through a screw 3, so that the pressure of the elastic pressing block 2 is adjusted through a compression spring 4;

(3) one end of the pressing strip 1 rotates around a rotating shaft 11 of the support 10, the pressing strip 1 falls down to enable the elastic pressing block 2 to be tightly pressed on the semiconductor laser 6, and the other end of the pressing strip 1 is clamped by the rapid clamp 5.

When the semiconductor laser device is aged, light emitted by the semiconductor laser device 6 is emitted to the radiating fins 12 through the optical grating and the optical fiber inserting core, and the heat of the radiating fins 12 is taken away by the radiating fin water cooling plates 13 through circulating water.

Heat-conducting silicone grease is required to be coated between the radiating fin water-cooling plate 13 and the radiating fin 12, so that the radiating fin water-cooling plate and the radiating fin are in better contact, and the radiating effect is better; the fins 12 are made of an aluminum material. The thermal conductivity of aluminum is 237 w/(m.k), which ensures that the semiconductor laser 6 dissipates heat as soon as possible upon aging, thereby improving the heat dissipation efficiency of the semiconductor laser, and the aluminum has a high cost performance.