阅读说明：本技术 电镀治具 (Electroplating jig ) 是由 林鼎钧 黄泰源 盖家驹 于 2019-12-19 设计创作，主要内容包括：一种电镀治具,包括具有四边形中空部的主体。其中,四边形中空部界定主体的内周面。主体于内周面向四边形中空部延伸凸缘。相应四边形中空部的每一边于凸缘上设置至少一导电体。(An electroplating jig comprises a main body with a quadrilateral hollow part. Wherein the quadrangular hollow portion defines an inner peripheral surface of the body. The main body extends a flange from the inner peripheral surface to the quadrangular hollow portion. At least one conductor is disposed on the flange on each side of the corresponding quadrilateral hollow portion.)

1. An electroplating jig comprising:

the main body is provided with a quadrilateral hollow part, wherein the quadrilateral hollow part defines the inner peripheral surface of the main body, the main body extends to form a flange towards the quadrilateral hollow part from the inner peripheral surface, and at least one electric conductor is arranged on the flange corresponding to each side of the quadrilateral hollow part.

2. The plating jig of claim 1, wherein two electrical conductors are provided on the flange corresponding to each side of the quadrilateral hollow.

3. The electroplating jig of claim 1, wherein each electrical conductor comprises a plurality of pins.

4. The electroplating fixture of claim 3, wherein each electrical conductor comprises a comb-shaped structure.

5. The electroplating jig of claim 1, wherein the main body is provided with a power input assembly, and the power input assembly is electrically connected with the conductor.

6. The electroplating jig of claim 5, wherein the power input assembly comprises:

a power input element; and

a plurality of conductive lines;

wherein the power input element is electrically connected to the conductor via the conductive wire.

7. The electroplating jig of claim 6, wherein a plurality of grooves are formed on the main body, and the conductive wires are embedded in the grooves.

8. The electroplating jig of claim 7, further comprising:

a protection plate covering the groove of the main body.

9. The electroplating jig of claim 1, further comprising:

a sealing element disposed around the flange between the flange and the electrical conductor.

10. The electroplating jig of claim 9, wherein the sealing element has an annular bump to abut the substrate when the quadrilateral hollow receives the substrate.

11. The electroplating jig of claim 1, further comprising:

a cover plate having a quadrangular boss corresponding to the quadrangular hollow.

12. The plating jig of claim 11, further comprising:

and the sealing element is arranged between the main body and the cover plate around the quadrilateral convex block.

13. The plating jig of claim 12, wherein the cover plate has a groove surrounding the quadrangular boss, and the sealing member is embedded in the groove.

14. The electroplating jig of claim 1, wherein each electrical conductor comprises at least one first positioning member for positioning the corresponding electrical conductor at least one second positioning member of the body.

15. The electroplating jig of claim 14, wherein the main body is provided with a power input assembly, the power input assembly comprising:

a power input element; and

a plurality of conductive lines;

wherein the power input element is electrically connected to the first positioning member of the conductor via the conductive wire.

16. The electroplating jig of claim 1, wherein the body further has at least one opening.

Technical Field

The present disclosure relates to an electroplating jig, and more particularly, to an electroplating jig for electroplating a square substrate.

Background

In the semiconductor packaging process, a metal layer is often applied to the substrate to further form circuit layers with different functions. There are many ways to apply a metal layer on a substrate, electroplating being one of them.

In the prior art, the substrate to be electroplated is mostly circular, and therefore, a jig used in electroplating is designed for the circular substrate. However, when the substrate to be plated is square, the prior art electroplating jig designed for circular substrate is not suitable.

Disclosure of Invention

In view of the above, the present disclosure provides an electroplating jig for electroplating a square substrate.

The present disclosure provides an electroplating jig including a main body having a quadrangular hollow portion. The quadrilateral hollow portion has an inner peripheral surface with a flange extending inwardly therefrom. At least one conductor is disposed on the flange on each side of the corresponding quadrilateral hollow portion.

In some embodiments, two electrical conductors are disposed on the flange on each side of the respective quadrilateral hollow.

In some embodiments, each electrical conductor includes a plurality of pins.

In some embodiments, each of the conductors includes a comb-shaped structure.

In some embodiments, the body is provided with a power input assembly, and the power input assembly is electrically connected to the electrical conductor.

In some implementations, the power input assembly includes a power input element and a plurality of conductive wires. The power input element is electrically connected with the conductor through the conducting wire.

In some embodiments, the body has a plurality of trenches, and the conductive lines are embedded in the trenches.

In some embodiments, the electroplating jig further includes a protection plate covering the groove of the main body.

In some embodiments, the electroplating fixture further comprises a sealing element disposed around the flange and between the flange and the conductor.

In some embodiments, the sealing element has an annular projection for abutting the substrate when the substrate is received in the quadrilateral hollow.

In some embodiments, the electroplating jig further comprises a cover plate having a quadrangular bump corresponding to the quadrangular hollow.

In some embodiments, the electroplating jig further includes a sealing element disposed between the body and the cover plate around the quadrilateral bump.

In some embodiments, the cover plate has a groove surrounding the quadrangular projection, and the sealing element is embedded in the groove.

In some embodiments, each of the conductors includes at least one first positioning member for positioning the corresponding conductor in at least one second positioning member of the body.

In some embodiments, the power input element is electrically connected to the first positioning member of the electrical conductor via an electrically conductive wire.

In some embodiments, the body further has at least one additional perforation.

Drawings

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that the various features may not be drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1 is a perspective view of a main body of an electroplating jig according to some embodiments of the present disclosure.

Fig. 2 is a front view of a body of some embodiments of the present disclosure.

Fig. 3 is a cross-sectional view of the body of some embodiments of the present disclosure along section line a-a' of fig. 2.

Fig. 4 is a schematic view of a body receiving substrate of some embodiments of the present disclosure.

Fig. 5 is a cross-sectional view of the body of some embodiments of the present disclosure along section line a-a' of fig. 2.

Fig. 6 is a front view of a body of some embodiments of the present disclosure.

Fig. 7 is a front view of a body of some embodiments of the present disclosure.

Fig. 8 is a front view of a body of some embodiments of the present disclosure.

Fig. 9 is a front view of a body of some embodiments of the present disclosure.

Fig. 10 is a cross-sectional view of the body of some embodiments of the present disclosure along section line B-B' of fig. 9.

Fig. 11 is a schematic view of a body receiving substrate of some embodiments of the present disclosure.

Fig. 12 is a front view of a cover plate of an electroplating fixture according to some embodiments of the present disclosure.

Fig. 13 is a cross-sectional view of a cover plate of some embodiments of the present disclosure, taken along section line C-C of fig. 12.

Fig. 14 is a schematic view of a plating jig according to some embodiments of the disclosure.

Fig. 15 is a front view of a cover plate of some embodiments of the present disclosure.

FIG. 16 is a cross-sectional view of a cover plate of some embodiments of the present disclosure, taken along section line D-D' of FIG. 15.

Fig. 17 is a schematic view of a plating jig according to some embodiments of the disclosure.

Fig. 18 is a front view of a cover plate of some embodiments of the present disclosure.

FIG. 19 is a cross-sectional view of the cover plate of some embodiments of the present disclosure along section line E-E' of FIG. 18.

Fig. 20 is a schematic view of an electroplating tool according to some embodiments of the present disclosure.

Fig. 21 is a front view of a body of some embodiments of the present disclosure.

Fig. 22 is a cross-sectional view of the body of some embodiments of the present disclosure along section line F-F' of fig. 21.

Fig. 23 is an enlarged partial view of a locating feature of an electrical conductor of some embodiments of the present disclosure.

Fig. 24 is an enlarged partial view of a locating feature of a body of some embodiments of the present disclosure.

Fig. 25 is a front view of a body of some embodiments of the present disclosure.

Fig. 26 is a front view of a body of some embodiments of the present disclosure.

Fig. 27 is a cross-sectional view of the body of some embodiments of the present disclosure along section line G-G' of fig. 26.

Fig. 28 is a cross-sectional view of the body of some embodiments of the present disclosure along section line H-H' of fig. 26.

Fig. 29 is a front view of an electrical conductor of some embodiments of the present disclosure.

FIG. 30 is a cross-sectional view of an electrical conductor along section line I-I' of FIG. 29 according to some embodiments of the present disclosure.

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, such components and arrangements are merely examples and are not intended to be limiting. In the present disclosure, reference in the following description to an embodiment in which a first feature is formed over or on a second feature may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include an embodiment in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Embodiments of the present disclosure are discussed in more detail below. It should be appreciated, however, that the present disclosure provides many applicable concepts that can be embodied in a wide variety of specific contexts. The particular embodiments discussed are merely illustrative and do not limit the scope of the disclosure.

Furthermore, for ease of description, spatially relative terms such as "below … …," "below … …," "above … …," "upper," "lower," "left," "right," and similar terms may be used herein to describe one element or feature's relationship to another element(s) or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as well. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

The numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, and the numerical values set forth in the specific examples may be reported as precisely as possible. However, some numerical values may contain certain errors necessarily resulting from the standard deviation found in the corresponding test measurement. Further, as used herein, the term "about" generally means within ± 10%, ± 5%, ± 1%, or ± 0.5% of a given value or range. Alternatively, one of ordinary skill in the art recognizes that the term "about" means within an acceptable standard error of the mean. Except in the operating/working examples, or unless otherwise expressly specified, all of the numerical ranges, amounts, values, and percentages (e.g., those of amounts of materials, durations, temperatures, operating conditions, ratios of amounts, and the like disclosed herein) are to be understood as modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the present disclosure and attached claims are approximations that may vary. At the very least, each numerical parameter should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one end point to another end point or between two end points. Unless otherwise specified, all ranges disclosed herein are inclusive of the endpoints. The term "substantially coplanar" may refer to two surfaces that are within a few micrometers (μm) along the same plane (e.g., within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm along the same plane). Where numerical values or properties are said to be "substantially" identical, the term can refer to the values being within ± 10%, ± 5%, ± 1% or ± 0.5% of the mean of the values.

Aiming at a square substrate to be electroplated, the present disclosure provides an electroplating jig 1. Please refer to fig. 1 to 3. Fig. 1 is a perspective view of a main body 11 of an electroplating jig 1 according to some embodiments of the present disclosure, fig. 2 is a front view of the main body 11 according to some embodiments of the present disclosure, and fig. 3 is a cross-sectional view of the main body 11 according to some embodiments of the present disclosure along a section line a-a' of fig. 2.

As shown in the figure, the electroplating jig 1 includes a main body 11, and the main body 11 has a quadrangular hollow 110. Specifically, the quadrangular hollow portion 110 includes a space penetrating the main body 11, and when the space is formed in the main body 11, a shape shown on one surface of the main body 11 is quadrangular. After the quadrangular hollow portion 110 penetrates the body 11, a space is formed to define an inner circumferential surface 110A of the body 11, and the body 11 extends a flange 110F from the inner circumferential surface 110A to the quadrangular hollow portion 110. At least one conductor EL is disposed on the flange 110F corresponding to each side of the quadrangular hollow 110.

In more detail, since the quadrangular hollow 110 has four sides corresponding to the main body 11, the inner circumferential surface 110A includes four circumferential surfaces corresponding to the four sides, and the flange 110F includes a portion extending from the four circumferential surfaces of the inner circumferential surface 110A toward the quadrangular hollow 110. Accordingly, the flange 110F includes four regions corresponding to the four circumferential surfaces of the inner circumferential surface 110A, and each region corresponds to one circumferential surface of the inner circumferential surface 110A. In other words, each region of the flange 110F corresponds to one side of the quadrangular hollow portion 110 corresponding to the body 11.

Next, at least one conductor EL is disposed on one region of the corresponding flange 110F corresponding to each side of the quadrangular hollow 110. In some embodiments, a single electrical conductor EL is disposed over each area of flange 110F, the length of the single electrical conductor EL being substantially equal to the length of an area of flange 110F.

Referring also to fig. 4, the conductors EL are arranged to contact the substrate 9 when the quadrangular hollow portion 110 receives the substrate 9 to be plated, so that the contact surfaces of all the conductors EL contacting the substrate 9 face in the same direction, i.e., the direction facing the substrate 9. In some embodiments, the substrate 9 is substantially the same size as the quadrangular hollow 110, and may be embedded in the quadrangular hollow 110. When the substrate 9 is fitted into the quadrangular hollow 110, the regions of the four sides of the substrate 9 can be brought into contact with the electric conductors EL on the four regions of the flange 110F, respectively.

However, the foregoing embodiments are not intended to limit the arrangement of the substrate 9, the number of the conductive bodies EL and the arrangement positions, and the user can adjust the arrangement of the substrate 9, the number of the conductive bodies EL and the arrangement positions according to the requirement through the disclosure of the present disclosure, so that the substrate 9 can contact the arranged conductive bodies EL.

In some embodiments, a power input assembly is provided on the body 11 for connecting to a power input for electroplating and delivering the power input to the substrate 9. Specifically, as shown in fig. 1 and fig. 2, the power input assembly includes a plurality of power input elements 112 and a plurality of conductive wires 114, and the power input elements 112 are electrically connected to the conductive bodies EL through the plurality of conductive wires 114. Accordingly, when the substrate 9 is received in the quadrangular hollow portion 110 and the substrate 9 is in contact with the conductor EL, the power input element 112 receives an electric input for plating and transmits the electric input to the substrate 9 through the conductive line 114 and the conductor EL.

In some embodiments, as shown in fig. 3, the flange 110F extends toward the quadrangular hollow 110 in alignment with a plane of the body 11. In some embodiments, as shown in fig. 5, the flange 110F extends from a middle portion section of the inner circumferential surface 110A toward the quadrangular hollow 110. However, the aforesaid embodiments are not intended to limit the installation position of the flange 110F, and the user can adjust the installation position of the flange 110F according to the requirement through the disclosure.

Through the technique of the foregoing embodiment, when the square substrate 9 is placed in the main body 11 of the plating jig 1 for plating, the square substrate 9 can receive the electric input evenly through the electric conductors EL in four-side contact, so that all the areas of the substrate 9 can be plated evenly, and the thickness of the plated metal film of the substrate 9 is highly uniform.

In some embodiments, the placement of electrical conductors EL on flange 110F is adjustable. Fig. 6 is a front view of the body 11 of some embodiments of the present disclosure. As shown in the drawing, since the quadrangular hollow 110 has four corners corresponding to the main body 11, the flange 110F includes four corner regions having four corners corresponding to the four corners. At least one conductive body EL is disposed on a corner region of the corresponding flange 110F corresponding to each corner of the quadrangular hollow 110.

In detail, each of the conductors EL is disposed on the corresponding corner region of the flange 110F, and extends toward two sides connected to the corner region. Accordingly, each of the conductive bodies EL can be regarded as being disposed corresponding to both sides of the quadrangular hollow portion 110. This arrangement of the electrical conductors EL also provides the electrical input required for the electroplating on average to the substrate 9 of square shape.

In some embodiments, the number of electrical conductors EL on flange 110F can be adjusted. Fig. 7 is a front view of the body 11 of some embodiments of the present disclosure. As shown, two conductors EL are disposed on a region of the corresponding flange 110F corresponding to each side of the quadrangular hollow 110. In such embodiments, each power input element 112 connects two electrical conductors EL through a conductive line 114.

By providing two conductors EL in one region of the flange 110F, the electric input required for plating the substrate 9 can be provided more evenly, and the effect of plating on the substrate 9 can be reduced when a partial conductor EL fails due to short circuit. Specifically, as the number of conductors EL on the flange 110F increases and the volume thereof decreases, the plating area of each conductor EL that can affect the substrate 9 is reduced. Accordingly, when the conductive body EL is short-circuited and failed, the area affected by the plating is relatively reduced.

In some embodiments, the shape of the conductive body EL can be adjusted. Fig. 8 is a front view of the body 11 of some embodiments of the present disclosure. As shown in the drawing, two conductors EL are provided on the flange 110F corresponding to each side of the quadrangular hollow portion 110. In such embodiments, each power input element 112 connects two electrical conductors EL through a conductive line 114. Further, each of the conductive bodies EL includes a plurality of leads.

Further, as shown in the figure, the conductive body EL includes a comb-like structure (or comb-like structure). With such a multi-pin structure, the contact point of each conductor EL with the substrate 9 can be increased, and thus, the electrical input can be more evenly applied to the substrate 9, so that the uniformity of the metal film formed on the plated substrate 9 can be further improved. In some embodiments, the total number of legs of the electrical conductor EL is about 40 to 400. In some embodiments, the total number of legs of the electrical conductor EL is about 260.

In some embodiments, a sealing member may be used to prevent the plating solution from contacting the conductive body EL. Please refer to fig. 9 and 10. Fig. 9 is a front view of the body 11 of some embodiments of the present disclosure, and fig. 10 is a cross-sectional view of the body 11 of some embodiments of the present disclosure along section line B-B' of fig. 9. Specifically, the electroplating jig 1 further includes a sealing element S1 disposed around the flange 110F and between the flange 110F and the conductor EL.

Referring also to fig. 11, in some embodiments, the annular sealing element S1 has an annular protrusion SP for abutting the substrate 9 when the substrate 9 is received by the quadrilateral hollow 110. The sealing element S1 includes a waterproof and elastic material. Thus, when the plating solution is applied to the substrate 9 on the right side of the drawing, the sealing member S1 prevents the plating solution from contacting the conductor EL, thereby further preventing the electrical contact between the conductor EL and the substrate 9 from being affected.

In some embodiments, the plating jig 1 further includes a cover plate 13. Please refer to fig. 12 and 13. Fig. 12 is a front view of the cover plate 13 according to some embodiments of the present disclosure, and fig. 13 is a sectional view of the cover plate 13 according to some embodiments of the present disclosure, taken along a section line C-C' of fig. 12. As shown, the cover plate 13 has a quadrangular projection 130. Specifically, the quadrangular projection 130 includes a projection projecting from one surface of the cover plate 13, and the projection is formed on the cover plate 13 to have a quadrangular shape corresponding to the shape displayed on the one surface of the cover plate 13.

In some embodiments, the shape of the quadrangular boss 130 corresponds to the shape of the quadrangular hollow 110 formed on the body 11. In more detail, the quadrangular boss 130 corresponds to the shape shown by the cover plate 13, and is substantially the same as the shape shown by the quadrangular hollow 110 corresponding to the main body 11. Referring to fig. 14, after the substrate 9 is received in the quadrangular hollow portion 110, the cover plate 13 is used to cover the substrate 9 and the main body 11, and the substrate 9 is fixed in the quadrangular hollow portion 110 by the quadrangular bumps 130. In other words, the quadrangular hollow 110 can further receive the quadrangular bump 130 after receiving the substrate 9.

In some embodiments, a sealing member can be used to prevent the plating solution from penetrating from the joint between the main body 11 and the cover 13 and affecting the conductive body EL. Please refer to fig. 15 and 16. Fig. 15 is a front view of the cover plate 13 according to some embodiments of the present disclosure, and fig. 16 is a sectional view of the cover plate 13 according to some embodiments of the present disclosure, taken along a section line D-D' of fig. 15.

Specifically, the electroplating jig 1 further includes a sealing element S2 disposed between the main body 11 and the cover plate 13 around the quadrilateral bump 130. As shown, the sealing element S2 may be first disposed on the cover plate 13 around the quadrilateral protrusion 130. Next, referring to fig. 17, when the cover 13 is combined with the body 11, the sealing element S2 can be clamped between the body 11 and the cover 13. The sealing element S2 includes a waterproof and elastic material. Thus, the sealing member S2 can be used to prevent the plating solution from infiltrating from the joint between the main body 11 and the cover plate 13.

In some embodiments, the setting of the sealing element S2 may be adjusted. Please refer to fig. 18 and 19. Fig. 18 is a front view of the cover plate 13 according to some embodiments of the present disclosure, and fig. 19 is a sectional view of the cover plate 13 according to some embodiments of the present disclosure, taken along a section line E-E' of fig. 18. In detail, the cover plate 13 has a groove 13C surrounding the quadrangular boss, and the sealing member S2 is fitted in the groove 13C. Referring also to fig. 20, when the cover 13 is combined with the body 11, the sealing element S2 can be clamped between the body 11 and the cover 13.

In some embodiments, the body 11 has a structure that can be hung, and the electrical conductor EL can be positioned on the body 11. Please refer to fig. 21 and 22. Fig. 21 is a front view of the body 11 according to some embodiments of the present disclosure, and fig. 22 is a cross-sectional view of the body 11 according to some embodiments of the present disclosure, taken along section line F-F' of fig. 21. In particular, in order to make the drawings easy to understand, fig. 21 shows only a single conductor EL as a reference numeral for a portion of the conductor EL.

Specifically, the main body 11 further has at least one opening 116. Through the at least one opening 116, the main body 11 can be hung by the electroplating device and further the electroplating operation can be performed. In addition, each of the conductive bodies EL includes at least one positioning portion L1 for positioning the corresponding conductive body EL at the at least one positioning portion L2 of the main body 11.

In such embodiments, as shown in fig. 21, each of the conductive bodies EL has three positioning members L1, and the main body 11 has three positioning members L2. Referring to fig. 23 and 24 together, fig. 23 is a partially enlarged view of a positioning member L1 of the conductive body EL according to some embodiments of the present disclosure, and fig. 24 is a partially enlarged view of a positioning member L2 of the main body 11 according to some embodiments of the present disclosure.

More specifically, each positioning member L1 includes a circular opening, each positioning member L2 includes a circular protrusion, and the circular opening of the positioning member L1 is adapted to receive the corresponding circular protrusion of the positioning member L2. In this way, the conductor EL can be fixed to the main body 11 by the coupling of the positioning member L1 and the positioning member L2.

In some embodiments, as shown in fig. 21, each power input element 112 is connected to the corresponding positioning member L1 of two electrical conductors EL through a conductive wire 114. In detail, since the positioning member L1 and the conductor EL can be integrally formed and made of a metal conductor material, the positioning member L1 electrically connected to the conductor EL is equivalent to electrically connected to the conductor EL.

In some embodiments, as shown in fig. 22, each positioning member L1 of the electric conductor EL extends along one surface of the main body 11, bends toward the inner circumferential surface 110A, and is disposed against the inner circumferential surface 110A. Then, the positioning member L1 extends to the flange 110F and then bends and extends toward the quadrangular hollow portion 110 to connect the conductor EL. In some embodiments, as shown in fig. 25, the body 11 has two openings 116.

In some embodiments, the body 11 is further provided with a trench in which the conductive line 114 is embedded. Please refer to fig. 26 to fig. 28. Fig. 26 is a front view of a body 11 according to some embodiments of the present disclosure, fig. 27 is a sectional view of the body 11 according to some embodiments of the present disclosure taken along a section line G-G 'of fig. 26, and fig. 28 is a sectional view of the body 11 according to some embodiments of the present disclosure taken along a section line H-H' of fig. 26.

As shown, the main body 11 is provided with a plurality of trenches 11C, and the conductive lines 114 are embedded in the trenches 11C. Furthermore, the electroplating jig 1 further includes a protection plate 15 for covering the groove 11C of the main body 11. The protection plate 15 is mainly formed according to the shape of the main body 11, and has an opening where necessary. It should be noted that, in the embodiments, the protection plate 15 includes a transparent material, and therefore, the front view of fig. 26 is still mainly illustrated by the main body 11 and the corresponding elements.

In these embodiments, the protection plate 15 is provided with an opening at the corresponding opening 116 to avoid obstructing the hanging of the electroplating jig 1. In addition, the protection board 15 is provided with openings at the respective power input elements 112 to avoid interference with the power input elements 112 receiving power input. Furthermore, the protective plate 15 is provided with openings at the respective quadrangular hollow portions 110 so as to avoid interference with the receiving substrate 9.

In some embodiments, the shape of the electrical conductors EL may be adjusted to enhance the contact of the electrical conductors EL with the substrate 9. Referring to fig. 29 and 30, fig. 29 is a front view of an electric conductor EL according to some embodiments of the present disclosure, and fig. 30 is a cross-sectional view of the electric conductor EL according to some embodiments of the present disclosure along a section line I-I' of fig. 29. As shown, the lead portion of each conductor EL can be slightly bent toward the receiving substrate 9, so that the contact between the conductor EL and the substrate 9 can be enhanced.

With the electroplating jig 1 according to the embodiment of the present disclosure, the square substrate 9 can also be used to uniformly complete the electroplating of the metal film. Furthermore, through the arrangement of the conductive body EL according to some embodiments of the present disclosure, after the square substrate 9 is plated, the Uniformity (Uniformity) of the metal film on the substrate 9 is less than 10%. Furthermore, through the arrangement of the electric conductor EL according to some embodiments of the present disclosure, the uniformity of the metal film on the substrate 9 after the square substrate 9 is electroplated is less than 6%.

The above-mentioned embodiments are only used for illustrating the implementation aspects of the present disclosure and illustrating the technical features of the present disclosure, and are not used to limit the scope of the present disclosure. Any arrangement which may be readily changed or equalized by a person skilled in the art is within the scope of the disclosure as claimed.