阅读说明：本技术 搬送系统及基板支承构件 (Conveying system and substrate supporting member ) 是由 藤方淳平 于 2017-06-28 设计创作，主要内容包括：本发明提供基板固持器、镀覆装置、搬送系统、基板支承构件、检测系统及搬送装置,该搬送系统可确实搬送具有翘曲状态的基板。本发明的搬送系统具备搭载基板(WF)的上阶手臂(237)。上阶手臂(237)具备：基部(132)；及配置于基部(132)的表面上的至少一个突起部(134)。突起部(134)具有用于通过真空吸附基板(WF)的真空孔。真空孔在突起部(134)顶部具有开口(138)。突起部(134)顶部的高度相对于基部(132)表面固定。在突起部(134)顶部,通过真空吸附基板(WF)。(The invention provides a substrate holder, a plating device, a conveying system, a substrate supporting member, a detection system and a conveying device. The transfer system of the present invention includes an upper arm (237) for mounting a substrate (WF). The upper arm (237) is provided with: a base (132); and at least one protrusion (134) disposed on a surface of the base (132). The protrusion (134) has a vacuum hole for vacuum-sucking the substrate (WF). The vacuum holes have openings (138) at the top of the protrusions (134). The height of the top of the protrusion (134) is fixed relative to the base (132) surface. A substrate (WF) is vacuum-sucked to the top of the protrusion (134).)

1. A carrying system for carrying a substrate in an electronic component manufacturing apparatus, the carrying system being characterized in that,

the conveyance system includes a hand part on which the substrate is mounted,

the arm portion includes:

a base; and

at least one protrusion disposed on a surface of the base,

the protrusion portion has a vacuum hole for sucking the substrate by vacuum,

the vacuum hole has an opening at the top of the protrusion,

the height of the top of the protrusion is fixed relative to the surface of the base,

the substrate is sucked by vacuum at the top of the protrusion.

2. The handling system according to claim 1,

the top of the protrusion has a height of 1mm to 2mm with respect to the surface of the base.

3. Handling system according to claim 1 or 2,

the overall height of the base and the protrusion is 5mm or less.

4. Handling system according to claim 1 or 2,

the protrusion is disposed in a central portion of the surface.

5. A carrying system for carrying a substrate in an electronic component manufacturing apparatus, the carrying system being characterized in that,

the conveyance system includes a hand part on which the substrate is mounted,

the arm part has:

a support part on which the substrate is mounted; and

a peripheral wall portion disposed on an outer periphery of the support portion,

the support portion has: an edge portion located at a peripheral portion of the support portion; and a recessed portion other than the edge portion, the recessed portion being recessed with respect to the edge portion,

the arm portion includes at least two fork portions, and at least a part of the peripheral wall portion and at least a part of the recess portion are provided in the fork portions.

6. The handling system according to claim 5,

the recess of the recess has a depth of 1mm to 2 mm.

7. The handling system according to any one of claims 1, 2, 5, and 6,

the electronic component manufacturing apparatus is a plating apparatus for electrolytically plating the substrate.

8. A substrate support member that supports a substrate, the substrate support member comprising:

a base;

a support portion provided on a surface of the substrate and on which the substrate is mounted; and

a protrusion portion disposed on a surface of the base portion,

the protrusion having a vacuum hole coupled to a vacuum source, the vacuum hole having an opening at a top of the protrusion,

the height of the top of the protrusion is fixed relative to the surface of the base,

and sucking the substrate by vacuum on the top of the protrusion.

9. The substrate support member of claim 8,

the protrusion is disposed at a central portion of the base.

10. The substrate support member of claim 8 or 9,

at least three of the support portions are provided.

Technical Field

The present invention relates to a substrate holder for a plating apparatus for plating a semiconductor substrate, a carrying system for carrying a substrate in an electronic component manufacturing apparatus, and an electronic component manufacturing apparatus.

Background

A conveyance system for conveying a substrate is used in various electronic component manufacturing apparatuses. An example of an electronic component manufacturing apparatus is a plating apparatus that performs plating on a surface of a plating object (substrate) such as a semiconductor wafer. The plating apparatus forms a plating film on a groove, a hole, and an opening of a resist layer for fine wiring provided on the surface of the wafer, or forms bumps (protruding electrodes) electrically connected to electrodes of a package on the surface of the semiconductor wafer.

The present invention also relates to a substrate supporting member that supports a substrate, and a substrate holder suitable for a plating apparatus and the like. The electronic component manufacturing apparatus according to the present invention is also referred to as a substrate processing apparatus because it processes a substrate.

The plating apparatus is used, for example, in manufacturing an interposer or a spacer used for so-called three-dimensional mounting of a semiconductor chip or the like. The interposer or spacer has a plurality of Via plugs (Via plugs) penetrating vertically therein, and is embedded in the through-holes by plating to form Via plugs. The plating apparatus disposes a substrate in a substrate holder, and immerses the substrate holder in a plating bath for plating.

The substrate subjected to the plating treatment is stored in a cassette before the treatment. The transfer robot for transferring the substrate carries the substrate from the cassette to the drying arm and transfers the substrate to the substrate holder. The reason why the drying arm is called is that a dried substrate before plating is mounted. The substrate is subjected to plating treatment in a state of being mounted on the substrate holder. After the plating treatment, the transfer robot for transferring the substrate mounts the substrate taken out of the substrate holder on a wet arm and transfers the substrate to a spin rinse dryer. The spin rinse dryer rotates the substrate at a high speed to dry the substrate. The reason why the arm is called a wet arm is to transport a wet substrate after the plating process. The plating apparatus and the substrate holder are described in japanese patent laid-open publication No. 2013 and 155405.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2013-155405

Disclosure of Invention

Problems to be solved by the invention

There has been a demand for substrates having a warp state and a plurality of thicknesses that are free from problems to be processed in an electronic component manufacturing apparatus such as a plating apparatus. It is known that when substrates having various warpage states or various thicknesses are held by a drying arm, a wet arm, a substrate support member, and the like, the substrates are not effectively held because they float on the drying arm, the wet arm, the substrate support member, and the like. Further, it is known that even a substrate holder sometimes cannot effectively perform sealing and contact of the outer periphery of the substrate. That is, the conventional apparatus causes problems such as a suction error and a floating of the outer periphery of the substrate due to the warpage of the substrate, a drying arm, a substrate holder, etc., and causes the substrate to be dropped or otherwise damaged.

Specifically, when manufacturing electronic components, a substrate (e.g., a silicon wafer, a glass plate, etc.) is moved through a plurality of manufacturing steps by a transfer robot. The throughput can be increased by rapidly transferring the substrate, and thus the manufacturing cost can be reduced. However, the substrate is of considerable value even before completion. Therefore, it is important to avoid substrate dropping or other damage when the substrate enters the manufacturing process.

Further, when the substrate is immersed in the plating solution to be plated while being held by the conventional substrate holder, the substrate holder receives water pressure and fluid force of paddle stirring, and locally uneven pressure is applied to the substrate. The inventors of the present invention have studied and known that warped substrates are easily broken due to the influence of the original internal stress, and these stresses are a main cause of breakage of the substrates.

Disclosure of Invention

The present invention has been made to solve the above-described problems, and an object thereof is to provide a transfer system that can stably transfer a substrate having a warped state.

In addition, another object is to provide a substrate holder capable of preventing a substrate from being broken when the substrate is immersed in a plating solution while holding the warped substrate.

Another object of the present invention is to provide a substrate support member that can stably support a substrate having a warped state.

Another object of the present invention is to provide a detection system capable of detecting that an object such as a substrate in a warped state is accurately mounted at a predetermined position on a conveyance device or the like.

(means for solving the problems)

In order to solve the above-described problems, a first aspect is a substrate holder configured to include a first holding member and a second holding member that detachably hold a substrate by sandwiching an outer peripheral portion of the substrate therebetween, the substrate holder including: the first holding member has a support portion on which the substrate is mounted, and the support portion has: an edge portion which is located at a peripheral portion of the support portion and which sandwiches the outer peripheral portion of the substrate; and a recessed portion other than the edge portion, the recessed portion being recessed with respect to the edge portion; the substrate holder has a substrate holding member that applies a force to the substrate in a direction from the recess toward the substrate.

The present embodiment includes a substrate holding member as a rear supporter for supporting the substrate against the water pressure applied to the substrate. Therefore, when the warped substrate is immersed in the plating solution while being held, the amount of warp can be prevented from increasing due to the water pressure, and the substrate can be prevented from cracking.

The warpage amount of the substrate is a difference between the maximum value and the minimum value of the distance from the horizontal plane with respect to the upper surface (or the lower surface) of the substrate when the substrate is placed on the horizontal plane. For example, when the substrate is warped in a mountain shape, the distance between the central portion of the substrate and the horizontal plane is large, and the distance between the outer peripheral portion of the substrate and the horizontal plane is small. When the substrate center portion is low and the substrate outer peripheral portion is high (hereinafter referred to as "warped into a bowl shape (or valley shape)"), the distance between the substrate center portion and the horizontal plane is small and the distance between the substrate outer peripheral portion and the horizontal plane is large.

A second aspect is a substrate holder configured to have a through hole in the recess, and the substrate holding member is disposed in the through hole.

A third aspect is a configuration employing a substrate holder, wherein the substrate holding member is movable in the through hole in a direction from the recess toward the substrate and/or in a direction from the substrate toward the recess.

A fourth aspect is a substrate holder configured to have a structure in which a portion of the substrate holding member in contact with the substrate and a portion of the edge portion in contact with the substrate have the same height as a point on the recess measured in a direction from the recess toward the substrate.

A fifth aspect is a substrate holder configured to employ a substrate holder, wherein the substrate holding member is an elastic member disposed between the concave portion and the substrate.

A sixth aspect is a substrate holder configured to include at least one variable-length member, wherein the substrate holding member is disposed between the recess and the substrate, a length of the variable-length member in a direction from the recess toward the substrate is adjustable, and the length of the variable-length member is adjusted according to a distance between the recess and the substrate.

A seventh aspect is a substrate holder configured to employ a substrate holder, wherein the substrate holding member and the first holding member are respectively supported by an elastic body so that lengths in a direction toward the substrate can be adjusted.

An eighth aspect is a substrate holder configured to include a first holding member and a second holding member that hold a substrate detachably by sandwiching an outer peripheral portion of the substrate, wherein the substrate holder includes a variable-length member whose length is adjustable, and the variable-length member is capable of abutting against the substrate to apply a force to the substrate.

A ninth aspect is a substrate holder configured to include a pressure sensor capable of detecting a contact pressure between the variable-length member and the substrate.

A tenth aspect is a substrate holder configured to include an adjustment mechanism capable of adjusting the pressure in accordance with a detection pressure of the pressure sensor.

An eleventh aspect is a plating apparatus configured to electrolytically plate the substrate using the substrate holder.

In order to solve the above-described problems, a twelfth aspect is a substrate transfer system for transferring a substrate in an electronic component manufacturing apparatus, the substrate transfer system including a hand on which the substrate is mounted, the hand including: a base; and at least one protrusion disposed on a surface of the base, the protrusion having a vacuum hole for vacuum-sucking the substrate, the vacuum hole having an opening at a top of the protrusion, a height of the top of the protrusion being fixed with respect to the surface of the base, and the substrate being vacuum-sucked at the top of the protrusion.

The arm portion can be used as a drying arm, for example, but the arm portion of the present embodiment includes a protrusion in consideration of the warp of the base plate, and therefore the top of the protrusion is higher than the surface of the base. Therefore, when the substrate center portion is high and the substrate outer peripheral portion is low (hereinafter referred to as "warp-mountain-shaped"), the warp-mountain-shaped substrate center portion can be held more stably than before and mounted on the arm portion. As a result, the substrate warped in a mountain shape can be stably conveyed than before. Therefore, the arm portion is flat and has no projection, and the vacuum suction force is increased because the top of the projection is opened and the opening is close to the center of the mountain shape as compared with the case where the opening of the vacuum hole is opened on the flat surface.

When the substrate is vacuum-sucked, the suction portion may be creased to adjust the height of the suction portion, thereby improving the compatibility with the warpage of the substrate. However, when the bellows is used, the structure of the suction portion becomes complicated, and the cost increases.

A thirteenth aspect is a configuration of the conveyance system, wherein the top of the protrusion has a height of 1mm to 2mm with respect to the surface of the base.

A fourteenth aspect is a configuration using a conveyance system, wherein the overall height of the base portion and the protrusion portion is 5mm or less.

A fifteenth aspect is a configuration that employs a conveyance system, wherein the protrusion is disposed at a central portion of the front surface.

A sixteenth aspect is a substrate transfer system for transferring a substrate in an electronic component manufacturing apparatus, the substrate transfer system including a hand on which the substrate is mounted, the hand including: a support part on which the substrate is mounted; and a peripheral wall portion disposed on an outer periphery of the support portion, the support portion including: an edge portion located at a peripheral portion of the support portion; and a recessed portion other than the edge portion, the recessed portion being recessed with respect to the edge portion, the arm portion including at least two fork portions, at least a part of the peripheral wall portion and at least a part of the recessed portion being provided in the fork portions.

The arm portion can be used as a wet arm, for example, but the arm portion of the present embodiment is provided with a recessed portion in consideration of the warp of the substrate, and therefore the recessed portion is lower than the edge portion. Therefore, the peripheral portion of the substrate mounted on the fork portion is warped into a bowl shape and is in contact with the edge portion, so that the peripheral portion of the substrate can be held more stably than before. As a result, the substrate warped into a bowl shape can be stably conveyed than before. Therefore, when the arm portion is flat and has no recess, the bowl-shaped peripheral portion does not contact the arm portion, but when the recess is provided as in the present embodiment, the bowl-shaped peripheral portion contacts the edge portion, and thus the substrate is stable.

A seventeenth aspect is a configuration using a conveying system, wherein the recess of the concave portion has a depth of 1mm to 2 mm.

An eighteenth aspect is the electronic component manufacturing apparatus, wherein the electronic component manufacturing apparatus is a plating apparatus for electrolytically plating the substrate.

A nineteenth aspect is a substrate support member for supporting a substrate, the substrate support member including: a base; a support portion provided on a surface of the substrate and on which the substrate is mounted; and a protrusion disposed on a surface of the base, the protrusion having a vacuum hole connected to a vacuum source, the vacuum hole having an opening at a top of the protrusion, a height of the top of the protrusion being fixed with respect to the surface of the base, and the substrate being adsorbed by vacuum at the top of the protrusion.

The substrate support member may, for example, serve as a rotating stage for a wafer aligner. In this embodiment, the base portion includes the support portion in consideration of the warpage of the substrate, and therefore the surface of the base portion is lower than the support portion. Therefore, the peripheral portion of the substrate warped in the bowl shape and supported by the substrate support member is in contact with the support portion, and therefore the peripheral portion of the substrate can be held more stably than before.

Further, when the projection portion is disposed on the surface of the base portion and the projection portion has the vacuum hole for vacuum-sucking the substrate, the suction substrate can be held more stably than before.

A twentieth aspect is a substrate support member, wherein the protrusion is disposed at a central portion of the base.

A twenty-first aspect is a substrate support member including at least three support portions.

A twenty-second aspect is a substrate support member for supporting a substrate, the substrate support member including a base portion having a vacuum hole for vacuum-sucking the substrate, the vacuum hole having an opening at a top portion of the base portion, and the substrate being vacuum-sucked at the top portion of the base portion.

In this aspect, the central portion of the substrate or the like warped in a mountain shape and supported by the base is in contact with the base, and the base has the vacuum hole for sucking the substrate by vacuum, so that the suction substrate can hold the central portion of the substrate or the like more stably than before.

A twenty-third aspect is a detection system for detecting a position of an object mounted on a mounting portion, the detection system including: a light emitting unit capable of outputting detection light for detecting a position of the object; and a detection unit disposed at a position where reflected light generated by the mounting unit being reflected by the detection light directly incident on the mounting unit from the light emitting unit can be detected, wherein the detection light directly incident on the mounting unit is located on a side opposite to the reflected light and the object in a plane generated by the detection light directly incident on the mounting unit and the reflected light detected by the detection unit.

A twenty-fourth aspect is a detection system for detecting a position of an object mounted on a mounting portion, the detection system including: a light emitting unit capable of outputting detection light for detecting a position of the object; and a detection unit disposed at a position where reflected light generated by the mounting unit being reflected by the detection light directly incident on the mounting unit from the light emitting unit can be detected, wherein the reflected light is located on a side opposite to the detection light directly incident on the mounting unit and the object in a plane generated by the detection light directly incident on the mounting unit and the reflected light detected by the detection unit.

The detection system according to the twenty-third or twenty-fourth aspect can detect that the object having a warped state is correctly mounted at a predetermined position on the conveyance device or the like.

A twenty-fifth aspect is a configuration using a conveyance device, including the detection system of the twenty-third or twenty-fourth aspect, and conveying the object.

A twenty-sixth aspect is a configuration using a plating apparatus, including the detection system of the twenty-third or twenty-fourth aspect, wherein the object is a substrate, and the plating apparatus electrolytically plates the substrate.

Drawings

Fig. 1 is an overall configuration diagram of a plating apparatus including an arm portion and a substrate holder according to an embodiment of the present invention.

Fig. 2 is a top view of a substrate holder provided to the plating apparatus shown in fig. 1.

Fig. 3 is a right side view showing a state where the second holding member of the substrate holder shown in fig. 2 is opened on an imaginary line.

Fig. 4 is an enlarged sectional view taken along line a-a of fig. 2.

Fig. 5 is an enlarged sectional view taken along line B-B of fig. 2.

Fig. 6 shows a process flow of the warpage amount determination section 170C.

Fig. 7 shows a method for measuring the warpage amount of the substrate by the measuring unit 110.

Fig. 8 shows another method for measuring the warpage amount of the substrate.

Fig. 9 shows another method for measuring the warpage amount of the substrate.

Fig. 10A is a diagram showing the substrate transfer device 22.

Fig. 10B is a diagram showing the substrate transfer device 22.

Fig. 10C is a diagram showing the substrate transfer device 22.

Fig. 10D is a diagram showing the substrate transfer device 22.

Fig. 11 shows a cross-sectional view of the upper arm 237 in the cross-section AA shown in fig. 10C.

Fig. 12 is a structural view showing an end portion of a wet arm.

Fig. 13 is an explanatory view of the substrate holder 18 that can prevent the substrate from being broken when immersed in the plating solution.

Fig. 14 is a diagram showing an elastic member 190 that can be applied to a substrate holding member when correction to a warp-free state is not desired.

Fig. 15 is a diagram showing another substrate holding member which can be applied to a case where correction to a warp-free state is not desired.

Fig. 16 is an illustration showing an island-shaped variable length member 192.

Fig. 17 is a graph showing experimental data for explaining the effect of the substrate holding member.

Fig. 18 is a graph showing experimental data for explaining the effect of the substrate holding member.

Fig. 19 is an explanatory diagram of the operation of the lock mechanism.

Fig. 20 is a graph illustrating how much the strain of the substrate WF is improved.

Fig. 21 shows an air pressure load adjustment mechanism.

Fig. 22 shows an air pressure load adjusting mechanism.

Fig. 23 shows a substrate support member 262 on which the substrate WF is mounted.

Fig. 24 shows another embodiment of the substrate support member on which the substrate WF is mounted.

Fig. 25 shows still another embodiment of the substrate support member on which the substrate WF is mounted.

Fig. 26 is an explanatory diagram of the operation of the level sensor.

Fig. 27 is an illustration showing that the substrate WF having a warped state is correctly mounted at a predetermined position of the substrate holder 18 and is still detected as an error.

Fig. 28 is a diagram showing an operation of a detection system for detecting a position of a substrate mounted on a movable seat.

Fig. 29 is a diagram showing a detection system for detecting the position of a substrate mounted on a movable seat.

Fig. 30 is a diagram showing another detection system for detecting the position of the substrate mounted on the movable base.

Fig. 31 is a diagram showing an operation of the detection system shown in fig. 30.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, the same or corresponding members are denoted by the same reference numerals, and redundant description thereof is omitted.

Fig. 1 is a diagram showing an overall arrangement of a plating apparatus for performing a plating process using a substrate holder according to an embodiment of the present invention. The plating apparatus is generally divided into: a warp amount determination section 170C for selecting a substrate having a small warp amount; a loading/unloading section 170A that loads a substrate on the substrate holder 18 or unloads the substrate from the substrate holder 18; and a processing unit 170B for processing the substrate. The substrate in this embodiment may be a circular or polygonal semiconductor substrate, and the substrate thickness may be, for example, about 1 mm. The substrate warp state is a state in which the substrate is not in a uniform flat plate shape without undulation along a horizontal plane. The warpage amount of the substrate is a difference between the maximum value and the minimum value of the distance from the horizontal plane to the upper surface (or the lower surface) of the substrate when the substrate is placed on the horizontal plane.

As shown in fig. 1, the loading/unloading unit 170A includes: two cassette stages 12 on which cassettes 10 for housing substrates WF such as semiconductor chips are mounted; an aligner 14 for aligning the orientation flat, the groove, or the like of the substrate WF in a predetermined direction; and a spin dryer 16 for drying the plated substrate WF by rotating the substrate WF at a high speed. Further, a substrate mounting/dismounting unit 20 is provided near the aligner 14 and the spin dryer 16, and mounts and demounts the substrate holders 18 to and from the substrate holders 18 of the substrate WF. A substrate transfer device (transfer system) 22, which is formed of a transfer robot and transfers the substrate WF therebetween, is disposed at the center of the cassette stage 12, the aligner 14, the spin dryer 16, and the substrate attaching/detaching section 20.

Further, from the substrate mounting/demounting unit 20 side, the processing unit 170B is provided with: a temporary storage box (cart) 24 for storing and temporarily placing the substrate holder 18; a pre-wetting tank 26 for immersing the substrate WF in pure water; a pre-bath 28 for etching and removing an oxide film formed on the surface of a seed layer or the like on the surface of the substrate WF; a first rinsing bath 30a for rinsing the surface of the substrate WF with pure water, and a blowing bath 32 for dehydrating the cleaned substrate WF; a second rinsing bath 30b and a plating bath 34. The plating tank 34 is configured to accommodate a plurality of plating units 38 in an overflow tank 36, and each plating unit 38 accommodates one substrate holder 18 therein to perform plating such as copper plating.

Further, a substrate holder transfer unit 40 using, for example, a linear motor system is provided, and the substrate holder transfer unit 40 is located on the side of each of these apparatuses, and the substrate holder 18 is transferred between these apparatuses together with the substrate WF. The substrate holder conveying part 40 includes: a first conveyor 42 for conveying the substrate WF between the substrate loading and unloading unit 20 and the buffer cassette 24; and a second conveyor 44 for conveying the substrate WF between the buffer cassette 24, the pre-wetting tank 26, the pre-dip tank 28, the rinsing tanks 30a and 30b, the blowing tank 32, and the plating tank 34.

A paddle drive device 46 is disposed on the opposite side of the substrate holder transport section 40 across the overflow tank 36, and the paddle drive device 46 is positioned inside each plating cell 38 and drives a paddle (not shown) as a stirring rod for stirring the plating solution.

The substrate mounting/demounting portion 20 includes two flat plate-like loading plates 52 slidable along the rail 50. Each loading plate 52 is loaded one horizontally, and two substrate holders 18 are loaded in total laterally. The substrate WF is transferred between one of the two substrate holders 18 and the substrate transfer device 22. Then, the loading plate 52 is slid laterally to transfer the substrate WF between the other substrate holder 18 and the substrate transfer device 22.

The substrate holder 18 seals the end and the back surface of the substrate from the plating solution and exposes and holds the surface to be plated during the substrate plating process. In addition, the substrate holder 18 may also be provided with a contact point for contacting a peripheral portion of the plated surface of the substrate for supplying power from an external power source. The substrate holder 18 is received in a temporary storage box 24 (cart) before the plating process; during the plating process, the substrate holder transfer part 40 moves between the substrate transfer device 22 and the plating process part; and the plating solution is stored in the cart again after the plating treatment. In the plating apparatus, the substrate held by the substrate holder 18 is immersed in the plating solution in the plating tank 34 in the vertical direction, and the plating solution is injected from below the plating tank 34 and overflows therefrom to perform plating. The plating tank 34 preferably has a plurality of plating units 38 as described, and each plating unit 38 performs plating by vertically immersing one substrate holder 18 holding one substrate in a plating solution. Each plating unit 38 preferably includes: an insertion portion of the substrate holder 18, a current supply portion to the substrate holder 18, an anode, a paddle stirring device, and a shielding plate. The anode is mounted on the anode holder for use, and the exposed surface of the anode facing the substrate is concentric with the substrate. The substrate held by the substrate holder 18 is processed with the processing fluid in each processing tank of the plating processing section.

The substrate held by the substrate holder 18 is processed with the processing fluid in each processing tank of the plating processing section.

The arrangement of the processing tanks in the plating section may be, for example, a pre-rinsing tank, a pre-processing tank, a rinsing tank, a first plating tank, a rinsing tank, a second plating tank, a rinsing tank, and a blowing tank in order of the steps in the case of using a plating apparatus of two plating solution types, or may be another arrangement. The processing tanks are preferably arranged in the order of process (X → X' direction) to eliminate redundant conveyance paths. The type of the tank, the number of tanks, and the arrangement of the tanks can be freely selected in the plating apparatus depending on the purpose of processing the substrate.

The first and second conveyors 42 and 44 of the substrate holder conveyance section 40 have an arm for suspending the substrate holders, and the arm has an elevator for holding the substrate holders 18 in a vertical posture. The substrate holder transporting unit is movable along the travel axis between the substrate mounting/demounting unit 20 and the plating unit by a transporting mechanism (not shown) such as a linear motor. The substrate holder transfer unit 40 holds and transfers the substrate holders 18 in a vertical posture. The temporary storage cassette receiving the substrate holders may receive a plurality of substrate holders 18 in a vertical state.

Next, the substrate holder 18 is described in detail. As shown in fig. 2 to 5, the substrate holder 18 has: a first holding member (fixed holding member) 54 in a rectangular flat plate shape made of, for example, vinyl chloride; and a second holding member (movable holding member) 58 openably and closably attached to the first holding member 54 via a hinge 56.

The second holding member 58 has a base 60 and an annular seal holder 62, for example, made of vinyl chloride, and slides well with a below-described pressure ring 72. A substrate sealing member 66 is attached to the surface of the seal holder 62 facing the first holding member 54 so as to protrude inward, and is pressed against and seals the outer periphery of the substrate WF along a substrate sealing line 64 on the outer periphery of the substrate WF when the substrate holder 18 holds the substrate WF. Further, a holder seal member 68 is attached to a surface of the seal holder 62 facing the first holding member 54, and is pressed against a below-described support seat 80 of the first holding member 54 at a position outside the substrate seal member 66 to seal the same.

The substrate sealing member 66 and the holder sealing member 68 are mounted to the seal holder 62 sandwiched between the seal holder 62 and a fixing ring 70 mounted on the seal holder 62 via a fastener such as a bolt. A protruding strip portion 66a that seals between the substrate sealing member 66 and the seal holder 62 is provided on the abutting surface (upper surface) of the substrate sealing member 66 and the seal holder 62.

A step is provided on the outer periphery of the seal holder 62 of the second holding member 58, and a pressure ring 72 is rotatably attached to the step via a spacer 74. The pressing ring 72 is attached so as to be not detachable from the seal holder 62 by a pressing plate (not shown) attached to the side surface of the seal holder 62 so as to protrude outward. The pressure ring 72 is made of, for example, titanium, which has excellent corrosion resistance against acid and sufficient rigidity. The spacer 74 is made of a material having a low friction coefficient, for example, PTEF so that the pressing ring 72 can rotate smoothly.

The first holding member 54 has a substantially flat plate shape, and seals the support seat 80 between the second holding member 58 by being pressed against the holder sealing member 68 when the substrate holder 18 holds the substrate WF. Further, the first holding member 54 has a substantially disc-shaped movable seat (support portion) 82 separated from the support seat 80. On the support seat 80 of the first holding member 54 located outside the pressing ring 72, inverted L-shaped fixing clips 84 having projecting portions projecting inward are provided upright at equal intervals in the circumferential direction. Further, a projecting portion 72a projecting outward is provided at a position facing the fixing clip 84 along the circumferential direction of the pressing ring 72. Then, the lower surface of the inward protruding portion of the fixing clip 84 and the upper surface of the protruding portion 72a of the pressing ring 72 are tapered surfaces inclined in opposite directions to each other along the rotation direction. Small protrusions 72b protruding upward are provided at a plurality of positions (for example, four positions) along the circumferential direction of the pressing ring 72. Thus, the pressing ring 72 can be rotated by rotating the rotation pin (not shown) and laterally surrounding the pressing small projection 72 b.

The substrate WF is clamped in the following order. As shown by the imaginary line in fig. 3, in a state where the second holding member 58 is opened, the substrate WF is inserted into the central portion of the first holding member 54, and the second holding member 58 is closed via the hinge 56. Then, the pressing ring 72 is rotated clockwise, and the protrusion 72a of the pressing ring 72 is slid into the inside of the inward protruding portion of the fixing clip 84. As a result, the first holding member 54 and the second holding member 58 are fastened and locked to each other via the tapered surfaces provided on the projection 72a of the pressing ring 72 and the fixing clip 84, respectively. When the lock is released, the pressing ring 72 is rotated counterclockwise, and the protrusion 72a of the pressing ring 72 is pulled out from the inner protrusion of the inverted L-shaped fixing clip 84. Thus, the lock can be released.

The movable holder 82 has an annular edge portion 82a that abuts against the outer peripheral portion of the substrate WF and supports the substrate WF when the substrate WF is held by the substrate holder 18. The edge portion 82a is movably attached to the support 80 via a compression spring 86 in a direction approaching the support 80. The edge portion 82a is biased in a direction away from the support 80 by the biasing force (spring force) of the compression spring 86. When the substrate holder 18 holds the substrates WF having different thicknesses, the thickness absorbing mechanism 88 is configured such that the movable base 82 moves in a direction approaching the support base 80 according to the thickness of the substrate WF, thereby absorbing the thickness of the substrate WF.

A substrate guide 82e for guiding the outer peripheral end of the substrate WF is provided on the upper surface of the peripheral edge of the movable base 82 to position the movable base 82 with respect to the substrate WF. When the substrate WF is supported by the edge portion 82a of the movable base 82 before the substrate holder 18 holds the substrate WF, the outer peripheral end portion of the substrate WF is guided to the substrate guide 82e, and the substrate WF is positioned with respect to the movable base 82.

Here, the type of the plating solution is not particularly limited, and various plating solutions can be used depending on the application. For example, a plating solution used in plating for TSV (Through-Silicon Via) or Through Silicon Via (TSV) may be used.

In addition, a plating solution containing CoWB (cobalt, tungsten, boron), CoWP (cobalt, tungsten, phosphorus), or the like for forming a metal film on a surface of a substrate having copper wiring may be used. In order to prevent copper from diffusing into the insulating film, a plating solution for forming a barrier film provided on the surface of the substrate or the surface of the substrate recess before forming the copper wiring, for example, a plating solution containing CoWB or tantalum (Ta) may be used.

The plating system including a plurality of plating apparatuses configured as described above includes a controller (not shown) configured to control the respective units. The controller has: a memory (not shown) for storing a predetermined program; a CPU (central processing unit) (not shown) that executes a program of the memory; and a control unit (not shown) realized by the CPU executing a program. The controller may control the conveyance of the substrate conveying device 22, the conveyance of the substrate holder conveying unit 40, the plating current and plating time in the plating tank 34, and the like. The controller may be configured to communicate with an upper controller, not shown, which integrally controls the plating device and other related devices, and may access data from a database provided in the upper controller. Here, the storage medium constituting the memory stores various setting data and various programs such as a plating process program described later. The storage medium may be a known storage medium such as a computer-readable memory such as a ROM or a RAM, a hard disk, a disk-shaped storage medium such as a CD-ROM, a DVD-ROM, or a flexible disk.

In the present embodiment, a substrate having a small warpage amount is selected by a warpage amount determination unit 170C provided in the plating apparatus. And the selected substrate is stored in the cassette stage 12. The warpage amount determination unit 170C includes: a measuring part 110 for measuring the substrate warpage; a FOUP (Front-Opening Unified Pod) 112, which is a carrier for the purpose of transporting and storing 300mm wafers, and is a Front-surface-Opening cassette-integrated transport/storage box, and a process flow performed by the warpage amount determination unit 170C are shown in fig. 6.

The measurement unit 110 measures the amount of warpage of the substrate taken out from the FOUP112 (step 114). The transfer of the substrate between the FOUP112 and the measurement unit 110 and the transfer of the substrate between the measurement unit 110 and the cassette stage 12 are performed by a transfer robot not shown. It is determined whether the measured warpage amount of the substrate is less than a threshold value (step 116). The threshold value is for example 2 mm. When the amount of warpage of the substrate is less than the threshold value, the substrate is mounted on the substrate holder 18 and sent to the cassette station 12 for plating (step 118). When the warpage amount of the substrate is larger than the threshold value, an error is output to the control section for the substrate, and the substrate is returned to the FOUP112 (step 120). This allows the substrate WF with a large warpage to be stopped before breaking.

Next, a method of measuring the warpage amount of the substrate WF by the measuring unit 110 will be described with reference to fig. 7. The substrate WF is mounted on the rotation stage 122 and rotated. The warpage amount of the substrate WF is measured by the distance sensor 124. The distance sensor 124 is disposed on the outer periphery of the substrate WF. The distance sensor 124 reads the distance between the distance sensor 124 and the substrate WF. The distance sensor 124 further outputs the amount of change in the distance on the outer periphery of the substrate WF to the controller with reference to the distance between the substrate WF and the distance sensor 124 at the start point of measurement of the substrate WF. When the distance change amount on the outer periphery of the substrate WF is larger than a certain threshold value as shown in fig. 6, the controller does not mount the substrate WF on the substrate holder in order not to perform the plating process.

In the embodiment shown in fig. 7(a), since the distance sensor 124 is fixed, only the amount of change in the distance on the outer periphery of the substrate WF is measured. In the embodiment shown in fig. 7(b), the substrate WF is rotated, and the distance sensor 124 is moved on the substrate WF in the radial direction of the substrate WF. Therefore, the distance sensor 124 measures the amount of change in the distance between the circumferential direction and the radial direction of the substrate WF. Instead of moving the distance sensor 124, a plurality of distance sensors 124 may be arranged in the radial direction. When only the amount of change in the distance on the outer periphery is measured, although the entire substrate WF is warped, the warpage may not be detected on the outer periphery. For example, in the case of warping in a mountain shape or a bowl shape. When the substrate is warped into a bowl shape, the warping can be detected by measuring the distance between the distance sensor 124 and the upper surface of the rotary stage 122. However, when the warpage is a mountain shape, the warpage cannot be detected by measuring only the amount of change in distance on the outer periphery. When the warp is not detected by measuring only the outer periphery, the distance sensor 124 preferably measures the amount of change in the distance between the circumferential direction and the radial direction of the substrate WF.

The distance sensor 124 may use, for example, a laser distance meter. The laser distance meter measures the time until the irradiated light is reflected by the measurement object and received, thereby measuring the distance. There are a "phase difference distance method" and a "pulse propagation method" depending on the difference in the measurement method.

Fig. 8 shows another method for measuring the warpage amount of the substrate WF. Fig. 8 shows a profile measuring device 126 that can measure the entire radius of the substrate WF. The profile meter 126 is fixed. In the present measurement method, the warpage amount determination unit 170C is not provided, but the substrate WF is rotated on the stage such as the aligner 14 shown in fig. 1, and the profile of the amount of change in distance on the outer periphery of the substrate WF is measured. Fig. 8(b) shows an example of the profile of the measurement result of the distance change amount of the entire substrate WF. Fig. 8(b) shows the measurement result of the distance change amount on one diameter. The horizontal axis represents the position of the substrate WF on the diameter, and the vertical axis represents the amount of change in distance. The controller determines the amount of warpage of the substrate from the amount of change in the distance on the outer periphery of the substrate or across the substrate. As described, the substrate WF having a certain amount of warpage, for example, the substrate WF having an amount of 2mm of warpage, is not processed. The warp amount determination unit 170C may be provided, and the contour meter 126 may be used in the warp amount determination unit 170C.

Fig. 9 shows another method for measuring the warpage amount of the substrate WF. Fig. 9 shows a case where the substrate WF is mounted on the movable base 82 of the substrate holder 18, and the distance between the substrate WF and the distance sensor 124 is measured by scanning the outer periphery of the substrate WF with the distance sensor 124. In the present measurement method, the warpage amount determination unit 170C is not provided, but the distance sensor 124 is rotated on the outer periphery of the substrate WF on the loading plate 52, and the profile of the distance change amount of the entire substrate WF is measured. Further, the plurality of distance sensors 124 may be disposed on the outer periphery of the substrate WF, and the distance sensors 124 may be fixed first. When the distance between the distance sensor 124 and the upper surface 128 of the edge portion 82a of the movable base 82 is measured in advance, the outer periphery warp can be detected when the outer periphery warps.

Fig. 9(a) shows an example in which the substrate WF is warped into a bowl shape (valley shape), and fig. 9(b) shows an example in which the substrate WF is warped into a mountain shape. Fig. 9(a) and 9(b) show examples in which the warpage amount is smaller than the threshold value. In fig. 9(a) and 9(b), the movable base 82 includes: an edge portion 82a located at the outer periphery of the substrate WF and contacting the back surface of the substrate WF; and the recess 130 other than the edge portion 82 a. The recess 130 is recessed toward the edge 82a in a direction away from the rear surface of the substrate WF. The depth of the recess is for example 2.5 mm.

Fig. 9(c) shows a comparative example in which the movable base 82 does not have the recess 130. When the amount of warpage is within the threshold value in the case of the concave portion 130, plating can be performed even in a mountain shape or a valley shape as shown in fig. 9(a) and 9 (b). In fig. 9(c) without the concave portion 130, when the warpage is a valley shape, the substrate WF is strained and may be broken more than in fig. 9(a) because a force for holding the substrate WF is applied to the edge portion 82a as described above. In fig. 9(a) and 9(b), even if a force for holding the substrate WF is applied to the edge portion 82a as described above, the substrate WF is less likely to be strained.

Next, a dry arm and a wet arm that carry the substrate WF having a warp amount less than a threshold value will be described. The loading/unloading unit 170A transports the substrate WF in which a dry substrate and a wet substrate are mixed. Therefore, the substrate transport device (transport system) 22 used in the loading/unloading section 170A is configured to mount two arms by 2 sets of arms. Fig. 10A is a plan view showing the substrate transfer device 22 (but showing a state where the upper arm 237 (hand) holds the substrate WF), fig. 10B is a side view of the substrate transfer device 22(a state where the substrate WF is not held), fig. 10C is a plan view of an important part of the upper arm 237 of the substrate transfer device 22(a state where the substrate WF is held), and fig. 10D is a plan view of an important part of the lower arm 241 of the substrate transfer device 22(a state where the substrate WF is held). As shown in fig. 10A to 10D, the substrate transport apparatus 22 has an upper arm 237 attached to the tip of one arm 233 of a plurality of (2) arms 233, 235 having a plurality of joints provided in the substrate transport apparatus main body 231. The substrate transfer device 22 has a lower arm 241 attached to the tip of the other arm 235.

The upper arm 237 is a drying arm that transports the dried substrate WF from the cassette stage 12 to the loading plate 52. The upper stage arm 237 is mounted so that the surface of the substrate WF is on the upper side, and the upper stage arm 237 has a thickness of 10mm or less and vacuum-adsorbs the back surface of the substrate WF. The lower arm 241 is a wet arm that transfers the substrate WF transferred from the processing unit 170B to the loading plate 52 to the spin dryer 16. The lower arm 241 is mounted such that the surface of the substrate WF is positioned on the lower side. The substrate WF is mounted on the support portion 220 surrounded by the peripheral wall portion 152.

The upper arm 237 includes: a base 132; and two protrusions 134 disposed on the surface of the base 132. The base 132 is formed of two prongs. The base 132 may also be formed of more than three prongs. The protrusion 134 has a vacuum hole 136 communicating with a vacuum source, not shown, and the vacuum hole 136 has an opening 138 at the top of the protrusion 134, and the height of the top of the protrusion 134 is fixed with respect to a surface 140 of the base 132. The substrate WF is vacuum-sucked to the top of the protrusion 134. The top of the protrusion 134 has a height 142 (shown in fig. 11) of 1mm to 2mm relative to the surface of the base 132. The protrusion 134 is disposed in the center of the surface 140. In the upper arm 237 of vacuum suction, it is considered that the warpage amount of the substrate WF to be sucked is 2mm or less, and the height of the protrusion 134 from the surface of the base 132 is 2 mm. Fig. 11 shows a cross-sectional view of the upper arm 237 in the cross-section AA shown in fig. 10C.

As shown in fig. 12, the lower arm (arm portion) 241 is formed by digging a portion (concave portion 130) facing the lower surface (rear surface 144) of the substrate WF downward by 2mm with respect to the edge portion 157, taking into consideration that the amount of warpage of the mounted substrate WF is 2mm or less. The substrate WF has: a front surface 148, a back surface 144, and a side surface 150 located at the outer periphery of the substrate WF. The lower arm 241 has: a support part 220 for mounting the substrate WF so as to face the back surface 144 of the substrate WF; and a peripheral wall portion 152 disposed on the outer periphery of the support portion 220 so as to face the side surface 150 of the substrate WF.

The support portion 220 has: an edge portion 157 located at the outer peripheral portion 160 of the substrate WF and contacting the rear surface 144; and a recess 130 other than the edge portion 157. The recess 130 is recessed toward the edge 157 in a direction away from the rear surface 144. The lower arm 241 is formed by two prongs 156. The lower arm 241 may be formed of three or more forks. The peripheral wall portion 152 is provided to the fork portion 156. The recess of the recess 130 has a depth 158 of 1mm to 2 mm. The depth 158 is preferably greater than 0.5 mm.

Next, a description will be given of the substrate holder 18 capable of preventing the substrate from being broken when the warped substrate is immersed in the plating solution while being held, with reference to fig. 13. As described in detail in fig. 2 to 5, the substrate holder 18 includes a first holding member 54 and a second holding member 58 that hold the outer peripheral portion 160 of the substrate WF and detachably hold the substrate WF. The first holding member 54 has a movable base 82 facing the back surface 144 of the substrate WF. The substrate holder 18 has a substrate holding member (rear support) 162 that applies a force to the rear surface 144 of the substrate WF facing the first holding member 54 in a direction from the movable base 82 toward the substrate WF. The substrate holding member (rear support) 162 may be provided at a position corresponding to the central portion of the substrate, or at least three members may be provided uniformly in the circumferential direction in the vicinity of the central portion of the substrate. In one embodiment, the substrate holding member (rear support) 162 is connected to an elastic member 184 such as a leaf spring via the first holding member 54, and is fixed to the substrate surface so as to be extendable and retractable in the vertical direction. At least three elastic members 184 may be arranged uniformly in the circumferential direction. The movable base 82 is connected to an elastic member 86 such as a leaf spring via the first holding member 54, and is fixed to the substrate surface so as to be extendable and retractable in the vertical direction. At least three elastic members 86 may be arranged in the circumferential direction. Preferably, when the substrate WF is held, the lengths of the elastic members 86 and 184 are adjusted so that the movable base 82 is lowered and the central substrate holding member 162 protrudes to the same height as the outer circumference. In addition, when the degree of warpage of the substrate WF is small, it is not necessary to secure the projecting amount of the substrate holding member 162 as described above, and therefore, instead of providing the elastic member 86, only the coupling member may be provided, and only the elastic member 184 may be provided. Further, since the movable base 82 and/or the substrate holding member 162 are coupled to the first holding member 54 by the elastic body, not only the influence of the unevenness of the held object such as warpage of the substrate can be absorbed, but also the influence of the thickness of the substrate can be absorbed and held even in the case of the substrate WF having a thickness. For example, when the substrate thickness is small, the substrate holder according to the present embodiment may not be provided with the thickness absorbing mechanism 88 for absorbing the thickness of the substrate WF.

Since the space 164 existing on the rear surface 144 side of the substrate WF is the sealed space 164, the pressure in the space 164 is lower than the water pressure. The substrate holder 18 has a substrate holding member 162 for resisting water pressure applied to the surface 148 of the substrate WF at the time of the plating process. Thus, the substrate WF can be prevented from being broken.

The movable base 82 has a through hole 172. The opening 174 of the through hole 172 faces the rear surface 144 of the substrate WF. The substrate holding member 162 is disposed in the through hole 172. The movable seat 82 includes: an edge portion 82a that contacts the rear surface 144 located on the outer peripheral portion 160 of the substrate WF; and a recess 130 other than the edge portion 82 a. The recess 130 is recessed toward the edge 82a in a direction away from the rear surface 144.

Fig. 13(a) shows a state before the substrate WF is set in the first holding member 54 and the second holding member 58 sandwiches the substrate WF. Fig. 13(b) shows a state in which the substrate WF is held by the second holding member 58. In fig. 13(a), a spring 184 is provided below the substrate holding member 162, and the spring 184 can press the substrate holding member main body 186 toward the substrate WF. As shown in fig. 13(a), before the second holding member 58 is pressed against the first holding member 54, the substrate holding member body 186 is caught by the catching portion 188 so that the portion 180 where the substrate holding member body 186 contacts the back surface 144 does not expose from the surface of the recess 130. The substrate holding member main body 186 is movable in the through hole 172 in a direction from the recess 130 toward the substrate WF and in a direction from the substrate WF toward the recess 130.

In fig. 13(b), the substrate holding member main body 186 presses the back surface 144 to correct the warpage of the substrate WF. Therefore, the portion 180 where the substrate holding member main body 186 contacts the rear surface 144 and the portion where the edge portion 82a contacts the rear surface 144 have the same height 182 measured from a point on the recess 130 in the direction from the recess 130 toward the substrate WF. That is, when the substrate WF is held, the movable base 82 is lowered, and the central substrate holding member 162 protrudes to have the same height as the outer periphery.

Further, the amount of warpage of the substrate is known and, when constant, it is preferable to become a height capable of supporting the substrate in consideration of the known amount of warpage, rather than the same height as the outer periphery.

Further, when the substrate is immersed in the plating solution for plating while being held in the conventional substrate holder as described above, the substrate may be broken due to the influence of differential pressure applied by different water pressures to the upper and lower portions of the substrate, an increase in internal stress and an increase in warpage due to fluid force of paddle stirring. In particular, when the thickness of the substrate is as thin as about 1mm, the possibility of cracking is higher. The present embodiment includes a substrate holding member 162 as a rear support for supporting the substrate WF from the rear surface thereof in order to resist the water pressure applied to the substrate WF. Further, a warp absorbing mechanism is provided for elastically coupling the movable base 82 and/or the substrate holding member 162 to the first holding member 54. Therefore, when the warped substrate WF is immersed in the plating solution while being held, the amount of warp can be prevented from increasing due to the water pressure, and the substrate can be prevented from cracking. Further, even in the case of the substrate WF which is not warped when held by the substrate holder, since the substrate WF held in the substrate holder is prevented from being warped in the plating solution by the influence of the water pressure after being immersed in the plating solution, the substrate WF can be effectively prevented from being cracked during the plating process.

In fig. 13(b), the substrate WF is corrected to be free from warpage, but if the substrate WF has a large warpage, the substrate WF may not be corrected to be free from warpage. Fig. 14 shows an elastic member 190 preferably applied to a substrate holding member which is not desired to be corrected to a warp-free state. The elastic member 190 is disposed between the recess 130 of the movable holder 82 and the back surface 144 of the substrate WF. The elastic member 190 is, for example, an airbag, and supports the substrate WF from the rear surface 144. The elastic member 190 can support the substrate WF with a certain pressure.

Fig. 14 shows a case of a substrate warped in a mountain shape, but in a case of a substrate warped in a bowl shape, the air bag is disposed on the outer peripheral portion of the substrate. For example, the substrate is supported by a doughnut-type bladder that applies pressure to the outer periphery of the substrate so as to be pushed (projected) upward in fig. 14, thereby deforming the substrate into a bowl shape. The height of the doughnut-type air bag is adjusted in advance using the profile data measured by the method described in fig. 7 and 8 to support the substrate. This reduces the load applied to the substrate and supports the substrate from the back surface.

Fig. 15 shows another substrate holding member preferably applied to a case where correction to a warp-free state is not desired. The substrate holding member is a rear side support for resisting water pressure, like the elastic member 190. In the case of this figure, the substrate holding member has five variable length members 192. The length-variable member 192 is disposed between the concave portion 130 of the movable base 82 and the back surface 144 of the substrate WF, and can adjust a length 294 from the concave portion 130 of the movable base 82 toward the substrate WF. The variable length member 192 is, for example, a pin shape.

The length 294 of the variable-length member 192 is adjusted in accordance with the distance between the concave portion 130 of the movable base 82 at the position where the variable-length member 192 is provided and the back surface 144 of the substrate WF. The length 294 of the variable length member 192 is generally made to coincide with this distance. The adjustment method is to project the variable length member 192 by a predetermined size from below so as to conform to the contour by using the contour data measured by the method described in fig. 7 and 8 in advance. Specifically, the measured profile data is stored in a computer (not shown) memory of the plating apparatus, and the CPU is controlled to execute a program for adjusting the respective lengths of the plurality of variable length members 192 provided in the substrate holder 18.

The projection amount adjustment mechanism may use a pneumatic pressure load adjustment mechanism or a spring force load adjustment mechanism that loads the variable length member 192 with pneumatic pressure or a spring force from below the variable length member 192 and adjusts the pneumatic pressure or the spring force. Further, an electromagnetic actuator using electromagnetic force of a coil or a piezoelectric actuator using piezoelectric effect may be used as the adjustment mechanism. Further, a method may be adopted in which a screw is provided at the lower portion of the variable length member 192, and the length of the variable length member 192 is adjusted by adjusting the rotation angle of the screw.

Next, an example of a pneumatic load adjusting mechanism that adjusts the pneumatic pressure or the spring force will be described. Fig. 21 shows an air pressure load adjustment mechanism 240. Fig. 21(a) shows an air pressure load adjusting mechanism 240 when the substrate WF is mounted on the substrate holder 18. Fig. 21(b) shows the air pressure load adjustment mechanism 240 before the substrate WF is mounted on the substrate holder 18.

The air pressure load adjustment mechanism 240 accommodates a part of the variable length member 192 in the air cylinder 244, and an upper portion of the variable length member 192 is outside the air cylinder 244. The variable length member 192 is a plug shape. The top 246 of the variable length member 192 contacts the back surface (lower surface) of the substrate WF. The spring 242 is disposed between the flange 248 of the variable length member 192 and the upper surface 250 of the cylinder 244. The spring 242 generates a force that presses down the variable-length member 192. Air is supplied into the cylinder 244 from an intake port 252 provided in a lower portion of the cylinder 244. The amount of protrusion of the variable-length member 192 is controlled by controlling the air pressure in the cylinder 244.

As shown in fig. 21(b), before the board WF is mounted, air is discharged from the air inlet 252, and the variable length member 192 is lowered downward by the force of the spring 242. As shown in fig. 21(a), after the board WF is mounted, air is blown in through the air inlet 252 to raise the variable length member 192 upward by the force of the air pressure. The protruding amount is controlled by the magnitude relation between the spring force and the air pressure.

Fig. 21 is provided with a pressure sensor 254 at the top 246 of the variable length member 192. The pressure sensor 254 detects a pressure acting between the variable-length member 192 and the substrate WF. The air pressure in the air cylinder 244 is adjusted by using the pressure acting between the variable-length member 192 and the substrate WF detected by the pressure sensor 254. This can adjust the pressure acting between the variable-length member 192 and the substrate WF. The pressure acting between the variable-length member 192 and the substrate WF can be feedback-controlled by the pressure sensor 254. The pressure sensor 254 is, for example, a semiconductor pressure sensor utilizing a piezoresistance effect.

In the example of fig. 21, the air pressure in the air cylinder 244 does not necessarily need to be controlled by the pressure sensor 254. Instead of using the pressure sensor 254, air having a predetermined air pressure may be supplied.

Fig. 22 shows another embodiment of the air pressure load adjustment mechanism 240. Fig. 22(a) shows an air pressure load adjusting mechanism 240 when the substrate WF is mounted on the substrate holder 18. Fig. 22(b) shows the air pressure load adjustment mechanism 240 before the substrate WF is mounted on the substrate holder 18. The pneumatic load adjusting mechanism 240 is of a fixed length type (fixed spring force type). The variable length member 192 is pressed down by air pressure before the substrate is mounted. The substrate WF is clamped and air is discharged, and the spring 242 pushes up the length-variable member 192.

The spring 242 is disposed between the flange 248 of the variable length member 192 and the lower surface 256 of the cylinder 244. The spring 242 generates a force that pushes the variable-length member 192 upward. And supplies air into the cylinder 244 from an intake port 252 provided in an upper portion of the cylinder 244.

As shown in fig. 22(b), before the board WF is mounted, air is supplied from the air inlet 252 to lower the variable length member 192 by the force of the air pressure. As shown in fig. 22(a), after the board WF is mounted, air is discharged from the air inlet 252, and the variable length member 192 is pushed upward by the force of the spring 242. The amount of projection of the variable-length member 192 is determined only by the spring force.

Fig. 14 and 15 show an example in which the elastic member 190 or the variable length member 192 is applied to the substrate WF warped in a mountain shape, but the elastic member 190 or the variable length member 192 is similarly applied to the substrate WF warped in a valley shape.

In fig. 15, a pressure sensor may be provided at the tip of the variable length member 192 to measure the contact pressure between the variable length member 192 and the back surface 144 of the substrate WF. Then, the variable-length member 192 is projected toward the back surface 144 until the contact pressure reaches a predetermined level, and the variable-length member 192 is fixed at this position. At this time, the position of the variable length member 192 can be set without using the above-described profile data. When the contact pressure changes to a predetermined value or more during plating, the control unit indicates and/or outputs an error signal. The control section may also store the error signal. The control unit may control the position of the variable length member 192 during plating so that the contact pressure is kept constant.

The variable length member 192 in fig. 15 may be a plug shape or an island shape. Fig. 16 shows an example of an island-shaped variable length member 192. Fig. 16 is a plan view of the movable base 82. In fig. 16, the variable-length members 192 are concentrically arranged on the movable base 82. The variable length member 192a arranged on the inner circumference is constituted by two variable length members 192 a. The variable length members 192b arranged on the outer circumference are constituted by six variable length members 192 b. Six guides 202 are equally arranged on the circumference of the variable-length member 192b in order to guide the movement of the variable-length member 192 b.

In the embodiment shown in fig. 13 to 16, the movable base 82 has a recess 130. In the example shown in fig. 9(c), the movable seat 82 does not have a recess. If the entire surface is flat without the recess, the substrate WF adheres to the surface of the movable base 82 without any gap when the substrate WF is separated from the movable base 82 after the plating is completed and a liquid enters the substrate holder due to some problem. Therefore, the liquid enters between the surface of the movable base 82 and the substrate WF. As shown in fig. 13 to 16, the substrate holding member helps prevent the substrate WF from adhering to the surface of the movable base 82 without a gap.

Fig. 17 and 18 show graphs of experimental data for explaining the effects of the substrate holding member. Fig. 17(a) and 17(b) are data of strain generated in the substrate WF when plating without the substrate holding member. In fig. 17(a), the horizontal axis represents the elapsed time from the start of plating, and the vertical axis represents the strain amount in μ ST. In fig. 17(b), the horizontal axis represents the plating thickness from the start of plating, the thickness at the start of plating is 0 μm, and the vertical axis represents the strain amount in μ ST. Fig. 18 shows strain data generated in the substrate WF during plating with the substrate holding member. In fig. 18, the horizontal axis represents the elapsed time from the start of plating, and the vertical axis represents the strain amount in μ ST.

It is known from fig. 17(a) that the strain at the start of plating is "0", and the strain is abruptly generated because the hydraulic pressure is applied to the substrate WF at the same time as the start of plating. The size is-150. mu.ST to-200. mu.ST. As shown in FIG. 17(b), the strain increased to-51.9. mu.ST. Fig. 18 shows strain when the substrate holding member 162 shown in fig. 13 is used. Graph 194 is the strain when the substrate holding member 162 is used, and graph 196 is the strain when the substrate holding member 162 is not used. Graph 194 is formed from three graphs with different numbers of blade trips. When the number of reciprocations of the paddle is expressed in rpm, the graphs show the reciprocations at 375rpm, 300rpm and 225 rpm. Graph 196 is made up of six graphs with different numbers of blade trips. In the graph 196, the upper solid line graph corresponds to the lower solid line graph, and these are graphs when the number of reciprocations of the blade is 375 rpm. Similarly, the upper broken line graph corresponds to the lower broken line graph, which is a graph when the number of blade reciprocations is 300rpm, and the upper one-dot chain line graph corresponds to the lower one-dot chain line graph, which is a graph when the number of blade reciprocations is 225 rpm. The upper graph of these graphs is the maximum value of strain for various numbers of blade reciprocations, and the lower graph is the minimum value of strain for various numbers of blade reciprocations. When the substrate holding member 162 is not used, the strain greatly fluctuates in a short time due to the influence of the blade movement, and the measured strain has a large amplitude. Comparing plot 194 with plot 196, it is known that the strain improves from-130 μ ST to-20 μ ST.

As described above, when the substrate WF is set in the substrate holder 18, the substrate WF is inserted into the first holding member 54, and the second holding member 58 is closed. Then, the lock member presses down the pressing ring 72 of the element of the second holding member 58 (specifically, the pressing ring 72 of the element of the seal holder 62). Next, the lock member rotates the pressing ring 72 clockwise, and the protrusion 72a of the pressing ring 72 slides into the inside of the inward protrusion of the fixing clip 84. This securely locks the first and second retaining members 54, 58 to each other. After locking, the locking mechanism is disengaged from the pressure ring 72.

Similar operations are performed except for the direction of rotation when unlocking. That is, the lock member presses the pressing ring 72 downward. Next, the lock member rotates the pressing ring 72 counterclockwise, and the protrusion 72a of the pressing ring 72 is pulled out from the inside of the inward protruding portion of the fixing clip 84. Thereby, the first holding member 54 and the second holding member 58 are opened. Then, the locking member is separated from the pressing ring 72.

After the locking is completed and the locking is released, the strain generated in the substrate WF can be reduced by setting the speed of separating the locking mechanism from the pressing ring 72 to a low speed. This will be explained with reference to fig. 19 and 29. Fig. 19(a) and 19(b) show the case of locking, and fig. 19(a) shows the case where the speed at which the locking mechanism is separated from the pressing ring 72 is high. Fig. 19(b) shows a case where the speed at which the lock mechanism is separated from the pressure ring 72 is low.

The step in which the speed at which the lock mechanism is separated from the seal holder 62 is high is described with reference to fig. 19 (a). The locking mechanism 204 is engaged with the seal holder 62 (S10), and descends together with the seal holder 62 at a speed of 2500mm/min (S12). When the lock mechanism 204 is close to the substrate WF, the speed is decreased and decreased at 50mm/min (S14). When the seal holder 62 contacts the substrate WF, the seal holder 62 is further pressed downward (S16), and then the pressing ring 72 is rotated clockwise, so that the protrusion 72a of the pressing ring 72 slides into the inward protrusion of the fixing clip 84 (S18). Then, the lock mechanism 204 is separated from the pressing ring 72 at a high speed of 3000mm/min (S20).

The procedure of the case where the speed at which the lock mechanism is separated from the pressure ring 72 is low will be described with reference to fig. 19 (b). Steps S10 to S18 are the same as in fig. 19 (a). After step S18, the lock mechanism is separated from the press ring 72 at a low speed of 50mm/min (S22). After the lock mechanism 204 is completely separated from the pressing ring 72, the lock mechanism 204 is separated from the pressing ring 72 at a high speed of 3000mm/min in the same manner as in step S20 of fig. 19(a) (S24).

Fig. 20 illustrates how much the strain of the substrate WF is improved in fig. 19(a) and 19 (b). Fig. 20(a) and 20(c) show the case where the speed of separating the locking member from the seal holder 62 is high, and fig. 20(b) shows the strain when the speed of separating the locking mechanism from the seal holder 62 is low. Fig. 20(a) and 20(c) correspond to fig. 19(a), and fig. 20(b) corresponds to fig. 19 (b). In fig. 20(a) to 20(c), the horizontal axis represents time, and the vertical axis represents strain. The speed of exit of the locking member from the seal retainer 62 is the same for fig. 20(a), 20(c), although the torque of the motor of the locking mechanism is different.

Point 206 represents the strain when the seal holder 62 contacts the substrate WF. The strain sharply increased from "0 μ ST" to "100 μ ST". Point 208 represents the strain of the seal holder 62 as it moves away from the substrate WF. The strain was reduced from "50 μ ST" to "-25 μ ST". The change of the strain from positive to negative indicates the reversal of the warping direction of the substrate WF. That is, a large strain occurs in the substrate WF. The "asterisk" indicated by the dot 206 indicates that a large impact force is applied to the substrate WF at this time.

In addition, the point 210 indicates the strain when the seal holder 62 is separated from the substrate WF, and the strain is reduced from "50 μ ST" to "0 μ ST". The strain changing from positive to 0 means that the warp direction of the substrate WF is not reversed. That is, it means that no large strain occurs on the substrate WF.

Fig. 20(d) to 20(f) correspond to fig. 20(a) to 20(c), and show the speed 212 and the motor torque 214 of the seal holder 62 separated from the substrate WF, and the maximum value 216 and the minimum value 218 of the strain at the points 208 and 210 in fig. 20(a) to 20 (c).

Next, a substrate supporting member applicable to a rotary stage portion of the aligner 14 for aligning the alignment plane, the groove, or the like of the substrate WF in a predetermined direction will be described with reference to fig. 23. Fig. 23(a) is a plan view of the substrate support member 262 on which the substrate WF is mounted. FIG. 23(b) shows a cross-sectional view AA of FIG. 23 (a). The substrate support member 262 can stably absorb the substrate WF warped in a bowl shape.

The substrate support member 262 for supporting the substrate WF according to the present embodiment includes: a base 258; three support portions 260 provided on a surface 272 of the base portion 258 and on which the substrate WF is mounted; and a protrusion (vacuum chuck section) 264 disposed on a surface 272 of the base 258. The outer diameter of the substrate support member 262 is used for the groove detection and the outer circumference detection of the outer circumference of the substrate WF, and has a diameter smaller than the diameter of the substrate WF.

The projection 264 has vacuum holes 266 for vacuum-sucking the substrate WF. The vacuum hole 266 has an opening 270 at the top 268 of the projection 264. The height 274 of the top 268 of the projection 264 is fixed relative to the surface 272 of the base 258. The substrate WF is vacuum-sucked onto the top 268 of the protrusion 264. The vacuum port 266 is connected to a vacuum source 276 of a vacuum pump.

The protrusion 268 is disposed at the center of the base 258. In the present embodiment, three support portions 260 are provided, but three or more support portions may be provided. The substrate support member 262 includes substrate support portions 260 at three locations so as to contact the outer periphery of the substrate WF. The substrate support member 262 can stably absorb the substrate WF warped in a bowl shape.

Next, another embodiment of a substrate supporting member applicable to a stage portion of the aligner 14 and the like will be described with reference to fig. 24. Fig. 24(a) shows a plan view of the substrate support member 278. Fig. 24(b) is a cross-sectional view of AA in fig. 24(a) when the substrate WF is mounted thereon. The substrate support member 278 can stably adsorb the substrate WF warped in a mountain shape.

The substrate support member 278 for supporting the substrate WF according to the present embodiment includes: a base 280; and a base 280 for vacuum holes 266 for vacuum-sucking the substrate WF. The vacuum holes 266 have openings 284 in the top 282 of the base 280. The substrate WF is vacuum-sucked on the top 282 of the base 280. The portion in contact with the center of the substrate WF includes a base portion 280 of a protrusion protruding from the support portion 286. The top 282 of the base 280 has an opening 284 for vacuum suction. The vacuum port 266 is connected to a vacuum source 276. The substrate support member can stably adsorb the substrate warped into the mountain shape.

Next, still another embodiment of a substrate supporting member applicable to a stage portion of the aligner 14 or the like will be described with reference to fig. 25. Fig. 25(a) shows a plan view of the substrate support member 288. Fig. 25(b) is an AA sectional view of fig. 25(a) when the substrate WF is mounted thereon. The substrate supporting member 288 can stably absorb the substrate WF warped in a mountain shape.

The substrate supporting member 288 for supporting the substrate WF according to the present embodiment includes: a base 290; and a vacuum hole 292 for vacuum-sucking the substrate WF through the base 290. Vacuum bore 292 has an opening 298 at the top 296 of base 290. The substrate WF is vacuum-sucked on the top 296 of the base 290. The portion in contact with the center of the substrate WF includes a base 290 having a protrusion protruding from the support 286. The top 296 of the base 290 has an opening 298 for vacuum suction. The substrate support member can stably adsorb the substrate warped into the mountain shape. Vacuum holes 292 are connected to vacuum holes 266. The vacuum port 266 is connected to a vacuum source 276.

Next, a detection system capable of detecting correct mounting of the substrate WF in a warped state at a predetermined position such as a transfer device (substrate holder 18) will be described. In order to detect whether or not the substrate WF is correctly disposed on the substrate support member for conveyance, a level sensor can be used. First, the operation of the level sensor applicable to the case of the substrate WF without the warp state will be described with reference to fig. 26. The operation of the level sensor applicable to the case of the substrate WF having a warped state will be described later.

As described above, when the substrate WF is supported by the edge portion 82a of the movable base 82 before the substrate holder 18 holds the substrate WF, the outer peripheral end portion of the substrate WF is guided by the substrate guide 82e, and the substrate WF is set on the movable base 82. Fig. 26(a) is an explanatory diagram of the operation of the level sensor when the substrate WF without warpage is disposed at a correct position on the movable base 82. Fig. 26(b) is an explanatory diagram of the operation of the level sensor when the substrate WF without warpage is disposed at an inappropriate position on the movable base 82.

As shown in fig. 26(a), the light emitting portion 300 of the level sensor emits light 302 so that the light 302 passes through a little above the substrate WF. The light 302 is detected by a detection portion 304 of the level sensor. As shown in fig. 26(b), when the substrate WF is not warped in a proper position on the movable base 82, specifically, when the substrate guide 82e is provided with the substrate WF, the light 302 is blocked by the substrate WF. Since the detector 304 cannot detect the light beam 302, it can be detected that the substrate WF is not disposed at a proper position on the movable base 82. The light emitting unit 300 and the detecting unit 304 are disposed at positions not to shield the light beam 302 by the substrate guide 82 e.

The light emitting unit 300 and the detecting unit 304 are preferably arranged on two diameters of the substrate WF. The angle formed by the two diameters is preferably 90 degrees, but may be larger than 0 degree. The light emitting unit 300 and the detecting unit 304 may be arranged on a straight line other than the diameter of the substrate WF. In the case of the level detection system, since the substrate WF is provided at a correct position of the stage when the substrate WF is transferred, for example, the substrate WF can be prevented from dropping off during the transfer.

Fig. 26 shows a case where a light beam 302 is passed a little above a substrate to detect a deviation of a substrate mounting position (or whether the substrate is not mounted horizontally). However, the warped substrate WF (for example, a mountain-shaped substrate warped upward) may not be able to detect whether the substrate WF is correctly arranged. This is explained with reference to fig. 27.

Fig. 27 is an illustration showing that an error is detected even though the substrate WF having a warped state is correctly mounted at a predetermined position of the substrate holder 18. As shown in fig. 27, when the substrate WF in a warped state is placed at a correct position on the movable base 82, the light beam 302 is blocked by the substrate WF. Since the detection unit 304 does not detect the light beam 302, an error is detected when the substrate WF is placed at an inappropriate position on the movable base 82.

A detection system 312 for detecting the position of a substrate mounted on the movable base 82 (mounting portion) that can solve such a problem will be described with reference to fig. 28. The inspection system 312 can accurately inspect the position of the substrate WF with and without the substrate WF in the warped state. The detection system 312 irradiates the detection light 314 on the outer periphery of the substrate WF, and the detection system 312 detects the detection light 314 reflected by the movable base 82 or the substrate WF. When the detection light 314 is shielded by the substrate WF, it is determined that the position is not appropriate, as described below.

Unlike the embodiment of fig. 26 in which the light beam 302 passes slightly above the substrate WF, the detection system 312 irradiates the light beam 314 from the detection system 312 only to the end 316 of the substrate WF. When the substrate WF blocks the light 314 from the detection system 312, it is determined that the position is deviated. Thus, the deviation of the substrate mounting position can be detected.

As shown in fig. 2, the detection system 312 may be disposed at three or more positions around the substrate WF. Fig. 2 is a configuration with 4 detection systems 312. When the detection systems 312 provided at three or more positions all determine that the substrate WF is at the correct position, as will be described later, it is possible to determine that the entire substrate WF is at the correct position. Fig. 28(a) is an illustration showing only two detection systems 312 indicating that the substrate WF having a warped state is in a correct position. Both detection systems 312 determine that the substrate WF is at the correct position.

Fig. 28(b) is an illustration showing only two detection systems 312 indicating that the substrate WF having a warped state is in an erroneous position. Of the two detection systems 312, the detection system 312b determines that the substrate WF is at the correct position because the substrate WF does not shield the detection light 314 from the detection systems 312. The detection system 312a determines that the substrate WF is not in the correct position because the substrate WF blocks the detection light 314 from the detection system 312.

Fig. 29 shows the structure of the detection system 312. The detection system 312 for detecting the position of the substrate (object) WF mounted on the movable base 82 (mounting portion) includes a light emitting portion 318 that outputs detection light for detecting the substrate position. The detection system 312 has a detection section 320. The detection unit 320 is disposed at a position where the reflected light 322 generated by reflecting the detection light 314 directly incident on the movable base 82 from the light emitting unit 318 by the movable base 82 can be detected.

In a plane generated by the detection light 314 directly incident on the movable base 82 and the reflected light 322 detected by the detection unit 320, the reflected light 322 is located on the opposite side of the substrate WF with respect to the detection light 314 directly incident on the movable base 82. In fig. 29, the plane is the plane in which fig. 29 is described. The substrate WF is a part thereof. The substrate 324 is at the correct position, and the positional deviation of the substrates 326 to 330 becomes larger in order. Arrow 332 indicates the amount of positional deviation of substrate 330 from the correct position.

The reflected light 322 reflects the light 314 not shielded by the substrate WF. When the reflected light 322 is detected, the substrate is in the correct position. The reflected light 326a to the reflected light 330a represent light beams that are blocked and reflected by the substrates 326 to 330, respectively. The reflected light 326a is reflected by the substrate WF and then reflected by the movable base 82. The reflected lights 328a and 330a are light beams that are not reflected by the movable base 82 after being reflected by the substrate WF. The reflected light 328a is detected by the detection section 320. The reflected light 330a is not detected by the detection section 320.

The amount of deviation of the substrate WF varies depending on the degree of the deviation, and the position of incidence on the detection unit 320. Therefore, the amount of deviation of the substrate WF (the position of the substrate WF) can be detected depending on the position of the substrate WF on the detection unit 320. As the detection unit 320 that receives light at different positions, an image sensor in which a plurality of light receiving elements are arranged in a plane, such as a light ray sensor or a CCD sensor, can be used.

With reference to the position where the reflected light 322 enters the detection unit 320, as shown in the figure, the position of the detection unit 320 on the side where the reflected light 326a enters is "+ (positive)" and the position of the detection unit 320 on the side where the reflected light 328a enters is "- (negative)". When determined in this manner, a positive value is output when the reflected light 326a is detected, that is, when the positional deviation is small. Since the reflected light 322 and the reflected light 326a are located close to each other, the reflected light 326a may be mistaken for the substrate WF at the correct position depending on the proximity. In the case of the reflected light 330a, since the reflected light does not enter the detection unit 320, it can be accurately recognized that the substrate WF is misaligned. Since the position of the substrate WF can be determined most accurately only in the case of the reflected light 322 and the reflected light 330a, the measurement value is somewhat unstable in the case of the present figure except for the case of the reflected light 322 and the reflected light 330 a.

Fig. 30 shows a configuration of a detection system 312 according to another embodiment that can perform measurement more stably. The detection system 312 for detecting the position of the substrate (object) WF mounted on the movable base 82 (mounting portion) includes a light emitting portion 318 that outputs detection light for detecting the substrate position. The detection system 312 has a detection section 320. The detection unit 320 is disposed at a position where the reflected light 322 generated by reflecting the detection light 314 directly incident on the movable base 82 from the light emitting unit 318 by the movable base 82 can be detected.

In the plane generated by the detection light 314 directly incident on the movable base 82 and the reflected light 322 detected by the detection unit 320, the detection light 314 directly incident on the movable base 82 is located on the opposite side of the substrate WF with respect to the reflected light 322. In the case of fig. 30, the plane is the plane in which fig. 30 is described. The substrate WF is a part thereof. The substrate 324 is in the correct position and the positional deviation of the substrates 326-328 increases in sequence. Arrow 332 indicates the amount of positional deviation of the substrate 328 from the correct position.

The reflected light 322 is not shielded by the substrate WF. When the reflected light 322 is detected, the substrate is in the correct position. The reflected light 326a to 328a represent light beams shielded and reflected by the substrates 326 to 328, respectively. The reflected light 326a, 328a is reflected by the movable base 82 and then reflected by the substrate WF. The reflected light 326a is detected by the detection section 320. The reflected light 328a is not detected by the detection section 320.

The amount of deviation of the substrate WF varies depending on the degree of the deviation, and the position of incidence on the detection unit 320. Therefore, the amount of deviation of the substrate WF (the position of the substrate WF) can be detected depending on the position of the substrate WF on the detection unit 320. As the detection unit 320 that receives light at different positions, an image sensor in which a plurality of light receiving elements are arranged in a plane, such as a light ray sensor or a CCD sensor, can be used.

As shown in the figure, the position of the detection unit 320 on the incident side of the reflected light 326a is "- (negative)" and the position of the detection unit 320 on which the light does not enter is "+ (positive)" with reference to the position where the reflected light 322 enters the detection unit 320. In this case, a negative value is output when the reflected light 326a is detected, that is, when the positional deviation is small.

The structure of the detection system 312 of fig. 30 can be the same as the detection system 312 of fig. 29. The difference is the positional relationship with the substrate WF or the movable base 82. When fig. 29 and fig. 30 are compared, the detection system 312 has an up-down reverse relationship.

The difference between fig. 29 and fig. 30 is that the mounting of the detection system 312 is reversed, and fig. 29 reflects the substrate WF and then reflects the substrate WF by the movable base 82. In fig. 30, the light is reflected by the movable base 82 and then reflected by the substrate WF. The reflection of the substrate WF is disturbed due to the complicated surface shape of the substrate WF. A first difference between fig. 29 and fig. 30 is that: fig. 29 shows the magnitude of positional deviation of the known detector 320 when receiving light in the range from the substrate 324 to the substrate 328; fig. 30 shows the magnitude of positional deviation of the known detector 320 when receiving light only in a narrow range from the substrate 324 to the substrate 326. In fig. 30, since the position detection unit 320 of the substrate 328 does not receive light, the positional deviation can be known clearly, and compared with fig. 29, the positional deviation can be known precisely. In fig. 29, when the position of the substrate WF is deviated from that of the substrate 328, the detection unit 320 does not receive light, and the positional deviation can be clearly known.

A second difference between fig. 29 and fig. 30 is that: fig. 29 is a view in which the detection section 320 receives light in both the "positive" and "negative" ranges of the detection section 320; in contrast, fig. 30 shows that the detection unit 320 receives light only in a narrow range of "minus" of the detection unit 320. In fig. 29, since the detecting unit 320 detects the positional deviation in a wide range of both "positive" and "negative" and in a wide range of the substrates 324 to 328, the accuracy in determining the magnitude of the positional deviation is lower than that in fig. 30. Since the light incident on the detection unit 320 is widely incident light, the accuracy of determining the position is lowered when determining the position of the substrate WF at the position of the maximum value of the intensity distribution of the light. In fig. 30, since the detection unit 320 receives light only in a narrow range from the substrate 324 to the substrate 326, when determining the position of the substrate WF at the position of the maximum value of the intensity distribution of light, the positional error of the substrate WF to be measured is small from the beginning even if an error occurs.

As further explained in this regard. In the embodiment of fig. 29, light is irradiated from above onto the movable base 82 below the substrate WF, and the light is reflected by the substrate WF and then reflected by the movable base 82. The contrast detection unit 320 receives the positions of the reflected light 326a and the reflected light 328a reflected by the substrates 326 and 328, respectively, and it is known that the position of the substrate WF is slightly shifted and the light is scattered at greatly different positions. Since the light is greatly scattered, the distribution area of the reflected light is enlarged, and the reflected light cannot properly enter the detection unit 320. That is, the change in the position of the substrate WF is small and the light path is largely changed. Then, detection is performed over a wide range of both "positive" and "negative" of the detection unit 320. The detection unit 320 detects positional deviations of the substrates 326 to 330 over a wide range of the substrate WF. Since the light incident on the detection unit 320 is incident with a large spread (a distribution in which the distribution of light is wide and has no sharp peak in intensity), the position determination accuracy is lowered when determining the position of the substrate WF at the position of the maximum value of the intensity distribution of light. As a result, it is more difficult to recognize a slight positional deviation of the substrate WF than in fig. 30. In fig. 29, it is more difficult to finely adjust the position of the substrate WF than in fig. 30.

In fig. 29, when the positions of the substrates 326 and 324 are identified, that is, when the positions of the substrates 326 and 324 are identified closer to the outer periphery, it is known at which position the maximum peak in the intensity of the waveform of the received light is located. The recognized position specifies where the fine position of the substrate is located. However, in fig. 29, when the reflected light 322 is compared with the reflected light 326a, the reflected light is greatly scattered by moving the substrate slightly to the outside at the position of the substrate 326. The distribution area of the reflected light is wide at the position of the substrate 326, and a part of the reflected light may be incident outside the detection unit 320. The reflected light does not properly enter the detection section 320. Since this state cannot be measured correctly, the detection unit 320 outputs a positive value, and an error occurs.

In addition, since fig. 30 adopts a method of reflecting the light by the movable base 82 and then reflecting the light by the substrate WF, the distribution area of the reflected light can be limited as described above. As described above, in fig. 30, light is received only at a position where the positional deviation of the substrate WF is small, that is, at a close distance from the correct position, and the reflected light is not detected at the positions of the substrate 328 and the substrate 330. In comparison with fig. 29, fig. 30 does not pick up the unnecessary reflected light.

In the case of the detection system 312 of fig. 30, the following advantages are provided as compared with the detection system 312 of fig. 29. That is, 1. since the light does not enter the positive area of the detection part 320, the error is reduced. Therefore, the reflected light when the position of the substrate WF is largely deviated does not enter the detection unit 320 as shown in fig. 30. Since the detection is performed only in the negative region, the numerical value variation region can be easily known, and the determination of the positional deviation can be easily performed. 2. Fig. 29 detects the reflected light 328a, while fig. 30 does not detect the reflected light 328 a. I.e. only when the deviation is small. By receiving light only at the closest distance point, no unwanted light sources are picked up. The value is stable because the detection range is defined. 3. The above 1 and 2 can detect a slight positional deviation of the substrate WF.

When fig. 29 is changed to fig. 30, only the mounting bracket for mounting the detection system 312 may be replaced. Thus, the change is easy.

Fig. 31 is an enlarged view of a part of fig. 30. Fig. 30 shows the offset position of the substrate WF by an imaginary line. Fig. 31 shows the same position of the substrate WF at the deviated position, and shows the path of the light beam on the substrate WF at the deviated position. The light ray 334 is the light ray described in fig. 30, and the following is known about the light ray 334. The light ray 334 and its neighboring light rays will generate more than a certain amount of interference to cause secondary reflection, and the light receiving angle will change. As a result, the detection unit 320 recognizes that light is reflected or received at a shorter distance (at a position with less deviation), and the numerical value indicating the deviation position indicates a value closer than the actual deviation position.

In addition, both level sensors and detection system 312 may be used. In this embodiment, when light is irradiated from the level sensor slightly above the substrate WF as shown in fig. 27 and an error occurs therein, detection light is irradiated from the detection system 312 to the outer periphery of the substrate WF instead of slightly above the substrate WF. The detection system 312 may be set to "false" when light is blocked by the substrate WF as shown in fig. 29 or 30. With this step, it can be determined whether the substrate WF is warped upward or downward, and a deviation of the substrate loading position can be detected.

Although the embodiments of the present invention have been described above, the embodiments of the present invention are not intended to limit the present invention, but are for easy understanding of the present invention. The present invention may be modified and improved without departing from the scope and spirit thereof, and the invention naturally includes equivalents thereof. In addition, the elements described in the claims and the description may be arbitrarily combined or omitted within a range in which at least part of the above-described problems can be solved or at least part of the effects can be achieved.

Description of the symbols

10 Cartridge

12 cassette station

14 aligner

16 spin dryer

18 substrate holder

20 substrate mounting/dismounting part

22 substrate conveying device

24 temporary storage box

38 plating unit

40 substrate holder conveying part

42 first conveyor

44 second conveyor

46 paddle drive

54 first holding member

58 second holding member

60 base

82 movable base

122 rotating stage

124 distance sensor

126 profile measuring instrument

130 recess

132 base

134 projecting part

136 vacuum hole

152 peripheral wall portion

156 fork part

157 edge part

160 outer peripheral portion

162 substrate holding member

172 through hole

174 opening part

186 substrate holding member main body

188 latch

190 elastic member

192 variable length member

233. 235 arm

237 Upper arm

241 lower arm

72a projection

82a edge portion

170B processing unit

170C warpage amount determination unit

192a, 192b variable length member