Support frame structure and manufacturing method thereof
阅读说明:本技术 支撑框架结构及其制作方法 (Support frame structure and manufacturing method thereof ) 是由 陈先明 冯进东 黄本霞 冯磊 赵江江 王闻师 于 2020-06-28 设计创作,主要内容包括:本申请公开了一种支撑框架结构制作方法和支撑框架结构,该方法包括步骤:提供包括支撑区和开口区的金属板;在支撑区的上下表面分别光刻形成上介质开孔和下介质开孔,上介质开孔和下介质开孔之间连接有金属间隔;在金属板上表面形成上金属柱,并层压上介质层,上介质层覆盖上金属柱和上介质开孔;刻蚀金属间隔,在金属板下表面形成下金属柱,并层压下介质层,下介质层覆盖下金属柱和下介质开孔;对上表面和下表面对应的上介质层、下介质层以及上金属柱、下金属柱进行磨平并贴附感光干膜,光刻感光干膜在开口区形成至少一个图案窗口;对图案窗口处进行刻蚀形成埋芯口框。本申请制作方法简单,能够提高芯片散热效率,改善封装翘曲。(The application discloses a method for manufacturing a supporting frame structure and the supporting frame structure, wherein the method comprises the following steps: providing a metal plate comprising a support region and an open region; photoetching the upper surface and the lower surface of the support area respectively to form an upper medium opening and a lower medium opening, wherein a metal interval is connected between the upper medium opening and the lower medium opening; forming an upper metal column on the upper surface of the metal plate, laminating an upper dielectric layer, and covering the upper metal column and the upper dielectric opening with the upper dielectric layer; etching the metal interval, forming a lower metal column on the lower surface of the metal plate, laminating a lower dielectric layer, and covering the lower metal column and the lower dielectric opening with the lower dielectric layer; grinding an upper dielectric layer and a lower dielectric layer corresponding to the upper surface and the lower surface, an upper metal column and a lower metal column, attaching a photosensitive dry film, and photoetching the photosensitive dry film to form at least one pattern window in an opening area; and etching the pattern window to form a core embedding opening frame. The manufacturing method is simple, and can improve the heat dissipation efficiency of the chip and improve the package warpage.)
1. A manufacturing method of a supporting frame structure is characterized by comprising the following steps:
providing a metal plate comprising a support region and an open region;
photoetching and forming at least one upper medium opening and at least one lower medium opening on the upper surface and the lower surface of the support region respectively, wherein a metal interval is connected between the upper medium opening and the lower medium opening;
electroplating the upper surface of the metal plate to form at least one upper metal column, and laminating an upper dielectric layer, wherein the upper dielectric layer covers the upper metal column and the upper dielectric opening;
etching the metal interval, electroplating the lower surface of the metal plate to form at least one lower metal column, laminating a lower dielectric layer, covering the lower metal column and the lower dielectric opening with the lower dielectric layer, and symmetrically arranging the upper metal column and the lower metal column relative to the metal plate;
and grinding the upper dielectric layer and the lower dielectric layer corresponding to the upper surface and the lower surface, the upper metal column and the lower metal column, attaching a photosensitive dry film, photoetching the photosensitive dry film to form at least one pattern window in the opening area, and etching the pattern window to form a core embedding opening frame.
2. A method of making a support frame structure according to claim 1, wherein the upper media openings are vertically aligned with the lower media openings.
3. A method of making a support frame structure according to claim 1, wherein: the upper metal column and the lower metal column respectively comprise a supporting metal column and an opening metal column, and the opening metal column is covered by the pattern window.
4. A method of making a support frame structure according to claim 1, wherein: the upper dielectric layer and the lower dielectric layer comprise prepreg or film type resin thermosetting organic resin or polyethylene thermoplastic organic resin.
5. A method of making a support frame structure according to claim 1, wherein: and forming a conductive layer and a protective layer on the surface of the upper dielectric layer in sequence.
6. A method of making a support frame structure according to claim 5, wherein: the conducting layer is made of titanium or copper metal.
7. A method of making a support frame structure according to claim 5, wherein: the protective layer is a photosensitive film or a liquid photoresist material.
8. A support frame structure for an embedded package, comprising:
The metal plate comprises a support area and an opening area, wherein at least one upper medium opening hole and at least one lower medium opening hole are respectively formed in the upper surface and the lower surface of the support area, and the upper medium opening hole is communicated with the lower medium opening hole;
the metal columns comprise upper metal columns and lower metal columns, and the upper metal columns and the lower metal columns are respectively and vertically connected to the upper surface and the lower surface of the metal plate;
the dielectric layers comprise an upper dielectric layer and a lower dielectric layer, and the upper dielectric layer and the lower dielectric layer are respectively and correspondingly arranged on the upper surface, the upper dielectric opening and the lower surface of the metal plate and the lower dielectric opening;
and the at least one core embedding opening frame is arranged in the opening area, penetrates through the dielectric layer and the metal plate, and is separated from the upper dielectric opening and the lower dielectric opening through the dielectric layer.
9. The support frame structure of claim 8, wherein the dielectric layer comprises a prepreg or film type resin thermosetting organic resin or a polyethylene thermoplastic organic resin.
10. The metal support frame structure of claim 8, for use in an embedded package, wherein the metal plate or the metal post comprises a conductive metal or metal alloy.
Technical Field
The present disclosure relates to the field of semiconductor packaging technologies, and in particular, to a supporting frame structure and a method for manufacturing the same.
Technical Field
With the vigorous development of the electronic industry, the electronic products are becoming thinner and lighter, the integration level is increasing, and the method for realizing the embedded chip packaging by using the supporting frame is being developed. The overall requirements of the support frame structure are reliability and appropriate electrical performance, thinness, rigidity, flatness, good heat dissipation, and competitive unit price.
At present, a medium material is mostly adopted by a frame for embedding and packaging in the market as a support frame main body, a large quantity of metal through hole column arrays are manufactured in the medium material, the height matching of the frame and an embedded chip is realized by adjusting the height of the metal through hole column, heat dissipation is realized mainly by windowing the medium and the back of the chip after the support frame is packaged, and the heat dissipation rate of the medium material is low, so that the embedded and packaging requirements of a high-power device cannot be met.
Content of application
The present application is directed to solving, at least to some extent, one of the technical problems in the related art. To this end, the present application proposes a support frame structure fabrication method and a support frame structure, the following is an overview of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims. The technical scheme is as follows:
In a first aspect, an embodiment of the present application provides a method for manufacturing a support frame structure, including the following steps:
providing a metal plate comprising a support region and an open region;
photoetching and forming at least one upper medium opening and at least one lower medium opening on the upper surface and the lower surface of the support region respectively, wherein a metal interval is connected between the upper medium opening and the lower medium opening;
electroplating the upper surface of the metal plate to form at least one upper metal column, and laminating an upper dielectric layer, wherein the upper dielectric layer covers the upper metal column and the upper dielectric opening;
etching the metal interval, electroplating the lower surface of the metal plate to form at least one lower metal column, laminating a lower dielectric layer, covering the lower metal column and the lower dielectric opening with the lower dielectric layer, and symmetrically arranging the upper metal column and the lower metal column relative to the metal plate;
and grinding the upper dielectric layer, the lower dielectric layer, the upper metal column and the lower metal column corresponding to the upper surface and the lower surface, attaching photosensitive dry films, photoetching the photosensitive dry films to form at least one pattern window in the opening area, and etching the pattern window to form a core embedding opening frame.
According to the manufacturing method of the supporting frame structure of the embodiment of the first aspect of the application, at least the following beneficial effects are achieved: on the first hand, the frame adopts metal as a supporting base material, the metal has good heat conductivity, heat generated by the chip during working can be conducted through a metal layer in the frame, the temperature of the chip is reduced, and windowing heat dissipation is not needed to be carried out on the back surface of the chip or high-cost high-heat-dissipation medium materials are not needed to be used; in the second aspect, the metal has certain rigidity and good ductility, the metal plate is used as a core to generate the metal column and cover the organic medium layer, and the improvement of packaging warping degree is facilitated; in the third aspect, the thickness of the frame can be increased by increasing the thickness of the core metal plate, so that the height of the electroplated metal column is reduced, the unstable risk of the electroplating process is reduced, the risk that the metal column is not ground out in the thinning and flattening processes is reduced, and the frame is guaranteed to be manufactured within the design specification; in a fourth aspect, the support frame is simple to manufacture and low in cost.
Optionally, in an embodiment of the present application, the upper media aperture is vertically aligned with the lower media aperture.
Optionally, in an embodiment of the present application, the upper metal pillar and the lower metal pillar include a supporting metal pillar and an opening metal pillar, respectively, and the opening metal pillar is covered by the pattern window.
Optionally, in an embodiment of the present application, the upper dielectric layer and the lower dielectric layer include a prepreg or film type resin thermosetting organic resin or a polyethylene thermoplastic organic resin.
Optionally, in an embodiment of the present application, a conductive layer and a protective layer are sequentially formed on a surface of the upper dielectric layer.
Optionally, in one embodiment of the present application, the conductive layer is titanium or copper metal.
Optionally, in an embodiment of the present application, the protective layer is a photosensitive film or a liquid photoresist material.
In a second aspect, an embodiment of the present application provides a support frame structure for embedding a package, including:
the metal plate comprises a support area and an opening area, wherein at least one upper medium opening hole and at least one lower medium opening hole are respectively formed in the upper surface and the lower surface of the support area, and the upper medium opening hole is communicated with the lower medium opening hole;
the metal columns comprise upper metal columns and lower metal columns, and the upper metal columns and the lower metal columns are respectively and vertically connected to the upper surface and the lower surface of the metal plate;
The dielectric layers comprise an upper dielectric layer and a lower dielectric layer, and the upper dielectric layer and the lower dielectric layer are respectively and correspondingly arranged on the upper surface, the upper dielectric opening and the lower surface of the metal plate and the lower dielectric opening;
and the at least one core embedding opening frame is arranged in the opening area, penetrates through the dielectric layer and the metal plate, and is separated from the upper dielectric opening and the lower dielectric opening through the dielectric layer.
The supporting frame structure according to the embodiment of the second aspect of the present application has at least the following advantages: on the first hand, the frame adopts metal as a supporting base material, the metal has good heat conductivity, heat generated by the chip during working can be conducted through a metal layer in the frame, the temperature of the chip is reduced, and windowing heat dissipation is not needed to be carried out on the back surface of the chip or high-cost high-heat-dissipation medium materials are not needed to be used; in the second aspect, the metal has certain rigidity and good ductility, the metal plate is used as a core to generate the metal column and cover the organic medium layer, and the improvement of packaging warping degree is facilitated; in the third aspect, the thickness of the frame can be increased by increasing the thickness of the core metal plate, so that the height of the electroplated metal column is reduced, the unstable risk of the electroplating process is reduced, the risk that the metal column is not ground out in the thinning and flattening processes is reduced, and the frame is guaranteed to be manufactured within the design specification; in a fourth aspect, the support frame is simple to manufacture and low in cost.
Alternatively, in one embodiment of the present application, the medium includes a prepreg or film type resin thermosetting organic resin or a polyethylene thermoplastic organic resin.
Optionally, in an embodiment of the present application, the metal plate or the metal pillar comprises a conductive metal or a metal alloy.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.
FIG. 1 is a flow chart illustrating steps in a method for fabricating a support frame structure according to one embodiment of the present application;
FIGS. 2-10 are cross-sectional views of an intermediate state of a method of making a support frame structure according to another embodiment of the present application;
FIG. 11 is a cross-sectional view of a support frame structure provided in accordance with another embodiment of the present application.
The
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the embodiments described herein are merely illustrative and not restrictive, and therefore do not represent any changes in the technical spirit, structure, proportion, or size which may occur or which may not affect the performance or objectives achieved thereby, and are intended to be covered by the teachings herein.
Reference will now be made in detail to the present embodiments of the present application, preferred embodiments of which are illustrated in the accompanying drawings, which are for the purpose of visually supplementing the description with figures and detailed description, so as to enable a person skilled in the art to visually and visually understand each and every feature and technical solution of the present application, but not to limit the scope of the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present number, and larger, smaller, inner, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1, a method for manufacturing a supporting frame structure according to an embodiment of the present application includes the following steps:
s100, as shown in fig. 2, providing a
S200, forming at least one upper
Referring to fig. 4, the
Optionally, the PCB
S300, electroplating at least one
S400, etching the metal space 150, electroplating at least one
It should be noted that, the upper
Step S400 further includes step S410, sequentially forming a conductive layer 500 and a protective layer 700 on the surface of the upper
S500, grinding and attaching the photosensitive
It should be noted that the core-embedding frame 400 is used for embedding electronic components, the electronic components include but are not limited to devices and chips, and may be active devices or passive devices, and may be high-power devices according to the classification of applications, and may also be radio frequency or logic chips, and the size and number of the core-embedding frame 400 may be designed according to actual requirements.
Based on the above manufacturing method of the support frame structure, various embodiments of the support frame structure of the present application are provided.
Referring to fig. 11, another embodiment of the present application further provides a support frame structure for embedded package, including a
In one embodiment, the group of metal posts includes an
An embodiment of the present application provides a support frame structure for embedded package, and the dielectric layer includes a prepreg or film type resin thermosetting organic resin or polyethylene thermoplastic organic resin.
In an embodiment, the dielectric layer is an organic material, and includes a thermosetting organic resin such as a prepreg and a film-type resin, or a thermoplastic organic resin such as polyethylene, and preferably, a prepreg dielectric layer is used as the organic dielectric material in the present application.
In one embodiment of the present application, a supporting frame structure for an embedded package is provided, and the
In one embodiment, the supporting metal material may be one of metals or metal alloys such as copper, aluminum, copper-aluminum alloy, etc., and preferably, the
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope of the present invention defined by the claims.
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