阅读说明：本技术 一种半导体封装超声铝线键合装置 (Semiconductor packaging ultrasonic aluminum wire bonding device ) 是由 林德辉 许伟波 于 2020-08-04 设计创作，主要内容包括：本发明公开了一种半导体封装超声铝线键合装置,包括底座,所述底座的顶部开设有输送腔,所述输送腔的内腔设置有输送机构,所述输送机构包括转动连接于输送腔内腔的两个转辊,所述转辊的表面套设有输送带,所述输送腔的内腔固定连接有支撑板,所述支撑板的顶部与输送带接触。本发明解决了导体芯片在进行铝线键合时,对半导体芯片输送时,不能实现间歇式进料,甚至还需人工控制其进料,使其自动化程度低,而且铝线送料还需劈刀尖夹取,增加了夹取铝线的行程,影响半导体芯片铝线键合的效率的问题,该半导体封装超声铝线键合装置,能够有效的提高半导体芯片铝线键合的效率,提高了半导体加工的效率。(The invention discloses a semiconductor packaging ultrasonic aluminum wire bonding device which comprises a base, wherein a conveying cavity is formed in the top of the base, a conveying mechanism is arranged in the inner cavity of the conveying cavity, the conveying mechanism comprises two rotary rollers which are rotatably connected to the inner cavity of the conveying cavity, a conveying belt is sleeved on the surfaces of the rotary rollers, a supporting plate is fixedly connected to the inner cavity of the conveying cavity, and the top of the supporting plate is in contact with the conveying belt. The semiconductor packaging ultrasonic aluminum wire bonding device solves the problems that when the aluminum wire bonding is carried out on a semiconductor chip, the intermittent feeding cannot be realized, even the feeding is controlled manually, so that the automation degree is low, and the aluminum wire feeding is carried out by clamping the aluminum wire by a cleaver tip, so that the stroke of clamping the aluminum wire is increased, and the aluminum wire bonding efficiency of the semiconductor chip is influenced.)

1. The utility model provides a semiconductor package supersound aluminum wire bonding device, includes base (1), its characterized in that: the conveying cavity (2) is seted up at the top of base (1), the inner chamber of conveying cavity (2) is provided with conveying mechanism (3), conveying mechanism (3) are connected in two of conveying cavity (2) inner chambers and are changeed roller (31) including rotating, the surface cover of changeing roller (31) is equipped with conveyer belt (32), the inner chamber fixedly connected with backup pad (4) of conveying cavity (2), the top and conveyer belt (32) contact of backup pad (4), the surface of conveyer belt (32) is provided with drive mechanism (5), the top of base (1) is provided with clamp plate (6), the bottom of clamp plate (6) is provided with elevating system (7), the top of clamp plate (6) is provided with aluminium wire paying out machine structure (8), the rear side at base (1) top is provided with ultrasonic wave cleaver (9).

2. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: drive mechanism (5) are including being fixed in box (51) on base (1) top right side, the rear side rotation of box (51) inner chamber is connected with bull stick (52), the front end of bull stick (52) runs through to the front side of box (51) and fixedly connected with gear (53), gear (53) are located the inner chamber of carrying chamber (2), the front side fixedly connected with ring gear (54) on conveyer belt (32) surface, ring gear (54) and gear (53) meshing, the inner chamber of box (51) is provided with actuating mechanism (55).

3. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 2, wherein: the driving mechanism (55) comprises a driving disc (551) fixed on the surface of the rotating rod (52), driving grooves (552) and positioning arc-shaped grooves (553) are formed in the periphery of the surface of the driving disc (551), and the driving grooves (552) and the positioning arc-shaped grooves (553) are arranged in a staggered mode.

4. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 3, wherein: the left side of the bottom of the inner cavity of the box body (51) is fixedly connected with a motor (554), an output shaft of the motor (554) is fixedly connected with a vertical plate (555), the front side of the vertical plate (555) is fixedly connected with an arc plate (556) matched with the positioning arc groove (553), and the top and the bottom of the front side of the vertical plate (555) are fixedly connected with driving blocks (557) matched with the driving groove (552).

5. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: elevating system (7) are including offering recess (71) in transport chamber (2) inner chamber rear side, the bottom fixedly connected with cylinder (72) of recess (71) inner chamber, the top of cylinder (72) run through to the top of base (1) and with clamp plate (6) fixed connection.

6. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 5, wherein: the two sides of the bottom of the pressing plate (6) are fixedly connected with guide rods (73), the bottoms of the guide rods (73) penetrate through inner cavities of the grooves (71), and the surfaces of the guide rods (73) are connected with the base (1) in a sliding mode.

7. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: box (81) is placed including being fixed in the left aluminium drum in clamp plate (6) top to aluminium line paying out machine structure (8), the front side fixedly connected with of box (81) is placed to the aluminium drum is put line box (82), the right side fixedly connected with motor (83) of putting line box (82), the output shaft of motor (83) runs through to the inner chamber and the fixedly connected with rolling disc (84) of putting line box (82), the front side fixedly connected with unwrapping wire stand pipe (85) of putting line box (82).

8. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 7, wherein: the surface of the rotating disc (84) is provided with anti-slip saw teeth.

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to an ultrasonic aluminum wire bonding device for semiconductor packaging.

Background

The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of a semiconductor, the semiconductor is a material with controllable conductivity ranging from an insulator to a conductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products in the present day, such as computers, mobile phones or digital audio recorders, have very close relationship with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor materials in commercial application.

Referring to a semiconductor bonding wire and a semiconductor package structure of the patent application No. CN201420804324.6, the semiconductor bonding wire includes a first end portion, a bent portion and a tail portion; wherein the first end is fixed to a first bond site of the semiconductor component; the corner part at least comprises a corner; the tail is fixed on a second bonding point of the semiconductor component; and the lead is not overlapped with the shortest path connecting the first bonding point and the second bonding point, and the lead comprises a corner part at the semiconductor bonding lead, so that the shortest path of the lead and the conventional lead can keep a proper distance, and the mutual inductance between the adjacent leads is greatly reduced.

However, when the semiconductor chip is bonded by the aluminum wire, the intermittent feeding can not be realized when the semiconductor chip is conveyed, and even the feeding is manually controlled, so that the automation degree is low, and the feeding of the aluminum wire is also required to be clamped by a cleaver tip, so that the stroke of clamping the aluminum wire is increased, and the efficiency of bonding the aluminum wire of the semiconductor chip is influenced.

Disclosure of Invention

The invention aims to provide a semiconductor packaging ultrasonic aluminum wire bonding device which has the advantage of high-efficiency bonding and solves the problems that when a semiconductor chip is subjected to aluminum wire bonding and conveyed, intermittent feeding cannot be realized, even the feeding needs to be controlled manually, the automation degree is low, aluminum wire feeding needs to be clamped by a cleaver tip, the stroke of clamping an aluminum wire is increased, and the efficiency of semiconductor chip aluminum wire bonding is influenced.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor package supersound aluminum wire bonding device, includes the base, the transport chamber has been seted up at the top of base, the inner chamber of carrying the chamber is provided with conveying mechanism, conveying mechanism is including rotating two commentaries on classics rollers of connecting in carrying the intracavity chamber, the surface cover of changeing the roller is equipped with the conveyer belt, the inner chamber fixedly connected with backup pad of carrying the chamber, the top and the conveyer belt contact of backup pad, the surface of conveyer belt is provided with drive mechanism, the top of base is provided with the clamp plate, the bottom of clamp plate is provided with elevating system, the top of clamp plate is provided with aluminum wire paying out machine and constructs, the rear side at base top is provided with the ultrasonic wave.

Preferably, drive mechanism is including being fixed in the box on base top right side, the rear side rotation of box inner chamber is connected with the bull stick, the front end of bull stick runs through to the front side of box and fixedly connected with gear, the gear is located the inner chamber in transport chamber, the front side fixedly connected with ring gear on conveyer belt surface, ring gear and gear engagement, the inner chamber of box is provided with actuating mechanism.

Preferably, the driving mechanism comprises a driving disc fixed on the surface of the rotating rod, driving grooves and positioning arc-shaped grooves are formed in the periphery of the surface of the driving disc, and the driving grooves and the positioning arc-shaped grooves are arranged in a staggered mode.

Preferably, the left side of the bottom of the inner cavity of the box body is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a vertical plate, the front side of the vertical plate is fixedly connected with an arc plate matched with the positioning arc groove, and the top and the bottom of the front side of the vertical plate are fixedly connected with a driving block matched with the driving groove.

Preferably, elevating system is including seting up the recess in transport chamber inner chamber rear side, the bottom fixedly connected with cylinder of recess inner chamber, the top of cylinder run through to the top of base and with clamp plate fixed connection.

Preferably, both sides of the bottom of the pressing plate are fixedly connected with guide rods, the bottoms of the guide rods penetrate through the inner cavities of the grooves, and the surfaces of the guide rods are connected with the base in a sliding mode.

Preferably, the box is placed including being fixed in the left aluminium drum in clamp plate top to aluminium line paying out machine structure, the box is placed to the front side fixedly connected with of box is placed to the aluminium line dish, the right side fixedly connected with motor of paying out box, the output shaft of motor runs through to the inner chamber and the fixedly connected with rolling disc of paying out box, the front side fixedly connected with unwrapping wire stand pipe of paying out box.

Preferably, the surface of the rotating disc is provided with anti-slip saw teeth.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention has the advantages that the semiconductor chip is placed on the top of the conveyer belt, the conveyer belt intermittently conveys the semiconductor chip to the right by the transmission mechanism, the aluminum wire is conveyed to the top of the semiconductor by the aluminum wire paying-off mechanism after being conveyed to a proper position, then the aluminum wire is conveyed to the top of the semiconductor by the ultrasonic cleaver, a certain ultrasonic power and pressure are applied to ensure that eutectic melting is formed between the aluminum wire and the aluminum layer contact surface on the surface of the chip, the effect of connecting the chip is achieved, after the connection is finished, the right conveying is continuously carried out by the conveying mechanism, the purpose of high-efficiency bonding can be achieved, the problems that the intermittent feeding can not be realized, even the feeding is manually controlled when the semiconductor chip is conveyed when the aluminum wire bonding is carried out on the semiconductor chip, the automation degree is low, the feeding of the aluminum wire is also required to be clamped by a tool tip, the stroke for clamping the, the semiconductor packaging ultrasonic aluminum wire bonding device can effectively improve the aluminum wire bonding efficiency of the semiconductor chip and improve the semiconductor processing efficiency.

2. According to the invention, through the arrangement of the transmission mechanism, the motor is started to drive the vertical plate, the arc-shaped plate and the driving block to rotate, so that the driving block is rotated into the inner cavity of the driving groove, the driving disc can be driven to rotate, and further the purpose of driving the rotating rod to rotate is realized.

3. The invention can ensure the stability of the bonding of the semiconductor chip by using the lifting mechanism and the aluminum wire paying-off mechanism together, and avoid the shaking during the semiconductor bonding, when the semiconductor chip moves to a proper position, the cylinder retracts to drive the pressing plate to move downwards to contact with the semiconductor chip, and the aluminum wire at one end passes through the inner cavity of the paying-off box and the bottom of the rotating disc, and then enters the inner cavity of the paying-off guide pipe, the motor is started to drive the rotating disc to rotate, because the friction force of the saw teeth on the surface of the rotating disc and the aluminum wire is used for conveying the aluminum wire, the semiconductor chip is fixed by the pressing plate, the aluminum wire mechanism is driven to move downwards when the pressing plate moves downwards, and the paying-off guide pipe is positioned at the top of the semiconductor chip, and the aluminum wire coming out of the paying-off guide pipe is clamped by the ultrasonic cleaver, at the moment, the aluminum wire is slightly longer than the point of the cleaver, when the aluminum wire reaches a connection area, the aluminum wire at the point of the ultrasonic cleaver is contacted with a chip, ultrasonic friction generates heat to melt the aluminum wire, the effect of connecting the aluminum wire with a semiconductor chip is achieved, after a welding area is completed, the ultrasonic cleaver cuts the aluminum wire connected with the aluminum wire pay-off mechanism, then the aluminum wire coming out of the pay-off guide pipe is clamped, the ultrasonic cleaver moves to another welding area, ultrasonic friction is also adopted to connect the aluminum wire with the semiconductor chip, and after the welding area is completed, the aluminum wire is cut off by the cleaver, and aluminum wire bonding of one semiconductor chip can be completed.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a front view of a partial connecting structure of a conveying mechanism and a transmission mechanism according to the present invention;

FIG. 3 is a schematic top sectional view of the box structure of the present invention;

FIG. 4 is a schematic front view of the driving mechanism of the present invention;

FIG. 5 is a schematic perspective view of the aluminum wire paying-off mechanism structure of the present invention;

fig. 6 is a schematic perspective view of a connection structure of a base and a lifting mechanism according to the present invention.

In the figure: 1. a base; 2. a delivery lumen; 3. a conveying mechanism; 31. rotating the roller; 32. a conveyor belt; 4. a support plate; 5. a transmission mechanism; 51. a box body; 52. a rotating rod; 53. a gear; 54. a toothed ring; 55. a drive mechanism; 551. a drive disc; 552. a driving groove; 553. positioning the arc-shaped groove; 554. a motor; 555. a vertical plate; 556. an arc-shaped plate; 557. driving the block; 6. pressing a plate; 7. a lifting mechanism; 71. a groove; 72. a cylinder; 73. a guide bar; 8. an aluminum wire paying-off mechanism; 81. an aluminum wire coil placing box; 82. a wire releasing box; 83. a motor; 84. rotating the disc; 85. paying off the guide pipe; 9. an ultrasonic cleaver.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.