阅读说明：本技术 导电材料和连接体的制备方法 (Conductive material and method for producing connector ) 是由 北爪宏治 江岛康二 于 2019-03-14 设计创作，主要内容包括：本发明提供即使在低压条件的压接下也可得到高的连接可靠性的各向异性导电粘接剂、和连接体的制备方法。各向异性导电粘接剂含有绝缘性粘接剂和树脂芯导电粒子,所述树脂芯导电粒子的20%压缩恢复率为20%以上、且20%压缩时的压缩硬度K值为4000N/mm<Sup>2</Sup>以上。由此,即使在低压条件的压接下导电粒子也能够与高压条件的压接同样地突破氧化物层,可得到高的连接可靠性。(The invention provides an anisotropic conductive adhesive which can obtain high connection reliability even in pressure welding under low pressure condition, and a method for preparing a connection body. The anisotropic conductive adhesive comprises an insulating adhesive and resin core conductive particles, wherein the resin core conductive particles have a 20% compression recovery rate of 20% or more and a compression hardness K value of 4000N/mm at 20% compression 2 The above. Thus, even when the conductive particles are pressed under low-voltage conditions, the conductive particles can break through the oxide layer in the same manner as when the conductive particles are pressed under high-voltage conditions, and high connection reliability can be obtained.)

1. A conductive material comprising an insulating adhesive and resin core conductive particles, wherein the resin core conductive particles have a compression recovery rate of 20% or more and a compression hardness K value of 4000N/mm at 20% compression²The above.

2. The conductive material according to claim 1, wherein the resin core conductive particles have a compression recovery rate of 45% or more and a compression hardness K value of 4500N/mm at 20% compression²The above.

3. The conductive material according to claim 1, wherein the resin core conductive particles have a compression recovery rate of 60% or more.

4. The conductive material according to claim 1, wherein the resin core conductive particles have a compression hardness K value of 8000N/mm at 20% compression²The above.

5. The conductive material according to claim 1, wherein the resin core conductive particle has a compression hardness K value of 20000N/mm at 20% compression²The following.

6. The conductive material according to any one of claims 1 to 5, wherein the insulating adhesive contains a film-forming resin, an epoxy resin and an anionic polymerization initiator, and the conductive material is in the form of a film.

7. A method for preparing a linker, comprising:

a disposing step of disposing a 1 st electronic component and a 2 nd electronic component with a conductive material containing an insulating adhesive and resin core conductive particles, the resin core conductive particles having a compression recovery rate of 20% or more and a compression hardness K value at 20% compression of 20%4000N/mm²The above; and

and a curing step of curing the conductive material while the 2 nd electronic component and the 1 st electronic component are pressure-bonded by a pressure-bonding tool.

8. The method for producing a connected body according to claim 7, wherein the 2 nd electronic component and the 1 st electronic component are pressure-bonded under a condition of 40MPa to 150MPa in the curing step.

9. A connecting body including a 1 st electronic component, a 2 nd electronic component, and an adhesive film for bonding the 1 st electronic component and the 2 nd electronic component, the connecting body

The adhesive film is obtained by curing a conductive material containing an insulating adhesive and resin core conductive particles, wherein the resin core conductive particles have a compression recovery rate of 20% or more and a compression hardness K value of 4000N/mm at 20% compression²The above.

Technical Field

The present technology relates to a method for manufacturing a conductive material and a connector for connecting, for example, an ic (integrated circuit) chip to a flexible wiring board. The present application claims priority based on japanese patent application No. 2018-067630 filed in japan on 30.3.2018, which is incorporated by reference into the present application.

Background

Conventionally, in an active matrix display device such as an lcd (liquid Crystal display) or an oled (organic Light emitting diode) display, a plurality of scanning signal lines and video signal lines intersecting each other are arranged in a matrix on an insulating substrate such as glass, and thin film transistors (hereinafter, referred to as "TFTs") are arranged at intersections of the scanning signal lines and the video signal lines.

IZO (indium Zinc oxide) is used as a metal wiring film for electrodes such as a source electrode and a drain electrode of a TFT instead of ITO (indium Tin oxide) which is expensive to produce. The IZO wiring has a smooth surface and an oxide layer (passivation) is formed on the surface. In addition, for example, in aluminum wiring, TiO may be formed on the surface to prevent corrosion₂And the like. Alternatively, Al/Ti wiring may be used, but the same may be used as aluminum wiring.

However, since the oxide layer is hard, for example, when the driver IC is connected by an anisotropic conductive adhesive, the connection resistance value tends to increase.

For this reason, for example, patent document 1 proposes that separation between an electrode and a circuit connecting material is suppressed and good connection reliability is obtained by reducing the compression recovery rate of conductive particles and suppressing the repulsive force of the conductive particles to a low level.

Disclosure of Invention

Problems to be solved by the invention

However, in the method described in patent document 1, since the compression recovery rate of the conductive particles is low, the contact area with the wiring tends to be small, and the on-resistance value tends to be high. Therefore, in the method described in patent document 1, if the pressure bonding is not performed under high pressure, high connection reliability cannot be obtained, and there is a concern that the mounted component may be damaged.

The present technology is a technology for solving the above problems, and provides a conductive material which can obtain high connection reliability even under pressure bonding under low pressure conditions, and a method for producing a connected body.

Means for solving the problems

The present inventors have conducted intensive studies and as a result, have found that high connection reliability can be obtained even under pressure bonding under low pressure conditions by using resin core conductive particles having a moderately high compression recovery rate and hardness to break through an oxide layer, and have completed the present technology based on this finding.

That is, the conductive material according to the present technology contains an insulating adhesive and resin core conductive particles, the resin core conductive particles have a compression recovery rate of 20% or more, and a compression hardness K value at 20% compression of 4000N/mm²The above.

Further, a method for producing a linker according to the present technology includes: a disposing step of disposing a 1 st electronic component and a 2 nd electronic component with a conductive material containing an insulating adhesive and resin core conductive particles, the resin core conductive particles having a compression recovery rate of 20% or more and a compression hardness K value at 20% compression of 4000N/mm²The above; and a curing step of curing the conductive material while the 2 nd electronic component and the 1 st electronic component are pressure-bonded by a pressure-bonding tool.

The connector according to the present technology includes a 1 st electronic component, a 2 nd electronic component, and an adhesive film that bonds the 1 st electronic component and the 2 nd electronic component, wherein the adhesive film is formed by curing a conductive material containing an insulating adhesive and resin core conductive particles, the resin core conductive particles have a compression recovery rate of 20% or more, and a compression hardness K value at 20% compression of 4000N/mm²The above.

Effects of the invention

According to this technique, the resin core conductive particles can break through the oxide layer even under pressure bonding under low pressure conditions, and the contact area with the wiring can be increased, so that high connection reliability can be obtained.

Drawings

FIG. 1 is a sectional view schematically showing a method for producing a connected body according to the present embodiment, wherein FIG. 1(A) shows a disposing step (S1), and FIG. 1(B) shows a curing step (S2).

Detailed Description

Hereinafter, embodiments of the present technology will be described in detail in the following order with reference to the drawings.

1. Conductive material

2. Method for producing linker