阅读说明：本技术 天线装置和包括该天线装置的显示装置 (Antenna device and display device including the same ) 是由 金钟敏 朴东必 吴伦锡 洪源斌 于 2019-03-06 设计创作，主要内容包括：根据本发明的实施方式的天线装置包括：介电层；设置在介电层上并包括辐射电极的上电极层；设置在介电层上的下电极层；以及定位在介电层上并与上电极层和下电极一体地连接的弯曲连接部。因此,可以高度可靠地通过弯曲连接部实现接地层的连接。(An antenna device according to an embodiment of the present invention includes: a dielectric layer; an upper electrode layer disposed on the dielectric layer and including a radiation electrode; a lower electrode layer disposed on the dielectric layer; and a bent connection part positioned on the dielectric layer and integrally connected with the upper electrode layer and the lower electrode. Therefore, the connection of the ground layer can be achieved with high reliability by the bent connection portion.)

1. An antenna device, comprising:

a dielectric layer;

an upper electrode layer disposed on the dielectric layer, the upper electrode layer including a radiation electrode;

a lower electrode layer disposed on the dielectric layer; and

a bent connection part integrally connected with the upper electrode layer and the lower electrode layer on the dielectric layer.

2. The antenna arrangement according to claim 1, wherein the dielectric layer comprises a curved dielectric portion and the dielectric layer is curved by the curved dielectric portion, thereby defining an upper dielectric layer and a lower dielectric layer.

3. The antenna device of claim 2, wherein the upper electrode layer is disposed on a top surface of the upper dielectric layer and the lower electrode layer is disposed on a bottom surface of the lower dielectric layer.

4. The antenna device according to claim 2, wherein the curved connection portion is provided on a lateral surface of the curved dielectric portion.

5. The antenna device according to claim 1, wherein a stepped portion is formed by the upper electrode layer and the lower electrode layer.

6. The antenna device of claim 5, further comprising a sensor structure or an optical film disposed on the step portion.

7. The antenna device according to claim 1, wherein the upper electrode layer further comprises a ground pad.

8. The antenna device according to claim 7, wherein the bent connection portion is integrally connected with the ground pad and the lower electrode layer.

9. The antenna device according to claim 7, wherein the bent connection portion includes a plurality of bent lines branching from the ground pad.

10. The antenna device according to claim 7, wherein the upper electrode layer further comprises a transmission line protruding from the radiation electrode to abut the ground pad.

11. The antenna device according to claim 7, wherein the upper electrode layer includes a plurality of the radiation electrodes and a plurality of the ground pads each connected to each of the radiation electrodes,

wherein the lower electrode layer is integrally connected with the plurality of ground pads through the plurality of bent connection parts.

12. The antenna device according to claim 1, wherein the upper electrode layer, the bent connection portion, and the lower electrode layer comprise the same conductive material.

13. The antenna device according to claim 12, wherein the upper electrode layer, the bent connection portion, and the lower electrode layer include at least one selected from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), and alloys thereof.

14. The antenna device according to claim 1, wherein the upper electrode layer and the lower electrode layer comprise conductive materials different from each other.

15. The antenna device according to claim 1, wherein the radiation electrode comprises a mesh structure.

16. The antenna device according to claim 14, wherein the lower electrode layer comprises a mesh structure.

17. The antenna device of claim 15, further comprising a dummy mesh layer disposed around the radiating electrode.

18. A display device comprising an antenna device according to any one of claims 1 to 17.

Technical Field

The present invention relates to an antenna device and a display device including the same. More particularly, the present invention relates to an antenna device including an electrode and a dielectric layer and a display device including the antenna device.

Background

With the development of information technology, wireless communication technologies such as Wi-Fi, bluetooth, etc. are combined with display devices such as in the form of smart phones. In this case, the antenna may provide a communication function in combination with the display device.

With the rapid development of mobile communication technology, antennas capable of operating ultra-high frequency communication are required in display devices.

Further, as a display device equipped with an antenna becomes thinner and lighter, a space for the antenna may be reduced. Therefore, transmission and reception of high frequency and broadband signals may not be achieved in a limited space.

Therefore, a thin film or patch type antenna may be required for a thin display device, and research into improving radiation reliability in high frequency communication even in a thin structure is required.

For example, the electrodes and pads included in the antenna are connected using additional interconnect structures. When the interconnection structure is formed, the thickness of the antenna may increase, and mutual interference and noise with other pixel structures or sensing structures in the display device may be generated.

For example, korean laid-open patent application No. 2013 and 0095451 discloses an antenna integrated into a display panel, but does not provide a solution to the above-mentioned problems.

Disclosure of Invention

According to an aspect of the present invention, there is provided an antenna device having improved signal efficiency and reliability.

According to an aspect of the present invention, there is provided a display device including an antenna device having improved signal efficiency and reliability.

(1) An antenna device, comprising: a dielectric layer; an upper electrode layer disposed on the dielectric layer, the upper electrode layer including a radiation electrode; a lower electrode layer disposed on the dielectric layer; and a bent connection part integrally connected with the upper electrode layer and the lower electrode layer on the dielectric layer.

(2) The antenna device according to the above (1), wherein the dielectric layer includes a bending dielectric portion, and the dielectric layer is bent by the bending dielectric portion, thereby defining the upper dielectric layer and the lower dielectric layer.

(3) The antenna device according to the above (2), wherein the upper electrode layer is provided on a top surface of the upper dielectric layer, and the lower electrode layer is provided on a bottom surface of the lower dielectric layer.

(4) The antenna device according to the above (2), wherein the curved connection portion is provided on a lateral surface of the curved dielectric portion.

(5) The antenna device according to the above (1), wherein a step portion is formed by the upper electrode layer and the lower electrode layer.

(6) The antenna device according to the above (5), further comprising a sensor structure or an optical film provided on the step portion.

(7) The antenna device according to the above (1), wherein the upper electrode layer further includes a ground pad.

(8) The antenna device according to the above (7), wherein the bent connection portion is integrally connected to the ground pad and the lower electrode layer.

(9) The antenna device according to the above (7), wherein the bent connection portion includes a plurality of bent lines branching from the ground pad.

(10) The antenna device according to the above (7), wherein the upper electrode layer further includes a transmission line which protrudes from the radiation electrode to be adjacent to the ground pad.

(11) The antenna device according to the above (7), wherein the upper electrode layer includes a plurality of radiation electrodes and a plurality of ground pads each connected to each radiation electrode, wherein the lower electrode layer is integrally connected to the plurality of ground pads through a plurality of bent connection portions.

(12) The antenna device according to the above (1), wherein the upper electrode layer, the bent connection portion, and the lower electrode layer include the same conductive material.

(13) The antenna device according to the above (12), wherein the upper electrode layer, the bent connection portion, and the lower electrode layer include at least one selected from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), and alloys thereof.

(14) The antenna device according to the above (1), wherein the upper electrode layer and the lower electrode layer comprise conductive materials different from each other.

(15) The antenna device according to the above (1), wherein the radiation electrode includes a mesh structure.

(16) The antenna device according to the above (14), wherein the lower electrode layer includes a mesh structure.

(17) The antenna device according to the above (15), further comprising a dummy mesh layer disposed around the radiation electrode.

(18) A display device comprising the antenna device according to any one of the above (1) to (17).

In the antenna device according to the embodiment of the present invention, the upper ground pad and the lower electrode layer may be integrally connected by a bent connection portion. Therefore, the upper ground pad may be connected to the lower electrode layer, so that interference of the resonance frequency and radiation characteristics in the radiation electrode may be prevented, thereby improving radiation and signal reliability.

Further, interconnection between the upper ground pad and the lower ground portion can be easily achieved by bending the connection portion without additional conductive members such as contacts, circuit boards, and the like. In addition, it is also possible to prevent an increase in thickness and noise generated from the conductive member, which are caused when the contact or the circuit board is used.

The antenna device can be applied, for example, as a thin film antenna shape to a display device including a high-band mobile communication device of 3G or more (e.g., 5G) to improve radiation characteristics and optical characteristics such as transmittance.

Drawings

Fig. 1 is a schematic top plan view illustrating an antenna device according to an exemplary embodiment.

Fig. 2 to 4 are a top plan view and a side view illustrating an antenna device in a bent state according to an exemplary embodiment.

Fig. 5 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments.

Fig. 6 is a side view illustrating an antenna device in a bent state according to some example embodiments.

Fig. 7 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments.

Fig. 8 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments.

Fig. 9 is a schematic side view illustrating an antenna apparatus according to some example embodiments.

Fig. 10 is a schematic top plan view illustrating a display device according to an exemplary embodiment.

Detailed Description

According to an exemplary embodiment of the present invention, there is provided an antenna device including an upper electrode layer and a lower electrode layer which may be connected to each other by a bent connection portion with a dielectric layer interposed therebetween.

The antenna device may be, for example, a microstrip patch antenna manufactured in the form of a transparent film. The antenna device can be applied to, for example, a communication device for 3G to 5G mobile communication.

According to an exemplary embodiment of the present invention, there is also provided a display device including the antenna device.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art will appreciate that the embodiments described with reference to the drawings are provided for further understanding of the spirit of the invention and do not limit the claimed subject matter to that disclosed in the detailed description and the appended claims.

Fig. 1 is a schematic top plan view illustrating an antenna device according to an exemplary embodiment. Fig. 2 to 4 are a top plan view and a side view illustrating an antenna device in a bent state according to an exemplary embodiment.

Specifically, fig. 1 is a top plan view showing the antenna device before bending. Fig. 2 is a top plan view of the antenna device after bending. Fig. 3 is a side view of the antenna arrangement after bending in a second direction. Fig. 4 is a side view of the antenna arrangement after bending in a first direction.

In fig. 1, two directions parallel to the top surface of the dielectric layer 100 and crossing each other are defined as a first direction and a second direction. For example, the first direction and the second direction may be perpendicular to each other. A direction perpendicular to the top surface of the dielectric layer 100 is defined as a third direction. For example, the first direction may correspond to a width direction of the antenna device, the second direction may correspond to a length direction of the antenna device, and the third direction may correspond to a thickness direction of the antenna device. The definition of orientation can be applied to all figures.

Referring to fig. 1, the antenna device may include an upper electrode layer 130 and a lower electrode layer 110 formed on a dielectric layer 100. The antenna device may include a bent connection part 120 connecting the lower electrode layer 110 and the upper electrode layer 130.

The dielectric layer 100 may include, for example, a transparent resin material having flexibility and being foldable. For example, the dielectric layer 100 may include a thermal thermoplastic resin, which may include polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose-based resins such as diacetylcellulose and triacetylcellulose; a polycarbonate-based resin; acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; styrene-based resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, cyclic olefin or polyolefin having a norbornene structure and ethylene-propylene copolymer; a vinyl chloride-based resin; amide-based resins such as nylon and aramid; an imide-based resin; a polyether sulfone-based resin; a sulfone-based resin; polyether ether ketone-based resin; polyphenylene sulfide resin; a vinyl alcohol-based resin; vinylidene chloride-based resins; a vinyl butyral based resin; an allyl resin; a polyoxymethylene-based resin; an epoxy-based resin. They may be used alone or in combination of two or more of them.

In addition, a transparent film formed of a thermosetting resin or a UV curable resin, which may include a (meth) acrylic-based resin, a polyurethane-based resin, an acrylic polyurethane-based resin, an epoxy-based resin, or a silicone-based resin, may be used as the dielectric layer 100. In some embodiments, an adhesive film such as Optically Clear Adhesive (OCA), Optically Clear Resin (OCR), or the like may be included in the dielectric layer 100.

In some embodiments, the dielectric layer 100 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, or the like.

As shown in fig. 1, the dielectric layer 100 may include a first region (I), a second region (II), and a third region (III). In an exemplary embodiment, the third region III of the dielectric layer 100 may be provided as a bending region. After the dielectric layer 100 is bent by the third region III, the first region I and the second region II may serve as an upper region and a lower region, respectively.

A capacitance or an inductance may be formed between the upper electrode layer 130 and the lower electrode layer 110 through the dielectric layer 100 so that a frequency band in which the antenna device may be driven or operated may be adjusted. In some embodiments, the dielectric constant of the dielectric layer 100 may be adjusted in a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively lowered, so that the antenna driving in a desired high frequency band may not be achieved.

The upper electrode layer 130 may be disposed on the first region I of the dielectric layer 100, and may include a radiation electrode 132 and a ground pad 136. The upper electrode layer 130 may further include a transmission line 134 branched and extended from the radiation electrode 132. For example, the transmission line 134 may extend from a central portion of the radiation electrode 132 toward the ground pad 136.

A ground pad 136 may be disposed around the end of the transmission line 134. For example, the ground pad 136 may include a recess, and the end of the transmission line 134 may be inserted into the recess. In one embodiment, the end of the transmission line 134 may be disposed in the recess adjacent to the ground pad 136 while being spaced apart from the ground pad 136.

The ground pad 136 may be disposed around the transmission line 134 so that noise generated when the radiation signal is transmitted and received through the transmission line 134 may be effectively filtered or reduced.

The lower electrode layer 110 may be disposed on the second region II of the dielectric layer 100. In an exemplary embodiment, the lower electrode layer 110 may serve as a lower ground layer of the antenna device.

As shown in fig. 1, the lower electrode layer 110 may have a larger area than the upper electrode layer (e.g., the radiation electrode 132) in a plan view. In some embodiments, the length of the lower electrode layer 110 in the first and second directions may be greater than the length of the upper electrode layer 130.

The bent connection part 120 may be disposed on the third region III of the dielectric layer 100. In an exemplary embodiment, the bent connection part 120 may electrically connect the lower electrode layer 110 and the upper electrode layer 130 to each other. Further, the bent connection part 120 may be provided as a substantially single member integrally connected with the lower electrode layer 110 and the upper electrode layer 130.

In some embodiments, the bent connection part 120 may be integrally connected with the ground pads 136 of the lower and upper electrode layers 110 and 130.

The upper electrode layer 130, the lower electrode layer 110, and the bent connection part 120 may include the same conductive material or different conductive materials from each other. In some embodiments, the upper electrode layer 130, the lower electrode layer 110, and the bent connection part 120 may include the same metal material. In this case, the upper electrode layer 130, the lower electrode layer 110, and the bending connection part 120 may be simultaneously formed through a substantially single pattern forming process.

For example, the upper electrode layer 130, the lower electrode layer 110, and the bent connection part 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), or an alloy thereof. They may be used alone or in combination. For example, silver (Ag) or silver alloys (e.g., silver-palladium-copper (APC) alloys) may be used to achieve low resistance.

In some embodiments, the upper electrode layer 130 and the lower electrode layer 110 may include conductive materials different from each other. For example, the upper electrode layer 130 may include the above-described metal or alloy, and the lower electrode layer 110 may include a transparent conductive oxide, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO).

Referring to fig. 2 to 4, the antenna device shown in fig. 1 may be bent and folded by the third region III of the dielectric layer 100. Accordingly, as shown in fig. 2 and 4, the upper electrode layer 130 and the lower electrode layer 110 may overlap in the third direction.

The dielectric layer 100 may be folded such that the dielectric layer 100 may be divided into an upper dielectric layer 102 and a lower dielectric layer 104. In addition, the third region III of the dielectric layer 100 may be converted into a curved dielectric portion 106. For example, the dielectric layer 100 may be substantially completely folded by bending the dielectric portion 106 so that the upper and lower dielectric layers 102 and 104 may contact each other.

Accordingly, the upper electrode layer 130 may be disposed on the top surface of the upper dielectric layer 102, and the lower electrode layer 110 may be disposed on the bottom surface of the lower dielectric layer 104. As shown in fig. 3, the curved connection portions 120 may be folded together along the lateral surfaces of the curved dielectric portion 106. The bent connection part 120 may be integrally connected with the ground pad 136 and the lower electrode layer 110 on the lateral surface of the bent dielectric part 106.

As shown by dotted lines in fig. 2, the lower electrode layer 110 may completely cover the upper electrode layer 130 or the radiation electrode 132 in a plan view. Accordingly, the efficiency of forming the inductor through the dielectric layer 100 may be improved, and the grounding efficiency may be improved by being connected with the grounding pad 136.

As described above, the ground pad 136 of the upper electrode layer 130 and the lower electrode layer 110 may be connected to each other by the bending connection part 120. Accordingly, noise or signal interference generated from the ground pad 136 may be grounded and removed through the lower electrode layer 110. Therefore, reliable signal transmission and reception can be achieved without changing the radiation characteristics such as the resonance frequency of the radiation electrode 132.

In addition, according to an exemplary embodiment, the interconnection of the upper electrode layer and the lower electrode layer may be easily achieved by bending the bending connection part 120 integrally formed with the ground pad 136 and the lower electrode layer 110.

In the comparative example, in order to connect the upper electrode and the lower electrode of the antenna, a contact may be formed in the dielectric layer or a printed circuit board (FPCB) may be used. However, when the contact is used, the thickness of the dielectric layer is increased in consideration of the etching process, and the inductance within the dielectric layer may be disturbed. Further, when the FPCB is used, the manufacturing cost increases, and noise caused by the adhesive member may also increase.

However, according to the above-described exemplary embodiment, after the bent connection part 120 is initially formed on the same plane as the ground pad 136 and the lower electrode layer 110, the upper electrode layer 130 and the lower electrode layer 110 may be defined by bending the dielectric layer 100. Accordingly, the interconnection of the upper electrode layer 130 and the lower electrode layer 110 can be easily achieved without additional conductive members such as contacts and FPCBs.

Fig. 5 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments. Fig. 6 is a side view illustrating an antenna device in a bent state according to some example embodiments. Detailed descriptions of elements and/or structures that are substantially the same as or similar to those described with reference to fig. 1 to 4 are omitted herein.

Referring to fig. 5 and 6, the bent connection part 122 may be disposed on the third region III of the dielectric layer 100 or the bent dielectric part 106. In some embodiments, the curved connection 122 may include a plurality of curved lines.

For example, the bent connection part 122 may include a first bending line 122a and a second bending line 122 b. The first bending line 122a and the second bending line 122b may branch from the ground pad 136 and may be integrally connected to the lower electrode layer 110.

The bending connection portion 122 may be divided into a plurality of bending lines, so that stress generated during a bending operation may be dispersed. Accordingly, it is possible to prevent the electrical connection from failing due to cracks or breakage of the bent connection 122 during the bending operation.

Fig. 7 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments.

Referring to fig. 7, the upper electrode layer may include a plurality of radiation electrodes, and a plurality of ground pads may be each electrically connected to the lower electrode layer 110 via each bent connection portion.

In some embodiments, the upper electrode layer may include a first radiation electrode 132a, a second radiation electrode 132b, and a third radiation electrode 132 c. The first to third radiation electrodes 132a, 132b and 132c may be connected to first to third ground pads 136a, 136b and 136c via first to third transmission lines 134a, 134b and 134c, respectively.

The first to third bent connection parts 120a, 120b and 120c may protrude from the first to third ground pads 136a, 136b and 136c, respectively, and may be integrally connected to the lower electrode layer 110.

The bent connection parts 120a, 120b, and 120c may be bent together by the third region III of the dielectric layer 100 so that the lower electrode layer 110 may face the radiation electrodes 132a, 132b, and 132c with the dielectric layer 100 interposed therebetween.

The lower electrode layer 110 may have a sufficient area to entirely cover the first to third radiation electrodes 132a, 132b and 132c in a plan view after bending.

A plurality of ground pads 136a, 136b, and 136c may be connected through the lower electrode layer 110, so that ground resistance and absorption noise may be reduced. In some embodiments, the first to third radiation electrodes 132a, 132b and 132c may have different phases. In this case, the phased array antenna may be implemented by one lower electrode layer 110, so that the transmission and reception efficiency of signals may be improved.

Fig. 8 is a schematic top plan view illustrating an antenna apparatus according to some example embodiments.

Referring to fig. 8, the upper electrode layer 230 of the antenna device may include a mesh structure. In an exemplary embodiment, the radiation electrode 232 may include a mesh structure, and thus, the transmittance of the antenna device may be improved.

A dummy mesh layer 240 may be disposed on the dielectric layer around the radiation electrode 232. The dummy mesh layer 240 and the radiation electrode 232 may include mesh structures having substantially the same shape. The electrode arrangement around the radiation electrode 232 may be made uniform by the dummy mesh layer 240 to prevent the mesh structure or electrode lines included therein from being seen by a user of a display device to which the antenna device is applied.

For example, a mesh metal layer may be formed on the dielectric layer 100, and may be cut along a predetermined region to electrically and physically separate the dummy mesh layer 240 from the radiation electrode 232.

In some embodiments, the transmission line 234 and the ground pad 236 of the upper electrode layer 230, the bent connection part 220, and/or the lower electrode layer 210 may also include a mesh structure. In addition, the dummy mesh layer 240 may be formed throughout the first region (I), the second region (II) and the third region (III) of the dielectric layer 100 so as to be disposed around the bent connection part 220 and the lower electrode layer 210.

Fig. 9 is a schematic side view illustrating an antenna apparatus according to some example embodiments.

Referring to fig. 9, as described above, the dielectric layer 100 may be bent by the bending dielectric part 106, so that the upper and lower dielectric layers 102 and 104 may be defined.

The length of the lower dielectric layer 104 in the second direction may be greater than that of the upper dielectric layer 102 so that the lower electrode layer 110 disposed on the bottom surface of the lower dielectric layer 104 may sufficiently cover the upper electrode layer 130. Therefore, a stepped portion may be generated from the portion not covered by the upper dielectric layer 102.

In an exemplary embodiment, the functional structure 150 may be provided on the top surface of the lower dielectric layer 104 exposed by the stepped portion, so that the stepped portion may be removed and space efficiency may be improved.

For example, the functional structure 150 may include a sensor structure such as a touch sensor, an IOT sensor, or the like included in the display device, or an optical film such as a polarizer, a retarder, or the like.

Fig. 10 is a schematic top plan view illustrating a display device according to an exemplary embodiment. For example, fig. 10 shows the appearance of a window including a display device.

Referring to fig. 10, the display device 300 may include a display area 310 and a peripheral area 320. The peripheral region 320 may be disposed on both lateral portions and/or both end portions of the display region 310.

In some embodiments, the antenna device may be inserted into the outer circumferential region 320 of the display device 300 in a patch or film shape. In some embodiments, the radiation electrode and the lower electrode layer of the antenna device may overlap the display region 310. As described above, the lower electrode layer may be bent via the bent connection part and disposed in the display region 310 together with the radiation electrode. For example, as shown in fig. 8, the radiation electrode may be prevented from being recognized by a user by using a mesh structure.

The outer peripheral region 320 may correspond to, for example, a light shielding portion or a frame portion of the image display device. An Integrated Circuit (IC) chip for controlling the driving characteristics and the radiation characteristics of the antenna device and supplying a feeding signal may be disposed in the outer circumferential region 320.