阅读说明：本技术 一种存储器、存储器用隔热材料及其束封方法 (Memory, heat insulating material for memory and bundling method of heat insulating material ) 是由 林万才 刘斌 李明伟 马志强 于 2020-07-13 设计创作，主要内容包括：本发明公开了一种存储器、存储器用隔热材料及其束封方法,属于存储器技术领域。本发明的隔热材料包括隔热层,隔热层上包覆阻挡层,阻挡层由热缩膜热缩形成。本发明的存储器,存储介质与防护壳体之间设有上述的存储器用隔热材料。本发明的存储器用隔热材料束封方法,将隔热层放入厚度为10～25μm的热收缩袋内并封口,利用全自动热缩膜包装机对隔热层进行热缩包装以在隔热层表面包覆阻挡层。本发明克服隔热材料容易碎裂漏粉的不足,提供一种存储器用隔热材料,阻挡层可以有效将隔热层与外界隔开,避免隔热层因震动产生的漏粉现象。本发明的存储器具有良好的安全稳定性和防护性能。本发明的隔热材料束封方法,可快速实现隔热材料束封,操作过程简便易控制。(The invention discloses a memory, a heat insulating material for the memory and a bundling method of the heat insulating material, and belongs to the technical field of memories. The heat insulating material comprises a heat insulating layer, wherein the heat insulating layer is coated with a barrier layer, and the barrier layer is formed by thermal shrinkage of a thermal shrinkage film. In the memory of the present invention, the heat insulating material for memory is provided between the storage medium and the protective case. The method for bundling and sealing the heat insulation material for the memory comprises the steps of putting a heat insulation layer into a heat shrinkage bag with the thickness of 10-25 mu m, sealing the heat insulation layer, and performing heat shrinkage packaging on the heat insulation layer by using a full-automatic heat shrinkage film packaging machine to coat a barrier layer on the surface of the heat insulation layer. The invention overcomes the defect that the heat-insulating material is easy to crack and leak powder, and provides the heat-insulating material for the storage, wherein the barrier layer can effectively separate the heat-insulating layer from the outside, so that the powder leakage phenomenon of the heat-insulating layer caused by vibration is avoided. The memory has good safety stability and protection performance. The heat insulating material bundling method can quickly realize heat insulating material bundling, and the operation process is simple and easy to control.)

1. A heat insulating material for a storage device, characterized in that: the thermal insulation layer (100) is covered with a barrier layer (110), and the barrier layer (110) is formed by thermal shrinkage of a thermal shrinkage film.

2. The heat insulating material for a storage device according to claim 1, wherein: the heat-shrinkable film is a POF (polyester pre-oriented film) cross-linked film with the thickness of 10-25 mu m.

3. The thermal insulation material for a storage according to claim 2, wherein: the thickness of the POF cross-linked film is 15 mu m, and the tensile strength of the POF cross-linked film is 125N/mm²～135N/mm²。

4. The heat insulating material for a storage device according to any one of claims 1 to 3, wherein: the heat insulation layer (100) is of a rectangular structure, and the edge of the heat insulation layer is in arc transition.

5. A memory comprising a storage medium (200) and a protective housing (300), characterized in that: the heat insulating material for a storage device according to any one of claims 1 to 4 is provided between the storage medium (200) and the shield case (300).

6. A method for bundling heat-insulating materials for a storage device is characterized by comprising the following steps: manufacturing a heat-shrinkable bag (120) according to the size of a heat-insulating layer (100), putting the heat-insulating layer (100) into the heat-shrinkable bag (120), sealing the heat-shrinkable bag by using a sealing machine, carrying out heat-shrinkable packaging on the heat-insulating layer (100) by using a full-automatic heat-shrinkable film packaging machine, and setting the temperature in a furnace path of the full-automatic heat-shrinkable film packaging machine to be 135-155 ℃.

7. The method for binding and sealing a heat insulating material for a memory according to claim 6, wherein: the heat-shrinkable bag (120) is made of a POF crosslinked film.

8. The method for binding and sealing a heat insulating material for a memory according to claim 7, wherein: the thickness of the heat-shrinkable bag (120) is 10-25 mu m.

9. The method for binding and sealing a heat insulating material for a memory according to claim 8, wherein: the power of the sealing machine is 190-210W, and the pressing and sealing time is 1.5s-2 s.